Provided is a polishing head and a polishing treatment device that can cope with the wrinkle phenomenon, the star mark phenomenon and the like, further improve the SFOR or the like of the substrate surface and steadily perform a polishing treatment of a large number of substrates with high quality.
Provided is a polishing head and a polishing treatment device that can cope with the wrinkle phenomenon, the star mark phenomenon and the like, further improve the SFOR or the like of the substrate surface and steadily perform a polishing treatment of a large number of substrates with high quality.
A polishing head 100 includes a membrane support ring 3, a membrane 4 that covers a lower end-side opening part of the membrane support ring 3 and holds a substrate W with a backing film 5 pasted to a front surface side thereof interposed therebetween, and a retainer ring 6 shaped to accommodate the membrane support ring 3 and surround the outer circumference of the substrate W. On the back surface side of the membrane 4, a plurality of radial ribs 4a that radially extend from the vicinity of the center of the membrane 4 and a circular rib 4b that is shaped to have a size smaller than the size of the elastic body are formed, and the radial ribs 4a are formed to radially extend outward from the circular rib 4b. In a region defined by adjacent radial ribs 4a, the membrane support ring 3 and the circular rib 4b on the back surface side of the elastic body, a rib lock member 33 shaped to be in contact with the side surfaces of the adjacent radial ribs 4a, the inner circumferential surface of the membrane support ring 3 and the outer circumferential surface of the circular rib 4b is arranged.
B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
Provided is a polishing apparatus capable of effectively suppressing deformation (thermal deformation) of a polishing platen of a chemical mechanical polishing (CMP) apparatus. The polishing apparatus is further able to improve site flatness quality requirements (SFQR) and the like of a substrate surface, and perform high-quality, stable polishing during each of a plurality of polishing processes. A polishing table 11 includes: a polishing platen 1 having a polishing pad arranged on the surface thereof; a cooling base 2 on which the polishing platen is placed and in which a first groove portion 21 is formed in a surface that comes in contact with a rear surface of the polishing platen; and a decompression cooling mechanism 200 that simultaneously suctions and cools the polishing platen by supplying a temperature-controlled negative pressure fluid to the first groove portion 21 of the cooling base, and recovers the negative pressure fluid that has passed through the first groove portion, performs a chiller treatment, and supplies the negative pressure fluid again to the first groove portion. The decompression cooling mechanism has a vacuum pump 70 that generates the negative pressure fluid, a chiller device 62 that performs chiller cooling of the negative pressure fluid, and a fluid pump 61 that supplies the temperature-adjusted negative pressure fluid to the first groove portion.
A polishing head includes a head housing having a first flange part that extends outward from an upper position of a circumferential surface of a cylindrical body and a second flange part that extends outward from a lower position of the circumferential surface, a membrane support ring that is sized to surround an outer circumference of the second flange part and has a third flange part that is formed at an upper end part thereof and located between the first flange part and the second flange part, a membrane that covers a lower end-side opening part of the membrane support ring and holds the wafer with a backing film pasted to a front surface thereof interposed therebetween, a retainer ring formed in a shape to surround an outer circumference of the substrate, and driving means that integrally horizontally rotates the head housing, the membrane support ring, and the retainer ring.
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of large numbers of substrates can be performed stably with high quality. A polishing head 100 has a membrane support ring 3, a membrane 4 that covers an opening on a lower end side of the membrane support ring 3 and holes a substrate W via a backing film adhered to a front surface side of the membrane 4, and a retainer ring 6 that includes the membrane support ring 3 therein and is formed in a shape that surrounds the outer periphery of the substrate W. A plurality of radial ribs 4a extending radially from the vicinity of the center of the membrane and an annular rib 4b formed with a small size relative to the size of an elastic body are formed on a back surface side of the membrane 4, and the radial ribs 4a are formed extending radially outward from the annular rib 4b. In a region on the back surface side of the elastic body that is surrounded by adjacent radial ribs 4a, the membrane support ring 3, and the annular rib 4b, there is arranged a rib restriction member 33 that is formed having a shape that adjoins side surfaces of the radial ribs 4a, the internal peripheral surface of the membrane support ring 3, and the external peripheral surface of the annular rib 4b.
Provided are a polishing head and a polishing treatment device with which uneven polishing of a substrate surface being polished, such as partial insufficient polishing or over-polishing, is prevented, with which a further improvement in the ESFQR of the substrate surface, for example, can be achieved, and with which polishing treatment for multiple substrates can be performed stably with high quality. This polishing head includes: a head housing that includes a first flange portion extending outward from a position above a circumferential surface of a tubular body, and a second flange portion extending outward from a position below the circumferential surface; a membrane supporting ring which is formed with a size that surrounds an outer circumference of the second flange portion, and in an upper end portion of which is formed a third flange portion positioned between the first and second flange portions; a membrane which covers an opening on a lower end side of the membrane supporting ring, and which holds a wafer by way of a backing film bonded to an outer surface side thereof; a retainer ring formed with a shape that surrounds the outer circumference of the substrate; and a drive mechanism for causing the head housing, the membrane supporting ring, and the retainer ring to rotate integrally in a horizontal direction.
Provided is a shipping inspection device that can specify a state of a container accommodating a multiplicity of wafers and further assure quality before shipment. A packaging device has a mechanism to retain a container B configured to be capable of accommodating a plurality of wafers with a prescribed interval placed therebetween and insert the container B into a packaging bag. Further, the packaging device has a light source 30 that irradiates lateral surfaces of the wafers accommodated in the container B with light from an outside of the container B before being inserted into the packaging bag, a light source 31 that irradiates the lateral surfaces of the wafers accommodated in the container B with light from a direction different from the light source 30, and light receiving units 35 and 36 that detect reflected light of the light irradiated from the respective light sources. Further, the packaging device has a control unit 20 that controls specification of a presence state of the wafers in the container B on the basis of detection results by the light receiving units 35 and 36.
B65B 57/10 - Automatic control, checking, warning or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
B65B 51/10 - Applying or generating heat or pressure or combinations thereof
B65B 57/00 - Automatic control, checking, warning or safety devices
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A pressing mechanism of a polishing head (13), including: a first pressing body configured so as to include a first airbag (132) and a first pressure disc (134) formed so that a portion near the center of a contact surface which comes into contact with an elastic body (137) is convex-shaped towards the elastic body (137); and a second pressing body, which is formed as a cylinder having the first pressure disc (134) disposed on the inner circumferential side thereof, and which is configured so as to include a second airbag (133) and a second pressure disc (135) formed so that a portion near the outer edge of a contact surface which comes into contact with the elastic body (137) is concave-shaped towards the elastic body (137). A pressure fluid is sealed in the first airbag (132) and the second airbag (133), and the pressing force from the first pressing body and the second pressing body generated towards the rear surface of a substrate (W) in accordance with the quantity of the pressure fluid is applied to the rear surface side of the substrate (W) through the elastic body (137).
patents
