Nepes Co., Ltd.

Republic of Korea

Create a watch for Nepes Co., Ltd.
Total IP 73
Total IP Rank # 18,875
IP Activity Score 2.4/5.0    28
IP Activity Rank # 27,647

Patents

Trademarks

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Last Patent 2025 - Semiconductor package
First Patent 2004 - Three-dimentional ultrasonic gen...

Latest Inventions, Goods, Services

2024 Invention Semiconductor package and method of manufacturing the same. A semiconductor package according to...
Invention Package for semiconductor. A package for semiconductor is disclosed. The semiconductor package a...
2023 Invention Semiconductor package and method for manufacturing the same. A semiconductor package and a manuf...
Invention Semiconductor package. The technical idea of the present invention provides a semiconductor pack...
Invention Image scaling device and image scaling method. An image scaling device, according to one embodime...
2022 Invention Semiconductor package including antenna and method of manufacturing the semiconductor package. A...
Invention Semiconductor package including redistribution structure, and method of manufacturing the same. P...
Invention Semiconductor package. According to one or more embodiments, a semiconductor package includes: a...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package and manufacturin...
2021 Invention Convolutional neural network accelerator device for minimizing memory access. A convolutional neu...
Invention Semiconductor package and method for manufacturing the same. Disclosed is a semiconductor package...
Invention Semiconductor package and method for manufacturing the same. Provided is a semiconductor package ...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package is provided. The ...
Invention Semiconductor package. A semiconductor package includes a semiconductor chip having at least one ...
2020 Invention Semiconductor package and manufacturing method thereof. A semiconductor package and a manufacturi...
Invention Semiconductor package. A semiconductor package according to an exemplary embodiment of the presen...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package having improved i...
Invention Semiconductor package and method for manufacturing same. A technical idea of the present disclos...
Invention Semiconductor package and method for manufacturing same. A technical idea of the present disclosu...
Invention Semiconductor device and method for manufacturing the same. A semiconductor package according to...
2019 Invention Semiconductor package. A semiconductor package includes a semiconductor chip including a chip pad...
Invention Semiconductor package comprising first molding layer and second molding layer with different ther...
Invention Semiconductor package. The technical idea of the present invention provides a semiconductor packa...
Invention Infrared reflective film and manufacturing method therefor. An infrared reflective film and a man...
Invention Wafer-level design and wiring pattern for a semiconductor package. A semiconductor package includ...
Invention Semiconductor package. According to a technical idea of the present invention, provided is a semi...
Invention Method for producing semiconductor package. A technical concept of the present disclosure provide...
Invention Smart window film and method for manufacturing same. The present invention relates to a smart win...
Invention Semiconductor package and method of manufacturing same. The present invention relates to a semico...
Invention Semiconductor package of using insulating frame. A semiconductor package using an insulating fram...
Invention Infrared reflective film and manufacturing method thereof. The present invention relates to an in...
Invention Semiconductor package and method of manufacturing the same. Provided are a semiconductor package ...
Invention Semiconductor package. A semiconductor package includes a first package including a first semicon...
2018 Invention Optical module. The technical subject matter of the present invention provides an optical module ...
Invention Emi shielding film. The present invention pertains to an EMI shielding film, and more specificall...
Invention Chip package with connection portion that passes through an encapsulation portion. Disclosed are ...
Invention Chip package and manufacturing method therefor. Disclosed are a chip package capable of improving...
Invention Quantum dot reflective sheet, manufacturing method therefor, and backlight unit and display devic...
Invention Lead sealant film, manufacturing method therefor, and secondary battery using same. The present i...
2017 Invention Ems antenna module, manufacturing method therefor, and semiconductor package comprising same. Dis...
Invention Method for producing semiconductor package. Provided is a method for producing a semiconductor pa...
Invention Tray for producing semiconductor package. Provided is a tray for producing a semiconductor packag...
Invention Manufacturing method for semiconductor package including filling member and membrane member. A se...
Invention Chip package and method for producing same. Disclosed are a chip package having a molding layer c...
Invention Semiconductor package produced using insulation frame, and method for producing same. A semicondu...
Invention Semiconductor package having reliability and method for producing same. A semiconductor package h...
Invention Semiconductor package using insulation frame and method for producing same. A semiconductor packa...