|
2025
|
Invention
|
Heat dissipation substrate, electronic device, and method for manufacturing heat dissipation subs... |
|
|
Invention
|
Composite component and method for producing composite component. An internal electrode layer 40 ... |
|
2024
|
Invention
|
Sintered body.
Provided is a sintered body containing Al2O3, SiO2, and MnO, the sintered body in... |
|
|
Invention
|
Package, electronic apparatus, and package manufacturing method. In the present invention, a heat... |
|
|
Invention
|
Package. A composite component (MX) is configured so as to include: a base portion (PB) that is i... |
|
|
Invention
|
Ceramic wiring member.
A ceramic wiring member includes: a main body portion made of ceramic; an... |
|
|
Invention
|
Ceramic wiring member.
The electroconductive portion has a structure including: an electroconduc... |
|
|
Invention
|
Heat dissipation member, method for manufacturing heat dissipation member, package, and substrate... |
|
|
Invention
|
Ceramic substrate and semiconductor device substrate comprising same. 23222 are adjacent to each ... |
|
|
Invention
|
Package, semiconductor module, and method for producing package. A package (51) has a cavity (CV)... |
|
2023
|
Invention
|
Method of manufacturing bonded substrate, method of manufacturing circuit substrate, and circuit ... |
|
|
Invention
|
Package, electronic device, and package manufacturing method. A frame body (21) has a first surfa... |
|
|
Invention
|
Ceramic substrate, and semiconductor device substrate provided with same. 23222 are located adjac... |
|
|
Invention
|
Package, semiconductor module, and method for producing package. This package (51) has a cavity (... |
|
|
Invention
|
Ceramic wiring member motherboard and ceramic wiring member. A ceramic wiring member motherboard ... |
|
|
Invention
|
Package.
A package includes a mounting surface on which an electronic component is to be mounted... |
|
|
Invention
|
Sintered body. 23223222222 and MnO in the second glass phase. |
|
|
Invention
|
Ceramic wiring member. This ceramic wiring member (1) comprises a body (10) and an electroconduct... |
|
|
Invention
|
Ceramic wiring member. A ceramic wiring member (1) comprises a body portion (10) which is made of... |
|
|
Invention
|
Ceramic wiring member. This ceramic wiring member (1) comprises: a body portion (10) made of cera... |
|
2022
|
Invention
|
Substrate for semiconductor device and method for producing same. This substrate for a semiconduc... |
|
|
Invention
|
Package and power module. In the present invention, a heat sink plate (50) has a mounting surface... |
|
|
Invention
|
Method for manufacturing bonded substrate, method for manufacturing circuit substrate, and circui... |
|
|
Invention
|
Package and electronic device. A package has a cavity to be sealed by a lid. The package includes... |
|
|
Invention
|
Package with heat dissipating substrate. 5≤5 is satisfied. |
|
|
Invention
|
Substrate for semiconductor device. This substrate for a semiconductor device is provided with: a... |
|
|
Invention
|
Package manufacturing method. A ceramic substrate part (110) provided with a substrate wiring par... |
|
|
Invention
|
Package. In the present invention, a frame body (120) is made of a ceramic and has a first surfac... |
|
2021
|
Invention
|
Ceramic sintered body and substrate for semiconductor device. A ceramic sintered body according t... |
|
|
Invention
|
Package with an electrode-attached frame supported by a heat sink, and method for manufacturing p... |
|
|
Invention
|
Package, and method for manufacturing power semiconductor module. A first frame is supported by a... |
|
|
Invention
|
Ceramic board and method for making same. A first ceramic part (110) has: in an in-plane directio... |
|
|
Invention
|
Substrate for semiconductor device. A substrate for a semiconductor device according to the prese... |
|
|
Invention
|
Power semiconductor module and manufacturing method for power semiconductor module.
A frame is m... |
|
|
Invention
|
Metal member and production method therefor. A metal member includes a metal substrate, a first i... |
|
|
Invention
|
Composite wiring board, package, and electronic device. A terminal substrate includes a signal te... |
|
|
Invention
|
Ceramic sintered body and substrate for semiconductor device. 2O. The balance content is 0.05 mas... |
|
|
Invention
|
Substrate for semiconductor device.
A substrate includes a ceramic sintered body, a first circui... |
|
|
Invention
|
Ceramic sintered body and substrate for semiconductor devices.
The ceramic sintered body contain... |
|
|
Invention
|
Ceramic sintered body and substrate for semiconductor device. The ceramic sintered body according... |
|
|
Invention
|
Package. A frame (81) is provided with an adherend surface (SA) having an outer edge (EO) in plan... |
|
2020
|
Invention
|
Package. A package (800) includes, in a plan layout: frame body regions (R3) that include a cavit... |
|
|
Invention
|
Package. A package (800) comprises: a mounting surface (SM) to which an electronic component (902... |
|
|
Invention
|
Wiring board. A wiring board (90) according to the present invention comprises: insulator layers ... |
|
|
Invention
|
Wiring structure. A wiring structure (100) is implemented using a ball grid array (90). A substra... |
|
|
Invention
|
Terminal structure, package, and method for manufacturing terminal structure. A substrate (10) is... |
|
|
Invention
|
Package, and method for manufacturing power semiconductor module. In the present invention, a fra... |
|
2019
|
Invention
|
Package. 23223233 content is 0.10-5.00 wt%. The wiring unit (820) contains at least 60.00% metall... |
|
|
Invention
|
Package. 23222 content relative to the MnO content of the ceramic is defined as R1 in the interio... |
|
|
Invention
|
Package. A package (800) comprises a mounting surface (SM) on which an electronic component (902)... |
