An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 20/00 - Nanooptics, e.g. quantum optics or photonic crystals
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
G02B 6/036 - Optical fibres with cladding core or cladding comprising multiple layers
G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
G02B 27/22 - Other optical systems; Other optical apparatus for producing stereoscopic or other three-dimensional effects
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
7.
POSITIONING SUBSTRATES IN IMPRINT LITHOGRAPHY PROCESSES
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
Micro- and nano- patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
G03F 1/32 - Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portionPreparation thereof
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 µm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
13.
METHODS FOR UNIFORM IMPRINT PATTERN TRANSFER OF SUB-20 NM FEATURES
Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
14.
NANO IMPRINTING WITH REUSABLE POLYMER TEMPLATE WITH METALLIC OR OXIDE COATING
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods and systems are provided for patterning polymerizable material dispensed on flexible substrates or flat substrates using imprint lithography techniques. Template replication methods and systems are also presented where patterns from a master are transferred to flexible substrates to form flexible film templates. Such flexible film templates are then used to pattern large area flat substrates. Contact between the imprint template and substrate can be initiated and propagated by relative translation between the template and the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
16.
FABRICATION OF SEAMLESS LARGE AREA MASTER TEMPLATES FOR IMPRINT LITHOGRAPHY
Described are methods of forming large area templates useful for patterning large area optical devices including e.g. wire grid polarizers (WGPs). Such methods provide for seamless patterning of such large area devices.
Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Singh, Vikramjit
Xu, Frank Y.
Sreenivasan, Sidlgata V.
Abstract
Functional nanoparticles may be formed using at least one nanoimprint lithography step. In one embodiment, sacrificial material may be patterned on a multilayer substrate including one or more functional layers between removable layers using an imprint lithography process. At least one of the functional layers includes a functional material such as a pharmaceutical composition or imaging agent. The pattern may be further etched into the multilayer substrate. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Removing the removable layers releases the pillars from the patterned structure to form functional nanoparticles such as drug or imaging agent carriers.
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82B 1/00 - Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82Y 40/00 - Manufacture or treatment of nanostructures
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata V.
Singh, Vikramjit
Xu, Frank Y.
Choi, Byung-Jin
Abstract
Methods of making nano-scale structures with geometric cross-sections, including convex or non-convex cross-sections, are described. The approach may be used to directly pattern substrates and/or create imprint lithography templates or molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates, such as into a functional or sacrificial resist to form functional nanoparticles.
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82B 1/00 - Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
B82Y 40/00 - Manufacture or treatment of nanostructures
20.
HIGH CONTRAST ALIGNMENT MARKS THROUGH MULTIPLE STAGE IMPRINTING
Two-stage imprinting techniques capable of protecting fine patterned features of an imprint lithography template are herein described. In particular, such techniques may be used during fabrication of recessed high-contrast alignment marks for preventing deposited metal layers from coming into contact with fine features etched into the template.
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
21.
VAPOR DELIVERY SYSTEM FOR USE IN IMPRINT LITHOGRAPHY
Described are systems and method of using a vapor delivery system for enabling delivery of an adhesion promoter material during an imprint lithography process.
Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.
Densifying a multi-layer substrate includes providing a substrate with a first dielectric layer on a surface of the substrate. The first dielectric layer includes a multiplicity of pores. Water is introduced into the pores of the first dielectric layer to form a water-containing dielectric layer. A second dielectric layer is provided on the surface of the water-containing first dielectric layer. The first and second dielectric layers are annealed at temperature of 600C or less. In an example, the multi-layer substrate is a nanoimprint lithography template. The second dielectric layer may have a density and therefore an etch rate similar to that of thermal oxide, yet may still be porous enough to allow more rapid diffusion of helium than a thermal oxide layer.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Yang, Shuqiang
Miller, Michael, N.
Hilali, Mohamed
Wan, Fen
Schmid, Gerard
Wang, Liang
Sreenivasan, Sidlgata, V.
Xu, Frank, Y.
Abstract
Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.
Control of lateral strain and lateral strain ratio (dt/db) between template and substrate through the selection of template and/or substrate thicknesses (Tt and/or Tb), control of template and/or substrate back pressure (Pt and/or Pb), and/or selection of material stiffness are described.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
27.
PROCESS GAS CONFINEMENT FOR NANOIMPRINTING LITHOGRAPHY
Gas confinement systems and methods are described. In particular, systems and methods are described that include a barrier that confines purging gas and restricts flow of purging gas to other elements within a nano-lithography system. The barrier can be adjusted to accommodate and/or control desired pressure variations between working and external environments.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Described are systems and methods for formation of templates having alignment marks with high contrast material. High contrast material may be positioned within recesses of alignment marks.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
29.
ROLL-TO-ROLL IMPRINT LITHOGRAPHY AND PURGING SYSTEM
Droplets of polymerizable material may be patterned on a film sheet using a roll-to-roll system. The droplets of polymerizable material may be dispensed on the film sheet such that a substantially continuous patterned layer may be formed on the film sheet. A contact system provides for smooth fluid front progression the polymerizable material during imprinting. A gas purging system may be positioned during imprinting. Gas purging systems may provide for purging in parallel as fluid front of polymerizable material moves through roll-to- roll system.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
Fabricating a solar cell stack includes forming a nanopattemed polymeric layer on a first surface of a silicon wafer and etching the first surface of the silicon wafer to transfer a pattern of the nanopattemed polymeric layer to the first surface of the silicon wafer. A layer of reflective electrode material is formed on a second surface of the silicon wafer. The nanopattemed first surface of the silicon wafer undergoes a buffered oxide etching. After the buffered oxide etching, the nanopattemed first surface of the silicon wafer is treated to decrease a contact angle of water on the nanopattemed first surface. Electron donor material is deposited on the nanopattemed first surface of the silicon wafer to form an electron donor layer, and a transparent electrode material is deposited on the electron donor layer to form a transparent electrode layer on the electron donor layer.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/42 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H01L 51/44 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details of devices
31.
MICRO-CONFORMAL TEMPLATES FOR NANOIMPRINT LITHOGRAPHY
A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
32.
METHODS AND SYSTEMS OF MATERIAL REMOVAL AND PATTERN TRANSFER
Polymerized material on a substrate may be removed by exposure to vacuum ultraviolet (VUV) radiation from an energy source within a gaseous atmosphere of a controlled composition. Following such removal, additional etching techniques are also described for nano-imprinting.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A nanoimprint lithography method for forming nanoparticles includes patterning sacrificial material on a multilayer substrate. In some cases, the pattern is transferred to or into a removable layer of the multilayer substrate, and functional material is disposed on the removable layer of the multilayer substrate and solidified. At least a portion of the functional material is then removed to expose protrusions of the removable layer, and pillars of the functional material are released from the removable layer to yield nanoparticles. In other cases, the multilayer substrate includes the functional material, and the pattern is transferred to or into a removable layer of the multilayer substrate. The sacrificial layer is removed, and pillars of the functional material are released from the removable layer to yield nanoparticles.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An ultra-compliant nanoimprint lithography template having a backing layer and a nanopatterned layer adhered to the backing layer. The nanopatterned layer includes nanoscale features formed by solidifying a polymerizable material in contact with a mold. The polymerizable material includes a fluoroelastomer and a photoinitiator. The backing layer has a higher elastic modulus than the nanopatterned layer. The ultra-compliant nanoimprint lithography template can be used to form multiple high fidelity imprints.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Nano imprint lithography templates for purging of fluid during nano imprint lithography processes are described. The templates may include an inner channel and an outer channel. The inner channel constructed to provide fluid communication with a process gas supply to a region between the template and a substrate during the nano imprint lithography process. The outer channel constructed to evacuate fluid and/or confine fluid between the active area of template and the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Forming an adhesive layer on a nanoimprint lithography template or a double-sided disk. Forming the adhesive layer on the double-sided disk includes immersing the double-sided disk in a liquid adhesive composition and removing the double-sided disk from the adhesive composition. The outer layer of the double-sided disk is a carbon overcoating or an intermediate layer. The adhesive composition is dried to form a first adhesion layer adhered directly to the carbon overcoating or intermediate layer on a first side of the disk and a second adhesion layer adhered directly to the carbon overcoating or intermediate layer on a second side of the disk. Forming the adhesive layer on the nanoimprint lithography template includes applying an adhesive material to the template, allowing the template to remain motionless, and rinsing a portion of the adhesive material from the template with a solvent, and drying the template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems and methods for imprinting and aligning an imprint lithography template with a field on a substrate are described. The field of the substrate may include an elongated side, and alignment sensitivity on the elongated side may be intentionally minimized.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Yang, Shuqiang
Sreenivasan, Sidlgata V.
Xu, Frank Y.
Abstract
Inorganic solar cells having a nano-patterned p-n or p-i-n junction to reduce electron and hole travel distance to the separation interface to be less than the magnitude of the drift length or diffusion length, and meanwhile to maintain adequate active material to absorb photons. Formation of the inorganic solar cells may include one or more nano-lithography steps.
H01L 31/032 - Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/052 - Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
H01L 31/075 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata, V.
Yang , Shuqiang
Xu, Frank Y .
Singh, Vikramjit
Abstract
Functional nanoparticles may be formed using at least one nano-lithography step. In one embodiment, sacrificial material may be patterned on a multi-layer substrate using an imprint lithography system. The pattern may be further etched into the multi-layer substrate. Functional material may then be deposited on multi-layer substrate and solidified. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Pillars may be removed from multi-layer substrate forming functional nanoparticles.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods for imprinting on abutted fields of a substrate are described. Generally, a first field of a substrate may be imprinted using an imprint lithography template. The template may then be placed such that a portion of the template overlaps the first field of the substrate while imprinting a second field of the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
MOLECULAR IMPRINTS, INC. (USA)
Inventor
Sreenivasan, Sidlgata V.
Yang, Shuqiang
Xu, Frank Y.
Wan, Fen
Abstract
Solar cells having at least one N-type material layer and at least one P-type material layer forming a patterned p-n junction are described. A conducting layer may provide electrical communication between the p-n junction and an electrode layer.
H01L 51/44 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details of devices
H01L 51/42 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A template chuck includes multiple zones to provide 1) an imprint bend optimized to provide high curvature and provide contact at middle radius of substrate and/or, 2) separation bend zone with an increased free span zone and high crack angle.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems, methods, and processes for separating a template from a substrate retained on an air cavity chuck during an imprint lithography process. Generally, vacuum level provided by air cavity chuck may be controlled during conforming of polymerizable material between the template and the substrate and during separation of the template and the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems, methods, and processes for forming imprint lithography templates from a multi-layer substrate are described. The multi-layer substrate may include a block copolymer layer positioned on a substrate layer. The block copolymer layer may include two or more domains. At least one domain having a different composition sensitivity than another domain such that the domains have different reactions to a specific process. Reaction of the domains to the specific process may provide a pattern in the block copolymer layer. The pattern may be transferred into the substrate layer to form the imprint lithography template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
The present application describes methods and systems for setting up and characterizing fluid dispensing systems. The methods and systems characterize the fluid dispensing systems and associate the characterizations with the corresponding fluid dispensing systems.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems and methods for providing identification patterns on substrates are described: such as a method of contacting an imprint lithography template with the droplets of polymerizable liquid, which are selectively deposited on a surface of a substrate, for defining an identification mark in matrix form. The imprinted pattern are subsequently cured and etched into the substrate. The substrate can be a multilayer substrate forming an imprint lithography template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata V.
Yang, Shuqiang
Xu, Frank Y.
Labrake, Dwayne L.
Abstract
Methods for creating nano-shaped patterns are described. This approach may be used to directly pattern substrates and/or create imprint lithography molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates in a high throughput process.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems and methods for imprinting a patterned layer on a substrate are described. Features of patterned layer may be concentrically imprinted in relation to a shaft positioned on a substrate chuck. The substrate may be biased using a radius difference between a diameter of the shaft and an inner diameter of the substrate in relation to a point on an inner edge of the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Release agents with increased affinity toward nano-imprint lithography template surfaces interact strongly with the template (18) during separation of the template from the solidified resist (46) in a nano-imprint lithography process. The strong interaction between the surfactant and the template surface reduces the amount of surfactant pulled off the template surface during separation of a patterned layer from the template in an imprint lithography cycle. Maintaining more surfactant associated with the surface of the template after the separation of the patterned layer (46) from the template (18) may reduce the amount of surfactant needed in a liquid resist to achieve suitable release of the solidified resist from the template during an imprint lithography process. Strong association of the release agent with the surface of the template (18) facilitates the formation of ultra-thin residual layers (48) and dense fine features (50) in nano-imprint lithography.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Imprint lithography benefits from precise alignment between a template and a substrate during imprinting. A moir signal resulting from indicia on the template and the substrate are acquired by a system comprising a line-scan camera and a digital micromirror device (DMD) which provides a high bandwidth, low-latency signal. Once acquired, the moir signal may be used directly to align the template and the substrate without need for discrete position/angle encoders.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
54.
FACILITATING ADHESION BETWEEN SUBSTRATE AND PATTERNED LAYER
Systems and methods for adhering a substrate to a patterned layer are described. Included are in situ cleaning and conditioning of the substrate, and the application of an adhesion layer between the substrate and the patterned layer, as well as forming an intermediate layer between adhesion materials and the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Systems and methods for providing multiple replicas from a master template are described. Replicas may be formed having a mesa. In one embodiment, a dummy fill region may be included on master template and/or replicas.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G11B 7/00 - Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower powerRecord carriers therefor
Non-uniformity may be minimized by reducing or eliminating non-uniform evaporation of a viscous liquid disposed on the surface of a substrate. At least one gas source component and one vacuum component may provide a mass flow rate of gas across the surface of the substrate to reduce or eliminate non-uniform evaporation.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
57.
ROBUST OPTIMIZATION TO GENERATE DROP PATTERNS IN IMPRINT LITHOGRAPHY
Imprint lithography may comprise generating a fluid map, generating a fluid drop pattern, and applying a fluid to a substrate according to the fluid drop pattern. The fluid drop pattern may be generated using a stochastic process such as a Monte Carlo or structured experiment over the expected range of process variability for drop locations and drop volumes. Thus, variability in drop placement, volume, or both may be compensated for, resulting in surface features being substantially filled with the fluid during imprint.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A fluid for dispensation on a substrate. In one implementation, the fluid comprises a set of fluid parameters to facilitate dispensation of the fluid from the system. In another implementation, the fluid comprises a set of fluid parameters specific to a polymerizable material.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B05B 12/10 - Arrangements for controlling deliveryArrangements for controlling the spray area responsive to condition of liquid or other fluent material discharged, of ambient medium or of target responsive to temperature or viscosity of liquid or other fluent material discharged
Imprint lithography may comprise generating a fluid map, generating a fluid drop pattern, and applying a fluid to a substrate according to the fluid drop pattern. The fluid drop pattern may be generated using edge weighting through one or more modified Lloyd's method iterations to result in surface features being substantially filled with the fluid during imprint.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
System, method and process for imprinting a substrate using controlled deformation of a substrate and/or a template. The substrate and/or template may be positioned in single wave formation or double wave formation during an imprint lithography process.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B05B 12/00 - Arrangements for controlling deliveryArrangements for controlling the spray area
62.
FABRICATION OF HIGH-THROUGHPUT NANO-IMPRINT LITHOGRAPHY TEMPLATES
An imprint lithography template (18, 100) includes a porous material defining a multiplicity of pores with an average pore size of at least about 0.4 nm. The porous material includes silicon and oxygen, and a ratio of Young's modulus (E) to relative density of the porous material with respect to fused silica (ρporous /ρfused silica) is at least about 10: 1. A refractive index of the porous material is between about 1.4 and 1.5. The porous material may form an intermediate layer (64, 103) or a cap layer (61, 63, 106) of an imprint lithography template (18, 100). The template may include a pore seal layer (59) between a porous layer (64, 103) and a cap layer (61, 63, 106), or a pore seal layer (59) on top of a cap layer (61, 63, 106).
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Imprint lithography systems and methods for transporting and dispensing polymerizable material on a substrate are described. In one implementation, the transport system utilizes a dispense head, dispense guard, and a shielding block when dispensing the polymerizable material. In another implementation, the transport system comprises one or more filters positioned in an inline manifold for particle reduction or ion reduction.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
64.
STRAIN AND KINETICS CONTROL DURING SEPARATION PHASE OF IMPRINT PROCESS
Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A drop dispense apparatus may be manufactured utilizing an imprint lithography process. Exemplary methods for manufacturing a drop dispense apparatus are described.
Separation of an imprint lithography template and a patterned layer in an imprint lithography process may result in stress to features of the template and/or features of the patterned layer. Such stress may be reduced by minimizing open areas on the template, including dummy features within the open areas, and/or selective positioning of features on the template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
67.
NANO-IMPRINT LITHOGAPHY STACK WITH ENHANCED ADHESION BETWEEN LAYERS
A nano-imprint lithography stack (300, 400) includes a substrate (12), a non-silicon-containing layer (302, 304, 306) solidified from a first polymerizable, non-silicon-containing composition, and a silicon-containing layer (308) solidified from a polymerizable silicon-containing composition adhered to a surface of the non-silicon-containing layer (302, 304, 306). The non-silicon-containing layer (302, 304, 306) is adhered directly or through one or more intervening layers to the substrate (12). The silicon-containing layer (308) includes a silsesquioxane with a general formula (R'(4-2z)SiOz)x(HOSiO1.5)y, wherein R' is a hydrocarbon group or two or more different hydrocarbon groups other than methyl, 1 < z < 2, and x and y are integers. The imprint lithography stack (300, 400) may further include a second non-silicon-containing layer (302, 304, 306) solidified from a second polymerizable, non-silicon-containing composition adhered to a surface of the silicon-containing layer (308) such that the silicon-containing layer is sandwiched between the non-silicon-containing layers (302, 304, 306).
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
The present application describes a template with feature profiles that have multiple sidewall angles. The multiple sidewall angles facilitate control over critical dimensions and reduce issues related to template release.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
69.
NANO-PATTERNED ACTIVE LAYERS FORMED BY NANO-IMPRINT LITHOGRAPHY
Patterned active layers formed by nano-imprint lithography for use in devices such as photovoltaic cells and hybrid solar cells. One such photovoltaic cell (400) includes a first electrode (406, 408) and a first electrically conductive layer (402, 404) electrically coupled to the first electrode. The first conductive layer (402, 404) has a multiplicity of protrusions (412, 414) and recesses (416, 422) formed by a nano-imprint lithography process. A second electrically conductive layer (402, 404) substantially fills the recesses (416, 422) and covers the protrusions (412, 414) of the first conductive layer (402, 404), and a second electrode (406, 408) is electrically coupled to the second conductive layer (402, 404). A circuit (410) electrically connects the first electrode (406, 408) and the second electrode (406, 408).
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
A fluid dispense system having a coating layer applied to the fluid flow path and the external surfaces is described. The coating layer is chemically resistant to the working fluids of the fluid dispense system and prevents the leaching of a plurality of ions from the fluid dispense system.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
71.
TEMPLATE HAVING ALIGNMENT MARKS FORMED OF CONTRAST MATERIAL
Imprint lithography substrates may include alignment marks formed of high contrast material. Exemplary methods for forming alignment marks having high contrast material are described.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
72.
ENERGY SOURCES FOR CURING IN AN IMPRINT LITHOGRAPHY SYSTEM
Energy sources and methods for curing in an imprint lithography system are described. The energy sources may include one or more energy elements positioned outside of the viewing range of an imaging unit monitoring elements of the imprint lithography system. Each energy source is configured to provide energy along a path to solidify polymerizable material on a substrate.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
73.
COMPLEMENTARY ALIGNMENT MARKS FOR IMPRINT LITHOGRAPHY
Systems and methods for minimizing overlay error during alignment of a template with a substrate are described. Templates generally include two distinct types of alignment marks: buried alignment marks and complementary alignment marks. Buried marks may be fabricated separately from the patterning surface, and the complementary marks may be fabricated in the same step as the patterning surface.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Imprint lithography system may provide for an energy source for solidification of material positioned between a template and a substrate. Additionally, the energy source and/or an additional energy source may be used to clean contaminants from the template and/or the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
75.
METHOD OF REPLICATION OF AN IMPRINT LITHOGRAPHY TEMPLATE
Particles may be present on substrates and/or templates during nano-lithographic imprinting. Particles may be mitigated and/or removed using localized removal techniques and/or imprinting techniques as described.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A nano-imprint lithography template system having a support layer with at least one port, and a patterned surface layer coupled to the support layer. Coupling of the patterned surface layer to the support layer forms a cavity. Pressure within the cavity is controlled through the port of the support layer.
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata, V.
Singhal, Shrawan
Choi, Byung-Jin
Mcmackin, Ian, M.
Abstract
Droplets of polymerizable material may be patterned on a film sheet. The droplets of polymerizable material may be dispensed on the film sheet. A predetermined force may be applied to an imprint lithography template such that localized trapping of the droplets of the polymerizable material on the film sheet is minimized and the droplets coalesce to form a continuous layer. The polymerizable material may be solidified to form a patterned layer having a residual layer and at least one feature.
B05D 1/32 - Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
Defects and/or particles during an imprint lithography process may provide exclusion zones and/or transition zones in the patterned layer. Exclusion zones and/or transition zones in the patterned layer may be identified to provide a region of interest on a template.
Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
The present invention is directed toward a method for reducing pattern distortions in imprinting layers by reducing gas pockets present in a layer of viscous liquid deposited on a substrate. To that end, the method includes varying a transport of the gases disposed proximate to the viscous liquid. Specifically, the atmosphere proximate to the substrate wherein a pattern is to be recorded is saturated with gases that are either highly soluble, highly diffusive, or both with respect to either the viscous liquid, the substrate, the template, or a combination thereof. Additionally, or in lieu of saturating the atmosphere, the pressure of the atmosphere may be reduced.
Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.
A nano-imprint lithography process includes forming a multiplicity of hydroxyl groups on a surface of a substantially inorganic nano-imprint lithography template, heating the template, and reacting a pre-selected percentage of the hydroxyl groups on the surface of the template with a mono-functional, non-fluorinated compound to form a monolayer coating on the surface of the nano-imprint lithography template. The coated template may be contacted with a polymerizable composition disposed on a nano- imprint lithography substrate, and the polymerizable composition solidified to form a patterned layer. The coated template is separated from the patterned layer.
An imprint lithography imprinting stack includes a substrate and a polymeric adhesion layer adhered to the substrate. The polymeric adhesion layer includes polymeric components with an extended backbone length of at least about 2 nm. The backbones of the polymeric components may be substantially aligned in a planar configuration on the surface of the substrate, such that a thickness of the polymeric adhesion layer is less than about 2 nm.
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
A sub-master template is patterned to provide at least double the density of features of a master template. The sub-master template and master template may employ the use of alignment marks during the patterning process.
A template is treated to provide a surfactant rich region and a surfactant depleted region. A contact angle at the surfactant rich region may be greater than, less than, or substantially similar to a contact angle of the surfactant depleted region.
Methods for manufacturing a patterned surface on a substrate are described. Generally, the patterned surface is defined by a residual layer having a thickness of less than approximately 5 nm.
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
87.
HIGH THROUGHPUT IMPRINT BASED ON CONTACT LINE MOTION TRACKING CONTROL
Systems and methods for controlling velocity of a contact line and height profile between a template and a substrate during imprinting of polymerizable material are described.
G05B 19/18 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
Methods for locating an alignment mark on a substrate are described. Generally, the substrate includes one or more locator marks adjacent to a substrate alignment mark. Locator marks provide the relative location of the substrate alignment mark such that the substrate alignment mark may be used in aligning a substrate with a template within a lithographic system with a reduced magnitude of relative displacement.
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (USA)
Inventor
Sreenivasan, Sidlgata V.
Singhal, Shrawan
Melliar-Smith, Christopher
Xu, Frank, Y.
Choi, Byung-Jin
Abstract
Solar cells having at least one electron acceptor layer and at least one electron donor layer forming a patterned p-n junction are described. Electron acceptor layer may be formed by patterning formable N-type material between a template and an electrode layer, and solidifying the formable N-type material.
A method of forming a lithographic template, the method including, inter alia, creating a multi-layered structure, by forming, on a body, a conducting layer, and forming on the conducting layer, a patterned layer having protrusions and recessions, the recessions exposing portions of the conducting layer; depositing a hard mask material anisotropically on the multi-layered structure covering a top surface of the patterned layer and the portions of the conducting layer; removing the patterned layer by a lift-off process, with the hard mask material remaining on the portions of the conducting layer; positioning a resist pattern on the multi-layered structure to define a region of the multi-layered structure; and selectively removing portions of the multi- layered structure in superimposition with the region using the hard mask material as an etching mask.
An imprint lithography template or imprinting stack includes a porous material defining a multiplicity of pores with an average pore size of at least about 0.4 nm. A porosity of the porous material is at least about 10%. The porous template, the porous imprinting stack, or both may be used in an imprint lithography process to facilitate diffusion of gas trapped between the template and the imprinting stack into the template, the imprinting stack or both, such that polymerizable material between the imprinting stack and the template rapidly forms a substantially continuous layer between the imprinting stack and the template.
A multi-layer stack for imprint lithography is formed by applying a first polymerizable composition to a substrate, polymerizing the first polymerizable composition to form a first polymerized layer, applying a second polymerizable composition to the first polymerized layer, and polymerizing the second polymerizable composition to form a second polymerized layer on the first polymerized layer. The first polymerizable composition includes a polymerizable component with a glass transition temperature less than about 25°C, and the first polymerized layer is substantially impermeable to the second polymerizable composition.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/461 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Generating a fluid drop pattern for an imprint lithography process includes selecting an imprinting surface and generating a fluid drop pattern including drop locations for placement of a multiplicity of drops of substantially equal volume on an imprint lithography substrate. The fluid drop pattern is generated through one or more modified Lloyd's method iterations. The fluid drop pattern allows substantially complete filling of imprinting surface features and formation of a substantially uniform residual layer during the imprint lithography process.
Fabricating a cross-point memory structure using two lithography steps with a top conductor and connector or memory element and a bottom conductor orthogonal to the top connector. A first lithography step followed by a series of depositions and etching steps patterns a first channel having a bottom conductor. A second lithography step followed by a series of depositions and etching steps patterns a second channel orthogonal to the first channel and having a memory element connecting the an upper conductor and the lower conductor at their overlaid intersections.
A transparent imprint template mold is configured with gratings surrounding the active imprint area. The gratings are fabricated at the same time as the active area and thus accurately define the active area with respect to the gratings. The substrate is positioned in tool coordinates under the template mold. A sensor system generates a beam of optical energy and receives reflected energy only at a specific angular window and is used to locate the template mold. The sensor system is scanned to locate the substrate and the gratings in tool coordinates. In this manner, the relative position of the template mold is determined with respect to the substrate in tool coordinates. The substrate is then accurately positioned with respect to the template mold. The system may be used to track imprinted pattern position relative to the substrate and to determine concentricity of patterns to substrates.
A solid layer is formed by applying a multiplicity of discrete portions of a fluid composition onto a surface of an imprint lithography substrate, and allowing the discrete portions of the composition to spontaneously spread on the surface of the substrate to form a substantially continuous layer. The composition includes a solvent and a solid or a solvent and a polymerizable material. The composition can be a solution or a dispersion. At least some of the solvent is evaporated from the composition, and a solid layer is formed (e.g., polymerized or dried) on the substrate. The solid layer is substantially free of interstitial voids.
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
97.
TEMPLATE HAVING A SILICON NITRIDE, SILICON CARBIDE, OR SILICON OXYNITRIDE FILM
An imprint lithography template including, inter alia, a body having a first thickness associated therewith; a patterning layer, having a second thickness associated therewith, comprising a plurality of features, having a third thickness associated therewith, wherein said second thickness is defined by: C1 x d ឬ t ឬ a / C2; wherein d is said first thickness, t is said second thickness, a is said third thickness, C1 has a value greater than 20, and C2 has a value greater than 350.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
98.
METHOD FOR IMPRINT LITHOGRAPHY UTILIZING AN ADHESION PRIMER LAYER
The invention provides a method of applying an adhesion primer layer for an imprint lithography process that includes contacting a fluid with a surface of a substrate in a coating process and initiating a chemical reaction that forms a covalent bond between a component in the fluid and the surface of the substrate such that an adhesion primer layer is adhered to the surface of the substrate. A polymeric layer may be adhered to the surface of the substrate coated with the adhesion primer layer. The method allows adhesion primer coating for double-sided imprinting applications including patterned magnetic media.
B05D 1/00 - Processes for applying liquids or other fluent materials
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
An enhanced process forming a material pattern on a substrate deposits the material anisotropically on resist material patterned to correspond to an image of the material pattern. The material is etched isotropically to remove a thickness of the material on sidewalls of the resist pattern while leaving the material on a top surface of the resist pattern and portions of the surface of the substrate. The resist pattern is removed by dissolution thereby lifting-off the material on the top surface of the resist pattern while leaving the material on the substrate surface as the material pattern. Alternately, a first material layer is deposited on the resist pattern and a second material layer is deposited and planarized. The second material layer is etched exposing the first material while leaving the second material in features of the resist pattern. The first material and the resist are removed leaving the first material pattern.
An imprint lithography template with an active area arranged to receive imprinting material during an imprint lithography process and a non-active area adjacent the active area is described. At least a portion of the non-active area is treated to inhibit flow of the imprinting material from the active area to the non-active area during the imprint lithography process.
patents
