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Resistive-conductive laminates made of metal for use in the manufacture of printed circuit boards

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ELECTRIC RESISTORS BUILT WITHIN A PRINTED CIRCUIT LESS THAN 100 MICRONS WIDE

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nickel-plated copper foil sold as a component part of resistors in printed circuit boards

Abstract

A circuit board material includes an electrical resistance material layer having a preselected resistivity adhered to the support layer, and a barrier layer adhered to the electrical resistive layer, and a conductive layer adhered to the barrier layer, wherein the barrier layer is plated on the conductive material such that the resistance of the subsequently applied resistive layer does not vary substantially during exposure to printed circuit board processing chemistries The process for making the material is directed to adjusting the electro deposition of the barrier layer by using the time for etching the resistive layer of the circuit board material in a standard etching bath.

IPC Classes  ?

• H01C 1/012 - MountingSupporting the base extending along, and imparting rigidity or reinforcement to, the resistive element

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Resistors built within a printed circuit trace that is less than 100 microns (0.004") wide

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Metallic foils for electrical and electronic purposes

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Metal foils for electrical and electronic purposes, and resistive-conductive laminates for use in the manufacture of printed circuit boards

Goods & Services

Metallic foils for electrical and electronic purposes

Goods & Services

Metal foils for electrical and electronic purposes, and resistive-conductive laminates for use in the manufacture of printed circuit boards

Goods & Services

Metal foils for electrical and electronic purposes, and resistive-conductive laminates for use in the manufacture of printed circuit boards

Goods & Services

Metal foils for electrical and electronic purposes, and resistive-conductive laminates for use in the manufacture of printed circuit boards

Abstract

The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• H01C 7/18 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
• H01G 4/14 - Organic dielectrics
• H01G 4/33 - Thin- or thick-film capacitors
• H05K 1/03 - Use of materials for the substrate
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Goods & Services

METALLIC FOILS * FOR ELECTRICAL AND ELECTRONIC PURPOSES * ADAPTED TO BE LAMINATED TO SUBSTRATES