A processing method of a surface-mounted transformer, comprising the following steps: hanging lead starting ends on electrodes and conducting welding and fixation by hot pressing; winding, wherein a coil is wound on a middle pillar of an I-shaped magnetic core; hanging lead finishing ends on the electrodes and conducting welding and fixation by hot pressing to obtain a winding product; leading out leading-out ends of the coil in a right-angle manner relative to connecting lines of the electrodes on a same side and conducting welding and fixation by hot pressing; molding pressing and solidifying forming, wherein a magnetic molding material is injected into a mold cavity in which the winding product is stored for mold pressing, solidifying forming is carried out and finally, an adhesive layer coating structure is formed around the winding product; finally, demolding. The product is high in reliability and can support a PSIP plastic package environment.
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
111≥10 μm, and the gaps each being filled with a low-dielectric-constant medium. The first outer electrode and the second outer electrode are respectively provided at two ends of the base, and both the first outer electrode and the second outer electrode are electrically connected to the inner electrode.
An electronic device, comprising a blank body provided with an insulating material, a conductive coil located within the blank body, and a first terminal and a second terminal exposed out of a surface of the blank body. The blank body has a top surface, a bottom surface, a first side surface, a second side surface, a front surface, and a back surface. The top surface is parallel to the bottom surface, the first side surface is parallel to the second side surface, and the front surface is parallel to the back surface. A plane parallel to the top surface and the bottom surface, a plane parallel to the first side surface and the second side surface, and a plane parallel to the front surface and the back surface are perpendicular to each other. Outer dimensions of the top surface, the bottom surface, the first side surface, the second side surface, the front surface, and the back surface are 0402 or below. The thickness-width ratio of at least one electrode layer of the conductive coil is at least 0.5, and a cross-section of the at least one electrode layer has a width of at least 15 μm and at most 30 μm and has a thickness of at least 15 μm and at most 40 μm. In the electronic device, a Q value can be increased and the degree of sensitivity to the width of a cross-section of the coil is reduced, that is, the stability of inductance during a change in the width of the cross-section of the coil is improved.
A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 27/33 - Dispositions pour amortissement du bruit
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
5.
INDUCTIVE COMPONENT AND MANUFACTURING METHOD THEREFOR
Provided in the present application are an inductive component and a manufacturing method therefor. In the present application, each individual terminal electrode (13) is designed to comprise two mutually separated parts, i.e. a first part (131) and a second part (132), the first part (131) and the second part (132) being oppositely provided, and at least one of the first part (131) and the second part (132) being connected to a corresponding leading-out end of an electromagnetic coil. The separated design of each individual terminal electrode can reduce the parasitic capacitance generated by the individual terminal electrode and the electromagnetic coil in the product, thus increasing the self-resonant frequency of the inductive component while ensuring the weldability.
The present application discloses a multiphase inductor and a manufacturing method therefor. The multiphase inductor comprises a magnetic body and multiple coils; the multiple coils are laminated in the magnetic body at intervals in a second direction; and every two adjacent coils are staggered. According to the present application, multiple inductors can be integrated into one multiphase inductor, the consistency of electrical parameters such as an inductance value L, an RDC, and a coupling coefficient K of the multiphase inductor is relatively high, the relatively high electrical performance consistency of the multiphase inductor can maintain signal stability in circuit working, and the occupied PCB circuit space can also be reduced.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
7.
VERTICAL MULTIPHASE INDUCTOR AND MANUFACTURING METHOD THEREFOR
The present application discloses a vertical multiphase inductor and a manufacturing method therefor. The vertical multiphase inductor comprises a magnetic body, a plurality of first coils, and a plurality of second coils. The plurality of first coils and the plurality of second coils are arranged in the magnetic body at intervals in a layered manner in a second direction. A second coil is arranged between every two adjacent first coils in the second direction. The orthographic projection of the first coils falls into the orthographic projection of the second coils. According to the present application, a plurality of inductors can be integrated into one single multi-phase inductor, and the consistency of electrical parameters such as the inductance value L, RDC, and coupling coefficient K of the multi-phase inductor is high. A high electrical performance consistency can maintain signal stability in a working circuit, and the space of a PCB circuit to be occupied can be reduced.
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
8.
Nonlinear inductor, manufacturing method thereof, and nonlinear inductor row
Disclosed is a nonlinear inductor, a manufacturing method thereof, and a nonlinear inductor row. The nonlinear inductor includes two magnetic core assemblies, a conductor and a magnetic plastic encapsulation layer; the magnetic core assemblies include magnetic cores; each magnetic core includes a flange and a central column arranged on the flange; two central columns of the two magnetic core assemblies are opposite to each other; a non-uniform air gap exists between the two central columns and/or the magnetic core assemblies are made of different materials; the conductor is arranged on the two central columns; the two magnetic core assemblies and the conductor are located in the magnetic plastic encapsulation layer; electrode parts of the conductor are exposed outside the magnetic plastic encapsulation layer; and the magnetic core assemblies and the magnetic plastic encapsulation layer are made of different materials; thereby the nonlinear inductor has stepped saturation characteristics.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
9.
Inductor with special-shaped structure and manufacturing method thereof
An inductor with the special-shaped structure includes an inductor main body and a pair of supporting legs fixed below the inductor main body, wherein the pair of supporting legs is conductors and is electrically connected to a pair of electrodes of the inductor main body, and the pair of supporting legs is configured to support the inductor main body during installation, so that a gap space is left below the inductor main body. Due to the unique structural design of the inductor in the present invention, the utilization ratio of the area of the PCB can be effectively increased, and the inductor is particularly suitable for very-high-density component installation on the PCB during power application. Moreover, by changing relative positions of the supporting legs, lower cavities with different sizes may be formed below the inductor main body, thereby facilitating optimal design for meeting different demands.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
Disclosed in the present application are a double-coil inductor and an electronic device. The double-coil inductor comprises a first coil, a second coil and two magnetic cores, wherein one magnetic core is provided with a first recess, the other magnetic core is provided with a second recess, the two magnetic cores are stacked, the first recess and the second recess are provided opposite to each other and communicated, the first coil is sleeved outside the second coil, and the first coil and the second coil are provided between the two magnetic cores and located in the first recess and the second recess which are communicated. The present application facilitates the inductor to integrate characteristics of small volume, large current, and high power.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 27/26 - Fixation des parties du noyau entre ellesFixation ou montage du noyau dans l'enveloppe ou sur un support
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
09 - Appareils et instruments scientifiques et électriques
Produits et services
Antenna filters; Radio interference suppression filters; Baluns, capacitors and electric coils, electric temperature sensors, batteries, antennas, transformers, electric converters, choking coils for use in electrical apparatus, varistors, circuit boards, electromagnetic coils, electric resistors, electric resistances, and induction voltage regulators
The present application discloses a magnetic device and a manufacturing method therefor. The manufacturing method comprises: placing the carrier onto which coil windings and a positioning auxiliary material are fixed and magnetic powder in a mold cavity for pressing to obtain a magnetic device whole board; and cutting the magnetic device whole board along the positioning auxiliary material to obtain a plurality of magnetic devices, such that improvement of the utilization rate of the magnetic powder and improvement of process capacity are facilitated, thereby reducing manufacturing costs of the device.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
13.
INDUCTOR WITH SPECIAL-SHAPED STRUCTURE AND METHOD FOR MANUFACTURING SAME
An inductor with a special-shaped structure and a method for manufacturing same. The inductor with a special-shaped structure comprises an inductor main body and a pair of supporting feet fixed beneath the inductor main body, wherein the pair of supporting feet are conductors and are in conduction connection with a pair of electrodes of the inductor main body, and the pair of supporting feet are configured to support the inductor main body when mounted, so as to leave a void space under the inductor main body. The unique inductor structure of the present invention is designed to provide adequate clearance for mounting other components on a PCB under the inductor main body, so as to effectively improve an area utilization rate of the PCB, and the inductor structure is particularly suitable for very high density component mounting on a PCB in power applications. Furthermore, by varying relative positions of the supporting feet, lower cavities of different sizes can be formed under the inductor main body, thereby facilitating adapting to different requirements to optimize a design. The inductor with a special-shaped structure of the present invention can improve the utilization rate of space in a Z direction of a PCB, such that the size of the PCB can be reduced.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
14.
PLANAR WIRE-WOUND TRANSFORMER AND MANUFACTURING METHOD THEREFOR
A planar wire-wound transformer and a manufacturing method therefor. Coils, and windings in a PCB substrate are used to jointly form all windings of the planar wire-wound transformer. When the number of turns of all the windings is unchanged, the number of layers of the PCB substrate is reduced, thereby reducing the thickness of the PCB substrate. Therefore, the design and manufacturing difficulties of the PCB substrate are reduced, thereby reducing the manufacturing difficulty of the planar wire-wound transformer.
Disclosed are a load sheet and a preparation method therefor. By means of arranging an extension portion on a second electrode, it is ensured that the area of a resistor is maximized, and a relatively high rated power can be withstood. In addition, by means of arranging the extension portion, return losses of a signal in the case of a large aspect ratio can be effectively reduced, and a standing wave ratio parameter meets requirements.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
A surface-mounted transformer includes an adhesive layer and a winding product. The winding product is disposed inside the adhesive layer; the winding product includes an I-shaped magnetic core and a coil wound on a middle pillar of the I-shaped magnetic core; leading-out ends of the coil are connected to electrodes; the electrodes are exposed on the surface of the adhesive layer; and the adhesive layer is obtained through compression molding forming of a magnetic molding material. Compared with a surface-mounted transformer in the prior art, which has equal performance indexes, the surface-mounted transformer has a smaller size with a decrease proportion of over 50%; and a BOBBIN and an insulating rubber tape do not need to be used in processing. The winding product in the surface-mounted transformer is completely covered by the adhesive layer, so that the product is high in reliability and can support a PSIP plastic package environment.
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
17.
Manufacturing method of an integrally formed inductor
A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.
H01F 7/06 - Électro-aimantsActionneurs comportant des électro-aimants
H01F 1/24 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
18.
Winding structure for inductor and method for manufacturing the same, winding inductor and method for manufacturing the same
A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 41/061 - Enroulement de feuilles ou de fils conducteurs plats
A laminated shielding inductor includes a laminated body, an internal coil, and a shielding cover; the laminated body includes a plurality of insulator layers; shielding conductor through grooves which are located at the periphery of the internal coil are formed in the plurality of insulator layers; shielding conductors are arranged in the shielding conductor through grooves, are electrically and mutually connected and jointly form a shielding conductor laminated layer; a shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal coil; and the shielding conductor laminated layer, the shielding conductor upper layer and the shielding conductor lower layer are closed to form the shielding cover. Thus, high shielding effect of the laminated chip inductor can be realized, external radiation of the laminated chip inductor is effectively reduced, and the reliability of a circuit system is improved.
A laminated electronic device includes a laminate wherein the laminate includes a plurality of laminated insulator layers, the laminate has a multi-layer coil pattern provided between the plurality of insulator layers in a laminated manner, adjacent layers of the coil pattern are electrically connected through conductive via holes to form an internal coil, a first external electrode and a second external electrode are disposed on a bottom surface of the laminate which is parallel to a direction of lamination. In surface-mounting of the laminated electronic device, it only needs to connect the external electrodes on the bottom surface of the laminate to a soldering board, and needs not to preserve a space for solder wicking in the surrounding, thereby significantly saving the occupied space of surface mount components to achieve high-density mounting; in addition, the Q value of the product is improved.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01F 41/10 - Raccord des connexions aux enroulements
21.
NONLINEAR INDUCTOR AND MANUFACTURING METHOD THEREFOR, AND NON-LINEAR INDUCTOR ROW
A nonlinear inductor and a manufacturing method therefor, and a nonlinear inductor row. The nonlinear inductor comprises two magnetic core assemblies, conductors and a magnetic plastic packaging layer. The magnetic core assemblies comprise a magnetic core, and the magnetic core comprises a blade and a central column arranged on the blade. The two middle columns of the two magnetic core assemblies are arranged opposite one another, an non-uniform air gap is arranged between the two middle columns, and/or the magnetic core assemblies are made of different materials. The conductors are disposed on the two central columns, and the two magnetic core assemblies and the conductors are both located in the magnetic plastic packaging layer, electrode parts of the conductors being exposed outside the magnetic plastic packaging layer. The magnetic core assemblies and the magnetic plastic packaging layer are made of different materials, and thus the nonlinear inductor features a stepped saturation characteristic.
Disclosed are an inductor assembly and a manufacturing method therefor. A magnetic core and a conductor are disposed within a magnetic encapsulation layer so as to enable the magnetic core and the conductor to be in a sealed space. In addition, the magnetic core and the conductor are attached to the magnetic encapsulation layer, such that no air gap is present between inner and outer magnetic mediums of the inductor assembly; thus, high inductance values can be maintained when currents are large, and almost no noise is generated at a high frequency, thereby improving reliability.
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
23.
NR-TYPE POWER INDUCTOR AND OPTIMIZATION DESIGN METHOD BASED ON FINITE ELEMENT SIMULATION
Disclosed are an NR-type power inductor and an optimization design method based on finite element simulation. The optimization design method comprises: a. selecting a magnetic core material according to a design target, and preliminarily determining the number of turns of winding, the size of a magnetic core center leg, a wire diameter and a DCR parameter; b. performing parametric modeling in Maxwell to obtain a simulation model; c, performing finite element simulation by taking a saturation current of the NR-type power inductor as a research object, so as to obtain an L-I curve; d. adjusting parameters and repeating steps b and c, so as to obtain a plurality of corresponding L-I curves; and e. comparing the L-I curves and determining the optimal structure. In finite element simulation, the saturation current of the NR-type power inductor is taken as a research object, so that when direct-current resistance is minimum, changes in the inductance and saturation current, under different sizes of a center leg, of the NR-type power inductor can be obtained more accurately and rapidly, so as to obtain the optimal structural design scheme.
G06F 30/23 - Optimisation, vérification ou simulation de l’objet conçu utilisant les méthodes des éléments finis [MEF] ou les méthodes à différences finies [MDF]
Disclosed is a ceramic dielectric filter, comprising a filter body and a PCB board. The signal transmission surface of the filter body is provided with an input end and an output end which are used for connecting a signal input/output device. The PCB board is used for welding the signal transmission surface and a communication system board and then is grounded. The PCB board, the input end and the output end are arranged in a staggered manner. The PCB board comprises at least two sub-boards. The sub-boards are arranged at intervals, so that the stress action between the sub-boards cannot be mutually transferred. Compared with an existing ceramic dielectric filter connected to a whole PCB board structure, the stress borne by the PCB board used in the utility model is greatly reduced, so that the ceramic cracking and welding spot tension cracking of the dielectric filter are effectively reduced, and the probability of falling of copper foils on the PCB board is effectively reduced.
Disclosed are a processing and forming method for a microwave ceramic dielectric filter and the microwave ceramic dielectric filter prepared by means of the method. The microwave ceramic dielectric filter comprises a ceramic dielectric body and a metal layer attached to the surface of the ceramic dielectric body, and the ceramic dielectric body is formed by mixing microwave ceramic powder with a ceramic forming agent at least containing a binder and then performing injection molding. The present invention can solve the problems of inconsistent dry-pressing molding size shrinkage, a local dielectric constant difference, incapability of molding complex shapes, and non-uniform green body density and the like of the microwave ceramic dielectric filter.
An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/10 - Raccord des connexions aux enroulements
27.
PLASTIC MOLDED POWER INDUCTANCE ELEMENT AND MANUFACTURING METHOD
A plastic molded power inductance element and a manufacturing method. The plastic molded power inductance element comprises a conductor (10), a magnetic core (20), and a magnetic plastic encapsulation layer (40). The conductor (10) comprises an insulated base (101), insulated side enclosing portions (102, 104), and electrode portions (103, 105) that are integrally formed. The base (101), the side enclosing portions (102, 104), and the magnetic core (20) are assembled together by means of a gapless fit. The magnetic plastic encapsulation layer (40) gaplessly covers the conductor (10) and the magnetic core (20). The magnetic plastic encapsulation layer (40) completely covers the prefabricated magnetic core (20) and the part of the conductor (10) except for the electrodes, the structure is integrally formed, and there is little leakage flux. When the equivalent permeability is as high as 60 or more, the equivalent saturation flux density can reach 0.55 T or more, and the space utilization rate is high, facilitating an inductor miniaturization design.
A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
H01F 27/33 - Dispositions pour amortissement du bruit
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
Disclosed in the present utility model is a ceramic filter having a coefficient of thermal expansion (CTE) compensation function, comprising a filter body, an input end and an output end being provided on a signal transmission surface of the filter body. To cancel the use of a PCB board for connection to effectively reduce use costs and improve the cushioning performance during connection to a communication system board, while retaining the functions, the same as those achieved when using the PCB board, of supporting the filter, connecting signals to the ground, and compensating for inconsistent CTEs of the ceramic and the communication system board, the ceramic filter having a CTE compensation function of the present utility model further comprises several first elastic metal pads for connection to the communication system board, the first elastic metal pads being discretely arranged on the signal transmission surface and being staggered with the input end and the output end, and the CTE of the first elastic metal pads being almost the same as that of the PCB board.
Disclosed is a dielectric filter capable of improving harmonics. The dielectric filter comprises a dielectric body, wherein the dielectric body is provided with a resonant cavity; the dielectric body is further provided with an annular structure for suppressing harmonics; and the resonant cavity is located in the annular structure. The dielectric filter can effectively suppress harmonics, can effectively improve the problem of heat dissipation of the filter, and can further effectively reduce the weight of the filter.
Disclosed is an SMD transformer and a production method therefor, said SMD transformer comprising a glue layer and a wound portion, the wound portion being disposed within the glue layer and comprising an I-shaped magnetic core and a winding package wound on the core column of same; a lead-out end of the winding package is connected to an electrode, said electrode being exposed on the surface of the glue layer. The glue layer is obtained by compression molding of a magnetic molding compound. Compared to existing SMD transformers having equivalent performance indices, the present SMD transformer is dimensionally smaller by a proportion that can exceed 50%, and no bobbins or insulating tape are required in production. The wound portion in the present SMD transformer is further wholly enclosed within the glue layer, ensuring high product reliability, and support of PSIP packaging environments.
H01F 27/06 - Montages, supports ou suspensions de transformateurs, réactances ou bobines d'arrêt
H01F 27/26 - Fixation des parties du noyau entre ellesFixation ou montage du noyau dans l'enveloppe ou sur un support
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
32.
Metal soft magnetic composite material inductor and preparation method thereof
A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.
C22C 38/34 - Alliages ferreux, p. ex. aciers alliés contenant du chrome et plus de 1,5% en poids de silicium
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
H01F 1/01 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
A preparation method for an inductance component, comprising: prefabricating a continuous coil row containing a plurality of hollow coils with the connections of every two adjacent hollow coils being bent feet; placing the continuous coil row into a cavity of a prefabricated mold, the cavity comprising a plurality of sub-chambers and one sub-chamber being used for placing a hollow coil; injecting the prepared soft-magnetic magnetic glue into the cavity to enable the soft-magnetic magnetic glue to coat the hollow coil, and simultaneously exposing the bent feet to the outside to perform magnet forming; cutting the formed semi-finished product; and peeling the exposed bent foot copper wire, and performing metallization to form an electrode to obtain a finished product of the inductance component. The invention has high inductance preparation efficiency, and the obtained product electrode has no risks of a dry joint, poor contact, and the like.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
34.
SOLID DIELECTRIC FOR FILTER AND SURFACE METALLIZATION PROCESS THEREFOR, AND DIELECTRIC FILTER
Disclosed is a solid dielectric for a filter. The solid dielectric comprises a solid dielectric body and is characterized by further comprising a conductor structure arranged on the surface of the solid dielectric body, wherein the conductor structure at least comprises a first conductor metal layer for signal transmission and a second conductor metal layer for a surface welding layer; the first conductor metal layer is located on the surface of the solid dielectric body; the second conductor metal layer is located on the surface of the first conductor metal layer; and the first conductor metal layer and the second conductor metal layer are conductor layers made of different metal materials. Further disclosed are a surface metallization process for the solid dielectric, and a dielectric filter. According to the solid dielectric in the present invention, by means of providing a multi-layer conductor layer structure, various metals can be replaced, while costs are reduced, the conductor layers which are actually used for signal transmission are protected from damage, and the signal transmission performance of the solid dielectric is ensured.
H01P 1/20 - Sélecteurs de fréquence, p. ex. filtres
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
35.
SURFACE TREATMENT METHOD FOR MICROWAVE DIELECTRIC CERAMIC FILTER
Disclosed in the present invention is a surface treatment method for a microwave dielectric ceramic filter. A protective layer is formed, by means of printing or spraying, on a non-functional surface of a microwave dielectric ceramic filter on which drying treatment has been performed, and thus the protective layer can prevent the non-functional surface of the microwave dielectric ceramic filter from being corroded by an external environment during use, obviously improving the corrosion resistance of the microwave dielectric ceramic filter, and further improving the reliability of the microwave dielectric ceramic filter.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
36.
INTEGRALLY FORMED INDUCTOR AND MANUFACTURING METHOD THEREFOR
An integrally formed inductor and a manufacturing method therefor. The method comprises the following steps: S1, prefabricating a coil having two lead-out ends; S2, placing the coil in a cavity; S3, injecting soft magnetic powder and a soft magnetic mixture into the cavity and forming integrally a magnet on the coil after pressing; S4, milling and performing surface reduction on the formed magnet, such that the thickness of the magnet is reduced to be within a pre-set dimension range, and the lead-out ends of the coil are exposed outside of the processed magnet; S5, applying metal to the lead-out ends exposed outside so as to form electrodes. The present method overcomes the shortcomings of inductors made with compression molding, produces integrally formed inductors that have a thin dimension at a good yield rate, while lowering the precision requirements for forming molds, as well reducing mold wear and tear and processing cost.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
37.
HIGH-FREQUENCY LOAD PIECE BASED ON ALUMINUM NITRIDE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Provided are a high-frequency load piece based on an aluminum nitride substrate (3) and a manufacturing method therefor, the high-frequency load piece comprising an aluminum nitride substrate (3), a first surface electrode (41), a second surface electrode (4), a resistance layer (5) and a back electrode (1). The first surface electrode (41) and the second surface electrode (4) are formed separated from one another on an obverse side of the aluminum nitride substrate (3), and the first surface electrode (41) is connected to the second surface electrode (4) by means of the resistance layer (5). The back electrode (1) is formed on the reverse side of the aluminum nitride substrate (3), and the second surface electrode (4) is connected to the back electrode (1) by means of an electrode terminal (2) formed on an end of the aluminum nitride substrate (3). The high-frequency load piece is able to satisfy the power and electrical requirements for a 10-18 GHz state, the rated power thereof is 20 W, and when the operating frequency is 10-18 GHz, the high-frequency load piece has a relatively low standing wave ratio. In addition, the high-frequency load piece is able to match the low operating frequency of 0-10 GHz. On the basis of the manufacturing method for the high-frequency load piece, a thick film process based on an aluminum nitride substrate (3) can be used to manufacture the high-frequency load piece.
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
Disclosed is a capacitance coupling structure of a dielectric filter, the capacitance coupling structure comprising a solid dielectric body, at least two first blind holes used for adjusting resonant frequency are arranged on the solid dielectric body, each of the first blind holes and solid dielectric filling the position around the corresponding first blind hole form a dielectric resonator, a negative coupling structure for realizing capacitive coupling of the two dielectric resonators is arranged between two adjacent first blind holes, the negative coupling structure comprises a second blind hole and an open slot that are provided in the solid dielectric body, at least one of the two ends of the open slot is of an open structure, and the surface of the solid dielectric body, the surfaces of the first blind holes, the surface of the second blind hole and the surface of the open slot are all covered with conductor metal layers. Further disclosed are a dielectric filter, a communication antenna, and a communication base station. The capacitance coupling structure provided in the utility model solves the problem that capacitance coupling between dielectric resonators is difficult, and simplifies the structure and the manufacturing process of a dielectric filter.
An integrally formed inductor and a manufacturing method therefor, the method comprising: sintering a magnetic core plate having a plurality of recesses from a soft magnetic material, a magnetic core pillar being formed in each recess; mounting hollow coils separately into the plurality of recesses, the magnetic core pillars being inserted into the coils, and terminals of the coils remaining outside the recesses; placing the magnetic core plate mounted with the coils into a forming mold, adding a fluid-state soft magnetic material, and by means of pressing, causing the fluid-state soft magnetic material to form a single body on the magnetic core plate; causing two terminals of the coils contained in the pressed magnetic core plate to be exposed, and corresponding to each coil, cutting the magnetic core plate into a plurality of semi-finished inductors; using an insulating material to coat the semi-finished inductors to form an insulating coating layer, only the two terminals of the coils being exposed; and performing metalation in the regions of the surface of the insulating coating layer having the exposed coil terminals to form electrodes of integrally formed inductors. Thus, provided in the present invention is an ultra small, ultra thin, and highly reliable integrally formed inductor and a manufacturing method therefor.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
40.
WINDING STRUCTURE AND MANUFACTURING METHOD FOR INDUCTANCE, WINDING INDUCTOR, AND MANUFACTURING METHOD
A winding structure and manufacturing method for inductance, a winding inductor, and a manufacturing method. The winding structure comprises a magnetic core and a coil; the magnetic core comprises a center post, a plate, first to fourth wire hangers, and first and second studs; the center post is connected to the top surface of the plate; the first stud is disposed at the center of a first side of the plate and extends outwards; the second stud is disposed at the center of a second side of the plate and extends outwards; the bottom surfaces of the first to fourth wire hangers that transit toward the bottom surface of the plate are respectively first to fourth chamfer surfaces; the coil comprises a wire pack sleeving the center post and two wire leads; first to fourth segments of the first wire lead sequentially adhere to the first wire hanger, the first chamfer surface, the bottom surface of the plate, the third chamfer surface, the third wire hanger, and the top surface of the plate; first to fourth segments of the second wire lead sequentially adhere to the second wire hanger, the second chamfer surface, the bottom surface of the plate, the fourth chamfer surface, the fourth wire hanger, and the top surface of the plate; the second segments of the two wire leads are parallel to one another.
An inductance element and a preparation method therefor, comprising: a prefabricated continuous coil row comprising a plurality of hollow coils (1), the connection of each two adjacent hollow coils (1) being a folding leg (11, 12); placing the continuous coil row into the mould cavity of a prefabricated mould, the mould cavity comprising a plurality of sub-cavities, one sub-cavity being for placing one hollow coil (1); injecting prepared soft-magnetic glue into the cavity so that the soft-magnetic glue covers the hollow coils (1) and the folding legs (11, 12) are exposed, and performing magnet moulding; cutting the moulded semi-finished product; stripping the copper wires of the exposed folding legs (11, 12), and performing metallisation to form an electrode to obtain the inductance component finished product. The efficiency of the inductor prepared using the present method is high, and the obtained product does not have risks such as faulty welding and poor contacts.
A stacked electronic component and a manufacturing method therefor. The stacked electronic component comprises a stacked body, an internal wire coil, a first external electrode, and a second external electrode. The stacked body comprises a plurality of insulating body layers arranged in a stacked manner, and is provided with a plurality of layers of wire coil patterns arranged in a stacked manner between the plurality of insulating body layers. Conductive through holes are arranged on the plurality of insulating body layers, adjacent layers of wire coil patterns being electrically connected by means of the through holes so as to form an internal wire coil. The first external electrode and the second external electrode are arranged on a bottom surface of the stacked body parallel to the stacking direction, and the first external electrode and the second external electrode are respectively connected to either end of the internal wire coil. When the present stacked electronic component is surface mounted, all that is required is for the external electrodes on the bottom surface of the stacked body to be connected to a soldering block, and there is no need to reserve a side tin climbing space, which can markedly reduce the area occupied by a electronic component surface mounting space, thus implementing high-density surface mounting of electronic components, while the internal wire coil being perpendicular to the structure of the bottom electrodes is advantageous for raising the Q value of the product.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01F 41/10 - Raccord des connexions aux enroulements
A stacked shielded inductor, comprising a stacked body, an internal wire coil, a first external electrode, a second external electrode, a third external electrode, and a shielding cover. The stacked body comprises a plurality of insulating body layers arranged in a stacked manner, and shielding conductor channels positioned on the periphery of the internal wire coil is opened in the plurality of insulating body layers. Each shielding conductor channel is internally provided with a shielding conductor, and the channels are electrically connected to one another, together forming a shielding conductor stacking layers surrounding the outside of the internal wire coil. A shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal wire coil, the shielding conductor stacking layers, the shielding conductor upper layer, and the shielding conductor lower layer closing to form a shielding cover that encloses the internal wire coil, the shielding cover being connected to the third external electrode arranged on a surface of the stacked body. Thus, the present invention is able to achieve a high screening effect for a stacked surface-mounted inductor, effectively reducing outward radiation from the stacked surface-mounted inductor, and thereby improving the reliability of a circuit system.
The present invention discloses a planar transformer PCB board and a manufacturing method thereof, comprising: performing gel injection molding on two sides of a PCB substrate with a through hole to form a double-sided winding portion integrated with the PCB substrate; the double-sided winding portion is of a symmetrical structure on the two sides of the PCB substrate, the center of the double-sided winding portion is a via hole consistent with the through hole, and the via hole is aligned with the through hole to form a magnetic core hole for the magnetic core to pass through; the periphery of the via hole is convex to form a wire stop portion; a wire passing groove is formed in a hole wall of the magnetic core hole, and is used for allowing a metal wire to pass through to simultaneously perform in-out planar winding on both sides of the double-sided winding portion, so as to form two series coils arranged on the two sides of the PCB substrate. The present invention does not need to coat a self-adhesive layer on the two sides of the PCB substrate, reduces the time for coating the self-adhesive layer, and solves a series of problems such as the flow phenomenon of the self-adhesive layer during the baking process, the accumulation of the sticky self-adhesive layer during the winding process and the like.
An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.
H01F 1/153 - Alliages métalliques amorphes, p. ex. métaux vitreux
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 41/26 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour appliquer des pellicules magnétiques sur des substrats à partir de liquides en utilisant des courants électriques
H01F 41/22 - Traitement thermiqueDécomposition thermiqueDépôt chimique à partir d'une vapeur
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
46.
METAL SOFT MAGNETIC COMPOSITE MATERIAL INDUCTOR AND PREPARATION METHOD THEREFOR
Disclosed in the present invention are a metal soft magnetic composite material inductor and a preparation method therefor, the method comprising: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; using the granulation powder to press a material cake, and transferring and molding same; using a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product to fabricate an end electrode, i.e. obtain a finished product inductor. The coil skin film at the interior of the inductor fabricated by the present invention sustains almost no damage, and has the advantages of a high density, high strength, high electrical reliability, etc.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
Disclosed are a coil component and a manufacturing method thereof. The coil component comprises a winding core portion, a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode. The winding core portion comprises a first flange portion and a second flange portion respectively provided at two ends of a winding center portion. The first outer electrode and the third outer electrode are provided at the first flange portion and the second flange portion, respectively. The second outer electrode and the fourth outer electrode are provided at the first flange portion and the second flange portion, respectively. A second wire is provided at a recess or a spacing in between adjacent turns of a first wire, such that the coil component has at least one area with double-layer wire winding and/or at least one area with single-layer wire winding. The coil component can be obtained by means of the manufacturing method. A slant capacitance in the same turn of each of the two wires can be effectively offset, thereby further reducing the mode conversion characteristics and noise levels of the coil component.
A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
An inductive component comprising a hollow coil made by winding a Litz wire, a plastically sealed magnetic layer covering said coil, and a first electrode and a second electrode respectively connected to a first lead-out terminal and a second lead-out terminal of said coil, the first electrode and the second electrode being exposed outside of the plastically sealed magnetic layer. The manufacturing method for the inductive component comprises: using a Litz wire to wind and make a hollow coil; connecting two lead-out terminals of said coil to a material piece at portions to be made into two electrodes; making and shaping a plastically sealed magnetic layer on the periphery of the coil; performing thermal processing to cure the plastically sealed magnetic layer; performing cutting on the material piece which is now a cured semi-finished product so as to form two electrodes exposed outside of the plastically sealed magnetic layer, and bending the two electrodes to be flush with and to extend along the surface of the plastically sealed magnetic layer. The inductive component can reduce the skin effect and proximity effect of an electrical conductor in a high-frequency magnetic field, effectively inhibit alternating current impedance, and reduce high-frequency loss.
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
50.
WINDING COIL COMPONENT AND FABRICATION METHOD THEREFOR
Disclosed by the present invention are a winding coil component and a fabrication method therefor. The winding coil component comprises a magnetic core part, a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode; the magnetic core part comprises a winding center part provided with a first flange part and a second flange part at two ends respectively, the first outer electrode and the third outer electrode are disposed on the first flange part and the second flange part respectively, and the second outer electrode and the fourth outer electrode are disposed on the first flange part and the second flange part respectively; and a first wire and a second wire are wound around the winding center part to form four winding areas and three switching areas, one switching area being provided between every two winding areas. The described winding coil component may be obtained by means of the fabrication method. The mode switching characteristics of the winding coil component may further be reduced.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
Disclosed are a common-mode coil component and a manufacturing method therefor. The common-mode coil component comprises a coiling core part, a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode, wherein the coiling core part comprises a wire coiling center part with a first flange part and a second flange part formed on one side and the other side respectively, the first outer electrode and the third outer electrode are arranged on the first flange part and the second flange part respectively, and the second outer electrode and the fourth outer electrode are arranged on the first flange part and the second flange part respectively; and a first wire and a second wire are wound around the coiling core part to form a first coiling area, a switching area, a second coiling area and a third coiling area, and are fixed on the outer electrodes to form a double-layer segmented structure. The common-mode coil component can be obtained through the manufacturing method. A mode translation characteristic of the common-mode coil component can be kept to a minimum by the present invention.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
09 - Appareils et instruments scientifiques et électriques
Produits et services
(1) Antenna filters for radios; radio interference suppression filters; baluns; capacitors and electric coils; electrical temperature sensors; fuel cell batteries, storage batteries; electrical accumulator; radio antennas; electric transformers; AC/DC converters; DC/DC converters; semiconductors; choking coils for use in electrical apparatus; varistors; circuit boards; electromagnetic coils; electric resistors; and induction voltage regulators.
An inductive element includes a magnetic core, a flat coil wound on a middle column of the magnetic core, and a magnetic plastic package layer covering the magnetic core and the flat coil. Two electrodes connected to two pigtails of the flat coil are exposed outside of the magnetic plastic package layer. The flat coil is configured to enable a width direction of a flat wire of the flat coil to be perpendicular to an axial direction of the middle column of the magnetic core, and the flat wire is stacked layer by layer in the axial direction of the middle column. A manufacturing method for the inductive element is also disclosed herein. By using the wounding method of the flat coil of the inductive element, a height of a product may be reduced while obtaining a same DCR, so that the product is thinner.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 1/147 - Alliages caractérisés par leur composition
H01F 41/061 - Enroulement de feuilles ou de fils conducteurs plats
An inductance element and manufacturing method therefor. The inductance element comprises magnetic cores (100, 200), flat coils (110, 210) wound on center pillars (105, 203) of the magnetic cores, and magnetic plastic package layers (108, 205) covering the magnetic cores and the flat coils. Two electrodes connected to two leading-out ends (106, 107, 201, 202) of the flat coils are exposed out of the magnetic plastic package layers, wherein the flat coil is configured in such a manner that a width direction of a flat wire which forms the flat coil is perpendicular to the axial direction of the center pillar of the magnetic core, and the flat wire is laminated layer by layer in the axial direction of the center pillar. According to a winding mode of the flat coil of the inductance element, the height of a product can be reduced while the same DCR is obtained, so that the product is thinner.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
55.
REAR CERAMIC COVER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
A rear ceramic cover (1) for an electronic device, and an electronic device. A wireless charging RX coil (8) is provided on the inner surface of the rear ceramic cover (1); a recess (2) for mounting the wireless charging RX coil (8) is provided in a middle area on the inner surface of the rear ceramic cover (1); and at least two wireless charging RX electrode grooves (3) externally extending from the middle area of the recess (2) and an edge area of the recess (2) respectively are formed on the inner surface of the rear ceramic cover (1). Electrodes formed in the at least two wireless charging RX electrode grooves (3) are used as lead-out terminals (5) of the wireless charging RX coil (8) mounted in the recess (2), and either end of the wireless charging RX coil (8) are soldered on the lead-out terminals (5). The rear ceramic cover (1) is directly used as a rear cover of a portable electronic product, such as a smart phone, a tablet computer, or a wearable device, facilitates satisfying miniaturization and thickness reduction requirements of the electronic product, and has high wireless charging efficiency.
A switching power supply module and a packaging method therefor. The switching power supply module comprises a power inductor (10) and a switching power supply chip (20). The power inductor comprises a magnetic core (100) and L-type metal end electrodes (10a, 10b) welded to the two ends of the magnetic core. The switching power supply chip comprises a packaging body (21), a bare chip (22) in the packaging body, and a bottom pad (23) of the bare chip. Each L-type metal end electrode consists of a first electrode portion (10b1) and a second electrode portion (10b2) that are perpendicular to each other. The first electrode portions are welded to the magnetic core and form right angles with the magnetic core. The second electrode portions extend in parallel from the first electrode portions to the middle of the magnetic core. The bare chip and the packaging body thereof are jointly embedded between the first and second electrode portions and the magnetic core. The bottom pad presses against between the two second electrode portions and is insulated from the second electrode portions, and the welding surface of the bottom pad is flush with the welding surfaces of the second electrode portions. By means of the packaging method, the power inductor provided with the L-type metal end electrodes and the switching power supply chip are packaged in a nested manner.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
57.
METHOD FOR FABRICATING MAGNETIC COIL IN WIRELESS CHARGING SYSTEM
CHENGDU YICHONG WIRELESS POWER TECHNOLOGY CO., LTD. (Chine)
SHENZHEN SUNLORD ELECTRONICS CO., LTD. (Chine)
Inventeur(s)
Peng, Xiaojun
Pan, Dezheng
Liu, Changzheng
Pan, Siming
Li, Tun
He, Dawei
Abrégé
Disclosed is a method for fabricating a magnetic coil in a wireless charging system. The coil can comprise a wire with a rectangular cross section. The method can comprise: feeding a wire to a coil apparatus comprising three winding reels; winding the wire to be a magnetic coil by changing the position of the winding reels; and assembling the magnetic coils by pressing the magnetic coils and attaching the magnetic coils to a coil carrier.
Disclosed is a ceramic back cover used in an electronic device and an electronic device having the ceramic back cover. A wireless charging RX coil is disposed on an inner surface of the ceramic back cover, a groove used for disposing the wireless charging RX coil is in an intermediate region of the inner surface of the ceramic back cover, and at least two wireless charging RX electrode grooves that extend outward separately from an intermediate region of the groove and a marginal region of the groove are formed on the inner surface of the ceramic back cover. Electrodes formed in the at least two wireless charging RX electrode grooves are used as leading-out ends of the wireless charging RX coil disposed in the groove, and two ends of the wireless charging RX coil are welded at the leading-out ends.
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
H04B 5/00 - Systèmes de transmission en champ proche, p. ex. systèmes à transmission capacitive ou inductive
H02J 7/02 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries pour la charge des batteries par réseaux à courant alternatif au moyen de convertisseurs
59.
TRANSFER MOULDING INDUCTIVE ELEMENT AND MANUFACTURING METHOD THEREFOR
Disclosed are a transfer moulding inductive element and a manufacturing method therefor. The element comprises: a magnetic body formed from a soft magnetic gel by means of transfer moulding; a prefabricated coil assembly, comprising a hollow coil and electrode pieces connected to two end portions of the hollow coil, the coil assembly being filled with the soft magnetic gel during the transfer moulding so that the whole hollow coil is located inside the magnetic body, the electrode pieces connected to the two end portions of the hollow coil being at least partially exposed on the outside of the magnetic body so as to form end electrodes. The manufacturing method comprises: soldering the prefabricated hollow coil and the electrode pieces to form the coil assembly, and placing in a cavity of a prefabricated mould; performing the transfer moulding with the gelatinous soft magnetic gel, so that the whole hollow coil is filled in the gelatinous soft magnetic gel, the electrode pieces at the two end portions of the hollow coil being at least partially exposed on the outside of the soft magnetic gel to act as the end electrodes; performing de-moulding after the soft magnetic gel in the mould has cured and formed the magnetic body, arranging the end electrodes, and obtaining the transfer moulding inductive element.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
60.
INTEGRALLY FORMED INDUCTIVE ELEMENT AND MANUFACTURING METHOD THEREFOR
Disclosed are an integrally formed inductive element and a manufacturing method therefor. The integrally formed inductive element comprises a coil provided with an insulating coating layer and a magnetic material integrally formed with the coil via pressing. Electrodes exposed outside the magnetic material are formed at two ends of the coil. The insulating coating layer of the coil includes a non-conductive inorganic matter particle component and a resin component which are uniformly mixed, the weight percentage ratio of the inorganic matter particle component and the resin component being 70%:30% – 90%:10%. The voltage resistance of the integrally formed inductive element is increased, and the electrical performance and reliability of an inductive product are improved.
An assembly-type inductor and a manufacturing method therefor. The assembly-type inductor comprises a cap magnetic core, a T-shaped magnetic core, a conductive winding and a pair of hardware assembly pieces. The inside of the cap magnetic core is formed with a recess, the conductive winding is wound on a central column of the T-shaped magnetic core, the central column of the T-shaped magnetic core and the conductive winding are arranged within the recess inside the cap magnetic core, a gap having a preset distance is arranged between the central column of the T-shaped magnetic core and the bottom of the recess of the cap magnetic core so as to form an air gap, the hardware assembly pieces are fixed on the cap magnetic core and form an electrical connection with the conductive winding, the cap magnetic core and the T-shaped magnetic core are fixed by a binder at least filled in a bottom area of the recess inside the cap magnetic core, and the binder filled in the bottom area of the recess inside the cap magnetic core fills the air gap. Also provided is the manufacturing method for the assembly-type inductor. The assembly-type inductor and the manufacturing method therefor are capable of implementing batch automated production and maintain high performance stability.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
62.
Method for preparing a composite wire and a power inductor
A method for preparing a power inductor includes the following steps A to E: A: preparing a composite wire; B: winding the composite wire according to a predetermined shape and a predetermined coil quantity, so as to form coils; C: placing the coils into a mold cavity, adding metal soft magnetic powder to the mold cavity, and pressing the metal soft magnetic powder and the coils to form a base comprising the coils; D: performing sintering treatment on the base; and E: plating two terminal electrodes on two ends of the base to form the power inductor.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 13/012 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles pour fabriquer des faisceaux de fils
H01B 3/10 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques oxydes métalliques
H01B 13/16 - Isolation des conducteurs ou des câbles par passage à travers un bain liquide ou par immersion dans un bain liquideIsolation des conducteurs ou des câbles par pulvérisation
H01F 41/061 - Enroulement de feuilles ou de fils conducteurs plats
H01F 41/32 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour appliquer un matériau conducteur, isolant ou magnétique sur une pellicule magnétique
H01F 41/26 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour appliquer des pellicules magnétiques sur des substrats à partir de liquides en utilisant des courants électriques
H01B 7/18 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par l'usure, la contrainte mécanique ou la pression
H01B 7/28 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par l'humidité, la corrosion, les attaques chimiques ou les conditions atmosphériques
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
63.
Metal matrix composite wire, power inductor, and preparation methods for same
A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 μm. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.
H01F 41/076 - Formation de prises ou de bornes lors de l’enroulement, p. ex. par enveloppement ou par brasage du fil sur les broches, ou en formant directement des bornes à partir du fil
H01B 13/06 - Isolation des conducteurs ou des câbles
H01F 41/064 - Enroulement de fils conducteurs non plats, p. ex. de tiges, de câbles ou de cordes
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
C03C 14/00 - Compositions de verre contenant un constituant non vitreux, p. ex. compositions contenant des fibres, filaments, trichites, paillettes ou similaires, dispersés dans une matrice de verre
H01B 3/08 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques quartzIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques verreIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques laine de verreIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques laine de laitierIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques émaux vitreux
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
B05D 3/02 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par cuisson
B05D 3/12 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par des moyens mécaniques
C03C 8/16 - Mélanges de frittes vitreuses contenant des additifs, p. ex. des agents opacifiants, des colorants, des agents de broyage agents vecteurs ou de suspension, p. ex. suspension
A low temperature co-fired ceramic material and a preparation method therefor. The low temperature co-fired ceramic material consists of CaO, B2O3, SiO2, nano Al2O3, MgO, and nano ZrO2. The mass percentages of the components are: CaO: 35%-50%; B2O3: 5%-15%; SiO2: 40%-55%; nano Al2O3: 1%-5%; MgO: 1%-5%; and nano ZrO2: 1%-5%. The preparation method comprises: performing ball mill mixing according to the formula, and then performing high temperature sintering; quenching in deionized water, grinding, performing wet ball milling, drying and grinding; and finally, granulating to prepare a green body, then debinding and sintering to obtain the low temperature co-fired ceramic material. The low temperature co-fired ceramic material has low dielectric constant, low loss (less than 100 GHz), and good overall performance.
2. A preparation method comprises the following steps: ball milling and mixing according to the formula, sintering at a high temperature, quenching in deionized water, grinding, performing wet ball-milling, drying and grinding; and finally, granulating to prepare a green body, discharging glue, and sintering, to obtain a low-temperature co-fired ceramic material. According to the low-temperature co-fired ceramic material and the preparation method thereof provided in the present disclosure, the prepared low-temperature co-fired ceramic material has the advantages of low dielectric constant, low loss, good overall performance and the like.
C03C 10/00 - Verre dévitrifié ou vitrocéramiques, c.-à-d. verre ou céramiques ayant une phase cristalline dispersée dans la phase vitreuse et constituant au moins 50% en poids de la composition
C03B 19/06 - Autres méthodes de façonnage du verre par frittage
C03C 3/093 - Compositions pour la fabrication du verre contenant de la silice avec 40 à 90% en poids de silice contenant du bore contenant de l'aluminium contenant du zinc ou du zirconium
C03C 4/16 - Compositions pour verres ayant des propriétés particulières pour verre diélectrique
66.
CBS-based LTCC material and preparation method thereof
5 as a final sintering aid, to prepare the material. In the present invention, a CBS-based LTCC material that is obtained by sintering at a low temperature and has the advantages of low dielectric constant, low loss, and good overall performance is provided.
C04B 35/22 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de silicates autres que l'argile riches en oxyde de calcium
C04B 35/626 - Préparation ou traitement des poudres individuellement ou par fournées
C04B 35/63 - Préparation ou traitement des poudres individuellement ou par fournées utilisant des additifs spécialement adaptés à la formation des produits
B28B 3/02 - Fabrication d'objets façonnés en utilisant des pressesPresses spécialement adaptées à ce travail dans laquelle un poinçon exerce une pression sur le matériau dans une cavité de moulagePoinçons de forme particulière
B28B 11/24 - Appareillages ou procédés pour le traitement ou le travail des objets façonnés pour faire prendre ou durcir
67.
CBS-CLASS LTCC MATERIAL AND MANUFACTURING METHOD THEREOF
A CBS-class LTCC material and a manufacturing method thereof. The primary component of the material is respectively a sintered phase with low dielectric constant of CaSiO3 and of CaB2O4, comprising: a CBS and a dopant, wherein the CBS comprises the following components in weight percentages: 30-40% of CaO; 15-30% of B2O3; and 40-50% of SiO2. The dopant comprises P2O5, nanoscale CuO, and nanoscale V2O5. The weight percentages are: 0-2% of P2O5; 0-2% of CuO; and 0.5-2% of V2O5. The manufacturing method comprises: using a CBS-class dielectric ceramic as the base and one or two of P2O5 and CuO as an initial dopant; using an oxide mixing technique; then adding V2O5 to obtain the final aid for manufacturing the material. The CBS-class LTCC material can realize low-temperature sintering and ensures a low dielectric constant, low power loss, and improved integrated performance for the CBS system.
C04B 35/22 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de silicates autres que l'argile riches en oxyde de calcium
The present invention discloses a soft magnetic composite material and manufacturing method thereof. The soft magnetic composite material comprises the following components: 67.9-95.54 wt% of FeSiCr, 0.1-0.3 wt% of TiO2, 0.15-0.75 wt% of SiO2, 0.1-0.5 wt% of Mn3O4, 0.1-0.5 wt% of ZnO, 3.4-25.9 wt% of BaO, 0.4-3 wt% of B2O3, 0.2-0.85 wt% of CaO, and 0.01-0.3 wt% of CuO. The soft magnetic composite material includes a soft magnetic composite material with high initial magnetic permeability and high Bs, excellent temperature stability, or low temperature coefficient.
C22C 33/02 - Fabrication des alliages ferreux par des techniques de la métallurgie des poudres
C22C 38/18 - Alliages ferreux, p. ex. aciers alliés contenant du chrome
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
C22C 38/02 - Alliages ferreux, p. ex. aciers alliés contenant du silicium
H01F 1/22 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
An inductor and a manufacturing method therefor. The inductor comprises a magnetic body (1) and a conductor coil (6). The conductor coil is inside the magnetic body, and further comprises an inorganic insulation layer (5). The inorganic insulation layer is wrapped on the surface of the conductor coil, and the inorganic insulation layer is inside the magnetic body. The manufacturing method can be used to manufacture an inductor with a greater inductance or an inductor with a smaller direct current resistance.
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 27/32 - Isolation des bobines, des enroulements, ou de leurs éléments
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
A preparation method for a metal matrix composite wire and a power inductor. The preparation method for the metal matrix composite wire comprises the steps of: 1) preparing a metal core; 2) formulating a glass resin mixture: premixing borosilicate glass powders and a solvent and uniformly stirring same, and then adding a dispersing agent and a resin with a decomposition temperature of 300-500 °C, uniformly stirring and mixing same; 3) dissolving a self-adhesive resin into a solvent to formulate a resin solution; 4) uniformly coating the glass resin mixture on the surface of the metal core, then coating the self-adhesive resin solution on the surface of the glass resin mixture, and drying at a temperature of 80-150 °C; and 5) repeating the step 4) until the coating thickness reaches 2-10 μm. A final power inductor is prepared by using the above-mentioned composite wire, pressing it together with magnetic powders to form an inductor; performing sintering at a temperature of 600-900 °C; and grinding and polishing the composite wire extending out of the two ends of the magnetic body of the inductor.
H01B 13/06 - Isolation des conducteurs ou des câbles
H01B 13/22 - GainageBlindageÉcransApplication de couches de protection d'un autre genre
H01B 13/08 - Isolation des conducteurs ou des câbles par enroulement
H01B 7/28 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par l'humidité, la corrosion, les attaques chimiques ou les conditions atmosphériques
H01B 7/29 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par des températures extrêmes ou par les flammes
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
72.
COMPOSITE WIRE AND PREPARATION METHOD THEREFOR, AND PREPARATION METHOD FOR POWER INDUCTOR
Disclosed in the present invention are a composite wire and a preparation method therefor, and a preparation method for a power inductor, the composite wire comprising a metal core, an easily-passivated metal layer covering the surface of the metal core, and a self-adhesive resin layer covering the surface of the easily-passivated metal layer; the insulating layer of the composite wire is a metal passivation layer formed by oxidisation of the easily-passivated layer after sintering processing. The preparation method is used for manufacturing the composite wire. The preparation method for the power conductor is used for preparing a novel power inductor containing the composite wire. The composite wire of the present invention is resistant to high temperature and easy to wind; the easily-passivated metal layer cannot easily fall off during the winding process, thus ensuring that the insulating layer formed by passivation of same will have excellent weather resistance and pressure resistance.
H01B 3/10 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques oxydes métalliques
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electric temperature sensors, antennas, transformers, choking coils for use in electrical apparatus, varistors, circuit boards, electromagnetic coils, electric resistors, electric resistances
A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to form external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.
H01F 7/06 - Électro-aimantsActionneurs comportant des électro-aimants
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01F 17/00 - Inductances fixes du type pour signaux
76.
LAMINATED INDUCTOR HAVING HIGH SELF-RESONANT FREQUENCY AND HIGH QUALITY FACTOR
A laminated inductor having a high self-resonant frequency and a high quality factor. A laminated body is a structure of at least two types of insulator sheets which are laminated into a whole body, one type is a first type of insulator sheet of a ferrite magnetic material constituting upper and lower substrates of the laminated body, and the other type is a second type of insulator sheet near an internal electrode constituting the laminated body, and the main body thereof is a plurality of first insulators of the ferrite magnetic material and at least one layer of a second insulator disposed in an internal specific position of a first insulation layer and made from a low-dielectric constant and low-loss material; and the coil conductor of a coil layer is arranged in the first insulators. By adjusting the number of layers and the width of a second insulator, the dielectric constant and loss of the whole material of a laminated inductor are reduced, i.e. the residual capacitance is reduced, thereby increasing the SRF and Q values of the laminated inductor, and a series of laminated inductors having different SRF and Q values can be obtained by needing only one kind of ferrite slurry; and with respect to the design of conventional various ferrite materials, the cost is greatly reduced.
Disclosed is a method for producing a stacked coil device. The stacked coil device involved comprises a stacked body formed by stacking a coil-forming conductor and an insulator. The production method comprises the following steps: A. producing a sheet of a ceramic insulating layer; B. forming a sheet of a ceramic insulating layer having electrically conducting through-holes; C. forming a coil layer sheet having a coil conductor, so that the coil conductor is embedded in the sheet of the ceramic insulating layer; D. stacking the sheet of the ceramic insulating layer and the coil layer sheet having the coil conductor in a pre-determined sequence and cutting off same, so as to obtain the stacked body; E. removing bonding material components from the cut-off stacked body, and sintering this stacked body; and F. forming external electrodes at the two ends of the stacked body. The method for producing the stacked coil device can conveniently produce stacked coil devices of power type with low DC resistances and without defects such as delamination, cracking and air gaps.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
