A substrate storage container 1 comprises a container body 2 and a lid 3. The container body 2 has a back wall 22, an upper wall 23, a lower wall 24, and a pair of side walls 25, 26. The substrate storage container 1 is further provided with lateral substrate support parts 5 that are disposed so as to form a pair in the lateral direction D3 within a substrate storage space 27, and that are capable of supporting edges of a plurality of substrates W in a state in which adjacent substrates W among the plurality of substrates W are aligned with a predetermined spacing therebetween. The lateral substrate support parts 5 and the side walls 25, 26 are integrally formed. An inner surface 232 of the upper wall 23 and/or an inner surface 242 of the lower wall 24 includes: an inner region 233, 243 located at an inner side D34 in the lateral direction D3; and outer regions 234, 244 located at both outer sides D33 in the lateral direction D3 with respect to the inner region 233, 243. The outer regions 234, 244 are displaced toward an outer side D23 in the vertical direction D2 as the outer regions 234, 244 extend toward the inner side D34 in the lateral direction D3. The inner region 233, 243 includes: a step surface 237, 247 recessed on the outer side D23 in the vertical direction D2 with respect to the outer regions 234, 244; and a guide part 238, 248 that is displaced on an inner side D24 or the outer side D23 in the vertical direction D2 with respect to the step surface 237, 247.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
2.
SUBSTRATE STORAGE CONTAINER AND EXTERIOR COMPONENT
A substrate storage container 1 is provided with a fixing component 85 which is movable between a fixed position and a non-fixed position in a state of being supported by an exterior component 8. In the fixed position, a movement-blocking member 853 is disposed on the trajectory of movement of a receiving object 256 relative to the exterior component 8 so that a receiving object 2 abuts the movement-blocking member 853, thereby blocking movement of the exterior component 8 with respect to the receiving object 256. The receiving object serves to receive attachment of the component. In the non-fixed position, the movement-blocking member 853 is disposed at a position offset from the trajectory of movement of the receiving object 256 relative to the exterior component 8 so that the receiving object 2 is placed in a state of not abutting the movement-blocking member 853, thereby allowing movement of the exterior component 8 with respect to the receiving object 2.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storage container 1 comprising: a container body 2 in which a substrate storage space 27 is formed; a lid body 3 capable of occluding a container body opening 21; a groove forming portion 2450b having a downwardly opening groove; a fixed portion 2450a that is engaged with a fixing portion 2401 of a lower wall 24; a groove member 245 supported and fixed to the lower wall 24; and a bottom plate 244 that is fixed to the lower wall 24 and constitutes a bottom portion of the container body 2 together with the lower wall 24, where a part of the groove member 245 is supported and fixed to the lower wall 24 in a state of being covered by the bottom plate 244.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprising: a container body 2; a lid body 3; ventilation passages 98, 99 capable of communicating a substrate storage space 27 with a space outside the container body 2; and a gas injection nozzle part 8 having a plurality of opening parts 841 for supplying gas flowing into the ventilation passages 98, 99 to the substrate storage space 27. The plurality of opening parts 641 are opened in a direction toward a collision position T so that the gas supplied from the plurality of opening parts 841 collides at the collision position T, the collision position T being located closer to an other-end part 22 of the container body 2 than to the center C of a substrate W stored in the container body 2 and being located on a virtual line L1 connecting a one-end part 21 and the other-end part 22 of the container body 2 and passing through the center of the substrate W.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This substrate storage container comprises: a container body for storing plate-shaped substrates W having at least one corner in the plan view, with a substrate storage space 27 formed therein in which the substrates W can be stored in parallel, in which there is an opening peripheral part at one end in which a container body opening communicating with the substrate storage space 27 is formed, and the other end is closed; a lid body that is detachable from the container body opening and that can close the container body opening; and side substrate support parts 5 arranged in pairs inside the substrate storage space 27, and in a state in which adjacent substrates W are arranged in parallel separated by a prescribed interval, are able to support the edge of the substrates W. The side substrate support part 5 has a plurality of plate parts 51 arranged between adjacent substrates W, and a plate support part 52 that supports the plate parts 51. The plate support part 52 has an opening part 53 that opens in a direction intersecting a vertical direction D2 which is a direction in which the plate parts 51 are parallel, and a non-opening part 54 that is arranged at least between the plate parts 51 and the opening part 53 in the vertical direction D2.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprises: a container body 2 in which a substrate storage space 27 is formed; and a lid body 3 capable of closing a container body opening 21. The substrate storage container 1 comprises a groove member 245 having a groove formation part 2451 in which a groove opening downward is formed and a locked part 2456 which is connected to the groove formation part 2451, is elastically deformable, and is locked to a locking part 2402 of a lower wall 24 by elastically deforming, and is supported by and fixed to the lower wall 24. The lower wall 24 has a storage part 2401 capable of storing the whole of the groove member 245, and the locked part 2456 is arranged in the storage part 2401.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storage container 1 comprising a pair of side walls 26 having outer surfaces each provided with a handling member 261 for supporting a container body 2, wherein the handling member 261 comprises front-rear direction extension parts 2611, 2612 which are provided in a pair in a vertical direction D2 and extend in a front-rear direction D1 and a front connection part 2613 which connects front end parts of the pair of front-rear direction extension parts 2611, 2612 and extends so as to be inclined in a front direction D11 toward an upper direction D21, and has a U-shape opening in a rear direction D12.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storage container 2 comprises: a container body 2 including a cylindrical wall part 20 that has one end part on the front side in which a container body opening 21 is formed and the other end part on the rear side which is closed by a back wall 22, the inner surface of the wall part 20 forming a substrate storage space 27 in which a plurality of substrates W can be stored and which communicates with the container body opening 21; and a lid body 3 that can be attached to and detached from the container body opening 21 and is capable of closing the container body opening 21. At least one of the container body 2 and the lid body 3 is composed of a member 5, 7. When the member 5, 7 is released from a mold for molding the member 5, 7, a portion of the member 5, 7 abuts a pushing pin for pushing out the member 5, 7. The portion, which abuts the edge of a substrate W, is provided with a recess 521 recessed in a direction away from the substrate W.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprises: a container body 2 including a cylindrical wall part 20 that has one end part on the front side in which a container body opening 21 is formed, and the other end part on the rear side which is closed by a back wall 22, the inner surface of the wall part 20 forming a substrate storage space 27 in which a plurality of substrates W can be stored and which communicates with the container body opening 21; and a lid body 3 which can be attached to and detached from the container body opening 21 and can close the container body opening 21. At least one of the container body 2 and the lid body 3 is composed of a member 5, 7. When released from a mold for molding the member 5, 7, the member 5, 7 is pushed out by a push-out pin. A convex part 522, 711 is formed on a portion of the member 5, 7 that abuts the push-out pin.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprises: a container body 2; a lid body 3; a lid-body-side substrate support part 73 capable of supporting an edge part of a plurality of substrates W; and a back-side substrate support part 6 which is disposed so as to form a pair with the lid-body-side substrate support part 73 and which supports the edge part of the plurality of substrates W in cooperation with the lid-body-side substrate support part 73 when a container body opening part 21 is closed by the lid body 3. The lid-body-side substrate support part 73 has an upper-side inclined surface 76 and a lower-side inclined surface 77 that form a V-shaped groove 74, which is a recessed groove depressed away from the center of a substrate storage space 27. A frontmost part of the upper-side inclined surface 76 and the lower-side inclined surface 77 functions as a holding part 78 for holding the edge part of the plurality of substrates W. The lower-side inclined surface 77 has a holding surface 775 forming the holding part 78 and a guide surface 8 which is located rearward D12 from the holding surface 775 and which guides the substrates W to the holding part 78 while causing the substrates W to slide. A guide inclination angle θ, by which the guide surface 8 is inclined with respect to a front direction D11, decreases in multiple stages.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 includes: a container body 2; a lid body 3; and a lateral substrate support part 5 that is disposed fixed to each of a pair of side walls 25, 26 so as to form a pair within a substrate storage space 27, and that can support edge portions of a plurality of substrates W in a state in which adjacent substrates W among the plurality of substrates W are separated at a prescribed interval and arranged in parallel when a container body opening part 21 is not closed by the lid body 3. The lateral substrate support part 5 has first positioning parts 551, 561 in the lateral substrate support part 5. The side wall 25 has second positioning parts 2552, 2562. The first positioning parts 551, 561 and the second positioning parts 2552, 2562 cooperate with each other to position a front portion 5F and/or a rear portion 5G of the lateral substrate support part 5 with respect to the side wall 25 in a vertical direction D2 and a lateral direction D3 only in a central region 5M in the vertical direction D2 of the lateral substrate support part 5.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 includes: a container body 2; a lid 3; a lid-side substrate support part 73 that is arranged in a portion facing a substrate storage space 27 when a container body opening part 21 is closed by the lid 3, and can support edge parts of a plurality of substrates W when the container body opening part 21 is closed by the lid 3; and a depth-side substrate support part 6 that supports the plurality of substrates W in a state in which the edge parts of the plurality of substrates W are arranged in parallel in the vertical direction D2 in cooperation with the lid-side substrate support part 73 when the container body opening part 21 is closed by the lid 3. The lid-side substrate support part 73 has an upper inclined surface 76 and a lower inclined surface 77 forming a V-shaped groove 74 which is a recessed groove recessed in a direction from the center of the substrate storage space 27. In the upper inclined surface 76, the lower part thereof is constituted by a main inclined surface 86 extending so as to be inclined toward an upper direction D21 while advancing in a rear direction D12, and the upper part thereof is constituted by a reverse inclined surface 87 extending so as to be inclined toward the upper direction D21 while advancing in a front direction D11.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprises: a container body 2; and a lid 3. The lid 3 has a seal member 4 which is interposed between an opening peripheral edge part 28 and a peripheral edge part-facing part 331 and which comes into close contact with the opening peripheral edge part 28 and the peripheral edge part-facing part 331 to close a container body opening part 21 in an airtight state. The front end of an upper wall 23 of the container body 2, the front end of a lower wall 24, the front end of a first side wall 25, and the front end of a second side wall 26 constitute the opening peripheral edge part 28. The opening peripheral edge part 28 has a seal surface 281 on which the seal member 4 abuts at a position on a rear side D12 of an opening edge of the opening peripheral edge part 28. The container body 2 has, at a location P281 on the seal surface 281, a first rib 81 standing in a direction (D2-D3) orthogonal to a front-rear direction D1, and has, at a location spaced apart from the first rib 81 to the rear side D12, a second rib 82 standing in a direction (D2-D3) orthogonal to the front-rear direction D1. The second rib 82 extends at least over the first side wall 25, the upper wall 23, and the second side wall 26.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 includes: a container body 2 including a cylindrical wall portion 20 in which a container body opening portion is formed in one end portion thereof on a front side D11 and another end portion thereof on a rear side D12 is closed by a back wall 22, the inner surface of the wall portion 20 forming a substrate storage space 27 capable of storing a plurality of substrates and in communication with the container body opening portion; and a lid body detachable from the container body opening portion and capable of closing the container body opening portion. The back wall 22 has leg portions 221 that form a ground contact plane CP when the container body 2 is placed with the back wall 22 facing downward. The back wall 22 has a gate trace 226 facing the rear side D12. The gate trace 226 is located more toward the front side D11 in comparison to the ground contact plane CP.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storage container 1 includes: a container body 2 including a cylindrical wall portion 20 in which a container body opening portion is formed in one end portion thereof on a front side D11 and another end portion thereof on a rear side D12 is closed by a back wall 22, the inner surface of the wall portion 20 forming a substrate storage space 27 capable of storing a plurality of substrates and in communication with the container body opening portion; and a lid body detachable from the container body opening portion and capable of closing the container body opening portion. The back wall 22 has a gate trace 226 projecting toward the rear side D12. The gate trace 226 projects toward the rear side D12 from the outer surface of the back wall 22 around the gate trace 226, and a base portion of the gate trace 226 is connected to the outer surface of the back wall 22 over an area equal to or greater than the area of a gate cut section.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This housing container 1 is provided with: a container main body 2 that is internally provided with a housing space 27, in which objects J to be housed can be housed side by side, and has one end provided with an opening peripheral part 28 in which a container main body opening 21 is formed, the container main body opening 21 being in communication with the housing space 27, while having the other end closed; a cover body 3 which is capable of closing the container main body opening 21; a lateral support part 5 which is disposed within the housing space 27 and is capable of supporting edges of the plurality of objects J to be housed in a state where the plurality of objects J to be housed are arranged side by side such that adjacent objects J to be housed are at a specific distance from each other, and which has a plurality of plate parts 51 that are each disposed between adjacent objects J to be housed; and an adapter member 8 which is disposed between the container main body opening 21 and the lateral support part 5 in the housing space 27 in a front-back direction D1 connecting the one end and the other end of the container main body 2, and which has a guide part 81 that is disposed so as to correspond to some or all of the plurality of plate parts 51. The adapter member 8 is configured so as to be freely attachable to and detachable from the lateral support part 5 or the container main body 2.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The present invention comprises: a container body; a lid; a lid-side substrate support capable of supporting edges of substrates when a container body opening is closed by the lid; a rear-side substrate support that is disposed as a counterpart of the lid-side substrate support in a substrate housing space, is capable of supporting the edges of the substrates, and supports the substrates in a state in which the edges of the substrates are arranged parallel to each other by the rear-side substrate support together with the lid-side substrate support while the container body opening is closed; a pair of lateral substrate supports that are disposed to face each other in a lateral direction in the substrate housing space and are configured to contact the edges of the substrates to be able to support the edges of the substrates in a state in which the adjacent substrates are arranged parallel to each other at predetermined intervals; and support constituent parts that are disposed to face the inner surfaces of side walls of a wall of the container body. The lateral substrate supports are provided in the support constituent parts, and a dehumidifying agent is placeable between the support constituent parts and the inner surfaces of the side walls of the wall of the container body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container includes: a gas ejection nozzle unit having a plurality of apertures for supplying to the substrate storing space a gas that has flowed into the ventilation paths; and a gas flow rate equalizer capable of causing the gas to flow out from the plurality of apertures at an equalized flow rate. The gas flow rate equalizer includes a gas detention chamber, a pre-outflow gas retention chamber, and inter-chamber partitions defining an inter-chamber flow path that blocks straight-line communication between the gas detention chamber and the pre-outflow gas retention chamber but allows for communication between the gas detention chamber and the pre-outflow gas retention chamber.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storage container 1 comprises: a container body 2 that has formed therein a substrate storage space 27 capable of storing a plurality of substrates W, and has, at one end thereof, an opening periphery portion 28 at which a container body opening portion 21 communicating with the substrate storage space 27 is formed; and a lid 3 that can be attached to and detached from the container body opening portion 21, and is capable of closing the container body opening portion 21, the lid 3 including a seal member attachment portion 311 and a periphery portion-opposing portion 331 opposing the opening periphery portion 28. The lid 3 further comprises a seal member 4 that is attached to the seal member attachment portion 311 of the lid 3. The seal member 4 is interposed between the opening periphery portion 28 and the periphery portion-opposing portion 331, and tightly abuts on the opening periphery portion 28 and the periphery portion-opposing portion 331, thereby closing the container body opening portion 21 in an airtight manner. The seal member 4 comprises: a base portion 41 that is held by the seal member attachment portion 311; a periphery portion-abutting lip portion 421 that extends from the base portion 41 and abuts on the opening periphery portion 28; and an opposing portion-abutting lip portion 422 that extends from the base portion 41 and abuts on the periphery portion-opposing portion 331. The periphery portion-opposing portion 331 has a cross-sectional shape that indicates a placement target PT for the opposing portion-abutting lip portion 422 and is not a direct flat plane.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate housing container of the present invention comprises: a lid-side substrate support portion which is a part of a lid (3) and is disposed in a part opposite a substrate housing space (27) when a container body opening portion is closed by the lid (3), and which, when the container body opening portion is closed by the lid (3), is able to support the edges of a plurality of substrates (W); and a rear retainer (6). The rear retainer (6) comprises: a rear-side substrate support portion (63) which is disposed to be paired with the lid-side substrate support portion in the substrate housing space (27) and is capable of supporting the edges of the plurality of substrates (W), and which, when the container body opening portion is closed by the lid (3), cooperates with the lid-side substrate support portion to support the plurality of substrates (W) with the edges of the plurality of substrates (W) arranged in parallel; a protruding wall portion (60) with an outer surface protruding toward the container body opening portion and an inner surface recessed toward the container body opening portion, the protruding wall portion (60) having the rear-side substrate support portion (63) provided on the protruding side of the protruding wall portion (60); and a circulation hole which, when the protruding side of the protruding wall portion (60) is facing downward, allows circulation of a liquid and/or a gas that is positioned on the inner surface side of the protruding wall portion (60).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A device for controlling a flow of a fluid includes a flow path having an inflow port and an outflow port; a valve body in the flow path between the inflow port and the outflow port; a valve seat on which the valve body can be seated; an elastic member for urging the valve seat or the valve body in a direction of approaching or separating the valve body to or from the valve seat; and a working fluid chamber that expands or contracts in the direction of separating or approaching the valve body from or to the valve seat by feeding or discharging a working fluid, wherein a part of the valve body is on an extension of a linear flow path central axis on the inflow port side across the valve body and the valve seat, and on an extension of a linear flow path central axis on the outflow port side, and wherein the valve seat or the valve body is displaceable in an axial direction of the linear flow path center axis on the inflow port side and the linear flow path central axis on the outflow port side.
F16K 1/12 - Lift valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with streamlined valve member around which the fluid flows when the valve is opened
F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
22.
SUBSTRATE STORAGE CONTAINER AND LID-BODY-SIDE SUBSTRATE SUPPORT PART
The present invention provides a substrate storage container which is provided with: a lid-body-side substrate support part 73 that is capable of supporting edges of a plurality of substrates in a state where the opening of a container main body is closed by means of a lid body; and a back-side substrate support part which supports the plurality of substrates together with the lid-body-side substrate support part 73 in such a manner that the edges of the plurality of substrates are arranged in parallel to each other in a state where the opening of the container main body is closed by means of the lid body. With respect to this substrate storage container, the lid-body-side substrate support part 73 has flat support surfaces 731 which support the plurality of substrates by coming into contact with the circumferential surfaces of the respective edges of the substrates; and flat support surfaces 731 which are in contact with the circumferential surfaces of the respective edges of substrates that are adjacent to each other among the plurality of substrates have overlapping parts 733 that face each other in a direction that is parallel to the upper surfaces of the substrates.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container includes: a container main body; a lid body which is attachable to and detachable from a container main body opening portion, and which is able to block the container main body opening portion; and a component which is attached to the container main body or to the lid body. A connected part between the component and the container main body, the lid body or another component includes press-fit fixing portions, which are positioned by means of press fitting while being fixed to each other; and impulse welding portions which are formed by impulse welding, to maintain the positioning and fixing in the press-fit fixing portions.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container according to the present invention is configured such that: a substrate W slides with respect to a second contact surface 601 at least when transitioning from a state in which an container body opening is not closed by a lid to a state in which the container body opening is closed by the lid, or when transitioning from a state in which the container body opening is closed by the lid to a state in which the container body opening is not closed by the lid; and an inner-side substrate support part 6 is composed of an alloy resin mainly containing a polycarbonate resin and polybutylene terephthalate resin, with the mass of the polybutylene terephthalate resin being greater than the mass of the polycarbonate resin.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This substrate storage container comprises: a lid body-side substrate support part which is capable of supporting an edge part of a substrate when the substrate storage container is closed; a depth-side substrate support part which is disposed so as to form a pair with the lid body-side substrate support part and is capable of supporting the edge part of the substrate; and a substrate edge part auxiliary part which is disposed at a portion opposing a substrate storage space when the substrate storage container is closed, and in which are formed a plurality of auxiliary grooves having an opening that is wider than the thickness of the edge part of the substrate so that the edge part of the substrate can be inserted therein. The auxiliary grooves each have opposing groove forming surfaces, and an edge part of one of a plurality of the substrates is inserted into each auxiliary groove when the container is closed. The edge part of the substrate is inserted into the auxiliary groove in a non-contact state in which a space is formed between the edge part of the substrate and the groove forming surfaces and the edge part of the substrate is not contacting the groove forming surfaces when the container is closed.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The container main body includes a tubular wall portion having an opening circumferential portion provided at one end portion and the other end portion being closed, the opening circumferential portion having a container main body opening portion formed therein. The substrate storing space can store a substrate and communicates with the container main body opening portion. A central fixed member is provided to the wall portion of the container main body so as to be removably attached to the wall portion of the container main body. The central fixed member is configured to be locked and fixed to an alignment portion provided at a load port for conveying the substrate stored in the substrate storing space to a processing apparatus.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
27.
SUBSTRATE STORAGE CONTAINER, METHOD FOR MANUFACTURING SAME, AND LID-SIDE SUBSTRATE SUPPORT
A lid 3 is provided with a lid-side first restriction part 36 and a lid-side second restriction part 37. A lid-side substrate support 7 is provided with a support-side first restriction part 76 and a support-side second restriction part 77, and is fitted to the lid 3 by being slid in a sliding direction D22 from a first position to a second position with respect to the lid 3. The lid-side second restriction part 37 does not restrict movement, of the lid-side substrate support 7 to the opposite side D11 of the side of a substrate storage space 27, for setting the lid-side substrate support 7 to the first position. At the first position, the lid-side first restriction part 36 permits movement of the support-side first restriction part 76 in the sliding direction D22, and permits movement of the support-side second restriction part 77 in the sliding direction D22. At the second position, the lid-side first restriction part 36 restricts movement of the support-side first restriction part 76 in the opposite direction D21 of the sliding direction and restricts movement of the support-side second restriction part 77 in the sliding direction D22, and the lid-side second restriction part 37 restricts movement of the lid-side substrate support 7 to the side D12 of the substrate storage space 27.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container in which: a rotating cam 31 is connected to an engaging latch-raising/lowering cam 35; the rotating cam 31 and the engaging latch-raising/lowering cam 35 are formed from different materials in the connecting sections thereof; the engaging latch-raising/lowering cam 35 is connected to an engaging latch 32; the engaging latch-raising/lowering cam 35 and the engaging latch 32 are formed from different materials in the connecting sections thereof; the rotating cam 31 is formed from a material which has better sliding properties than does that of the engaging latch 32; and the engaging latch-raising/lowering cam 35 is also formed from a material which has better sliding properties than does that of the engaging latch 32.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate container 1 includes: a container body 2; a lid 3; a gas passage 98, 99 that enables a substrate housing space 27 to communicate with a space outside of the container body 2; a gas ejection nozzle part 8 having multiple openings 841 for supplying a gas flowed into the gas passage 98, 99 to the substrate housing space 27; and a gas flow equalization part 801, 803, 804 that enables the gas to flow out from the multiple openings 841 at an equalized flow rate. The gas flow equalization part includes a gas retention chamber 801, a pre-outflow gas retention chamber 804, and an inter-chamber partition 812, 822 that prevents the gas retention chamber 801 and the pre-outflow gas retention chamber 804 from linearly communicating with each other and forms an inter-chamber flow path 806 through which the gas retention chamber 801 and the pre-outflow gas retention chamber 804 communicate with each other.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The present invention comprises: a container body 2; a lid 3; a lid-side substrate support capable of supporting edges of substrates W when a container body opening 21 is closed by the lid 3; a rear-side substrate support 6 that is disposed as a counterpart of the lid-side substrate support in a substrate housing space 27, is capable of supporting the edges of the substrates W, and supports the substrates W in a state in which the edges of the substrates W are arranged parallel to each other by the rear-side substrate support 6 together with the lid-side substrate support while the container body opening 21 is closed; a pair of lateral substrate supports 5 that are disposed to face each other in a lateral direction D3 in the substrate housing space 27 and are configured to contact the edges of the substrates W to be able to support the edges of the substrates W in a state in which the adjacent substrates W are arranged parallel to each other at predetermined intervals; and support constituent parts 4 that are disposed to face the inner surfaces of side walls 25, 26 of a wall 20 of the container body 2. The lateral substrate supports 5 are provided in the support constituent parts 4, and a dehumidifying agent 9 is placeable between the support constituent parts 4 and the inner surfaces of the side walls 25, 26 of the wall 20 of the container body 2.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This substrate storage container comprises: a container body; a lid body; a sealing member; and a filter part 80 that has a ventilation passage enabling connection between a substrate storage space and a space outside the container body, a filter 85 disposed in the ventilation passage, and a housing 81, 82, 83, 84 for forming the ventilation passage, that is disposed in the container body, and that enables air passing between the space outside the container body and the substrate storage space through the filter 85. The filter part 80 includes, in the housing 81, 82, 83, 84, a filter part sealing member 862 that hermetically seals the ventilation passage with respect to the outside of the housing 81, 82, 83, 84, and a valve body 863 that can open/close the ventilation passage. The valve body 863 is supported by a hinge structure.
F16K 15/14 - Check valves with flexible valve members
F16K 15/16 - Check valves with flexible valve members with tongue-shaped laminae
B65D 81/20 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
F16J 15/10 - Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A housing accommodates: a valve body capable of moving between a closing position and an opening position in an outer opening portion, the closing position closing the outer opening portion and the opening position opening the outer opening portion; a biased member having a tubular shape and connected to the valve body, the biased member supported by the housing so as to be movable in the housing and guiding the movement of the valve body so as to move integrally with the valve body; and a biasing member biasing the biased member so that the valve body moves to the closing position.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
33.
Substrate storing container, method for manufacturing the same, and filter unit
A substrate storing container includes a filter unit having a housing that forms a ventilation path and a filter. The housing includes an outer housing portion and an inner housing portion at least partially disposed inside the outer housing portion and fastened to the outer housing portion. The inner housing portion has a male thread portion at a part disposed inside the outer housing portion. The outer housing portion has a female thread portion that meshes with the male thread portion. The inner housing portion has first engagement portions at a part that is disposed inside the outer housing portion and where the male thread portion does not exist. The outer housing portion has second engagement portions that engage with the first engagement portions at a part where the female thread portion does not exist. The first engagement portions and the second engagement portions are configured to be visually identifiable.
B65D 81/18 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
B65D 81/05 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This fluid control device (1) controls the flow of a fluid, and comprises: a flow passage (4) that has an inlet (2) and an outlet (3), and through which a fluid under control flows; a valve body (5) that is positioned in the flow passage (4), partway between the inlet (2) and the outlet (3); a valve seat (6) where the valve body (5) can be seated; an elastic member (7) that biases the valve seat (6) or the valve body (5) in an approaching direction or a separating direction of the valve body (5) and the valve seat (6); and a working fluid chamber (8) in which, due to the supply or discharge of a working fluid, expansion or contraction occurs in the separating direction or the approaching direction of the valve body (5) and the valve seat (6), wherein at least a portion of the valve body (5) is present on the line of extension of a flow passage center axis (CL2), which is a straight line and is on the inlet (2) side of the flow passage (4) with regard to the valve body (5) and the valve seat (6), and on the line of extension of a flow passage center axis (CL3), which is a straight line and is on the outlet side (3), and either the valve seat (6) or the valve body (5) can be displaced in the axial direction of the flow passage center axis (CL2) that is a straight line and is on the inlet (2) side, and/or in the axial direction of the flow passage center axis (CL3) that is a straight line and is on the outlet (3) side.
F16K 1/00 - Lift valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
A cultivation environment control device 1 is provided with a light emission unit 12 that illuminates a plant P with light. The cultivation environment control device 1 is provided with an airflow generation unit 13 that generates an airflow around the plant P. The light emission unit 12 and the airflow generation unit 13 are controlled intermittently or the intensity thereof is controlled.
This substrate storage container is provided with: a container main body; a lid body which is attachable to and detachable from an opening of the container main body, and which is able to close the opening of the container main body; and a component 81 which is fitted to the container main body or to the lid body. The connected portion between the component 81 and the container main body, the lid body or other components 82, 83 is provided with: press fitting parts 8101, 8201 which are positioned by means of fitting, while being affixed to each other; and impulse welding parts 8102, 8202 which are formed by impulse welding so as to maintain the positioning and affixing of the press fitting parts 8101, 8201.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This substrate storage container comprises: a lid body-side substrate support part 73 which is capable of supporting an edge part of a substrate W when the substrate storage container is closed by a lid body; a depth-side substrate support part which is disposed so as to form a pair with the lid body-side substrate support part and is capable of supporting the edge part of the substrate W, and which cooperates with the lid body-side substrate support part 73 when the substrate storage container is closed so as to support the substrate W in a state in which the edge parts of the substrate W are arranged in parallel; and a substrate edge part auxiliary part 75 which is disposed at a portion opposing a substrate storage space when the substrate storage container is closed, and in which are formed a plurality of auxiliary grooves 76 having an opening that is wider than the thickness of the edge part of the substrate W so that the edge part of the substrate W can be inserted therein. The auxiliary grooves 76 each have opposing groove forming surfaces 761, 762, and an edge part of one of a plurality of the substrates W is inserted into each auxiliary groove when the container is closed. The edge part of the substrate W is inserted into the auxiliary groove 76 in a non-contact state in which a space is formed between the edge part of the substrate W and the groove forming surfaces 761, 762 and the edge part of the substrate W is not contacting the groove forming surfaces 761, 762 when the container is closed.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storage container according to the present invention is configured such that: a substrate W slides with respect to a second contact surface 601 at least when transitioning from a state in which an container body opening is not closed by a lid to a state in which the container body opening is closed by the lid, or when transitioning from a state in which the container body opening is closed by the lid to a state in which the container body opening is not closed by the lid; and an inner-side substrate support part 6 is composed of an alloy resin mainly containing a polycarbonate resin and polybutylene terephthalate resin, with the mass of the polybutylene terephthalate resin being greater than the mass of the polycarbonate resin.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
39.
SUBSTRATE-ACCOMMODATING CONTAINER, AND MANUFACTURING METHOD AND FILTER PART FOR SAME
A substrate-accommodating container 1 comprising a filter part 90 that has a filter 95 and a housing forming a ventilation passage 901, wherein: the housing comprises an outer housing part 94, and an inner housing part that is at least partially disposed inside the outer housing part 94 and is fastened to the outer housing part 94; the inner housing part 92 has a male screw part 929 at a position that is disposed inside the outer housing part 94; the outer housing part 94 has a female screw part 949 that meshes with the male screw part 929; the inner housing part 92 has a first engaging part 928 at a position that is disposed inside the outer housing part 94 but where the male screw part 929 is not present; the outer housing part 94 has a second engaging part 948, which engages with the first engaging part 928, at a position where the female screw part 949 is not present; and when fastening the inner housing part 92 and the outer housing part 94, the first engaging part 928 and the second engaging part 948 are visually identifiable.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A substrate storing container includes: a container main body including a tubular wall portion, the container main body having a substrate storing space which is formed by an inner face of the wall portion, is able to store a plurality of substrates, and communicates with the container main body opening portion; a lid body which is removably attached to the container main body opening portion and is able to close the container main body opening portion; a ventilation passage which allows the substrate storing space and an external space of the container main body to communicate with each other, wherein the ventilation passage is formed in a ventilation passage forming unit which is insert-molded with the container main body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container includes: a container main body; a lid body that is attachable to and detachable from a container main body opening portion and can close the container main body opening portion; and a sealing member that closes the container main body opening portion together with the lid body, in which airtightness of the substrate storing space is enhanced so that 50% or more of a gas supplied to a substrate storing space can be discharged from an exhaust filter portion in a case in which a supply amount of a gas supplied from an outer space of the container main body to the substrate storing space through a gas supply filter portion is 22 liters per minute or less.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Provided is a substrate storage container in which housings 91, 92, 93, 94 of an exhaust filter portion 90 accommodates: a valve body 99 which is inserted into an outer opening portion 903 and is movable in the outer opening portion 903 between a closing position for closing the outer opening portion 903 and an opening position for opening the outer opening portion 903; a biased member 96 connected to the valve body 99, supported by the housings 91, 92, 93, 94 of the exhaust filter portion 90 so as to be movable inside the housings 91, 92, 93, 94 of the exhaust filter portion 90, and guiding the movement of the valve body 99; and a biasing member 97 biasing the biased member 96 so that the valve body 99 moves to the closing position. A filter 95 of the exhaust filter portion 90 has an effective area greater than an effective area of a filter 85 of an intake filter portion 80.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container 1 comprising a container body, a lid body, a seal member, and a filter unit 80 which includes: a ventilating path 801 providing communication between a substrate storage space and a space outside the container body; a filter 85 disposed in the ventilating path 801; and housings 81, 82, 83, 84 forming the ventilating path 801, the filter unit 80 being disposed in the container body and allowing passage of a gas via the filter 85 between the space outside the container body and the substrate storage space. A housing 93 accommodates: a valve body 99 capable of moving between a closing position and an opening position in an outer opening portion 903, the closing position closing the outer opening portion 903 and the opening position opening the outer opening portion 903; a biased member 96 having a tubular shape and connected to the valve body 99, the biased member 96 supported by the housing 93 so as to be movable in the housing 93 and guiding the movement of the valve body 99 so as to move integrally with the valve body 99; and a biasing member 97 biasing the biased member 96 so that the valve body 99 moves to the closing position.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storage container comprising: a container main body; a lid body; a sealing member; and a filter part 80 positioned in the container main body and comprising an airway 801 which can connect a substrate storage space with a space external to the container main body, a filter 85 which is positioned in the airway 801, and housings 81, 82, 83, 84 which form the airway 801, said filter part being configured such that air can pass through the filter part 80 via the filter 85 between the space external to the container main body and the substrate storage space. The housings 81, 82, 83, 84 comprise an outward aperture part 803 which opens toward the space external to the container main body. A valve body 86 is housed in the housings 81, 82, 83, 84, said valve body 86 closing the outward aperture part 803 by being inserted in the outward aperture part 803, and opening the outward aperture part 803 by being removed from the outward aperture part 803.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storage container comprising: a container main body; a lid body; a vent passage 210 through which a substrate storage space and a space outside the container main body can be in communication; a gas jet nozzle part 8 comprising a plurality of aperture parts 802 for supplying a gas which has flowed into the vent passage 210 to the substrate storage space; and a gas flow rate equalizing part by which the gas can flow out from the plurality of aperture parts 802 at a uniform flow rate. The gas flow rate equalizing part comprises a branching channel 801 which is formed between the vent passage 210 and the aperture parts 802 and causes the flow of gas from the vent passage 210 to branch. The branching channel 801 comprises: a branch starting part 8011 which causes the flow of gas to branch into a plurality of flows and distributes the branched flows of gas in parallel; and a plurality of leading end side branch parts 8015 which distribute the gas distributed through the branch starting part 8011 to the aperture parts 802 while causing the gas to further branch.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
46.
Method for molding substrate storing container, mold, and substrate storing container
There is provided a method for molding a substrate storing container 1 including a container main body molding step of molding a container main body 2 in a state where a direction P2 perpendicular to a plane P1 passing through the entire periphery of an end edge of an opening circumferential portion 28 of the container main body 2 is inclined in a direction forming a predetermined angle a2, with respect to a horizontal direction L1 which is a movement direction of the movable die M1 with respect to the fixed die M2, and a pullout step of pulling the container main body 2 molded in the mold space M0 out from the movable die M1 by moving the movable die M1 so as to retreat from the fixed die M2.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A container main body has a container main body opening portion in one end portion. The lid body is attachable to and detachable from the container main body opening portion and capable of blocking the container main body opening portion. The gas purge port is provided with a seal face provided in at least one of a ventilation path forming portion and a part of the gas purge port other than the ventilation path forming portion and the check valve member and coming into close contact with a gas injection port. The seal face is provided with a close contact pad constituted by an elastic body for preventing gas leakage between the gas injection port and the seal face.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storing container in which a latching mechanism includes an engagement latch 32, an engagement latch lifting/lowering cam 35 that causes the engagement latch 32 to advance to and retreat from an engagement concave portion and causes the engagement latch 32 in the engagement concave portion to move toward/away from the other end portion of a container main body by advancing and retreating in a direction in which the engagement latch 32 advances and retreats, and a rotating cam 31, and the engagement latch lifting/lowering cam 35 includes an engagement latch connection portion 357 that causes the engagement latch 32 to be engaged with the engagement concave portion and thereafter causes the engagement latch 32 to approach the other end portion of the container main body by moving in a direction in which the engagement latch 32 approaches the engagement concave portion.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
E05C 9/04 - Arrangement of simultaneously-actuated bolts or other securing devices at well-separated positions on the same wing with two sliding bars moved in opposite directions when fastening or unfastening
This board storing container is provided with a container body, a lid 3, and a lid-side board support unit 7 which, when the lid 3 closes a container body opening, is arranged in the part of the lid 3 opposite of the board storage space and which can support the edge of multiple boards. The lid-side board support unit 7 is provided with a lid-side board receiving unit which receives the edge of a board when supporting the board, and a frame part 71 held on the inner surface of the lid 3 and having a first surface 711 facing the inner surface of the lid 3 and a second surface 712 opposite of the first surface 711. The lid 3 is provided with a frame holding unit 35 for holding the frame 71 in an inserted state, and comprises a third surface 353 opposite of the first surface 711 and a fourth surface 354 opposite of the second surface 712. The lid-side board support unit 7 further is provided with a first protrusion 76 which, on the first surface 711 of the frame part 71, protrudes towards the third surface 353, and is provided with an engagement part 75 which, on the second surface 712 of the frame part 71, engages with the frame holding unit 35 in a state in which the frame part 71 is inserted.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container provided with a container main body, a lid body, a lateral substrate support portion, a lid body side substrate support portion, and a back side substrate support portion includes a casting-off portion that casts off a substrate in a state being supported by the back side substrate support portion and the lid body side substrate support portion from at least one of the back side substrate support portion or the lid body side substrate support portion. When the lid body is opened from the container main body opening portion from a state in which the container main body opening portion is closed by the lid body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container according to the present invention is configured such that at least one of a lateral substrate support 5, a back-side substrate support 6, and a lid-side substrate support 7 has, in a quantity corresponding to each of a plurality of substrates W stored in a substrate storage space 27, edge support parts 60 for supporting the edges of the substrates W. When viewed in the juxtaposed direction D2 of the substrates W, each of the edge support parts 60 has a contactable region 61 that projects in a direction toward the center of the substrate storage space 27 and that is capable of making contact with a substrate W, and uncontactable regions 62 that are adjacent to the contactable region 61, that are recessed as compared with the contactable region 61 in a direction away from the center of the substrate storage space 27, and that cannot make contact with the substrate W.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate accommodating container 1 in which a container body 2 has a wall part 20 having a back wall 2, an upper wall 23, a lower wall 24, and a pair of lateral walls. The other end of the wall part 20 is closed by the back wall 22, and a container body opening part is formed by one end of the upper wall 23, one end of the lower wall 24, and one ends of the lateral walls 25 and 26. The lower wall 24 is provided with a positioning part 50 that positions an object RP to be accommodated with respect to the container body 2. The upper wall 23 is provided with a downward pressing part 60 that presses an upper part of the object RP to be accommodated toward the lower wall 24. A lid body 3, when closing the container body opening part, causes the downward pressing part 60 to press the upper part of the object RP to be accommodated toward the lower wall 24.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate-accommodating container 1 comprises: a container body 2 that has tubular walls that have an open peripheral section at one end in which a container body opening is formed, and are closed at the other end, wherein a substrate-accommodating space, which is capable of accommodating substrates and communicates with the container body opening, is formed by the inner surfaces of the wall; a lid body 3; and a seal member 4. The walls 20 of the container body 2 are provided with a central fastening member 6 that can be attached to and removed from the walls 20 of the container body, said central fastening member 6 being fastened as a result of engaging with a position-aligning part provided to a load port for transferring a substrate accommodated in the substrate-accommodating space to a processing device.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
54.
METHOD FOR MOLDING SUBSTRATE STORAGE CONTAINER, MOLD, AND SUBSTRATE STORAGE CONTAINER
This method for molding a substrate storage container 1 has: a container body molding step for molding a container body 2 in a state in which in a molding space M0 inside a mold M having a fixed die M2 and a movable die M, a direction P2 perpendicular to a plane P1, which passes through the entire peripheral end edge of an opening peripheral edge section 28 of the container body 2, is inclined in a direction forming a predetermined angle a2 with respect to the horizontal direction L1 in which the movable die M1 moves relative to the fixed die M2; and a drawing step for drawing, from the movable die, the container body 2 which has been formed in the molding space M0.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This substrate accommodation container comprises: a container body; a lid that can be attached/detached to/from an opening of the container body, and that can seal off the opening of the container body; and a sealing member that, together with the lid, seals off the opening of the container body. If the supply quantity of a gas supplied to a substrate accommodation space from a space outside of the container body through a supply filter is less than or equal to 22 L per minute, then the airtightness of the substrate accommodation space is increased so that 50% or more of the gas supplied to the substrate accommodation space can be discharged through a discharge filter.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This substrate accommodation container comprises: a container body; a lid that can be attached/detached to/from an opening of the container body, and that can seal off the opening of the container body; and a sealing member that, together with the lid, seals off the opening of the container body. If the supply quantity of a gas supplied to a substrate accommodation space from a space outside of the container body through a supply filter is less than or equal to 22 L per minute, then the airtightness of the substrate accommodation space is increased so that 50% or more of the gas supplied to the substrate accommodation space can be discharged through a discharge filter.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A lid body side substrate receiving portion includes a lower side substrate guiding inclined face and an upper side substrate guiding inclined face. In a direction in which a groove extends while a container main body opening portion is closed by a lid body, a length of the lower side substrate guiding inclined face in the upper-lower direction becomes longer as approaching a center of the container main body opening portion.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A back side substrate support portion 6 includes a lower side inclined face 622 on which an end of a back face of a substrate W slides, and a substrate support portion 632 that is located above the lower side inclined face 622 and can support an edge portion of the substrate W. When a container main body opening portion 21 is closed by a lid body 3, the edge portion of the substrate W slides on the lower side inclined face 622 and reaches the substrate support portion 632. At least a portion of the lower side inclined face 622 is configured from a second member that is different from a first member that configures the substrate support portion 632, and the second member has a lower maximum static friction coefficient and lower wear resistance than the first member.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container includes a container main body, a lid body removably attached to a container main body opening portion and able to close the container main body opening portion, a ventilation passage which enables a substrate storing space and a space outside the container main body to communicate with each other, a gas ejecting nozzle portion having a plurality of opening portions through which a gas flowing into the ventilation passage is supplied into the substrate storing space, and a gas flow rate uniformizing unit which enables the gas to flow out through the plurality of opening portions at a uniform flow rate.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
G05D 7/01 - Control of flow without auxiliary power
In this substrate storage container, a latch mechanism has: an engagement latch 32; an engagement latch raising/lowering cam 35 that, by advancing and retreating in the direction that the engagement latch 32 advances and retreats, causes the engagement latch 32 to advance and retreat with respect to an engagement recess and causes the engagement latch 32 to move, within the engagement recess, closer to or away from the other end section of the container body; and a rotating cam 31. The engagement latch raising/lowering cam 35 has an engagement latch connection part 357 that, by means of the movement of the engagement latch 32 in the direction closer to the engagement recess, causes the engagement latch 32 to be engaged with the engagement recess and thereafter causes the engagement latch 32 to move closer to the other end section of the container body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
61.
HOLDING STRUCTURE OF PIPE MEMBER, END CLOSURE TOOL, AND CONNECTION TOOL
This holding structure (1) of a pipe member is provided with: a housing (2) which is a structure for holding a resin pipe member (61), and in which an internal space (2a) is formed; an insertion member (3) which has a through-hole (3a) for passage of the resin pipe member (61) and which is inserted into the housing (2) while being fitted in the housing (2) by means of a screw; and a tubular elastic member (4) which is arranged inside of the internal space (2a) of the housing (2) and which, on the inside, receives the resin pipe member (61), which has passed through the through-hole (3a) of the insertion member (3). The holding structure is configured such that the insertion member (3), when inserted into the housing (2), axially pressurizes the tubular elastic member (4) inside of the internal space (2a) and deforms this elastically inwards, pressing the resin pipe member (61) from the outer peripheral side.
F16L 37/05 - Couplings of the quick-acting type in which the connection is maintained only by friction of the parts being joined with an elastic outer part pressing against an inner part by reason of its elasticity tightened by the pressure of a mechanical organ
F16L 21/08 - Joints with sleeve or socket with additional locking means
F16L 33/32 - Arrangements for connecting hoses to rigid membersRigid hose-connectors, i.e. single members engaging both hoses comprising parts outside the hoses only
This substrate accommodating container is provided with a container main body 2 provided with a tubular wall portion which has in one end portion thereof an open peripheral edge portion having a container main body opening portion formed therein, and which has another end portion that is closed, wherein a substrate accommodating space 27 capable of accommodating a plurality of substrates and communicating with the container main body opening portion is formed by means of an inner surface of the wall portion, a lid which can be attached to and removed from the container main body opening portion and which is capable of closing the container main body opening portion, and a ventilation passage P capable of providing communication between the substrate accommodating space 27 and a space outside the container main body 2. The ventilation passage P is formed in a ventilation passage forming component 245 insert molded in the container main body 2.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This gas purge port is attached to an accommodation container that has an accommodation space therein by a container body having a container body opening part at one end section thereof and by a lid body that is attachable to or detachable from the container body opening part and can cover the container body opening part. The gas purge port is provided on at least one among a ventilation channel forming part 831 and a portion 85 of the gas purge port other than the ventilation channel forming part 831 and a check valve member, and is provided with a sealing surface 852 which is in close contact with a gas injection port, wherein a close contact pad composed of an elastic body for preventing gas leakage between the gas injection port and the sealing surface 852 is provided on the sealing surface 852.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
F16K 15/08 - Check valves with guided rigid valve members shaped as rings
A filtration device 1 according to the present invention is provided with: a filter housing 10 that has a head 13 and a bowl 11 attachable to/detachable from the head 13; and a filter cartridge 20 that is housed and disposed inside the filter housing 10 and has a filter part. The filtration device 1 filters a liquid by allowing the liquid flowing in from an inflow port 14 of the head 13 to pass the filter part of the filter cartridge 20 and to flow out from an outflow port 15 of the head 13. The bowl 11 of the filter housing 10 is configured to include: a cylindrical side part 11a; an opening part 11b which is located on one end side of the side part 11a and to which the head 13 is attached; and a bottom part 11c that seals the other end side of the side part 11a. The side part 11a has a taper-shaped section 16 that is tapered from the opening part 11b side toward the bottom part 11c side. A joint surface 18 for increasing a cross-sectional area by extending, over the entire circumference, to the outer circumferential side with respect to the outer surface of the taper-shaped section 16 and/or to the inner circumferential side with respect to the inner surface of the taper-shaped section 16, is formed midway in the axial direction of the taper-shaped section 16 so as to be oriented toward the opening part 11b side.
This substrate storage container is provided with a container body, a lid member, a lateral substrate support portion, a lid-member-side substrate support portion, and a back-side substrate support portion 6. The substrate storage container is further provided with a clearing portion 83 which, when the lid member is opened from a container body opening portion that was closed by the lid member, clears a substrate W being supported by the back-side substrate support portion 6 and the lid-member-side substrate support portion from at least one of the back-side substrate support portion 6 and the lid-member-side substrate support portion.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
66.
RESINOUS TUBE MEMBER, METHOD FOR MANUFACTURING RESINOUS TUBE MEMBER, RESINOUS TUBE FITTING, AND RESINOUS PIPING
A resinous tube member (1) according to the present invention comprises: a tube body (2) having an internal flow path (P) in which a fluid flows; and an outer cylinder (3) that is arranged so as to cover the periphery of at least a body end (2a) of the tube body (2) on an outer peripheral side of the tube body (2), and that is fixed or adhered to the tube body (2). An outer cylinder end (3a) to be welded to an end of another resinous tube member or a resinous tube fitting is positioned so as to protrude outward in an axis direction (AD) from the body end (2a) on an inner peripheral side thereof, and an inner face step (4) formed by an inner face of the outer cylinder end (3a) and an inner face of the body end (2a) is provided.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
A sealing member of this substrate housing container has: a base part-side deformation part that couples the base part and the container contact tip part and is elastically deformable to allow the container contact tip part to oscillate relative to the base part; and a protruding part that is present in the portion of the container contact tip part connected to the base part-side deformation part and that protrudes from the outer surface of the container contact tip part. The thickness of the container contact tip part in the oscillating direction of the container contact tip part is configured to be greater than the thickness of the base part-side deformation part.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
68.
Resin pipe joint, piping, and piping production method
b) is shorter than half of a straight distance (SD, SD1-SD4) between two points adjacent to each other, the two points being selected from the group consisting of branched points (Bp), curved points (Cp) and inner diameter transition points (Tp) of piping to be formed using the resin pipe joints (1, 11).
This substrate storage container is provided with: a container body 2; a lid body which can be attached to and detached from an opening portion of the container body and which can close the opening portion of the container body; a gas flow path 210 which can connect a substrate storage space 27 and a space outside the container body 2; and a gas jetting nozzle part 8 having a plurality of opening portions 802 through which a gas having flowed in the gas flow path 210 is supplied to the substrate storage space 27, wherein a gas-flow-rate uniformizing unit that allows outflow of the gas from the plurality of opening portions 802 at a uniformized flow rate, is included.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This substrate storage container is provided with: a container body 2; a lid body which can be attached to and detached from an opening portion of the container body and which can close the opening portion of the container body; a gas flow path 210 which can connect a substrate storage space 27 and a space outside the container body 2; and a gas jetting nozzle part 8 having a plurality of opening portions 802 through which a gas having flowed in the gas flow path 210 is supplied to the substrate storage space 27, wherein a gas-flow-rate uniformizing unit that allows outflow of the gas from the plurality of opening portions 802 at a uniformized flow rate, is included.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
Disclosed is a gas purge filter used in a housing container provided with a container main body and a lid body. The gas purge filter has a filter housing having a ventilation space where gas outside the housing container and gas of a housing space can be ventilated, and a pad formed outside the housing space of the filter housing to cover an outer peripheral face of a nozzle portion that forms a part of the ventilation space. The pad is formed of an elastic body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
B01D 46/10 - Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
F16K 15/02 - Check valves with guided rigid valve members
B01D 46/42 - Auxiliary equipment or operation thereof
B01D 46/52 - Particle separators, e.g. dust precipitators, using filters embodying folded material
This board storing container is provided with a container body, a lid 3, and a lid-side board support unit 7 which, when the lid 3 closes a container body opening, is arranged in the part of the lid 3 opposite of the board storage space and which can support the edge of multiple boards. The lid-side board support unit 7 is provided with a lid-side board receiving unit which receives the edge of a board when supporting the board, and a frame part 71 held on the inner surface of the lid 3 and having a first surface 711 facing the inner surface of the lid 3 and a second surface 712 opposite of the first surface 711. The lid 3 is provided with a frame holding unit 35 for holding the frame 71 in an inserted state, and comprises a third surface 353 opposite of the first surface 711 and a fourth surface 354 opposite of the second surface 712. The lid-side board support unit 7 further is provided with a first protrusion 76 which, on the first surface 711 of the frame part 71, protrudes towards the third surface 353, and is provided with an engagement part 75 which, on the second surface 712 of the frame part 71, engages with the frame holding unit 35 in a state in which the frame part 71 is inserted.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This board storing container comprises a lid-side board support unit 7, and the lid-side board support unit 7 is provided with a lid-side board receiving unit 73 and a lid-side leg 72. The lid-side board receiving unit 73 comprises: a lower inclined surface 731; an upper inclined surface 732; a lower board guiding inclined surface 733 which is connected to the bottom end of the lower inclined surface 731 and which has an angle from the vertical direction D2, which coincides with the direction of arrangement of the multiple boards, less than the angle of inclination of the lower inclined surface 731; and an upper board guiding inclined surface 734 which is connected to the top end of the upper inclined surface 732 and which has an angle from the vertical direction D2 less than the angle of inclination of the upper inclined surface 732. In the direction of extension of a groove 703 when a container body opening is closed by a lid, the length of the lower board guiding inclined surface 733 in the vertical direction D2 becomes longer nearer to the center of the container body opening.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
A resin pipe joint includes a tubular joint body portion having an internal flow path (P) for allowing a fluid to flow therein; and two or more welding end portions, which are respectively provided at two or more opening portions of the internal flow path (P), and which are configured to be welded while being butted against end portions of other resin tube members or end portions of other resin pipe joints. The flow path cross-sectional area of the internal flow path (P) in the joint body portion is constant, at least in portions that are adjacent to the welding end portions and whose outer diameters are straight.
At least one of a lateral substrate support portion 5, a back side substrate support portion 6, and a lid body side substrate support portion of this substrate housing container is an interior portion that is attachably/detachably fixed to an inner surface of a container body 2 and is disposed in a substrate housing space. Surface roughening S is performed on parts 53, 251, 255, 256 where members including substrates are brought into contact with each other in the substrate housing space. It is possible to provide a substrate housing container that is able to suppress occurrence of particles and adhesion of resin to a substrate W, and suppress a device error in a device for closing a lid body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
According to the present invention, a back-side substrate support part 6 of a substrate housing container has: a lower contact surface 611 that can contact an end edge of an undersurface of a substrate W; a side contact surface 621 that extends perpendicularly upward from the lower contact surface 611; a lower inclined surface 622 that extends obliquely from an upper end part of the side contact surface 621 away from the center of a substrate housing space; and an upper inclined surface 631 that extends obliquely from an upper end part of the lower inclined surface 622 toward the center of the substrate housing space. When a container main body opening part has been closed by a lid body, the side contact surface 621 can contact a side surface of an end edge of the substrate W, and the lower contact surface 611 remains in contact with the end edge of the undersurface of the substrate W.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
According to the present invention, a back-side substrate support part 6 of a substrate housing container 1 has: a lower inclined surface 622 that extends obliquely away from the center of a substrate housing space 27 and is a surface along which an end part of an undersurface of a substrate W slides; and a substrate support part 632 that is positioned above the lower inclined surface 622 and can support an edge part of the substrate W. When a container main body opening part 21 is being closed by a lid body 3, the edge part of the substrate W slides along the lower inclined surface 622 to the substrate support part 632. At least one part of the lower inclined surface 622 is configured from a second member that is separate from a first member that constitutes the substrate support part 632. The second member has lower abrasion resistance and a lower maximum coefficient of static friction than the first member.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The plurality of protective grooves 225 has openings 2231 wider than thicknesses of the edge portions of the substrates W to allow the edge portions of the substrates W to be inserted. The edge portions of the substrates W are inserted into the protective grooves 225 in a non-contact state in which a space is formed between the edge portions of the substrates W and a groove forming surface 2221 of the substrate edge portion protective portion 222 on which the protective grooves 225 are formed when the container main body opening portion is closed by the lid body and the edge portions of the substrates W are not in contact with the groove forming surface 2221.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
79.
MULTILAYER SHEET, AND MULTILAYER CONTAINER USING SAME
The purpose of the present invention is to provide: a multilayer sheet which exhibits impact resistance such as dropping strength, and poses no health problems, despite being easy to snap at a split groove; and a multilayer container which uses said multilayer sheet. Provided is a multilayer sheet which has, as one surface, a polystyrene resin layer having polystyrene as a main component, and has, as another surface, a functional resin layer having a functional resin as a main component. The polystyrene resin layer and the functional resin layer are bonded together using an adhesive resin layer. A split groove obtained by cutting the functional resin layer and the adhesive resin layer is provided so as to reach the inside of the polystyrene resin layer. Also provided is a container which uses said multilayer sheet.
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
A substrate storing container includes a container main body, a lid body, and a lateral substrate support portion. The lateral substrate support portion of the substrate storing container includes substrate contact portions touching a substrate when supporting an edge portion of the substrate, and contact portion support portions supporting the substrate contact portions. The substrate contact portions are made of a material having a heat-resisting property with respect to temperature of the substrate touching the substrate contact portions. The contact portion support portions are made of a material having a lower heat-resisting property than that of the substrate contact portions and having a lower coefficient of moisture absorption than that of the substrate contact portions.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A sealing member 4 of this substrate housing container has: a base part 41 fixed to a seal member attachment section 303; a container contact tip part 43 having a body contact section 431 that comes into contact with an opening peripheral edge section; a base part-side deformation part 42 that couples the base part 41 and the container contact tip part 43 and is elastically deformable to allow the container contact tip part 43 to oscillate relative to the base part 41; and a protruding part 44 that is present in the portion of the container contact tip part 43 connected to the base part-side deformation part 42 and that protrudes from the outer surface of the container contact tip part 43. The thickness of the container contact tip part 43 in the oscillating direction of the container contact tip part 43 is configured to be greater than the thickness of the base part-side deformation part 42.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
82.
RESIN PIPING MEMBER, RESIN PIPE JOINT, AND PIPING PRODUCTION METHOD
This resin piping member (1) comprises: a pipe main body part (2) that has an internal flow path (P) that allows a fluid to flow; and two or more weld end parts (3a, 3b, 3c) that are respectively provided to two or more open sections (A1, A2, A3) of the internal flow path (P) and that are to abut and be welded to end parts of other resin piping members. At least one of the weld end parts (3a, 3b, 3c) is provided with an expanded-inner-diameter section (4) that has a larger inner diameter than the pipe main body part (2). An inner surface of the expanded-inner-diameter section (4) comprises inclined surfaces (5a, 5b) that are inclined with respect to a plane that is orthogonal to the center axis (C) of the internal flow path (P) at the location of the weld end part (3a, 3b, 3c) and are configured such that the inclination angle (θ1, θ2) of the inner surface with respect to the plane changes along the axial direction of the internal flow path (P).
These resin pipe joints (1, 11) comprise: a pipe-shaped joint main body part (2, 12) that has an internal flow path (P) that extends so as to allow a fluid to flow; and two or more weld end parts (3a-3c, 13a, 13b) that are respectively provided to two or more open sections (A1-A3) of the internal flow path (P) and that are to abut and be welded to weld end parts of other resin piping members. The internal flow path (P) has, along the length thereof, a branch point (Bp) at which the internal flow path (P) branches into two or more branches, a curve point (Cp) at which the internal flow path (P) curves, or an inner-diameter transition point at which the inner diameter of the internal flow path changes. The distance (Lh) from the branch point (Bp), the curve point (Cp), or the inner-diameter transition point (Tp) to an end surface of the weld end parts (3a-3c, 13a, 13b) is shorter than half of the two-point straight-line distance (SD, SD1-SD4) between adjacent branch points (Bp), curve points (Cp), or inner-diameter transition points (Tp) of piping configured using the resin pipe joints (1, 11).
This resin pipe joint (1, 11, 21) is provided with: a tubular joint main body (2, 12, 22) comprising an internal flow path (9P) through which a fluid is made to flow; and two or more welded ends (3a-3c, 13a, 13b, 23a, 23b) that are provided to each of two or more open parts of the internal flow path (P) and that are arranged opposite the end of a resin tube member for piping or the end of another resin pipe joint and welded thereto. The internal flow path (P) of the joint main body (2, 12, 22) is configured so that the cross-sectional area of the flow path thereof is uniform at least in a part that has a straight outer diameter and that is adjacent to the welded sections (3a-3c, 13a, 13b, 23a, 23b).
This resin tube member (1) is provided with: a tube main body (2) that has a straight tubular shape and that comprises an internal flow path through which a liquid is made to flow; and welded ends (3a, 3b) that are provided to each of the one end and the other end of the tube main body (2) and that are arranged opposite an end of a resin pipe joint or an end of another resin tube member and welded thereto. A position adjustment section (4, 14, 24) used for alignment with the resin pipe joint or the other resin tube member in the circumferential direction is provided to at least one location on the outer surface of the tube main body (2) and/or the welded ends (3a, 3b) in the circumferential direction.
The tip face 411 of the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322 have a positional relationship of facing each other, and a bottom portion space 413 is formed between the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322. A pair of side faces 412 of the base portion 41 inserted into the retaining groove 321 and the pair of groove side faces 323 have a positional relationship of facing each other, and side face spaces 324 which are in communication with an opening of the retaining groove 321 are respectively formed between the pair of side faces 412 of the base portion 41 inserted into the retaining groove and the pair of groove side faces 323, and the bottom portion space is in communication with the side face space.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This substrate storing container is provided with a substrate end portion protection section 222 wherein a plurality of protection grooves 225 are formed, said protection grooves 225 respectively having openings 2231 wider than the thickness of end portions of substrates W such that the end portions of the substrates W can be inserted, and respectively having the end portions of the substrates W inserted therein when a container main body opening is covered with at least a cover body. When the container main body opening is covered with the cover body, spaces are formed between the end portions of the substrates W and a groove forming surface 2221 of the substrate end portion protection section 222 forming the protection grooves 225, and in a state wherein the end portions of the substrates W are not in contact with the groove forming surface 2221, the end portions of the substrates W are inserted into the protection grooves 225, respectively.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
The bottom part of a substrate-accommodating container includes: contact parts 7 for contacting each of a plurality of positioning parts 921, 922 provided to a load port for conveying a substrate accommodated in a substrate-accommodating space to a processing device, the positioning parts 921, 922 positioning a container body relative to the load port; and an interior bottom engagement part 615 positioned closer to an interior wall 22 than a center position CP between the contact part 7 positioned closest to an opening in the container body and the contact part 7 positioned closest to the interior wall 22 with respect to the direction in which the opening in the container body and the interior wall 22 are linked, the interior bottom engagement part 615 being engaged and secured by the container engaging part 911 of the load port.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
This filtration device (1) is configured so that a filter housing (10) is provided with: an axial stopper for restricting the displacement of a filter cartridge (20) in the direction of the axis of the housing; and a rotational direction stopper for restricting the displacement of the filter cartridge (20) in the direction of rotation thereof about the axis of the housing. The filter cartridge (20) is removably affixed within the filter housing (10) to a bowl (11) by the axial stopper and the rotational direction stopper.
B01D 29/11 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups Filtering elements therefor with bag, cage, hose, tube, sleeve or like filtering elements
90.
Packaging structure for packing substrate storing container
The first cushioning portion includes: a cushioning support portion that directly abuts the substrate storing container to support the substrate storing container; and a cushioning-portion connecting portion that is connected to the cushioning support portion, and extends downwards from the cushioning support portion. The second cushioning portion includes: a cushioning plate-like portion in which a through-hole is formed; and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion. The cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.
B65D 5/58 - Linings spaced appreciably from container wall
B65D 81/05 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
B65D 81/113 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container (1) according to the present invention is provided with a gas spraying nozzle part (101A) which supplies, to a substrate storing space (27), gas having flowed into the aeration channel of a filter part (80). The gas spraying nozzle part (101A) is provided with: through holes (130A, 140A) which cause a nozzle-part internal space connected to the aeration channel to be in communication with the external space of the gas spraying nozzle part; and concavities and convexities (113A, 114A, 115A) which are formed on the internal surface of the gas spraying nozzle part (101A) which forms the nozzle-part internal space, and which produce a turbulent flow of the gas in the nozzle-part internal space.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
92.
Structure for fastening together resin members in substrate storing container
The lower lid includes a bottom plate that supports the substrate storing container and a lower lid peripheral wall that extends upwards from a periphery of the bottom plate. The sleeve member has a tubular shape having an axial center that extends in the vertical direction. The upper lid has a top plate and an upper lid peripheral wall that extends downwards. The lower lid includes device positioning portions. The device positioning portions can engage the positioned portion of the lifting device that lifts, from the lower lid, the substrate storing container which is supported by the lower lid in a state of the upper lid being removed therefrom.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 81/113 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate storing container that stores substrates composed of semiconductor wafers includes: a locked portion that is arranged at a center portion of an upper wall and is locked by a lifting member that can lift a container main body; in which the locked portion includes a plate-like flange portion having a lower face that faces the upper wall and an elastically deformable elastic member provided at a lower face of the flange portion and/or at a rim portion of the flange portion; and in which the locked portion is locked by the lifting member in a state in which the elastic member is sandwiched between the flange portion and the lifting member.
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The lid body which includes a lid body main body having a lid body inner face and a lid body outer face, is detachable to the opening rim portion, and can close the container main body opening portion, wherein the lid body inner face forms the substrate storing space together with the main body inner face when the container main body opening portion is closed. The external component made from resin that is mounted to at least one of a part of the container main body other than the main body inner face, and a part of the lid body main body other than the lid body inner face. The external component is annealed.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
95.
Packing structure for packing substrate storing container
An upper cushioning material is placed on a substrate storing container in a packing box. The substrate storing container is placed on a lower cushioning material. The lower cushioning material is disposed in the packing box in such a manner that the substrate storing container is sandwiched in the vertical direction by an upper cushioning material and the lower cushioning material. Furthermore, the lower cushioning material is not in contact with any of a first side plate, a second side plate, a front plate and a back plate of the packing box, and a lower space is formed between the lower cushioning material and the first side plate, the second side plate, the front plate and the back plate of the packing box.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The present invention provides a substrate housing container that prevents cleaning water from remaining in a communication part. The communicating part 93 includes: an opening facing wall section 931; a gas lead-out section 941 for guiding, toward a gas jetting nozzle part 91, gas G1 which comes from a ventilation passage 801 of a filter part 80 and collides with the opening facing wall section 931; a communicating part flow passage 945 formed by the opening facing wall section 931 and the gas lead-out section 941 and transferring the gas from the ventilation passage 801 of the filter part 80 toward the gas jetting nozzle part 91; and a leak suppressing wall section 935 which extends from the opening facing wall section 931 toward the filter part 80 and suppresses the gas G1, which comes from the ventilation passage 801 of the filter part 80 and collides with the opening facing wall section 931, from leaking from the communicating part flow passage 945. The extending end of the leak suppressing wall section 935 and the filter part 80 are positioned to be spaced apart from each other, and a gap 806 is formed between the leak suppressing wall section 935 and the filter part 80.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
A heat-weldable weld fitting that has a cylindrical fitting main body portion. The cylindrical fitting main body portion includes an outer periphery including a first end portion, a second end portion, and a middle section between the first end portion and the second end portion, and positioning scales formed at equal intervals in a peripheral direction of the second end portion of the outer periphery of the fitting main body portion. The first end portion being configured to be heated by a heater and is welded to an end portion of another weld fitting. The positioning scales are configured to define an angular portion of the weld fitting relative to the welding apparatus at the time of welding the first end portion to the first end portion of another weld fitting by matching the positioning scale with a reference mark provided on the clamp portion of the welding apparatus.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
B23K 37/053 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work aligning cylindrical workClamping devices therefor
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
B29C 65/00 - Joining of preformed partsApparatus therefor
B23K 33/00 - Specially-profiled edge portions of workpieces for making soldering or welding connectionsFilling the seams formed thereby
B29C 65/20 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated tool with direct contact, e.g. using "mirror"
B29C 65/02 - Joining of preformed partsApparatus therefor by heating, with or without pressure
B29C 65/14 - Joining of preformed partsApparatus therefor by heating, with or without pressure using wave energy or particle radiation
The lateral substrate support part has: a plurality of plate parts, which have a parallel positional relationship, and support end portions of a plurality of substrates; and a plate-part support part, which supports the plate part, and is fixed to a side wall. The plate-part support part has: a groove-forming portion having a groove formed therein, said groove linearly extending over the whole plate parts in the direction intersecting the plate parts; a protrusion, which is formed in the groove, and which protrudes such that the protrusion reduces the width of the groove in the direction orthogonal to the direction in which the groove extends; and a positioned part that is formed at a center portion of the groove in the direction in which the groove extends.
B65D 85/00 - Containers, packaging elements or packages, specially adapted for particular articles or materials
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A gas purge filter used for a container (1) consisting of a container body and a lid comprises: a filter housing (100) having a ventilation space (110) that allows the ventilation of a gas in a space outside the container (1) and the ventilation of a gas in a containing space (27); and a pad (300) that is so formed as to cover the outer surface of a nozzle part (103) of the filter housing (100), said nozzle part (103) being formed outside the containing space and defining a portion of the ventilation space (110), said pad (300) being made of an elastic body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
F16K 15/02 - Check valves with guided rigid valve members
The bottom plate has a plate-like shape, is arranged to face an outer face of a lower wall, and has a locking portion. The groove member has: a groove-forming portion having a groove opening downward formed therein, a surrounding wall portion, which is connected to the groove-forming portion, and is arranged around the groove-forming portion; and a locked portion, which is connected to the surrounding wall portion, is elastically deformable, and is locked by way of the locking portion of the bottom plate by being elastically deformed. The groove member is supported and fixed by way of the lower wall and the bottom plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
