Abstract

A carrier stack for transferring a two-dimensional, 2D, material layer to a rigid target substrate and a method of producing the stack, the method including: - providing a rigid or semi-rigid carrier substrate; and - coating at least one of the carrier substrate and the 2D material layer with an adhesion layer; and - bonding the 2D material layer to the carrier substrate through the at least one adhesion layer, wherein bonding the 2D material layer comprises: - positioning the carrier substrate facing the 2D material layer, the 2D material layer supported by a growth substrate, and bringing them into contact; - bonding the 2D material layer to the carrier substrate through the at least one adhesive layer by applying heat and/or pressure; and - de-bonding the 2D material layer from the growth substrate; wherein the 2D material comprises one or more of graphene, hexagonal Boron Nitride, h-BN, and a transition metal dichalcogenide, TMDC, material; and when the 2D material comprises graphene or h-BN, the step of de-bonding comprises an electrochemical process; and when the 2D material comprises a TMDC material, the adhesion layer comprises a metal, an eutectic material or a metal compound, and the step of de-bonding comprises mechanical debonding.

IPC Classes  ?

• C01B 32/19 - Preparation by exfoliation
• C01B 32/194 - After-treatment
• C25F 5/00 - Electrolytic stripping of metallic layers or coatings
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

Method and apparatus for cleaning a two-dimension, 2D, material disposed on a substrate, with a first surface of the 2D material facing away from the substrate and a second surface of the 2D material facing the substrate, wherein cleaning is performed by: providing a plurality of force application elements, each having an outer end, with their outer ends and positioning these at substantially equal distances from the first surface; and applying a shear force to the first surface, in particular to an interface between the first surface and residues present on the first surface, by moving the plurality of force application elements and the substrate relative one another.

IPC Classes  ?

• H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• C01B 32/194 - After-treatment
• B08B 1/00 - Cleaning by methods involving the use of tools
• B08B 1/12 - Brushes
• B08B 1/14 - WipesAbsorbent members, e.g. swabs or sponges

Abstract

The invention relates to a method and an apparatus for transferring a layer of a material from an initial substrate to a target substrate. The apparatus comprises a container for holding an electrolyte solution, a substrate holding member arranged inside the container, a voltage source connectable to the layer of the material and/or to the initial substrate, an actuator for moving the target substrate away from the initial substrate, or vice versa, and a controller for controlling the actuator. The method comprises the steps of: - moving an edge of the target/initial substrate away from the initial/target substrate for providing a separation space between the initial substrate and the layer of the material, with a separation front where the initial substrate and the layer of the material commence separation from each other; and - when the initial substrate with the layer of the material and the target substrate are at least partially submerged in the electrolyte solution and a potential is applied to the layer of the material and/or a surface of the initial substrate that is facing the layer of the material, increasing the separation space and moving the separation front along the initial substrate, wherein the electrolyte diffuses between the initial substrate and the layer of material, wherein the actuator is controlled to provide a progress of the separation front that is equal to or smaller than a diffusion velocity of the electrolyte.

IPC Classes  ?

• B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
• C25F 5/00 - Electrolytic stripping of metallic layers or coatings
• C01B 32/194 - After-treatment

Abstract

A retainer for holding a substrate during chemical vapor deposition, CVD, processing, the retainer having: - a first surface configured to form a counter surface for an exposure surface of the substrate; - a second surface, substantially parallel to the counter surface and arranged at a distance, d, from the counter surface, the second surface arranged for supporting the substrate; - a third surface, arranged at an angle to the second surface, the third surface forming an edge confining movement of the substrate.

IPC Classes  ?

• C23C 16/26 - Deposition of carbon only
• C01B 32/186 - Preparation by chemical vapour deposition [CVD]
• C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• C23C 14/50 - Substrate holders

Abstract

The invention relates to a heating element, a substrate processing system comprising such a heating element, and a method for processing a substrate in such a substrate processing system. The heating element comprises an electrically conductive electrode, wherein the electrically conductive electrode extends along a path between an input contact and an output contact. The electrically conductive electrode comprises a segment along the path in which the electrically conductive electrode is split in at least two separate electrically conductive electrode branches which are electrically connected in parallel. The electrically conductive electrode and the at least two separate electrically conductive branches comprises a heating component which is configured for generating heat and/or emitting heat radiation when a current is running through the heating component.

IPC Classes  ?

• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base