Abrégé

An LED illumination device and a color temperature switching method thereof are provided. The LED illumination device includes a bridge rectifier chip, a microcontroller module, a first semiconductor switch module, a second semiconductor switch module, a first current limiting module, a second current limiting module, and a first light-emitting module and a second light-emitting module. The microcontroller module includes a microcontroller chip. The first semiconductor switch module includes a first semiconductor switch chip for receiving a first pulse width modulation signal output from the microcontroller chip. The second semiconductor switch module includes a second semiconductor switch chip for receiving a second pulse width modulation signal output from the microcontroller chip. When the AC power is supplied to the LED illumination device, the first and the second semiconductor switch modules are turned on and maintained within a predetermined turn-on percentage range without being completely turned off.

Classes IPC  ?

• H05B 45/20 - Commande de la couleur de la lumière
• H05B 45/54 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection dans un ensemble sériel de LED
• H05B 45/325 - Modulation de la largeur des impulsions [PWM]
• H05B 45/37 - Circuits de conversion

Abrégé

An LED illuminating device without using a capacitor includes a surge absorber group, a three-phase rectifier bridge module, an LED chip group and a current-limiting chip group. The surge absorber group includes a first surge absorber electrically connected between the first and the second AC power input terminal, and a second surge absorber electrically connected between the second and the third AC power input terminal, and a third surge absorber electrically connected between the third and the first AC power input terminal. The three-phase rectifier bridge module is electrically connected to the first, the second and the third AC power input terminal. The LED chip group is electrically connected to the three-phase rectifier bridge module. The current-limiting chip group is electrically connected to the bridge rectifier group. The LED illuminating device can generate a lighting source through a three-phase power provided by a three-phase power supply.

Classes IPC  ?

• H05B 45/37 - Circuits de conversion
• H05B 45/345 - Stabilisation du courantMaintien d'un courant constant
• H05B 45/54 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection dans un ensemble sériel de LED

Abrégé

An LED illumination device for rapidly releasing residual capacitance, which includes a bridge rectifier chip, a current-limiting chip, a light-emitting group, a resistor group and a capacitor. The light-emitting group includes a plurality of first and second LED chips. The resistor group includes a plurality of first and second resistor chips. The first working voltage of the first LED chip is different from the second working voltage of the second LED chip. The first resistance value of the first resistor chip is different from the second resistance value of the second resistor chip. Each first LED chip corresponds to one of the first resistor chips, and each second LED chip corresponds to one of the second resistor chips. When the power supply is turned off, the residual capacitance remaining in the capacitor can be released by cooperation of the first resistor chips and the second resistor chips.

Classes IPC  ?

• H05B 45/3725 - Alimentation du circuit à découpage [SMPS]
• H05B 45/40 - Détails des circuits de charge à LED
• H02M 7/06 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge sans électrode de commande ou des dispositifs à semi-conducteurs sans éléctrode de commande

Abrégé

An LED illumination device for improving anti-surge capability includes a circuit substrate, a bridge rectifier chip, a surge absorber group, a first anti-surge current-limiting chip group, a second anti-surge current-limiting chip group, an LED illuminating group, and an LED current-limiting group. The surge absorber group is disposed on the circuit substrate and electrically connected to the bridge rectifier chip for absorbing a surge voltage. The first anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a first predetermined surge voltage. The second anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a second predetermined surge voltage. The LED illuminating group includes a plurality of LED chips disposed on the circuit substrate. The LED current-limiting group is disposed on the circuit substrate for controlling a total harmonic distortion of current (THDi) of the LED illuminating group.

Classes IPC  ?

• H05B 45/50 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection
• H05B 45/37 - Circuits de conversion

Abrégé

An illumination device includes a first light-emitting module, a second light-emitting module and an airflow-guiding structure. The second light-emitting module is adjacent to the first light-emitting module. The airflow-guiding structure includes a receiving casing, a first air inlet pipe in air communication with the receiving casing, and a first air outlet pipe in air communication with the receiving casing. The first light-emitting module is received inside the airflow-guiding structure. When external air flows into the receiving casing through the first air inlet pipe by natural convection, the external air inside the receiving casing is sterilized by a sterilization light source provided by the first light-emitting module, and the external air that has been sterilized by the sterilization light source flows out of the receiving casing through the first air outlet pipe by natural convection, and is then discharged out of the illumination device.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F24F 13/078 - Bouches pour diriger ou distribuer l'air dans des pièces ou enceintes, p. ex. diffuseur d'air de plafond combinées avec des installations d'éclairage
• A61L 9/20 - Désinfection, stérilisation ou désodorisation de l'air utilisant des phénomènes physiques des radiations des ultraviolets
• F21Y 115/10 - Diodes électroluminescentes [LED]

Abrégé

An LED illumination device includes a circuit substrate, a bridge rectifier, a current-limiting chip, a resistance switching module and an LED group. The bridge rectifier is disposed on the circuit substrate and electrically connected to the circuit substrate. The current-limiting chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The resistance switching module is disposed on the circuit substrate and electrically connected to the circuit substrate. The LED group includes a plurality of LED chips disposed on the circuit substrate and electrically connected to the circuit substrate. The bridge rectifier, the current-limiting chip, the resistance switching module and the LED group are electrically connected with each other. The resistance switching module includes a plurality of resistance switches and a plurality of resistor elements respectively corresponding to the resistance switches, and each of the resistance switches includes a physical switching key that is exposed.

Classes IPC  ?

• H05B 45/39 - Circuits contenant des onduleurs de type pont
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• H05B 45/345 - Stabilisation du courantMaintien d'un courant constant
• F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage

Abrégé

A two-wire dimming lighting device includes an encoding circuit, a decoding circuit, a light source driving circuit, and an LED light emitting circuit. The encoding circuit wirelessly receives the dimming instruction, encodes an AC power according to the dimming instruction, and then outputs an encoded AC power. The decoding circuit receives the encoded AC power and then decodes the encoded AC power to obtain a light source driving instruction. The light source driving circuit receives the light source driving instruction and controls the changes of light emission of the LED light emitting circuit according to the light source driving instruction. The encoding circuit transmits the encoded AC power to the decoding circuit through a two-wire AC transmission wire.

Classes IPC  ?

• H05B 47/185 - Commande de la source lumineuse par télécommande via une transmission par ligne électrique
• H05B 45/10 - Commande de l'intensité de la lumière
• H05B 45/20 - Commande de la couleur de la lumière
• H05B 47/19 - Commande de la source lumineuse par télécommande via une transmission sans fil

Abrégé

A lighting device for multiple input voltages is provided. The lighting device for multiple input voltages includes a plurality of driving circuits each being electrically connected with the light-emitting unit. Each of the driving circuits receives an AC input voltage, and converts the AC input voltage into a working voltage for use by the light-emitting unit. Each of the driving circuits includes a surge protection device and a rectifier. The surge protection device inputs the AC input voltage. The rectifier is electrically connected with the surge protection device, and rectifies the AC input voltage into the working voltage through the surge protection device for use by the light-emitting unit. A threshold voltage of each of the surge protection devices to prevent a surge is different from each other, so that the AC input voltage received by the driving circuits are different from each other.

Classes IPC  ?

• H05B 45/30 - Circuits de commande
• H05B 45/50 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection
• H05B 45/54 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection dans un ensemble sériel de LED
• H05B 45/44 - Détails des circuits de charge à LED avec un contrôle actif à l'intérieur d'une matrice de LED
• H05B 45/56 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection impliquant des mesures pour empêcher une température anormale des LED

Abrégé

The present disclosure provides a light-emitting device having an ambient light sensing function, including a light-emitting module, a rectification module, a switch module, a control module, and an ambient light sensing module. The light-emitting module includes a circuit substrate and a plurality of light-emitting elements. The rectification module is electrically connected to the light-emitting module. The switch module includes a semiconductor switch element electrically connected to the light-emitting module. The control module is electrically connected to the rectification module and the switch module. The ambient light sensing module is electrically connected to the control module for receiving an ambient light source. The ambient light sensing module provides a light intensity signal to the control module according to a light intensity provided by the ambient light source, and the light-emitting elements are turned on or turned off by the semiconductor switch element according to the light intensity signal.

Classes IPC  ?

• H05B 37/02 - Commande
• F21V 23/06 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des dispositifs de couplage
• F21V 23/04 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des interrupteurs
• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
• F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage

Abrégé

The prevent invention provides a light-emitting device for providing a flash light source comprising a light-emitting module and a control module. The light-emitting module comprises a circuit substrate and a plurality of light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The control module comprises a semiconductor switch element having a MOSFET for turning the light-emitting elements on or off, wherein the semiconductor switch element is electrically connected to the light-emitting elements thereby the light-emitting elements can flash via the semiconductor switch element alternately turning on and off the light-emitting elements.

Classes IPC  ?

• H01Q 1/26 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec tube à décharge électrique
• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
• H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
• H05B 37/02 - Commande
• H01Q 1/44 - Détails de dispositifs associés aux antennes utilisant un équipement ayant une autre fonction principale servant en outre d'antenne
• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

The instant disclosure provides an illumination device and a light-emitting module thereof. The light-emitting module includes a cover structure, a light-emitting structure and an assembled type capacitor assembly. The cover structure has a through opening. The light-emitting structure includes a circuit substrate disposed under the cover structure and a plurality of light-emitting elements disposed on the circuit substrate and exposed from the through opening. The assembled type capacitor assembly includes at least one assembled type capacitor electrically connected the circuit substrate through an assembled type electrical connection assembly, and the at least one assembled type capacitor is separated from the circuit substrate.

Classes IPC  ?

• H01R 33/00 - Dispositifs de couplage spécialement conçus pour supporter un appareil et munis d'une pièce de couplage assurant la fonction de support et la connexion électrique par l'intermédiaire d'une pièce complémentaire qui est structurellement associée à l'appareil, p. ex. supports de lampesLeurs pièces détachées
• F21K 9/238 - Agencement ou montage d’éléments de circuit intégrés dans la source lumineuse
• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
• F21K 9/68 - Détails des réflecteurs faisant partie de la source lumineuse
• F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
• F21Y 115/10 - Diodes électroluminescentes [LED]

Abrégé

A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.

Classes IPC  ?

• H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
• H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
• H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
• H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone

Abrégé

A LED illumination device includes a carrier structure, a suspension structure, and a light-emitting structure. The carrier structure includes a carrier body and a first heat-conducting body fixedly disposed inside the carrier body. The carrier body has an outer thread structure disposed on an outer perimeter surface. The first heat-conducting body has a bottom contacting surface exposed from a bottom side of the carrier body. The suspension structure includes a first suspension element detachably disposed on a top side of the carrier body. The light-emitting structure includes a circuit substrate and a light-emitting unit. The circuit substrate is detachably disposed on the bottom side of the carrier body to contact the bottom contacting surface of the first heat-conducting body, and the light-emitting unit is disposed on the circuit substrate. Therefore, heat generated by the light-emitting unit is guided to the first heat-conducting body through the circuit substrate.

Classes IPC  ?

• F21V 3/02 - GlobesVasquesVerres de protection caractérisés par leur forme
• F21S 8/06 - Dispositifs d'éclairage destinés à des installations fixes destinés uniquement au montage sur un plafond ou sur une structure similaire en porte-à-faux par suspension
• F21V 17/02 - Fixation des parties constitutives des dispositifs d'éclairage, p. ex. des abat-jour, des globes, des réfracteurs, des réflecteurs, des filtres, des écrans, des grilles ou des cages de protection avec possibilité de réglage
• F21V 17/06 - Fixation des parties constitutives des dispositifs d'éclairage, p. ex. des abat-jour, des globes, des réfracteurs, des réflecteurs, des filtres, des écrans, des grilles ou des cages de protection sur le support de la source lumineuse ou par son intermédiaire
• F21V 21/112 - Fixation des dispositifs d'éclairage aux lustres
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/54 - Encapsulations ayant une forme particulière
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• F21V 29/70 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques
• F21V 29/89 - Métaux
• F21K 9/20 - Sources lumineuses comprenant un moyen de fixation
• F21Y 105/10 - Sources lumineuses planes comprenant un réseau bidimensionnel d’éléments générateurs de lumière ponctuelle
• F21Y 115/10 - Diodes électroluminescentes [LED]
• F21K 9/69 - Détails des réfracteurs faisant partie de la source lumineuse

Abrégé

An illumination device including a voltage transformer module, a switching unit, a control module, a sensor module, a first illumination module and a second illumination module. The switching unit is coupled to the rectifier module and the voltage transformer module. The control module is coupled to the switching unit and the voltage transformer module. The sensor module is electrically connected to the control module. The sensor module senses an invading object within an induction area. The first illumination module is electrically connected to the switching unit. The second illumination module is electrically connected to the sensor module. The sensor module supplies electricity to the second illumination module to emit light. The sensor module outputs a sensing signal to the control module when the sensor module senses the invading object. The control module controls the switching unit to be turned on so that the first illumination module emits light.

Classes IPC  ?

• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
• H05B 37/02 - Commande

Abrégé

Disclosed is an AC light emitting device. The AC light emitting device is electrically connected to an AC power, and the AC power is rectified by a rectification module and inputs an input voltage. The AC light emitting device comprises a buck module, a switching unit, a control module and an AC lighting emitting module. The buck module is electrically connected to the rectification module. The switching unit is electrically connected to the rectification module and the buck module. The control module is electrically connected to the switching unit and the buck module. The AC lighting emitting module is electrically connected to the switching unit. The control module outputs a pulse waveform signal to the switching unit according to the input voltage and a dimming signal, and the switching unit turns on or off the AC lighting emitting module according to the pulse waveform signal.

Classes IPC  ?

• H05B 37/02 - Commande
• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes

Abrégé

A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

Classes IPC  ?

• F21S 4/00 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses
• F21V 29/50 - Dispositions de refroidissement
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
• F21V 31/04 - Dispositions pour l'agent intermédiaire de remplissage
• H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
• F21K 9/68 - Détails des réflecteurs faisant partie de la source lumineuse
• H01L 33/54 - Encapsulations ayant une forme particulière
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/28 - Application de revêtements de protection non métalliques
• F21Y 105/10 - Sources lumineuses planes comprenant un réseau bidimensionnel d’éléments générateurs de lumière ponctuelle
• F21Y 115/10 - Diodes électroluminescentes [LED]

Abrégé

A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

Classes IPC  ?

• H05K 3/28 - Application de revêtements de protection non métalliques
• H01L 33/54 - Encapsulations ayant une forme particulière
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants

Abrégé

A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.

Classes IPC  ?

• H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes

Abrégé

A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

Classes IPC  ?

• F21V 7/00 - Réflecteurs pour sources lumineuses
• H05K 3/28 - Application de revêtements de protection non métalliques
• H01L 33/54 - Encapsulations ayant une forme particulière
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants

Abrégé

A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.

Classes IPC  ?

• F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température

Abrégé

A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.

Classes IPC  ?

• F21V 23/06 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des dispositifs de couplage
• F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
• F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• F21Y 105/00 - Sources lumineuses planes
• F21Y 113/00 - Combinaison de sources lumineuses

Abrégé

An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module. The control unit includes a first PWM control module electrically connected to the first current-limiting chip, a second PWM control module electrically connected to the second current-limiting chip, and a third PWM control module electrically connected to the third current-limiting chip.

Classes IPC  ?

• H01J 63/04 - Enceintes comportant des revêtements luminescentsEmploi de matériaux spécifiés pour les revêtements

Abrégé

An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply.

Classes IPC  ?

• G05F 1/00 - Systèmes automatiques dans lesquels les écarts d'une grandeur électrique par rapport à une ou plusieurs valeurs prédéterminées sont détectés à la sortie et réintroduits dans un dispositif intérieur au système pour ramener la grandeur détectée à sa valeur ou à ses valeurs prédéterminées, c.-à-d. systèmes rétroactifs

Abrégé

An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power.

Classes IPC  ?

• H05B 37/02 - Commande

Abrégé

An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.

Classes IPC  ?

• H01L 29/18 - Sélénium ou tellure uniquement, mis à part les matériaux de dopage ou autres impuretés

Abrégé

A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.

Classes IPC  ?

• F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température

Abrégé

A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

Classes IPC  ?

• H05B 37/02 - Commande

Abrégé

A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Produits et services

[ APPARATUS FOR ADJUSTING HEADLIGHTS; ] [ AUTOMOTIVE, INDUSTRIAL, CONSTRUCTION, LOCOMOTIVE, AVIATION, NAVIGATION AND MARINE SAFETY-WARNING LIGHTS, namely, STROBES, ROTATING LIGHTS AND BAR LIGHTS; ] [ COMPUTER HARDWARE AND SOFTWARE SYSTEMS FOR REMOTELY CONTROLLING LIGHTING DEVICES WITHIN A BUILDING; COUNTERFEIT MONEY DETECTION LIGHT TO BE USED IN RETAIL STORES AND BANKS; ELECTRIC LIGHT DIMMERS; ELECTRIC LIGHT SWITCHES; ] [ ELECTRIC WARNING LIGHTS; ELECTRIC WARNING LIGHT SYSTEMS; ELECTRONIC REGULATING AND CONTROL DEVICES FOR THE OPERATION OF LIGHT EMITTING DIODES; EMERGENCY WARNING LIGHTS; FLASHING AND STEADY SAFETY LIGHTS; FLASHING SAFETY LIGHTS; ] [ LED AND HID LIGHT CONTROLS; LED CIRCUIT BOARDS; ] [ LED VEHICLE TRAFFIC SIGNALS; ] [ LIGHT DIODES; ] LIGHT EMITTING DIODES (LEDS) [ ; ] [ LIGHT SWITCHES; ] [ LIGHT SYSTEMS COMPRISING LIGHT SENSORS AND SWITCHES; RADIO RECEIVERS AND TRANSMITTERS FOR MONITORING AND CONTROLLING LIGHT EMITTING DIODES IN A NETWORK OF STREET LIGHTS AND FOR PROCESSING EMERGENCY SIGNALS TRANSMITTED TO INDIVIDUAL STREET LIGHTS ]

Produits et services

APPARATUS FOR ADJUSTING HEADLIGHTS; AUTOMOTIVE, INDUSTRIAL, CONSTRUCTION, LOCOMOTIVE, AVIATION, NAVIGATION AND MARINE SAFETY-WARNING LIGHTS, NAMELY, STROBES, ROTATING LIGHTS AND BAR LIGHTS; COMPUTER HARDWARE AND SOFTWARE SYSTEMS FOR REMOTELY CONTROLLING LIGHTING DEVICES WITHIN A BUILDING; COUNTERFEIT MONEY DETECTION LIGHT TO BE USED IN RETAIL STORES AND BANKS; ELECTRIC LIGHT DIMMERS; ELECTRIC LIGHT SWITCHES; ELECTRIC WARNING LIGHTS; ELECTRIC WARNING LIGHT SYSTEMS; ELECTRONIC REGULATING AND CONTROL DEVICES FOR THE OPERATION OF LIGHT EMITTING DIODES; EMERGENCY WARNING LIGHTS; FLASHING AND STEADY SAFETY LIGHTS; FLASHING SAFETY LIGHTS; LED AND HID LIGHT CONTROLS; LED CIRCUIT BOARDS; LED VEHICLE TRAFFIC SIGNALS; LIGHT DIODES; LIGHT EMITTING DIODES (LEDS); LIGHT SWITCHES; LIGHT SYSTEMS COMPRISING LIGHT SENSORS AND SWITCHES; RADIO RECEIVERS AND TRANSMITTERS FOR MONITORING AND CONTROLLING LIGHT EMITTING DIODES IN A NETWORK OF STREET LIGHTS AND FOR PROCESSING EMERGENCY SIGNALS TRANSMITTED TO INDIVIDUAL STREET LIGHTS

Abrégé

An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement

Abrégé

An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Abrégé

A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

Classes IPC  ?

• H01L 29/18 - Sélénium ou tellure uniquement, mis à part les matériaux de dopage ou autres impuretés
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Abrégé

An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.

Classes IPC  ?

• H01L 27/15 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants semi-conducteurs avec au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière

Abrégé

An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each. LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.

Classes IPC  ?

• H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
• H01L 21/66 - Test ou mesure durant la fabrication ou le traitement