Mitsubishi Gas Chemical Company, Inc.

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C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs 264
H05K 1/03 - Use of materials for the substrate 244
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics 237
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01 - Chemical and biological materials for industrial, scientific and agricultural use 146
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1.

EPOXY RESIN COMPOSITION

      
Application Number 18871604
Status Pending
Filing Date 2023-05-16
First Publication Date 2025-11-27
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Wakahara, Daiki
  • Ohnishi, Nobuyoshi
  • Ikeuchi, Kousuke
  • Okada, Kana
  • Matsumoto, Nobuhiko
  • Innan, Susumu

Abstract

An epoxy resin composition contains an epoxy resin (A) and an epoxy resin curing agent (B). The epoxy resin (A) includes an epoxy resin (A1) having a glycidyl group derived from resorcinol, and an epoxy resin (A2) such as an epoxy resin having a glycidyl group derived from bisphenol F. The epoxy resin curing agent (B) includes resorcinol (B1) and/or the like. The epoxy resin composition has from 7 to 60 mass % epoxy resin curing agent (B) content.

IPC Classes  ?

  • C08G 59/24 - Di-epoxy compounds carbocyclic
  • C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
  • C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
  • C08G 59/62 - Alcohols or phenols
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 5/3445 - Five-membered rings

2.

RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME

      
Application Number 18881853
Status Pending
Filing Date 2023-07-03
First Publication Date 2025-11-27
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Okada, Takumi

Abstract

A resist composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist composition: A resist composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist composition: wherein R0 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

3.

SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, LIQUID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2025017656
Publication Number 2025/243917
Status In Force
Filing Date 2025-05-15
Publication Date 2025-11-27
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kikunaga Takahiro
  • Ido Yuto
  • Fukazawa Shun
  • Horie Hiroaki

Abstract

The present invention can provide a surface treatment method for semiconductor substrates, wherein the method comprises a step for removing, using a liquid (B) that brings the contact angle of water versus the surface of a silicon-containing material (A) to 29 degrees or less, bubbles generated at the surface of a semiconductor substrate composed of the material (A). The present invention can also provide a method for producing semiconductor substrates, wherein the method comprises a bubble removal step for removing, using a liquid (B) that brings the contact angle of water versus the surface of a silicon-containing material (A) to 29 degrees or less, bubbles generated at the surface of a semiconductor substrate composed of the material (A).

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

4.

COMPOUND, COMPOSITION FOR FORMING LITHOGRAPHIC FILM, RESIST FILM, AND METHOD FOR FORMING RESIST PATTERN

      
Application Number JP2025017876
Publication Number 2025/243949
Status In Force
Filing Date 2025-05-16
Publication Date 2025-11-27
Owner
  • THE SCHOOL CORPORATION KANSAI UNIVERSITY (Japan)
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kudo Hiroto
  • Sato Takashi
  • Echigo Masatoshi

Abstract

Provided is a compound having excellent resist sensitivity characteristics as well as excellent solvent solubility, heat resistance, and film-forming properties. Also provided are: a composition for forming a lithographic film, said composition containing the compound; a resist film; and a method for forming a resist pattern. The compound is represented by formula (1). (In formula (1), Ar is a group having a C6-60 aryl group, R1is an organic group having a sulfonium salt or an iodonium salt, nAis an integer of 1-9, and nB is an integer of 1 or more.)

IPC Classes  ?

  • C07C 381/12 - Sulfonium compounds
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

5.

THINNER COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THINNER COMPOSITION

      
Application Number 18881364
Status Pending
Filing Date 2023-07-03
First Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okada, Takumi
  • Hoshino, Ryosuke
  • Sato, Hideyuki
  • Katagiri, Masayuki
  • Suzuki, Shu
  • Echigo, Masatoshi

Abstract

A thinner composition includes: (B) a solvent containing: (B1) a compound represented by the following general formula (b-1): A thinner composition includes: (B) a solvent containing: (B1) a compound represented by the following general formula (b-1): A thinner composition includes: (B) a solvent containing: (B1) a compound represented by the following general formula (b-1): wherein R0 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

IPC Classes  ?

6.

POLARIZING SHEET

      
Application Number 18996249
Status Pending
Filing Date 2023-07-13
First Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okazaki, Kota
  • Matsuno, Yuya
  • Akaki, Masayuki
  • Kimura, Hideaki

Abstract

A polarizing laminate includes a uniaxially stretched polyvinyl alcohol resin film as a polarizing film, with transparent protective layers disposed on both sides via adhesive layers, wherein: in optical distortion measured based on MIL-DTL-43511D, the difference between the maximum and minimum widths of gaps (slit spacing) formed by two adjacent slits in the polarizing laminate is 1.05 mm or less.

IPC Classes  ?

  • G02B 1/14 - Protective coatings, e.g. hard coatings
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

7.

ALICYCLIC DIAMINE AND ALICYCLIC-DIAMINE COMPOSITION

      
Application Number JP2025014480
Publication Number 2025/239079
Status In Force
Filing Date 2025-04-11
Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikarashi Yuki
  • Sumi Hiroki
  • Nakamura Goh
  • Kumano Tatsuyuki
  • Etou Hajime
  • Ohno Yuma

Abstract

222 is bonded at a or b).

IPC Classes  ?

8.

MULTILAYER BODY, DUSTPROOF COVER FOR HEAD-UP DISPLAY, AND RESIN COMPOSITION

      
Application Number JP2025016401
Publication Number 2025/239211
Status In Force
Filing Date 2025-04-30
Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Nakamura Hitomi
  • Izumi Ryunosuke

Abstract

Provided is a multilayer body, a dustproof cover for a head-up display, and a resin composition that can be used for manufacturing the multilayer body. A multilayer body according to the present disclosure comprises a polycarbonate resin layer, an acrylic resin layer, and a photocurable resin layer. The polycarbonate resin layer contains a sulfonic acid metal salt. The photocurable resin layer is formed of a resin composition comprising: a curable compound (a1) having a (meth)acryloyl group; inorganic particles (a2) having a photopolymerizable functional group on the surface thereof and having an average particle diameter of 1-70 nm; and a photoreactive oligomer (a3) having Si atoms and a (meth)acryloyl group equivalent of 200 to 500 g/mol.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 290/06 - Polymers provided for in subclass

9.

HARD COAT FILM AND RESIN MOLDED ARTICLE USING SAME

      
Application Number 18881877
Status Pending
Filing Date 2023-07-10
First Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Ryota
  • Wakayama, Shota
  • Nakamura, Hitomi
  • Sato, Yoshimasa

Abstract

A hard coat film includes: a base material layer which contains a thermoplastic resin; and a hard coat layer which is a cured coating film layer and is provided on at least one surface of the base material layer, wherein the hard coat layer contains a fluorine-containing leveling agent, the surface roughness of the surface of the hard coat layer is at most 10 nm, and the atomic concentration) F(80°) of fluorine at an angle of 80° is at most 10 atomic % and the atomic concentration) F(30°) of fluorine at an angle of 30° is at most 10 atomic %, as measured by angle resolved XPS.

IPC Classes  ?

  • G02B 1/14 - Protective coatings, e.g. hard coatings

10.

MULTILAYER OBJECT AND DUST-PROOF COVER FOR HEAD-UP DISPLAYS

      
Application Number JP2025016402
Publication Number 2025/239212
Status In Force
Filing Date 2025-04-30
Publication Date 2025-11-20
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Nakamura Hitomi
  • Izumi Ryunosuke

Abstract

Provided are a multilayer object and a dust-proof cover for head-up displays. This multilayer object comprises a polycarbonate resin layer, an acrylic resin layer, and a photocurable resin layer. The polycarbonate resin layer contains a metal sulfonate. The photocurable resin layer is formed from a resin composition comprising a penta- to nona-functional urethane (meth)acrylate (a1) and inorganic particles (a2) having a photopolymerizable functional group on the surface and having an average particle diameter of 1-70 nm, in a mass proportion ((a1):(a2)) of 10:90 to 90:10.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin

11.

TELLURIUM-CONTAINING POLYMER AND COMPOUND

      
Application Number 18862395
Status Pending
Filing Date 2023-05-02
First Publication Date 2025-11-13
Owner
  • The School Corporation Kansai University (Japan)
  • Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Kudo, Hiroto
  • Omatsu, Tadashi
  • Sato, Takashi
  • Echigo, Masatoshi

Abstract

A polymer including tellurium in the main chain, which is prepared by reacting (A) a compound having a plurality of cyclic (thio) ether groups, and (B) TeX4, wherein X is a halogen atom.

IPC Classes  ?

  • C08G 79/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon
  • C07C 395/00 - Compounds containing tellurium
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

12.

POLYACETAL RESIN COMPOSITION

      
Application Number 18871952
Status Pending
Filing Date 2023-06-14
First Publication Date 2025-11-13
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Michiba, Kiyonori
  • Sunaga, Daisuke

Abstract

A polyacetal resin composition; a metal resin composition; and a method for producing a polyacetal resin composition are provided. The polyacetal resin composition contains 100 parts by weight of a polyacetal resin (A) and 0.1 to 0.9 part by weight of a fatty acid metal salt (B) having a weight loss rate of 20% by weight of more, the weight loss rate being the ratio of weight loss after the fatty acid metal salt is heated from room temperature to 200° C. at a rate of 200° C./minute in the air at atmospheric pressure and is subsequently held at 200°° C. for 60 minutes.

IPC Classes  ?

  • C08K 5/098 - Metal salts of carboxylic acids
  • B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
  • B29C 45/46 - Means for plasticising or homogenising the moulding material or forcing it into the mould
  • B29K 61/00 - Use of condensation polymers of aldehydes or ketones, as moulding material
  • B29K 105/00 - Condition, form or state of moulded material

13.

THERMOPLASTIC RESIN, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY

      
Application Number JP2025016325
Publication Number 2025/234377
Status In Force
Filing Date 2025-04-30
Publication Date 2025-11-13
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Noriyuki
  • Nishimori Katsushi
  • Motegi Atsushi
  • Ishihara Kentaro
  • Murata Suzuki Shoko
  • Nyuui Tatsuki
  • Fukui Kiyoshiro

Abstract

Provided as one embodiment is a thermoplastic resin containing, relative to the total amount (100 mol%) of constituent units in the thermoplastic resin, 35-90 mol% of a constituent unit (A) derived from a diol represented by general formula (1) and 10-65 mol% of a constituent unit (B) derived from a diol represented by general formula (2), said thermoplastic resin containing two or more types of constituent units (A) derived from a diol represented by general formula (1).

IPC Classes  ?

  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

14.

METHOD FOR PRODUCING CHEMICAL INDUSTRIAL PRODUCT FROM BIOGAS

      
Application Number JP2025016448
Publication Number 2025/234389
Status In Force
Filing Date 2025-05-01
Publication Date 2025-11-13
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Fujii Takashi
  • Ito Maki

Abstract

One embodiment of the present invention provides a method for producing a chemical industrial product from a biogas, the method comprising the following steps (A)-(C). Step (A): a step for producing a biogas containing methane gas from biomaterials; Step (B): a step for producing a synthesis gas, which contains carbon monoxide and hydrogen, using at least a portion of the biogas and water as raw materials; and Step (C): a step for producing methanol using carbon monoxide and hydrogen contained in the synthesis gas as raw materials.

IPC Classes  ?

  • C07C 29/151 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases
  • B09B 3/65 - Anaerobic treatment
  • C01B 3/36 - Production of hydrogen or of gaseous mixtures containing hydrogen by reaction of gaseous or liquid organic compounds with gasifying agents, e.g. water, carbon dioxide, air by reaction of hydrocarbons with gasifying agents using oxygen or mixtures containing oxygen as gasifying agents
  • C07B 61/00 - Other general methods
  • C07C 1/20 - Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon starting from organic compounds containing only oxygen atoms as hetero atoms
  • C07C 15/02 - Monocyclic hydrocarbons
  • C07C 31/04 - Methanol
  • C08G 64/20 - General preparatory processes
  • C10G 3/00 - Production of liquid hydrocarbon mixtures from oxygen-containing organic materials, e.g. fatty oils, fatty acids
  • C10L 3/10 - Working-up natural gas or synthetic natural gas
  • B09B 101/70 - Kitchen refuseFood waste
  • B09B 101/85 - PaperWoodFabrics, e.g. cloths

15.

METHOD FOR PRODUCING METHANOL AND METHANOL PRODUCTION APPARATUS

      
Application Number 18876332
Status Pending
Filing Date 2023-05-25
First Publication Date 2025-11-13
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Higashide, Hirofumi
  • Kakimi, Atsushi
  • Akiyoshi, Shuusuke
  • Abe, Takanori

Abstract

A method for producing methanol using carbon dioxide and hydrogen as raw materials includes: mixing carbon dioxide and hydrogen to obtain a make-up gas; raising pressure of the make-up gas, and then mixing the make-up gas with a recycled gas recovered from an exit gas of a synthesis reactor to obtain a synthesis reactor-feeding gas; preheating the synthesis reactor-feeding gas by exchanging heat with the exit gas from the synthesis reactor as a heating source; and feeding the preheated synthesis reactor-feeding gas to the synthesis reactor and bringing into contact with a catalyst to synthesize methanol.

IPC Classes  ?

  • C07C 29/152 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the reactor used
  • B01J 8/02 - Chemical or physical processes in general, conducted in the presence of fluids and solid particlesApparatus for such processes with stationary particles, e.g. in fixed beds

16.

METHOD FOR PRODUCING FURAN-2,5-DICARBOXYLIC ACID

      
Application Number JP2025003764
Publication Number 2025/234174
Status In Force
Filing Date 2025-02-05
Publication Date 2025-11-13
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Watanabe Yuki
  • Matsuura Yumi
  • Nakamura Goh

Abstract

Provided is a method for producing furan-2,5-dicarboxylic acid, the method comprising: an oxidation step 1 for performing an oxidation reaction by continuously supplying 5-methylfurfural and an oxygen-containing gas under a supply condition 1 or 2 in the presence of a lower aliphatic carboxylic acid, a bromine compound, and a metal catalyst; and an oxidation step 2 for performing an oxidation reaction under a supply condition in which the oxygen concentration of the oxygen-containing gas and/or the molar ratio of oxygen in the oxygen-containing gas to the 5-methylfurfural is greater than those in the oxidation step 1. In the supply condition 1, the oxygen concentration of the oxygen-containing gas is 10 vol% or more and less than 15 vol%, and the molar ratio of oxygen in the oxygen-containing gas to the 5-methylfurfural is 2.5-4.2. In the supply condition 2, the oxygen concentration is 15-30 vol% and the molar ratio is 1.0 or more and less than 2.5.

IPC Classes  ?

  • C07D 307/68 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen
  • B01J 31/04 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing carboxylic acids or their salts
  • C07B 61/00 - Other general methods

17.

RESIN OBTAINED FROM CYCLIC DIOL COMPOUND, AND OPTICAL LENS CONTAINING SAME

      
Application Number 18994141
Status Pending
Filing Date 2023-07-20
First Publication Date 2025-11-06
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Nishimori, Katsushi
  • Motegi, Atsushi
  • Ishihara, Kentaro
  • Watanabe, Takafumi
  • Harada, Yutaro

Abstract

A resin contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. A resin contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. A resin contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. In the formula, each R1 independently a hydrogen atom, a C1-4 alkyl group, or a phenyl group. X is a direct bond or a divalent group that is represented by formula (Y). A resin contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. In the formula, each R1 independently a hydrogen atom, a C1-4 alkyl group, or a phenyl group. X is a direct bond or a divalent group that is represented by formula (Y). A resin contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. In the formula, each R1 independently a hydrogen atom, a C1-4 alkyl group, or a phenyl group. X is a direct bond or a divalent group that is represented by formula (Y). In the formula, each R2 and each R3 is independently a hydrogen atom, an alkyl group, or an aryl group, or each R2 and each R3 may bind to one another to form a ring together with an adjacent carbon atom, and the ring may be substituted by an alkyl group. n is 0 or 1. * represents a binding position.

IPC Classes  ?

  • C08G 63/64 - Polyesters containing both carboxylic ester groups and carbonate groups
  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
  • C08G 64/16 - Aliphatic-aromatic or araliphatic polycarbonates
  • C08G 64/30 - General preparatory processes using carbonates

18.

RESIN COMPOSITION, PELLET, MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLDED ARTICLE

      
Application Number JP2025004883
Publication Number 2025/229793
Status In Force
Filing Date 2025-02-14
Publication Date 2025-11-06
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ishihara Tomita Eri
  • Shimada Nakamura Jin
  • Kobayashi Masayuki
  • Oda Takafumi

Abstract

Provided are: a resin composition that can be crystallized in a low-temperature mold and can provide a molded article excellent in impact resistance; a pellet; a molded article; and a method for producing a molded article. This resin composition comprises 1-30 parts by mass of a polyamide resin B with respect to 100 parts by mass of the total of a polyamide resin A and the polyamide resin B, wherein the polyamide resin A contains a diamine unit and a dicarboxylic acid unit; the diamine unit contains a xylylenediamine constituent unit at a ratio of 70 mol% or more; the dicarboxylic acid unit contains an α,ω-linear aliphatic dicarboxylic acid unit having 11-20 carbon atoms at a ratio of 70 mol% or more; and the difference (Tmb - Tma) between the melting point Tmb of the polyamide resin B according to differential scanning calorimetry (DSC) and the melting point Tma of the polyamide resin A according to differential scanning calorimetry (DSC) is 35°C or more.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • C08K 3/40 - Glass

19.

POLYESTER AND FEEDING BOTTLE

      
Application Number JP2025015164
Publication Number 2025/225511
Status In Force
Filing Date 2025-04-18
Publication Date 2025-10-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Taguwa Ken
  • Morishita Takami

Abstract

The present invention provides a polyester wherein: a dicarboxylic acid constituent unit includes 72.5 mol% or more of a constituent unit derived from 2,6-naphthalenedicarboxylic acid and/or an ester derivative thereof among a total 100 mol% of said dicarboxylic acid constituent units; and a diol constituent unit includes 27.5 mol% or more of a constituent unit derived from 1,4-cyclohexanedimethanol and a constituent unit derived from 2,2,4,4-tetramethyl-1,3-cyclobutanediol among a total 100 mol% of said diol constituent units. A feeding bottle according to the present invention is formed using said polyester.

IPC Classes  ?

  • C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
  • A61J 9/00 - Feeding-bottles in general

20.

RESIN COMPOSITION, RESIN SHEET, AND MULTILAYER BODY

      
Application Number JP2025015622
Publication Number 2025/225621
Status In Force
Filing Date 2025-04-22
Publication Date 2025-10-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Koga Shota
  • Kikuta Kohei
  • Odawara Masahiro
  • Hirano Shunsuke

Abstract

To provide a resin composition, a resin sheet, and a multilayer body. A resin composition according to the present disclosure contains a thermosetting compound (A) having a melting point of 30°C or less and a 5% weight loss temperature of 150°C or more and a thermosetting compound (B) (excluding compounds that fall under the category of the thermosetting compound (A)) capable of polymerizing with the thermosetting compound (A).

IPC Classes  ?

  • C08F 220/20 - Esters of polyhydric alcohols or phenols
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • C08F 222/40 - Imides, e.g. cyclic imides
  • C08F 226/06 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
  • C08F 290/06 - Polymers provided for in subclass
  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
  • H05K 1/03 - Use of materials for the substrate

21.

RESIN COMPOSITION, CURED OBJECT, PREPREG, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025014940
Publication Number 2025/225477
Status In Force
Filing Date 2025-04-16
Publication Date 2025-10-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Miyamoto Makoto
  • Futamura Keisuke
  • Hida Kenji
  • Umeki Miho
  • Higashita Kazuyuki

Abstract

Provided are a resin composition, a cured object, a prepreg, a metal-foil-clad laminate board, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition according to the present disclosure comprises 10-90 parts by mass of a resin (A) and 90-10 parts by mass of a maleimide compound (B) represented by formula (M4), wherein the resin (A) is represented by formula (T).

IPC Classes  ?

  • C08F 212/34 - Monomers containing two or more unsaturated aliphatic radicals
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
  • C08F 222/40 - Imides, e.g. cyclic imides
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • H05K 1/03 - Use of materials for the substrate

22.

POLYESTER AND FEEDING BOTTLE

      
Application Number JP2025015165
Publication Number 2025/225512
Status In Force
Filing Date 2025-04-18
Publication Date 2025-10-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Taguwa Ken
  • Morishita Takami

Abstract

The present invention provides a polyester wherein: a dicarboxylic acid constituent unit is a constituent unit derived from 2,6-naphthalenedicarboxylic acid and/or an ester derivative thereof; and a diol constituent unit includes a constituent unit derived from any isosorbide, and 27.5 mol% or more of a constituent unit derived from 1,4-cyclohexanedimethanol among a total 100 mol% of said diol constituent units. A feeding bottle according to the present invention is formed using said polyester.

IPC Classes  ?

  • C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
  • A61J 9/00 - Feeding-bottles in general

23.

THERMOPLASTIC RESIN AND OPTICAL MEMBER

      
Application Number 18881864
Status Pending
Filing Date 2023-07-18
First Publication Date 2025-10-23
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Nishimori, Katsushi
  • Motegi, Atsushi
  • Ishihara, Kentaro
  • Murata Suzuki, Shoko
  • Harada, Yutaro

Abstract

A thermoplastic resin includes a constituent unit (A) derived from a monomer represented by the following general formula (1) and a constituent unit (C) derived from a monomer represented by the following general formula (3): A thermoplastic resin includes a constituent unit (A) derived from a monomer represented by the following general formula (1) and a constituent unit (C) derived from a monomer represented by the following general formula (3):

IPC Classes  ?

  • C08G 63/64 - Polyesters containing both carboxylic ester groups and carbonate groups
  • C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
  • C08G 64/04 - Aromatic polycarbonates
  • C08G 64/30 - General preparatory processes using carbonates

24.

LAMINATE FOR THERMOFORMING AND MOLDED ARTICLE OBTAINED BY MOLDING SAME

      
Application Number JP2025014415
Publication Number 2025/220596
Status In Force
Filing Date 2025-04-11
Publication Date 2025-10-23
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ozaki Yushi
  • Wakayama Shota
  • Kamei Shota

Abstract

The present invention is capable of providing a laminate for thermoforming comprising a substrate layer, a primer layer, an adhesive layer, and a backer material in this order. The primer layer has a thickness of 0.2-1.0 μm, the adhesive layer comprises a two-component curable composition containing a polyester-based adhesive and an isocyanate-based curing agent, and the content of the isocyanate-based curing agent is 2-20 parts by mass with respect to 100 parts by mass of the polyester-based adhesive contained in the adhesive layer.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C09D 4/02 - Acrylmonomers
  • C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
  • C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 175/06 - Polyurethanes from polyesters

25.

RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME

      
Application Number 18881367
Status Pending
Filing Date 2023-07-03
First Publication Date 2025-10-16
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okada, Takumi
  • Hoshino, Ryosuke
  • Sato, Hideyuki
  • Katagiri, Masayuki
  • Suzuki, Shu
  • Echigo, Masatoshi

Abstract

A resist auxiliary film composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist auxiliary film composition: A resist auxiliary film composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist auxiliary film composition: A resist auxiliary film composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist auxiliary film composition: wherein R0 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

26.

NOVEL LACTIC ACID BACTERIUM, AND COMPOSITION, FOOD OR BEVERAGE, AND PHARMACEUTICAL PRODUCT CONTAINING LACTIC ACID BACTERIUM

      
Application Number 18865063
Status Pending
Filing Date 2023-04-20
First Publication Date 2025-10-09
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sugimoto, Atsushi
  • Nakamura, Tomoe
  • Chihama, Ryota
  • Takenaka, Yuto
  • Sato, Yuuki

Abstract

Provided are a lactic acid bacterium that can enhance IL-12p70 and IFN-λ production and thereby enhance the resistance to infection with infectious microorganisms and viruses, mitigate stress, and suppress excessive inflammatory response that causes symptom worsening; compositions, such as an immunostimulatory composition, a stress relief composition, and an inflammation suppression composition, containing the lactic acid bacterium; and food or beverage and pharmaceutical products containing these compositions. Lactobacillus sakei strain MG-LAB279 (accession number: NITE BP-03645); compositions, such as an immunostimulatory composition, a stress relief composition, and an inflammation suppression composition, containing the strain or a bacterial cell component thereof as an active ingredient; and food or beverage and pharmaceutical products containing the compositions.

IPC Classes  ?

27.

OXYGEN ABSORBER COMPOSITION AND OXYGEN ABSORBER PACKAGING

      
Application Number JP2025006204
Publication Number 2025/204382
Status In Force
Filing Date 2025-02-25
Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Masataka
  • Sasaki Kazuhisa
  • Hatakeyama Hidetoshi

Abstract

This oxygen absorber composition contains an iron powder (A), an alkali metal halide or an alkaline earth metal halide (B), activated carbon (C), and an inorganic powder filler (D), wherein the apparent density of the inorganic powder filler (D), excluding the iron powder (A), the alkali metal halide or the alkaline earth metal halide (B), and the activated carbon (C), is between 1.10 g/cm3and 2.90 g/cm3 inclusive, and the inorganic powder filler (D) content is 50 to 300 parts by mass to 100 parts by mass of the iron powder (A).

IPC Classes  ?

  • B01J 20/20 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising free carbonSolid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising carbon obtained by carbonising processes
  • B01D 53/14 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption

28.

TREATMENT METHOD

      
Application Number JP2025011084
Publication Number 2025/205448
Status In Force
Filing Date 2025-03-21
Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Asai Tomoko
  • Higuchi Kei
  • Namiki Kosuke

Abstract

The purpose of the present invention is to provide a treatment method capable of, in recycled products of carbon fiber-reinforced plastic, suitably removing a surface-attached object, and suitably maintaining the strength of carbon fibers or improving tensile strength thereof. A treatment method according to the present invention is for removing a surface-attached object from carbon fibers (A) and maintaining or improving the tensile strength of the carbon fibers (A), the method comprising a step for subjecting the carbon fibers (A) having a surface-attached object to an immersion treatment in a treatment liquid containing a peracid. The peracid includes at least one selected from the group consisting of percarboxylic acids, persulfuric acids, and monopersulfuric acids. The contained amount of the peracid is at least 5.0 mass% with respect to the total amount (100 mass%) of the treatment liquid. The duration of the immersion treatment is 2 minutes to 48 hours.

IPC Classes  ?

  • B29B 17/00 - Recovery of plastics or other constituents of waste material containing plastics
  • C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
  • D06M 11/50 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompoundsSalts derived from anions with an amphoteric element-oxygen bond with hydrogen peroxide or peroxides of metalsTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompoundsSalts derived from anions with an amphoteric element-oxygen bond with persulfuric, permanganic, pernitric, percarbonic acids or their salts
  • D06M 101/40 - Fibres of carbon

29.

SOLVENT AND SEMICONDUCTOR COMPOSITION USING SAME

      
Application Number JP2025011271
Publication Number 2025/205522
Status In Force
Filing Date 2025-03-24
Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hoshino Ryosuke
  • Okada Takumi
  • Sato Hideyuki
  • Echigo Masatoshi

Abstract

The present invention is a solvent containing a compound (A1) represented by general formula (a-1) and having a boiling point of 190°C or higher. (In the formula, R1represents a hydrogen atom, a C1-10 alkyl group, a C6-10 aryl group, or a C1-10 acyl group, and R2 represents a C1-10 alkyl group.)

IPC Classes  ?

  • C07C 69/675 - Esters of carboxylic acids having esterified carboxyl groups bound to acyclic carbon atoms and having any of the groups OH, O-metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids of saturated hydroxy-carboxylic acids
  • C07C 43/13 - Saturated ethers containing hydroxy or O-metal groups
  • C07C 69/16 - Acetic acid esters of dihydroxylic compounds
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

30.

COMPOSITION, AND METHOD FOR PRODUCING TRIOXANE USING SAME

      
Application Number 18868937
Status Pending
Filing Date 2023-06-01
First Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Okada, Takuya

Abstract

A composition containing (A) 58.5 to 65.5 mass % of formaldehyde, (B) 0.7 to 4.5 mass % of methanesulfonic acid; and (C) less than 0.007 mass % of a metal salt, wherein a total content of the formaldehyde (A) and the methanesulfonic acid (B) is less than 68 mass %, and the metal salt (C) contains at least one selected from a group consisting of a nitrate, a nitrite, and a persulfate.

IPC Classes  ?

  • C07D 323/06 - Trioxane
  • C07C 47/04 - Formaldehyde
  • C07C 309/04 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing only one sulfo group

31.

MULTILAYER BODY, METHOD FOR MANUFACTURING MULTILAYER BODY, PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

      
Application Number JP2025010559
Publication Number 2025/205278
Status In Force
Filing Date 2025-03-18
Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kobayashi Takashi
  • Kamata Yuji
  • Hasebe Keiichi
  • Kashima Naoki
  • Tomizawa Katsuya
  • Hirano Shunsuke
  • Kato Yoshihiro

Abstract

Provided are a multilayer body capable of achieving reduction of transmission loss, a multilayer body, a method for manufacturing a multilayer body, a printed wiring board, a semiconductor device, and a method for manufacturing a printed wiring board. This multilayer body includes a first insulating resin layer, and a second insulating resin layer in contact with the first insulating resin layer. The dielectric loss tangent of the second insulating resin layer at a frequency of 10 GHz measured by a perturbation method cavity resonator is lower than the dielectric loss tangent of the first insulating resin layer.

IPC Classes  ?

  • B32B 7/025 - Electric or magnetic properties
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 7/027 - Thermal properties
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
  • H05K 1/03 - Use of materials for the substrate
  • H05K 3/46 - Manufacturing multi-layer circuits

32.

SOLVENT AND COMPOSITION FOR SEMICONDUCTOR PRODUCTION USING SAME

      
Application Number JP2025011269
Publication Number 2025/205520
Status In Force
Filing Date 2025-03-24
Publication Date 2025-10-02
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hoshino Ryosuke
  • Okada Takumi
  • Sato Hideyuki
  • Echigo Masatoshi

Abstract

Provided is a solvent or the like having a high boiling point and high solubility. The solvent contains a compound (B1) represented by general formula (b-1). (In the formula, A represents a C1-10 alkylene group, R1represents a hydrogen atom, a C-10 alkyl group, a C6-10 aryl group, or a C1-10 acyl group, and R2 represents a C1-10 alkyl group.)

IPC Classes  ?

  • C07C 69/675 - Esters of carboxylic acids having esterified carboxyl groups bound to acyclic carbon atoms and having any of the groups OH, O-metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids of saturated hydroxy-carboxylic acids
  • C07C 43/13 - Saturated ethers containing hydroxy or O-metal groups
  • C07C 69/16 - Acetic acid esters of dihydroxylic compounds
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

33.

ANTI-GLARE LAMINATE

      
Application Number JP2025008667
Publication Number 2025/192489
Status In Force
Filing Date 2025-03-10
Publication Date 2025-09-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yamagishi Hiroaki
  • Mochizuki Yuki

Abstract

The present invention mainly addresses the problem of providing an anti-glare laminate that meets the demand for thinning without impairing anti-glare properties, feel, and hardness. This problem is solved by the anti-glare laminate comprising a base material layer and a first hard coat layer provided on at least a first surface of the base material layer. That is, the present invention is an anti-glare laminate that satisfies formula (i): {Eh/Ef}/{B/A} < 1.3 (In the formula, Ef represents an erosion rate of a surface layer of the base material layer, Eh represents an erosion rate of a surface layer of the hard coat layer, A represents a thickness (μm) of the hard coat layer, B represents a depth when Ex = Ef, and Ex represents an erosion rate at a position of a depth X μm from the surface layer of the hard coat layer).

IPC Classes  ?

  • G02B 5/02 - Diffusing elementsAfocal elements
  • B32B 7/023 - Optical properties
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • G02B 1/11 - Anti-reflection coatings
  • G02B 1/14 - Protective coatings, e.g. hard coatings

34.

OXYGEN ABSORBENT MATERIAL AND METHOD FOR STORING ARTICLE

      
Application Number 18862739
Status Pending
Filing Date 2023-04-28
First Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kobayashi, Naoko
  • Kouno, Kazuki
  • Nohira, Itsuki

Abstract

Provided are: an oxygen absorbent material containing a base material (I), an inorganic layer (II), and a cured product layer (III) of an epoxy resin composition containing an epoxy resin and an epoxy resin curing agent that includes an amine-based curing agent, where the inorganic layer (II) and the cured product layer (III) are adjacent to each other; and a method for storing an article, the method including an aspect in which the article is accommodated in a packaging material in which the oxygen absorbent material described above is enclosed, and/or an aspect in which the article is accommodated in a packaging material at least partially including the oxygen absorbent material described above, and the packaging material has an oxygen transmission rate of 1 cc/(m2·day·atm) or less.

IPC Classes  ?

  • B01J 20/26 - Synthetic macromolecular compounds
  • B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B65B 5/04 - Packaging single articles
  • C08J 7/04 - Coating
  • C08J 7/048 - Forming gas barrier coatings

35.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025007434
Publication Number 2025/187613
Status In Force
Filing Date 2025-03-03
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yamamoto Katsuya
  • Tokunaga Naoya
  • Okaniwa Masashi
  • Hasebe Keiichi

Abstract

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition contains an elastomer (A), a thermosetting compound (B), and a radical polymerization initiator (C). The elastomer (A) includes a polymer block (a1) including a conjugated diene compound unit and a styrene compound unit having a radical reactive group. The thermosetting compound (B) contains a resin (E) having two or more vinylbenzyl groups at terminals. The content of the elastomer (A) is 0.5-30 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition. The mass ratio ((A)/(E)) of the elastomer (A) to the resin (E) having two or more vinylbenzyl groups at terminals is 0.01-1.1.

IPC Classes  ?

  • C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 297/04 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 5/14 - Peroxides
  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • H05K 1/03 - Use of materials for the substrate

36.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025007435
Publication Number 2025/187614
Status In Force
Filing Date 2025-03-03
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yamamoto Katsuya
  • Tokunaga Naoya
  • Okaniwa Masashi
  • Hasebe Keiichi

Abstract

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises an elastomer (A), a thermosetting compound (B), a radical polymerization initiator (C), and a filling material (D), wherein: the elastomer (A) includes a polymer block (a1) containing a radically reactive group-containing styrene compound unit and a conjugated diene compound unit; the thermosetting compound (B) contains a resin (E) having at least two vinylbenzyl groups at the terminal thereof; the content of the filling material (D) is 1-300 parts by mass with respect to 100 parts by mass of the solid content of the resin; and the mass ratio ((A)/(E)) of the elastomer (A) to the resin (E) having at least two vinylbenzyl groups at the terminal thereof is 0.01-1.1.

IPC Classes  ?

  • C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 297/04 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 5/14 - Peroxides
  • C08K 7/26 - Silicon-containing compounds
  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • H05K 1/03 - Use of materials for the substrate

37.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025007436
Publication Number 2025/187615
Status In Force
Filing Date 2025-03-03
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yamamoto Katsuya
  • Tokunaga Naoya
  • Ito Sayaka
  • Hasebe Keiichi

Abstract

The present invention provides a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains an elastomer (A), a compound (B) represented by formula (GU), and a radical polymerization initiator (C). The elastomer (A) includes a polymer block (a1) containing a conjugated diene compound unit and a styrene compound unit having a radical reactive group. The content of the elastomer (A) is 1-30 parts by mass with respect to 100 parts by mass of the resin solid content. In formula (GU), R1and R2are hydrogen atoms or substituents, two R2are the same as each other, at least one of R1and R2is a group including a (meth)allyl group, and R3and R4 each independently represent a hydrogen atom, an alkyl group, or an aryl group.

IPC Classes  ?

  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 297/04 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
  • C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 5/14 - Peroxides
  • C08K 5/3445 - Five-membered rings
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • H05K 1/03 - Use of materials for the substrate

38.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025007437
Publication Number 2025/187616
Status In Force
Filing Date 2025-03-03
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Tokunaga Naoya
  • Yamamoto Katsuya
  • Ito Sayaka
  • Hasebe Keiichi

Abstract

Provided are: a resin composition which has excellent low dielectric characteristics when made into a cured product and has a small thermal expansion coefficient; a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a semiconductor device. The resin composition comprises a maleimide compound (A) and a compound (B) represented by formula (GU), wherein the maleimide compound (A) contains 50-100 parts by mass of a maleimide compound represented by formula (M1) and 50-0 parts by mass of another maleimide compound other than the maleimide compound represented by formula (M1), and the molar ratio β/α of the (meth)allyl group amount (β) of the compound (B) represented by formula (GU) to the maleimide group amount (α) of the maleimide compound (A) is 0.2-3.5.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • C08F 222/40 - Imides, e.g. cyclic imides
  • C08F 226/06 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • H05K 1/03 - Use of materials for the substrate

39.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2025007438
Publication Number 2025/187617
Status In Force
Filing Date 2025-03-03
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Tokunaga Naoya
  • Yamamoto Katsuya
  • Ito Sayaka
  • Hasebe Keiichi

Abstract

Provide are: a resin composition that has excellent moldability and comprises a maleimide compound and a compound having at least four (meth)allyl groups in one molecule; a cured product; a prepreg; a metal-foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. The resin composition comprises a maleimide compound (A) and a compound (B) represented by formula (GU), wherein the maleimide compound (A) has at least two structures represented by formula (Mx) in one molecule and 50-100 parts by mass of a maleimide compound (a1) having a maleimide group equivalent to 300-1,200 g/eq., and another maleimide compound (a2) other than the maleimide compound (a1), and the molar ratio β/α of the maleimide group content (α) of the maleimide compound (A) and the (meth)allyl group content (β) of the compound (B) represented by the formula (GU) in the resin composition is 0.2-3.5.

IPC Classes  ?

  • C08F 222/40 - Imides, e.g. cyclic imides
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 290/06 - Polymers provided for in subclass
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • H05K 1/03 - Use of materials for the substrate

40.

LAMINATE, MOLDED ARTICLE CONTAINING SAME, AND METHOD FOR PRODUCING LAMINATE

      
Application Number JP2025007935
Publication Number 2025/187737
Status In Force
Filing Date 2025-03-05
Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Inoue Kensuke
  • Ohmori Yuta

Abstract

The present invention provides, for example, a laminate in which carbon fibers are less likely to protrude from the surface or scatter to the outside even when the laminate is subjected to high impact. Provided is a laminate in which a first unreinforced polycarbonate resin layer that contains a first polycarbonate resin, a carbon fiber-reinforced resin layer, and a second unreinforced polycarbonate resin layer that contains a second polycarbonate resin are disposed in this order. The carbon fiber-reinforced resin layer contains carbon fibers and a third polycarbonate resin. The third polycarbonate resin contains a polycarbonate that is obtained by reacting a bisphenol, a carbonate binder, and a monovalent phenol end-capping agent which is represented by formula (6). The thickness of the first unreinforced polycarbonate resin layer with respect to the thickness of the carbon fiber-reinforced resin layer (the thickness of the first unreinforced polycarbonate resin layer / the thickness of the carbon fiber-reinforced resin layer) is 0.05-4.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
  • B29C 70/06 - Fibrous reinforcements only
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

41.

THERMOPLASTIC RESIN, METHOD FOR MANUFACTURING SAME, AND OPTICAL LENS

      
Application Number 19217265
Status Pending
Filing Date 2025-05-23
First Publication Date 2025-09-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeda, Shinya
  • Kato, Noriyuki
  • Hirakawa, Manabu
  • Reuter, Karl
  • Andrushko, Vasyl
  • Kantor, Mark
  • Stolz, Florian

Abstract

Provided is a thermoplastic resin including constituent units represented by general formula (1). (In formula (1), R1 and R2 each independently represents: a hydrogen atom; a fluorine atom; a chlorine atom; a bromine atom; an iodine atom; a C1-6 alkyl group; a monocyclic or polycyclic C6-36 aryl group; a monocyclic or polycyclic heteroaryl group having 5-36 ring atoms, 1, 2, 3, or 4 of the ring atoms being selected from nitrogen, sulfur, and oxygen, and the other ring atoms being carbon in the heteroaryl group; a C2-6 alkenyl group; a C1-6 alkoxy group; or a C7-17 aralkyl group. In formula (1), X, a, and b are each as described in the present specification.) Provided is a thermoplastic resin including constituent units represented by general formula (1). (In formula (1), R1 and R2 each independently represents: a hydrogen atom; a fluorine atom; a chlorine atom; a bromine atom; an iodine atom; a C1-6 alkyl group; a monocyclic or polycyclic C6-36 aryl group; a monocyclic or polycyclic heteroaryl group having 5-36 ring atoms, 1, 2, 3, or 4 of the ring atoms being selected from nitrogen, sulfur, and oxygen, and the other ring atoms being carbon in the heteroaryl group; a C2-6 alkenyl group; a C1-6 alkoxy group; or a C7-17 aralkyl group. In formula (1), X, a, and b are each as described in the present specification.)

IPC Classes  ?

  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
  • C07C 43/20 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
  • C08G 63/66 - Polyesters containing oxygen in the form of ether groups
  • C08G 63/78 - Preparation processes
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

42.

LAMINATE, MOLDED ARTICLE INCLUDING SAME, AND METHOD FOR MANUFACTURING LAMINATE

      
Application Number JP2025007936
Publication Number 2025/187738
Status In Force
Filing Date 2025-03-05
Publication Date 2025-09-11
Owner
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
  • ARISAWA MFG. CO., LTD. (Japan)
Inventor
  • Inoue Kensuke
  • Taguchi Daisuke
  • Ohmori Yuta
  • Tanaka Hiroshi

Abstract

The present invention provides a laminate or the like in which carbon fibers are not likely to protrude from the surface or are not likely to be scattered to the outside even when a strong impact is applied thereto. The present invention specifically provides a laminate in which a first non-reinforced polycarbonate resin layer that contains a first polycarbonate resin, a carbon fiber-reinforced resin layer, and a second non-reinforced polycarbonate resin layer that contains a second polycarbonate resin are arranged in this order, wherein: the carbon fiber-reinforced resin layer contains carbon fibers and a third polycarbonate resin; the third polycarbonate resin contains a polycarbonate that is obtained by reacting a bisphenol, a carbonate binder, and a monohydric phenol chain terminator represented by formula (5); and the ratio of the thickness of the first non-reinforced polycarbonate resin layer to the thickness of the carbon fiber-reinforced resin layer ((thickness of first non-reinforced polycarbonate resin layer)/(thickness of carbon fiber-reinforced resin layer)) is 0.05 to 4.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
  • B29C 70/06 - Fibrous reinforcements only
  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • C08G 64/14 - Aromatic polycarbonates not containing aliphatic unsaturation containing a chain-terminating or -crosslinking agent
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

43.

METHOD FOR PRODUCING IODINE-CONTAINING TERTIARY ALCOHOL ESTER

      
Application Number JP2025004018
Publication Number 2025/182521
Status In Force
Filing Date 2025-02-06
Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Fujiwara Koichi
  • Omatsu Tadashi
  • Horiuchi Junya
  • Koguma Takeru
  • Iinuma Masataka
  • Sato Takashi
  • Shishimi Toru
  • Echigo Masatoshi

Abstract

Disclosed is a method for producing an iodine-containing tertiary alcohol ester, the method including: a nucleophilic step for reacting an iodine-containing compound represented by formula (1) with a nucleophilic agent; and an acylation step for adding an acylating agent to the reaction liquid obtained in the nucleophilic step so as to obtain an iodine-containing tertiary alcohol ester. The nucleophilic step and the acylation step are continuously performed without having an isolation step after the nucleophilic step.

IPC Classes  ?

  • C07C 67/08 - Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
  • C07B 61/00 - Other general methods
  • C07C 69/653 - Acrylic acid estersMethacrylic acid estersHaloacrylic acid estersHalomethacrylic acid esters

44.

METHOD FOR PRODUCING LGPS-BASED SOLID ELECTROLYTE, AND METHOD FOR PRODUCING ALL-SOLID-STATE BATTERY

      
Application Number 18857047
Status Pending
Filing Date 2023-04-17
First Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Nitanda Katori, Aki

Abstract

A method for producing an LGPS-based solid electrolyte includes: preparing Li3PS4 powder, or producing Li3PS4 powder from at least Li2S and P2S5; and removing impurities in the Li3PS4 powder by adding, to the Li3PS4 powder, a solvent in which sulfur is contained in an amount of 0.1-1.75 mass % in an organic solvent.

IPC Classes  ?

45.

COMPOUND, COMPOSITION, COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR LITHOGRAPHY, AND COMPOSITION FOR FORMING RESIST FILM FOR SEMICONDUCTOR LITHOGRAPHY

      
Application Number JP2025002444
Publication Number 2025/182386
Status In Force
Filing Date 2025-01-27
Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Omatsu Tadashi
  • Horiuchi Junya
  • Fujiwara Koichi
  • Koguma Takeru
  • Iinuma Masataka
  • Sato Takashi
  • Shishimi Toru
  • Echigo Masatoshi

Abstract

Provided is a composition containing: a (co)polymer containing a compound represented by formula (1) and/or a constituent unit derived from a compound represented by formula (1); and at least one compound selected from the group consisting of a compound represented by formula (2), a compound represented by formula (3), and a compound represented by formula (X) [formulae (1)-(3) and formula (X) are as described in the description].

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C07C 43/23 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
  • C08F 212/08 - Styrene
  • G03F 7/004 - Photosensitive materials

46.

COMPOSITION

      
Application Number JP2025002907
Publication Number 2025/182419
Status In Force
Filing Date 2025-01-30
Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Matsumoto Masahiro
  • Iinuma Masataka
  • Omatsu Tadashi
  • Sato Takashi
  • Echigo Masatoshi

Abstract

The purpose of the present invention is to provide a composition capable of forming a lithographic film having excellent EUV and EB sensitivity. A composition according to the present invention comprises a compound represented by formula (A1) and a compound represented by formula (B1).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 47/57 - Compounds having —CHO groups bound to carbon atoms of six-membered aromatic rings containing hydroxy groups polycyclic
  • C07C 47/565 - Compounds having —CHO groups bound to carbon atoms of six-membered aromatic rings containing hydroxy groups all hydroxy groups bound to the ring
  • C07C 47/575 - Compounds having —CHO groups bound to carbon atoms of six-membered aromatic rings containing ether groups, groups, groups, or groups
  • C07C 49/86 - Ketones containing a keto group bound to a six-membered aromatic ring containing —CHO groups
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

47.

METHOD FOR PRODUCING CYCLIC LACTAM

      
Application Number JP2025006010
Publication Number 2025/182802
Status In Force
Filing Date 2025-02-21
Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Tokuda Yuka
  • Aoyagi Naoto

Abstract

Provided is a method for producing a cyclic lactam. A method for producing a cyclic lactam comprising subjecting a thermoplastic resin including a polyamide resin containing a repeating unit represented by formula (a) to a depolymerization reaction with a polyphosphoric acid, wherein the amount of the polyphosphoric acid is 1 part by mass or more relative to 100 parts by mass of the polyamide resin containing the repeating unit represented by formula (a), and the thermoplastic resin contains 6 to 90 parts by mass of a linear polyolefin resin relative to 100 parts by mass of the polyamide resin containing the repeating unit represented by formula (a). In formula (a), n1 is an integer of 3 to 22. The value of n1 may be different for each repeating unit.

IPC Classes  ?

  • C07D 201/12 - Preparation of lactams by depolymerising polyamides

48.

RESIN COMPOSITION, FILM, POLARIZING SHEET, AND SUNGLASSES

      
Application Number JP2025006011
Publication Number 2025/182803
Status In Force
Filing Date 2025-02-21
Publication Date 2025-09-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Kosaka Megumu

Abstract

Provided are a resin composition, a film, a polarizing sheet, and sunglasses. The resin composition contains: a polyamide resin containing alicyclic diamine units and C7-20 aliphatic dicarboxylic acid units; a polyether amide elastomer; and a release agent.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • C08G 81/00 - Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
  • C08K 5/20 - Carboxylic acid amides
  • C08K 5/101 - EstersEther-esters of monocarboxylic acids

49.

METHOD FOR PRODUCING RECYCLED RESIN

      
Application Number JP2025005508
Publication Number 2025/178044
Status In Force
Filing Date 2025-02-19
Publication Date 2025-08-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shiratake Munenori
  • Ishizuka Hirohito
  • Hosokawa Tomoya
  • Hara Nozomi
  • Koshiishi Eiji

Abstract

A method for producing a recycled resin is provided in which an efficient filtration is possible and the production energy is inhibited from increasing. A method for producing a recycled resin according to one embodiment of the present invention comprises the following steps (A) to (C): (A) a step in which a waste-resin composition comprising a waste resin, an aryl alcohol, and a diol compound, wherein the weight ratio of the waste resin to the aryl alcohol is in the range of 1:0.1 to 1:6 and the weight ratio of the waste resin to the diol compound is in the range of 1:0.1 to 1:20, is heated to prepare a liquid reaction mixture; (B) a step in which the liquid reaction mixture obtained in the step (A) is filtered with a filter; and (C) a step in which the aryl alcohol is removed from a liquid reaction mixture obtained in the step (B).

IPC Classes  ?

  • C08J 11/24 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with organic material by treatment with organic oxygen-containing compounds containing hydroxyl groups

50.

PRODUCTION METHOD FOR β-Ga2O3/β-Ga2O3 LAMINATE, LAMINATE OBTAINED VIA SAID PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE COMPRISING SAID LAMINATE

      
Application Number JP2025004853
Publication Number 2025/177952
Status In Force
Filing Date 2025-02-14
Publication Date 2025-08-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Miyamoto Miyuki
  • Tadokoro Hiroaki
  • Chen Zhijin

Abstract

232323232323233 single crystal is -1×1019to +1×1019atoms/cm3233 single crystal is less than 0.01 mol%.

IPC Classes  ?

  • C30B 29/16 - Oxides
  • C30B 19/04 - Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
  • H01L 21/20 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
  • H10D 30/60 - Insulated-gate field-effect transistors [IGFET]

51.

METHOD FOR PURIFYING (METH)ACRYLIC ACID MONOMER AND/OR (METH)ACRYLIC ACID ESTER MONOMER

      
Application Number 18846812
Status Pending
Filing Date 2023-03-08
First Publication Date 2025-08-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yuri, Michihiro
  • Suzuki, Kouji
  • Yamaguchi, Yu
  • Sugita, Masaki
  • Sugano, Yuuichi

Abstract

A method for purifying a (meth)acrylic acid monomer and/or a (meth)acrylic acid ester monomer includes purifying a composition containing a (meth)acrylic acid monomer and/or a (meth)acrylic acid ester monomer by distillation, wherein from the beginning to the end of the distillation, oxygen is supplied, so that the molar ratio of oxygen to vapor derived from the (meth)acrylic acid monomer and/or the (meth)acrylic acid ester monomer in gas phase components in a distillation still is maintained at 1.50×10-3 or more.

IPC Classes  ?

  • C07D 303/16 - Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals

52.

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER

      
Application Number 18857545
Status Pending
Filing Date 2023-03-02
First Publication Date 2025-08-21
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Ikeuchi, Kousuke
  • Wakahara, Daiki
  • Ohnishi, Nobuyoshi
  • Okada, Kana
  • Matsumoto, Nobuhiko

Abstract

Provided are an epoxy resin curing agent, an epoxy resin composition, a cured product thereof, a fiber-reinforced composite material, and a high-pressure gas container including the fiber-reinforced composite material, the epoxy resin curing agent including the following components (A-1) and (A-2): (A-1) a reaction composition containing polycondensation reaction product of aniline derivative and formaldehyde (A-2) a reaction composition containing a reaction product of styrene and a compound represented by the following General Formula (1): Provided are an epoxy resin curing agent, an epoxy resin composition, a cured product thereof, a fiber-reinforced composite material, and a high-pressure gas container including the fiber-reinforced composite material, the epoxy resin curing agent including the following components (A-1) and (A-2): (A-1) a reaction composition containing polycondensation reaction product of aniline derivative and formaldehyde (A-2) a reaction composition containing a reaction product of styrene and a compound represented by the following General Formula (1): H2N—CH2-A-CH2—NH2  (1) (in Formula (1), A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group). Provided are an epoxy resin curing agent, an epoxy resin composition, a cured product thereof, a fiber-reinforced composite material, and a high-pressure gas container including the fiber-reinforced composite material, the epoxy resin curing agent including the following components (A-1) and (A-2): (A-1) a reaction composition containing polycondensation reaction product of aniline derivative and formaldehyde (A-2) a reaction composition containing a reaction product of styrene and a compound represented by the following General Formula (1): H2N—CH2-A-CH2—NH2  (1) (in Formula (1), A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group). In the epoxy resin curing agent, a content of the component (A-1) is from 50 to 95 mass %, and a content of the component (A-2) is from 5 to 50 mass %.

IPC Classes  ?

53.

OLIGOMERIC BINAPHTYL COMPOUNDS AND THERMOPLASTIC RESINS

      
Application Number 18858517
Status Pending
Filing Date 2023-04-24
First Publication Date 2025-08-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Nishimori, Katsushi
  • Motegi, Atsushi
  • Ishihara, Kentaro
  • Watanabe, Takafumi
  • Takamatsu, Kazutaka
  • Harada, Yutaro
  • Reuter, Karl
  • Koschker, Philipp
  • Andrushko, Vasyl
  • Kyri, Andreas
  • Stolz, Florian
  • Kantor, Mark

Abstract

Oligomeric binaphtyl compounds of formula (I), Oligomeric binaphtyl compounds of formula (I), where X1-X2 are selected from hydrogen, -Alk1-OH, —CH2-A2-CH2—OH, -Alk2-C(O)ORx, —CH2-A2-C(O)ORx and —C(O)-A2-C(O)ORx, where Rx is selected from the group consisting of hydrogen, phenyl, benzyl and C1-C4-alkyl; Y1-Y2 are selected from —CH2—, —CHArY- and —CH(CH2ArY)—; A1 is a single bond, —CH2—, —CHArA—, —CH(CH2ArA)-, —C(CH2ArA)2-, a moiety of the formula(A), mono- or polycyclic arylene having 6-26 carbon atoms as ring members or mono- or polycyclic hetarylene having 5-26 atoms, which are ring members, alternatively, the moiety —Y1-A1-Y2— in formula(I) is —CH2— or —CHArY-, n is 1, 2 or 3; m, p, q and r are 0, 1 or 2; R1-R4 are independently-selected from the group consisting of halogen, C2-C3-alkynyl, CN, R, OR, CHsR′3-s, NR2, C(O)R and CH═CHR″, R1, R2, R3 or R4 is identical or different if more than 1 of R1, R2, R3 or R4 is present, where s on each occurrence is 0, 1 or 2.

IPC Classes  ?

  • C07C 43/23 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
  • C07C 59/64 - Unsaturated compounds containing ether groups, groups, groups, or groups containing six-membered aromatic rings
  • C08G 65/34 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives

54.

RESIN COMPOSITION, FILM, POLARIZING SHEET, AND SUNGLASSES

      
Application Number JP2025004097
Publication Number 2025/173656
Status In Force
Filing Date 2025-02-07
Publication Date 2025-08-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Kosaka Megumu

Abstract

Provided are a resin composition, a film, a polarizing sheet, and sunglasses. The resin composition comprises: a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7-20 carbons; and a polyalkylene glycol. The polyalkylene glycol contains an ethylene glycol unit and/or a propylene glycol unit at a total proportion of 50 mol% or more of all units and has a number average molecular weight of 100-3,500.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • C08L 71/02 - Polyalkylene oxides
  • G02B 27/28 - Optical systems or apparatus not provided for by any of the groups , for polarising

55.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number 18846083
Status Pending
Filing Date 2023-03-13
First Publication Date 2025-08-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Itoh, Syouichi
  • Tadokoro, Hiroaki
  • Innan, Susumu
  • Miyamoto, Makoto
  • Futamura, Keisuke

Abstract

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton, and a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, wherein a mass ratio of a content of the resin (A) to a content of the polyphenylene ether compound (B); i.e., resin (A)/polyphenylene ether compound (B) is 5/95 to 70/30. In Formula (T1), Mb each independently represents a hydrocarbon group having from 1 to 12 carbons which may be substituted with a halogen atom; y represents an integer of 0 to 4; and * represents a bonding position with another moiety. Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton, and a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, wherein a mass ratio of a content of the resin (A) to a content of the polyphenylene ether compound (B); i.e., resin (A)/polyphenylene ether compound (B) is 5/95 to 70/30. In Formula (T1), Mb each independently represents a hydrocarbon group having from 1 to 12 carbons which may be substituted with a halogen atom; y represents an integer of 0 to 4; and * represents a bonding position with another moiety.

IPC Classes  ?

  • C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
  • B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCompositions of derivatives of such polymers
  • H05K 1/03 - Use of materials for the substrate

56.

METHOD FOR PRODUCING HYDROGENATED POLYMER BY USING PLURALITY OF SOLVENTS

      
Application Number 18855070
Status Pending
Filing Date 2023-04-10
First Publication Date 2025-08-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sato, Hideyuki
  • Arai, Hirokatsu
  • Nakamura, Yusuke
  • Matsushita, Miru
  • Kato, Noriyuki

Abstract

Provided is a hydrogenation method using a solvent that satisfactorily dissolves a polymer before and after hydrogenation. A method for producing a hydrogenated polymer by hydrogenating the aromatic ring of an aromatic vinyl compound-based polymer includes performing a hydrogenation reaction using the aromatic vinyl compound-based polymer, a solvent, and a hydrogenation catalyst, wherein the solvent is a mixed solvent containing at least one first solvent and at least one second solvent, and the Hansen solubility parameter (HSP) value of the mixed solvent 1) falls within a Hansen sphere on a three-dimensional space consisting of δd, δp, and δh axes of the aromatic vinyl compound-based polymer before hydrogenation, and 2) falls within a Hansen sphere on a three-dimensional space consisting of δd, δp, and δh axes of the aromatic vinyl compound-based polymer after hydrogenation.

IPC Classes  ?

57.

MULTILAYER BODY AND PRODUCTION METHOD FOR PRINTED WIRING BOARD

      
Application Number JP2025003268
Publication Number 2025/169861
Status In Force
Filing Date 2025-01-31
Publication Date 2025-08-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okumura Keisuke
  • Komatsu Kouki
  • Hasebe Keiichi
  • Hirano Shunsuke

Abstract

Provided are a multilayer body and a production method for a printed wiring board. A multilayer body according to the present invention includes a metal foil that has a surface roughness Rz of no more than 2 μm as measured in accordance with JIS B0601 1994 at at least one surface and a layer that contains a resin composition and is provided on a surface of the metal foil that has a surface roughness Rz of no more than 2 μm. The resin composition includes a thermosetting compound and a compound that has an unshared electron pair, includes an aromatic ring, and has a melting point of at least 10°C. The thermosetting compound may also have an unshared electron pair.

IPC Classes  ?

  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
  • C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
  • C08K 5/3415 - Five-membered rings
  • C08L 71/12 - Polyphenylene oxides
  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • H05K 1/03 - Use of materials for the substrate
  • H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

58.

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number 18846740
Status Pending
Filing Date 2023-03-16
First Publication Date 2025-08-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ito, Sayaka
  • Takamura, Tatsuro
  • Kashima, Naoki
  • Miyahira, Tetsuro
  • Ogashiwa, Takaaki

Abstract

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent heat resistance and moisture absorption and heat resistance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less, and (B) a thermosetting compound.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • C08G 8/32 - Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
  • C08G 65/48 - Polymers modified by chemical after-treatment
  • C08J 5/18 - Manufacture of films or sheets
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 9/02 - Ingredients treated with inorganic substances
  • C08K 9/08 - Ingredients agglomerated by treatment with a binding agent
  • C09K 5/14 - Solid materials, e.g. powdery or granular

59.

CYCLIC COMPOUND HAVING IODINE ATOM

      
Application Number 18855112
Status Pending
Filing Date 2023-04-10
First Publication Date 2025-08-07
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Matsumoto, Masahiro
  • Iinuma, Masataka
  • Omatsu, Tadashi
  • Sato, Takashi
  • Echigo, Masatoshi

Abstract

A compound represented by the following formula (1): A compound represented by the following formula (1): A compound represented by the following formula (1): wherein RG is a group containing at least one cyclic structure, I is an iodine atom, R1 is a monovalent functional group having 0 to 30 carbon atoms, containing no polymerizable unsaturated bond, and being optionally the same or different; n is an integer of 1 to 5, and m is an integer of 1 to 5.

IPC Classes  ?

  • C07C 29/62 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by introduction of halogenPreparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by substitution of halogen atoms by other halogen atoms
  • C07C 43/23 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
  • C07C 45/63 - Preparation of compounds having C=O groups bound only to carbon or hydrogen atomsPreparation of chelates of such compounds by reactions not involving the formation of C=O groups by introduction of halogenPreparation of compounds having C=O groups bound only to carbon or hydrogen atomsPreparation of chelates of such compounds by reactions not involving the formation of C=O groups by substitution of halogen atoms by other halogen atoms
  • C07C 67/28 - Preparation of carboxylic acid esters by modifying the hydroxylic moiety of the ester, such modification not being an introduction of an ester group
  • G03F 7/004 - Photosensitive materials

60.

METHOD FOR MANUFACTURING HYDROGENATED POLYMER

      
Application Number 18854584
Status Pending
Filing Date 2023-04-10
First Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sato, Hideyuki
  • Arai, Hirokatsu
  • Nakamura, Yusuke
  • Matsushita, Miru
  • Kato, Noriyuki

Abstract

Provided is a method for hydrogenating an aromatic ring (aromatic hydrogenation) of an aromatic vinyl compound polymer in order to obtain a hydrogenated polymer having sufficient heat resistance at a high rate of aromatic hydrogenation. More specifically, provided is a method for producing a hydrogenated polymer by hydrogenating an aromatic ring (aromatic hydrogenation) of an aromatic vinyl compound polymer, the method including reducing a hydrogenation catalyst before use.

IPC Classes  ?

  • C08F 8/04 - Reduction, e.g. hydrogenation
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

61.

METHOD FOR PRODUCING OPTICAL MATERIAL

      
Application Number 18855063
Status Pending
Filing Date 2023-04-10
First Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sato, Hideyuki
  • Arai, Hirokatsu
  • Nakamura, Yusuke
  • Matsushita, Miru
  • Kato, Noriyuki

Abstract

Provided is a method for producing an optical material by hydrogenating an aromatic ring (aromatic hydrogenation) of an aromatic vinyl compound polymer in order to obtain an optical material having sufficient heat resistance at a high rate of aromatic hydrogenation. More specifically, provided is a method for producing an optical material by hydrogenating an aromatic ring (aromatic hydrogenation) of an aromatic vinyl compound polymer, the method using a mixed solvent including at least one first solvent and at least one second solvent.

IPC Classes  ?

  • C08F 8/04 - Reduction, e.g. hydrogenation
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

62.

FIBER-REINFORCED COMPOSITE MATERIAL AND MOLDED ARTICLE

      
Application Number JP2024041570
Publication Number 2025/158763
Status In Force
Filing Date 2024-11-25
Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Ito Keisuke

Abstract

The present invention provides a fiber-reinforced composite material and a molded article. Provided is a fiber-reinforced composite material containing 100-200 parts by mass of continuous reinforcing fibers per 100 parts by mass of a polyamide resin, wherein the polyamide resin contains a diamine unit and a dicarboxylic acid unit, 70 mol% or more of the diamine unit is derived from a xylylenediamine, and 70 mol% or more of the dicarboxylic acid unit is derived from a C11-20 α,ω-linear aliphatic dicarboxylic acid.

IPC Classes  ?

  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • C08K 7/02 - Fibres or whiskers
  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids

63.

COMBINED FILAMENT YARN, WOVEN FABRIC, AND METHOD FOR PRODUCING SHAPED ARTICLE

      
Application Number JP2024041569
Publication Number 2025/158762
Status In Force
Filing Date 2024-11-25
Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Ito Keisuke

Abstract

The purpose of the present invention is to provide a combined filament yarn excellent in flexibility, woven fabric, and a method for producing a shaped article. This combined filament yarn of the present invention comprises continuous thermoplastic resin fibers and continuous reinforcing fibers, wherein the continuous thermoplastic resin fibers contain a diamine unit and a dicarboxylic acid unit, 70 mol% or more of the diamine unit is derived from xylylenediamine, and 70 mol% or more of the dicarboxylic acid unit contains a polyamide resin derived from an α,ω-linear aliphatic dicarboxylic acid having 11-20 carbon atoms.

IPC Classes  ?

  • D02G 3/04 - Blended or other yarns or threads containing components made from different materials
  • B29B 11/16 - Making preforms characterised by structure or composition comprising fillers or reinforcements

64.

FIBER-REINFORCED COMPOSITE MATERIAL, MOLDED ARTICLE, AND PRODUCTION METHOD FOR FIBER-REINFORCED COMPOSITE MATERIAL

      
Application Number JP2024041571
Publication Number 2025/158764
Status In Force
Filing Date 2024-11-25
Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Ito Keisuke

Abstract

Provided is a fiber-reinforced composite material using natural fibers. Specifically provided is a fiber-reinforced composite material containing a thermoplastic resin having a melting point of 180-220°C and natural fibers, wherein the natural fibers are impregnated with at least a portion of the thermoplastic resin, and the natural fibers are oriented in at least one direction.

IPC Classes  ?

  • B29B 15/12 - Coating or impregnating of reinforcements of indefinite length
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material
  • B29K 105/10 - Condition, form or state of moulded material containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns oriented

65.

OXYGEN SCAVENGER PACKAGE

      
Application Number JP2025000552
Publication Number 2025/158926
Status In Force
Filing Date 2025-01-09
Publication Date 2025-07-31
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Watanabe Risa
  • Sato Daiki
  • Masuyama Tomohiro

Abstract

Provided is an oxygen scavenger package comprising an oxygen scavenger and an air-permeable packaging bag (A) in which the oxygen scavenger is accommodated. The air-permeable packaging bag (A) contains no organic fluorine compound and is formed from a laminated packaging material (A1) comprising an outer layer (a1) having through-holes, an air-permeable layer (a2) having air permeability, and an inner layer (a3) having through-holes, in this order. The laminated packaging material (A1) has an air impermeability of 5-25,000 sec, excluding 25,000 sec, the outer layer (a1) and the air-permeable layer (a2) are bonded or fusion-bonded to each other over the entire interface, and the ratio of the number of the through-holes of the outer layer (a1) to the number of the through-holes of the inner layer (a3) is 0.08-40.0.

IPC Classes  ?

  • B65D 81/26 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contentsApplications of corrosion inhibitors or desiccators

66.

FILM, MULTILAYERED ARTICLE, THERMOFORMED ARTICLE, IN-MOLD FORMED ARTICLE, METHOD FOR PRODUCING FORMED ARTICLE, AND METHOD FOR PRODUCING IN-MOLD FORMED ARTICLE

      
Application Number 19174380
Status Pending
Filing Date 2025-04-09
First Publication Date 2025-07-24
Owner
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
  • MGC FILSHEET CO., LTD. (Japan)
Inventor Kaneko, Satoshi

Abstract

Provided is a film including a polycarbonate resin capable of achieving excellent drawdown resistance during thermoforming and excellent formability in processing a bent portion and the like thereof. The film contains a polycarbonate resin (a) which satisfies the following expression (i), when a viscosity at a shear rate of 6.080×10 [1/s] measured at 300° C. is X [Pa·s] and a viscosity at a shear rate of 6.080×103 [1/s] measured at 300° C. is Y [Pa·s]. Provided is a film including a polycarbonate resin capable of achieving excellent drawdown resistance during thermoforming and excellent formability in processing a bent portion and the like thereof. The film contains a polycarbonate resin (a) which satisfies the following expression (i), when a viscosity at a shear rate of 6.080×10 [1/s] measured at 300° C. is X [Pa·s] and a viscosity at a shear rate of 6.080×103 [1/s] measured at 300° C. is Y [Pa·s]. - 0.69 < logY - logX 2 < - 0.41 ( i )

IPC Classes  ?

  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
  • B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C 45/16 - Making multilayered or multicoloured articles
  • B29C 51/00 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor
  • B29K 69/00 - Use of polycarbonates as moulding material
  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
  • C08J 5/18 - Manufacture of films or sheets

67.

COMPOSITION FOR FORMING LITHOGRAPHY UNDERLAYER FILM, LITHOGRAPHY UNDERLAYER FILM, POSITIVE RESIST COMPOSITION, RESIST FILM, AND METHOD FOR FORMING RESIST PATTERN

      
Application Number JP2025000446
Publication Number 2025/154627
Status In Force
Filing Date 2025-01-09
Publication Date 2025-07-24
Owner
  • THE SCHOOL CORPORATION KANSAI UNIVERSITY (Japan)
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kudo Hiroto
  • Sato Takashi
  • Omatsu Tadashi
  • Echigo Masatoshi

Abstract

The present invention provides: a composition for forming a lithography underlayer film, the composition containing a polymer that contains a repeating unit derived from an iodine-containing monomer represented by general formula (1); and a positive resist composition which contains a polymer that contains a repeating unit derived from an iodine-containing monomer represented by formula (1). (In the formula, X1is a hydrogen atom, a methyl group, or a halogen atom, Y1 is -O- or -NH-, a is 0 or 1, and R is a group containing an iodine atom and 2 to 30 carbon atoms.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08F 20/22 - Esters containing halogen
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

68.

OXYGEN SCAVENGER COMPOSITION

      
Application Number JP2024046185
Publication Number 2025/150447
Status In Force
Filing Date 2024-12-26
Publication Date 2025-07-17
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Someya Masao
  • Nakata Takashi

Abstract

This oxygen scavenger composition contains (A) a metal halide-coated iron powder having iron oxide at the iron surface and (B) a moisture donor. The proportion of the element iron in the iron powder provided by removing the metal halide and moisture from the metal halide-coated iron powder (A) is 90.0-96.3 mass%. Also provided are a method for producing the oxygen scavenger composition, an oxygen scavenger package, and a deoxygenation method.

IPC Classes  ?

  • B01J 20/06 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising oxides or hydroxides of metals not provided for in group
  • A23B 2/717 - Oxygen absorbent
  • B01D 53/14 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
  • B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
  • B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
  • B01J 20/30 - Processes for preparing, regenerating or reactivating
  • B65D 81/26 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contentsApplications of corrosion inhibitors or desiccators

69.

THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME

      
Application Number 18852615
Status Pending
Filing Date 2023-04-06
First Publication Date 2025-07-10
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Nishimori, Katsushi
  • Motegi, Atsushi
  • Ishihara, Kentaro
  • Murata Suzuki, Shoko
  • Sato, Atsuhiro
  • Ishikawa, Shun

Abstract

A thermoplastic resin includes a constituent unit (A) derived from a monomer represented by general formula (1). A thermoplastic resin includes a constituent unit (A) derived from a monomer represented by general formula (1). A thermoplastic resin includes a constituent unit (A) derived from a monomer represented by general formula (1). (In the formula, each R1 independently represents a C6-14 aryl group or a C7-17 aralkyl group, each R2 independently represents a hydrogen atom, a C6-14 aryl group, or a C7-17 aralkyl group, each a independently represents an integer of 0 or 1-3, each R3 independently represents —OH or —O—(CH2)n—OH, and n represents an integer of 1-4.)

IPC Classes  ?

  • C08G 64/16 - Aliphatic-aromatic or araliphatic polycarbonates
  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation

70.

BLOWING AGENT, FOAMING RESIN COMPOSITION, POLYURETHANE UREA RESIN FOAM, AND PRODUCTION METHOD FOR POLYURETHANE UREA FOAM

      
Application Number 18852593
Status Pending
Filing Date 2023-02-28
First Publication Date 2025-07-10
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kawashima, Yuki
  • Kouno, Kazuki

Abstract

A blowing agent for obtaining a polyurethane urea resin foam, including a reaction product (a2) of an amine compound (a1) and carbon dioxide, the amine compound (a1) including at least one selected from the group consisting of xylylenediamine and derivatives thereof, and bis(aminomethyl)cyclohexane and derivatives thereof, wherein a water content of the blowing agent is 15% by mass or less.

IPC Classes  ?

  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/02 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules

71.

THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME

      
Application Number 18852629
Status Pending
Filing Date 2023-04-06
First Publication Date 2025-07-10
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Nishimori, Katsushi
  • Motegi, Atsushi
  • Ishihara, Kentaro
  • Murata Suzuki, Shoko
  • Harada, Yutaro

Abstract

A thermoplastic resin, includes a constituent unit (A) derived from a monomer represented by the following general formula (1): A thermoplastic resin, includes a constituent unit (A) derived from a monomer represented by the following general formula (1): wherein R1 each independently represents an alkylene group containing 1 to 4 carbon atoms, R2 each independently represents an alkyl group containing 1 to 6 carbon atoms, an aryl group containing 6 to 18 carbon atoms or a halogen atom, n each independently represents 0 or an integer of 1 to 4, and R3 each independently represents a hydrogen atom, an alkyl group containing 1 to 6 carbon atoms or an alkenyl group containing 2 to 4 carbon atoms.

IPC Classes  ?

  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
  • C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
  • C08G 63/197 - Hydroxy compounds containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
  • C08G 63/199 - Acids or hydroxy compounds containing cycloaliphatic rings
  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics

72.

METHOD FOR RECOVERING PLASTIC FILM

      
Application Number 18853166
Status Pending
Filing Date 2023-03-27
First Publication Date 2025-07-10
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kouno, Kazuki
  • Nohira, Itsuki
  • Kobayashi, Naoko

Abstract

Provided is a method for recovering a plastic film from a laminate. The laminate includes a plastic film (I), an inorganic layer (II) including at least one selected from the group consisting of silicon oxide, aluminum, and aluminum oxide, and a cured resin layer (III). The cured resin layer (III) is a cured product of an epoxy resin composition containing an epoxy resin and an epoxy resin curing agent, which contains an amine-based curing agent. The method includes bringing the laminate into contact with an acid aqueous solution or an alkaline aqueous solution.

IPC Classes  ?

  • C08J 11/04 - Recovery or working-up of waste materials of polymers

73.

RESIN COMPOSITION, MOLDED BODY, AND MULTILAYER BODY

      
Application Number 18843957
Status Pending
Filing Date 2022-12-09
First Publication Date 2025-07-03
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Kobayashi, Masayuki
  • Miyabe, Takanori

Abstract

A resin composition contains from 50 to 99 parts by mass of a polyethylene terephthalate resin and from 50 to 1 part by mass of a polyamide resin, wherein the polyamide resin is a copolymer containing a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, 70 mol % or higher of the diamine-derived structural unit is derived from xylylenediamine, from 65.0 to 95.0 mol % of the dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 8 carbons, from 35.0 to 5.0 mol % of the dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic dicarboxylic acid having from 9 to 12 carbons, and the polyamide resin has a relative viscosity of from 1.7 to 2.5.

IPC Classes  ?

  • C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds

74.

RESIN COMPOSITION, MOLDED PRODUCT, AND METHOD FOR PRODUCING THE MOLDED PRODUCT

      
Application Number 18850137
Status Pending
Filing Date 2022-12-05
First Publication Date 2025-07-03
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Oguro, Hatsuki
  • Amano, Akio

Abstract

A resin composition includes, per 100 parts by mass of a total of a polyamide resin A and a polyamide resin B, 1 to 15 parts by mass of the polyamide resin B, a difference between a melting point Tmb of the polyamide resin B and a melting point Tma of the polyamide resin A is 35 to 110° C., a structural unit derived from a diamine includes 100 to 50 mol % of a structural unit derived from m-xylylenediamine in the polyamide resin A, 70 mol % or more of a structural unit derived from a dicarboxylic acid is derived from an α,ω-linear aliphatic dicarboxylic acid having 7 to 16 carbon atoms, the structural unit derived from a diamine includes 100 to 95 mol % of a structural unit derived from p-xylylenediamine in the polyamide resin B, and 70 mol % or 10 more of the structural unit derived from a dicarboxylic acid is derived from an α,ω-linear aliphatic dicarboxylic acid having 7 to 16 carbon atoms.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
  • B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material

75.

BLOWING AGENT, FOAMING RESIN COMPOSITION, POLYUREA RESIN FOAM, AND PRODUCTION METHOD FOR POLYUREA RESIN FOAM

      
Application Number 18852578
Status Pending
Filing Date 2023-02-28
First Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kawashima, Yuki
  • Kouno, Kazuki

Abstract

A blowing agent for obtaining a polyurea resin foam including a polyurea having a repeating unit represented by the following general formula (I), the blowing agent including a reaction product (a2) of a cyclic amine compound (a1) and carbon dioxide. (In the formula I, R1 is a divalent hydrocarbon group having a cyclic structure optionally having a substituent, and R2 is a divalent hydrocarbon group optionally having a substituent.) A blowing agent for obtaining a polyurea resin foam including a polyurea having a repeating unit represented by the following general formula (I), the blowing agent including a reaction product (a2) of a cyclic amine compound (a1) and carbon dioxide. (In the formula I, R1 is a divalent hydrocarbon group having a cyclic structure optionally having a substituent, and R2 is a divalent hydrocarbon group optionally having a substituent.)

IPC Classes  ?

  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08G 18/32 - Polyhydroxy compoundsPolyaminesHydroxy amines
  • C08G 101/00 - Manufacture of cellular products
  • C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic

76.

MEMBER FOR PROBE CARD OR MEMBER FOR PRINTED CIRCUIT BOARD INSPECTION JIG, AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2024040406
Publication Number 2025/142176
Status In Force
Filing Date 2024-11-14
Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sato Yuuki
  • Sakai Atsushi

Abstract

Provided is a member for a probe card or a member for a printed circuit board inspection jig, wherein the member comprises a thermoplastic resin composition containing component (A), which is at least one thermoplastic resin selected from the group consisting of crystalline thermoplastic resins (a1) having a melting point of 270°C or higher and amorphous thermoplastic resins (a2) having a glass transition temperature of 200°C or higher, and component (B), which is an inorganic filler that contains zirconium oxide (b1), the component (b1) content being 2-40 parts by mass per 100 parts by mass of the component (A), and the component (B) content being 2-60 parts by mass per 100 parts by mass of the component (A). Also provided is a method for producing the member.

IPC Classes  ?

  • G01R 1/073 - Multiple probes
  • C08K 3/22 - OxidesHydroxides of metals
  • C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
  • C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
  • G01R 31/26 - Testing of individual semiconductor devices
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

77.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL–CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number JP2024042243
Publication Number 2025/142301
Status In Force
Filing Date 2024-11-28
Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Nonaka Hiroyuki
  • Tawara Yuta
  • Sato Naoto
  • Sahara Shunya
  • Kikuta Kohei
  • Motoyoshi Ryo
  • Nakazumi Yoshihiro
  • Kashima Naoki
  • Koga Shota
  • Ogashiwa Takaaki

Abstract

The purpose of the present invention is to provide: a resin composition that is ideal for production of an insulating layer for a printed wiring board that has a high dielectric constant, a low dielectric loss tangent, excellent thermal characteristics, excellent laser processability, and high metal foil peeling strength; and a prepreg, a resin sheet, a laminate, a metal foil–clad laminate, and a printed wiring board obtained using the resin composition. This resin composition includes: a dielectric powder (A) that has a relative permittivity of at least 12.0 at a frequency of 10 GHz as measured in accordance with a cavity resonator perturbation method, an inorganic filler (B) that is different from the dielectric powder (A), has a melting point of no more than 1600°C, and has an absorbance of at least 0.70 at a wavelength of 9.3 μm on an infrared absorption spectrum obtained using Fourier transform infrared spectroscopy, and a thermosetting resin (C).

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • B32B 7/025 - Electric or magnetic properties
  • B32B 7/027 - Thermal properties
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 3/24 - AcidsSalts thereof
  • C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
  • C08L 71/12 - Polyphenylene oxides
  • C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
  • H05K 1/03 - Use of materials for the substrate

78.

METHANOL PRODUCTION METHOD AND METHANOL PRODUCTION DEVICE

      
Application Number JP2024045016
Publication Number 2025/142739
Status In Force
Filing Date 2024-12-19
Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shibata Akihiro
  • Abe Takanori
  • Kakimi Atsushi

Abstract

Provided is a methanol production method comprising: a step (A) for obtaining a synthesis gas that contains at least carbon dioxide and hydrogen; a step (B) for reacting the synthesis gas in the presence of a catalyst to obtain a methanol mixture; a step (C) for distilling the methanol mixture to separate each of methanol and distilled wastewater; a step (D) for removing, from the distilled wastewater, an acid and/or a base and salts of these; and a step (E) for using, in step (A), a gas and/or a liquid obtained in step (D).

IPC Classes  ?

  • C07C 29/152 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the reactor used
  • C02F 1/42 - Treatment of water, waste water, or sewage by ion-exchange
  • C02F 3/28 - Anaerobic digestion processes
  • C07B 61/00 - Other general methods
  • C07C 31/04 - Methanol

79.

METHANOL PRODUCTION METHOD AND METHANOL PRODUCTION DEVICE

      
Application Number JP2024045017
Publication Number 2025/142740
Status In Force
Filing Date 2024-12-19
Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shibata Akihiro
  • Abe Takanori
  • Kakimi Atsushi

Abstract

A methanol production method comprising: a step (A) for acquiring a synthesis gas comprising at least carbon dioxide and hydrogen; a step (B) for reacting the synthesis gas in the presence of a catalyst to obtain a methanol mixture; a step (C) for distilling the methanol mixture to separate out each of methanol, a distillation waste liquid, and distillation wastewater; and a step (D) for subjecting the distillation waste liquid and/or the distillation wastewater to an organic matter decomposition treatment to obtain a decomposition gas and treated water.

IPC Classes  ?

  • C07C 29/152 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the reactor used
  • C02F 3/12 - Activated sludge processes
  • C02F 3/28 - Anaerobic digestion processes
  • C07B 61/00 - Other general methods
  • C07C 31/04 - Methanol
  • C25B 1/04 - Hydrogen or oxygen by electrolysis of water
  • C25B 9/00 - Cells or assemblies of cellsConstructional parts of cellsAssemblies of constructional parts, e.g. electrode-diaphragm assembliesProcess-related cell features

80.

RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED BODY

      
Application Number JP2024045806
Publication Number 2025/142976
Status In Force
Filing Date 2024-12-25
Publication Date 2025-07-03
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Noriyuki
  • Nishimori Katsushi
  • Motegi Atsushi
  • Ishihara Kentaro
  • Fukui Kiyoshiro

Abstract

There has been a need for a resin composition that enables a molded body, which is obtained by molding the resin composition, or the like to have excellent properties. In addition, it has not been easy to reliably and easily produce a resin composition, which enables the achievement of a molded body having excellent properties, by a conventional production method. The above-mentioned problem is solved by a resin composition which contains an oligomer that includes a first constituent unit (A) derived from a monomer represented by general formula (1), and a polycarbonate resin that includes a second constituent unit (B) derived from a monomer represented by any one of general formulae (2a) to (2c), wherein the molecular weight (Mw) of the oligomer is 500-20,000. The details of general formulae (1) and (2a) to (2c) are as shown in the description of the present application.

IPC Classes  ?

  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates

81.

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number 18849811
Status Pending
Filing Date 2023-03-24
First Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Takamura, Tatsuro
  • Ito, Sayaka
  • Yamaguchi, Shohei
  • Sahara, Shunya
  • Kashima, Naoki
  • Ogashiwa, Takaaki

Abstract

A resin composition has a high permittivity and a low dissipation factor, and having a high peel strength of the metal foil, excellent moisture absorption and heat resistance, and favorable thermal characteristics, and suitably used for producing an insulation layer of a printed wiring board; and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) a dielectric powder, (B) an aromatic phosphorus compound, and (C) a thermosetting resin.

IPC Classes  ?

  • C08K 3/22 - OxidesHydroxides of metals
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
  • C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
  • C08K 5/5373 - Esters of phosphonic acids containing heterocyclic rings not representing cyclic esters of phosphonic acids
  • C08K 5/5399 - Phosphorus bound to nitrogen
  • C08L 65/02 - Polyphenylenes

82.

METHOD FOR PRODUCING POLYHYDROXYALKANOIC ACID AGGREGATE

      
Application Number JP2024036507
Publication Number 2025/134498
Status In Force
Filing Date 2024-10-11
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Itani, Shunto
  • Yoshimura, Takafumi
  • Abe , Hisaki

Abstract

To provide a method for efficiently producing a high-purity aggregate of PHA from a culture solution containing polyhydroxyalkanoic acid (PHA) accumulated in bacterial cells. An aggregate of PHA is obtained by a very simple method in which hydrogen peroxide and a surfactant are added to a culture solution containing bacterial cells containing PHA and stirred under prescribed conditions.

IPC Classes  ?

  • C12P 7/625 - Polyesters of hydroxy carboxylic acids
  • C08L 101/16 - Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
  • C12N 15/09 - Recombinant DNA-technology

83.

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER

      
Application Number JP2024040239
Publication Number 2025/134612
Status In Force
Filing Date 2024-11-13
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Wakahara Daiki
  • Ikeuchi Kousuke

Abstract

Provided are: a thermosetting resin composition containing (A) a polyfunctional epoxy resin, (B) a (meth)acrylate compound that does not have a glycidyl group, (C) a compound that has a (meth)acryloyloxy group and a glycidyl group, (D) an epoxy resin curing agent that includes a boron amine complex, and (E) a thermal radical polymerization initiator; a cured product thereof; a prepreg containing the thermosetting resin composition; a fiber-reinforced composite material; and a high-pressure gas container.

IPC Classes  ?

  • C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • F16J 12/00 - Pressure vessels in general

84.

METHOD FOR MANUFACTURING OPTICAL COMPONENT

      
Application Number JP2024041900
Publication Number 2025/134706
Status In Force
Filing Date 2024-11-27
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okabe Yuta
  • Nyuui Tatsuki
  • Tsuruya Hirotaka

Abstract

xx layer (x is 1.5-2.0) having a thickness of 0.5-2.0 μm on a first layer by a resistance heating vapor deposition method, and furthermore forming a laminate in which a plurality of metal oxide layers and/or non-metal oxide layers are laminated by an electron beam vapor deposition method after a second layer.

IPC Classes  ?

  • G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
  • C23C 14/08 - Oxides
  • C23C 14/20 - Metallic material, boron or silicon on organic substrates
  • C23C 14/24 - Vacuum evaporation
  • C23C 14/30 - Vacuum evaporation by wave energy or particle radiation by electron bombardment
  • G02B 1/10 - Optical coatings produced by application to, or surface treatment of, optical elements
  • G02B 1/14 - Protective coatings, e.g. hard coatings
  • G02B 1/115 - Multilayers
  • G02B 3/00 - Simple or compound lenses

85.

COMPOUND, ORGANIC THIN FILM, PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, OPTICAL SENSOR, AND SOLID STATE IMAGING DEVICE

      
Application Number JP2024044001
Publication Number 2025/134913
Status In Force
Filing Date 2024-12-12
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shimizu Masahiro
  • Sasage Tomonari
  • Takamura Tatsuro
  • Yamamoto Takashi

Abstract

13243515677 are each independently a hydrogen atom, a halogen atom other than a fluorine atom, a cyano group, a straight chain, a branched or cyclic alkyl group, or the like).

IPC Classes  ?

  • C07D 491/14 - Ortho-condensed systems
  • C07D 491/147 - Ortho-condensed systems the condensed system containing one ring with oxygen as ring hetero atom and two rings with nitrogen as ring hetero atom
  • H10F 39/18 - Complementary metal-oxide-semiconductor [CMOS] image sensorsPhotodiode array image sensors
  • H10K 30/60 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation in which radiation controls flow of current through the devices, e.g. photoresistors
  • H10K 30/85 - Layers having high electron mobility, e.g. electron-transporting layers or hole-blocking layers
  • H10K 39/32 - Organic image sensors
  • H10K 85/60 - Organic compounds having low molecular weight

86.

CLEANING SOLUTION FOR SIMULTANEOUSLY REMOVING PHOTORESIST RESIDUE AND ETCH STOP LAYER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT ELEMENT USING SAME

      
Application Number JP2024044885
Publication Number 2025/135091
Status In Force
Filing Date 2024-12-19
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shimada Kenji
  • Takakuwa Hiroaki
  • Kikunaga Takahiro

Abstract

According to the present invention, it is possible to provide a cleaning solution for simultaneously removing a photoresist film or residue generated after a photoresist ashing process and aluminum oxide, which is an etch stop layer, in a process for forming metal traces on a board, the cleaning solution containing at least one organic alkali selected from the group consisting of amines or quaternary ammonium hydroxides, and at least one organic solvent (except dimethyl sulfoxide), in which the concentration of the amines is between 0.1% and 25% by mass of the total mass of the cleaning solution or the concentration of the quaternary ammonium hydroxides is between 0.05% and 0.5% by mass of the total mass of the cleaning solution.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

87.

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number 18846436
Status Pending
Filing Date 2023-03-16
First Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Takamura, Tatsuro
  • Ito, Sayaka
  • Kashima, Naoki
  • Miyahira, Tetsuro
  • Ogashiwa, Takaaki

Abstract

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent moisture absorption and heat resistance, a high glass transition temperature, and a low coefficient of thermal expansion, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide and (B) a thermosetting compound, wherein a water absorption rate calculated by the formula (i) is 0.40% or less. An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent moisture absorption and heat resistance, a high glass transition temperature, and a low coefficient of thermal expansion, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide and (B) a thermosetting compound, wherein a water absorption rate calculated by the formula (i) is 0.40% or less. Water absorption rate (%)=[(M2−M1)/M1]×100  (i)

IPC Classes  ?

  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08J 5/18 - Manufacture of films or sheets
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 9/02 - Ingredients treated with inorganic substances
  • H05K 1/03 - Use of materials for the substrate

88.

COMPOSITION FOR PROTECTING COPPER SURFACE, AND METHOD FOR PRODUCING SEMICONDUCTOR INTERMEDIATE AND SEMICONDUCTOR USING SAME

      
Application Number 18847732
Status Pending
Filing Date 2023-03-17
First Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Oie, Toshiyuki

Abstract

Provided are a composition for protecting a copper surface, a method for producing a semiconductor intermediate using the composition, and a method for producing a semiconductor using the composition. The composition contains a solvent and at least one copper surface protectant chosen from compounds represented by formulae (1) to (3) below and salts thereof: Provided are a composition for protecting a copper surface, a method for producing a semiconductor intermediate using the composition, and a method for producing a semiconductor using the composition. The composition contains a solvent and at least one copper surface protectant chosen from compounds represented by formulae (1) to (3) below and salts thereof:

IPC Classes  ?

  • C23F 11/167 - Phosphorus-containing compounds
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/321 - After-treatment

89.

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND PRODUCTION METHOD FOR MOLDED BODY

      
Application Number JP2024040240
Publication Number 2025/134613
Status In Force
Filing Date 2024-11-13
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Wakahara Daiki
  • Ikeuchi Kousuke

Abstract

Provide are: a thermosetting resin composition containing (A) an epoxy resin that does not include a polybutadiene structure, (B) a (meth)acrylate compound, (C) a reactive diluent, (D) an epoxy resin curing agent, and (E) a thermal radical polymerization initiator; a cured product thereof; a fiber-reinforced composite material containing the cured product and reinforcing fibers; and a production method for a molded body including the fiber-reinforced composite material.

IPC Classes  ?

  • C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
  • B29C 70/06 - Fibrous reinforcements only
  • B29C 70/28 - Shaping operations therefor
  • C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • C08G 59/72 - Complexes of boron halides
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • B29K 63/00 - Use of epoxy resins as moulding material
  • B29K 105/08 - Condition, form or state of moulded material containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns

90.

MULTILAYER BODY, POLARIZING SHEET, THERMALLY-BENT MOLDED BODY, AND POLARIZING LENS

      
Application Number JP2024043977
Publication Number 2025/134909
Status In Force
Filing Date 2024-12-12
Publication Date 2025-06-26
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Kosaka Megumu

Abstract

Provided are: a multilayer body; and a polarizing sheet, a thermally-bent molded body, and a lens, in all of which the multilayer body is used. This multilayer body has a polycarbonate film having a thickness of 150-3000 μm, and a transparent conductive layer. The transparent conductive layer contains polyethylenedioxythiophene and polystyrene sulfonate.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 7/023 - Optical properties
  • B32B 7/025 - Electric or magnetic properties
  • G02B 1/16 - Optical coatings produced by application to, or surface treatment of, optical elements having an anti-static effect, e.g. electrically conducting coatings
  • G02B 5/30 - Polarising elements

91.

OXYGEN SCAVENGER PACKAGING MATERIAL AND OXYGEN SCAVENGER PACKAGE

      
Application Number 18847421
Status Pending
Filing Date 2023-03-17
First Publication Date 2025-06-19
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Watanabe, Risa
  • Masuyama, Tomohiro

Abstract

An oxygen scavenger packaging material includes, in this order, an inner layer containing a thermoplastic resin, an intermediate layer containing an oil-resistant paper, and an outer layer containing a thermoplastic resin, the oil-resistant paper containing no fluorine; and the oxygen scavenger packaging material includes an inner side air hole that passes through the inner layer and the intermediate layer, and an outer side air hole that passes through the outer layer.

IPC Classes  ?

  • B65D 65/40 - Applications of laminates for particular packaging purposes
  • B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/10 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of paper or cardboard
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B65D 81/26 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contentsApplications of corrosion inhibitors or desiccators

92.

COMPOSITION FOR SEMICONDUCTOR SUBSTRATE CLEANING, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2024043722
Publication Number 2025/127048
Status In Force
Filing Date 2024-12-11
Publication Date 2025-06-19
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ido Yuto
  • Kawai Ryuichiro

Abstract

The present invention is able to provide a composition for semiconductor substrate cleaning, the composition containing: a component (A) that is at least one substance which is selected from the group consisting of hydrofluoric acid, a salt of hydrofluoric acid, an acid that has an anion represented by general formula (a) as a conjugate base, and a salt of the acid that has an anion represented by general formula (a) as a conjugate base; a component (B) that is a compound represented by general formula (b); a component (C) that is an oxidant; a component (D) that is a tungsten corrosion inhibitor; a component (E) that is an organic solvent; and a component (F) that is water. The component (E) contains at least one substance that is selected from the group consisting of tetrahydrofuran, acetone, and acetonitrile, and α represented by formula (I) is 0.2 to 1.1 inclusive.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • C09K 13/08 - Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
  • C11D 1/00 - Detergent compositions based essentially on surface-active compoundsUse of these compounds as a detergent
  • C23F 11/00 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
  • H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks

93.

COMPOSITION, METHOD FOR ROUGHENING STAINLESS STEEL SURFACE USING SAME, ROUGHENED STAINLESS STEEL, AND METHOD FOR PRODUCING SAID ROUGHENED STAINLESS STEEL

      
Application Number 19069452
Status Pending
Filing Date 2025-03-04
First Publication Date 2025-06-19
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeda, Kazuhiko
  • Fujii, Tomoko
  • Matsunaga, Hiroshi
  • Tamai, Satoshi

Abstract

The present invention provides: a composition with which the surface of a stainless steel is sufficiently roughened in an efficient manner with few steps; a method for roughening a stainless steel; and the like. The above are achieved by means of a composition for roughening the surface of a stainless steel, said composition containing from 0.1% by mass to 25% by mass of one or more substances that are selected from the group consisting of persulfuric acid and persulfuric acid salts based on the total amount of the composition, and from 1% by mass to 30% by mass of halide ions based on the total amount of the composition.

IPC Classes  ?

  • C23F 1/28 - Acidic compositions for etching iron group metals
  • H01M 4/66 - Selection of materials
  • H01M 4/70 - Carriers or collectors characterised by shape or form

94.

CARBON DIOXIDE GAS DETECTOR

      
Application Number JP2024042780
Publication Number 2025/126913
Status In Force
Filing Date 2024-12-04
Publication Date 2025-06-19
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ishii Haruka
  • Itoh Takayoshi

Abstract

This carbon dioxide gas detector is obtained by impregnating a carrier with an ink composition. The ink composition contains a pH indicator, an alkali agent, a water retention agent, a silver-based antimicrobial agent, and water. The content of the silver-based antimicrobial agent in terms of silver is 0.001-0.02 mass% with respect to the total amount of the carbon dioxide gas detector.

IPC Classes  ?

  • G01N 31/00 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods
  • G01N 31/22 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods using chemical indicators

95.

DOUGELIDE

      
Application Number 1859226
Status Registered
Filing Date 2025-05-07
Registration Date 2025-05-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
NICE Classes  ? 03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations

Goods & Services

Perfumery; synthetic perfumery; natural perfumery; perfumes for industrial purpose.

96.

OXYGEN SCAVENGER COMPOSITION, OXYGEN SCAVENGER PACKAGE, AND METHOD FOR MANUFACTURING OXYGEN SCAVENGER PACKAGE

      
Application Number 18845609
Status Pending
Filing Date 2023-03-16
First Publication Date 2025-06-12
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Nakata, Takashi
  • Someya, Masao
  • Watanabe, Keisuke

Abstract

There is provided an oxygen scavenger composition comprising iron, a metal salt and water, wherein the content of water per unit surface area of the iron present on the surface of the iron, [the content of water present on the surface of the iron] (g)/{the content of the iron (g)×the specific surface area of the iron (m2/g)}], is 0.60 g/m2 or more and 2.00 g/m2 or less.

IPC Classes  ?

  • B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
  • B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
  • B01J 20/30 - Processes for preparing, regenerating or reactivating
  • B01J 20/32 - Impregnating or coating
  • B65D 81/26 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contentsApplications of corrosion inhibitors or desiccators

97.

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number 18846102
Status Pending
Filing Date 2023-03-13
First Publication Date 2025-06-12
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Itoh, Syouichi
  • Tadokoro, Hiroaki
  • Innan, Susumu
  • Miyamoto, Makoto
  • Futamura, Keisuke

Abstract

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains 10 to 300 parts by mass of a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, and 10 to 300 parts by mass of a polymer having a structural unit represented by Formula (V), relative to 100 parts by mass of a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton. Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains 10 to 300 parts by mass of a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, and 10 to 300 parts by mass of a polymer having a structural unit represented by Formula (V), relative to 100 parts by mass of a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton.

IPC Classes  ?

  • C08L 25/16 - Homopolymers or copolymers of alkyl-substituted styrenes
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08L 71/12 - Polyphenylene oxides
  • H05K 1/03 - Use of materials for the substrate

98.

RESIN, RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number 18846113
Status Pending
Filing Date 2023-03-13
First Publication Date 2025-06-12
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Futamura, Keisuke
  • Miyamoto, Makoto
  • Itoh, Syouichi
  • Tadokoro, Hiroaki
  • Aoyagi, Naoto

Abstract

Provided is a resin, a resin composition containing the resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. Provided is a resin represented by Formula (T), wherein a parameter α indicating a proportion of a structural unit having an indane skeleton is 0.55 or more and 1.00 or less, and a parameter β indicating a proportion of a terminal double bond is 0.20 or more and 3.00 or less. In Formula (T), R is a group containing structural units represented by Formula (Tx). Provided is a resin, a resin composition containing the resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. Provided is a resin represented by Formula (T), wherein a parameter α indicating a proportion of a structural unit having an indane skeleton is 0.55 or more and 1.00 or less, and a parameter β indicating a proportion of a terminal double bond is 0.20 or more and 3.00 or less. In Formula (T), R is a group containing structural units represented by Formula (Tx).

IPC Classes  ?

  • C08F 112/34 - Monomers containing two or more unsaturated aliphatic radicals
  • C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

99.

HYDROXY RESIN, STYRENE RESIN, METHOD FOR PRODUCING HYDROXY RESIN, METHOD FOR PRODUCING STYRENE RESIN, AND APPLICATIONS THEREOF

      
Application Number 18846115
Status Pending
Filing Date 2023-03-13
First Publication Date 2025-06-12
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Miyamoto, Makoto
  • Futamura, Keisuke

Abstract

Provided is a styrene resin, a hydroxy resin, a method for producing a hydroxy resin, a method for producing a styrene resin, a resin composition containing a styrene resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. Provided is a hydroxy resin represented by Formula (T-OH) and having a number average molecular weight of 850 to 4000. In Formula (T-OH), R is a group containing structural units represented by Formula (Tx-OH). Provided is a styrene resin, a hydroxy resin, a method for producing a hydroxy resin, a method for producing a styrene resin, a resin composition containing a styrene resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. Provided is a hydroxy resin represented by Formula (T-OH) and having a number average molecular weight of 850 to 4000. In Formula (T-OH), R is a group containing structural units represented by Formula (Tx-OH).

IPC Classes  ?

  • C08F 8/02 - Alkylation
  • C08F 112/34 - Monomers containing two or more unsaturated aliphatic radicals
  • C08F 257/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group on to polymers of styrene or alkyl-substituted styrenes
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 3/36 - Silica

100.

MATERIAL FOR ASSISTING METAL MACHINING PROCESS AND MACHINING METHOD

      
Application Number 19054015
Status Pending
Filing Date 2025-02-14
First Publication Date 2025-06-12
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Nonaka, Hiroyuki
  • Yaginuma, Michio
  • Yokosuka, Ryota

Abstract

A material for assisting metal machining process, having a polymer compound, wherein a content of the polymer compound is 50% by mass or more based on the total amount of the material for assisting metal machining process, a melting point is 40° C. or more, and a temperature at 5% weight loss is 275° C. or more.

IPC Classes  ?

  • C10M 107/44 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
  • B23B 35/00 - Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machinesUse of auxiliary equipment in connection with such methods
  • B23P 17/04 - Metal-working operations, not covered by a single other subclass or another group in this subclass characterised by the nature of the material involved or the kind of product independently of its shape
  • C10N 40/20 - Metal working
  • C10N 40/22 - Metal working with essential removal of material
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