Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B29C 33/62 - Releasing, lubricating or separating agents based on polymers or oligomers
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
11.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
14.
Multi-waveguide optical structure with diffraction grating
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
19.
Strain and kinetics control during separation phase of imprint process
Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.
B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
20.
Template having a varying thickness to facilitate expelling a gas positioned between a substrate and the template
A nanoimprint lithography template including, inter alia, a body having first and second opposed sides with a first surface disposed on the first side, the second side having a recess disposed therein, the body having first and second regions with the second region surrounding the first region and the recess in superimposition with the first region, with a portion of the first surface in superimposition with the first region being spaced-apart from the second side a first distance and a portion of the first surface in superimposition with the second region being spaced-apart from the second side a second distance, with the second distance being greater than the first distance; and a mold disposed on the first side of the body in superimposition a portion of the first region.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
21.
Edge sealant confinement and halo reduction for optical devices
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
24.
Optical polymer films and methods for casting the same
An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
B29C 43/54 - Compensating volume change, e.g. retraction
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29L 11/00 - Optical elements, e.g. lenses, prisms
B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or
B29C 43/56 - Compression moulding under special conditions, e.g. vacuum
25.
Configuring optical layers in imprint lithography processes
An imprint lithography method of configuring an optical layer includes depositing a set of droplets atop a side of a substrate in a manner such that the set of droplets do not contact a functional pattern formed on the substrate. The imprint lithography method further includes curing the set of droplets to form a spacer layer associated with the side of the substrate and of a height selected such that the spacer layer can support a surface adjacent the substrate and spanning the set of droplets at a position spaced apart from the functional pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.
B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
27.
Multi-waveguide optical structure with diffraction grating
A multi-waveguide optical structure, including multiple waveguides stacked to intercept light passing sequentially through each waveguide, each waveguide associated with a differing color and a differing depth of plane, each waveguide including: a first adhesive layer, a substrate having a first index of refraction, and a patterned layer positioned such that the first adhesive layer is between the patterned layer and the substrate, the first adhesive layer providing adhesion between the patterned layer and the substrate, the patterned layer having a second index of refraction less than the first index of refraction, the patterned layer defining a diffraction grating, wherein a field of view associated with the waveguide is based on the first and the second indices of refraction.
A method of generating a virtual image, including directing a light beam to a first side of an eyepiece, including transmitting the light beam into a first waveguide of the eyepiece; deflecting, by first diffractive elements of the first waveguide, a first portion of the light beam towards a second waveguide of the eyepiece, the first portion of the light beam associated with a first phase of light; deflecting, by protrusions on the first side of the eyepiece, a second portion of the light beam towards the second waveguide, the second portion of the light beam associated with a second phase of light differing from the first phase; and deflecting, by second diffractive elements of the second waveguide, some of the first and the second portions of the light beam to provide an exiting light beam associated with the virtual image that is based on the first and second phases.
Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
30.
Positioning substrates in imprint lithography processes
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Micro- and nano-patterns in imprint layers formed on a substrate and lithographic methods for forming such layers. The layers include a plurality of structures, and a residual layer having a residual layer thickness (RLT) that extends from the surface of the substrate to a base of the structures, where the RLT varies across the surface of the substrate according to a predefined pattern.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
B29C 33/62 - Releasing, lubricating or separating agents based on polymers or oligomers
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
Techniques are described for using confinement structures and/or pattern gratings to reduce or prevent the wicking of sealant polymer (e.g., glue) into the optically active areas of a multi-layered optical assembly. A multi-layered optical structure may include multiple layers of substrate imprinted with waveguide grating patterns. The multiple layers may be secured using an edge adhesive, such as a resin, epoxy, glue, and so forth. A confinement structure such as an edge pattern may be imprinted along the edge of each layer to control and confine the capillary flow of the edge adhesive and prevent the edge adhesive from wicking into the functional waveguide grating patterns of the layers. Moreover, the edge adhesive may be carbon doped or otherwise blackened to reduce the reflection of light off the edge back into the interior of the layer, thus improving the optical function of the assembly.
G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/35 - Optical coupling means having switching means
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
36.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03G 7/00 - Selection of materials for use in image-receiving members, i.e. for reversal by physical contactManufacture thereof
C23C 16/513 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B41C 1/10 - Forme preparation for lithographic printingMaster sheets for transferring a lithographic image to the forme
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 59/14 - Surface shaping, e.g. embossingApparatus therefor by plasma treatment
38.
Methods for uniform imprint pattern transfer of sub-20 nm features
Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.
H01L 21/283 - Deposition of conductive or insulating materials for electrodes
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
39.
High throughput imprint based on contact line motion tracking control
Systems for controlling velocity of a contact line and height profile between a template and a substrate during imprinting of polymerizable material are described.
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B82Y 40/00 - Manufacture or treatment of nanostructures
In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
41.
Nano imprinting with reusable polymer template with metallic or oxide coating
Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
42.
Nanoimprint lithography processes for forming nanoparticles
A lithography method for forming nanoparticles includes patterning sacrificial material on a multilayer substrate. In some cases, the pattern is transferred to or into a removable layer of the multilayer substrate, and functional material is disposed on the removable layer of the multilayer substrate and solidified. At least a portion of the functional material is then removed to expose protrusions of the removable layer, and pillars of the functional material are released from the removable layer to yield nanoparticles. In other cases, the multilayer substrate includes the functional material, and the pattern is transferred to or into a removable layer of the multilayer substrate. The sacrificial layer is removed, and pillars of the functional material are released from the removable layer to yield nanoparticles.
Porous nano-imprint lithography templates may include pores, channels, or porous layers arranged to allow evacuation of gas trapped between a nano-imprint lithography template and substrate. The pores or channels may be formed by etch or other processes. Gaskets may be formed on an nano-imprint lithography template to restrict flow of polymerizable material during nano-imprint lithography processes.
B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.
Methods and systems are provided for patterning polymerizable material dispensed on flexible substrates or flat substrates using imprint lithography techniques. Template replication methods and systems are also presented where patterns from a master are transferred to flexible substrates to form flexible film templates. Such flexible film templates are then used to pattern large area flat substrates. Contact between the imprint template and substrate can be initiated and propagated by relative translation between the template and the substrate.
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
46.
Fabrication of seamless large area master templates for imprint lithography using step and repeat tools
Described are methods of forming large area templates useful for patterning large area optical devices including e.g. wire grid polarizers (WGPs). Such methods provide for seamless patterning of such large area devices.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features.
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
48.
Photocatalytic reactions in nano-imprint lithography processes
An imprint lithography template having a photoactive coating adhered to a surface of the template. Irradiation of the photoactive coating promotes cleaning of the template by decomposition of organic material proximate the template (e.g., organic material adsorbed on the template). An imprint lithography system may be configured such that template cleaning is achieved during formation of a patterned layer on an imprint lithography substrate. Cleaning of the template during an imprint lithography process reduces down-time that may be associated with template maintenance.
Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
Functional nanoparticles may be formed using at least one nanoimprint lithography step. In one embodiment, sacrificial material may be patterned on a multilayer substrate including one or more functional layers between removable layers using an imprint lithography process. At least one of the functional layers includes a functional material such as a pharmaceutical composition or imaging agent. The pattern may be further etched into the multilayer substrate. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Removing the removable layers releases the pillars from the patterned structure to form functional nanoparticles such as drug or imaging agent carriers.
B82Y 5/00 - Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 15/00 - Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
Methods of making nano-scale structures with geometric cross-sections, including convex or non-convex cross-sections, are described. The approach may be used to directly pattern substrates and/or create imprint lithography templates or molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates, such as into a functional or sacrificial resist to form functional nanoparticles.
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Methods for forming an imprint lithography template are provided. Materials for forming the imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.
Two-stage imprinting techniques capable of protecting fine patterned features of an imprint lithography template are herein described. In particular, such techniques may be used during fabrication of recessed high-contrast alignment marks for preventing deposited metal layers from coming into contact with fine features etched into the template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 40/00 - Manufacture or treatment of nanostructures
Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.
Release agents with increased affinity toward nano-imprint lithography template surfaces interact strongly with the template during separation of the template from the solidified resist in a nano-imprint lithography process. The strong interaction between the surfactant and the template surface reduces the amount of surfactant pulled off the template surface during separation of a patterned layer from the template in an imprint lithography cycle. Maintaining more surfactant associated with the surface of the template after the separation of the patterned layer from the template may reduce the amount of surfactant needed in a liquid resist to achieve suitable release of the solidified resist from the template during an imprint lithography process. Strong association of the release agent with the surface of the template facilitates the formation of ultra-thin residual layers and dense fine features in nano-imprint lithography.
Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.
H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
B82Y 20/00 - Nanooptics, e.g. quantum optics or photonic crystals
H01L 31/0376 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/075 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
H01L 31/076 - Multiple junction or tandem solar cells
H01L 31/20 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor material
H01L 31/0463 - PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
58.
Imprinting of partial fields at the edge of the wafer
Edge field patterning of a substrate having full fields and partial fields may include patterning using a template having multiple mesas with each mesa corresponding to a field on the substrate. Polymerizable material may be deposited solely between the template and the full fields of the substrate. A non-reactive material may be deposited between the template and partial fields of the substrate.
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
59.
Methods and systems of material removal and pattern transfer
Polymerized material on a substrate may be removed by exposure to vacuum ultraviolet (VUV) radiation from an energy source within a gaseous atmosphere of a controlled composition. Following such removal, additional etching techniques are also described for nano-imprinting.
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
60.
Micro-conformal templates for nanoimprint lithography
A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
Droplets of polymerizable material may be patterned on a film sheet using a roll-to-roll system. The droplets of polymerizable material may be dispensed on the film sheet such that a substantially continuous patterned layer may be formed on the film sheet. A contact system provides for smooth fluid front progression the polymerizable material during imprinting. A gas purging system may be positioned during imprinting. Gas purging systems may provide for purging in parallel as fluid front of polymerizable material moves through roll-to-roll system.
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
62.
Template having a varying thickness to facilitate expelling a gas positioned between a substrate and the template
A nanoimprint lithography template including, inter alia, a body having first and second opposed sides with a first surface disposed on the first side, the second side having a recess disposed therein, the body having first and second regions with the second region surrounding the first region and the recess in superimposition with the first region, with a portion of the first surface in superimposition with the first region being spaced-apart from the second side a first distance and a portion of the first surface in superimposition with the second region being spaced-apart from the second side a second distance, with the second distance being greater than the first distance; and a mold disposed on the first side of the body in superimposition a portion of the first region.
Methods of imprint lithography are described. Generally, the methods include imprinting, via a patterned mold, a pattern into a polymerizable fluid composition on a substrate to form a patterned imprinting layer. A conformal layer is overlayed on the patterned imprinting layer. A portion of the conformal layer is used as a hard mask for subsequent processing. The imprinted pattern may be transferred to the substrate by a plurality of etches.
C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
Functional nanoparticles may be formed using at least one nano-lithography step. In one embodiment, sacrificial material may be patterned on a multi-layer substrate using an imprint lithography system. The pattern may be further etched into the multi-layer substrate. Functional material may then be deposited on multi-layer substrate and solidified. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Pillars may be removed from multi-layer substrate forming functional nanoparticles.
B44C 1/22 - Removing surface-material, e.g. by engraving, by etching
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
65.
Method and system to control movement of a body for nano-scale manufacturing
Systems to control movement of a template during an imprint lithography process are described. The systems include an orientation stage having an inner frame, and outer frame, and a plurality of actuators coupled between the inner frame and the outer frame to vary translational motion and impart angular motion about a plurality of axes.
Methods described include placing a sensor system over a substrate positioned on a chuck. The sensor system generates a beam of optical energy towards the substrate and is configured to receive optical energy deflected from the substrate. The sensor system generates sensor signals in response to variations in received optical energy from the substrate and the chuck.
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
68.
System and method for model checking by interleaving stateless and state-based methods
A method for symbolic model checking for sequential systems using a combination of state-based and state-less approaches. A state-based method is used to compute frontier states by building transition relations on-the-fly using control flow information of the system, and performing successive image computations until a memory bound is reached, and efficiently storing only the new frontier states as disjunctive partitions of Boolean and Arithmetic expressions. A stateless method is used to check reachability of given goal states from a heuristically chosen set of frontier states until depth/time bound is reached. These two methods are alternated until one of the following occurs: all frontier states are explored, all goal states are reached, all computing resources are exhausted. Even though we do not store the entire reachable state set, we guarantee a complete coverage for terminating programs without the need to compute a fixed-point.
G06F 7/60 - Methods or arrangements for performing computations using a digital non-denominational number representation, i.e. number representation without radixComputing devices using combinations of denominational and non-denominational quantity representations
G06G 7/48 - Analogue computers for specific processes, systems, or devices, e.g. simulators
69.
Residual layer thickness measurement and correction
In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.
An enhanced process forming a material pattern on a substrate deposits the material anisotropically on resist material patterned to correspond to an image of the material pattern. The material is etched isotropically to remove a thickness of the material on sidewalls of the resist pattern while leaving the material on a top surface of the resist pattern and portions of the surface of the substrate. The resist pattern is removed by dissolution thereby lifting-off the material on the top surface of the resist pattern while leaving the material on the substrate surface as the material pattern. Alternately, a first material layer is deposited on the resist pattern and a second material layer is deposited and planarized. The second material layer is etched exposing the first material while leaving the second material in features of the resist pattern. The first material and the resist are removed leaving the first material pattern.
The present invention includes a template for patterning liquids disposed on a substrate. The template includes a body having opposed first and second surfaces with one surface having at least one recess and the other surface having a patterning region. In one embodiment, the template may be mounted to a fluid chamber having an inlet and a throughway. The template may be connected to the throughway and the inlet is connected to a fluid source.
A system of patterning first and second opposed sides of a substrate is described. The system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.
Methods for creating nano-shaped patterns are described. This approach may be used to directly pattern substrates and/or create imprint lithography molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates in a high throughput process.
Systems and methods for providing multiple replicas from a master template are described. Replicas may be formed having a mesa. In one embodiment, a dummy fill region may be included on master template and/or replicas.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G11B 5/855 - Coating only part of a support with a magnetic layer
Systems, methods, and processes for separating a template from a substrate retained on an air cavity chuck during an imprint lithography process. Generally, vacuum level provided by air cavity chuck may be controlled during conforming of polymerizable material between the template and the substrate and during separation of the template and the substrate.
B29C 33/44 - Moulds or coresDetails thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
B29C 41/12 - Spreading-out the material on a substrate
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B41F 21/12 - Adjusting leading edges, e.g. front stops
B41F 21/14 - Adjusting lateral edges, e.g. side stops
B41L 1/02 - Devices for preparatory operations, e.g. for bringing together sheets or webs and interposed carbonsDevices combined with devices for printing, for coating with carbon, for folding
B41L 3/02 - Platens or like sheet supports for manifolding using pressure-sensitive layers or intermediaries, e.g. for book-keeping purposes with stationary clamping means for holding the manifolding assembly in registered position, e.g. resilient clamps for holding non-perforated sheets
77.
Facilitating adhesion between substrate and patterned layer
Systems and methods for adhering a substrate to a patterned layer are described. Included are in situ cleaning and conditioning of the substrate, and the application of an adhesion layer between the substrate and the patterned layer, as well as forming an intermediate layer between adhesion materials and the substrate.
B05D 5/10 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
Systems and methods for imprinting a patterned layer on a substrate are described. Features of patterned layer may be concentrically imprinted in relation to a shaft positioned on a substrate chuck. The substrate may be biased using a radius difference between a diameter of the shaft and an inner diameter of the substrate in relation to a point on an inner edge of the substrate.
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G01B 11/03 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness by measuring coordinates of points
A nano-imprint lithography system is described for patterning first and second substrates, the system includes a translation stage constructed to alternatively place substrate chucks in position with respect to a nano-imprint mold assembly such that the nano-imprint mold assembly may imprint a pattern on one of the substrates, while concurrently obtaining a desired spatial relationship for the remaining substrate.
Systems, methods, and processes for forming imprint lithography templates from a multi-layer substrate are described. The multi-layer substrate may include a block copolymer layer positioned on a substrate layer. The block copolymer layer may include two or more domains. At least one domain may have a different composition sensitivity than another domain such that the domains have different reactions to a specific process. Reaction of the domains to the specific process may provide a pattern in the block copolymer layer. The pattern may be transferred into the substrate layer to form the imprint lithography template.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Imprint lithography benefits from precise alignment between a template and a substrate during imprinting. A moiré signal resulting from indicia on the template and the substrate are acquired by a system comprising a line-scan camera and a digital micromirror device (DMD) which provides a high bandwidth, low-latency signal. Once acquired, the moiré signal may be used directly to align the template and the substrate without need for discrete position/angle encoders.
G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
G01B 15/00 - Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.
Imprint lithography may comprise generating a fluid map, generating a fluid drop pattern, and applying a fluid to a substrate according to the fluid drop pattern. The fluid drop pattern may be generated using edge weighting through one or more modified Lloyd's method iterations to result in surface features being substantially filled with the fluid during imprint.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
85.
Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement
Imprint lithography may comprise generating a fluid map, generating a fluid drop pattern, and applying a fluid to a substrate according to the fluid drop pattern. The fluid drop pattern may be generated using a stochastic process such as a Monte Carlo or structured experiment over the expected range of process variability for drop locations and drop volumes. Thus, variability in drop placement, volume, or both may be compensated for, resulting in surface features being substantially filled with the fluid during imprint.
Separation of an imprint lithography template and a patterned layer in an imprint lithography process may result in stress to features of the template and/or features of the patterned layer. Such stress may be reduced by minimizing open areas on the template, including dummy features within the open areas, and/or selective positioning of features on the template.
Energy sources and methods for curing in an imprint lithography system are described. The energy sources may include one or more energy elements positioned outside of the viewing range of an imaging unit monitoring elements of the imprint lithography system. Each energy source is configured to provide energy along a path to solidify polymerizable material on a substrate.
Porous nano-imprint lithography templates may include pores, channels, or porous layers arranged to allow evacuation of gas trapped between a nano-imprint lithography template and substrate. The pores or channels may be formed by etch or other processes. Gaskets may be formed on an nano-imprint lithography template to restrict flow of polymerizable material during nano-imprint lithography processes.
The present invention is directed towards a chucking system to hold a substrate, said system including, inter alia, a chuck body having first and second opposed sides, said first side including an array of fluid chambers arranged in rows and columns, said fluid chambers each comprising first and second spaced-apart recesses defining first and second spaced-apart support regions, with said first support region cincturing said second support region and said first and second recesses, and said second support region cincturing said second recess, with said substrate resting against said first and second support regions, with said first recess and a portion of said substrate in superimposition therewith defining a first chamber and said second recess and a portion of said substrate in superimposition therewith defining a second chamber, with each column of said first chambers and each row of said second chambers being in fluid communication with a differing source of fluid to control a flow of fluid in said array of fluid chambers.
An imprint lithography template including, inter alia, a body having a first thickness associated therewith; a patterning layer, having a second thickness associated therewith, comprising a plurality of features, having a third thickness associated therewith.
Imprint lithography substrates may include alignment marks formed of high contrast material. Exemplary methods for forming alignment marks having high contrast material are described.
B28B 11/08 - Apparatus or processes for treating or working the shaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
Droplets of polymerizable material may be patterned on a film sheet. The droplets of polymerizable material may be dispensed on the film sheet. A pre-determined force may be applied to an imprint lithography template such that localized trapping of the droplets of the polymerizable material on the film sheet is minimized and the droplets coalesce to form a continuous layer. The polymerizable material may be solidified to form a patterned layer having a residual layer and at least one feature.
B28B 11/08 - Apparatus or processes for treating or working the shaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
Defects and/or particles during an imprint lithography process may provide exclusion zones and/or transition zones in the patterned layer. Exclusion zones and/or transition zones in the patterned layer may be identified to provide a region of interest on a template.
Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.
A nano-imprint lithography process includes forming a multiplicity of hydroxyl groups on a surface of a substantially inorganic nano-imprint lithography template, heating the template, and reacting a pre-selected percentage of the hydroxyl groups on the surface of the template with a mono-functional, non-fluorinated compound to form a monolayer coating on the surface of the nano-imprint lithography template. The coated template may be contacted with a polymerizable composition disposed on a nano-imprint lithography substrate, and the polymerizable composition solidified to form a patterned layer. The coated template is separated from the patterned layer.
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An imprint lithography imprinting stack includes a substrate and a polymeric adhesion layer adhered to the substrate. The polymeric adhesion layer includes polymeric components with an extended backbone length of at least about 2 nm. The backbones of the polymeric components may be substantially aligned in a planar configuration on the surface of the substrate, such that a thickness of the polymeric adhesion layer is less than about 2 nm.
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
B82Y 40/00 - Manufacture or treatment of nanostructures
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
98.
Porous template and imprinting stack for nano-imprint lithography
An imprint lithography template or imprinting stack includes a porous material defining a multiplicity of pores with an average pore size of at least about 0.4 nm. A porosity of the porous material is at least about 10%. The porous template, the porous imprinting stack, or both may be used in an imprint lithography process to facilitate diffusion of gas trapped between the template and the imprinting stack into the template, the imprinting stack or both, such that polymerizable material between the imprinting stack and the template rapidly forms a substantially continuous layer between the imprinting stack and the template.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
99.
High throughput imprint based on contact line motion tracking control
Systems and methods for controlling velocity of a contact line and height profile between a template and a substrate during imprinting of polymerizable material are described.
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B82Y 40/00 - Manufacture or treatment of nanostructures
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
Generating a fluid drop pattern for an imprint lithography process includes selecting an imprinting surface with features and generating a fluid drop pattern including drop locations for placement of a multiplicity of drops of substantially equal volume on an imprint lithography substrate such that some of the drops are substantially aligned with at least some of the features. The fluid drop pattern is generated through an optimization process. The fluid drop pattern allows substantially complete filling of imprinting surface features and formation of a substantially uniform residual layer during the imprint lithography process.
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