Abstract

A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoidable impurities, wherein the copper alloy plate has such a surface layer part that the Mg concentration in the plate surface is 30% or less of the bulk Mg concentration at the thickness center and the surface layer part has a depth at which the Mg concentration is 90% of the bulk Mg concentration as observed from the plate surface, and the Mg concentration in the surface layer part increases from the plate surface toward the thickness center at a concentration gradient of 1.8 to 50% by mass/μm inclusive.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22C 13/00 - Alloys based on tin
• C25D 5/10 - Electroplating with more than one layer of the same or of different metals
• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

This pure copper plate has a Cu purity of 99.96 mass% or greater, the remainder being unavoidable impurities, and has a P content of 2 mass ppm or less, and a total content of Pb, Se, and Te of 10 mass ppm or less. The S content in the pure copper plate may be 2 mass ppm to 20 mass ppm.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

65655 is substituted with nickel; a part of the copper-tin alloy layer is exposed at the surface of the tin layer where tin solidified parts are present in an island-like manner; and the tin solidified parts have an average diameter of 10-1000 μm in a direction along the surface of the tin layer, and occupy an area that accounts for 1-90% of the surface area of the tin layer.

IPC Classes  ?

• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 7/00 - Electroplating characterised by the article coated
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials

Abstract

J3J2 J2J33))0.5 ≤ 0.45.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

J3J2J2J3J3) )0.5 ≤ 0.45.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

1/2+0.5×μ≤66. The long side of the γ phase does not exceed 50 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Goods & Services

Copper, unwrought or semi-wrought; copper alloys; rolled, drawn or extruded semi-finished articles of copper; rolled, drawn or extruded semi-finished articles of copper alloys; plated copper alloys; rolled, drawn or extruded semi-finished articles of plated copper alloys.

Abstract

This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relationships: 75.0≤f1=Cu+0.8×Si-7.5×Sn+P+0.5×Pb≤78.2; 60.0≤f2=Cu-4.8×Si-0.8×Sn-P+0.5×Pb≤61.5; and 0.09≤f3=P/Sn≤0.30. The area percentage (%) of respective constituent phases satisfies the following relationships: 30≤κ≤65; 0≤γ≤2.0; 0≤β≤0.3; 0≤μ≤2.0; 96.5≤f4=α+κ; 99.4≤f5=α+κ+γ+μ; 0≤f6=γ+μ≤3.0; and 35≤f7=1.05×κ+6×γ1/2+0.5×μ≤70. The κ phase is present within the α phase, the long side of the γ phase is at most 50 µm, and the long side of the μ phase is at most 25 µm.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relationships: 78.0≤f1=Cu+0.8×Si+P+Pb≤80.8; and 60.2≤f2=Cu-4.7×Si-P+0.5×Pb≤61.5. The area percentage (%) of respective constituent phases satisfies the following relationships: 29≤κ≤60; 0≤γ≤0.3; β=0; 0≤μ≤1.0; 98.6≤f3=α+κ; 99.7≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤1.2; and 30≤f6=κ+6×γ1/2+0.5×μ≤62. The long side of the γ phase is at most 25 µm, the long side of the μ phase is at most 20 µm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relationships: 76.5≤f1=Cu+0.8×Si-8.5×Sn+P≤80.3; 60.7≤f2=Cu-4.6×Si-0.7×Sn-P≤62.1; and 0.25≤f7=[P]/[Sn]≤1.0. The area percentage (%) of respective constituent phases satisfies the following relationships: 28≤κ≤67; 0≤γ≤1.0; 0≤β≤0.2; 0≤μ≤1.5; 97.4≤f3=α+κ; 99.4≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤2.0; and 30≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase is at most 40 µm, the long side of the μ phase is at most 25 µm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

[Problem] To provide a terminal material for connectors having excellent insertion/removal properties, which is decreased in the coefficient of kinetic friction to as low as 0.3 or less, while exhibiting excellent electrical connection characteristics. [Solution] A terminal material for connectors, which is obtained by sequentially laminating, on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper tin alloy layer and a tin layer in this order, and wherein: the tin layer has an average thickness of from 0.2 μm to 1.2 μm (inclusive); the copper tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 μm to 1.5 μm (inclusive); a part of the copper tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 μm to 1.0 μm (inclusive) and an average crystal grain diameter of from 0.01 μm to 0.5 μm (inclusive), with the (standard deviation)/(average crystal grain diameter) ratio of the crystal grain diameters being 1.0 or less; the surface roughness Ra of a surface of the nickel or nickel alloy layer, said surface being in contact with the copper tin alloy layer, is from 0.005 μm to 0.5 μm (inclusive); and the coefficient of kinetic friction of the surface is 0.3 or less.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
• H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Abstract

This free-cutting copper alloy casting contains 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 75.5 ≤ f1 = Cu + 0.8 × Si -7.5 × Sn + P + 0.5 × Pb ≤ 78.7, 60.8 ≤ f2 = Cu – 4.5 × Si – 0.8 × Sn – P + 0.5 × Pb ≤ 62.2, 0.09 ≤ f3 = P/Sn ≤ 0.35. The surface area ratios (%) of the constituent phases satisfy the following relations, 30 ≤ κ ≤ 63, 0 ≤ γ ≤ 2.0, 0 ≤ β ≤ 0.3, 0 ≤ μ ≤ 2.0, 96.5 ≤ f4 = α + κ, 99.3 ≤ f5 = α + κ + γ + μ, 0 ≤ f6 = γ + μ ≤ 3.0, 37 ≤ f7 = 1.05 × κ + 6 × γ1/2 + 0.5 × μ ≤ 72. The κ phase is present within the α phase, the long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This free-cutting copper alloy contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, and 0.022-0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2 ≤ f1 = Cu + 0.8 × Si - 8.5 × Sn + P + 0.5 × Pb ≤ 80.3, 61.5 ≤ f2 = Cu – 4.3 × Si – 0.7 × Sn – P + 0.5 × Pb ≤ 63.3. The surface area ratios (%) of the constituent phases satisfy the following relations: 25 ≤ κ ≤ 65, 0 ≤ γ ≤ 1.5, 0 ≤ β ≤ 0.2, 0 ≤ μ ≤ 2.0, 97.0 ≤ f3 = α + κ, 99.4 ≤ f4 = α + κ + γ + μ, 0 ≤ f5 = γ + μ ≤ 2.5, 27 ≤ f6 = κ + 6 × γ1/2 + 0.5 × μ ≤ 70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the k phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0 ≤ f0 = 100 × Sn/(Cu + Si + 0.5 × Pb + 0.5 × P – 75.5) ≤ 3.7, 78.5 ≤ f1 = Cu + 0.8 × Si – 8.5 × Sn + P + 0.5 × Pb ≤ 83.0, 61.8 ≤ f2 = Cu – 4.2 × Si – 0.5 × Sn – 2 × P ≤ 63.7. The surface area ratios (%) of the constituent phases satisfy the following relations, 36 ≤ κ ≤ 72, 0 ≤ γ ≤ 2.0, 0 ≤ β ≤ 0.5, 0 ≤ μ ≤ 2.0, 96.5 ≤ f3 = α + κ, 99.4 ≤ f4 = α + κ + γ + μ, 0 ≤ f5 = γ + μ ≤ 3.0, 38 ≤ f6 = κ + 6 × γ1/2 + 0.5 × μ ≤ 80. The long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This free-cutting copper alloy contains 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.84% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4 ≤ f1 = Cu + 0.8 × Si – 8.5 × Sn + P + 0.5 × Pb ≤ 78.2, 61.2 ≤ f2 = Cu – 4.4 × Si - 0.7 × Sn – P + 0.5 × Pb ≤ 62.8, 0.09 ≤ f3 = P/Sn ≤ 0.35. The surface area ratio (%) of the constituent phases satisfies the following relations: 30 ≤ κ ≤ 65, 0 ≤ γ ≤ 2.0, 0 ≤ β ≤ 0.3, 0 ≤ μ ≤ 2.0, 96.5 ≤ f4 = α + κ, 99.4 ≤ f5 = α + κ + γ + μ, 0 ≤ f6 = γ + μ ≤ 3.0, 36 ≤ f7 = 1.05 × κ + 6 × γ1/2 + 0.5 × μ ≤ 72. The k phase is present within the α phase, the long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2 ≤ f1 = Cu + 0.8 × Si – 8.5 × Sn + P + 0.5 × Pb ≤ 80.3, 61.2 ≤ f2 = Cu – 4.4 × Si - 0.8 × Sn – P + 0.5 × Pb ≤ 62.8. The surface area ratios (%) of the constituent phases satisfy the following relations: 25 ≤ κ ≤ 65, 0 ≤ γ ≤ 2.0, 0 ≤ β ≤ 0.3, 0 ≤ μ ≤ 2.0, 96.5 ≤ f3 = α + κ, 99.2 ≤ f4 = α + κ + γ + μ, 0 ≤ f5 = γ + μ ≤ 3.0, 29 ≤ f6 = κ + 6 × γ1/2 + 0.5 × μ ≤ 66. The long side of the γ phase does not exceed 50 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This copper alloy is characterized by having a composition that contains from 0.05 mass% to 0.70 mass% (inclusive) of Co, from 0.02 mass% to 0.20 mass% (inclusive) of P, from 0.005 mass% to 0.70 mass% (inclusive) of Sn, and one or more elements selected from among B, Cr and Zr, with the balance made up of Cu and unavoidable impurities; and this copper alloy is also characterized in that if X (mass ppm) is the content of B, Y (mass ppm) is the content of Cr and Z (mass ppm) is the content of Zr, X, Y and Z satisfy formula (1) 1 ≤ (X/5) + (Y/50) + (Z/100) and formula (2) X + Y + Z ≤ 1,000.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• B22D 11/00 - Continuous casting of metals, i.e. casting in indefinite lengths
• B22D 11/06 - Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
• B22D 11/108 - Feeding additives, powders, or the like
• B22D 11/12 - Accessories for subsequent treating or working cast stock in situ
• B22D 35/00 - Equipment for conveying molten metal into beds or moulds
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

One aspect of this brass alloy hot-worked article contains 61.5-64.5 mass% of Cu, 0.6-2.0 mass% of Pb, 0.55-1.0 mass% of Sn, 0.02-0.08 mass% of Sb and 0.02-0.10 mass% of Ni, with the remainder comprising Zn and unavoidable impurities, and the one aspect satisfies the formulae below. 60.5 ≤ [Cu]+0.5×[Pb]-2×[Sn]-2×[Sb]+[Ni] ≤ 64.0 0.03 ≤ [Sb]/[Sn] ≤ 0.12 0.3 ≤ [Ni]/[Sb] ≤ 3.5

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≤([Co]−0.007)/([P]−0.008)≤6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 7/00 - Insulated conductors or cables characterised by their form
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• H01B 13/012 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses

Abstract

The present invention is characterized by containing 0.5-3.0% by mass of Mg, the balance comprising Cu and unavoidable impurities; in a tensile test, when the ratio dσt/dεt defined by true stress σt and true strain εt is plotted on the vertical axis and true strain εt is plotted on the horizontal axis, a strain region is included in which the gradient of σt/εt is positive.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

The present copper alloy for electronic/electric devices contains greater than 2 mass% to 36.5 mass% Zn, 0.1 mass% to 0.9 mass% Sn, 0.15 mass% to less than 1.0 mass% Ni, 0.005 mass% to 0.1 mass% P, and 0.001 mass% to 0.1 mass% Fe, the balance being obtained from Cu and unavoidable impurities, and in atom ratios, satisfies 3 < (Ni+Fe)/P < 30, 0.3 < Sn/(Ni+Fe) < 2.7, and 0.002 ≤ [Fe/Ni] < 0.6, and satisfies the atom ratio [Fe/Ni]P of the Fe content to the Ni content in a [Ni, Fe]-P-based deposit containing Fe, Ni and P with respect to the atom ratio [Fe/Ni] of the Fe content to Ni content in the alloy as a whole being 5 ≤ [Fe/Ni]P/[Fe/Ni] ≤ 200.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars

Abstract

LD in a direction parallel to the rolling direction exceeds 1.09.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• B22D 7/00 - Casting ingots
• C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
• C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22C 1/02 - Making non-ferrous alloys by melting

Goods & Services

Copper and its alloys; copper-base alloy ingots; copper ingots; semi-finished articles of unrefined copper; castings, foils, powder, and rolled, drawn or extruded semi-finished articles of copper or its alloys; building materials of metal; construction materials of metal; metal pulleys, springs and valves [not including machine elements]; pulleys of metal, other than for machines; springs [metal hardware]; metal valves, not being parts of machines; metal pipe couplings; metal flanges; metal hardware; metal hardware [not including "security locks, keys for locks, ring of metal for keys and padlocks"]; security locks; keys; metal rings for keys; padlocks; industrial packaging containers of metal; industrial packaging containers of metal [not including "metal stoppers for industrial packaging containers and lids of metal"]; metal stoppers for industrial packaging containers; lids of metal; joinery fittings of metal; safe deposit boxes.

Abstract

1/2×[Ni]≤23, 1.3≤[Ni]+[Sn]≤2.4, 1.5≤[Ni]/[Sn]≤5.5, and 20≤[Ni]/[P]≤400 are satisfied. The copper alloy has a metallographic structure of an α single phase.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
• C21D 8/02 - Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
• C21D 9/46 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for sheet metals

Abstract

1/2≦33, 1.2≦0.7×[Ni]+[Sn]≦4, and 1.4≦[Ni]/[Sn]≦90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % in an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7.

IPC Classes  ?

• C21D 8/02 - Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
• C21D 9/46 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for sheet metals
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

2 or more.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

Provided is a copper alloy sheet which is excellent in terms of resistance to stress corrosion cracking, stress relaxation property, tensile strength, proof stress, electrical conductivity, bendability, and solder wettability. The copper alloy sheet contains 4-14 mass% Zn, 0.1-1 mass% Sn, 0.005-0.08 mass% P, and 1.0-2.4 mass% Ni, with the remainder comprising Cu and unavoidable impurities, and satisfies the relational expressions 7≤[Zn]+3×[Sn]+2×[Ni]≤18, 0≤[Zn]-0.3×[Sn]-1.8×[Ni]≤11, 0.3≤(3×[Ni]+0.5×[Sn])/[Zn]≤1.6, 1.8≤[Ni]/[Sn]≤10, and 16≤[Ni]/[P]≤250. The copper alloy sheet has an average crystal grain diameter of 2-9 μm and contains circular or elliptic precipitates which have an average grain diameter of 3-75 nm or in which precipitate grains each having a grain diameter of 3-75 nm account for 70% by number or more of all the circular or elliptic precipitates. The copper alloy sheet has an electrical conductivity of 24% IACS or greater and a degree of stress relaxation, measured at 150°C for 1,000 hours as an index to resistance to stress relaxation, of 25% or less.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

A copper alloy for electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3

IPC Classes  ?

• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10

IPC Classes  ?

• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C23C 2/08 - Tin or alloys based thereon
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

　Provided is a metal structure containing 17-34 mass% Zn, 0.01-2.5 mass% Sn, 0.005-1.8 mass% Al, and 0.0005-0.030 mass% Pb, the balance being Cu and unavoidable impurities, the above elements being contained in amounts such that the relationships 24 ≤ [Zn] + 5 × [Sn] + 3 × [Al] ≤ 40 and 1.2 ≤ [Sn] + 2 × [Al] ≤ 4.0 are satisfied, the area ratio (γ)% of the γ phase and the area ratio (β)% of the β phase in the α-phase matrix having the relationship 0 ≤ 2 × (γ) + (β) ≤ 1.5, and 0-0.7% of the γ phase and 0-0.9% of the β phase, in terms of area ratio, being dispersed in the α-phase matrix.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent

Abstract

A brazed structure in which a brazed part is formed on a substrate comprising a discoloration-resistant copper alloy containing 17-37 mass% Zn, 0.30 mass% Pb, and at least one of 0.5 mass% Ni, 0.01-1.6 mass% Al, and 0.01-2.5 mass% Sn, the balance being Cu and unavoidable impurities, wherein the relationships 15 ≤ [Zn] - 0.5 × [Pb] - 1.2 × [Ni] + 2.4 × [Sn] + 1 × [Al] ≤ 32 and 0.7 ≤ 0.3 × [Ni] + 1 × [Sn] + 1.8 × [Al] ≤ 3.8 are satisfied, the metal structure of the brazed part is an α-phase matrix, the total of the proportion occupied by the β phase and the proportion occupied by the γ phase is 0-1.4% in terms of the area ratio, and the electrical conductivity is 7-25% IACS.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22C 5/08 - Alloys based on silver with copper as the next major constituent
• C22C 30/06 - Alloys containing less than 50% by weight of each constituent containing zinc

Abstract

A copper alloy according to the present invention comprises 18 to 30 mass% of Zn, 1 to 1.5 mass% of Ni, 0.2 to 1 mass% of Sn, 0.003 to 0.06 mass% of P and a remainder made up by Cu and unavoidable impurities, wherein the relationships represented by the formulae mentioned below are satisfied: 17 ≤ f1 = [Zn]+5×[Sn]-2×[Ni] ≤ 30, 14 ≤ f2 = [Zn]-0.5×[Sn]-3×[Ni] ≤ 26, 8 ≤ f3 = {f1×(32-f1)}1/2×[Ni] ≤ 23, 1.3 ≤ [Ni]+[Sn] ≤ 2.4 and 1.5 ≤ [Ni]/[Sn] ≤ 5.5 and 20 ≤ [Ni]/[P] ≤ 400. The copper alloy has an α single phase metal structure.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

A copper alloy according to the present invention comprises 17 to 34 mass% of Zn, 0.02 to 2.0 mass% of Sn, 1.5 to 5 mass% of Ni and a remainder made up by Cu and unavoidable impurities, wherein the relationships represented by the formulae mentioned below are satisfied: 12 ≤ f1 = [Zn]+5×[Sn]-2×[Ni] ≤ 30, 10 ≤ [Zn]-0.3×[Sn]-2×[Ni] ≤ 28, 10 ≤ f3 = {f1×(32-f1)×[Ni]}1/2 ≤ 33, 1.2 ≤ 0.7×[Ni]+[Sn] ≤ 4 and 1.4 ≤ [Ni]/[Sn] ≤ 90. The copper alloy has an electric conductivity of 13 to 25% IACS or less, and the occupation ratio of an α phase is 99.5% by area or more or the area ratio (γ) (%) of a γ phase and the area ratio (β) (%) of a β phase in the α phase matrix have a relationship represented by the formula: 0 ≤ 2×(γ)+(β) ≤ 0.7.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

This copper alloy contains 1.5 mass% to 2.7 mass% Fe, 0.008 mass% to 0.15 mass% P, and 0.01 mass% to 0.5 mass% Zn, with the remainder being Cu and unavoidable impurities. The content of C contained as an unavoidable impurity is less than 3 mass/mass ppm.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This copper alloy contains 1.5 mass% to 2.7 mass% Fe, 0.008 mass% to 0.15 mass% P, and 0.01 mass% to 0.5 mass% Zn, with the remainder being Cu and unavoidable impurities. The content of C contained as an unavoidable impurity is less than 5 mass/mass ppm; the content of Cr is less than 7 mass/mass ppm; the content of Mo is less than 5 mass/mass ppm; the content of W is less than 1 mass/mass ppm; the content of V is less than 1 mass/mass ppm; and the content of Nb is less than 1 mass/mass ppm.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

One example of this copper alloy for electronic/electrical equipment contains more than 2.0 mass% to not more than 36.5 mass% of Zn, 0.10 mass% to 0.90 mass% inclusive of Sn, at least 0.15 mass% to less than 1.00 mass% of Ni, and 0.005 mass% to 0.100 mass% inclusive of P, with the remainder comprising Cu and unavoidable impurities. The atomic ratios of the content of the elements satisfy 3.0 < Ni/P < 100.0 and 0.10 < Sn/Ni < 2.90, and the Vickers hardness of the α-phase surface that contains Cu, Zn, and Sn is at least 100.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

One example of this copper alloy for electronic and electrical equipment contains more than 2.0 mass% to at most 36.5 mass% of Zn, 0.10 mass% to 0.90 mass% inclusive of Sn, at least 0.15 mass% to less than 1.00 mass% of Ni, 0.005 mass% to 0.100 mass% inclusive of P, with the remainder comprising Cu and unavoidable impurities. The atomic ratios of the content of the elements satisfy 3.00 < Ni/P < 100.00, and 0.10 < Sn/Ni < 2.90, and the strength ratio (TSTD/TSLD) of the tensile strength (TSTD) in the transverse direction to the rolling direction and the tensile strength (TSLD) in the parallel direction to the rolling direction is more than 1.09.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

2, a/b is in a range of 0.5 to 1.5.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

Provided is a copper alloy for electrical and electronic equipment, having reliable and sufficiently excellent copper alloy stress relaxation properties and having excellent strength and bending workability. Also provided are a copper alloy thin sheet for electrical and electronic equipment and a conductive component and a terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment contains more than 2 mass% but less than 23 mass% Zn, 0.1-.0.9 mass% Sn, at least 0.05 mass% but less than 1.0 mass% Ni, at least 0.001 mass% but less than 0.10 mass% Fe, and 0.005-0.1 mass% P, with the remainder being Cu and unavoidable impurities. The copper alloy for electrical and electronic equipment fulfills, by atomic rate, 0.002≤Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Provided is a copper alloy for electrical and electronic equipment, having reliable and sufficiently excellent stress relaxation properties and having excellent strength and bending workability. Also provided are a copper alloy thin sheet for electrical and electronic equipment and a conductive component and a terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment comprises 23-36.5 mass% Zn, 0.1-0.9 mass% Sn, at least 0.15 mass% but less than 1.0 mass% Ni, at least 0.001 mass% but less than 0.10 mass% Fe, and 0.005-0.1 mass% P, with the remainder being Cu and unavoidable impurities. Said copper alloy for electrical and electronic equipment fulfils, by atomic rate, 0.002≤Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

1/2 in any location in a tube axis direction.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• F16L 9/02 - Rigid pipes of metal

Abstract

An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 21/10 - Alloys based on aluminium with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 13/00 - Alloys based on tin

Abstract

Provided is one aspect of copper alloy sheet containing 4.5% by mass to 12.0% by mass of Zn, 0.40% by mass to 0.90% by mass of Sn, 0.01% by mass to 0.08% by mass of P, as well as 0.005% by mass to 0.08% by mass of Co and/or 0.03% by mass to 0.85% by mass of Ni, the remainder being Cu and unavoidable impurities. The copper alloy sheet satisfies a relationship of 11≦[Zn]+7×[Sn]+15×[P]+12×[Co]+4.5×[Ni]≦17. The one aspect of copper alloy sheet is produced by a production process including a finish cold rolling process at which a copper alloy material is cold-rolled. An average grain size of the copper alloy material is 2.0 μm to 8.0 μm, circular or elliptical precipitates are present in the copper alloy material, and an average particle size of the precipitates is 4.0 nm to 25.0 nm, or a percentage of precipitates having a particle size of 4.0 nm to 25.0 nm makes up 70% or more of the precipitates.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

0{110}≦6.0.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• C22C 9/00 - Alloys based on copper
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 1/10 - Alloys containing non-metals

Abstract

This copper-alloy plate for a terminal/connector material: contains 4.5-12.0 mass% of Zn, 0.40-0.9 mass% of Sn, 0.01-0.08 mass% of P and 0.20-0.85 mass% of Ni, with inevitable impurities and Cu constituting the remainder thereof; satisfies the relationship 8≤Ni/P≤40 when satisfying the relationship 11≤Zn+7.5×Sn+16×P+3.5×Ni≤17 and containing 0.35-0.85 mass% of Ni; has an average crystal particle diameter of 2.0-8.0μm; has an average particle diameter of the circular or elliptical precipitate of 4.0-25.0nm, or contains a proportion of the number of precipitate particles having a particle diameter of 4.0-25.0nm among the precipitate particles of 70% or higher; has a conductivity of 30% IACS or higher; in terms of stress relaxation resistance properties, exhibits a percentage of stress relaxation after 1000 hours at 150°C of 30% or lower; has a bending workability when W-bending of R/t≤0.5; exhibits excellent solder wettability; and has a Young's modulus of 100×103N/mm2 or higher.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

This copper-alloy plate for a terminal/connector material: contains 4.5-12.0 mass% of Zn, 0.40-0.9 mass% of Sn, 0.01-0.08 mass% of P and 0.20-0.85 mass% of Ni, with inevitable impurities and Cu constituting the remainder thereof; satisfies the relationship 7≤Ni/P≤40 when satisfying the relationship 11≤Zn+7.5×Sn+16×P+3.5×Ni≤19 and containing 0.35-0.85 mass% of Ni; has an average crystal particle diameter of 2.0-8.0μm; has an average particle diameter of the circular or elliptical precipitate of 4.0-25.0nm, or contains a proportion of the number of precipitate particles having a particle diameter of 4.0-25.0nm among the precipitate particles of 70% or higher; has a conductivity of 29% IACS or higher; in terms of stress relaxation resistance properties, exhibits a percentage of stress relaxation after 1000 hours at 150°C of 30% or lower; has a bending workability when W-bending of R/t≤0.5; exhibits excellent solder wettability; and has a Young's modulus of 100×103N/mm2 or higher.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

A copper alloy for an electronic/electric device, containing 23 mass% to 36.5 mass% of Zn, 0.1 mass% to 0.9 mass% of Sn, 0.15 mass% to less than 1.0 mass% of Ni, 0.001 mass% to less than 0.10 mass% of Fe, and 0.005 mass% to 0.1 mass% of P, with the remainder made up by Cu and unavoidable impurities, the relationships 0.002 ≤ Fe/Ni < 0.7, 3 < (Ni+Fe)/P < 15, and 0.3 < Sn/(Ni+Fe) < 2.9 in terms of atomic ratio being satisfied, and the proportion (R{220}) of the intensity of X-ray diffraction from the {220} plane on one surface being no greater than 0.8.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 21/10 - Alloys based on aluminium with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C21D 11/00 - Process control or regulation for heat treatments
• C22C 13/00 - Alloys based on tin

Abstract

A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0.001 to 0.10 mass% of P with the balance consisting of Cu and unavoidable impurities, satisfying the relationships among the contents of these elements in atomic ratio, 0.002 ≤ Fe/Ni < 1.5, 3 < (Ni+Fe)/P < 15 and 0.3 < Sn/(Ni+Fe) < 5, and containing a precipitate that contains both P and at least one element selected from the group consisting of Fe, Co and Ni.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C25D 7/00 - Electroplating characterised by the article coated
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

1/2≦37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 μm to 7.0 μm, and a sum of an area ratio of a β phase and an area ratio of a γ phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

The present invention pertains to a copper alloy for electrical and electronic equipment, a copper alloy thin sheet for electrical and electronic equipment, and a conductive part and terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment contains more than 2.0 mass% to 15.0 mass% of zinc, 0.10 mass% to 0.90 mass% of tin, 0.05 mass% to less than 1.00 mass% of nickel, 0.001 mass% to less than 0.100 mass% of iron, and 0.005 mass% to 0.100 mass% of phosphorus, with the remainder comprising copper and unavoidable impurities. The copper alloy satisfies 0.002 ≤ Fe/Ni < 1.500, 3.0 < (Ni + Fe)/P < 100.0, and 0.10 < Sn/(Ni + Fe) < 5.00 in terms of atomic ratios. The yield ratio (YS/TS), which is calculated from the tensile strength (TS) and 0.2% offset yield strength (YS) when a tension test is performed in a direction parallel to the rolling direction, is over 90%.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

This copper alloy for electrical and electronic equipment contains more than 2 mass% to 23 mass% of zinc, 0.1 mass% to 0.9 mass% of tin, 0.05 mass% to less than 1.0 mass% of nickel, 0.001 mass% to less than 0.10 mass% of iron, and 0.005 mass% to 0.1 mass% of phosphorus, with the remainder comprising copper and unavoidable impurities. The copper alloy satisfies 0.002 ≤ Fe/Ni < 1.5, 3 < (Ni + Fe)/P < 15, and 0.3 < Sn/(Ni + Fe) < 5 in terms of atomic ratios. A ratio (R) {220} of X-ray diffraction intensities from the {220} plane on one surface is set at 0.8 or less.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum

Abstract

The present invention pertains to a copper alloy for electrical and electronic equipment, a copper alloy thin sheet for electrical and electronic equipment, and a conductive part and terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment contains more than 2.0 mass% but less than 23.0 mass% of zinc, 0.10 mass% to 0.90 mass% of tin, 0.05 mass% to less than 1.00 mass% of nickel, 0.001 mass% to less than 0.100 mass% of iron, and 0.005 mass% to 0.100 mass% of phosphorus, with the remainder comprising copper and unavoidable impurities. The copper alloy satisfies 0.002 ≤ Fe/Ni < 1.500, 3.0 < (Ni + Fe)/P < 100.0, and 0.10 < Sn/(Ni + Fe) < 5.00 in terms of atomic ratios. The content of hydrogen is not more than 10 mass ppm, the content of oxygen is not more than 100 mass ppm, the content of sulfur is not more than 50 mass ppm, and the content of carbon is not more than 10 mass ppm.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

1/2}≦580 are fulfilled, in which Tmax is the highest arrival temperature, tm (min) is a retention time in a temperature range from a temperature lower than the highest arrival temperature by 50° C. to the highest arrival temperature, and RE (%) is a cold working rate.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

1/2≦37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 μm to 7.0 μm, and a sum of an area ratio of a β phase and an area ratio of a γ phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C21D 11/00 - Process control or regulation for heat treatments
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 7/00 - Electroplating characterised by the article coated
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent

Abstract

Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002≦Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01R 9/24 - Terminal blocks
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials

Abstract

A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≦[Cu]−3.6×[Si]≦67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≦“α”≦84, 15≦“κ”≦68, “α”+“κ”≧92, 0.2≦“κ”/“α”≦2, “β”≦3, “μ”≦5, “β”+“μ”≦6, 0≦“γ”≦7, and 0≦“β”+“μ”+“γ”≦8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

IPC Classes  ?

• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/008 - Soldering within a furnace
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C

Abstract

2.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≤[Cu]−3.6×[Si]≤67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≤“α”≤84, 15≤“κ”≤68, “α”+“κ”≥92, 0.2≤“κ”/“α”≤2, “β”≤3, “μ”≤5, “β”+“μ”≤6, 0≤“γ”≤7, and 0≤“β”+“μ”+“γ”≤8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 1/008 - Soldering within a furnace
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• B23K 101/12 - Vessels
• B23K 103/12 - Copper or alloys thereof
• B23K 103/18 - Dissimilar materials

Abstract

To improve fatigue resistance, particularly fatigue resistance after holding for 1000 hours at 150 °C, while maintaining the conventional properties. A copper alloy plate having a composition including 0.2-1.2 mass% of Mg and 0.001-0.2 mass% of P, with the balance being made up by Cu and unavoidable impurities, wherein: the crystal orientation of the surface is such that 4.0 ≤ I{110}/I0{110} ≤ 6.0, where I{110} represents the X-ray diffraction intensity of the {110} crystal plane, and I0{110} represents the X-ray diffraction intensity of the {110} crystal plane of a pure copper standard powder; I{100} / I0{100} ≤ 0.8, where I{100} represents the X-ray diffraction intensity of the {100} crystal plane, and I0{100} represents the X-ray diffraction intensity of the {100} crystal plane of a pure copper standard powder; and I{111}/I0{111} ≤ 0.8, where I{111} represents the X-ray diffraction intensity of the {111} crystal plane, and I0{111} represents the X-ray diffraction intensity of the {111} crystal plane of a pure copper standard powder. The average crystal grain diameter is 1.0-10.0 μm.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

Provided is a copper alloy comprising, by mass%, Zn at greater than 2.0% and 36.5% or less, Sn at 0.1% to 0.9%, Ni at 0.05% or more and less than 1.0%, Fe at 0.001% or more and less than 0.10%, P at 0.005% to 0.10%, and the remainder including Cu and inevitable impurities, wherein in atomic ratio, 0.002≤Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22C 9/10 - Alloys based on copper with silicon as the next major constituent

Abstract

A Cu-Ni-Si based copper alloy sheet which has an excellent die abrasion resistance and a good shear processability while maintaining a sufficient strength and a sufficient conductivity, said Cu-Ni-Si based copper alloy sheet comprising 1.0-4.0 mass% of Ni, 0.2-0.9 mass% of Si and the balance consisting of Cu and unavoidable impurities, wherein the number of Ni-Si precipitate grains having a grain size of 20-80 nm present on the surface thereof is 1.5×106 to 5.0×106/mm2 and the number of Ni-Si precipitate grains having a grain size exceeding 100 nm present on the surface thereof is 0.5×105 to 4.0×105/mm2. In the Cu-Ni-Si based copper alloy sheet, the ratio a/b [wherein a stands for the number (grains/mm2) of Ni-Si precipitate grains having a grain size of 20-80 nm that are present in a surface layer extending from the surface to the depth corresponding to 20% of the thickness of the whole sheet; and b stands for the number (grains/mm2) of Ni-Si precipitate grains having a grain size of 20-80 nm that are present below the surface layer] is in the range of 0.5-1.5, and the concentration of Si solid-soluted in crystal grains present in an area at a depth of less than 10 μm from the surface is 0.03-0.4 mass%.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

A tubular hot-forged copper alloy article has an alloy composition comprising 59.0-84.0 mass% of Cu, 0.003-0.3 mass% of Pb and a remainder made up by Zn and unavoidable impurities, wherein the content of Cu [Cu] (mass%) and the content of Pb [Pb] (mass%) have a relationship represented by the formula: 59 ≤ ([Cu]+0.5×[Pb]) ≤ 64, the shape of the article fulfills the formulae: 0.4 ≤ (average inner diameter)/(average outer diameter) ≤ 0.92, 0.04 ≤ (average thickness)/(average outer diameter) ≤ 0.3 and 1 ≤ (length in tube axis direction)/(average thickness) ≤ 10, and a forging material that is not hot-forged yet has a tubular form, fulfills the formulae: 0.3 ≤ (average inner diameter/average outer diameter) ≤ 0.88, 0.06 ≤ (average thickness)/(average outer diameter) ≤ 0.35 and 0.8 ≤ (length in tube axis direction)/(average thickness) ≤ 12, and fulfills the formulae: 0 ≤ (degree of thickness unevenness) ≤ 30% and 0 ≤ (degree of thickness unevenness) ≤ 75×1/((length in tube axis direction)/(average thickness))1/2 at any position located in the tube axis direction.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

According to one embodiment, a copper alloy sheet comprises 28.0 to 35.0 mass% of Zn, 0.15 to 0.75 mass% of Sn, and 0.005 to 0.05 mass% of P, with the remainder being Cu and inevitable impurities, wherein each correlation of 44 ≥ [Zn] + 20 × [Sn] ≥ 37 and 32 ≤ [Zn] + 9 × ([Sn] ˗ 0.25)1/2 ≤ 37 is satisfied. According to one embodiment, the copper alloy sheet is produced by production steps that include a step for a final cold rolling step whereby a copper alloy material is cold rolled, wherein the average crystal grain size of the copper alloy material is between 2.0 and 7.0 µm, and the total of the surface area percentage of β phase and surface area percentage of γ phase in the metal composition of the copper alloy material is between 0% and 0.9%.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

One aspect of this copper alloy sheet is that the sheet contains 4.5-12.0% by mass of Zn, 0.40-0.90% by mass of Sn, 0.01-0.08% by mass of P, as well as 0.005-0.08% by mass of Co and/or 0.03-0.85% by mass of Ni, the remainder comprising Cu and unavoidable impurities, and the copper alloy sheet satisfies the relationship: 11 ≤ [Zn] + 7 × [Sn] + 15 × [P] + 12 × [Co] + 4.5 × [Ni] ≤ 17. One aspect of this copper alloy sheet is that the sheet is produced by a production process comprising a finishing cold-rolling process for cold-rolling copper alloy material, the average crystal particle size of the copper alloy material being 2.0-8.0 µm, circular and oblong-shaped deposits exist in the copper alloy material, and either the average particle size of the deposits is 4.0-25.0 nm or deposits having a particle size of 4.0-25.0 nm make up at least 70% of the deposits.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

One aspect of this copper alloy sheet is that the sheet contains 5.0-12.0% by mass of Zn, 1.1-2.5% by mass of Sn, 0.01-0.09% by mass of P, and 0.6-1.5% by mass of Ni, the remainder comprising Cu and unavoidable impurities; and the copper alloy sheet satisfies a relation of 20 ≤ [Zn] + 7 × [Sn] + 15 × [P] + 4.5 × [Ni] ≤ 32. One aspect of this copper alloy sheet is that the sheet is produced through a production process comprising a finishing cold-rolling process for cold-rolling copper alloy material, the average crystal particle size of a copper alloy material is 1.2-5.0 µm, circular or oblong-shaped deposits exist in the copper alloy material, and either the average particle size of the deposits is 4.0-25.0 nm or those deposits having a particle size of 4.0-25.0 nm occupy a proportion of 70% or greater among the deposits.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Provided are a silver-white copper alloy and a method for manufacturing a silver-white copper alloy which has excellent hot processability, cold processability, press characteristics and other processing and mechanical properties, which is not liable to discolor, and which has excellent bactericidal, antibacterial, and anti-Ni allergy properties. The silver-white copper alloy is a composition comprising 51.0-58.0 mass% of Cu, 9.0-12.5 mass% of Ni, 0.0003-0.010 mass% of C, and 0.0005-0.030 mass% of Pb, with the remainder being Zn and other unavoidable impurities. The Cu content [Cu] mass% and the Ni content [Ni] mass% have the relationship 65.5 ≤ [Cu] + 1.2 × [Ni] ≤ 70.0. The metallographic structure has a β phase of 0-0.9% in terms of the area ratio dispersed in an α-phase matrix.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

A Cu-Ni-Si copper alloy sheet which contains 1.0-3.0 mass% Ni and contains Si in a concentration by mass% that is 1/6 to 1/4 the Ni concentration, with the remainder comprising Cu and incidental impurities, and in which the surface has an arithmetic average roughness Ra of 0.2 µm, the standard deviation of the absolute values for the crests and troughs from the surface-roughness mean line as a reference is 0.1 µm or less, and the crystal grains in the alloy structure have an aspect ratio of 0.4-0.6 on average. When all pixels present in the field of view are examined for orientation by the EBSD method and each boundary between adjoining pixels that differ in orientation by 5º or larger is taken as grain boundary, then the average GOS of all the crystal grains is 1.2-1.5º and the ratio of the total length Lσ of all special boundaries to the total length L of all grain boundaries (Lσ/L) is 60-70%. The copper alloy sheet has a spring limit of 450-600 N/mm2, has satisfactory high-temperature solder adhesion when examined at 150ºC for 1,000 hours, fluctuates little in fatigue resistance, and has excellent deep drawability.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

A Cu-Ni-Si copper alloy sheet which contains 1.0-3.0 mass% Ni and contains Si in a concentration by mass% that is 1/6 to 1/4 the Ni concentration, with the remainder comprising Cu and incidental impurities, and in which the surface has an arithmetic average roughness Ra of 0.2 µm, the standard deviation of the absolute values for the crests and troughs from the surface-roughness mean line as a reference is 0.1 µm or less, and the crystal grains in the alloy structure have an aspect ratio of 0.4-0.6 on average. When all pixels present in the field of view are examined for orientation by the EBSD method and each boundary between adjoining pixels that differ in orientation by 5º or larger is taken as grain boundary, then the average GOS of all the crystal grains is 1.2-1.5º and the ratio of the total length Lσ of all special boundaries to the total length L of all grain boundaries (Lσ/L) is 60-70%. The copper alloy sheet has a spring limit of 450-600 N/mm2, has satisfactory high-temperature solder adhesion when examined at 150ºC for 1,000 hours, fluctuates little in fatigue resistance, and has excellent deep drawability.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

Provided are: a Cu-Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance between bending workability and spring deflection limit at a high level; and a process for manufacturing the Cu-Zr-based copper alloy plate. The copper alloy plate contains 0.05-0.2 mass% of Zr and a remainder made up by Cu and unavoidable impurities, and is characterized in that the average value of KAM values as measured by an EBSD method on a scanning electron microscope equipped with an electron backscattered diffraction pattern system is 1.5-1.8˚, the R/t ratio is 0.1-0.6 wherein R represents the minimum bending radius at which no cracking occurs and t represents the thickness of the plate in a W bending test, and the spring deflection limit is 420-520 N/mm2.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

This copper alloy hot-forged part has an alloy composition which contains 0.21 to 0.44 mass% of Co, 0.06 to 0.13 mass% of P, 0.003 to 0.08 mass% of Sn and 0.00003 to 0.0030 mass% of O, with the balance consisting of Cu and unavoidable impurities, and in which the Co content, [Co] mass%, and the P content, [P] mass%, satisfy the relationship: 3.1 ≤ ([Co] - 0.005)/([P] - 0.006) ≤ 4.9. In the cross-sectional metal structure, the sum of the fraction of recrystallized-grain groups where the recrystallized grains have an average grain diameter of 0.050 to 0.50mm and the fraction of un-recrystallized grains is 80% or above.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Provided is a pre-coating straight-angle substrate of an electrode wire for a solar cell having superior resistance to cracking and being formed of slit materials of pure copper plate which has desirable adhesion with a coating applied on the obverse face thereof. The substrate is formed of slit materials of pure copper thin plate containing 99.90mass% or more copper, with an obverse face arithmetical mean deviation (Ra) of 0.05-0.3μm, an obverse face maximum height (Rz) of 0.05-2.5μm, a ratio (Rq/Rz) of a root mean square (Rq) to the maximum height (Rz) of the obverse face of 0.06-1.1, and a ratio (Lσ/L) of a total special grain boundary length (Lσ) of a special grain boundary to a total length of a crystalline grain boundary (L), as measured with EBSD by a scanning electron microscope with backscatter electron diffraction pattern system attached within a depth of 10μm from the obverse surface, of 40-90%.

IPC Classes  ?

• H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices
• C23C 2/02 - Pretreatment of the material to be coated, e.g. for coating on selected surface areas
• C23C 2/34 - Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shapeApparatus therefor characterised by the shape of the material to be treated

Abstract

Disclosed is a pressure-resistant and corrosion-resistant copper alloy which contains 73.0-79.5 mass% of Cu and 2.5-4.0 mass% of Si with the balance made up of Zn and unavoidable impurities. The Cu content expressed as [Cu] mass% and the Si content expressed as [Si] mass% satisfy the following relationship: 62.0 ≤ [Cu] - 3.6 × [Si] ≤ 67.5. In addition, the area ratio of the α phase expressed as α%, the area ratio of the β phase expressed as β%, the area ratio of the γ phase expressed as γ%, the area ratio of the κ phase expressed as κ% and the area ratio of the μ phase expressed as μ% satisfy the following relationships: 30 ≤ α ≤ 84; 15 ≤ κ ≤ 68; α + κ ≥ 92; 0.2 ≤ κ/α ≤ 2; β ≤ 3; μ ≤ 5; β + μ ≤ 6; 0 ≤ γ ≤ 7; and 0 ≤ β + μ + γ ≤ 8.

IPC Classes  ?

• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• B23K 101/12 - Vessels

Abstract

Provided is a copper-nickel-silicon (Cu-Ni-Si) copper alloy that strikes a balance between deep-draw characteristics, thermal ablation resistance plating and spring deflection limit and, in particular, is used in electric and electronic members that have excellent deep-draw characteristics and a Cu-Ni-Si copper alloy production method. The disclosed Cu-Ni-Si copper alloy contains 1.0-3.0 mass% Ni and Si that is ¼ the density of the Ni and the remainder consists of copper and inevitable impurities. Crystal grains within the alloy structure have an aspect ratio (crystal grain minor axis/crystal grain major axis) with an average value of 0.4-0.6. The average value for the grain orientation spread (GOS) of whole crystal grains, measured by electron backscatter diffraction (EBSD) using a scanning electron microscope with an attached backscattered electron imaging system, is 1.2-1.5°. The ratio (Ｌσ/Ｌ) of the total specific grain boundary length (Ｌσ) of the specific grain boundaries to the total grain boundary length (L) of the crystal grains is 60-70 %. The spring deflection limit is 450-600 N/mm2. At 150 °C and after 1000 hours, the solder had excellent deep draw characteristics and good thermal ablation resistance.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

3Sn layer is 0.01 μm to 0.5 μm.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≤([Co]−0.007)/([P]−0.009)≤5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent

Abstract

Disclosed is a Cu-Mg-P-based copper alloy bar of which the percentage of stress relaxation during extended use at high temperatures, the tensile strength, and the spring bending elastic limit are balanced at a high level. Further disclosed is a method for producing same. The copper alloy bar has a composition of 0.3-2% Mg and 0.001-0.1% P by mass, the remainder being Cu and unavoidable impurities. Using an EBSD method by means of a scanning electron microscope with an attached backscattered electron diffraction imaging system, the orientation of every pixel within the measurement area of the surface of the copper alloy bar using a step size of 0.5 μm is measured, and when considering the boundary at which the orientation difference between adjacent pixels is at least 5° to be a crystal grain boundary, the average value of the average orientation difference among every pixel within a crystal grain for every crystal grain is 3.8-4.2°, the tensile strength is 641-708 N/mm2, the spring bending elastic limit is 472-503 N/mm2, and the percentage of stress relaxation after heat treatment at 200°C for 1000 hours is 12-19%.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Disclosed is a pure copper plate production method wherein post-hot-forging and post-hot-rolling cold forging and cold rolling, and subsequent heat processing are unnecessary. Further disclosed is a pure copper plate having a fine structure which is obtained according to the disclosed production method and which is provided with a high special grain boundary ratio due to the formation of a twin crystal structure by means of partial recrystalisation, and is particularly suitable for copper target members for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800˚C. A hot-rolling process is carried out wherein the total rolling rate is 85% or higher, the temperature at rolling completion is 500-700˚C, and which includes at least one finishing rolling pass having a rolling reduction rate for one pass of 5-24%. Then, rapid cooling from the rolling completion temperature to 200˚C or lower is carried out at a cooling speed of 200-1000˚C/min, as required.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C23C 14/34 - Sputtering
• C25D 17/10 - Electrodes
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Disclosed is a production method for a pure copper plate having a fine crystal structure, a suitable hardness, and a high special grain boundary length ratio. Further disclosed is a pure copper plate which is obtained according to the disclosed production method and which is for targets for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800˚C. A hot-rolling process is carried out wherein the rolling rate is 80% or higher and the temperature at rolling completion is 500-700˚C. Next, rapid cooling from the rolling completion temperature to 200˚C or less is carried out at a cooling speed of 200-1000˚C/min, followed by cool rolling at a rolling rate of 5-24%, and annealing.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• C23C 14/34 - Sputtering
• C25D 17/10 - Electrodes
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of Sn, and 0.00005 to 0.0050 mass % of O, wherein a content [Co] mass % of Co and a content [P] mass % of P satisfy a relationship of 2.9≦([Co]−0.007)/([P]−0.008)≦6.1, and the remainder includes Cu and inevitable impurities. The high strength and high conductivity copper alloy pipe, rod, or wire is produced by a process including a hot extruding process. Strength and conductivity of the high strength and high conductivity copper pipe, rod, or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

Disclosed is a simple method for manufacturing pure copper plates which does not involve cold forging or cold pressing after hot forging or hot pressing, or heat processing thereafter; also disclosed is the finely uniform pure copper plate which is obtained by said method, has low residual stress and excellent processability, and is especially suitable as a copper sputtering target material. Pure copper ingots of purity no less than 99.96 wt% are heated to 550-800°C, and after hot pressing with a total press rates of 85% or more and a temperature at press completion of 500-700°C, are quenched at a cooling rate of 200-1000°C/min until the temperature reaches 200°C or less from the aforementioned temperature at press completion.

IPC Classes  ?

• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• B21B 1/38 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets
• B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
• C23C 14/34 - Sputtering
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

2.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

IPC Classes  ?

• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent

Abstract

To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which β phases at an area ratio of 2 to 17% are dispersed in an α-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting.

IPC Classes  ?

• C22C 30/02 - Alloys containing less than 50% by weight of each constituent containing copper
• C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon

Abstract

A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.

IPC Classes  ?

• B21C 1/00 - Manufacture of metal sheets, wire, rods, tubes or like semi-manufactured products by drawing
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• B21C 23/00 - Extruding metalImpact extrusion
• B21C 23/08 - Making wire, rods or tubes
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal

Abstract

Provided is a heat-resistant copper alloy for electronic equipment, the strength of which is not diminished even at a high temperature of 500°C. The material contains 1.5-2.4 mass% of Fe, 0.008-0.08 mass% of P, and 0.01-0.5 mass% of Zn. When observed using a transmission electron microscope, the peak value in a histogram of the diameters of precipitate particles per 1 µm2 is in the range of 15-35 nm diameter, precipitate particles having diameters within said range are present at a frequency of 50% of the total frequency or higher, and their half-value width is 25nm or less.

IPC Classes  ?

• C22C 9/00 - Alloys based on copper
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

The conductive member has a stable contact resistance, resists peeling, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic compound layer (4) is formed between a Ni-based underlayer (3) formed on a Cu-based base material (1), and a Sn-based surface layer (5) that forms the surface. In addition, the Cu-Sn intermetallic compound layer (4) comprises a Cu3Sn layer (6) disposed on the Ni-based underlayer (3) and a Cu6Sn5 layer (7) that is disposed on the Cu3Sn layer (6). The surface roughness of the contact face between the Sn-based surface layer (5) and the Cu-Sn intermetallic compound layer (4) combining the Cu3Sn layer (6) and Cu6Sn5 layer (7) has an arithmetic mean roughness Ra of 0.05-0.25 μm, and the maximum valley depth Rv of the roughness curve is 0.05-1.00 μm. Furthermore, the Cu3Sn layer covers the Ni-based underlayer with a surface coverage of 60-100%.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• H01H 85/06 - Fusible members characterised by the fusible material
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials

Abstract

Disclosed is a conductive member having a stable contact resistance, which is hardly separated and requires a small inserting/drawing force when used as a connector. The conductive member is characterized in that a Cu-Sn intermetallic compound layer (3) and an Sn surface layer (4) are formed in this order on the surface of a Cu substrate (1) through an Ni base layer (2); the Cu-Sn intermetallic compound layer (3) is composed of a Cu3Sn layer (5) arranged on the Ni base layer (2) and a Cu6Sn5 layer (6) arranged on the Cu3Sn layer (5); the Cu-Sn intermetallic compound layer (3) obtained by bonding the Cu3Sn layer (5) and the Cu6Sn5 layer (6) is provided with recesses and projections in the surface which is in contact with the Sn surface layer (4); thicknesses X at the recessed portions (7) are set to 0.05-1.5 μm; the area coverage of the Cu3Sn layer (5) relative to the Ni base layer (2) is not less than 60%; the ratio of the thicknesses Y at the projected portions (8) to the thicknesses at the recessed portions (7) in the Cu-Sn intermetallic compound layer (3) is 1.2-5; and the average thickness of the Cu3Sn layer (5) is 0.01-0.5 μm.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 5/50 - After-treatment of electroplated surfaces by heat-treatment
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials

Abstract

Disclosed is a low-cost high-strength high-conductivity copper alloy rolled sheet which has an alloy composition that contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P, and 0.005-1.4 mass% of Sn with the balance made up of Cu and unavoidable impurities, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. In the high-strength high-conductivity copper alloy rolled sheet, deposits are present in the metal structure, and the deposits have a generally circular or generally elliptical shape and an average grain size of 1.5-9.0 nm. Alternatively, not less than 90% of all the deposits are fine deposits having a size of 15 nm or less, and dispersed uniformly. Due to the presence of fine deposits of Co and P, and the solid solution of Sn, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and heat resistance.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/01 - Alloys based on copper with aluminium as the next major constituent
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

Disclosed is a high-strength high-conductivity copper alloy rolled sheet which contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P and 0.005-1.4 mass% of Sn, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 ≤ ([Co] - 0.007)/([P] - 0.009) ≤ 5.9. The high-strength high-conductivity copper alloy rolled sheet has a total cold rolling reduction of not less than 70%, and a recrystallization ratio of not more than 45% after the final deposition heat treatment process. The recrystallized grains have an average crystal grain size of 0.7-7 μm, the deposits have an average grain size of 2.0-11 nm, and the fine crystals have an average grain size of 0.3-4 μm. The area ratio of the fine crystals relative to the entire metal structure is 0.1-25%. Due to the fine deposits of Co, P and the like, solid solution of Sn, and fine crystals, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and ductility.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/01 - Alloys based on copper with aluminium as the next major constituent
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Abstract

A method for producing a deformed cross-section strip comprises a rough rolling step for rolling a planar material to form a deformed cross-section molding material, a cutting step for cutting the deformed cross-section molding material at the middle position in the width direction of a thick portion or a thin portion at the both side edge portions thereof to form a deformed cross-section slit material, and a correction step for correcting the deformed cross-section slit material to obtain a deformed cross-section strip, wherein rolling is carried out in the rough rolling step such that Δt is 0.01 or less, e is 0.15 or less, D1 is 0.4 or less, and a rough rolling management value X determined by Δt×e×D1 is 5×10-4 or less, assuming the deviation of plate thickness at a thin portion from a target value is Δt, an actual measurement of the radius of curvature at a corner formed by the side surface and the top surface of a tick portion is e (mm), and an actual measurement of curvature per meter-length of the deformed cross-section molding material is D1 (mm), the deformed cross-section molding material is cut in the cutting step such that an actual measurement |A-B| (mm) of the difference in the width from the side edge of the thick portion or thin portion between the both side edge portions is 0.08 or less, and the deformed cross-section slit material is corrected in the correction step such that an actual measurement D2 (mm) of curvature per meter –length of the deformed cross-section molding strip is 0.13 or less.

IPC Classes  ?

• B21B 1/08 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling work of special cross-section, e.g. angle steel
• B21B 27/02 - Shape or construction of rolls

Abstract

Disclosed are high-strength and high-electroconductivity copper alloy pipe, bar, and wire rod. The high-strength and high-electroconductivity copper alloy pipe, bar, and wire rod are produced by a process comprising providing an alloy comprising 0.13 to 0.33% by mass of Co, 0.044 to 0.097% by mass of P, 0.005 to 0.80% by mass of Sn, and 0.00005 to 0.0050% by mass of O with the balance consisting of Cu and unavoidable impurities, Co and P satisfying a requirement of 2.9 ≤ ([Co] - 0.007)/([P] - 0.008) ≤ 6.1, wherein [Co] represents the content of Co, mass%; and [P] represents the content of P, mass%, and hot extruding the alloy. Homogeneous precipitation of Co and P compounds and dissolution of Sn as a solid solution can improve the strength and electroconductivity of the high-strength and high-electroconductivity copper alloy pipe, bar, and wire rod. Further, since the high-strength and high-electroconductivity copper alloy pipe, bar, and wire rod are produced by hot extrusion, a reduction in cost can be realized.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 9/00 - Alloys based on copper
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 5/02 - Single bars, rods, wires or stripsBus-bars
• H01B 5/06 - Single tubes
• C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working