Abrégé

Described herein are a component carrier, wherein the component carrier comprises: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of (electrical) conductive nanowires.

Classes IPC  ?

• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a carrier body having at least one hole, electrically conductive paste in at least part of the at least one hole, and at least one conductive interconnection structure extending with direct physical contact into the electrically conductive paste.

Classes IPC  ?

• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/181 -
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier having a stack with i) at least one electrically conductive layer structure and at least one electrically insulating layer structure; ii) an inorganic layer structure with a, in particular planar, main surface; iii) a cavity in the stack, defined by a bottom and a sidewall; and iv) at least one stop layer, arranged at least partially in or on the main surface of the inorganic layer structure and exposed at the bottom of the cavity. The present application further provides a method of manufacturing a component carrier.

Classes IPC  ?

• H05K 1/183 -
• H05K 1/185 -

Abrégé

A package includes a component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes at least one carrier pad. An electronic component assembled with the component carrier has at least one component pad. A connection structure electromechanically connects the at least one carrier pad with the at least one component pad by micro- and/or nanostructures, wherein the micro- and/or nanostructures are made of the same material as the at least one carrier pad and/or the at least one component pad.

Classes IPC  ?

• H10W 72/00 -
• H10W 72/90 -

Abrégé

A component carrier having a stack with i) at least one electrically conductive layer structure and at least one electrically insulating layer structure; and ii) a cavity provided in the stack. The cavity includes a) a first cavity portion provided on a first vertical level of the stack, wherein the first cavity portion partially vertically extends along the thickness of a first electrically insulating layer structure of the at least one electrically insulating layer structure, and b) a second cavity portion provided on a second vertical level of the stack, wherein the first cavity portion and the second cavity portion are connected to each other through their vertical thickness extension in the stack.

Classes IPC  ?

• H10W 70/68 -
• H10W 44/20 -

Abrégé

A product, in particular a component carrier, including: i) an electrically insulating layer structure; ii) an electrically conductive layer structure; and iii) at least one glass barrier layer, at least partially sandwiched between the electrically insulating layer structure and the electrically conductive layer structure. The at least one glass barrier layer has two main surfaces. The two main surfaces have a different adhesion property. Further, a manufacturing method is described.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A membrane dialysis device, including: i) a first dialysis section having: ia) a first dialysis medium region, ib) a first diffusion medium region, and ic) a first membrane section arranged between the first dialysis medium region and the first diffusion medium region; ii) a second dialysis section having: iia) a second dialysis medium region, iib) a second diffusion medium region, and iic) a second membrane section arranged between the first dialysis medium region and the second diffusion medium region; and iii) a separation device that spatially separates the first dialysis section from the second dialysis section. The first dialysis medium region is fluidically coupled with the second dialysis medium region such that dialysis medium is streamed through the first dialysis medium region and then through second dialysis medium region.

Classes IPC  ?

• B01D 61/24 - Dialyse
• B01D 61/28 - Appareils à cet effet
• C02F 1/44 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par dialyse, osmose ou osmose inverse

Abrégé

An electronic device having a motherboard, a power converter module, a processor module, a memory module, and a heat sink. At least one of the power converter module, the processor module and the memory module is mounted on the motherboard for signal transmission and electric power supply, wherein the heat sink is thermally coupled at least with the processor module and the memory module for removing heat, and wherein the power converter module, the processor module and the memory module are arranged between the motherboard and the heat sink.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
• H05K 1/181 -
• H05K 1/183 -
• H10W 40/20 -
• H10W 74/15 -

Abrégé

An electronic device comprising: a semiconductor element having connection pads, a redistribution layer coupled to the semiconductor element, a component carrier, and at least one functional element. The redistribution layer comprises: a first main surface associated to the semiconductor element, a second main surface opposite the first main surface first pads exposed on the first main surface and electrically connected to the connection pads and second pads exposed at the second main surface. The component carrier is coupled to the redistribution layer-structure and has at least one insulating layer, and at least one conductive layer structure. The at least one conductive layer structure is electrically connected to the second pads. The at least one functional element is arranged in or on the component carrier. At least some of the second pads are offset with respect to the correspondent first pads towards the location of the at least one functional element

Classes IPC  ?

• H10W 72/90 -
• H10W 90/00 -

Abrégé

Provided is a component carrier having a stack comprising electrically conductive layer structures and electrically insulating layer structures. The stack includes a cavity that has a bottom wall with portions having different vertical levels, and that is delimited by one main surface of one of the conductive or insulating layer structures. The component carrier also has components provided in the cavity, with at least two of the components having different heights. At least two components with different heights are associated to respective portions, such that the surfaces of the components opposite the bottom wall are vertically positioned within a vertical extension of the same layer structure. An encapsulant material is provided to embed the components.

Classes IPC  ?

• H05K 1/185 -
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A component carrier with a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, at least two components arranged on and/or in the stack side-by-side and divided by a space, at least one electrically conductive first vertical partitioning structure and at least one electrically conductive second vertical partitioning structure. At least one of the vertical partitioning structures at least partially in the space and each of the vertical partitioning structures surrounds at least partially at least one of the components. The at least one electrically conductive first vertical partitioning structure and the at least one electrically conductive second vertical partitioning structure interact with one of the at least one electrically conductive layer structure for shielding the components and are disconnected from each other in a shielding region around the at least two components.

Classes IPC  ?

• H10W 42/20 -
• H10W 70/05 -
• H10W 70/60 -
• H10W 70/63 -
• H10W 70/68 -
• H10W 90/10 -

Abrégé

A component carrier including i) a central structure having a recess extending from a main surface through the thickness of the central structure; ii) at least one component arranged in the recess; iii) an encapsulant material in the recess and at least partially encapsulating the at least one component; and iv) a reinforcing portion, wherein the reinforcing portion is associated with the external side of the encapsulant material.

Classes IPC  ?

• H05K 1/185 -
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/183 -
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance

Abrégé

A component carrier, including a stack with i) at least one electrically insulating layer structure; ii) a plurality of first electrically conductive traces in and/or on the at least one electrically insulating layer structure, and including a first line spacing; and iii) a plurality of second electrically conductive traces in and/or on the at least one electrically insulating layer structure, and including a second line spacing. The second line spacing is larger than the first line spacing, and a first surface of at least one first electrically conductive trace is smoother or rougher than a second surface of at least one second electrically conductive trace.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails

Abrégé

A package having a component carrier having at least one exposed electrically conductive carrier contact and an exposed carrier dielectric, and an electronic component having an integrated circuit having at least one exposed component pad and an exposed component dielectric, wherein the component carrier is connected with the electronic component so that there is a connection between the at least one carrier contact and the at least one component pad and so that there is a direct physical contact between the carrier dielectric and the component dielectric, and wherein at least one of the carrier dielectric and the component dielectric comprises a stress release structure at its surface facing the respectively other one of the carrier dielectric and the component dielectric.

Classes IPC  ?

• H10W 72/30 -
• H10W 42/00 -

Abrégé

A head (100) for exposing a surface (112) of a component carrier structure (102) to a treatment with a processing medium (104), the head (100) comprising at least one ejection opening (106) for ejecting the processing medium (104) to the surface (112), a peripheral wall (108) delimiting a working space (110) to contain the ejected processing medium (104) when the head (100) is in its working position with respect to the surface (112) to be exposed to the processing medium (104), and a processing medium outlet (118) configured to discharge the ejected processing medium (104) from the working space (110). Electrostatic discharge safety may be a feature of an embodiment.

Abrégé

A component carrier having a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the at least one electrically conductive layer structure comprises a plurality of wiring elements arranged in a wiring plane in the at least one electrically insulating layer structure to form a first row of equidistant wiring elements arranged along a straight direction within the wiring plane, and a second row of equidistant wiring elements arranged along the straight direction within the wiring plane and being offset along the straight direction with respect to the wiring elements of the first row.

Classes IPC  ?

• H05K 1/181 -

Abrégé

A component carrier, including a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the at least one electrically conductive layer structure has a sub-portion, i) wherein the sub-portion is electrically separated or separable from the rest of the electrically conductive layer structure; ii) wherein the sub-portion includes a region degrading along the time; iii) wherein the sub-portion includes two extremities, and iv) wherein each of the extremities is electrically connected to a respective connecting area exposed on one of the main surfaces of at least one electrically insulating layer structure. Further, there is described a package, an electronic panel, and a method to evaluate the health condition of a single component carrier.

Classes IPC  ?

• G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/185 -

Abrégé

A method of making a component carrier having a stack comprising an electrically conductive layer structure, and an electrically insulating layer structure having plural wiring elements arranged in a wiring plane to form a first row of equidistant wiring elements arranged along a straight direction within the wiring plane and a second row of equidistant wiring elements arranged along the straight direction within the wiring plane. The method includes defining structural and electrical features of the wiring elements, defining distribution features indicative of a distribution of the wiring elements, defining amounts of the distributed wiring elements to be provided in a respective area of the wiring plane, and defining the distribution of the wiring elements in accordance with requirements of a target current-related value in dependence of the defined structural and electrical features of the wiring elements, the defined distribution features, and the defined amounts of the distributed wiring elements.

Classes IPC  ?

• H10W 70/652 -
• G06F 30/3947 - Routage global
• H10W 70/05 -
• H10W 70/685 -

Abrégé

A component carrier with a stack having at least two electrically insulating layer structures and at least one electrically conductive layer structure, wiring elements provided in one of the electrically insulating layer structures and arranged in a wiring plane to form a first row and a second row of equidistant wiring elements arranged along a straight direction within the wiring plane, a plurality of further wiring elements provided in another of the electrically insulating layer structures, wherein the at least one electrically conductive layer structure has several conductive areas that are electrically insulated from each other and connected to at least one wiring elements and at least one further wiring element. Each conductive area of the electrically conductive layer structure is spaced by a distance from a respective conductive area connected to an adjacent wiring element, wherein said distance is at least 5% of a diameter of the wiring element.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails

Abrégé

Provided are a component carrier and a method for manufacturing thereof. The component carrier has a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one surface of the at least one electrically conductive layer structure is divided in at least one first portion and at least one second portion, with the at least one first portion and the at least one second portion being adjacent one to the other. The at least one first portion has a higher conductivity with respect to that of the at least one second portion. Metallic nanostructures and/or microstructures are provided on the at least one first portion.

Classes IPC  ?

• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• B32B 7/025 - Propriétés électriques ou magnétiques
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

An electronic board includes a stack having at least one electrically insulating layer structure and a plurality of electrically conductive layer structures. One of the plurality of electrically conductive layer structures is provided on one main surface of the at least one electrically insulating layer structure and a further one of the plurality of electrically conductive layer structures is provided on an opposing main surface of the at least one electrically insulating layer structure. A through hole is formed in the stack and is laterally delimited by conductive material, at least one plating layer provided on at least part of both opposing main surfaces of the stack and on a lateral wall of the stack. An annular axial protrusion is provided at one extremity of the through hole, and an annular radial protrusion is provided at the lateral wall of the stack.

Classes IPC  ?

• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

An apparatus for treating a portion of a surface of at least one electrically conductive layer structure of a layer stack of a printed circuit board or the like comprises a surface treatment unit configured to alter along a predefined multi-profiled shape a portion of the exposed surface of the at least one electrically conductive layer structure. Further, there is described a PCB or the like and a method for treating a surface.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A component carrier includes a stack having at least one electrically insulating layer structure and at least one electrically conductive layer structure. The at least one electrically conductive layer structure has at least one trace embedded in the at least one electrically insulating layer structure. The at least one trace has, in a cross section, two lateral walls slanted inwardly beginning from an exterior surface where the embedded trace is exposed with respect to the at least one electrically insulating layer structure. The at least one trace includes, in the cross section, two sharp edges at the exterior surface and at least one rounded edge at an opposed extremity.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

A component carrier includes i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) an electronic component embedded in the stack; and iii) a thermal structure, configured to dissipate thermal energy produced by the electronic component towards and beyond a main surface of the stack. The thermal structure includes iiia) a base structure mounted on and/or at least partially embedded in the stack, in particular flush with one of the layer structures of the stack, and iiib) a plurality of protrusions, protruding from the base structure, and extending beyond the main surface of the stack.

Classes IPC  ?

• H10W 40/22 -
• H10W 40/00 -
• H10W 70/05 -
• H10W 70/685 -

Abrégé

An electronic device includes a three-dimensionally non-planar mold body defining at least part of one of a non-planar side surface and an opposed non-planar side surface of the electronic device, an electrically conductive structure provided on one of the non-planar side surface and the opposing non-planar side surface, and at least one electric entity at least partially inside of the three-dimensionally non-planar mold body.

Classes IPC  ?

• H10W 74/10 -
• H10W 70/09 -
• H10W 72/00 -
• H10W 74/01 -
• H10W 74/47 -
• H10W 76/157 -
• H10W 90/10 -

Abrégé

A component carrier and a method of manufacturing the component carrier are presented. The component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The at least one electrically insulating layer structure has a first main surface and an opposing second main surface, and at least one cavity formed in the first main surface of the at least one electrically insulating layer structure. The cavity is delimited by a bottom wall and a sidewall. A surface of the bottom wall and a surface of the sidewall of the at least one cavity have a different roughness Ra than the first main surface and/or than the second main surface of the at least one electrically insulating layer structure.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance

Abrégé

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier having a stack with at least one electrically insulating layer structure and at least two electrically conductive layer structures, and at least one electrically conductive element. The at least one electrically conductive element passes through the at least one electrically insulating layer structure, preferably in a stacking direction. The at least one electrically conductive element comprises an electrically conductive paste provided in a cavity being located at least partially within the at least one electrically insulating layer structure. The electrically conductive paste is in contact with the at least two electrically conductive layer structures, wherein the center of gravity of one vertical extremity of the at least one electrically conductive element is misaligned with respect to the center of gravity of the opposed other vertical extremity of the at least one electrically conductive element.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Provided are a component carrier, a method for manufacturing thereof, and a component carrier assembly. The component carrier includes a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. The insulating layer structure is stacked in between two electrically conductive layer structures, and the two electrically conductive layer structures are electrically connected to each other by an electrically conductive element including an electrically conductive paste provided in a cavity located between the two electrically conductive layer structures. The cavity delimited in a lateral direction by a lateral wall of the electrically insulating layer structure, the lateral wall having two opposed portions with different inclinations relative to a contacting plane between the electrically insulating layer structure and one of the two electrically conductive layer structures and with respect to a thickness direction of the stack.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

A component carrier and a method of manufacturing the component carrier are presented. A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, an inorganic carrier provided as part of the stack, a through hole in the inorganic carrier extending between a first main surface and a second main surface, and at least one at least partially conductive pin in the through hole, wherein the at least one at least partially conductive pin is directly encapsulated in the through hole by encapsulating material of at least one electrically insulating layer structure of the stack.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Produits et services

Purification installations for sewage; water filtering apparatus; water purification installations; water purifying apparatus and machines; Waste water treatment apparatus; Wastewater treatment installations; Waste water purification installations. Metal treating; providing information relating to material treatment; recycling of waste and trash; refining services; sorting of waste and recyclable material; upcycling [waste recycling]; waste treatment [transformation]; water treating; Chemical recycling of waste products; Consultancy relating to the recycling of waste and trash; Information, advice and consultancy services relating to the recycling of waste and trash; Material treatment services in connection with recycling; Precious metal recycling; Precious metal treating; Processing and recycling of waste and trash; Providing information relating to the recycling of waste; Recovery of precious metals; Recycling; Recycling of chemicals; Recycling of metals; Recycling of precious metals; Recycling of scrap; Recycling of scrap metal; Recycling of solvents; Recycling of waste; Recycling services; Regeneration of water; Sorting of waste and recyclable material [transformation]; Treatment [recycling] of chemicals; Treatment [recycling] of waste; Waste processing; Waste processing [transformation]; Waste recycling; Waste recycling services; Waste treatment for decontamination; Waste treatment services; Waste treatment services [environmental remediation services]; Waste water reprocessing; Waste water treatment; Waste water treatment services; Water pollution control [water treatment]; Water purification; Water purification services. Chemical analysis; chemistry services; consultancy in the field of energy-saving; engineering; technological consultancy; Environmental sustainability consultancy services; Provision of information relating to environmental sustainability; Technical advice in the field of environmental technology.

Abrégé

A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are surface mounted on the stack. The first component and the second component are electrically coupled with each other by the higher density connection region.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou

Abrégé

The invention relates to a method for estimating a viscosity curve of a polymeric material, the method comprising: acquiring viscosity values of the polymeric material at different temperatures (T) under different heating rates (β); determining at least one viscosity curve of the polymeric material depending on the measured viscosities for each heating rate (β); splitting the viscosity curves into at least one determined melting curve and at least one determined curing curve per determined viscosity curve; determining at least one fitted melting curve per determined melting curve; determining at least one fitted curing curve per determined curing curve; and estimating the viscosity curve of the polymeric material by combining the fitted melting curve and the fitted curing curve.

Classes IPC  ?

• G01N 11/00 - Recherche des propriétés d'écoulement des matériaux, p. ex. la viscosité, la plasticitéAnalyse des matériaux en déterminant les propriétés d'écoulement
• G01N 33/44 - RésinesMatières plastiquesCaoutchoucCuir

Abrégé

The invention relates to a method to define a production and/or application and/or use of a polymeric material, comprising the steps of: estimation of a convention degree value (α) of the polymeric material based on at least one first measured value from the polymeric material relating to the kind of conversion degree and based on a fixed value (QI) associated with a respective reciprocal temperature (1/T) and a heating rate (β) of the specific polymeric material, the fixed value (QI) being independent from the conversion degree value (α) of the polymeric material, and definition of the production and/or the application and/or the use of the polymeric material use based on the estimated conversion degree value (α).

Classes IPC  ?

• G01N 33/44 - RésinesMatières plastiquesCaoutchoucCuir
• B29C 37/00 - Éléments constitutifs, détails, accessoires ou opérations auxiliaires non couverts par le groupe ou
• B29K 105/00 - Présentation, forme ou état de la matière moulée

Abrégé

The invention relates to a method for estimating a conversion degree value (α) of a polymeric material, wherein the method comprises the steps of: heating the polymeric material with a predetermined heating rate (β); acquisition of at least one first measured value from the polymeric material at a current temperature (T), the first measured value relating to a specific kind of the conversion degree; determination of a fixed value (QI) associated with the reciprocal temperature (1/T) and the heating rate (B), the fixed value (QI) being independent from the conversion degree value (α) of said polymeric material; and estimation of the conversion degree value (α) of the polymeric material based on the first measured value and the fixed value (QI).

Classes IPC  ?

• G01N 33/44 - RésinesMatières plastiquesCaoutchoucCuir
• G01N 25/48 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la production de quantités de chaleur, c.-à-d. la calorimétrie, p. ex. en mesurant la chaleur spécifique, en mesurant la conductivité thermique sur une solution, sorption ou réaction chimique n'impliquant pas une oxydation par combustion ou catalyse

Abrégé

A component carrier has an elongated shape and comprises a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. At least two of said plurality of electrically conductive layer structures comprise and/or extend up to a respective area provided on one of two extremities of the elongated shape, wherein a plurality of conductive nanowires is provided on said respective areas.

Classes IPC  ?

• H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
• H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
• H01R 12/65 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes

Abrégé

A carrier assembly is provided. The carrier assembly includes: (i) a component carrier; (ii) a component in or on the component carrier, (iii) a signal conductive element provided on a component surface of the component; and (iv) a shielding conductive structure, which is at least partially embedded in the component carrier and which at least partially surrounds said signal conductive element.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides

Abrégé

A component carrier includes i) a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; ii) a cavity, at least partially provided in the stack and delimited by a plurality of sidewalls, iii) a metallic shielding structure in the cavity that at least partially covers the plurality of sidewalls; and iv) a dielectric element of a material having a dielectric constant, Dk, of two or more arranged in the cavity.

Classes IPC  ?

• H01P 3/12 - Guides d'ondes creux
• H01P 3/06 - Lignes coaxiales
• H01P 3/16 - Guides d'ondes diélectriques, c.-à-d. sans conducteur longitudinal
• H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes

Abrégé

A component carrier, including: i) a stack comprising at least two electrically conductive layer structures and at least one electrically insulating layer structure; ii) a plurality of components provided in or on the stack; iii) a plurality of electrically conductive interconnections in the stack electrically connecting at least one electrically conductive layer structure and a respective component; and iv) a test region provided in a portion of the component carrier, the test region comprising at least one test component and at least one second electrically conductive interconnection, the test component having the area where the second electrically conductive interconnection is connected with the same mechanical/chemical features and/or the same position in the depth of the correspondent one of the plurality of components, the second electrically conductive interconnection having the same mechanical/chemical features and/or the same position in the depth of at least one of the plurality of electrically conductive interconnections, wherein connecting areas are exposed on same side of the component carrier, the areas being respectively electrically connected to the two extremities of the at least one second electrically conductive interconnection.

Classes IPC  ?

• G01R 31/68 - Test de connexions amovibles, p. ex. des raccords montés sur une carte de circuit imprimé
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants

Abrégé

A package and its manufacturing method are presented. The package includes a core having at least one through hole delimited by a wall surface which is at least partially covered with at least one electrically conductive plating material, a first layer stack on one main surface of the core, and a second layer stack on an opposing other main surface of the core. The first layer stack has electrically conductive elements with a higher integration density than further electrically conductive elements with a lower integration density of the second layer stack. The further electrically conductive elements include at least one cylindrical vertical electrically conductive connection element for contributing to the formation of an electrically conductive connection interface at a main surface of the second layer stack facing away from the core.

Classes IPC  ?

• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

A component carrier includes a stack-having at least one electrically conductive layer structure and at least one electrically insulating layer structure where the at least one electrically insulating layer structure has at least one design layer structure with a stamped surface profile. A component embedded in the stack-is at least partially covered by the at least one design layer structure.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

A package includes an inorganic core having at least one through hole, and at least one organic board with an at least partially organic dielectric matrix and at least one electrically conductive vertical through connection extending vertically through the at least partially organic dielectric matrix. The at least one organic board is at least partially embedded in the at least one through hole, and an electric connection between a top side and a bottom side of the inorganic core is established by the at least one vertical through connection.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

A component carrier includes a layer stack having at least one component carrier material, a component at least partially embedded in the layer stack, where the component has at least one metal layer structure; and a photoimageable dielectric layer structure on the layer stack. The photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure up to the at least one metal layer structure of the component.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
• G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A package with a component carrier, an interposer and a component and a method of manufacturing the same. The package includes a component carrier, an interposer arranged on the component carrier having a laminated interposer stack with electrically conductive vertical through connections and electrically conductive horizontal structures in a dielectric matrix, and at least one component arranged on the interposer. At least one of the component carrier and the at least one component is directly connected to exposed horizontal structures of the interposer.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

Provided are a component carrier comprising a stack, a method for manufacturing a component carrier, and a package having a component carrier. The stack has an electrically conductive layer and a solder resist layer. The solder resist layer has at least one opening exposing a portion of the electrically conductive layer, and a protective layer is provided on the exposed portion of the electrically conductive layer. The protective layer has an at least substantially plate-shaped central portion having a first thickness distribution and an at least substantially wall-shaped peripheral portion having a second thickness distribution. The central portion at least partially contacts the exposed portion. The peripheral portion is at least partially at an external side of the central portion, and extends least partially in a direction different from a plate extension direction of the central portion, wherein the first thickness distribution is different from the second thickness distribution.

Classes IPC  ?

• H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

The invention relates to component carrier assembly (1) comprising a component carrier (2), comprising a stack (4) said stack (4) comprising at least one electrically conductive layer structure (5, 6) and at least one electrically insulating layer structure (7). It further comprises a component (10), wherein a cavity (8) is formed within the stack (4), and the component (10) is embedded within the cavity (8) by means of an embedding mass (9), wherein the embedding mass (9) is formed from solder resist material.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants

Abrégé

An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

Classes IPC  ?

• H01Q 9/04 - Antennes résonnantes

Abrégé

A component carrier includes a stack having at least one electrically insulating layer structure, at least one electrically conductive layer structure, and at least one inorganic layer structure. At least a portion of a stack side wall is tapered with respect to a stacking direction. The at least one inorganic layer structure being laterally exposed and forming at least partially the stack side wall.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

The present invention provides a package and a method thereof as well as a use of the package for a high-frequency application. The package (100) comprises a component carrier (102) comprising a stack (104) which comprises at least one electrically conductive layer structure (106) and at least one electrically insulating layer structure (108), a multi-component module (110) at least partially arranged on and/or in the stack (104), said multi-component module (110) comprising at least two active portions (112, 114), and an electrically conductive shielding structure (116) configured for at least partially shielding the at least two active portions (112, 114) from each other with respect to electromagnetic interference.

Classes IPC  ?

• H01L 23/552 - Protection contre les radiations, p. ex. la lumière
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

Provided are a component carrier, a method for manufacturing thereof and to a package comprising such a component carrier. The component carrier has a stack having a stacking direction and includes at least one electrically insulating layer structure and at least one electrically conductive layer structure, and further includes at least a first component and a second component embedded in said stack one above the other in said stacking direction with a cavity in between. The first component and the second component each comprise a component main surface facing towards said cavity and delimiting said cavity in the stacking direction partially, and said cavity is filled with an electrically conductive paste.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/11 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe

Abrégé

A metal structure for a component carrier includes a first metal layer structure having a first recess exposed to a first surface and defining a first external boundary profile; and a second metal layer structure having a second recess exposed to a second surface and defining a second external boundary profile. The first metal layer structure and the second metal layer structure are stacked to face each other, so that the first recess and the second recess define a common recess, and the first external boundary profile of the first recess and the second external boundary profile of the second recess are misaligned in the stacking direction of the metal structure.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H01P 3/08 - MicrorubansTriplaques
• H01Q 9/04 - Antennes résonnantes
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

There is described a component carrier and a method of manufacturing a component carrier. The component carrier has a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, the component carrier comprising: i) a cavity formed in the stack; ii) at least one electrically conductive structure exposed at the bottom of the cavity; iii) at least one component embedded in the cavity, wherein the component has at least one exposed connecting element facing the at least one exposed electrically conductive structure; iv) an interconnection structure, arranged between the bottom of the cavity and the at least one component, wherein the interconnection structure connects the at least one exposed electrically conductive structure and the at least one exposed connecting element; v) a first encapsulating material, arranged at the bottom of the cavity, and encapsulating the interconnecting structure and/or a first portion of the component; and vi) a second encapsulating material, encapsulating a second portion of the component. The first encapsulating material and the second encapsulating material are in contact with each other and define a boundary region.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier, includes i) a stack having at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a cavity formed in the stack; iii) an electrically insulating material layer arranged in the stack, at least partially defining the bottom of the cavity; and iv) a metal layer arranged in the stack below the electrically insulating material layer where the bottom of the cavity includes a bottom surface encircled by the sidewalls of the cavity, and a peripheral recess is formed on the bottom of the cavity.

Classes IPC  ?

• H01L 23/053 - ConteneursScellements caractérisés par la forme le conteneur étant une structure creuse ayant une base isolante qui sert de support pour le corps semi-conducteur
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

A component carrier assembly may include a component carrier, a component at least partially embedded within the stack, and an adhesive profile. The component carrier may include a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure. The component may have a first main surface, a second main surface opposed to the first main surface, and at least one lateral surface connecting the first main surface and the second main surface with each other. A first edge of the component may be formed where the first main surface and the at least one lateral surface meet. A second edge of the component may be formed where the second main surface and the at least one lateral surface meet. The adhesive profile may be disposed in a region of the first edge of the component.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 23/495 - Cadres conducteurs

Abrégé

A component carrier includes a stack having at least one electrically conductive layer structure and at least one inorganic layer structure, the at least one inorganic layer structure has a planar first main surface and an opposing planar second main surface. The component carrier further includes a geometrically discontinuous region at the first main surface, and a reinforcing layer structure at the second main surface. The reinforcing layer structure at least partially laterally overlaps the geometrically discontinuous region.

Classes IPC  ?

• H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

There is described a component carrier (100) comprising: i) a stack (102) having at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106); ii) a cavity in the stack (102); iii) a component (136) embedded in the cavity; and iv) a first resin (140) extending from a bottom of the cavity to at least part of the lateral side of the component (136) defining an external boundary surface (143); The component (136) comprises an external main surface opposite to the bottom of the cavity, wherein the external boundary surface (143) is vertically misaligned with respect to the external main surface of the component (136).

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance

Abrégé

A component carrier including i) an inorganic carrier structure; ii) an electrically insulating layer structure comprising resin and reinforcing structures on the inorganic carrier structure; iii) an ultra-thin insulation film on the electrically insulating layer structure; and iv) an electrically conductive structure with a fine line pattern directly on the ultra-thin insulation film.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A component carrier with a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, a cavity formed in the stack and delimited by a bottom wall and a sidewall, and an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall.

Classes IPC  ?

• H01L 23/552 - Protection contre les radiations, p. ex. la lumière
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

Component carrier and method of manufacturing the component carrier are provided by the present application. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), a through hole (108) extending vertically through the stack (102) and delimiting slanted sidewalls (110) of the stack (102), and an electrically insulating coating (112) covering part of both opposing main surfaces (114, 116) of the stack (102) and at least part of the slanted sidewalls (110) of the stack (102), in particular the whole slanted sidewalls (110) of the stack (102).

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/34 - Connexions soudées
• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Abrégé

A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, wherein the stack includes: i) a central rigid portion; ii) a first flexible portion, extending from a first side of the central rigid portion; and iii) a second flexible portion, extending from a second side of the central rigid portion. The first flexible portion extends from a first vertical level from the central rigid portion that is different from a second vertical level from which the second flexible portion extends from said central rigid portion.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H10W 70/05 -
• H10W 70/67 -
• H05K 1/181 -
• H05K 1/185 -

Abrégé

A component carrier which includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a through hole extending vertically through the stack and delimited by sidewalls of the stack having a lateral constriction between opposing main surfaces of the stack, and an electrically insulating coating covering part of the opposing main surfaces and at least part of the sidewalls of the stack.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/34 - Connexions soudées
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

An electronic device (100) which comprises at least one electronic component (134) comprising electrically conductive contacting elements (174) on each of a first main surface and an opposing second main surface, a first component carrier (102) comprising at least one first electrically conductive layer struc- ture (104) and at least one first electrically insulating layer structure (106) at least partially made of an organic material, wherein the at least one first elec- trically conductive layer structure (104) is electrically coupled with the con- tacting elements (174) on the first main surface of the at least one electronic component (134), a second component carrier (112) comprising at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116) at least partially made of an or- ganic material, wherein the at least one second electrically conductive layer structure (114) is electrically coupled with the contacting elements (174) on the second main surface of the at least one electronic component (134), and at least one connection structure (176) connecting the first component carrier (102) with the second component carrier (112).

Classes IPC  ?

• H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A component carrier (112) which comprises a stack (152) which comprises a plurality of electrically conductive layer structures (114) and at least one electrically insulating layer structure (116), wherein said electrically conductive layer structures (114) comprise a multi-layer structure (138) comprising at least two stacked layer structures (140) of different electrically conductive materials, and wherein at least part of said multi-layer structure (138) is electrically coupled with at least one of said electrically conductive layer structures (114a) being exposed at an external surface (154) of the stack (152).

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants

Abrégé

An electronic device (100) which comprises a first component carrier (102) comprising at least one first electrically conductive layer structure (104) and at least one first electrically insulating layer structure (106), a second compo- nent carrier (112) comprising at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116), and at least one electrically functional component (110) configured for providing at least two electric functions and connecting the first component carrier (102) with the second component carrier (112) so as to define a cen- tral space (108) in between.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

A printed circuit board or a printed circuit board intermediate product, comprises a first main surface and a second main surface; a combination of layers including a plurality of insulating layers and at least one first metal layer, wherein the at least one first metal layer extends along a first horizontal plane in parallel to at least one of the first and second main surfaces; at least one cavity in the printed circuit board or the printed circuit board intermediate product, said cavity extending through at least one of the plurality of insulating layers; and a component inserted in the at least one cavity, said component being embedded in said at least one cavity by a material from the at least one insulating layer through which the cavity extends.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/05 - Substrat en métal isolé
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

There is described a component carrier (150), wherein the component carrier (150) comprises: i) a first stack (160) comprising at least one first electrically conductive layer structure (164) and at least one first electrically insulating layer structure (162), and having a first cavity (166) in which a first component (165) is embedded, wherein said first cavity (166) is open on a first main surface of the first stack (160); ii) a second stack (170) comprising at least one second electrically conductive layer structure (174) and at least one second electrically insulating layer structure (172), and having a second cavity (176) in which a second component (175) is embedded, wherein the second cavity (176) is open on a second main surface of the second stack (170) and faces the first main surface of the first stack (160); iii) an intermediate layer (100), wherein the intermediate layer (100) is arranged between the first stack (160) and the second stack (170), and comprises: a) stiffening layer (110) comprising a stiffening structure in an intermediate resin portion (110), b) a first resin portion (120) arranged at a first main surface (115) of the stiffening layer (110), wherein the first resin portion (120) is arranged at least partially in gaps (167) of the open first cavity (166) between the first component (165) and the first stack (160), and c) a second resin portion (130) arranged at a second main surface (116) of the stiffening layer (110) opposed to the first main surface (115), wherein the second resin portion (130) is arranged at least partially in gaps (177) of the open second cavity (176) between the second component (175) and the second stack (170).

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

A component carrier includes a stack of layers forming at least one electrically conductive layer structure and at least one electrically insulating layer structure, the stack including a—preferably conically shaped—cavity, wherein the cavity extends—in the direction perpendicular to the planes in which the layers extend—through at least two layers of the stack of layers, the cavity being delimited by a side wall, the side wall being inclined with respect to the direction perpendicular to the planes of the layers, wherein at least one recess in the side wall of the cavity locally disrupts the side wall extension and partially extends in the stack along the planar extension of the stack.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

The invention relates to a component carrier assembly (1) comprising: a component carrier (2), and an electronic component (10) at least partially embedded within the component carrier (2), wherein at least one electrically insulating layer structure (3) covers at least a first surface (11) of the electronic component (10), wherein the electronic component (10) comprises at least one electrically conductive portion (12) at its first surface (11), wherein at least one feedthrough (5) is formed in the electrically insulating layer structure (3), said at least one feedthrough (5) positionally matches with the at least one electrically conductive portion (12), wherein an electrically conductive path (6) extends from the at least one electrically conductive portion (12) through the feedthrough (5), wherein the electrically conductive path (6) comprises a first portion (7) covering at least a portion of the electrically conductive portion (12), said first portion (7) also covering at least a portion of the stack (4), and a second portion (8) that covers the first portion (7), said second portion (8) being separated from the electrically conductive portion (12) by the first portion (7), wherein the first portion (7) is formed from a first material, the second portion (8) is formed from a second material and the electrically conductive portion (12) of the electronic component (10) is formed from a third material, wherein the first, second and third material are different from each other.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

There is described a component carrier (100), comprising a stack (101) having at least one electrically insulating layer structure (102) and at least one electrically conductive layer structure (104), and comprising the following features: i) said at least one electrically conductive layer structure (104) comprises a patterned conductive structure (110) provided on one of the surfaces of the at least one electrically insulating layer structure (102); ii) the patterned conductive structure (110) defines a contact interface (115) between the patterned conductive structure (110) and said surface (103) of the at least one electrically insulating layer structure (102), so that said surface (103) is partitioned in at least one contact interface portion (120) and at least one free surface portion (130); and iii) the at least one free surface portion (130) comprises metal (150).

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

There is described a component carrier (100), comprising a stack (101) having at least one electrically insulating layer structure (102) and at least one electrically conductive layer structure (104), and comprising the following features: i) said at least one electrically conductive layer structure (104) comprises a patterned conductive structure (110) provided on one of the surfaces of the at least one electrically insulating layer structure (102); ii) the patterned conductive structure (110) defines a contact interface (115) between the patterned conductive structure (110) and said surface (103) of the at least one electrically insulating layer structure (102), so that said surface (103) is partitioned in at least one contact interface portion (120) and at least one free surface portion (130); iii) the properties of metal (150) at the at least one free surface portion (130) is such that the migration of electrically conductive material, in particular copper, between adjacent portions of the patterned conductive structure (110) is prevented; and iv) the patterned conductive structure (110) comprises at least a lateral wall (111) defining the lateral edge (112) of the contact interface (115), wherein the lateral wall (111) vertically extends so that, at the contact with the contact interface (115), the lateral wall (111) penetrates at least partially towards the patterned conductive structure (110) material with respect to the overall vertical extension of the lateral edge (112).

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Produits et services

Apparatus, instruments and cables for electricity; electrical and electronic components; electrical circuits and circuit boards; information technology and audio-visual, multimedia and photographic devices; audio/visual and photographic devices; image capturing and developing devices; measuring, detecting, monitoring and controlling devices; testing and quality control devices; signal cables for IT, AV and telecommunication; communications equipment; printed circuit boards; printed circuits; integrated circuits; hybrid circuits; flexible circuit boards; photomasks; material testing instruments and machines; multichip modules; electronic circuit boards; electronic components; electronic components for integrated circuit cards; microelectronic components; waveguides; optical waveguides; high-frequency apparatus; radio-frequency receivers; radio-frequency transmitters. Material treatment information; air and water conditioning and purification; recycling and waste treatment; printing, and photographic and cinematographic development; textile, leather and fur treatment; metal plating; grinding; soldering; electroplating; water treating; laminating; laminating of board; providing information relating to material treatment; stripping finishes; waste treatment [transformation]; printing; lithographic printing; pattern printing; welding services; laser scribing. Education, entertainment and sport services; organisation of conferences, exhibitions and competitions; arranging and conducting of conferences, congresses and symposiums; arranging of exhibitions for cultural or educational purposes; educational and teaching services; instruction services; transfer of business knowledge and know-how [training]; coaching [training]. Science and technology services; IT services; software development, programming and implementation; design services; natural science services; testing, authentication and quality control; scientific research; scientific laboratory services; computer software design; industrial design; design of electric circuit boards; design of integrated circuits; technological consultancy; chemical analysis; chemistry services; chemical research; packaging design; material testing; research in the field of physics; design of prototypes.

Abrégé

There is described a component carrier (100) having a stack (101) that comprises: i) a core layer (110); ii) a first electrically insulating layer structure (120) arranged on a first main surface of the core layer (110); iii) a second electrically insulating layer structure (130) arranged on a second main surface of the core layer (110), wherein the second main surface is opposed to the first main surface; iv) a cavity (140) in the core layer (110), wherein the core layer (110) defines a cavity lateral wall (145); v) a component (150) with a component lateral wall (155), at least partially inserted in said cavity (140). The first electrically insulating layer structure (120) and the second electrically insulating layer structure (130) extend at least partially into the cavity (140), so that in a region (160) between the cavity lateral wall (145) and the component lateral wall (155), a first distinct resin flowed portion (126) of the first electrically insulating layer structure (120) and a second distinct resin flowed portion (136) of the second electrically insulating layer structure (130) are provided.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

A component carrier (100) which comprises a stack (102) comprising a layer body (104), a fiber-free first electrically insulating layer structure (106) including a first resin (108) on a bottom main surface on the layer body (104), and a fiber-free second electrically insulating layer structure (110) including a second resin (112) on a top main surface of the layer body (104), and a component (114) inserted in a cavity (116) of the stack (102), wherein at least part of a gap (118) between the component (114) and sidewalls (154) of the stack (102) delimiting the cavity (116) is filled partially with the first resin (108) and partially with the second resin (112).

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique

Abrégé

A cluster (100) configured to be inserted and subsequently embedded in a re- cess (116) provided in a component carrier (104), said cluster comprising at least one component (102), and an uncured solid resin (106) encapsulating said component (102), said uncured solid resin (106), or said at least one component (102) and said uncured solid resin (106), forming the exterior sur- face of said cluster (100).

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A method of manufacturing a component carrier, wherein the method comprises stamping a surface profile in a design layer, forming a metallic base structure in at least one indentation of the profiled design layer at least partially by electroplating, and electroplating an electroplating structure in the at least one indentation on or above the metallic base structure.

Classes IPC  ?

• H05K 3/42 - Trous de passage métallisés
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier, including: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a first electronic switch component and a second electronic switch component embedded side-by-side in the stack; and iii) a capacitor device, electrically connected in parallel to the first electronic switch component and the second electronic switch component; wherein the capacitor device is assembled, in particular surface-mounted, to the stack, so that the first electronic switch component and the second electronic switch component are at least partially arranged below the capacitor device in a direction z, perpendicular to the directions of main extension x, y, of the component carrier.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method of manufacturing a component carrier, includes stamping a surface profile in a design layer, forming an electrically conductive seed layer on the stamped design layer, forming a patterned electroplating protection structure on portions of the seed layer apart from indentations of the profiled design layer, and electroplating an electroplating structure selectively on or above portions of the seed layer exposed with respect to the electroplating protection structure.

Classes IPC  ?

• C25D 7/12 - Semi-conducteurs
• C25D 5/00 - Dépôt électrochimique caractérisé par le procédéPrétraitement ou post-traitement des pièces
• C25D 5/02 - Dépôt sur des surfaces déterminées
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 23/528 - Configuration de la structure d'interconnexion
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/46 - Fabrication de circuits multi-couches

Produits et services

Apparatus and instruments for conducting, switching, transforming, accumulating, regulating and controlling the distribution and use of electricity; Electronic components for computers; Electric and electronic circuits; Electrical circuits and circuit boards; Computer hardware and computer peripheral devices; Recording and playing devices for sound and image carriers; Measuring, monitoring and controlling devices, namely, digital multimeters, calipers and cameras, oscilloscopes, insulation tester, LCR meters, and spectrum analyzers, automatic image processing and recognition devices, all the foregoing for printed circuit board and IC substrate production, simulation and testing; Laser measuring systems; Infrared detecting apparatus; Radiation detecting instruments; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; Telecommunication cables; Communications equipment, namely, communication hubs, amplifiers for wireless communications, communication modems, printed circuit boards, IC-substrates, and optical PCBs for high speed and high frequency applications; Printed circuit boards; Printed circuits; Integrated circuits; Hybrid electronic circuits; Flexible circuit boards; Optical inspection apparatus for inspection of semiconductor materials, namely photomasks; Electronic material testing instruments and machines for testing the electrical, optical, and mechanical performance of an electronic package, printed circuit board, interposer, IC-substrate or electronic component; Multichip modules in the nature of integrated circuit modules, camera modules, high frequency modules, power modules, communication modules, radar modules, memory modules, chiplets modules, optical modules, hybrid modules, battery and power management units; Electronic circuit boards; Integrated circuit cards and components; Microelectronic components, namely, electronic packages, PCBs, IC substrates and interposers; Microelectronic components, namely, electronic packages, PCBs, IC substrates and interposers with embedded components, cavities, and integrated functionalities, namely, heat transfer, power delivery, High density connections, high speed connections, high frequency connections, optical connections, and transmission of analog and digital signals; Waveguides for emission of high-power rays and high frequency signals; Wireless distribution system comprising waveguides; Waveguides for high power beam delivery; High frequency switches; High-frequency switching power supplies; Radio-frequency receivers; Radio-frequency transmitters Market and consumer research in the field of electronics Providing information relating to material treatment; Rental of air conditioning apparatus; air purification; water treatment and purification; Water filtration and conditioning services; Recycling of waste and rubbish; Photographic film development; Chemical treatment of textile; Working of leather and furs; Metal plating; Grinding; Soldering; Electroplating; water treating; Laminating of organic and inorganic materials for manufacturing a PCB, Interposer or IC-substrate; Laminating of board; Stripping finishes, namely, stripping of metal and other organic and inorganic material for manufacturing a PCB, Interposer or IC-substrate; Printing; Lithographic printing; pattern printing; Welding services; laser scribing of metal and other organic and inorganic material for manufacturing a PCB, Interposer or IC-substrate Organisation of educational conferences, exhibitions and competitions in the field of electronics and computer simulation; Arranging and conducting of conferences, congresses and symposiums in the field of electronics and computer simulation; Organization of exhibitions for cultural or educational purposes; Educational services, namely, teaching in the field of electronics, computer simulation, chemistry, environmental technologies, and plant engineering; instruction in the field of electronics, computer simulation, chemistry, environmental technologies, and plant engineering; transfer of business knowledge and know-how, namely, training in the field of electronics, computer simulation, chemistry, environmental technologies, and plant engineering; Business training; coaching in the field of electronics, computer simulation, chemistry, environmental technologies, and plant engineering Science and technology services, namely, scientific research and development in the field of printed circuits, interposers, and IC-substrates; research in the fields of materials science, electronic products, computer simulation technology, chemistry, environmental technologies, and plant and machinery engineering; IT integration services; IT consulting services relating to installation, maintenance and repair of computer software; Computer software development and computer programming development for others; Design, development and implementation of software; Design services, namely, design of printed circuits, interposers, IC-substrates, integrated circuits and circuit boards, and machinery; Testing of electronic components, printed circuit boards, interposers, IC-substrates, material and chemistry suitable for PCB manufacturing; quality control for others; Scientific research; Scientific laboratory services; computer software design; Industrial design; Design of electric circuit boards; Design of integrated circuits; Technological consultancy in the field of printed and electronic circuits, interposers, IC-substrates, modules and component embedding, mechanical and electrical simulation of PCB/IC substrate designs, chemistry, environmental technologies, and plant and machinery engineering; Chemical analysis; Chemistry consultation; Research in the field of chemistry; packaging design; Material testing; Research in the field of physics; Custom design of prototypes

Abrégé

There is described a component carrier (100), wherein the component carrier (100) comprises a stack (101) comprising a plurality of electrically insulating layer structures (110, 120) and at least one electrically conductive layer structure (104), i) wherein at least one of said electrically insulating layer structures (110) comprises a main material (112) having fillers (111) embedded therein, ii) wherein a further one of said electrically insulating layer structures (120) is provided on one of the main surfaces (115) of the at least one electrically insulating layer structure (110), and iii) wherein on said main surface (115), the fillers (111) of the electrically insulating layer structures (110) are exposed, and the material (122) of the further electrically insulating layer structure (120) is embedded in the spaces between the exposed fillers (111).

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

The invention concerns a method for fabricating at least one conductive structure layer (6), preferably in the form of a trace, a pad, a land or a connecting lip, on or in a component carrier (7), preferably in the form of a printed circuit board or an integrated circuit substrate, and with at least one specific electric or electronic property, comprising the step of manufacturing a conductive structure layer (6) or changing or reworking a pre-fabricated conductive structure layer (6), based on at least one model (5) combining design parameters with at least one electric or electronic property, in particular the impedance, wherein the method further comprises the steps of - acquiring actual data from at least one conductive structure layer (6) of a component carrier (7), - feeding said actual data of said at least one conductive structure layer (6) into the at least one model (5), said model (5) determining - in dependence of said actual data of said at least one conductive structure layer (6) and in dependence of at least one electric or electronic target property for the conductive structure layer (6) - at least one adjusted design parameter for the conductive structure layer (6), wherein the at least one adjusted design parameter relates to a geometric characteristic and/or a structural characteristic and/or a material characteristic of the conductive structure layer (6), in particular the structure layer width, the structure layer thickness, the structure layer length, the structure layer roughness, the structure layer porosity and/or the structure layer material, wherein the step of manufacturing a conductive structure layer (6) or changing or reworking a pre-fabricated conductive structure layer (6) is performed according to the at least one adjusted design parameter.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/22 - Traitement secondaire des circuits imprimés
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A component carrier-includes i) a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; ii) at least one signal element, wherein the signal element protrudes from the outermost layer structure of the stack; and iii) a surrounding material arranged on the outermost layer structure of the stack and at least partially surrounding the at least one signal element. The signal element includes a dielectric material with a permittivity that is different than a permittivity of a medium that directly surrounds the at least one signal element.

Classes IPC  ?

• H01Q 9/04 - Antennes résonnantes
• H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles

Abrégé

A component carrier having: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface connected to an electrically conductive connecting element, said connecting element extending from said electrically conductive surface away from the stack and configured to be connected to at least one external component to be mounted on the component carrier when at least one connecting surface provided in/on the external component is faced to the electrically conductive surface of the component, wherein the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component. Also provided is a package using such component carrier.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A component carrier including: i) a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a first metal trace comprising a rough surface; and iii) a second metal trace arranged adjacent to the first metal trace, comprising a smooth surface. The component carrier is configured to guide high-frequency and or high-speed signals through the second metal trace.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

The invention concerns a component carrier comprising a stack (1) comprising at least one electrically conductive layer structure (2) and at least one electrically insulating layer structure (3), said at least one electrically conductive layer structure (2) comprising two portions (P1, P2) adjacent one to each other placed on a common layer (5), each portion (P1, P2) having a base (6) in contact with the common layer (5), an upper extremity (7) opposite to said base (6) and at least one lateral wall(8) connecting the base (6) and the upper extremity (7), wherein the base (6) of each portion (P1, P2) is connected to the at least one lateral wall (8), thereby forming a base edge (9), the side wall (8) faces the adjacent portion (P1, P2) and has an inclination (a) relative to the base (6) of less than 90°, and wherein a distance between the base edges (9) of the two adjacent portions (P1, P2) is below 10µm. The invention also concerns a method of manufacturing such component carrier.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

A component carrier and a method of manufacturing a component carrier are disclosed. The component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an interposer embedded in the stack and having a plurality of vertically extending electrically conductive through connections, and electrically conductive structures in the stack laterally on both sides of the interposer.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

There is described a component carrier (100), which comprises: i) a stack (101) comprising at least one electrically conductive layer structure (104) and at least two electrically insulating layer structures (102); ii) a cavity (110) formed in the stack (101); and iii) at least one hydrophobic protection film (120) arranged on at least part of an inner surface of the stack (101) delimiting said cavity (110).

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a central section, and at least two vertically stacked functional volume sections in the central section, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p. ex. dissipateurs de chaleur
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

Component carrier (100) which comprises a stack (102) comprising a plurality of electrically conductive layer structures (150) and a plurality of electrically insulating layer structures (152), a cavity (104) formed in the stack (102), said cavity (104) being delimited by a peripheral wall, a conductive shielding (106) covering the peripheral wall of the cavity (104), and an antenna (108) formed as part of said stack (102), wherein the conductive shielding (106) has an opening (110) on a top extremity of said cavity (104) along a stack direction (112), said opening (110) being vertically associated with the antenna (108) provided on top of and/or at said opening (110).

Classes IPC  ?

• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H01Q 1/32 - Adaptation pour l'utilisation dans ou sur les véhicules routiers ou ferroviaires
• H01Q 13/02 - Cornets de guide d'onde
• H01Q 15/08 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme constitués par une matière diélectrique solide
• H01Q 19/06 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p. ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée utilisant des dispositifs de réfraction ou de diffraction, p. ex. lentilles
• H01Q 21/00 - Systèmes ou réseaux d'antennes
• H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
• H05K 3/46 - Fabrication de circuits multi-couches
• H01Q 13/18 - Antennes à fentes résonnantes la fente étant adossée à, ou formée par, une paroi limite d'une cavité résonnante

Abrégé

A component carrier (100) which comprises a stack (102) comprising a plurality of electrically conductive layer structures (150) and at least one electrically insulating layer structure (152), a cavity (104) formed in the stack (102) and being delimited by a peripheral wall, a conductive shielding (106) covering at least part of the peripheral wall of the cavity (104), a non-conductive low loss high frequency structure (154) above said cavity (104), and an antenna (108) at least partially above said low loss high frequency structure (154).

Classes IPC  ?

• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H01Q 5/385 - Combinaison d’éléments alimentés et d’éléments passifs avec plusieurs éléments passifs
• H01Q 9/04 - Antennes résonnantes
• H01Q 13/10 - Antennes à fentes résonnantes
• H01Q 21/29 - Combinaisons d'unités d'antennes de types différents interagissant entre elles pour donner une caractéristique directionnelle désirée

Abrégé

A package comprising an integrated circuit substrate having an exposed substrate pad and having an exposed substrate dielectric, and an electronic component having an integrated circuit, having an exposed component pad and having an exposed component dielectric, wherein the integrated circuit substrate is connected with the electronic component so that there is a direct physical contact between the substrate pad and the component pad and so that there is a direct physical contact between the substrate dielectric and the component dielectric.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A component carrier includes: i) a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a cavity formed in the stack; iii) an electrically conductive contact structure at a bottom of the cavity; and iv) a finishing structure on the electrically conductive contact structure. The finishing structure has a smaller lateral extension than the electrically conductive contact structure.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A component carrier with a laminated stack including at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component embedded in the stack. The component has at least one electrically conductive connection structure exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.

Classes IPC  ?

• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
• H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices

Abrégé

A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure and a mounting region arranged at the stack. The mounting region configured for mounting a component thereon and having at least one mounting protrusion for insertion of the component in at least one mounting recess.

Classes IPC  ?

• H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques

Abrégé

A component carrier including a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a first component embedded in the stack; a second component mounted on the first component and in a cavity which is delimited by an interface surface of the stack; and an electrically insulating filling which at least partially fills the cavity and extends up to the interface surface and thereby forms an interface with at least one of the at least one electrically insulating layer structure.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side by side, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides

Abrégé

There is described a radio frequency module, comprising: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and ii) a RF front-end functionality that is integrated in the stack. Further, an RF arrangement, a manufacture method and a use are described.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
• H01L 23/15 - Substrats en céramique ou en verre
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/552 - Protection contre les radiations, p. ex. la lumière
• H01L 23/66 - Adaptations pour la haute fréquence
• H01Q 1/02 - Dispositifs de dégivrageDispositifs de séchage
• H01Q 1/52 - Moyens pour réduire le couplage entre les antennesMoyens pour réduire le couplage entre une antenne et une autre structure
• H01Q 9/04 - Antennes résonnantes
• H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
• H04B 1/40 - Circuits
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A component carrier including a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The at least one electrically insulating layer structure includes i) an insulating material, and ii) fillers embedded in the insulating material. At least one of said fillers is exposed at one of the main surfaces of the electrically insulating layer structure. The at least one exposed filler includes a high-roughened surface portion and a low-roughened surface portion.

Classes IPC  ?

• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat