Provided is a charging plug in which it is not necessary to open a hole and onto which a temperature sensor has been attached in a high heat-joining state. This charging plug is provided with: a pin-like plug body (2); a temperature sensor (3); and a metal clip member (4) having been attached to the plug body in a state in which the temperature sensor is in contact with the plug body. The plug body is provided with a pin section (2a) that is inserted into a counterpart connector and plug-in connected thereto, and a plug basal-end section (2b) provided on the basal end-side of the pin section. The clip member, with the temperature sensor being in contact with the plug basal-end section, clasps the temperature sensor between the clip member itself and the plug basal-end section, and is anchored to the plug basal-end section.
H01R 13/66 - Structural association with built-in electrical component
B60L 53/16 - Connectors, e.g. plugs or sockets, specially adapted for charging electric vehicles
G01K 1/14 - SupportsFastening devicesArrangements for mounting thermometers in particular locations
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01R 13/04 - Pins or blades for co-operation with sockets
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
2.
COPPER ALLOY POWDER FOR METAL AM AND METHOD FOR MANUFACTURING ADDITIVE MANUFACTURING PRODUCT
This copper alloy powder for a metal AM is used in the metal AM and includes a copper alloy containing Cr and Zr, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.
A copper alloy powder for a metal AM includes a copper alloy containing Cr, Si, and Ni, and any one or both of a CrSi-based compound containing Cr and Si and a NiSi-based compound containing Ni and Si are precipitated on a copper crystal grain boundary of a surface of a copper alloy particle constituting the copper alloy powder.
x1−xy1−yz1−z−mmmN (where: M is at least one selected from the group consisting of Cr, Mo, Ta, B, Si, W, and lanthanoids; on average, 0.45 ≤ z ≤ 0.65; on average, 0.01 ≤ m ≤ 0.20; and x < z < y).
Provided is a surge protection element capable of reducing damage caused by surges and suppressing fluctuation in discharge start voltage. A surge protection element according to the present invention comprises: an insulating tube (2); a pair of sealing electrodes (3) that close off both end openings of the insulating tube and seal a discharge control gas in the interior thereof; a pair of discharge electrodes (4) in which base ends are in contact with inner surfaces of the sealing electrodes and tip ends protrude into the insulating tube and face each other; and an insulating member (5) sandwiched between tip end surfaces of the pair of discharge electrodes and accommodated inside the insulating tube. The insulating member has a columnar shape having an axial line orthogonal to an axial line of the insulating tube, and is such that groove portions (5a) extending along the axial line of the insulating member are formed in an outer circumferential surface exposed between the pair of discharge electrodes.
This copper alloy powder for a metal AM is formed of a copper alloy containing Cr, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.
B22F 1/16 - Metallic particles coated with a non-metal
B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
A method for manufacturing an insulated circuit board with a heat sink, the circuit board comprising a heat sink including a flat, plate-shaped top plate portion and a heat-dissipating fin, an insulation layer provided on the top plate portion side of the heat sink, and a circuit layer provided on the insulation layer, the method comprising: a material formation step for fabricating the top plate portion separately from the fin; a first bonding step in which the top plate portion is laminated on one surface side of the insulation layer, and a metal plate for the circuit layer is laminated on the other surface side of the insulation layer, followed by bonding the laminated members together; and a second bonding step in which, after the first bonding step, the fin is bonded to a surface of the top plate portion opposite to the surface bonded to the insulation layer.
The present invention is provided with: a substrate (11); a silicon oxide layer (12) formed on at least the front surface of the substrate (11); an electrode layer (13) laminated on the silicon oxide layer (12); and a PZT-based ferroelectric layer (14) laminated on the electrode layer (13). The Pb content in the silicon oxide layer (12) is 1 atom% or less. Preferably, an insulating oxide layer (15) is formed between the silicon oxide layer (12) and the electrode layer (13). Preferably, a conductive oxide layer (16) is formed between the electrode layer (13) and the PZT-based ferroelectric layer (14).
In the present invention, a coating film is formed on a surface of a substrate made of copper or a copper alloy. The coating film comprises: a nickel layer that is composed of nickel or a nickel alloy and is formed on the surface of the substrate; a copper-tin alloy layer that is composed of an alloy of copper and tin and is formed on the nickel layer; and a tin layer that is composed of tin or a tin alloy and is formed on the copper-tin alloy layer. The average thickness of the nickel layer is 0.05 μm to 3.00 μm, the arithmetic mean peak curvature Spc of the surface of the copper-tin alloy layer is 700 mm-1to 2200 mm-1, the average thickness of the tin layer is 0.05 μm to 2.00 μm, and the average thickness of the copper-tin alloy layer is 0.15 μm to 1.55 μm.
A heat-storing thermally conductive material characterized by comprising: a heat storage material; a thermally conductive filler; and an oil-gelling agent or a two-component curable base resin.
22 gas is blown into the lithium carbonate slurry so as to produce lithium bicarbonate, thereby obtaining a lithium bicarbonate solution; a first solid-liquid separation step (S53) in which calcium carbonate suspended in the lithium bicarbonate solution is separated; a purified lithium carbonate crystallization step (S54) in which the lithium bicarbonate solution after the removal of the calcium carbonate is warmed so as to decompose the lithium bicarbonate, thereby precipitating purified lithium carbonate; a second solid-liquid separation step (S55) in which the precipitated purified lithium carbonate is separated from the mother liquid; and a mother liquid returning step (S56) in which the mother liquid obtained in the second solid-liquid separation step (S55) is returned to the slurrying step (S51).
This method for producing lithium carbonate (S04) comprises: a first carbonation reaction step (S41) for adding a soluble carbonate compound to a lithium-containing liquid in which calcium ions are also present and heating to produce calcium carbonate; a first solid-liquid separation step (S42) for separating the calcium carbonate generated in the first carbonation reaction step (S41) and the lithium-containing liquid; a second carbonation reaction step (S43) for adding a soluble carbonate compound to the lithium-containing liquid separated in the first solid-liquid separation step (S42) and heating to produce lithium carbonate; and a second solid-liquid separation step (S44) for separating the lithium carbonate generated in the second carbonation reaction step (S43) and the mother liquor.
This lithium-concentrated liquid production method (S03) is characterized by comprising: a carbonation reaction step (S31) in which a soluble carbonic acid compound is added to a lithium-containing liquid having calcium ions coexisting therein to produce calcium carbonate; a solid-liquid separation step (S32) in which the calcium carbonate produced in the carbonation reaction step (S31) and the lithium-containing liquid are separated; a decarbonation step (S33) in which an inorganic acid is added to the lithium-containing liquid separated in the solid-liquid separation step (S32) and the dissolved carbonic acid compound is removed from the lithium-containing liquid as carbon dioxide gas; and a membrane separation step (S34) in which, after the decarbonation step (S33), a reverse osmosis membrane is used to obtain a lithium-concentrated liquid in which lithium ions in the lithium-containing liquid are concentrated.
This aluminum powder product has powder particle bodies made of aluminum or an aluminum alloy, and barrier layers formed on surfaces of the powder particle bodies. An oxygen content in the aluminum powder product is 0.5 mass % or less, and in a case where a test, in which a mixture obtained by mixing the aluminum powder product and pure water at a mass ratio of 1:100 is held at 80° C. for 12 hours, is performed, no aluminum hydroxide phase is formed on a surface of the aluminum powder product after the test.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Providing technical advice relating to the selection of
cutting tools; providing technical advice relating to the
selection of metalworking machines and tools; technological
consultancy services relating to the selection and usage of
metalworking machines and tools; providing on-line
non-downloadable computer software for the selection of
tools and power tools for machine tools; providing on-line
non-downloadable computer software for the selection of
cutting tools for machine tools; software as a service
[SaaS]; providing online non-downloadable computer software.
16.
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THERMALLY CONDUCTIVE POLYMER COMPOSITION, AND THERMALLY CONDUCTIVE POLYMER
The thermally conductive polymer composition contains a liquid rubber having two or more hydroxyl groups in one molecule, a solvent having one or more hydroxyl groups in one molecule, a curing agent having, in one molecule, two or more functional groups which are reactive with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent, and a filler having thermal conductivity.
C08G 18/28 - Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
This method for leaching an electrode material is a method for subjecting an electrode material of a lithium ion secondary battery to acid leaching, the method including a leaching step of reacting the electrode material of a lithium ion secondary battery with sulfuric acid to obtain a leachate in which metals contained in the electrode material are leached, in which the leaching step includes a sulfuric acid adding step of adding the sulfuric acid to the electrode material to obtain a sulfuric acid-added electrode material, a kneading step of kneading the sulfuric acid-added electrode material to form a leaching paste, and a diluting step of diluting the leaching paste with water.
A thermally conductive filler includes: coarse inorganic particles; and the small inorganic particles, wherein the coarse inorganic particles includes large fused alumina particles having an average particle size in the range of 20 μm or more and 50 μm or less and the medium inorganic particles having an average particle size in the range of 1.0 μm or more and 10 μm or less, in a mass ratio of 60:40 to 100:0, the small inorganic particles have an average particle size of 0.1 μm or more and less than 1.0 μm, and a content of the small inorganic particles is in a range of 15% by mass or more and 30% by mass or less.
A turning tool according to the present invention includes a tool main body that extends along a tool axis (J) and that has a base at a tip portion on one side in an axial direction (Dj) along the tool axis (J), a cutting insert detachably attached to the base, and a camera provided in the tool main body and configured to image a machined surface of a work material cut by the cutting insert, in which the camera is disposed to image an outer side in a radial direction (Dr) of the tool main body intersecting with the axial direction (Dj).
A cutting tool includes a lower layer having an average thickness At from 0.3 μm to 6.0 μm and an upper layer having an average thickness Bt from 0.1 to 3.0 μm, and 2.0≤At/Bt≤5.0; the lower layer includes an alternating laminate of A1α sublayers with an average thickness αt and A1β sublayers with an average thickness βt, and 0.5 nm≤αt≤4.0 nm, 0.5 nm≤βt≤4.0 nm, and 0.7≤βt/αt≤1.3; the A1α sublayers each have a composition AlxTi1-xN (the average xavg of x is 0.35≤xavg≤0.55); the A1β sublayers each have a composition AlyTi1-yN (average yavg of y is 0.60≤yavg≤0.80); 1.2≤yavg/xavg; and the upper layer has a composition AlaTi1-a-bSibN (average values of aavg and bavg are represented by 0.35≤aavg≤0.60 and 0.00
B23B 27/14 - Cutting tools of which the bits or tips are of special material
C22C 29/00 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides
C22C 29/08 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
C25D 9/12 - Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
21.
RESIN COMPOSITION, RESIN MOLDED BODY, AND METHOD FOR PRODUCING RESIN COMPOSITION
A resin composition includes a thermoplastic resin; a carbon fiber; and a silane coupling agent, in which a content of the thermoplastic resin is within a range of 59 parts by mass or more and 88 parts by mass or less, a content of the carbon fiber is within a range of 1 part by mass or more and 18 parts by mass or less, and a content of the silane coupling agent is within a range of 0.3 parts by mass or more and 7 parts by mass or less, with respect to a total of 100 parts by mass of the resin composition, and the carbon fiber is an isotropic pitch-based carbon fiber.
This heat transfer member is a heat transfer member constituted of a fired body of a molded object including a fluorine-based resin or a fluorine-based elastomer, in which a hardness measured using a type AM durometer conforming to JIS K 6253-3:2012 is lower by 7 or greater than a hardness of the molded object. This heat transfer member has a high plasma resistance and can maintain a high state of adhesion with respect to various members over a long period of time.
A surface coated cutting tool includes a substrate and a coating layer. The coating layer includes a complex carbonitride layer. The complex carbonitride layer has an average thickness of 1.0 μm or more and 20.0 μm or less. The complex carbonitride layer includes NaCl-type face-centered cubic crystal grains, each containing: metal components Ti, V, Zr, and Nb in atomic fractions a1, a2, a3, and a4, respectively, where the total atomic fraction of the metal components in the layer is 1; non-metallic components C and N in atomic fractions b1 and b2, respectively, where the total atomic fraction of the non-metallic components is 1; and inevitable impurities. The atomic fractions a1, a2, a3, a4, b1, and b2 satisfy the relations:
A surface coated cutting tool includes a substrate and a coating layer. The coating layer includes a complex carbonitride layer. The complex carbonitride layer has an average thickness of 1.0 μm or more and 20.0 μm or less. The complex carbonitride layer includes NaCl-type face-centered cubic crystal grains, each containing: metal components Ti, V, Zr, and Nb in atomic fractions a1, a2, a3, and a4, respectively, where the total atomic fraction of the metal components in the layer is 1; non-metallic components C and N in atomic fractions b1 and b2, respectively, where the total atomic fraction of the non-metallic components is 1; and inevitable impurities. The atomic fractions a1, a2, a3, a4, b1, and b2 satisfy the relations:
0.01
≤
a
1
≤
0.6
,
0.01
≤
a
2
≤
0.6
,
0.01
≤
a
3
≤
0.6
,
0.01
≤
a
4
≤
0.6
,
0.2
≤
b
1
≤
0.8
,
and
0.2
≤
b
2
≤
0.8
.
A copper alloy catalyst according to the present invention is characterized by being composed of a bulk material of a copper alloy which contains one or more kinds of alloy elements that are selected from among Zn, Al, Ca, Mg, Ni, Si, Mn, In, Fe, Co, Ag, and Sn, and which has a Cu content of 50 atom% or more. The copper alloy catalyst is also characterized in that if a droplet of ion exchange water is dropped on the surface of the bulk material, the contact angle measured by a θ/2 method is 95° or more.
B01J 23/80 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with zinc, cadmium or mercury
B01J 23/78 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with alkali- or alkaline earth metals or beryllium
B01J 23/89 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with noble metals
B01J 23/825 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with gallium, indium or thallium
B01J 23/835 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with germanium, tin or lead
C07C 29/154 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the catalyst used containing copper, silver, gold, or compounds thereof
C07C 29/156 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the catalyst used containing iron group metals, platinum group metals, or compounds thereof
C22C 9/01 - Alloys based on copper with aluminium as the next major constituent
C22C 9/02 - Alloys based on copper with tin as the next major constituent
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22C 9/05 - Alloys based on copper with manganese as the next major constituent
C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
C22C 9/10 - Alloys based on copper with silicon as the next major constituent
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C25B 9/00 - Cells or assemblies of cellsConstructional parts of cellsAssemblies of constructional parts, e.g. electrode-diaphragm assembliesProcess-related cell features
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
Kobayashi Keigo
Kato Jun
Hirayama Yusuke
Liu Zheng
Takagi Kenta
Abstract
This powder for sintering contains: a primary powder composed of aluminum or an aluminum alloy; and an oxide of at least one rare earth metal element selected from scandium, yttrium, and lanthanoid elements. This powder (1) for sintering is composed of a mixed powder having: particles (2) of a primary powder composed of aluminum or an aluminum alloy; and additive particles (3) composed of an oxide of at least one rare earth metal element selected from scandium, yttrium, and lanthanoid elements, wherein at least some of the additive particles (3) may adhere to the surface of the particles (2) of the primary powder.
B22F 1/16 - Metallic particles coated with a non-metal
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
C22C 1/04 - Making non-ferrous alloys by powder metallurgy
A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.
The thermally conductive polymer composition includes: a liquid rubber having two or more hydroxyl groups in one molecule; a solvent having one or more hydroxyl groups per molecule; a curing agent having two or more functional groups capable of reacting with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent in one molecule; and a filler, wherein a compression modulus of a cured thermally conductive polymer at room temperature is 4.5N/mm2 or more and 5.5N/mm2 or less, the cured thermally conductive polymer being obtained after mixing the thermally conductive polymer composition and then allowing the thermally conductive polymer composition that is mixed to stand in an atmosphere at 25° C. for 24 hours or more.
In an aluminum powder product for metal additive manufacturing, a purity of aluminum in the entire powder is 98 mass % or more, 0.01 mass % or more and 0.5 mass % or less of Mg is contained, and a ratio Mg amount/oxygen amount of a contained amount of Mg (mass %) to a contained amount of oxygen (mass %) is 0.1 or more and 2.0 or less.
Provided is a porous Cu member which comprises: a member main body (11) that is formed of Cu or a Cu alloy and has a porous structure; and a nano-Cu structure layer (16) that is formed on at least a part of the surface of the member main body (11). The member main body (11) has a porosity in the range of 38% to 95% inclusive and a thickness in the range of 0.1 mm to 1.0 mm inclusive. The nano-Cu structure layer (16) is configured as a layer by laminating Cu particles, which have an average length of 20 µm to 1 nm, on the surface.
A heatsink-integrated insulated circuit board includes a heatsink, an insulation layer formed on a top plate part of the heatsink, and a circuit layer formed on a surface of the insulation layer opposite to the heatsink, in which an electronic component is mounted on a mounting surface of the circuit layer. The circuit layer is made of copper or a copper alloy, and when a component occupancy ratio, which is a ratio of an occupied area of the electronic component to an area of the mounting surface of the circuit layer, is defined as X and a ratio λR/tR of a thermal conductivity λR of the insulation layer to a thickness tR of the insulation layer is defined as Y, in a range in which the component occupancy ratio X is 0.6 or less, a thickness tC of the circuit layer is set within a range of 0.7×(−5X−0.005Y+4.5)≤tC≤1.3×(−5X−0.005Y+4.5).
A method for processing a lithium ion secondary battery includes: a crushing and sorting step (S02) of crushing and classifying a lithium ion secondary battery to obtain an electrode material containing at least lithium; a leaching step (S03) of immersing the electrode material in an acid to obtain a leachate; a pH adjustment step (S04) of adding lithium hydroxide to the leachate to adjust a pH; a metal recovery step (S05) of recovering a metal other than lithium in the leachate to obtain a lithium-containing liquid; and a lithium hydroxide recovery step (S06) of recovering lithium in the lithium-containing liquid as lithium hydroxide, in which the lithium hydroxide recovered in the lithium hydroxide recovery step (S06) is used in the pH adjustment step (S04).
The surface coated cutting tool has the same multiple cutting edges. The coating layer of the flank face has a composition represented by (AlxTi1-x) (CyN1-y) (the average content xavg of x is 0.60 to 0.95 and the average content yavg of y's is 0.0000 to 0.0050); the crystal grains in each flank face have an average value I(200) of 200 diffraction intensities and a standard deviation σI(200), where the σI(200)/I(200) is 0.00 to 0.20; the average value Lavg and standard deviation σL of the thicknesses Lm's of the coating layer on a line 100 μm away from the ridge of each cutting edge in the direction of the flank face is within a σL/Lavg of 0.00 to 0.20; and the coating layer on each flank face has a region containing variable amounts of Al and Ti, and the difference between the maximum xmax and the minimum xmin is 0.02 to 0.40.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
34.
THERMOPLASTIC ELASTOMER COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND HEAT-DISSIPATING STRUCTURE
The thermoplastic elastomer composition contains a base polymer containing a styrene-based thermoplastic elastomer and an ethylene-propylene-based rubber, and a thermally conductive filler, in which the thermoplastic elastomer composition contains 200 parts by mass or more and 4,000 parts by mass or less of the thermally conductive filler with respect to 100 parts by mass of the base polymer.
Provided is a catalyst for hydrogen generation comprising a mixture of tungsten carbide and cobalt, the catalyst for hydrogen generation being characterized in that the absolute value of the cathode current per mg of the catalyst is 0.10 mA/mg or more when the catalyst for hydrogen generation is loaded on a glassy carbon electrode and subjected to potential scanning at -1.2 V with respect to a silver/silver chloride reference electrode under nitrogen bubbling in a 1 mol/L sodium hydroxide aqueous solution.
B01J 35/70 - Catalysts, in general, characterised by their form or physical properties characterised by their crystalline properties, e.g. semi-crystalline
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of at least one catalytic element and at least one catalytic compoundElectrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
36.
LITHIUM SULFIDE AND METHOD FOR MANUFACTURING SULFIDE SOLID ELECTROLYTE
The purpose of the present invention is to provide: lithium sulfide that has sufficiently high purity and is particularly suitable as a feedstock for a sulfide solid electrolyte; and a method, for manufacturing a sulfide solid electrolyte, that uses this lithium sulfide. The present invention pertains to: lithium sulfide characterized in that the L*value (brightness) as defined in the L*a*b* color space is 85 or more; and a method for manufacturing a sulfide solid electrolyte, the method being characterized in that the aforementioned lithium sulfide is used as a feedstock.
Provided is a sulfide solid electrolyte that is characterized by having an LGPS type crystal structure belonging to the space group P42/nmc, and is characterized in that the half value width of a peak of 2θ=29.58°±1.0° is 0.1 or less in an X-ray diffraction measurement using CuKα rays.
H01B 1/10 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances sulfides
C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
38.
DIMENSION MEASUREMENT DEVICE, CUTTING TOOL SYSTEM, AND DIMENSION MEASUREMENT METHOD
This dimension measurement device comprises a sensor unit (3) and a measurement device body (100). The sensor unit (3) includes a first distance sensor (31) that uses an eddy current sensor, and a signal conversion unit (35A, 35B) that outputs, as a detection value, an output signal from the distance sensor for each preset time interval. The measurement device body (100) is provided with: a detection control unit (101) that causes the sensor unit (3) to detect the distance to a material being cut while rotating the material being cut; an acquisition unit (103) that acquires a plurality of detection values outputted from the sensor unit (3) for each time interval within a preset stipulated time; a calculation unit (105) that calculates the average value of the plurality of detection values acquired by the acquisition unit (103); and a result output unit (107) that outputs a measurement result for the material being cut, the measurement result being based on the average value of the detection values that was calculated by the calculation unit (105).
B23Q 17/20 - Arrangements for indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
Provided is a copper-clad laminate (10) in which a base material (11) containing a fluororesin and a metal copper layer (12) are laminated, the copper-clad laminate (10) being characterized in that: an alloy layer (13) is formed between the base material (11) and the metal copper layer (12), the alloy layer (13) being composed of 25.0-75.0 at% Co, with the balance being Mo and unavoidable impurities; and the metal copper layer (12) has a copper plating layer.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
A method for manufacturing a copper alloy powder for a metal AM includes a casting step of manufacturing a copper alloy ingot with a casting apparatus including a molten copper supply unit which melts a copper raw material consisting of high-purity copper having a purity of 99.99 mass % or more to obtain molten copper, an addition unit which adds alloy elements of a copper alloy to the molten copper, and a mold to which the molten copper alloy is supplied, and an atomizing treatment step of powdering the copper alloy ingot by performing melting and decomposing by an atomizing treatment in an inert gas or a vacuum atmosphere using the copper alloy ingot, in which the O concentration of the copper alloy ingot is set to 10 mass ppm or less, and the H concentration of the copper alloy ingot is set to 5 mass ppm or less.
B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
B33Y 70/00 - Materials specially adapted for additive manufacturing
COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL APPARATUS, COMPONENT FOR FLEXIBLE DEVICE, COMPONENT FOR HEAT DISSIPATION, AND METAL SEALING MATERIAL
Provided is a copper alloy having a composition containing 15 to 57 mass% of Zn, containing 12 mass% or less of Al, and having a Zn content of A mass% and an Al content of B mass% where A + 5 × B ≥ 30 and A + 3.5 × B ≤ 57 are satisfied, with the balance being Cu and unavoidable impurities. The copper alloy has a β-phase volume fraction of 50% or greater, the average value of Kernel average misorientation (KAM) values of the β phase is 2.0° or less, said average value having been obtained by measuring a measurement area of 1 mm2 or greater using an EBSD method at measurement intervals of 1-μm steps and excluding measurement points at which a CI value obtained by being analyzed using data analysis software OIM is 0.1 or less. The copper alloy has excellent conductivity, a low Young's modulus, and a sufficiently large elastic deformation amount, and is not likely to plastically deform even when subjected to significant deformation.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22C 18/02 - Alloys based on zinc with copper as the next major constituent
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
42.
COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COMPONENT FOR FLEXIBLE DEVICE, HEAT DISSIPATION COMPONENT, AND METAL SEALING MATERIAL
A copper alloy according to the present invention has a composition comprising 15-57 mass% of Zn and 12 mass% or less of Al, with the remainder being Cu and inevitable impurities, and when the content of Zn is denoted by A mass% and the content of Al is denoted by B mass%, the composition satisfies A+5×B ≥ 30 and A+3.5×B ≤ 57. A volume fraction of a β-phase is 50% or more, and when a measurement area of 8 mm2 or more is measured at a measurement interval of 8 μm steps by an EBSD method and analyzed except at measurement points at which an CI value analyzed by data analysis software OIM is 0.1 or less, and a boundary between measurement points at which an orientation difference between adjacent measurement points is 5º or greater is defined as a crystal grain boundary, the ratio of each corresponding grain boundary length of 3 ≤ Σ ≤ 29 to all crystal grain boundary lengths L where the measured β-phases contact each other is 4% or more. The copper alloy has excellent conductivity, has a low Young's modulus and a sufficiently large elastic deformation amount, and does not easily undergo plastic deformation even when subjected to large deformation.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22C 18/02 - Alloys based on zinc with copper as the next major constituent
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
In this drill, a cutting blade (7) has a thinning blade (70) that is disposed at a radial inner end part of the cutting blade (7), and a main cutting blade (71) that is disposed on the radially outer side of the thinning blade (70) and that is connected to a leading edge (12) via an outer peripheral corner (15), the main cutting blade (71) and the leading edge (12) having honing in which a cross section perpendicular to ridge line parts has a convex curve shape, the honing curvature radius at a position within 1.5 mm from the outer peripheral corner (15) toward the rear end side of the leading edge (12) being 25-80 μm, and being smaller than the honing curvature radius of a radial outer end part connected to the outer peripheral corner (15) of the main cutting blade (71).
In a drill according to the present invention, a thinning blade, a main cutting blade, and a leading edge each have honing (H) where a cross section perpendicular to each ridge line part is formed in a convex curved shape. In this cross section, among both end parts (h1) and (h2) of the honing H, a surface connected to the first end part (h1) is defined as a first surface (101), a surface connected to the second end part (h2) is defined as a second surface (102), the distance to the first end part h1 from an intersection point P of an extension line of the first surface (101) and an extension line of the second surface (102) is defined as a first width dimension (L1), the distance to the second end part h2 from the intersection point P is defined as a second width dimension (L2), and [L1/L2] is defined as a width ratio. The thinning blade and the main cutting blade each have the first surface (101) as a rake face, and the second surface (102) as a flank face, and the width ratio of the thinning blade is larger than the width ratio of a radial outer end part connected to an outer peripheral corner of the main cutting blade.
This Cu-Zn-Si-Pb-P-based alloy continuous cast wire rod material comprises more than 60.0 mass% but less than 65.0 mass% of Cu, Si in the range of 0.40 mass% to 1.20 mass% inclusive, Pb in the range of 0.002 mass% to 0.250 mass% inclusive, and P in the range of 0.040 mass% to 0.190 mass% inclusive, and comprises, as an optional element, 0.001 mass% to 0.100 mass% inclusive of Bi, with the balance being Zn and impurities, wherein: the total content of Fe, Mn, Co, and Cr, which are impurities, is 0.450 mass% or less; the total content of Sn and Al is 0.30 mass% or less; and in a cross section perpendicular to the casting direction, the area ratio between the α phase and the β phase is α:β = 40 to 70:60 to 30, the area ratio of the γ phase is 0.1% or less, and the area ratio of a fine α phase in which the particle diameter is 10 μm or less is 30% to 60% inclusive.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
B22D 11/00 - Continuous casting of metals, i.e. casting in indefinite lengths
B22D 11/04 - Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
B23B 1/00 - Methods for turning or working essentially requiring the use of turning-machinesUse of auxiliary equipment in connection with such methods
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
42 - Scientific, technological and industrial services, research and design
Goods & Services
Providing technical advice relating to the selection of cutting tools; providing technical advice relating to the selection of metalworking machines and tools; technological consultancy services relating to the selection and usage of metalworking machines and tools; providing on-line non-downloadable computer software for the selection of tools and power tools for machine tools; providing on-line non-downloadable computer software for the selection of cutting tools for machine tools; software as a service [SaaS]; providing online non-downloadable computer software.
This WC-based cemented carbide, which is suitable for a substrate of a surface-coated cutting tool or the like, contains 6.0-10.0 mass% of Co, 0.08-0.90 mass% of Cr (where the ratio Cr content (mass%)/Co content (mass%) is 10% or lower), 0.0-3.8 mass% of M (where M is one or more of V, Ta, Nb, Ti, and Zr), and 4.5-7.5 mass% of C, the balance being W and unavoidable impurities. The WC-based cemented carbide has a binder phase, a hard phase, and a γ phase, the binder phase containing Co as the main component, the hard phase containing a carbide of W as the main component, and the γ phase containing a carbide of M as the main component. In crystal particles constituting the hard phase, the grain diameter C99 (μm) for 99% cumulative particle count is 3.30 or lower, and the ratio C99/C50 (grain diameter C99 (μm) for 99% cumulative particle count to grain diameter C50 (μm) for 50% cumulative particle count) is 4.80-6.50. The proportion (L) of the phase interface length along which the hard phase and the binder phase are in contact with respect to the total phase interface length of the hard phase is 35% or greater.
C22C 29/08 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
C22C 1/051 - Making hard metals based on borides, carbides, nitrides, oxides or silicidesPreparation of the powder mixture used as the starting material therefor
C22C 27/04 - Alloys based on tungsten or molybdenum
A surface-coated cutting tool includes a substrate and a coating layer provided on the substrate, wherein
1) the coating layer includes an alternating layer of A sublayers and B sublayers,
2) the A sublayers are each A Al1-aTiaN (where 0.30≤a≤0.70),
3) the B sublayers are each Cr1-cM2cN (where M2 is B and/or Si, where 0.01≤c≤0.40),
4) the A and B sublayers each have an average thickness of 1 nm or more and 500 nm or less, and
5) the alternating layer has an average thickness of 0.3 μm or more and 7.0 μm or less,
6) the adjoining A and B sublayers satisfy the relation: 0.1≤TA/TB≤0.8 or 1.2≤TA/TB≤10.0, where TA is the average thickness of the A sublayers and TB is the average thicknesses of the B sublayers.
Performance is improved. There is provided a negative electrode material for a battery, in which the negative electrode material includes carbon, sodium tungstate, and silicon particles 33 including silicon, and in the silicon particle 33, a ratio of the amount of Si in Si2p derived from elemental silicon to the amount of Si in Si2p derived from SiO2 in a surface layer when measured by X-ray photoelectron spectroscopy is 3 or more on an atomic concentration basis.
A copper/ceramic bonded body (10) formed by bonding copper member (12, 13) and a ceramic member (11), wherein the copper member has a Cu content of at least 99.96 mass%, and the ratio C/D is 0.93-1.05, where C is the proportion of KAM values of 0.25° or less in a measurement field of view arranged around a grain boundary triple point, and D is the proportion of KAM values of 0.25° or less within grains on the basis of the observation of a cross section of the copper member along a thickness direction after 3000 cycles of a thermal cycle test including holding at -65°C for 5 minutes and then holding at 150°C for 5 minutes in a liquid bath per cycle.
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
This copper/ceramic joined body is obtained by joining a copper member and a ceramic member. The copper member has a Cu content of at least 99.96 mass%, and has, in a cross section along the thickness direction of the copper member, an average crystal grain size of at most 100 μm after performing 3000 cycles of a heat cycle test in which the copper member is, in a liquid tank, held at -65°C for 5 minutes and then held at 150°C for 5 minutes in a single cycle.
A hafnium compound-containing sol-gel liquid contains an alcohol as a solvent and a hafnium compound as a hafnia source, in which the hafnium compound-containing sol-gel liquid contains one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, a mass ratio WM/WHf of a content WM of the elements M to a content WHf of Hf as a metal component is within a range of 0.2% or more and 5.0% or less. A hafnia-containing film containing hafnia (HfO2) and one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, and in which a mass ratio WM/WHfO2 of a content WM of the elements M to a content WHfO2 of the HfO2 is within a range of 0.05% or more and 5.0% or less.
B01J 13/00 - Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided forMaking microcapsules or microballoons
This method for separating cobalt and nickel includes a step (S3) of immersing an electrode material of a lithium ion secondary battery in a treatment liquid containing sulfuric acid and hydrogen peroxide to obtain a leachate, a step (S4) of adding a hydrogen sulfide compound to the leachate to precipitate copper, either one of a first treatment step (S5A) or a second treatment step (S5B), a step (S6) of obtaining a precipitate substance containing cobalt sulfide and nickel sulfide and a residual liquid containing lithium, and a re-dissolution step (S7) of dissolving cobalt and nickel in a suspension obtained by suspending the precipitate substance in distilled water or dilute sulfuric acid, in which, in the re-dissolution step (S7), the suspension is bubbled with an oxidizing gas containing oxygen using a fine-bubble generation apparatus.
Provided are: a tin oxide particle dispersion in which tin oxide particles are dispersed in a solvent, from which it is possible to form a tin oxide particle laminated film having excellent conductivity as a result of the tin oxide particles being arranged uniformly, and which is characterized by having a zeta potential of -35 mV or less at pH 10; and a method for producing a tin oxide particle laminated film. The tin oxide particles may be doped with a different element. The different element is preferably one or more selected from antimony, fluorine, and phosphorus. The primary particle size of the tin oxide particles is preferably in the range of 1.5-100 nm.
In the present invention, the following steps are carried out: a leaching step S01 in which a lithium-containing substance is immersed in an acidic solution to leach lithium into the acidic solution, thereby obtaining a lithium leachate; a heavy metal and first fluorine precipitation step S02 in which a first calcium compound is added to the lithium leachate to produce a metal hydroxide precipitate and a fluorine-containing precipitate; a first solid-liquid separation step S03 in which the precipitated metal hydroxide precipitate and fluorine-containing precipitate are removed from the lithium leachate; a second fluorine precipitation step S04 in which a second calcium compound is added to the lithium leachate from which the precipitates have been removed, to precipitate dissolved fluorine; and a second solid-liquid separation step S05 in which the precipitated dissolved fluorine and unreacted second calcium compound are removed from the lithium leachate.
2 or more is measured by an EBSD method at a measurement interval of 1 μm, measurement points at which a CI value obtained by an analysis using data analysis software OIM is 0.1 or less are excluded, and boundaries between adjacent pixels with a misorientation of 5° or more are regarded as crystal grain boundaries, an average of local orientation spread (LOS) is 2.00° or less.
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
In a cutting insert and an edge replaceable end mill according to the present invention, a cutting blade (14) has: a main cutting blade (17) that is disposed on a first side of four sides of a quadrangular surface (11); a sub-cutting blade (18) that is disposed on a second side; and a corner blade (19). The sub-cutting blade (18) has a curved blade part (18a) that is connected to the corner blade (19), and forms a curved shape protruding toward a front side; and a linear blade part (18b) that is connected to the curved blade part (18a), and linearly extends toward a rear side as extending toward the side opposite to the curved blade part (18a) in the left-right direction. A flank (16) has: a first sub-flank (16b) that is connected to the curved blade part (18a), and forms a curved surface shape protruding toward the front side; and a planar second sub-flank (16c) that is connected to the linear blade part (18b).
Provided is an insulated circuit board in which a metal layer formed from pure aluminum is bonded to at least one surface of a ceramic substrate. In this circuit board: the pure aluminum is aluminum having a purity of 99.9%mass or more; a slip plane of metal crystal in the metal layer and the bonding interface with the ceramic substrate form an angle of 40° or less; and a second metal layer formed from any of aluminum, an aluminum alloy, copper, or a copper alloy may be bonded on the metal layer.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/04 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
59.
Pure copper material, insulating substrate, and electronic device
This pure copper material includes Cu in an amount of 99.96 mass % or more, either one or both of one or more A-group elements selected from Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and one or more B-group elements selected from O, S, Se, and Te are included in a total amount of 10 mass ppm or more and 300 mass ppm or less, an average crystal grain size in a rolled surface is 15 μm or more, and a high-temperature Vickers hardness at 850° C. is 4.0 HV or more and 10.0 HV or less.
An adhesive structure according to the present invention is characterized in that a tube array structure (20) formed by erecting a plurality of tube bodies (21) formed from a metal oxide is formed on at least a portion of the surface of a base material that comprises an inorganic material. The adhesive structure can be stably used even in high-temperature environments and clean environments and makes it possible to achieve sufficient adhesive force. The metal oxide is preferably an aluminum oxide or a titanium oxide. The tube bodies (21) preferably have an average outer diameter D of at least 40 nm and an average height H of at least 300 nm.
Provided is a program for instructing a processor of a map creation device, which communicates with a monitoring device that includes one or more sensors and moves together with a user being monitored, to execute: a process for acquiring an output value of the sensor of the monitoring device and the location of the user of the monitoring device; a process for determining that a prescribed event has occurred to the user of the monitoring device on the basis of information acquired from the monitoring device; a process for creating map information for displaying a map image representing the number or frequency of the events for each place where the prescribed event has occurred; and a process for outputting the map information to another terminal device.
G08G 1/13 - Traffic control systems for road vehicles indicating the position of vehicles, e.g. scheduled vehicles to a central station the indicator being in the form of a map
G09B 29/00 - MapsPlansChartsDiagrams, e.g. route diagrams
G09B 29/10 - Map spot or co-ordinate position indicatorsMap-reading aids
Provided is an adhesive structure in which a fiber structure layer configured from a plurality of fiber bodies composed of an inorganic material is formed on at least a portion of the surface of a base material composed of an inorganic material, the equivalent circle diameter D of a cross-section orthogonal to the extension direction of a fiber body (21) constituting the fiber structure layer is within the range of 15-400 nm, an aspect ratio H/D calculated from the height H and the equivalent circle diameter D of the fiber body (21) is 3 or greater, and the adhesive structure can be stably used even in a high-temperature environment and a clean environment and can achieve sufficient adhesive force.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
63.
MONITORING DEVICE, MONITORING MANAGEMENT DEVICE, AND MONITORING SYSTEM
This monitoring device is incorporated into or accommodated in a shoe and is detachably attached thereto, the monitoring device comprising: one or more left-foot pressure sensors; one or more right-foot pressure sensors; and a determination unit that acquires output values from the one or more left-foot pressure sensors and the one or more right-foot pressure sensors, and determines that the user has fallen when all of the output values indicate values lower than a threshold value.
G08B 25/04 - Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using a single signalling line, e.g. in a closed loop
A43B 3/44 - Footwear characterised by the shape or the use with electrical or electronic arrangements with sensors, e.g. for detecting contact or position
A43B 3/48 - Footwear characterised by the shape or the use with electrical or electronic arrangements with transmitting devices, e.g. GSM or Wi-Fi®
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
A61B 5/022 - Measuring pressure in heart or blood vessels by applying pressure to close blood vessels, e.g. against the skinOphthaldynamometers
A61B 5/0245 - Measuring pulse rate or heart rate using sensing means generating electric signals
G01S 1/68 - Marker, boundary, call-sign, or like beacons transmitting signals not carrying directional information
G01S 5/14 - Determining absolute distances from a plurality of spaced points of known location
G08B 21/02 - Alarms for ensuring the safety of persons
G08B 25/08 - Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using communication transmission lines
G08B 25/10 - Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using wireless transmission systems
This drill (1) comprises a shaft-shaped tool body (10) that is rotated about a central axis, the drill having a chip discharge groove (14) formed on the outer periphery of the tool body (10), and a cutting blade (15) formed at an intersecting ridge portion between the chip discharge groove (14) and a tip flank (13) of the tool body (10)). The tool body (10) has a base material and a hard coating (17) formed in a region of a prescribed length from the tip of the base material. The chip discharge groove (14) has, in the central axis direction, in order from the tip of the tool body (10), a first section (S1) having a first surface roughness and a second section (S2) positioned closer to the rear end side than the first section (S1) and having a second surface roughness less than the first surface roughness. The first section (S1) has a length of at least 0.5 times a tool diameter (D). The hard coating (17) is formed in the first section (S1), and a hard coating (S17) is not formed in the second section (S2).
A titanium substrate material includes: a substrate main body made of a sintered titanium particle body; and a titanium oxide film formed on the substrate main body, wherein a proportion of anatase titanium oxide among titanium oxide constituting the titanium oxide film is 90% or more. It may have a porosity of the substrate main body is within a range of 30% or more and 92% or less. It may have a compressive strength of the titanium substrate is 0.5 MPa or more.
C25B 11/077 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound the compound being a non-noble metal oxide
66.
ALUMINUM POWDER MIXTURE, METAL POWDER FOR ADDITIVE MANUFACTURING, AND METAL ADDITIVE MANUFACTURING PRODUCT
This aluminum powder mixture is an aluminum powder mixture obtained by mixing two or more powders containing aluminum, in which an oxygen content of the aluminum powder mixture is 0.3 mass % or less, and a total content of one or more elements selected from Ca, Cu, Fe, Mg, Mn, Ni, Si, and Zn contained in the aluminum powder mixture is 0.4 mass % or more and 5.0 mass % or less.
This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
C09J 1/00 - Adhesives based on inorganic constituents
A ball end mill includes an end mill body; a chip discharge groove, a first gash, and a bottom cutting edge. A second gash is formed at an interval from the bottom cutting edge on at least a first wall surface of the first gash. A minimum curvature radius in a cross section perpendicular to an axis of the second gash is larger than a minimum curvature radius in a cross section perpendicular to an axis of a groove bottom portion of the first gash.
This copper alloy powder includes a copper alloy that contains 5% by mass or more and 50% by mass or less of Ni. This copper alloy powder may contain 45% by mass or more and 95% by mass or less of Cu. This copper alloy powder may contain 1% by mass or more and 42% by mass or less of Zn. This copper alloy powder may contain 7% by mass or less of Mn.
Provided is a bonded body (10) obtained by bonding a first member (11) and a second member (12) with a bonding layer (13) interposed therebetween. The bonded body (10) is characterized in that the bonding layer (13) is composed of an Au-Sn alloy and has a thickness of less than 10 μm, and the area ratio of deformed voids having a roundness of 60% or less in the bonding layer (13) is less than 15% of the bonding area of the bonding layer (13). The area ratio of voids in the bonding layer (13) is preferably less than 25% of the bonding area thereof.
A tungsten compound is appropriately disposed on a surface of carbon. The negative electrode material is a negative electrode material for a battery that includes amorphous carbon and sodium tungstate is attached on a surface on the amorphous carbon and provided on the surface of the amorphous carbon. The sodium tungstate may have at least one of a cubic crystal and a tetragonal crystal.
This copper alloy has a composition containing Mg in an amount of 0.10 mass % or greater and 2.6 mass % or less, with a balance being Cu and inevitable impurities, in which in a plastic deformation region of a stress-strain curve obtained in a low-speed tensile test at a strain rate of 1.0×10−6/s, an average value of a period of a strain of a saw edge-shaped curve is 0.01% or greater and 1.0% or less, an average value of a difference in level of stress of the saw edge-shaped curve is 0.1 MPa or greater and 2 MPa or less, and there are five or more saw edge-shaped curves with a period of strain of 0.01% or greater and 1.0% or less and a difference in the level of stress of 0.1 MPa or greater and 2 MPa or less.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
39 - Transport, packaging, storage and travel services
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Iron and steel; common metals and their alloys; common
metals, unwrought or semi-wrought; nonferrous metals and
their alloys; copper and its alloys; metal materials for
building or construction; metal pulleys, springs and valves
[not including machine elements]; metal pipe couplings;
metal flanges; small items of metal hardware; industrial
packaging containers of metal; metal nameplates and door
nameplates; joinery fittings of metal; metal safes. Metalworking machines and tools; drilling bits [parts of
metalworking machines]; metal working machines; metal
cutting tools [parts of machines]; cutting tools for
machinery; cemented carbide cutting tools; drilling tools
for use with metalworking machines; boring tools operated by
metalworking machine; power operated metalworking machine
tools, namely, turning tools; power operated metalworking
machine tools, namely, grooving tools; milling tools [parts
for metalworking machines]; tool holders for metalworking
machines [machine parts]; drill chucks [parts of machines];
holders of cutting tools for machinery; end mills
[machines]; bits for power drills; tool bits for
metalworking machines; mining machines and apparatus; bits
for mining machines; construction machines and apparatus;
loading-unloading machines and apparatus; semiconductor
manufacturing machines; stone working machines and
apparatus; non-electric prime movers, not for land vehicles;
parts of non-electric prime movers; machine elements, not
for land vehicles. Measuring or testing machines and instruments; power
distribution or control machines and apparatus; rotary
converters; phase modifiers; solar batteries; electrical
cells and batteries; electric or magnetic meters and
testers; electric wires and cables; telecommunication
machines and apparatus; personal digital assistants;
semiconductor wafers; electronic data processing apparatus;
computer software, recorded; computer software,
downloadable; computer application software, downloadable;
application software; monitors [computer programs]; computer
programs, recorded; computer programs, downloadable;
magnetic cores; resistance wires; electrodes; downloadable
image files; recorded video discs and video tapes;
electronic publications. Transport by rail; transport by car; vessel transport;
transport by air; collection of recyclable goods
[transportation]; warehousing services; distribution of
energy; distribution of renewable energy; distribution of
gas; electricity distribution; distribution of heat;
collection of waste and trash. Metalworking; processing of rubber; processing of plastics;
ceramic processing; woodworking; paper treating; stone
treating; recycling of waste; recycling of waste metals;
rental of metal treating machines and tools; sorting and
disposal of waste and trash.
A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.
This cutting insert is a plate-shaped cutting insert having a center line, and includes an upper surface that forms one surface of two surfaces facing each other in an axial direction along the center line; a lower surface that forms the other surface of the two surfaces facing each other; a side surface that connects the upper surface and the lower surface in the axial direction; and a mounting hole that passes through the cutting insert in the axial direction, in which the side surface extends obliquely inward in a radial direction perpendicular to the center line from the upper surface toward the lower surface in the axial direction.
Provided are a lithium recovery method and a lithium recovery device with which it is possible to improve the lithium recovery rate while reducing impurities when recovering lithium from a roasted spent lithium ion battery (black mass), said lithium recovery method having: a leaching step in which an acidic solution containing an inorganic acid is added to a lithium-containing starting material to cause lithium to leach into the acidic solution; a precipitating step in which a first slurry obtained in the leaching step is neutralized to obtain a precipitate; a solid-liquid separating step in which a second slurry obtained in the precipitating step is subjected to solid-liquid separation; a washing step in which a solid phase obtained in the solid-liquid separating step is washed with a washing liquid; and a recycling step in which a post-washing liquid obtained in the washing step is reused in one or both of the leaching step and the precipitating step.
What is provided is a joined body in which a first member and a second member are joined through a solder layer therebetween, in which the joined body is dipped in isopropanol to extract organic residues contained in the joined body, a UV absorption spectrum of an extract having the extracted organic residues is measured, the obtained UV absorption spectrum is normalized with the absorbance set to 100 at a wavelength of 207 nm, and the absorbance at a wavelength of 300 nm obtained from the normalized UV absorption spectrum is 4 or less.
0000 is the loss tangent when the strain is 0.01%. The viscosity measured at a temperature of 25°C and a shear rate of 6/s is preferably within the range of 50-100 Pa·s.
This copper/ceramic bonded body includes a copper member consisting of copper or a copper alloy and a ceramic member, wherein the copper member is bonded to the ceramic member, an active metal compound layer consisting of an active metal compound is formed on a side of the ceramic member at a bonded interface between the ceramic member and the copper member, microcracks that extend from the bonded interface toward an inner side of the ceramic member are present in the ceramic member, and at least a part of the microcracks are filled with the active metal compound.
1−xxyy (where M is one or more from among Zr, Hf, V, Nb, Ta, Cr, Mo, and W, x is 0.05-0.50, and y is 1.0-2.5) having an average thickness of 0.5-5.0 μm; (b) in the boride layer, the x has variations in repetition over the entirety of the boride layer in the thickness direction; (c) the difference Δx between the average value of the maximum values of x and the average value of the minimum values of x is 0.02-0.10; and (d) the average interval Γ in the thickness direction between the maximum values of x and the minimum values of x is 2-20 nm.
Performance of a negative electrode material is improved. The negative electrode material is a negative electrode material for a battery that includes carbon, sodium tungstate provided on a surface of the carbon, and silicon provided on the surface of the carbon.
A method for recovering valuable metals according to the present invention comprises: a cementation step S01 for adding a metal less noble than copper to a raw solution containing at least one of cobalt and nickel; a pH adjustment step S02 for adjusting the pH of the raw solution to a predetermined range; a first ion exchange step S04 for bringing the raw solution into contact with a first ion exchange resin; a water cleaning step S05 for cleaning the first ion exchange resin with water; a first elution step S06 for bringing the first ion exchange resin into contact with a low-concentration sulfuric acid; and a second elution step S07 for bringing the first ion exchange resin into contact with high-concentration sulfuric acid. When recovering cobalt, an iron removal step S61, a second ion exchange step S62, and a cobalt concentrate recovery step S63 are performed, and when recovering nickel, a nickel concentrate recovery step S71 is performed.
C22B 3/22 - Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means
C22B 3/24 - Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means by adsorption on solid substances, e.g. by extraction with solid resins
C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
C22B 3/46 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes by substitution, e.g. by cementation
83.
TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL
A terminal material having a plating film which can be used as a terminal for electric connection and a contact for a connector, including a base material made of copper or copper alloy and a plating film formed on the base material; the plating film has a tin layer made of tin or tin alloy; a surface-part KAM value measured by analyzing a cross section of a surface part by the EBSD method in a range of depth 1 μm in a thickness direction of the base material from an interface between the base material and the plating film is 0.15° or more and less than 90°; and a center-part KAM value in a center part of a plate thickness of the base material is 0.1 times or more and 0.6 times or less of the surface-part KAM value.
Provided is a cobalt recovery method for recovering cobalt from a cobalt sulfate solution. The method is characterized by comprising: adding, to the cobalt sulfate solution, an additive of which the solubility becomes lower at a pH of at most 2.0; and electrolytically recovering cobalt from the cobalt sulfate solution to which the additive has been added. The additive preferably has a pH-buffering effect in a pH range of 2.0-4.5.
C25C 1/08 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of nickel or cobalt
85.
BLACK DISPERSION, ULTRAVIOLET-RAY-CURABLE BLACK COMPOSITION, RESIN COMPOSITION, BLACK MATRIX FOR COLOR FILTERS, AND CMOS CAMERA MODULE
This black dispersion includes a solvent, a black pigment, and a polymer dispersant, in which the solvent contains either one or both of a monofunctional monomer having an ethylenically unsaturated bond and a difunctional monomer having an ethylenically unsaturated bond, the black pigment contains zirconium nitride, and the polymer dispersant contains a comb polymer, the comb polymer has a main chain and a plurality of side chains bonded to the main chain, the main chain is a polyalkyleneimine, and each of the plurality of side chains is a group containing an oxyethylene group and an oxypropylene group.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
This free-machining copper alloy contains prescribed amounts of Cu, Si, Pb, and P, and contains a prescribed amount of Bi as an optional element, with the remainder being Zn and unavoidable impurities. Among the unavoidable impurities, the total content of Fe, Mn, Co, and Cr is less than a prescribed amount, and the Al content is less than a prescribed amount. The compositional relationships f1 and f2, which are defined from the elemental composition, the structural relationships f3, f4, and f5, which are defined from the surface area ratios of the constituent phases of the metallographic structure, and structural/compositional relationship f6, which is defined from the composition and the metallographic structure, each fall within prescribed ranges. When etched using a liquid mixture of hydrogen peroxide and aqueous ammonia, grain boundaries can be observed in a β1 phase.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
87.
FREE-MACHINING COPPER ALLOY AND PRODUCTION METHOD FOR FREE-MACHINING COPPER ALLOY
This free-machining copper alloy contains prescribed amounts of Cu, Si, Pb, and P, and contains a prescribed amount of Bi as an optional element, with the remainder being Zn and unavoidable impurities. Among the unavoidable impurities, the total content of Fe, Mn, Co, and Cr is less than a prescribed amount, and the Al content is less than a prescribed amount. The compositional relationships f1, f2, and f0, which are defined from the elemental composition, the structural relationships f3, f4, and f5, which are defined from the surface area ratios of the constituent phases of the metallographic structure, and structural/compositional relationship f6, which is defined from the composition and the metallographic structure, each fall within prescribed ranges. A modified β1 phase has visible grain boundaries when et\ched using a liquid mixture of hydrogen peroxide and aqueous ammonia.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
88.
COPPER STRIP FOR EDGEWISE BENDING, COMPONENT FOR ELECTRIC OR ELECTRONIC DEVICE, AND BUS BAR
A copper strip for edgewise bending can be edgewise-bent under a condition that a ratio R/W of a bending radius R to a width W is 5.0 or less. In the copper strip, a thickness t is in a range of 1 mm or more and 10 mm or less, and area ratio B/(A+B) is in a range of more than 10% and 100% or less in a square region where the length of one side is 1/10 of the thickness t, where an intersection of a straight line which contacts a surface and is parallel to a width direction and a straight line which contacts an end face and is perpendicular to the width direction is used as a reference in a cross section orthogonal to a longitudinal direction, A is an area where copper is present, and B is an area where copper is not present.
H01B 5/02 - Single bars, rods, wires or stripsBus-bars
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 7/00 - Insulated conductors or cables characterised by their form
H01B 7/28 - Protection against damage caused by external factors, e.g. sheaths or armouring by moisture, corrosion, chemical attack or weather
89.
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where in an edge region E of each of the copper members (12) and (13), an area ratio of each of Ag solid solution parts (12A) and (13A) having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
Disclosed is a method for managing an electrodeposition liquid that is used for the formation of an electrodeposition film on a conductive base material by means of anionic electrodeposition, wherein the concentration of an organic acid contained in the electrodeposition liquid is adjusted by performing an anion exchange treatment on the electrodeposition liquid. Also disclosed is an electrodeposition device (10) which is used when an electrodeposition film is formed on a conductive base material by means of anionic electrodeposition, and which comprises: an electrodeposition tank (20) in which an electrodeposition liquid is retained, and the base material and a counter electrode are immersed therein; an anion exchange means (30) for performing an anion exchange treatment on the electrodeposition liquid; and an electrodeposition liquid circulation means (40) for circulating the electrodeposition liquid between the electrodeposition tank (20) and the anion exchange means (30).
C02F 1/42 - Treatment of water, waste water, or sewage by ion-exchange
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
C09D 127/12 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCoating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C25D 9/02 - Electrolytic coating other than with metals with organic materials
C25D 13/06 - Electrophoretic coating characterised by the process with organic material polymers
C25D 13/10 - Electrophoretic coating characterised by the process characterised by the additives used
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region of each of the copper members is 10% or less.
An electrodeposition liquid for electrodepositing an electrodeposition film on a conductive base material by anionic electrodeposition includes water, an organic solvent, a solid component, a neutralizing agent, and an organic acid. The solid component includes at least a polyimide-based resin. An insulating coating film production method for forming an insulating coating film on the surface of a base material includes: an electrodeposition film forming step (S02) for immersing the base material and a counter electrode in the electrodeposition liquid, and, by using the base material as a positive electrode and the counter electrode as a negative electrode, applying a voltage between the positive electrode and the negative electrode to form an electrodeposition film on the base material; and a baking process (S03) for baking the electrodeposition film.
C25D 13/10 - Electrophoretic coating characterised by the process characterised by the additives used
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
C09D 127/12 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCoating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
C25D 9/02 - Electrolytic coating other than with metals with organic materials
C25D 13/00 - Electrophoretic coating characterised by the process
C25D 13/06 - Electrophoretic coating characterised by the process with organic material polymers
This Cu pillar joined body is obtained by joining a first Cu pillar and a second Cu pillar via a joining layer, wherein: the joining layer has a porous Cu layer formed on the first Cu pillar side, a solder layer formed on the second Cu pillar side, and an intermetallic compound layer formed between the porous Cu layer and the solder layer; and the porosity in the porous Cu layer is within the range of 5-80%.
This aluminum-oxide-based-composition-containing zirconium nitride powder contains particles each of which is mainly composed of zirconium nitride and has a surface to which an aluminum oxide-based composition partially adheres, in which the aluminum-oxide-based-composition-containing zirconium nitride powder contains aluminum in a proportion of greater than 1% by mass and 15% by mass or less in terms of a total content of 100% by mass, and has a specific surface area of 30 m2/g to 90 m2/g measured by a BET method. This powder has relatively high light shielding properties in a near infrared region with a wavelength of 1,000 nm, has excellent patterning and visible light shielding properties, and has favorable moisture resistance, when the powder is used to form a black patterned film as a black pigment.
A surface-coated cutting tool having a substrate and a hard coating film formed on the surface of the substrate, wherein the hard coating film has a lower layer made of AlCrXZ film, an intermediate layer consisting of alternating laminated films of layer A made of AlCrX'Z film and layer B made of AlCrBWX''Z film, and an upper layer made of TiSiX'''Z film, the lower layer and the intermediate layer have crystalline structures preferentially oriented in the (111) plane of the face-centered cubic structure, and the upper layer has a crystalline structure preferentially oriented in the (200) plane of the face-centered cubic structure.
C23C 28/04 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of inorganic non-metallic material
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
This method for producing lithium sulfide is characterized by having a heat treatment step in which lithium sulfide is produced by circulating and heating a sulfur gas in a reaction vessel storing a lithium salt therein. Excess sulfur gas can be discharged as waste gas, and as a result, it is possible to suppress residual unreacted raw material and the expression of by-products, and to stably produce high-quality lithium sulfide.
Agglomeration of metal particles is to be suppressed. A metal ink contains metal particles, a solvent, and a polyhydric alcohol containing two or more OH groups and soluble in water and ethanol.
This method for manufacturing a square silicon substrate having a first surface for forming a circuit and a second surface positioned opposite to the first surface comprises: a slicing step for slicing a silicon ingot to form a square plate-shaped member; a grinding step for grinding both surfaces of the plate-shaped member; and a polishing step for mechanically polishing one surface of the plate-shaped member, which has been subjected to the grinding step, to form a square silicon substrate having a first surface, wherein chemical etching is not performed during the grinding step, during the polishing step, and between the grinding step and the polishing step, and the square silicon substrate is formed to have a thickness of 0.5-2.0 mm. Moreover, in the square silicon substrate, the TTV in the first surface is at most 100.0 μm, and the maximum peak height Rp of the first surface is at most 100.0 nm. In the polishing step, a finishing slurry composed of finishing abrasive grains and a liquid having a hydrogen ion exponent of 7.0-9.0 is used.
Provided is a film-provided copper terminal material which prevents the occurrence of adhesion when used as a connector and in which insertion and extraction force is stably reduced. In the present invention, a film is formed on a base material composed of copper or a copper alloy. The film has, on the surface thereof, a tin layer composed of tin or a tin alloy having an average thickness of 0.2-2.0 μm. The arithmetic average curvature Spc of peak apexes on the surface of the film is 10-70 mm-1, and the standard deviation/average value of Spc measured at ten visual fields is 30% or less.
avgavgavgavgavgavgavgavgavgavgavg = 100.0) are 20.0 ≤ a ≤ 30.0, 20.0 ≤ b ≤ 30.0, 10.0 ≤ c ≤ 20.0, 20.0 ≤ d ≤ 30.0, and 5.0 ≤ e ≤ 15.0, and the average value of σa, σb, σc, σd, σe, which are standard deviations of a, b, c, d, and e, respectively, is 0.40 or less.
C22C 29/08 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
B23B 27/14 - Cutting tools of which the bits or tips are of special material
C22C 1/051 - Making hard metals based on borides, carbides, nitrides, oxides or silicidesPreparation of the powder mixture used as the starting material therefor
