hh of the surface free energy, measured in accordance with ISO 19403, is 2.4 mN/m or less. In addition, the release layer preferably satisfies the condition that the storage modulus at 180°C, measured in accordance with JIS K7244, is no less than 10 MPa but no greater than 200 MPa.
Provided is a polymer that is capable of forming a resin film having high-heat resistance and low film stress, and that contains a structural unit derived from norbornene or a derivative thereof. This block copolymer has a block A and a block B. In the block copolymer, structural units represented by at least any chemical formula selected from the group consisting of general formulae (1-1), (1-2), and (1-3) account for greater than 50 mol% of all of the structural units in the block A. Additionally in the block copolymer, structural units represented by general formula (2) account for greater than 50 mol% of all of the structural units in the block B.
C08F 293/00 - Composés macromoléculaires obtenus par polymérisation sur une macromolécule contenant des groupes capables d'amorcer la formation de nouvelles chaînes polymères rattachées exclusivement à une ou aux deux extrémités de la macromolécule de départ
C08F 297/00 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire
A brain wave measurement device (10) comprises: a support body (110) that is attached to a head; a first through-hole (support body through-hole (114)) that is provided to the support body (110); an elastic member (130) that is embedded in the first through-hole (support body through-hole (114)) and that has a first recess (elastic member recess (131), elastic material through-hole (135)) that faces the bottom surface from the surface; and an electrode unit (brain wave electrode member (120)) that is held by the elastic member (130).
Provided is an electroencephalogram measurement device (10) comprising: a support body (110) that is to be attached to the head and is divided into a plurality of pieces; an electrode unit (brain wave electrode member (120)) that is held by the support body (110); a buffer material (500) that is provided in a gap between the pieces adjacent to each other; and a connection part (400) that determines the relative positions of the pieces adjacent to each other.
This vascular embolization agent contains solid particles of two or more amino acids having different solubilities as an active ingredient. The solid particles dissolve in physiological saline at 37°C within 6 hours. This production method for a vascular embolization agent includes a step for adjusting the dissolution rate of solid particles of two or more amino acids that have different solubilities and serve as an active ingredient so that the solid particles dissolve in physiological saline at 37°C within 6 hours.
A61L 31/14 - Matériaux caractérisés par leur fonction ou leurs propriétés physiques
A61K 31/40 - Composés hétérocycliques ayant l'azote comme hétéro-atome d'un cycle, p. ex. guanéthidine ou rifamycines ayant des cycles à cinq chaînons avec un azote comme seul hétéro-atome d'un cycle, p. ex. sulpiride, succinimide, tolmétine, buflomédil
A61K 31/198 - Alpha-amino-acides, p. ex. alanine ou acide édétique [EDTA]
A61K 31/401 - ProlineSes dérivés, p. ex. captopril
A61K 31/4172 - Acides imidazole-alkanecarboxyliques, p. ex. histidine
BORON NITRIDE POWDER, THERMOSETTING RESIN COMPOSITION, HEAT-CONDUCTIVE MEMBER, METAL BASE SUBSTRATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING HEAT-CONDUCTIVE MEMBER
A boron nitride powder containing boron nitride particles, and having a plastic deformation start equivalent pressure of 5.0 MPa or more as calculated by fitting based on the Cooper-Eaton equation.
C01B 21/064 - Composés binaires de l'azote avec les métaux, le silicium ou le bore avec le bore
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
The present invention provides: a photosensitive resin composition which exhibits excellent brittle fracture resistance and can produce a cured film having high patterning precision; a cured film having high reliability and patterning precision; and a semiconductor device containing said cured film. This photosensitive resin composition can be used to produce a cured film of a semiconductor device, and contains a phenolic resin (A), a crosslinking agent (B) and an acid generator (C). The crosslinking agent (B) includes a first component that is a solid at normal temperature and a second component that is a liquid at normal temperature. The cured product has a tensile elongation of 25% or more. When the cured product is used to form a trench pattern having a trench width of 10 µm and a film thickness of 5 µm, the tapering angle at an end surface that faces the trench is 50° or more in a cross section of the trench pattern.
Provided are a specimen retrieval bag and a specimen retrieval device that easily retrieves a removed specimen out of a body in a state where the removed specimen is stored. Provided is a bag body 2 including a storage portion 2b that stores a specimen (excision piece) via an opening 2a. The bag body 2 is obliquely inclined downward from the opening 2a to a tip portion (back end portion 2c) on a side opposite to the opening 2a. That is, the bag body 2 achieves the above-described object by a specimen retrieval bag 1 extending with a component in a direction intersecting with a central axis of the opening 2a and a component in a direction away from the opening 2a when viewed in an extending direction of the central axis.
A heat sink-attached circuit board (50) comprises a circuit layer (30) and a heat sink (10) which are integrated via an insulating layer (20), wherein the heat sink (10) has a flat base plate (11), a sealing resin (40) is provided between a plurality of circuit bodies (31) constituting the circuit layer (30), the upper surface (32) of the circuit layer (30) is disposed below the upper surface (41) of the sealing resin (40), and a portion of the upper surface (32) of the circuit layer (30) is exposed from the sealing resin (40).
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
Provided is a high-frequency diffusion sheet that enables good reception of electromagnetic waves by communication equipment over a wide area within a building, for example, by diffusing high-frequency range electromagnetic waves with excellent diffusion and uniformity. A high-frequency diffusion sheet 10 according to the present invention is used to diffuse high-frequency range electromagnetic waves, and includes an electromagnetic wave shielding layer 11 that has electromagnetic wave shielding properties, wherein: the electromagnetic wave shielding layer 11 is patterned as seen in a plan view of the high-frequency diffusion sheet 10 and has a plurality of openings 15 that penetrate in the thickness direction of the electromagnetic wave shielding layer 11; and if the separation distance between adjacent openings 15 is a distance P, the distance P includes a first distance P1 and a second distance P2 different from the first distance P1.
The present invention provides a release film which, when the release film is peeled from a flexible printed circuit board, enables the release film to be peeled off quickly and excellently, and enables the molded article to be manufactured with excellent productivity. A release film according to the present invention has a release layer, said release film being characterized by containing a resin having a melting point of 180°C or higher, and, in the infrared absorption spectrum, when the absorbance at 2855 ± 7 cm-1is defined as Xa, the absorbance at 2920 ± 7 cm-1is defined as Xb, and the absorbance at 2960 ± 7 cm-1 is defined as Xc, satisfying the relationship Xc/Xb ≤ 1.6 and the relationship Xc/Xa ≤ 2.6.
The present invention provides: a heat dissipation sheet that has excellent heat dissipation properties, that is reduced in size, and that is reduced in size particularly in the thickness direction; and a method for manufacturing the heat dissipation sheet. A heat dissipation sheet 1 according to the present invention includes: a base 4; a heat dissipation part 2 that is provided on one surface side of the base 4, has heat dissipation properties, and has linear fibers 21 that stand in the thickness direction of the base 4; and a fiber fixing layer 3 that is provided on the one surface side of the base 4 and supports and fixes the base ends of the linear fibers 21 in an embedded state. The heat dissipation part 2 includes first regions 2A where the linear fibers 21 are present and second regions 2B where the linear fibers 21 are not present in a plan view of the base 4.
The present invention provides a heat dissipation sheet that has an excellent heat dissipation property and that has been miniaturized, particularly in the thickness direction. A heat dissipation sheet 1 according to the present invention comprises a fiber fixing layer 3 as an adhesive layer having an adhesive property, and a heat dissipation layer 2 that is provided to one surface side of the fiber fixing layer 3 and that comprises straight fibers 21 having a heat dissipation property, wherein: the linear fibers 21 are fixed to the fiber fixing layer 3 by base-end portions thereof being embedded from the one surface side of the fiber fixing layer 3; and the heat dissipation sheet 1 is used via the other surface of the fiber fixing layer 3 being attached to a semiconductor device, which is one example of a target object.
A tablet-shaped epoxy resin molding material according to the present invention contains an epoxy resin and a fibrous or acicular filler. The cross-sectional area is 3 cm2to 100 cm2. The compression ratio calculated from [(M/G)/V]×100, where G is the specific gravity, M (g) is the mass, and V (cm3) is the volume, as measured in accordance with JIS 6911:2006, in the tablet-shaped epoxy resin molding material, satisfies 70-95%.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
The present invention provides an adhesive tape that makes it possible to precisely prevent or suppress the generation of static electricity in a substrate or a component affixed to the adhesive tape and pick up the substrate or component when picking up the substrate or the component while in a state in which the substrate or the component is pushed up from the adhesive tape side after radially stretching the adhesive tape. The adhesive tape 100 comprises a base material 4 and an adhesive layer 2, and is used with at least one of the substrate and the component temporarily affixed thereto. The base material 4 includes a resin material and a conductive material. When the time at which the electrostatic charge decays to 5 [V] when the adhesive tape 100 is forcibly charged to 5000 [V] in the TD direction while under conditions in which the temperature is 23°C and the relative humidity is 50% is denoted by X [seconds] and the time at which the electrostatic charge decays to 5 [V] when the adhesive tape 100 is stretched by 50% in the TD direction and forcibly charged to 5000 [V] in the TD direction is denoted by Y [seconds], the adhesive tape 100 satisfies Y - X < 1.0 seconds.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
In a polycarbonate laminate (10), a base material layer (1) containing a polycarbonate resin and a hard coat layer (2) constituting an outer surface are laminated. The thickness of the hard coat layer is 20-80 μm. The glossiness, which is the reflectance of light at an incidence angle of 60° and is measured in conformance with JIS Z 8741 on the hard-coat-layer-side surface after the polycarbonate laminate is processed at 80°C and 50% RH for 72 hours, is 97 or greater.
An electrochromic sheet, which is an EC sheet, comprises a first substrate, a second substrate, an EC element, and a sealing part. The EC element has a first transparent electrode, a second transparent electrode, and an EC layer. When the impedance per unit area of the EC sheet is measured in a response frequency range of 0.1 Hz to 1 MHz under conditions of an applied voltage of 0 V and an amplitude of 10 mV, the following requirements (1) to (3) are satisfied in a Nyquist diagram obtained from the measurement result. (1) The first intersection point between the graph and the horizontal axis of the Nyquist diagram is at 1.0-8.0 Ω/cm2. (2) The slope of the approximate straight line of the graph in the range of an imaginary component of 7.0-14.0 Ω/cm2is 25 or less. (3) The value of A ([the value of a second intersection point between the approximate straight line and the horizontal axis] - [the value of the first intersection point]) is 5.0 Ω/cm2 or less.
G02F 1/15 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique
G02C 7/10 - Filtres, p. ex. pour faciliter l'adaptation des yeux à l'obscuritéLunettes de soleil
G02F 1/1514 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique caractérisés par le matériau électrochromique, p. ex. par le matériau électro-déposé
18.
RESIN COMPOSITION FOR INJECTION MOLDING AND METHOD FOR INJECTION-MOLDING SAID COMPOSITION
A resin composition for injection molding according to the present invention comprises (A) a thermosetting resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing accelerator. When a thermomechanical analysis (TMA) is performed, the glass transition temperature of the resin composition for injection molding as measured at a temperature increase rate of 10 °C/min is 160-220°C, and the reduction rate of spiral flow after the resin composition for injection molding is stored for 7 days at 30°C is 17% or less.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
B29C 45/00 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet
C08J 5/00 - Fabrication d'objets ou de matériaux façonnés contenant des substances macromoléculaires
C08K 3/013 - Charges, pigments ou agents de renforcement
To provide a release film having excellent releasability and slipperiness, and a method for producing a molded article using the release film. A release film 10 according to the present invention comprises: a first release layer 1 comprising a first thermoplastic resin composition; and a cushion layer laminated on the first release layer 1. The first release layer 1 has an arithmetic average height Sa of more than 2.3 μm, the arithmetic average height Sa being an average of absolute values of differences in height of each point from an average surface of the surface of the first release layer 1.
Provided is an electronic dimming device having a refresh function for eliminating or reducing color unevenness. The electronic dimming device according to the present invention comprises: an electrochromic element that is light transmissive, has a transmittance that is reduced by a voltage applied between terminals, and keeps a state of the reduced transmittance when the terminals are electrically opened; and a voltage application unit that has a function of applying a voltage between the terminals and a function of electrically opening the terminals. The voltage application unit performs a voltage application operation so that the transmittance is between 5% and 50% both inclusive, and then executes a refresh operation for performing an opening operation so that the transmittance remains within a range of 5% to 50% both inclusive for 5 minutes or more.
G02F 1/163 - Fonctionnement des cellules électro-chromiques, p. ex. des cellules d’électrodépositionDispositions des circuits à cet effet
G02F 1/15 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique
The present invention provides a method for manufacturing a stator (4), wherein a resin layer is formed using a mold for forming a resin layer on wall surfaces (a teeth wall surface (72) and a yoke wall surface (62)) of a slot (8) inside the slot (8) which is a space between teeth (7) that extend from an annular yoke part (6). The mold has a blade (80) that is housed inside the slot (8), and the resin layer (50) is formed by filling a space, which is formed between the blade (80) and the wall surfaces of the slot (8) when the blade (80) is housed therein, with a resin material. The blade (80) is provided with a draft on a surface that faces the wall surfaces of the slot (8), and the draft is 15 μm to 100 μm. The surface roughness Ra of the surface that is provided with the draft is 0.2 μm to 2 μm.
A surface layer material (1) used for a floor material or a wall material of a building includes an outermost layer (2) exposed to the indoor space. The polar component of the surface free energy of the surface of the outermost layer (2) is 40 mJ/m2 or less. The surface side of the outermost layer (2) has a tack force of 100 gf or less at 110°C. The Young's modulus in the longitudinal direction is 150 MPa or more.
E04F 15/16 - Revêtements posés à l'état de nappes flexibles, p. ex. parquet disposé sur une nappe flexibleNappes spécialement adaptées au revêtement des sols
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
E04F 13/07 - Revêtements ou enduits, p. ex. pour murs ou plafonds constitués d'éléments d'habillage ou de garnissageLeurs bâtisLeurs moyens de fixation
23.
RELEASE FILM, AND MOLDED ARTICLE MANUFACTURING METHOD
6012060120120 [N/15 mm] is the peel strength at a peel angle of 120°, when the release film is peeled while the release layer remains adhered to an adhesive layer, which contains an epoxy-based adhesive, of a film body having the adhesive layer.
The present invention is provided with: a translucent resin sheet having a resin layer formed of a resin material serving as a main material; and a protective sheet that is stacked on the translucent resin sheet and that protects the translucent resin sheet. The surface free energy at a temperature of 25°C on the face of the translucent resin sheet on the side adhering to the protective sheet is 28-38 mN/m. The force of adhesion of the protective sheet to the translucent resin sheet, measured by conducting a 180° peel test at a peel speed of 10 cm/min under the conditions of a temperature of 25°C and a humidity of 50% by using a test piece having a size of 1 cm × 10 cm in plan view, is 0.004-0.15 N/cm.
Provided is a brain wave measurement device (10) comprising: an electrode unit (30) that acquires brain waves by contacting a measurement site of a subject; and a support member (20) that supports the electrode unit (30). The support member (20) includes: a film member (120) (substrate, circuit pattern (22), protective layer, and shield layer); and a mounting part (25) that is provided to the film member (120) and that is for mounting the electrode unit (30). The electrode unit (30) and the mounting part (25) are fixed by a detachable engagement structure.
This furan resin satisfies condition (a). Condition (a): 10g of the furan resin and 0.33g of a p-toluenesulfonic acid (PTSA) aqueous solution (55%) are mixed to obtain a mixture. The mixture is treated at 120°C for one hour and then pulverized to prepare a sample. The IR spectrum of the sample is measured using Fourier transform infrared spectroscopy (FT-IR). When the transmittance at the maximum absorption peak in the range from 1545 cm-1to 1560 cm-1is noted as R1, and the transmittance at the maximum absorption peak in the range from 1645 cm-1to 1662 cm-1 is noted as R2, R1/R2 > 1.000 is satisfied.
This prepreg is obtained by impregnating a fiber base material with a thermosetting resin composition, and contains a component (a) specified by the following procedure in an amount of 72 mass% or less. (Procedure) The prepreg is cut into 10 cm squares to prepare a test piece, and then the mass x (g) is measured. Next, the test piece is stirred together with 400 ml of methanol in a 500 ml resin container at 20°C for 20 hours, and is subsequently taken out. Thereafter, the test piece is dried under reduced pressure for 24 hours, and then the mass y (g) is measured. Subsequently, the test piece is fired at 500°C for 4 hours, and then the mass z (g) is measured. The ratio (mass%) of the component a is calculated by formula (1) below. (1): Component a = {(mass y - mass z)/(mass x - mass z)} × 100
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
B32B 3/12 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche discontinue, c.-à-d. soit continue et percée de trous, soit réellement constituée d'éléments individuels caractérisés par une couche d'alvéoles disposées régulièrement, soit formant corps unique dans un tout, soit structurées individuellement ou par assemblage de bandes indépendantes, p. ex. structures en nids d'abeilles
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
The present invention provides an adhesive tape that has good resistance to a cleaning liquid and is capable of maintaining good peelability realized through irradiation with an energy ray, even after making contact with the cleaning liquid. An adhesive tape according to the present invention is provided with a base material and an adhesive layer laminated on one surface of the base material. The adhesive tape is characterized in that: the adhesive tape is for use in temporarily fixing a substrate; the adhesive layer contains a double bond introduction type acrylic resin having an unsaturated double bond in a side chain, and a curable resin that becomes cured through irradiation with an energy ray; and the blended ratio of the curable resin with respect to 100 parts by mass of the double bond introduction type acrylic resin is more than 0 parts by mass but not more than 180 parts by mass.
This laminated film includes a functional layer and a sealant layer as one outermost layer. The functional layer includes a plate-shaped filler and a cyclic olefin copolymer. The sealant layer includes polypropylene-based resin.
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B65D 65/40 - Emploi de stratifiés pour des buts particuliers d'emballage
30.
THREE-DIMENSIONAL MOLDED INSULATOR AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL MOLDED INSULATOR
The present invention provides a three-dimensional molded insulator that enables reduction of dead space between a circuit board and the three-dimensional molded insulator, thereby enabling effective use of a space in which the circuit board is accommodated, and a method for manufacturing a three-dimensional molded insulator, the method enabling the manufacture of a three-dimensional molded insulator having high shape accuracy. This three-dimensional molded insulator covers a component to which a voltage is applied and is characterized by: being formed into a shape with a recess portion including a bottom portion and a wall portion provided at an end of the bottom portion; and being used in a state in which a component is inserted into the recess portion.
H05K 7/06 - Dispositions de composants de circuits ou du câblage sur une structure de support sur panneaux isolants
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p. ex. les contacts incorrects des bornes ou des barres omnibus
This electroencephalographic electrode (100) comprises a base part (90), a conductive layer (30) having electrical conductivity, and a linear conductive wire material (40). The base part (90) has a plurality of protruding parts (80), each of which is an elastic body having a conical shape, on one surface (24). The conductive layer (30) is formed in at least one of the protruding parts (80). The conductive wire material (40) penetrates the base part (90) and is electrically connected to the conductive layer (30). The protruding parts (80) include side surface parts (11) that are continuous with the one surface (24). The conductive wire material (40) is provided on at least one of a first side surface part (11a), a second side surface part (11b) that is located facing to the first side surface part (11a), and a bottom surface part (24a) of the one surface (24) that is located between the first side surface part (11a) and the second side surface part (11b).
The present invention provides an optical waveguide and an optical wiring component that can reduce the burden of connection work or the like and also contribute to the simplification of the structure of a device to be connected thereto. An optical waveguide according to the present invention has a core pattern. The core pattern is provided with a first incidence/emission surface, a second incidence/emission surface, a third incidence/emission surface, a fourth incidence/emission surface, a fifth incidence/emission surface, a sixth incidence/emission surface, a seventh incidence/emission surface, an eighth incidence/emission surface, a first branching part, a second branching part, a third branching part, a fourth branching part, a first intersection part, a second intersection part, and a third intersection part. The first incidence/emission surface, the second incidence/emission surface, the fifth incidence/emission surface, and the six incidence/emission surface are in line symmetry with the third incidence/emission surface, the fourth incidence/emission surface, the seventh incidence/emission surface, and the eighth incidence/emission surface with respect to a first straight line. The first incidence/emission surface, the second incidence/emission surface, the third incidence/emission surface, and the fourth incidence/emission surface are in line symmetry with the fifth incidence/emission surface, the six incidence/emission surface, the seventh incidence/emission surface, and the eighth incidence/emission surface with respect to a second straight line.
In this polycarbonate resin laminate (10) for heat bending, a base material layer (1) containing polycarbonate resin and a hard coat layer (2) are laminated, a weather-resistant layer (3) is interposed between the base material layer (1) and the hard coat layer (2), and the weather-resistant layer (3) contains polycarbonate resin and an ultraviolet absorber.
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
B29C 48/07 - Moulage par extrusion, c.-à-d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désiréeAppareils à cet effet caractérisées par la forme à l’extrusion de la matière extrudée plate, p. ex. panneaux
B29C 48/21 - Articles comprenant au moins deux composants, p. ex. couches coextrudées les composants étant des couches les couches étant jointes à leurs surfaces
B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
C08J 7/046 - Formation de revêtements résistants à l'abrasionFormation de revêtements de durcissement de surface
The present invention provides a method for polishing a brake piston whereby the surface roughness of the lateral surface of a base material of a brake piston that includes a resin material can be brought to a prescribed value easily and quickly using a grinding wheel, and moreover, the life of the grinding wheel can be extended. The method for polishing a brake piston according to the present invention comprises: a first step for performing processing for grinding or polishing an outer circumferential surface 981, which is the lateral surface of a base material 98 of a brake piston 93 that includes a resin material; and a second step for bringing a rotating grinding wheel 31 into contact with the lateral surface 981 of the base material 98 to perform processing for polishing the outer circumferential surface 981 while rotating the base material 98, which has undergone the first step, around a first axis O1 as the center of rotation and advancing the base material 98 in the direction of the first axis O1, wherein the grinding wheel 31 has abrasive grains of different grain sizes arranged along the first axis O1 direction.
B24B 5/22 - Machines ou dispositifs pour meuler des surfaces de révolution des pièces, y compris ceux qui meulent également des surfaces planes adjacentesAccessoires à cet effet possédant des moyens "sans centre" pour supporter, guider, soutenir ou mettre en rotation la pièce pour meuler des surfaces cylindriques, p. ex. des surfaces de boulons
B24B 5/18 - Machines ou dispositifs pour meuler des surfaces de révolution des pièces, y compris ceux qui meulent également des surfaces planes adjacentesAccessoires à cet effet possédant des moyens "sans centre" pour supporter, guider, soutenir ou mettre en rotation la pièce
This flame-retardant resin composition comprises a thermosetting resin and a flame-retarding agent, and has a ΔEr value of 30 or less as determined by the following procedure. Procedure: (i) A test plate (size: 120 mm square, 2 mm in thickness) under the conditions including a mold temperature of 175°C and a curing time of 3 minutes is prepared using the flame-retardant resin composition. (ii) A torch burner (30 mm with respect to a flame length of about 100 mm) is set to the center of one surface of the vertically-set test plate such that the angle with respect to the test plate becomes 90°, and a flame from the torch burner is applied to the center for 5 minutes. (iii) For the center of the other surface of the test plate and two points which are located on a straight line passing through the center of the other surface of the test plate and are each 3 mm away from this center, color differences between before and after the contact with the flame are separately measured and an average value (ΔEr) is determined.
The purpose of the present invention is to provide an adhesive tape which is capable of accurately suppressing or preventing the occurrence of breakage in the adhesive tape when a substrate such as a semiconductor wafer stuck on the adhesive tape is cut into individual pieces in the thickness direction by means of irradiation of a laser beam. An adhesive tape 100 according to the present invention includes a base material 4 and an adhesive layer 2. The adhesive tape 100 is used when a substrate is cut into pieces, in the thickness direction, so as to form a plurality of components by irradiating the substrate with a laser beam in a state where the substrate is fixed on the adhesive layer 2, and subsequently each component is separated from the adhesive layer 2. The base material 4 has a weight loss rate from room temperature to 420°C in the TG curve obtained by simultaneous thermogravimetry differential thermal analysis that is 50% or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
An electrochromic sheet comprising: a first substrate; a second substrate; an electrochromic element; and a sealing portion, wherein the electrochromic element includes a first transparent electrode, a first auxiliary electrode, a second transparent electrode, a second auxiliary electrode, and an electrochromic layer, the first auxiliary electrode and the second auxiliary electrode are disposed around a colored region, the first auxiliary electrode has a strip-shaped first frame body surrounding a portion of the electrochromic layer and a first extraction portion disposed at one end of the first frame body, the second auxiliary electrode has a strip-shaped second frame body surrounding a portion of the electrochromic layer and a second extraction portion disposed at one end of the second frame body, the first extraction portion and the second extraction portion are spaced apart by more than 0 mm and not more than 10 mm in plan view, and the other end of the first frame body and the other end of the second frame body are spaced apart by more than 0 mm and not more than 20 mm in plan view.
G02F 1/15 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique
38.
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
This photosensitive resin composition contains a polyimide (A) having a double bond in a side chain, a crosslinking agent (B) containing a (meth)acrylate compound, a polymerization initiator (C), and an antioxidant (D) having an isocyanuric acid skeleton.
This photosensitive resin composition contains: a polyimide (A) having a double bond in a side chain; a cross-linking agent (B) containing a (meth)acrylate compound; and a polymerization initiator (C). An oxygen permeability coefficient according to method 1 is 30 cm3•mm/(m2•day•atm) or less. (Method 1) The photosensitive resin composition is cured at 230°C for 3 hours to obtain a cured product of 100 mm × 100 mm × 10 μm thickness. The oxygen permeability coefficient of the cured product is measured by a differential pressure method in accordance with JIS K 7126-2:2006 under the conditions of 23°C and 60% RH.
A clocking device 10 comprises: a flow path groove 12 that is formed on at least one surface of a substrate 11; a coating material that covers the flow path groove 12; and a fluid introduction port 14 that communicates with the flow path groove 12. The flow path groove 12 has a section with a width of 0.8-2.0 mm and a depth of 70-100 μm. The clocking device can measure a prescribed time by a required time until a fluid that is introduced into the introduction port 14 reaches a prescribed end point G that is located downstream of the flow path groove 12.
G01N 1/00 - ÉchantillonnagePréparation des éprouvettes pour la recherche
G01N 35/08 - Analyse automatique non limitée à des procédés ou à des matériaux spécifiés dans un seul des groupes Manipulation de matériaux à cet effet en utilisant un courant d'échantillons discrets circulant dans une canalisation, p. ex. analyse à injection dans un écoulement
G01N 35/10 - Dispositifs pour transférer les échantillons vers, dans ou à partir de l'appareil d'analyse, p. ex. dispositifs d'aspiration, dispositifs d'injection
G01N 37/00 - Détails non couverts par les autres groupes de la présente sous-classe
41.
BRAIN WAVE MEASUREMENT DEVICE AND BRAIN WAVE MEASUREMENT METHOD
A brain wave measurement device comprising an electrode unit that contacts a measurement site on a subject's head and acquires a brain wave signal, a support member (20) that supports the electrode unit, and an attachment unit (70) (facilitating member) that facilitates the disposition of the support member (20) on the head, wherein: the support member (20) comprises an inelastic film member and a mounting portion (25) that the electrode unit is electrically connected to and fixed to; the film member comprises an inelastic base material and a circuit pattern provided to the base material; and the circuit pattern is connected to the mounting portion (25).
Provided is a thermosetting resin composition which is used for the purpose of forming a sealing member (resin sealing part (65)) in a stator (4) which has a stator core (41) that has a plurality of teeth (7) and a plurality of slots (8) alternately formed in the circumferential direction, a coil (9) that is wound in the slot (8) and housed in the slot (8), and the sealing member (resin sealing part (65)) that is provided inside the slot (8) so as to seal the coil (9). The thermosetting resin composition contains an epoxy resin, a curing agent, and an inorganic filler, D90 in the particle size distribution of the inorganic filler is 40 μm to 70 μm inclusive, and D10 in the particle size distribution of the inorganic filler is 0.1 μm to 1.0 μm inclusive.
H02K 3/34 - Enroulements caractérisés par la configuration, la forme ou la réalisation de l'isolement entre conducteurs ou entre conducteur et noyau, p. ex. isolement d'encoches
C08K 3/013 - Charges, pigments ou agents de renforcement
5A5A of the first liquid is 1.0 Pa∙s to 50.0 Pa∙s inclusive as measured at the rotation speed of 5 rpm and the temperature of 25°C using an E-type viscometer and a 3° × R14 cone rotor.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
44.
THERMOSETTING RESIN COMPOSITION AND METHOD FOR MANUFACTURING STATOR
Provided is a thermosetting resin composition which is used for the purpose of forming an insulating layer by filling a space (88) that is formed between a mold core (80) (blade), which is inserted into a slot (8) of a stator (4), and a wall surface (an inner wall surface (72) of a tooth part (7) and an inner wall surface (62) of a yoke part (6)) of the slot (8), the thermosetting resin composition containing an epoxy resin, a curing agent, an inorganic filler, and a wax (a mold release agent). With respect to the thermosetting resin composition, the wax contains a higher fatty acid ester or a higher fatty acid amide, and the amount of the higher fatty acid ester or the higher fatty acid amide is 1.0 mass% or less relative to the entire thermosetting resin composition.
1311 of the laminated film is greater than 85%; when a Gelbo flex test is performed on the laminated film under the conditions of a temperature of 23ºC and a twist number of 2,000 times in accordance with ASTM F392, the number of pinholes recognized in the laminated film after the Gelbo flex test is at most 2; and the puncture strength of the laminated film is at least 6 N.
Provided is a structure (bus bar module (10)) comprising: a bus bar (30) which is made of a conductive metal and which is electrically connected to a power module (101) that has a plurality of semiconductor elements (120) and that converts current between DC and AC; and a bus bar sealing part (40) that seals at least a part of the bus bar (30) with a resin cured product obtained by curing a thermosetting resin.
H02G 5/04 - Installations partiellement enfermées, p. ex. dans des canaux et adaptées à la prise de courant par glissement ou roulement
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p. ex. dissipateurs de chaleur
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H02K 5/22 - Parties auxiliaires des enveloppes non couvertes par les groupes , p. ex. façonnées pour former des boîtes à connexions ou à bornes
H02K 9/19 - Dispositions de refroidissement ou de ventilation pour machines avec enveloppe fermée et circuit fermé de refroidissement utilisant un agent de refroidissement liquide, p. ex. de l'huile
H02K 9/22 - Dispositions de refroidissement ou de ventilation par un matériau solide conducteur de la chaleur s'encastrant dans, ou mis en contact avec, le stator ou le rotor, p. ex. des ponts de chaleur
H02K 11/33 - Circuits d’entraînement, p. ex. circuits électroniques de puissance
47.
BRAIN WAVE MEASURING DEVICE AND BRAIN WAVE MEASURING METHOD
Provided is a brain wave measuring device (30) comprising: a support member (20) that is placed along the head (99) of a subject; an electrode unit (30) that is attached to the support member (20) and comes into contact with a measurement site of the subject to acquire a brain wave signal; and an assistance member (attachment part (70)) that assists the placement of the support member (20) on the head (99). The support member (20) is configured with a ribbon-shaped or linear, non-stretchable member. The brain wave measuring device (10) has an elastic body (spring (61)) that is stretchable between the support member (20) and a fitting part to a human body (ear).
A resin film containing a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or larger, and the softening point of the resin film is 140°C or lower.
B65D 75/36 - Objets ou matériaux enveloppés entre deux feuilles ou flans opposés à bords réunis, p. ex. par adhésifs à pression, pliage, thermosoudage ou soudage une ou les deux feuilles ou flans étant renfoncés pour épouser la forme du contenu une feuille ou un flan étant renfoncés et l'autre fait d'une feuille plate relativement rigide, p. ex. empaquetage pour ampoules
The present invention pertains to a resin composition that can be used in optical waveguide cladding. The resin composition contains a cyclic olefin resin (A). The cyclic olefin resin (A) contains a structural unit (a) and a structural unit (b). The structural unit (a) is a structural unit represented by formula (a-1). The structural unit (b) is one or more units selected from the group consisting of structural units represented by formula (b-1), structural units represented by formula (b-2), and structural units represented by formula (b-3).
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
C08F 32/00 - Homopolymères ou copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique
C08L 45/00 - Compositions contenant des homopolymères ou des copolymères de composés ne possédant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique ou hétérocycliqueCompositions contenant des dérivés de tels polymères
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
50.
BALLOON-EQUIPPED GUIDE WIRE, CATHETER SET, AND MEDICAL INSTRUMENT
A portion of a tube wall located on the leading end side in a tubular-shaped member (10) is a spring. The spring has a ribbon (15a) that is helically arranged with the central axis of the tubular-shaped member (10) serving as the axis thereof, such that a gap is provided between respective turns thereof. The width dimension of a helical slit (44) is less than one-fifth of the width dimension of the ribbon (15a). When a liquid is injected in a balloon member (40) through an injection port (18) and the volume thereof is increased, the balloon member (40) is expanded as a result of the dimensions of the balloon member (40) increasing in the radial direction and the axial direction of the tubular-shaped member (10).
The present invention relates to photosensitive compositions containing PFAS-free polynorbornene (PNB) copolymers and terpolymers in combination with certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PFAS-frcc PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo- oxidative chain degradation and exhibit improved mechanical properties.
The present invention provides: a laminate film (1) for blister packs, which is provided with a base material layer (11) containing a thermoplastic resin, and which has excellent heat resistance; and a packaging body (10) provided with the laminate film (1). This laminate film (1) is for blister packs and is formed by laminating the base material layer (11), an anchor coat layer (12), and a print layer (13), in this order in the thickness direction of these layers. The base material layer (11) contains a thermoplastic resin, and the anchor coat layer (12) and the print layer (13) contain a cured product of an ultraviolet curable resin.
Provided is a sugar chain preparation method comprising: a release step for causing a sugar chain-releasing enzyme to act, in a container, on a glycoprotein immobilized to a solid phase to obtain a released product including a sugar chain; and a labeling step for adding a labeling reaction reagent to the released product in the container to obtain a labeled product including a labeled body of the sugar chain. The glycoprotein is an antibody. The solid phase has, on the surface, a ligand selected from the group consisting of protein A, protein G, protein L, protein H, protein D, and protein Arp. The labeling reaction reagent contains a solution, a reducing agent, and at least one selected from the group consisting of 8-aminopyrene-1,3,6-trisulfonicacid, a sodium salt of 8-aminopyrene-1,3,6-trisulfonicacid, and 9-aminopyrene-1,4,6-trisulfonicacid.
G01N 1/28 - Préparation d'échantillons pour l'analyse
C07H 1/08 - SéparationPurification à partir de produits naturels
C07K 16/00 - Immunoglobulines, p. ex. anticorps monoclonaux ou polyclonaux
C07K 17/00 - Peptides fixés sur un support ou immobilisésLeur préparation
C08B 37/00 - Préparation des polysaccharides non prévus dans les groupes Leurs dérivés
C12N 9/24 - Hydrolases (3.) agissant sur les composés glycosyliques (3.2)
C12P 19/00 - Préparation de composés contenant des radicaux saccharide
C12P 19/14 - Préparation de composés contenant des radicaux saccharide préparés par action d'une carbohydrase, p. ex. par action de l'alpha-amylase
C12Q 1/34 - Procédés de mesure ou de test faisant intervenir des enzymes, des acides nucléiques ou des micro-organismesCompositions à cet effetProcédés pour préparer ces compositions faisant intervenir une hydrolase
G01N 33/50 - Analyse chimique de matériau biologique, p. ex. de sang ou d'urineTest par des méthodes faisant intervenir la formation de liaisons biospécifiques par ligandsTest immunologique
54.
PHOTOSENSITIVE COMPOSITION CONTAINING PFAS FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF
The present invention relates to photosensitive compositions containing PFAS-free polynorbornene (PNB) terpolymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PFAS-free PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
H02S 20/23 - Structures de support directement fixées sur un objet inamovible spécialement adaptées pour les bâtiments spécialement adaptées aux structures de toit
H02S 40/36 - Composants électriques caractérisés par des moyens d'interconnexions électriques spéciaux entre plusieurs modules PV, p. ex. connexion électrique module à module
55.
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PASTE
A conductive paste according to the present invention comprises an elastomer composition, a conductive filler, and a nonaqueous solvent. The value of the particle gauge of the conductive paste, measured in accordance with JIS K 5600-2-5:1999, satisfies 40 µm or less.
This raw material (M) for a release film uses a used release film (y) as a raw material, and in thermogravimetric differential thermal analysis (TG-DTA) of the raw material (M) for a release film, the oxidation initiation temperature (Ts), which is determined when the temperature is increased from 25°C at a rate of 5°C/min in air, is 120-350ºC.
B29B 17/00 - Récupération de matières plastiques ou d'autres constituants des déchets contenant des matières plastiques
B29B 9/02 - Fabrication de granulés par division de matière préformée
B29B 13/10 - Conditionnement ou traitement physique de la matière à façonner par broyage, p. ex. par triturationConditionnement ou traitement physique de la matière à façonner par tamisageConditionnement ou traitement physique de la matière à façonner par filtration
B29B 17/04 - Désintégration des matières plastiques
B29C 48/04 - Moulage par extrusion, c.-à-d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désiréeAppareils à cet effet caractérisées par la forme à l’extrusion de la matière extrudée en forme de particules
B29C 48/08 - Moulage par extrusion, c.-à-d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désiréeAppareils à cet effet caractérisées par la forme à l’extrusion de la matière extrudée plate, p. ex. panneaux flexible, p. ex. pellicules
B29C 48/21 - Articles comprenant au moins deux composants, p. ex. couches coextrudées les composants étant des couches les couches étant jointes à leurs surfaces
B29C 48/69 - Filtres ou tamis pour la matière à mouler
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
Provided is a method for manufacturing a laminate comprising: a substrate (110); and a first cladding layer of an optical waveguide. The method comprises: a step (A) for preparing a workpiece (350) provided with at least a substrate (110); and a step (B) for attaching an adhesive member (450) to one surface of the substrate (110) of the workpiece (350).
Provided is a cell-accommodating dish from which accommodated cells or cell clusters are easily sucked out and recovered by a cannula. This cell-accommodating dish has, in a body thereof, at least one first cell-accommodating part that is capable of accommodating a liquid including cells or cell clusters, and that has a recessed shape which is open on the top surface side of the body and which has a long direction and a short direction. The first cell-accommodating part has a straight section that linearly extends in the long direction longer than the length in the short direction, and further has inclined surfaces that are downwardly inclined from both ends of the opening in the short direction in the straight section toward the bottom of the recessed shape so as to approach each other.
C12M 1/00 - Appareillage pour l'enzymologie ou la microbiologie
A61M 37/00 - Autres appareils pour introduire des agents dans le corpsPercutanisation, c.-à-d. introduction de médicaments dans le corps par diffusion à travers la peau
A method for manufacturing a laminate comprising a substrate (110) having a through-hole (140) and a first cladding layer of an optical waveguide, the method comprising: a step (A) for preparing a workpiece (410) in which the substrate (110) and a layer (310) made of a resin composition for forming the first cladding layer are laminated; and a step (B) for exposing both surfaces of the workpiece (410).
The present invention addresses the problem of providing a cannula excellent in terms of suction performance and discharge performance. The problem is solved by a cannula in which: the tip part of the cannula is configured as a bent part that is bent with respect to a base end side part; the tip of the bent part comprises a first part that is positioned on the bending direction side and a second part that is positioned on the opposite side of the bending direction side; the first part protrudes further in the extending direction of the bent part than the second part and has a pointed end most protruding in the protruding direction; and the first part and the second part face each other in parallel.
A production method for a substrate (1100) includes a preparation step S10 for preparing a substrate that includes a base substrate (10), a circuit layer (130), and a heat dissipation layer (120) that is between the base substrate (110) and the circuit layer (130) and a formation step S20 for providing a sealing material (150) opposite a first surface of the circuit layer (130) that is on the reverse side from the heat dissipation layer (120) and pressing the sealing material (150) toward the heat dissipation layer (120) while heating to form a sealing material layer (140) that seals the circuit layer (130).
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
This endoscopic suturing device is provided at a distal end of a tubular insertion part of an endoscope. The endoscopic suturing device has a pair of arm parts each having, on one end of the arms, a holding part for a suture needle. The endoscopic suturing device is configured to be capable of switching the arm part that holds the suture needle, when suturing a tissue by opening and closing one end of the arm. Each of the arm parts includes: a lock switching member that is configured to be able to advance and retreat with respect to a lock position on the one end of the arm in the arm part; a spring member that biases the lock switching member toward the lock position; and an operation wire that is disposed along the tubular insertion part and that retracts the lock switching member from the lock position by pulling the lock switching member toward a proximal with respect to a device body part. In each arm part, the suture needle is fixed to the holding part when the lock switching member is in the lock position, and the fixation of the suture needle in the holding part is released when the lock switching member is retracted from the lock position.
The present invention pertains to a method which is capable of predicting the onset of acute pancreatitis in an early stage and enables appropriate therapeutic intervention in an early stage, and more specifically, to a method for providing data necessary for treating acute pancreatitis, the method comprising: (1) measuring a trypsin concentration in a specimen of a subject that is suspected to suffer from acute pancreatitis; and (2) providing data necessary for diagnosing acute pancreatitis based on the measured value, and recommending treatment for acute pancreatitis when the trypsin concentration is equal to or higher than a certain value.
G01N 33/68 - Analyse chimique de matériau biologique, p. ex. de sang ou d'urineTest par des méthodes faisant intervenir la formation de liaisons biospécifiques par ligandsTest immunologique faisant intervenir des protéines, peptides ou amino-acides
G01N 33/573 - Tests immunologiquesTests faisant intervenir la formation de liaisons biospécifiquesMatériaux à cet effet pour enzymes ou isoenzymes
This electroencephalogram measurement device (10) is provided with a support body (110), an electroencephalogram electrode member (120), and a tube (151). The support body (110) can be attached to the head. The electroencephalogram electrode member (120) is held by the support body (110). The tube (151) passes through a third through-hole (121) provided in the electroencephalogram electrode member (120). The tube (151) may be inserted into and extracted from the third through-hole (121) of the electroencephalogram electrode member (120).
This electroencephalogram measurement device (10) is provided with a support body (110), an elastic member (130), an electroencephalogram electrode member (120), and a holding member (140). The support body (110) can be attached to the head. The elastic member (130) is elastically deformable and is provided with a first through-hole (131). The electroencephalogram electrode member (120) is held by the support body (110) via the elastic member (130). The holding member (140) passes through the first through-hole (131), one end (141) holding the electroencephalogram electrode member (120), and the other end (142) being exposed to the outside of the support body (110).
An electrochromic lens (300) comprises: an electrochromic element (10); a sealing material (8) that covers the side surface of the electrochromic element (10); and a pair of transparent base material layers (a first transparent base material layer (1) and a second transparent base material layer (7)) that sandwich the electrochromic element (10) and the sealing material (8). The electrochromic lens (300) satisfies a prescribed requirement a.
G02F 1/161 - JointsÉléments d’espacementScellement de cellulesRemplissage ou fermeture de cellules
G02C 7/10 - Filtres, p. ex. pour faciliter l'adaptation des yeux à l'obscuritéLunettes de soleil
G02F 1/15 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique
Provided is a brain wave measuring device (10) comprising: a support member (20) that is disposed along the head (99) of a subject; an electrode unit (30) that is attached to the support member (20) and contacts the scalp of the subject to acquire a brain wave signal; and a assisting member (attachment part (70)) that assists the placement of the support member (20) on the head (99). The support member (20) is configured from a ribbon-shaped or linear member.
The purpose of the present invention is to provide a method for producing 4-hydroxybenzoic acid, by which 4-hydroxybenzoic acid that has high purity with little coloration can be produced with a high yield. A method for producing 4-hydroxybenzoic acid according to the present invention comprises: a first acid deposition step in which a first post-acid-deposition crystal of 4-hydroxybenzoic acid is caused to deposit by mixing an acid with a starting material liquid that contains a metal salt of 4-hydroxybenzoic acid and water; a re-dissolution step in which a solution is obtained by re-dissolving the first post-acid-deposition crystal by mixing the first post-acid-deposition crystal with a basic solvent, and an adsorbent is added to the solution; a second acid deposition step in which a second post-acid-deposition crystal of 4-hydroxybenzoic acid is caused to deposit by mixing an acid with the solution after the re-dissolution step; and a first cooling crystallization step in which a first post-crystallization crystal of 4-hydroxybenzoic acid is caused to deposit by mixing the second post-acid-deposition crystal with a first aqueous solvent and subsequently performing cooling crystallization, and the first post-crystallization crystal and a first waste liquid are separated from each other.
This epoxy resin composition particle is used for fixing a magnet, sealing an electronic control unit, sealing a coil, or sealing a stator core, and contains an epoxy resin and a fibrous or needle-like filler.
A device 10 for detecting a cell characteristic comprises a base plate 20 and a pair of support bodies 30 that are made from a resin and are provided suspended from the base plate 20 in an elastically deformable manner. During a condition in which a cell aggregate 15 is retained between the pair of support bodies 30 by the pair of support bodies 30, the displacement quantity ΔW of the support bodies 30 can be detected from the outside.
This method for purifying 5,6-dihydroxyindole comprises: a preparation step for preparing a raw material liquid comprising crude 5,6-dihydroxyindole and water; a first extraction step for adding an extractant to the raw material liquid to thereby obtain a first extract containing the 5,6-dihydroxyindole and a first raffinate; a simple purification step for simply purifying the 5,6-dihydroxyindole contained in the first extract; and a first solid-liquid separation step for recovering a first separated liquid containing the purified 5,6-dihydroxyindole, by solid-liquid separation. By the method, 5,6-dihydroxyindole can be purified to a high purity.
The present invention provides cover tape for packaging electronic components that comprises a substrate layer and a sealant layer provided on one surface side of the substrate layer. In the cover tape, the surface of the sealant layer on the opposite side from the substrate layer side is an exposed surface. The density of peaks Spd of the exposed surface as defined by ISO 25178 is 3×105to 1×106/mm2, and the developed interfacial area ratio Sdr of the exposed surface as defined by ISO 25178 is 1×10-3to 5×10-2.
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
74.
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENTS, AND ELECTRONIC COMPONENT PACKAGE
The present invention provides cover tape for packaging electronic components that comprises a substrate layer and a sealant layer provided on one surface side of the substrate layer. In the cover tape, the surface of the sealant layer on the opposite side from the substrate layer side is an exposed surface. The density of peaks Spd of the exposed surface as defined by ISO 25178 is 3×105to 1×106/mm2, and the root mean square gradient Sdq of the exposed surface as defined by ISO 25178 is 1.0×10-2to 5.0×10-1.
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
75.
RESIN COMPOSITION, PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND POLYMER
Provided is a resin composition containing a polymer having a structural unit represented by general formula (NB) and a structural unit represented by general formula (MI-1), and a solvent. Also provided is a polymer having a structural unit represented by general formula (NB) and a structural unit represented by general formula (MI-1). In general formula (NB), R1, R2, R3, and R4are each independently a hydrogen atom or an organic group having 1-30 carbon atoms, provided that at least one of R1, R2, R3and R43211 is 0, 1 or 2. In general formula (MI-1), X is a monovalent organic group containing a cyclic skeleton.
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
C08F 232/04 - Copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique ne contenant pas de cycles condensés contenant une seule double liaison carbone-carbone
C08L 23/02 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères non modifiées par un post-traitement chimique
This photosensitive resin composition contains an alkali-soluble resin (A), a polyether-modified polydimethylsiloxane (B), a solvent (C), and a photosensitizer (D). The polystyrene-equivalent weight average molecular weight (Mw) of the polyether-modified polydimethylsiloxane (B) as measured by gel permeation chromatography is 1000-5000.
Provided is a method for producing a multilayer body (300) that sequentially comprises a substrate (110), a first cladding layer (20) of an optical waveguide (100), and a core layer (30) of the optical waveguide (100) in this order. This method for producing a multilayer body (300) comprises: a step (A) in which a substrate (110) and a film that is provided with a resin layer (a) (21), which is composed of a resin composition for forming the first cladding layer (20), are superposed upon each other; a step (B) in which the resin layer (a) (21) is photocured after the step (A); and a step (C) in which a film that is provided with a resin layer (b) (31), which is composed of a resin composition for forming the core layer (30), is superposed on a surface on the reverse side of a resin layer (a) (22) from the substrate (110) after the step (B). With respect to this method for producing a multilayer body (300), the resin composition for forming the first cladding layer (20) contains a photopolymerization initiator.
A catheter set 1 has a catheter 100, a hub 200, and an extension member 300. The catheter 100 has a body 110 and a connection part 120. The body 110 is long and has formed therethrough a lumen 111. The connection part 120 is formed at the base end of the body. The hub 200 has a hollow part 210 that is in communication with the lumen 111 when attached to the body 110. The extension member 300 is long. The hub 200 can be removed from the body 110 and can be attached to the body 110 via the connection part 120. Further, the extension member 300 can be removed from the body 110 and can be attached to the body 110 via the connection part 120.
A61M 25/088 - Introduction, guidage, avance, mise en place ou maintien en position des cathéters utilisant un cathéter supplémentaire, p. ex. pour atteindre des endroits relativement inaccessibles
A body 10 includes a plurality of segments 11 and a linear member 20. The plurality of segments 11 are continuous in the longitudinal direction of the body 10 and are capable of being separated from each other or brought close to each other in the longitudinal direction. The linear member 20 is inserted through at least a portion of the plurality of segments 11. The linear member 20 is connected to an operating part 30 at one end. The linear member 20 is also connected to a connection segment 11a, which is one of the segments 11, at the other end opposite to said one end. By increasing the tension of the linear member 20 extending between the connection segment 11a and the operating part 30, the distance between two adjacent segments 11 arranged closer to the base end side as compared to the connection segment 11a is decreased, or the pressure contact force that is mutually applied by two segments 11 is increased.
Provided is a resin composition that can be used in an optical waveguide clad, the resin composition being configured such that the flow rate of a resin layer formed from the resin composition, calculated by the following method 1, is 6-200% inclusive. [Method 1] A sample is formed so that the thickness of the resin layer formed from the resin composition becomes 100 μm, and the sample is cut into a circular piece having a diameter of 1 cm to obtain a sample for flow rate measurement. The sample for flow rate measurement is sandwiched between glass slides, and is laminated by a laminating machine under conditions including a temperature of 100°C, a pressure of 5.0 MPa and a time of 180 seconds. The area of the resin layer before and after lamination is measured, and the flow rate [%] is calculated using the following formula (I). (I): Flow rate [%] = [((the area of the resin layer after lamination)-(the area of the resin layer before lamination))/(the area of the resin layer before lamination)] × 100
C08L 87/00 - Compositions contenant des composés macromoléculaires non spécifiés, obtenus autrement que par des réactions de polymérisation ne faisant intervenir que des liaisons non saturées carbone-carbone
C08F 32/04 - Homopolymères ou copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique ne contenant pas de cycles condensés contenant une seule double liaison carbone-carbone
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08K 5/15 - Composés hétérocycliques comportant de l'oxygène dans le cycle
C08L 45/00 - Compositions contenant des homopolymères ou des copolymères de composés ne possédant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique ou hétérocycliqueCompositions contenant des dérivés de tels polymères
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
Provided is a method for manufacturing a laminate that comprises: a substrate (110) having a through hole (140); and a first cladding layer (20) of an optical waveguide (100). The method comprises at least: a step (A) for preparing, on the substrate (110), a workpiece (400) on which is placed a resin film (300) comprising a resin layer (a) (310), made of a resin composition, for forming the first cladding layer (20); and a step (B) for laminating the first cladding layer (20) on the substrate (110) by heating and pressing the workpiece (400) under reduced pressure using a vacuum laminating device.
EASILY DEGRADABLE RESIN COMPOSITION, STRUCTURE PROVIDED WITH CURED PRODUCT OF EASILY DEGRADABLE RESIN COMPOSITION, METHOD FOR DISASSEMBLING STRUCTURE, AND METHOD FOR RECYCLING MATERIAL FORMING STRUCTURE
An easily degradable resin composition according to the present invention contains a thermosetting resin, and exhibits an adhesion strength ratio (S2/S1) of 0.30 or less as measured by the following procedure. [Procedure] The easily degradable resin composition is molded on a copper substrate at 175°C and at 6.9 MPa for 120 seconds, and is then subjected to post-curing for four hours at 175°C to obtain a test piece. By using the test piece, the adhesion strength [N/mm2] obtained when the shearing adhesion to the copper substrate is measured at a rate of 300 µm/second at room temperature is denoted as S1 [N/mm2]. Further, after the test piece is heated for 30 minutes at 300°C, the adhesion strength [N/mm2] obtained when the shear adhesion to the copper substrate is measured at a rate of 300 µm/second at room temperature is denoted as S2 [N/mm2].
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H02K 15/02 - Procédés ou appareils spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation des machines dynamo-électriques des corps statoriques ou rotoriques
84.
REAGENT AND METHOD FOR DIAGNOSING ARTERIOSCLEROTIC DISEASE
The present invention relates to a reagent for use in the diagnosis, assessment of severity, prediction of onset or aggravation, or assessment of onset risk or aggravation risk of an arteriosclerotic disease. The reagent includes: an antibody to a complex, which is bonded to a neutrophil-derived protein or a corresponding binding molecule thereof; or an antigen-binding fragment of said antibody.
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
B65D 73/02 - Objets, p. ex. petits éléments électriques, fixés à des bandes
86.
BUS-BAR SUBSTRATE, BUS-BAR SUBSTRATE DEVICE, STATOR, AND STATOR MANUFACTURING METHOD
Disclosed is a bus-bar substrate (10) which has a resin substrate (11) and a bus bar (30) made of a conductive metal, wherein: the bus bar (30) has planar bus-bar conductive portions (a first planar bus bar (31) and a second planar bus bar (32)) formed in a planar shape on one surface (upper surface (12)) of the resin substrate (11); and the surface (upper surface (12)) of the resin substrate (11) on which the planar bus-bar conductive portions (the first planar bus bar (31) and the second planar bus bar (32)) are provided is such that the planar bus-bar conductive portions (the first planar bus bar (31) and the second planar bus bar (32)) and the resin substrate (11) become flush with each other.
H02K 15/04 - Procédés ou appareils spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation des machines dynamo-électriques d'enroulements avant leur montage dans les machines
H02K 3/50 - Fixation des têtes de bobines, des connexions équipotentielles ou des connexions s'y raccordant
87.
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND SEMICONDUCTOR DEVICE
The present invention provides: a positive photosensitive resin composition which makes it possible to produce a resin film that has excellent resistance to brittle fracture; and a highly reliable cured film and a highly reliable semiconductor device. A positive photosensitive resin composition according to the present invention is used for a resin film of a semiconductor device, and contains a biphenyl-type phenolic resin (A1), a urea resin-based crosslinking agent (B1) and a sensitizing agent (C). The urea resin-based crosslinking agent (B1) is mainly composed of a bifunctional compound or a trifunctional compound. A cured product of this positive photosensitive resin composition has a tensile elongation of 40% or more.
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C08G 8/20 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes de formaldéhyde, p. ex. de formaldéhyde formé in situ avec des phénols polyhydriques
A production method for a string-equipped stent 4 comprises: a first knot-forming step for forming a first knot 11a by forming a first bent part 12a on a string 6 and then passing, between the first bent part 12a and a stent 5 around the stent 5 in one circumferential direction, a portion located closer to an other end side 6h of the string 6 as compared to the first bent part 12a; and a second knot-forming step for forming a second knot 11b by forming a second bent part 12b at the portion that has been passed between the first bent part 12a and the stent 5 and then passing, between the second bent part 12b and the stent 5 around the stent 5 in the other circumferential direction which is the opposite direction with respect to the direction of having passed the first bent part 12a, a portion located closer to the other end side 6h of the string 6 as compared to the second bent part 12b. The first knot 11a is formed on a first side 5x of the stent 5 as seen in an axial-direction AX, and the second knot 11b is formed on a second side 5y located on the side opposite to the first side 5x.
This cover tape for packaging electronic components is provided with a base material layer, a first intermediate layer, a second intermediate layer, and a sealant layer in the stated order. In the cover tape, the first intermediate layer contains a polyethylene-based resin derived from biomass, and the second intermediate layer contains a polyethylene-based resin having a density of 0.908 g/cm3 or less.
B65D 77/20 - Fermetures des réceptacles formées après remplissage en appliquant des couvercles ou chapeaux séparés
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
90.
PROTECTIVE PLATE FOR BATTERY CELLS AND RESIN BATTERY MODULE
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E. V. (Allemagne)
Inventeur(s)
Koizumi Koji
Inokuchi Hideaki
Dekeyser Arne
De Keyser Hendrik
Liebertseder Johannes
John Leonard
Abrégé
A protective plate for battery cells according to the present invention is disposed at least on a lateral surface of a battery cell in a battery module that comprises a plurality of battery cells. This protective plate is configured from a cured product of a thermosetting resin composition. The thermosetting resin composition contains an inorganic fiber filler and a thermosetting resin that contains at least one of a phenolic resin, an unsaturated polyester, a diallyl phthalate resin and an epoxy resin. With respect to a cured product of the thermosetting resin composition, the thermal conductivity is 20 W/m∙K or less, and the bending elastic modulus retention rate as determined by the high temperature exposure test is 75% to 100% inclusive.
H01M 10/6556 - Composants solides comprenant des canaux d'écoulement ou des tubes pour un échange de chaleur
H01M 10/6565 - Gaz avec circulation forcée, p. ex. par des soufflantes avec recirculation ou demi-tour dans le trajet d'écoulement, c.-à-d. va-et-vient
H01M 10/6568 - Liquides caractérisés par des circuits d'écoulement. p. ex. boucles, situés à l'extérieur des éléments ou des boîtiers des éléments
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/211 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules en forme de poche
H01M 50/284 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports comprenant l’insertion de cartes de circuits, p. ex. de cartes de circuits imprimés
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/548 - Bornes caractérisées par la position des terminaux sur les cellules sur des côtés opposés de la cellule
H01M 50/569 - Détails de construction des connexions conductrices de courant pour détecter les conditions à l'intérieur des cellules ou des batteries, p. ex. détails des bornes de détection de tension
91.
CONDUCTIVE PASTE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 177/00 - Adhésifs à base de polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
92.
CONNECTOR WITH TEMPERATURE CONTROL FUNCTION, AND RESIN BATTERY MODULE
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E. V. (Allemagne)
Inventeur(s)
Koizumi Koji
Inokuchi Hideaki
Dekeyser Arne
De Keyser Hendrik
Liebertseder Johannes
John Leonard
Abrégé
A connector with temperature control function according to the present invention is provided with a bus bar and a temperature control tube that controls the temperature of the bus bar, and the space between the bus bar and the temperature control tube is filled with a cured product of an epoxy resin composition. The epoxy resin composition contains an epoxy resin and an inorganic filler, and this connector with temperature control function is configured such that if R (W/m∙K) is the thermal conductivity of the cured product of the epoxy resin composition and D (µm) is the gap between the bus bar and the temperature control tube, R/D is 1.0 × 10-1 or less.
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/284 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports comprenant l’insertion de cartes de circuits, p. ex. de cartes de circuits imprimés
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p. ex. modules de barres omnibus
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E. V. (Allemagne)
Inventeur(s)
Koizumi Koji
Inokuchi Hideaki
Dekeyser Arne
De Keyser Hendrik
Liebertseder Johannes
John Leonard
Abrégé
A resin battery module according to the present invention is provided with: a plurality of battery cells, each of which is in the form of a pouch or has a rectangular shape, while having a battery cell terminal; a circuit board; a bus bar which is electrically connected to the respective battery cell terminals of the plurality of battery cells and the circuit board; a refractory plate which is disposed between at least a pair of adjacent battery cells among the plurality of battery cells that are aligned in one direction; a pair of end plates which are respectively disposed on both end sides of the plurality of battery cells that are aligned in one direction; and a pair of side plates which are connected to the pair of end plates so as to form an enclosure structure that houses the plurality of battery cells. The refractory plate and/or the pair of end plates are configured from a cured product of a thermosetting resin composition.
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/211 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules en forme de poche
H01M 50/262 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports avec des moyens de fixation, p. ex. des serrures
H01M 50/264 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports avec des moyens de fixation, p. ex. des serrures pour des cellules ou des batteries, p. ex. cadres périphériques, courroies ou tiges
H01M 50/35 - Évacuation des gaz comprenant des passages allongés, tortueux ou en forme de labyrinthe
H01M 50/358 - Passages externes d’évacuation des gaz sur le couvercle ou sur le boîtier de batterie
H01M 50/50 - Connexions conductrices de courant pour les cellules ou les batteries
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p. ex. les contacts incorrects des bornes ou des barres omnibus
A semiconductor device (100) comprises: a heat sink (5); an insulating heat-dissipation sheet (4) disposed on the heat sink (5); a circuit layer (8) disposed on the heat-dissipation sheet (4); a semiconductor chip (1) disposed on the circuit layer (8); a sealing resin (7) sealing the semiconductor chip (1) and the circuit layer (8); and a conductive bonding member (9) bonding the circuit layer (8) and the semiconductor chip (1) to each other.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
An electrochromic sheet (100) according to the present invention comprises: a first support layer (1); an electrolyte layer (4) provided on the first support layer (1); a first electrochromic layer (3) provided on at least one surface of the electrolyte layer (4); and a sealing part (8) provided so as to cover at least the side surface of the electrolyte layer (4). The deformation amount of the sheet measured through the following procedure i is 0.01-0.09 mm. Procedure i: A test piece (having a maximum length of 20 mm or more) in which the electrolyte layer (4) is located at the center and in which the sealing part (8) is located at the outer edge is made by using the electrochromic sheet (100). The test piece is chucked at both ends by a chucking part, and the center of the test piece is pressed at 30 N for 30 seconds. The difference in depth between the center of the test piece before being pressed and the center piece after being pressed is defined as a deformation amount (mm).
G02F 1/15 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique
B29C 33/14 - Moules ou noyauxLeurs détails ou accessoires comportant des moyens incorporés pour positionner des inserts, p. ex. marquages contre la paroi du moule
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
G02F 1/1523 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique caractérisés par le matériau électrochromique, p. ex. par le matériau électro-déposé comprenant un matériau inorganique
Provided is a liquid delivery device that is capable of continually delivering liquid in a constant liquid flow direction at a stable flow rate. A liquid delivery device (100) comprises a liquid delivery unit (3) and a liquid delivery rotary unit (8). The liquid delivery unit (3) comprises: a liquid delivery chamber (7) where liquid flows in and flows out; and a first straight flow channel (11) and a second straight flow channel (12) that allow liquid to circulate through the liquid delivery chamber (7). The liquid delivery rotary unit (8) comprises: a spindle (7b) that is disposed so as to protrude at the center of the liquid delivery chamber (7); an impeller (20) that is supported by an annular part (21) so as to be rotatable about the spindle (7b) and that contains a magnetic material; and a drive motor (31) that is disposed outside the liquid delivery chamber (7) and that causes the impeller (20) to be rotated by magnetic fields. A gap (24) is provided between the outer circumference (7c) of the spindle (7b) and the inner circle (21a) of the annular part (21). The drive motor (31) is disposed such that the impeller (20) is allowed to rotate in a state where the gap (24) is biased relative to a range of contact between the outer circumference (7c) of the spindle (7b) and the inner circle (21a) of the annular part (21).
Provided is a cover tape that is used by being heat sealed onto the front surface of an electronic component conveyance-use carrier tape that intermittently includes, in the longitudinal direction, accommodation sections for accommodating electronic components, the heat sealing performed so as to seal the accommodation sections. The cover tape includes: a substrate layer; and a heat sealant layer which is provided to one surface of the substrate layer. The heat sealant layer is formed so as to extend in a strip shape at both ends of the substrate layer in the longitudinal direction thereof.
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B65D 65/40 - Emploi de stratifiés pour des buts particuliers d'emballage
An optical waveguide according to the present invention includes a first core pattern and a second core pattern. The first core pattern comprises a first incidence/emission surface and a second incidence/emission surface that are provided at one end of the first core pattern, a third incidence/emission surface and a fourth incidence/emission surface that are provided at the other end of the first core pattern, a first rectification part, a first branching part, and a second branching part. The second core pattern comprises a fifth incidence/emission surface and a sixth incidence/emission surface that are provided at one end of the second core pattern, a seventh incidence/emission surface and an eighth incidence/emission surface that are provided at the other end of the second core pattern, a second rectification part, a third branching part, and a fourth branching part. A line-symmetric relationship with respect to a first straight line as the axis of symmetry is established between the first to fourth incidence/emission surfaces and the fifth to eighth incidence/emission surfaces, and a line-symmetric relationship with respect to a second straight line as the axis of symmetry is established between the first incidence/emission surface and the third incidence/emission surface, and the second incidence/emission surface and the fourth incidence/emission surface, and between the fifth incidence/emission surface and the seventh incidence/emission surface, and the sixth incidence/emission surface and the eighth incidence/emission surface.
A sandwich panel (100) comprises: a core layer (1) having a honeycomb structure; and a plurality of skin layers (2) that are disposed on both surfaces of the core layer (1). The skin layers (2) each comprise two or more prepregs (21) which are stacked on one another with a sheet (22), which is obtained by a papermaking process, interposed therebetween.
B32B 3/12 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche discontinue, c.-à-d. soit continue et percée de trous, soit réellement constituée d'éléments individuels caractérisés par une couche d'alvéoles disposées régulièrement, soit formant corps unique dans un tout, soit structurées individuellement ou par assemblage de bandes indépendantes, p. ex. structures en nids d'abeilles
B29C 43/20 - Fabrication d'objets multicouches ou polychromes
B29C 70/42 - Façonnage ou imprégnation par compression pour la fabrication d'objets de longueur définie, c.-à-d. d'objets distincts
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
100.
MOLD RELEASE FILM AND METHOD FOR MANUFACTURING MOLDED PRODUCT
A mold release film 10 according to a first invention comprises: a first mold release layer 1 comprising a first thermoplastic resin composition; and a cushion layer 3 laminated on the first mold release layer 1, wherein the oxygen permeability of the mold release film 10 as measured according to JIS K 7126-2 is 60.0 cc/(m2·atm·day) or more. A mold release film 10 according to a second invention comprises: a first mold release layer 1 comprising a first thermoplastic resin composition; and a cushion layer 3 laminated on the first mold release layer 1, wherein the water vapor permeability of the mold release film 10 as measured according to JIS K 7129 (B method) is more than 1.0 g/m2·day (25°C·90% RH).
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