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2024
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Invention
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Chip package structure and method for producing the same.
A chip package structure and a method ... |
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Invention
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Power component submount and manufacturing method thereof.
A power component submount includes a... |
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Invention
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Method for manufacturing conductive circuit board and conductive circuit board made therefrom.
A... |
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Invention
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Ceramic metal composite substrate.
A ceramic metal composite substrate includes a metal core lay... |
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Invention
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Metal-ceramic substrate having double brazing layers and method for manufacturing the same.
A me... |
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Invention
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Active metal brazing substrate and method for manufacturing the same.
An active metal brazing su... |
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Invention
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Dual-side heat-dissipation package structure and package structure.
A package structure includes... |
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Invention
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Semiconductor package structure.
A semiconductor package structure includes a conductive substra... |
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Invention
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Method for reducing warpage occurred to substrate during packaging process.
A method for reducin... |
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2023
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Invention
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Ceramic submount for semiconductor device and method for manufacturing the same.
A ceramic submo... |
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Invention
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Image sensing module.
An image sensing module is provided. The image sensing module includes an ... |
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Invention
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Light emitting diode package structure and method for manufacturing the same.
A light emitting d... |
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Invention
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Circuit board structure and method for manufacturing the same.
A circuit board structure is prov... |
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Invention
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Chip package structure.
A chip package structure includes a circuit substrate, a lead frame, a f... |
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Invention
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Bonding structure for connecting a chip and a metal material and manufacturing method thereof.
A... |
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Invention
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Optical device.
An optical device includes an electronic component, a light-permeable layer, and... |
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Invention
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Chip package structure and method for fabricating the same.
A chip packaging structure and a met... |
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G/S
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Crystal wafer etching treatment; Semiconductor sealing processing; Integrated circuit etching tre... |
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Invention
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Ceramic substrate and method for manufacturing the same.
A ceramic substrate and a method for ma... |
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Invention
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Semiconductor package structure and method for producing the same.
A semiconductor package struc... |
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Invention
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Circuit board structure including metal materials with different thermal expansion coefficients a... |
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Invention
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Chip package structure and manufacturing method thereof.
A chip package structure and a manufact... |
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Invention
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Active metal brazing substrate material and method for producing the same.
An active metal brazi... |
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Invention
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Active metal brazing substrate material containing aluminum metal element and method for producin... |
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Invention
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Sensor package structure and sensing module thereof.
A sensor package structure includes a subst... |
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Invention
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Wireless transistor outline package structure.
A wireless transistor outline (TO) package struct... |
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Invention
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Optical package structure and method for manufacturing the same.
An optical package structure an... |
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Invention
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Sensor package structure and manufacturing method thereof.
A sensor package structure and a manu... |
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Invention
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Optical package structure.
An optical package structure includes a light transmittable member, a... |
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Invention
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Composite ceramic substrate having multi-layer configuration.
A composite ceramic substrate havi... |
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Invention
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Chip package structure.
A chip package structure includes a substrate, a chip, a light-permeable... |
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Invention
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Intelligent power module package structure and hybrid ceramic board.
An intelligent power module... |
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Invention
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Ceramic metal composite substrate.
A ceramic metal composite substrate (CMCS) includes a metal c... |
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Invention
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Power chip packaging structure.
A power chip packaging structure includes: a ceramic substrate; ... |
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Invention
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Sensor package structure. A sensor package structure includes a substrate, a sensor chip disposed... |
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Invention
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Sensor package structure and manufacturing method threrof.
A sensor package structure and a manu... |
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Invention
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Sensor package structure.
A sensor package structure includes a substrate, a sensor chip dispose... |
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Invention
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Circuit board and manufacturing method thereof.
A manufacturing method of a circuit board. The m... |
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Invention
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Printed circuit board and method for making the same.
A printed circuit board (PCB) is disclosed... |
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Invention
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Circuit substrate having improved bonding structure.
A circuit substrate having an improved bond... |
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Invention
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Circuit board structure with embedded ceramic substrate and manufacturing process thereof.
This ... |
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Invention
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Chip package structure and method for fabricating the same.
A chip package structure and a metho... |
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Invention
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Chip packaging structure.
A chip packaging structure is provided. The chip packaging structure i... |
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G/S
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Integrated circuits; semiconductor elements; Integrated circuit boards; printed circuit boards; a... |
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2022
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Invention
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Chip packaging structure and chip packaging method.
A chip packaging structure and a chip packag... |
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Invention
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Sensor package structure.
A sensor package structure is provided and includes a substrate, a sen... |
