The present invention relates to a method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization, the method comprising the steps (a) providing said substrate, (b) providing an aqueous, palladium-free activation composition comprising (i) a first species of dissolved transition metal ions and additionally metal particles thereof, (ii) one or more than one complexing agent, (iii) permanently or temporarily one or more than one reducing agent, (iv) optionally one or more than one second species of dissolved metal ions being different from the first species, wherein - at least of the first species, the dissolved transition metal ions and the metal particles thereof are present in a reversible equilibrium, with the proviso that - the metal particles are formed from the dissolved transition metal ions through a continuous or semi-continuous reduction through the one or more than one reducing agent, - the dissolved transition metal ions are formed from the metal particles through continuous or semi-continuous oxidation of said particles, and - the dissolved transition metal ions and the metal particles thereof, respectively, are repeatedly involved in said reduction and said oxidation such that no precipitating agglomerates of said metal particles a r e formed, (c) contacting the substrate with said activation composition such that a transition metal or a transition metal alloy is deposited on the surface of said substrate and an activated surface for metallization is obtained.
The present invention is related to an aqueous post treatment composition for providing a post treatment layer on at least a part of a passivation layer, which is covering at least a part of a zinc layer being on at least a part of an iron containing substrate, characterized in that the aqueous post treatment composition comprises at least one chromium (III) ion source and at least one compound containing the chemical element silicon; wherein a molar ratio of silicon versus chromium is given in said composition, with the proviso that said molar ratio is ranging from 2600:1 to 1 : 1 for the zinc layer obtained by an electrolytic acid zinc deposition process; or that said molar ratio is ranging from 5200:1 to 1:1 for the zinc layer obtained by an electrolytic alkaline zinc deposition process.
The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc- nickel alloy layer on a substrate to be treated using a membrane anode system, and the use of a membrane anode system for acid or alkaline electrolytic deposition of a zinc-nickel alloy layer on a substrate to be treated by such a method.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
The invention relates to an aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer on a substrate in manufacturing an article with an integrated circuit and a method and use thereof, wherein the solution comprises: - at least one hydroxycarboxylic acid or salt thereof according to the general formula (I) [RCH2-(RCH)n-COO-]m Mm+ (I) wherein n is integer from 2 to 4 and m is 1 or 2, R is independently H or OH with proviso that at least one R is OH, and wherein Mm+ with m: 1 is hydrogen, ammonium or alkali metal; or Mm+ with m: 2 is earth alkali metal, - at least one polyoxyethylene sorbitan fatty acid ester, - at least one sulphonated fatty acid or a salt thereof.
The present invention is related to an acidic zinc or zinc-nickel alloy electroplating bath for depositing a zinc or zinc-nickel alloy layer and a method for zinc or zinc-nickel alloy electroplating making use of such an electroplating bath. The bath comprises a triazole derivative and a polyethylene glycol derivative.
The present invention refers to a controlled method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath, wherein the bath comprises - trivalent chromium ions, - bromide ions, - alkali metal cations in a total amount of 0 mol/L to 1 mol/L, based on the total volume of the deposition bath, and the bath has - a target pH within the range from 4.1 to 7.0, (b) providing the at least one substrate and at least one anode, (c) immersing the at least one substrate in the aqueous deposition bath and applying an electrical direct current such that the chromium or chromium alloy layer is deposited on the substrate, the substrate being the cathode, wherein during or after step (c) the pH of the deposition bath is lower than the target p H, (d) adding NH4OH and/or NH3 during or after step (c) to the deposition bath such that the target pH of the deposition bath is recovered.
The present invention concerns a method for increasing the adhesion between a chromium surface and a lacquer wherein said chromium surface is contacted with an aqueous solution comprising at least one phosphorous compound according to formulae R1-P(O)(OR2R3) 1 and R1-O-P(O)(OR2R3) 2 wherein R1 is a C1 to C12 alkyl group, linear, branched or cyclic comprising at least one polar residue and R2 and R3 are independently selected from the group consisting of hydrogen, lithium, sodium, potassium, ammonium and C1 to C4 alkyl while passing an external electrical current through said substrate and at least one anode wherein said substrate serves as the cathode.
C09D 5/44 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produits; Apprêts en pâte pour des applications électrophorétiques
8.
ACIDIC ZINC AND ZINC-NICKEL ALLOY PLATING BATH COMPOSITION AND ELECTROPLATING METHOD
The present invention relates to an acidic zinc or zinc-nickel alloy plating bath composition comprising a source for zinc ions, optionally a source for nickel ions, a source for chloride ions and at least one dithiocarbamyl alkyl sulfonic acid or salt thereof. Said plating bath composition and the corresponding plating method result in zinc or zinc-nickel alloy layers having an improved throwing power and thickness distribution, particularly when plating substrates having a complex shape and/or in rack-and-barrel plating.
The present invention concerns a method for cathodic corrosion protection of a substrate having a chromium surface and at least one intermediate layer between the substrate and the chromium surface, selected from the group comprising nickel, nickel alloys, copper and copper alloys and wherein said chromium surface is contacted with an aqueous solution comprising at least one compound containing phosphorous while passing an electrical current through said substrate, at least one anode and the aqueous solution wherein said substrate serves as the cathode. The phosphorous compound is preferably a phosphonic acid of type RR2R3P03, wherein R is selected from the group consisting of n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadexyl, n-heptadecyl, n-octadecyl, unsubstituted branched C8 to C18 alkyl residues, and wherein R2 and R3 are H or a suitable counter ion selected from Li+, Na+, K+ and NH4 +. The aqueous solution comprises also at least one additive which increases the solubility of the phosphonic acid.
C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
C25D 9/08 - Revêtement électrolytique autrement qu'avec des métaux avec des matières inorganiques par des procédés cathodiques
C23F 13/02 - Moyens pour empêcher la corrosion des métaux par protection anodique ou cathodique cathodique; Choix des conditions, des paramètres ou des procédés pour la protection cathodique, p.ex. des conditions électriques
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p.ex. couches doubles ou triples
10.
GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING A SEMI-BRIGHT NICKEL OR NICKEL ALLOY, METHOD FOR ELECTROPLATING AND USE OF SUCH A BATH AND COMPOUNDS FOR THE SAME
The present invention is related to a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy coating characterized in that the electroplating bath comprises at least one compound having the general formula (I) wherein R1 = C1 C18 hydrocarbon moiety substituted with a SO3- group, C1 C18 hydrocarbon moiety substituted with a carboxylic group or C1 C18 hydrocarbon moiety substituted with at least an aromatic and/or a heteroaromatic group; R2 = NR3R4 moiety, OR5 moiety, or cyclic NR6 moiety, wherein R3, R4, R5= hydrogen or C1 C18 hydrocarbon moiety or C1 C18 hydrocarbon moiety substituted with at least an aromatic and/or a heteroaromatic group, wherein R3, R4 and R5 are identical or different; R6 = C3 C8 hydrocarbon moiety or C3 C8 hydrocarbon moiety, wherein at least one carbon atom is substituted by a heteroatom; and n = 1 3.
The aqueous electroplating bath according to the present invention comprises chromium(VI) ions, sulfate ions and methane-trisulfonic acid or a salt thereof as the catalyst. The functional chromium layer deposited from the aqueous electroplating bath according to the present invention has an increased corrosion resistance.
The present invention relates to a process for corrosion protection of an iron- containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved.
C25D 3/56 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages
C25D 5/10 - Dépôt de plusieurs couches du même métal ou de métaux différents
C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p.ex. couches doubles ou triples
13.
PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS
The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickel; Revêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/50 - Revêtement avec des alliages avec des alliages à base de fer, de cobalt ou de nickel
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique
14.
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of hexavalent chromium. The etching solution is based on an sulphuric acidic solution containing a source of chlorate ions. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p.ex. de résines
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p.ex. de résines pour rendre la surface rugueuse, p.ex. par décapage au moyen de solutions aqueuses acides
The present invention relates to a process for metallizing nonconductive plastics using etching solutions free of hexavalent chromium. The etching solutions are based on permanganate solutions. After the treatment of the plastics with the etching solutions, the plastics are metallized by means of known processes.
The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles. During the process, the rack to which the said articles are fastened is subjected to a treatment for protection against metallization. Subsequently, the articles are metallized by means of known processes, wherein the racks remain free of metal.
The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of hexavalent chromium. The etching solution is based on an acidic permanganate solution. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.
The present invention concerns an electroless nickel plating bath suitable for application in plating on plastic processes. The plating bath is free of hazardous substances such as lead ions and ammonia and allows deposition of nickel phosphorous alloys on plastic substrates at plating temperatures not higher than 55 °C. Furthermore, the deposition of copper from an immersion type copper plating bath onto the nickel phosphorous coatings require no activation step which results in less process steps and less waste water production.
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickel; Revêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfurcontaining additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications.
To achieve high efficiency in regeneration of waste fluid from metal plating electrolytes for example, a device and a method for recovering a recovering material from a recovering fluid containing the recovering material are provided, wherein the device comprises at least one container C, the at least one container C comprising at least one sorption material, the at least one sorption material forming at least one sorption bed SB in the at least one container C and the sorption bed SB allows the fluid to flow there through. The at least one container C comprises at least one means for fixing ML, EP, FM, MO the at least one sorption bed SB to compensate for a volume change VC thereof. The method comprises a) loading the recovering material, in a loading step, to at least one sorption material forming at least one sorption bed S which is comprised in at least one container C by bringing a recovering fluid containing the recovering material into contact with the at least one sorption material; b) unloading the recovering material, in a regenerating step, from the at least one sorption material by bringing a regenerant fluid into contact with the at least one sorption material which is loaded with the recovering material and loading the recovering material to the regenerant fluid, and c) fixing the at least one sorption bed (SB) to compensate for a volume change (VC) thereof.
B01D 15/22 - Adsorption sélective, p.ex. chromatographie caractérisée par des caractéristiques de structure ou de fonctionnement relatives à la structure de la colonne
C22B 3/24 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par des procédés physiques, p.ex. par filtration, par des moyens magnétiques par adsorption sur des substances solides, p.ex. par extraction avec des résines solides
C22B 3/42 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par extraction utilisant l'échange d'ions
C23C 18/32 - Revêtement avec l'un des métaux fer, cobalt ou nickel; Revêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux
C02F 1/28 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par absorption ou adsorption
C02F 1/42 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par échange d'ions
The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and work- pieces carrying dark chromium deposits are suited for application for decorative purposes.
The invention discloses an alkaline aqueous zinc-iron alloy plating bath comprising: 4 to 6 g/l zinc ions, 1 to 3 g/l iron ions, 25 to 35 g/l hydroxyl ions, 0.5 to 2.5 g/l of a quaternary ammonium polymer and at least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof.
The invention concerns a process which is used to plate functional layers of acidic or alkaline zinc or zinc alloy baths which contain nitrogenous organic additives, a soluble zinc salt and if necessary other metal salts selected from Fe, Ni, Co and Sn salts, where the bath composition for the regeneration is conveyed through an appropriate device having an ion exchanger resin to remove cyanide ions.
An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm2; and a lattice parameter of 2.8895 +/- 0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.
A crystalline chromium deposit having a lattice parameter of 2.8895 + / - 0.0025 .ANG., and an article including the crystalline chromium deposit. An article including a crystalline chromium deposit, wherein the crystalline chromium deposit has a {111} preferred orientation. A process for electrodepositing a crystalline chromium deposit on a substrate, including providing an electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited.
For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof.
C23C 22/53 - Traitement du zinc ou des alliages à base de zinc
C23C 22/17 - Orthophosphates contenant des cations du zinc et des acides organiques
C23C 22/34 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p.ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des fluorures ou des fluorures complexes
There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
C25D 3/56 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages
28.
METHOD OF MANUFACTURING A CIRCUIT CARRIER AND THE USE OF THE METHOD
A method of manufacturing a circuit carrier and the use of said method are proposed, said method comprising, after providing a printed circuit board (a), coating the circuit board on at least one side thereof with a dielectric (b), structuring the dielectric for producing trenches and vias therein using laser ablation (c) are performed. Next, a primer layer is deposited onto the dielectric, either onto the entire surface thereof or into the produced trenches and vias only (d). A metal layer is deposited onto the primer layer, with the trenches and vias being completely filled with metal for forming conductor structures therein (e). Finally, the excess metal and the primer layer are removed until the dielectric is exposed if the primer layer was deposited onto the entire surface thereof, with the conductor structures remaining intact (f).
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
brevets
