The invention relates to stall detection of an electronically commutated motor, comprising one or more motor phases for each motor phase a phase inductance L, and a phase resistance R. A driver is configured for driving the electronically commutated motor by applying a voltage or a current vector to one or more motor phases of the electronically commutated motor with a rotation speed ω of the voltage vector or the current vector; a detector is configured for obtaining an electric angle between the applied voltage vector and a resulting current vector or between the applied current vector and a resulting voltage vector; a processing device is configured for determining a stall of the rotor if the absolute value of the electric angle or a filtered version thereof crosses a stall threshold value wherein the stall threshold value is arctan 2(ωL, R) plus or minus a predefined margin.
A method of manufacturing a chemical sensor die comprises providing (200) a 5 substrate (102) comprising an electrically non-conducting surface, and providing (210) a conduction line (120) on the electrically non-conducting surface. A passivation layer (130) is formed (214) over the conduction line (120) using a Low Pressure Chemical Vapour Deposition technique, and a portion of the passivation layer (130) is removed to expose a portion of the conduction line (120) for electrical 10 coupling. A sensor electrode (146) is disposed (228) upon the passivation layer (130) so as to extend from above the passivation layer (130) into the passivation layer (130) to access the exposed portion of the conduction line (120). The sensor electrode (146) is coupled to the exposed portion of the conduction line (120) and the conduction line (120) is formed from a material where a shape of the conduction 15 line (120) survives deposition of the passivation layer (130).
A sensing die (100) comprises a substrate (102) comprising an electrically non-conducting surface (106) and a bond pad (144), the bond pad being encapsulated by an encapsulation material (170). A conduction line (120) is disposed on the electrically non-conducting surface (106) and an ion-blocking passivation layer (130) is disposed over the conduction line (120). A sensor electrode (146) is disposed adjacent the passivation layer (130) and a portion of the passivation layer (130) is absent, providing a portion of the conduction line (120) for electrical coupling. The sensor electrode (146) extends from above the passivation layer (130) to the exposed portion of the conduction line (120) and is coupled to the portion of the conduction line (120) provided for electrical coupling. The sensor electrode (146) above the passivation layer (130) is exposed for direct contact with an analyte. The conduction line (120) is formed from a material where a form of the conduction line (120) survives deposition of the passivation layer (130).
A thermal sensor array device (100) comprises a substrate having a cavity (291) formed therein. An infrared absorbing membrane (200) is suspended over the cavity from a first and second beams (202, 206), the first beam (202) being thermally coupled at one end thereof to the substrate (Cj1) at a first cold junction and the second beam (206) being thermally coupled at one end thereof to a second substrate cold junction (Cj2). Thermocouples are disposed over the first and second beams (202, 206) and on the membrane (200). The thermocouples are arranged on the first and second beams (202, 206) and the membrane (200) as first and second thermopiles (300, 320). The first and second thermopiles (300, 320) are arranged on the membrane (200) to measure a sum of first temperature differentials between the first substrate cold junction (Cj1) and a hot junction (Hj) on the membrane (200), and second temperature differentials between the second substrate cold junction (Cj2) and the hot junction (Hj) on the membrane. The first thermopile (300) is configured to connect selectively to the second thermopile (320) in series and anti-series.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
5.
METHOD FOR TEMPERATURE COMPENSATION FOR COMPACT LED LIGHTS
A method and an apparatus for temperature compensation are described. The method includes receiving a target color point for light emitted by at least one light-emitting device, determining an operating electrical energy of the at least one light-emitting device based on a correlation of at least one temperature value of the at least one light-emitting device with the received target-color point and operating the at least one light-emitting device based on the determined operating electrical energy.
A method and an apparatus for determining the temperature of a light-emitting device is described. The method includes operating the light-emitting device during an on-interval and during an off-interval, measuring, during at least one sensing interval, at least one electrical energy across the light-emitting device. The at least one sensing interval is included in the off-interval and each of the at least one sensing intervals has a duration equal to or less than a duration of the off-interval and determining, at least one temperature value of the light-emitting device based on the measured at least one electrical energy.
An analog to digital converters (ADC) is for converting an input signal into a digital value. In the ADC, a successive approximation register is connected with its output to a first digital to analog converter (DAC), to a second DAC. A switch matrix is configured for capacitively coupling the input signal between the first input and the second input of the comparator or for capacitively coupling an output signal of the first DAC or an output signal of the second DAC or both between the first input and the second input of the comparator. The ADC includes a comparator switch between the first and the second input of the comparator. An output of the comparator is connected to an input of the successive approximation register.
H03M 1/46 - Analogue value compared with reference values sequentially only, e.g. successive approximation type with digital/analogue converter for supplying reference values to converter
An integrated device comprises an electrically conductive substrate having an upper surface comprising a recess and a lower surface for contacting the device, a multi-layer stack provided on the upper surface of the substrate and lining the recess, and an electrically conductive layer for contacting the device provided on the multi-layer stack. The multi-layer stack comprises a first, a second, a third and a fourth dielectric layer. Immediately adjacent dielectric layers have different bandgaps to trap charge carriers at respective interfaces between the dielectric layers during operation of the device.
H01L 29/94 - Metal-insulator-semiconductors, e.g. MOS
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, comprising a membrane as part of a semiconductor substrate for being deformed due to the external pressure, a first group of neighboring resistors comprising a sensing resistor pair and a compensating resistor pair and a second group of neighboring resistors comprising a sensing resistor pair and a compensating resistor pair, wherein the sensing resistor pairs are located on or adjacent to the membrane edge and wherein the compensating resistor pairs are located at least partially outside the membrane or on a zero stress zone of the membrane, and wherein the resistors of each resistor pair are orthogonal, and wherein the resistors are connected in a Wheatstone bridge configuration.
G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
10.
PRESSURE SENSING ELEMENT AND METHOD OF MANUFACTURE THEREOF
A pressure sensing element (100) for a pressure sensor device comprises a substrate portion (102) comprising a cavity (104) formed therein, a mouth (184) of the cavity (104) having an opening periphery (186). A membrane layer (106) overlies the opening periphery (186) of the cavity (104), and a strain gauge element (166, 168, 170, 172) is disposed on the membrane layer (106) over the cavity (104). The cavity (104) comprises a primary cavity (118) and a first annex (120) integrally formed with the primary cavity (118).
G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
11.
THERMAL SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF
A thermal sensor device (100) comprises an integrated circuit die (104) having a first mating side (126) and an external side (128) opposite the mating side (126). A sensor-containing die (102) is disposed in spaced relation with the integrated circuit die (104) so that the first mating side (126) faces a second mating side (114), a portion (144) of the sensor-containing die (102) overhanging the integrated circuit die (104). An electrically conductive circuit path (132, 146, 120, 122) extends from a first opposing surface (134) of the first mating side (126) to a second opposing surface of the second mating side (114) and extends further to the overhanging portion (144) so that a portion of the electrically conductive circuit path (132, 146, 120, 122) also overhangs the integrated circuit die (104). An electrical linkage portion (148) electrically couples to the electrically conductive circuit path (132, 146, 120, 122) at the overhanging portion (144) and extends beyond the external side (128) of the integrated circuit die (104).
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
H10N 19/00 - Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups
A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.
H01L 23/26 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
13.
THERMAL SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a thermal sensor (106) comprises providing a first part (102) of a body of the sensor (106), the first part (102) of the body being configured to define a first part (114) of a chamber (310). A second part (104) of the body of the sensor (106) is also provided, the second part (104) of the body being configured to define a second part (118) of the chamber (310). A getter material (112) is disposed in the first part (114) of the body of the sensor (106), and the first part (102) and the second part (104) of the body of the sensor (106) are brought together so that the first and second parts (102, 104) of the chamber (310) define the chamber (310). The chamber (310) is backfilled with a gas to a pressure greater than 10 mbar, and the first part (102) of the body is bonded to the second part (104) of the body so as to seal hermetically the chamber (310).
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
H10N 10/13 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
14.
SEALED SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF
A sealed sensor device (104) comprising: an internal atmosphere comprising a gas pressurised to a predetermined pressure, the predetermined pressure being below atmospheric pressure when the internal atmosphere is hermetically sealed from ambient. A sensor cavity (214) is also provided having a periphery and is in fluid communication with the internal atmosphere, thereby comprising the gas and the gas having a mean free path at the predetermined pressure associated therewith. A thermopile (256) is disposed in the sensor cavity (214) for detecting a change in pressure of the internal atmosphere and detecting failure of the hermetic seal. A membrane structure (234) disposed within the cavity comprises the thermopile (256). The membrane structure (234) also comprises a heating element, and a shortest distance from substantially any point on the membrane structure (234) to the periphery of the sensor cavity (214) is less than the mean free path of the gas at the predetermined pressure.
G01K 1/26 - Compensating for effects of pressure changes
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
15.
PRESSURE SENSOR RESISTOR CONFIGURATION FOR STRESS COMPENSATION
A semiconductor pressure sensor comprising a membrane, delineated by an edge, and a group of neighboring piezo resistors: a first pair of piezo resistors near the edge of the membrane (a first piezo resistor RTmemb, a second piezo resistor RLmemb); a second pair of piezo resistors (a third piezo resistor RTref, a fourth piezo resistor RLref) at a position where applied pressure causes reduced surface stress compared to surface stress at the position of the first and the second piezo resistor. A signal from the first piezo resistor and a signal from the second piezo resistor, corrected with a signal from the third piezo resistor and a signal from the fourth piezo resistor, are used as a measure of a pressure on the membrane.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices
G01L 9/08 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices
G01L 27/00 - Testing or calibrating of apparatus for measuring fluid pressure
A sensor device for measuring a physical parameter. The sensor device comprises at least three sensing elements. Each sensing element comprises a first node and a second node. The first nodes of all sensing elements are connected together, and the second nodes are accessible to a readout circuit for measuring differential signals between the second nodes. At least three of the sensing elements have a different sensitivity to the physical parameter.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
A sensor package comprises an active element with a first region and an opposite second region. The first region includes a sensing structure. The second region comprises at least one contact pad. A moulding compound encapsulates the second region and not the first region. The active element comprises at least one conductive line for routing signals from the sensing structure to the contact pad. The projection of the conductive line over the active element corresponds to a portion of the external surface of the active element. The active element comprises at least one dummy track providing a protrusion thereby raising a portion of the surface of the active element to at least the same height as the portion corresponding to the conductive line. These protrusions can receive mechanical pressure from a moulding insert applied during manufacture, relieving pressure over the portion of the surface including the conductive lines.
A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.
A method for autoconfiguration of a plurality of nodes in a linear network allows extracting the address and position of each node. The method includes applying an identifier field for transmitting to the bus the bit sequence of the identifier of a chosen node. Then for at least for the first node to the last but one node, a field comprising a predetermined bit sequence is applied. The field comprises dominant bits, so a current is transmitted. Then, a further field is applied for transmitting any stored direction bit associated to that node and obtained in any previous iteration. The iteration continues by choosing a node different from a node chosen in any previous cycle, starting the communication, until all nodes are identified.
A method for autoconfiguration of a plurality of nodes in a linear network allows extracting the address and position of each node. The nodes are identified by a unique identifier. The method comprises choosing a node in a network and extracting its identifier, and for the first node to the last but one node, transmitting a current in the network from the chosen node, and reading the direction of the current flowing through at least the nodes not chosen in previous iteration cycles. The identifier is linked with the direction of the current for said not chosen nodes, obtaining the position of said not chosen nodes relative to the chosen node. These steps are repeated by choosing a different node not chosen before. Autoconfiguration is finished when the identifier of each node is extracted, and the physical position of each node is determined.
H04L 67/12 - Protocols specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
A unit trench capacitor in a substrate includes one or more trenches in the substrate, a dielectric layer, a first electrode and a second electrode. Walls of the one or more trenches are covered by the dielectric layer which separates the first electrode from the second electrode. Each trench follows a closed curve. The closed curve of each trench has one or more elongated parts in directions in which the substrate has a maximum elastic modulus, or the closed curve of each trench has a circular shape if the substrate has an isotropic elastic modulus.
A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.
A method of operating a plurality of driving units for powering electronic units is described. The method includes interchanging a data frame including a bit sequence, between a master control unit and at least one of a plurality of driving units at slave nodes. The method includes applying an ID field for addressing at least one driving unit, and applying a data field comprising information and/or instructions regarding the status of the electronic units. Applying the ID field comprises indicating the driving unit address using a first bit sub-string comprising N bits, allowing the master control unit to identify whether data should be received or transmitted, performing a data length decoding step, and adding a further bit string to the data field including information for carrying out an action by the driving unit.
In a heating appliance comprising a substrate for receiving an item of cookware, a method of measuring reflectivity comprises emitting a time-varying electromagnetic signal from a first side of the substrate, a portion of the time-varying electromagnetic signal propagating through the substrate. Electromagnetic radiation is then received at the first side of the substrate, the received electromagnetic radiation comprising a background ambient component received and a component reflected by the substrate. A gain factor is applied to translate the received electromagnetic radiation to a receive electrical signal. An offset signal component is then identified from the receive electrical signal, the offset signal component arising from the background ambient component of the received electromagnetic radiation. The gain factor from the offset signal component is then estimated using a characterisation of the offset signal component, and the reflectivity is calculated using the receive electrical signal and the estimated gain factor.
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
12 - Land, air and water vehicles; parts of land vehicles
Goods & Services
Industrial robots [parts of]; machine tools [parts of];
boring tools [machine tools], grippers being parts of
machines; electric screw drivers. Electronic integrated circuit devices; magnetic sensors for
use in industrial applications; hall effect magnetic sensors
for use in industrial applications; magnetic sensors for use
in consumer applications; magnetic (hall effect) sensors for
use in consumer applications; force pressure sensor and
pressure sensors for industrial or consumer applications;
robotic electrical control apparatus and components. Surgical robots; medical apparatus, devices and instruments
[parts of]; surgical implants composed of artificial
materials [parts of]. Couplings and transmission components for land vehicles
(including electrical bike), motors and engines for land
vehicles, electric vehicles.
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
12 - Land, air and water vehicles; parts of land vehicles
Goods & Services
Industrial robots [parts of]; machine tools [parts of];
boring tools [machine tools], grippers being parts of
machines; electric screw drivers. Electronic integrated circuit devices; magnetic sensors for
use in industrial applications; hall effect magnetic sensors
for use in industrial applications; magnetic sensors for use
in consumer applications; magnetic (hall effect) sensors for
use in consumer applications; force pressure sensor and
pressure sensors for industrial or consumer applications;
robotic electrical control apparatus and components. Surgical robots; medical apparatus, devices and instruments
[parts of]; surgical implants composed of artificial
materials [parts of]. Couplings and transmission components for land vehicles
(including electrical bike), motors and engines for land
vehicles, electric vehicles.
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
12 - Land, air and water vehicles; parts of land vehicles
Goods & Services
Parts of industrial robots, namely, force and tactile sensors; Parts of machine tools, namely, force and tactile sensors; Boring tools being machine tools; Grippers being parts of machines in the nature of robotic grippers featuring force and tactile sensors; Electric screwdrivers Electronic integrated circuit devices, namely, a force and tactile sensor; Magnetic sensors for use in industrial applications; Hall effect magnetic sensors for use in industrial applications; Magnetic sensors for use in consumer applications; Hall effect magnetic sensors for use in consumer applications; Force pressure sensor and pressure sensors for industrial or consumer applications, namely, a force and tactile sensor; Parts of user-programmable humanoid robots, not configured, with artificial intelligence to enable manipulation of objects with human levels of dexterity using force and tactile sensors, namely, robotic arms, robotic hands, and robotic fingers Surgical robots; Parts of medical apparatus, devices and instruments, namely, force and tactile sensors; Parts of surgical implants comprised of artificial materials and devices, namely, force and tactile sensors Couplings and transmission components for land vehicles, including electrical bikes; Motors and engines for land vehicles and electric vehicles
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
12 - Land, air and water vehicles; parts of land vehicles
Goods & Services
Parts of industrial robots, namely, force and tactile sensors; Parts of machine tools, namely, force and tactile sensors; Boring tools being machine tools; Grippers being parts of machines in the nature of robotic grippers featuring force and tactile sensors; Electric screwdrivers Electronic integrated circuit devices, namely, a force and tactile sensor; Magnetic sensors for use in industrial applications; Hall effect magnetic sensors for use in industrial applications; Magnetic sensors for use in consumer applications; Hall effect magnetic sensors for use in consumer applications; Force pressure sensor and pressure sensors for industrial or consumer applications, namely, a force and tactile sensor; Parts of user-programmable humanoid robots, not configured, with artificial intelligence to enable manipulation of objects with human levels of dexterity using force and tactile sensors, namely, robotic arms, robotic hands, and robotic fingers Surgical robots; Parts of medical apparatus, devices and instruments, namely, force and tactile sensors; Parts of surgical implants comprised of artificial materials and devices, namely, force and tactile sensors Couplings and transmission components for land vehicles, including electrical bikes; Motors and engines for land vehicles and electric vehicles
29.
Method of manufacturing a sensor device and moulding support structure
A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
A safety related light system includes: one light source, a first control circuit, and a second control circuit. One of the first control circuit or the second control circuit is selectively enabled to operate in a drive mode to operate the one light source.
H05B 45/50 - Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDsCircuit arrangements for operating light-emitting diodes [LED] responsive to LED lifeProtective circuits
H05B 47/17 - Operational modes, e.g. switching from manual to automatic mode or prohibiting specific operations
H05B 47/18 - Controlling the light source by remote control via data-bus transmission
31.
METHOD OF GENERATING A DE-INTERLACING FILTER AND IMAGE PROCESSING APPARATUS
A method of generating a de-interlacing filter comprises: analysing a pixel array comprising an interlacing pattern of pixels. The interlacing pattern of pixels comprises first and second pluralities of pixels configured to be read during a first measurement subframe and a second measurement subframe, respectively. An n-state representation of the interlacing pattern of pixels is generated and distinguishes between the first plurality of pixels and the second plurality of pixels. The n-state representation of the interlacing pattern is translated to a spatial frequency domain, thereby generating a spatial frequency domain representation of the n-state representation of the interlacing pattern. A DC signal component is then removed from the spatial frequency domain representation of the n-state representation of the interlacing pattern, thereby generating a DC-less spatial frequency domain representation. A kernel filter is then selected and configured to blur before convolving the DC-less spatial frequency representation with the selected kernel filter.
A method for creating an electrical contact between semiconductor layers which are separated by an isolating connection layer. The method comprising: providing a layered stack comprising at least a first semiconductor layer, an isolating connection layer, and a second semiconductor layer, wherein the isolating connection layer is between first semiconductor layer and the second semiconductor layer; laser grooving at least one laser groove in the stack through the first semiconductor layer and the isolating connection layer and partly in the second semiconductor layer, leaving a remainder of the second semiconductor layer; cutting the remainder of the second semiconductor layer.
An evaluation and control unit (100) for a broadband lambda probe (200) and a method for operating the same are disclosed. The evaluation and control unit (100) comprises pins (RE, IPE, APE, MES) connectable to electrical wires (201, 202, 203, 204) of electrochemical cells (210, 211) of the broadband lambda probe (200), a controller (103), a ASIC reference potential source (102), wherein the ASIC reference potential source (102) is operable by means of the controller (103), a switch assembly (104) connected to each of the pins (RE, I PE, APE, MES), wherein the switch assembly (104) comprises a first transistor (TWire) and a second transistor (TECU), wherein the switch reference potential source (105) is connected to a gate side of the first and second transistors (TWire, TECU), wherein the controller (103) is configured to vary the switch reference potential (VSW) applied to the gate side of the first and second transistors (TWire, TECU), wherein the switch assembly (104) is configured to allow a limiting current flowing to the drain side of the first transistor (TWire) from the ASIC reference potential if the potential at the gate side of the first and second transistors (TWire, TECU) is at a predetermined voltage between values of an open and closed switch.
A magnetic sensor device comprises a substrate. A first magnetic sensor, a second magnetic sensor, and one or more inductors are disposed over the substrate and are controlled by a magnetic sensor controller having a control circuit. The control circuit is adapted for controlling the first magnetic sensor to measure magnetic fields under presence of a first set of magnetic fields, and for controlling the second magnetic sensor to measure magnetic fields under presence of a second set of magnetic fields generated by the inductors. The control circuit calculates a relative sensitivity matching value that converts magnetic field values measured by the second magnetic sensor to a comparable magnetic field value measured by the first magnetic sensor or vice versa. The control circuit is further adapted for correcting a measurement by the second magnetic sensor using the relative sensitivity matching value to produce a corrected measurement, and for calculating a magnetic field gradient by combining a measurement by the first magnetic sensor with the corrected measurement.
A method of digitally processing a plurality of pixels of an image captured using an array of sensing pixels of an optical sensor device. The method comprises identifying a measurement pixel of the plurality of pixels corresponding to a measurement point on a target to be measured. The method then comprises identifying a number of pixels of the plurality of pixels neighbouring the measurement pixel, the number of pixels having a number of intensity values, respectively. A curve is then fitted to the number of pixels and the number of respective intensity values. An estimated intensity value is then determined from the curve in respect of the measurement pixel, thereby simulating a predetermined field of view in respect of the measurement pixel narrower than an actual field of view of the measurement pixel.
A lighting system includes a plurality of nodes arranged in a serial network. The lighting system has a master node, one or more gateway nodes, a first communication bus connecting the one or more gateway nodes to the master node, a plurality of slave nodes such that each slave node is connected to a lighting source and is arranged for conveying data messages, and one or more second communication buses, each connecting one of the gateway nodes with one or more slave nodes of the plurality. The master node is arranged for conveying a unique network address to the one or more gateway nodes via the first communication bus, and the one or more gateway nodes are arranged for conveying a unique network address to the plurality of slave nodes via one of the second communication buses. At least one gateway node is arranged for storing a lighting plan for lighting one or more slave nodes connected to that gateway node.
H04L 67/12 - Protocols specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
Goods & Services
Industrial robots [parts of]; machine tools [parts of];
boring tools [machine tools], grippers being parts of
machines; electric screwdrivers. Electronic integrated circuit devices; magnetic sensors for
use in industrial applications; hall effect magnetic sensors
for use in industrial applications; magnetic sensors for use
in consumer applications; magnetic (hall effect) sensors for
use in consumer applications; force pressure sensor and
pressure sensors for industrial or consumer applications;
humanoid robots with ai [parts of]. Surgical robots; medical apparatus, devices and instruments
[parts of]; surgical implants comprised of artificial
materials [parts of].
38.
Arrangement, method and sensor for measuring an absolute angular position using a multi-pole magnet
A system for measuring an angular position of a rotor with respect to a stator, wherein the rotor is rotatable around a rotation axis, and the system includes: a magnetic source mounted on the rotor, having at least four magnet poles and providing a periodically repetitive magnetic field pattern with respect to the rotation axis; a sensor mounted on the stator and comprising a plurality of sensor elements for measuring at least one magnetic field component of the magnetic field and for providing a measurement signal thereof; the sensor being located substantially centered around the rotation axis, in a plane substantially perpendicular to the rotation axis at a first distance from the magnetic source; the sensor elements being located substantially on a circle at a second distance from the rotation axis; a calculator that determines the angular position by calculating it from the measurement signals.
G01R 33/36 - Electrical details, e.g. matching or coupling of the coil to the receiver
G01D 5/14 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
G01D 5/244 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trainsMechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means generating pulses or pulse trains
39.
Sensor interfaces for functional safety applications
A sensor interface circuit includes at least two sensor inputs and at least two front-end circuits to obtain sensor signal acquisitions from the at least two sensor inputs; a test circuit configured to test correct functionality of at least part of one of the front end circuits by applying a test input to the front end circuit under test, by reading a test output of the front end circuit, and by comparing the test output with an expected result thus obtaining at least one test result. The test input is applied intermittently between sensor signal acquisitions; a processing device is configured to compare the sensor signal acquisitions from the different sensor inputs and combine the comparison with the at least one test result to evaluate correct functionality of the sensor interface circuit.
A method of digitally processing an image comprises: generating an intensity distribution model (170) in respect of at least a portion of the array of sensing pixels (102) of a detector device (100). The array of sensing pixels comprises clusters of pixels. A pixel (140) from the array of sensing pixels is then selected (202) and a first distance and a second distance from the selected pixel to a first neighbouring pixel (142) and a second neighbouring pixel (144), respectively, are determined (402) and the intensity distribution model (170) referenced (406) by the first distance is used to calculate a first weight and a second weight to apply to the first and second neighbouring pixels, respectively. The first distance comprises an intra-cluster distance and the second distance comprises an inter-cluster distance, the intra-cluster distance being different from the inter-cluster distance. The first weight is applied (214) to the first neighbouring pixel (142) and the second weight is applied (214) to the second neighbouring pixel (144).
H04N 23/80 - Camera processing pipelinesComponents thereof
H04N 25/44 - Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
Goods & Services
Parts of industrial robots, namely, force and tactile sensors; parts of machine tools, namely, force and tactile sensors; boring tools being machine tools; grippers being parts of machines in the nature of robotic grippers featuring force and tactile sensors; electric screwdrivers Electronic integrated circuit devices, namely, a force and tactile sensor; magnetic sensors for use in industrial applications; Hall effect magnetic sensors for use in industrial applications; magnetic sensors for use in consumer applications; Hall effect magnetic sensors for use in consumer applications; Force pressure sensor and pressure sensors for industrial or consumer applications, namely, a force and tactile sensor; Parts of humanoid robots with artificial intelligence to enable manipulation of objects with human levels of dexterity using force and tactile sensors, namely, robotic arms, robotic hands, and robotic fingers Surgical robots; Parts of medical apparatus, devices and instruments, namely, force and tactile sensors; Parts of surgical implants comprised of artificial materials and devices, namely, force and tactile sensors
42.
Thermal imaging apparatus and method of thermal imaging
A thermal imaging apparatus comprising: a thermal detector device (100) comprising an array of thermal sensing pixels (102) and signal processing circuitry (104) coupled to the detector device (100). The circuitry (104) supports a background identifier (110) and a pixel classifier (112), the background identifier (110) comprising a common intensity identifier (114) and an expected background intensity calculator (116). The background identifier (110) receives pixel measurement data captured by the detector device (100) in respect of pixels of the array (102) and the common intensity identifier (114) identifies a largest number of substantially the same pixel intensity values from the pixel measurement data. The expected background intensity calculator (116) uses the largest number of substantially the same pixel intensity values to generate a model of expected background intensity levels. The pixel classifier (112) uses the model to determine whether an intensity measurement by a pixel (118) of the array (102) corresponds to a background or an object in an image.
H04N 25/46 - Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
H04N 25/702 - SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry
A sensor system for measuring a physical quantity includes: a bridge sensor having at least two terminal pairs, a current source for applying a bias current between the bias terminal pair, resulting in a differential sensor signal on a readout terminal pair, wherein the differential sensor signal is indicative for the physical quantity, and an amplifier comprising a first input node and a second input node for receiving the differential signal and at least one output node, wherein the amplifier is configured for amplifying the differential sensor signal and putting the resulting signal on the at least one output node, wherein the sensor system is configured such that, in operation, the amplifier is powered by at least part of the bias current.
G01D 5/16 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
G01R 15/20 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices
A controller configured for detecting a disturbance using a comparison of outputs of at least two sensors and for determining a pressure from the outputs of the at least two sensors. A ratio of the measurement sensitivity and the disturbance sensitivity should be different for the at least two sensors. A method for monitoring disturbances of a sensor assembly includes comparing the outputs of the at least two sensors. The controller and related method provide, while requiring only two sensors, a redundant system that is also able to detect excessive disturbances on a sensor assembly.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
A transmitter device is provided for transmission of data via DC power distribution lines includes a sequence generator arranged for receiving a raw data bit stream to be transmitted over a positive and a negative DC power distribution line and for deriving a switching sequence based on the raw data bit stream, and a circuit including one or more capacitors and a plurality of switches controllable with the switching sequence derived in the sequence generator.
09 - Scientific and electric apparatus and instruments
Goods & Services
Engine components incorporating magnetic sensors, engine components incorporating Hall effect magnetic sensors, namely, pressure sensors measuring pressure in air-intake management system, air-exhaust management system, thermal management system and transmission system; direct current electric motors; brushless direct current electric motors Electrical integrated circuit devices, namely, pressure sensors; magnetic sensors for use in automotive or industrial applications; Hall effect magnetic sensors for use in automotive or industrial applications; electronic controllers for electric motors, direct current electric motors or brushless direct current electric motors, namely, power driver modules or inverter modules; microprocessor based controllers for electric motors, direct current electric motors or brushless direct current electric motors; microcontrollers and microprocessors; single chip microcontrollers and microprocessors; computer firmware recorded on read-only Memory or flash memory devices in the nature of pressure sensors for use with microcontrollers and microprocessors for measurement of gas and liquid media; computer firmware recorded on read-only memory or flash memory devices in the nature of pressure sensors for use with single chip microcontrollers and microprocessors for measurement of gas and liquid media; computer software recorded on read-only memory or flash memory devices in the nature of pressure sensors for use with microcontrollers and microprocessors for measurement of gas and liquid media; computer software recorded on read-only memory or flash memory devices in the nature of pressure sensors for use with single chip microcontrollers and microprocessors for measurement of gas and liquid media
09 - Scientific and electric apparatus and instruments
Goods & Services
Engine components incorporating magnetic sensors; engine components incorporating hall effect magnetic sensors; electric motors; direct current electric motors, brushless direct current electric motors. Electrical integrated circuit devices; magnetic sensors for use in automotive or industrial applications; hall effect magnetic sensors for use in automotive or industrial applications; controllers for electric motors, direct current electric motors or brushless direct current electric motors; microprocessor based controllers for electric motors, direct current electric motors or brushless direct current electric motors; microcontrollers and microprocessors; single chip microcontrollers and microprocessors; firmware for use with microcontrollers and microprocessors; firmware for use with single chip microcontrollers and microprocessors; software for use with microcontrollers and microprocessors; software for use with single chip microcontrollers and microprocessors.
48.
DISTORTION DETERMINATION APPARATUS AND METHOD OF DETERMINING A DISTORTION
A motion or saturation determination apparatus (100) comprising: a light source configured to emit light and an optoelectronic device (102) configured to receive an electromagnetic signal and to translate the signal to a plurality of electrical output signals corresponding to a plurality of predetermined phase offset values in accordance with an indirect time of flight measurement technique. A signal processing circuit (110, 116, 126, 132, 136) of the apparatus (100) is configured to process the electrical output signals to calculate a plurality of measurement vectors derived from the plurality of electrical signals. The vectors are in respect of a plurality of frequencies and comprise a first measurement vector for a fundamental harmonic frequency and a second measurement vector for a non-fundamental frequency. The circuit (110, 116, 126, 132, 136) is configured to calculate a scalar relating a first amplitude of the first vector to a second amplitude of the second vector, and to use the scalar to identify motion or saturation in respect of the optoelectronic device (102).
A method for communicating between a master and a plurality of slaves includes generating a communication frame including generating a slave data frame in each slave. The slave data frame has a data packet including one or more data bytes and at least one gap of variable time length comprising no information in the slave data frame. The gap may be at the beginning of said slave data frame before the beginning of the first data byte of said data packet and/or at the end of said data packet after the end of a last data byte of said data packet, where the gaps have a time length dependency based on parameters locally stored in each of said at least one slave. The slave data frame is transmitted sequentially where the gap increases for each subsequent slave.
An oscillator-based sensor interface circuit includes first and second input nodes arranged to receive first and second electrical signals representative of an electrical quantity, respectively; an analog filter; a first oscillator arranged to receive a first oscillator input signal and a second oscillator different from the first oscillator and arranged to receive a second oscillator input signal; a comparator arranged to compare signals coming from the first and second oscillators; a first feedback element arranged to receive a representation of the digital comparator output signal and to convert the representation into a first feedback signal to be applied to the oscillation means; a digital filter arranged to yield an output signal, being an filtered version of the digital comparator output signal; a second feedback element arranged to receive the output signal and to convert the output signal into a second feedback signal.
H03L 7/099 - Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
G01R 19/252 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with conversion of voltage or current into frequency and measuring of this frequency
G01D 21/00 - Measuring or testing not otherwise provided for
H03M 1/60 - Analogue/digital converters with intermediate conversion to frequency of pulses
G01D 3/036 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
G01D 11/00 - Component parts of measuring arrangements not specially adapted for a specific variable
H03M 1/06 - Continuously compensating for, or preventing, undesired influence of physical parameters
G01D 18/00 - Testing or calibrating apparatus or arrangements provided for in groups
G01D 3/00 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group
G01D 5/16 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
51.
Method of optical detection and optical detection apparatus
In a method of optical detection, a carrier signal of a carrier signal period and a code sequence over an exposure time period are generated. Each code (406) of the sequence comprises a plurality of symbols (408, 410, 412, 414, 416) with a timing delay (418, 420, 422, 424) in between. The carrier signal is phase shifted in response to the code sequence (406) depending upon a value of a symbol (408, 410, 412, 414, 416). The modulated carrier signal is applied to a light source, thereby modulating the light which is emitted. An electrical sensor signal is generated in response to received reflected light. A plurality of predetermined phase offset values is applied to the modulated carrier signal, and a plurality of electrical output signals is generated and stored by applying said resulting signal to the electrical sensor signal in accordance with the indirect time of flight measurement technique over the exposure time period. Each symbol (408, 410, 412, 414, 416) has a duration greater than the carrier signal period.
G01S 7/4865 - Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
G01S 17/26 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves wherein the transmitted pulses use a frequency-modulated or phase-modulated carrier wave, e.g. for pulse compression of received signals
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
A photonic mixer device for multiplying an impinging optical signal with a reference electrical signal includes: a semiconductor substrate of a first conductivity type; two detector regions of a second conductivity type different from the first conductivity type; two biasing regions of the first conductivity type with a higher dopant concentration than the dopant concentration of the semiconductor substrate, each biasing region positioned near one of the respective detector regions, wherein an electrical field can be formed in the semiconductor substrate by applying a voltage bias between the biasing regions; two bias electrodes, which are isolated from the substrate and the biasing regions, wherein each bias electrode is only locally, partially or completely, covering an outer edge of one of the respective biasing regions.
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
G01S 7/4865 - Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
G01S 17/06 - Systems determining position data of a target
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element comprises a sensor substrate and a magnetic sensor. The magnetic sensing element is mounted on the electronic circuit and contact pads are provided on the magnetic sensor. The contact pads of the magnetic sensing element are electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material, and the contact pads are disposed next to an edge or at a corner of the sensor substrate.
A method for diagnosing an optical sensor includes a photodetector and an integrator. The method comprises exposing the photodetector to incoming light; obtaining an initial integrated signal at an initial frame; at least once executing the steps of changing at least one control parameter of the optical sensor, exposing the photodetector to incoming light, and obtaining one or more subsequent integrated signals at a subsequent frame; obtaining a characteristic of the optical sensor from the obtained integrated signals; comparing the obtained characteristic with a pre-determined characteristic of the optical sensor to diagnose the optical sensor.
A depth mapping system includes a time of flight ranging system including structured and unstructured light sources, an optical sensor unit and a signal processing unit. The system time employs first and second time of flight ranging technique in respect of the optical sensor unit. The first and second time of flight techniques measure respective first and second distance ranges over a first and a second respective field of view. Measurement of the first and second distance ranges are respectively at a first angular resolution and a second angular resolution greater than the first angular resolution. The structured and unstructured light sources respectively operate in respect of the first and second time of flight techniques. First and second regions of the optical sensor unit respectively have the first and second fields of view associated therewith, and the structured source has a greater emission radiant intensity than the unstructured source.
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
G01S 17/18 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves wherein range gates are used
58.
Method for multipath error compensation and multipath error-compensated indirect time of flight range calculation apparatus
A method for multipath error compensation comprises an unstructured light source (142) illuminating a scene during a plurality of consecutive time frames. A structured light source (144) illuminates the scene concurrently, the illumination by the structured source (144) occurring during predetermined frames of the plurality of consecutive time frames. An array of photodetectors (102) each generate a set of signals in response to irradiation with light reflected from the scene according to an indirect time of flight calculation technique to yield a plurality of sets of signals. An error estimate is derived (130) from the plurality of sets of signals generated during a selected time frame of the plurality of consecutive time frames when structured illumination takes place and another time frame temporally about the selected time frame when both structured and unstructured illumination takes place. The error estimate is applied in a range calculation with respect to the scene.
G01S 17/32 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
G01S 17/931 - Lidar systems, specially adapted for specific applications for anti-collision purposes of land vehicles
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
G06V 20/56 - Context or environment of the image exterior to a vehicle by using sensors mounted on the vehicle
59.
Phase angle correction value calculation apparatus and method of calculating a phase angle correction value
A phase angle error calculation apparatus (100) comprising a light source (102) that emits light according to an indirect time of flight (iToF) measurement technique. A photonic mixer cell (104) generates and stores a plurality of electrical output signals corresponding to a plurality of predetermined phase offset values. A signal processing circuit processes the electrical output signals according to the iToF measurement technique in order to calculate a reference vector and a reference phase angle therefrom. The output signals correspond to measurement at a first level of precision. The circuit processes a subset of output signals according to the iToF measurement technique and calculates a measurement vector and a measurement phase angle therefrom. The subset of the output signals corresponds to measurement at a second level of precision lower than the first level of precision. The circuit calculates a phase angle correction value using the reference phase angle and the measurement phase angle.
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
G01S 7/48 - Details of systems according to groups , , of systems according to group
G01S 7/4865 - Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/46 - Indirect determination of position data
G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
60.
Optical range calculation apparatus and method of range calculation
An optical range calculation apparatus (100) comprises a light source configured to emit light in accordance with an indirect time of flight measurement technique. A photonic mixer cell (102) is configured to generate and store a plurality of electrical output signals respectively corresponding to a plurality of predetermined phase offset values applied (112) in accordance with the indirect time of flight measurement technique. A signal processing circuit (110, 124) is configured to process the plurality of electrical output signals in accordance with the indirect time of flight measurement technique in order to calculate a measurement vector and a measured phase angle from the measurement vector. The signal processing circuit (110, 124) is configured to calculate a phase angle correction value using reference illumination data and to apply the calculated phase angle correction value in order to correct the measured phase angle, and the signal processing circuit is configured to calculate a range using the corrected measured phase angle.
G01S 7/4865 - Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
G01S 7/48 - Details of systems according to groups , , of systems according to group
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/46 - Indirect determination of position data
G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
A piezo-resistor sensor includes a diffusion of a first conductivity type in a well of an opposite second type, contacts with islands in the diffusion, interconnects with the contacts, and a shield covers the diffusion between the contacts and extends over side walls of the diffusion between the contacts. Each interconnect covers the diffusion at the corresponding contact and extends over edges of the diffusion, and each island is at a side covered by its interconnect. A guard ring of the second type is around the diffusion. The shield covers the well between the diffusion and the ring and the edge of the ring facing the diffusion. If a gap between the shield and the interconnect is present, the ring bridges this gap, and/or the edges of the diffusion are completely covered by the combination of the shield and the interconnects.
H01L 41/113 - Piezo-electric or electrostrictive elements with mechanical input and electrical output
G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
A gas sensor device (100) is configured to measure a predetermined gas of interest and comprises an enclosure (101) comprising a semiconductor substrate (102) and defining a first cavity (124), an optically transmissive second closed cavity (126) and a third cavity (128). The second cavity (126) is interposed between the first and third cavities (124, 128). The first cavity (124) comprises an inlet port (130) for receiving a gas under test, an outlet port (132) for venting the gas under test. The first cavity (124) also comprises an optical source (112) and a measurement sensor (114). The second cavity (126) is configured as a gaseous filter comprising a volume of the gas of interest sealingly disposed in the second cavity (126), and the third cavity (128) comprises a reference measurement sensor (116) disposed therein.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
G01N 21/31 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
G01N 21/01 - Arrangements or apparatus for facilitating the optical investigation
63.
Indirect time of flight range calculation apparatus and method of calculating a phase angle in accordance with an indirect time of flight range calculation technique
An indirect time of flight range calculation apparatus comprises a light source, a photonic mixer that generates a plurality of output signals corresponding to a first plurality of phase values. A signal processor is also provided to calculate a first vector and a first angle from the first vector. The photonic mixer generates a second plurality of electrical output signals corresponding to a second plurality of phase values. Each phase value of the second plurality of phase values is respectively offset with respect to each phase value of the first plurality of phase values by a predetermined phase offset value. The signal processor processes the second plurality of electrical output signals in order to calculate a second vector, and de-rotates the second vector calculated and calculates a second angle from the de-rotated vector before offsetting the second angle against the first angle, thereby generating a corrected output angle.
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 7/4915 - Time delay measurement, e.g. operational details for pixel componentsPhase measurement
G01S 17/46 - Indirect determination of position data
64.
Arrangement, method and sensor for measuring an absolute angular position using a multi-pole magnet
A system for measuring an angular position of a rotor with respect to a stator, wherein the rotor is rotatable around a rotation axis, the system comprising: a magnetic source mounted on the rotor, having at least four magnet poles and providing a periodically repetitive magnetic field pattern with respect to the rotation axis; a sensor mounted on the stator and comprising a plurality of sensor elements for measuring at least one magnetic field component of the magnetic field and for providing a measurement signal thereof; the sensor being located substantially centered around the rotation axis, in a plane substantially perpendicular to the rotation axis at a first distance from the magnetic source; the sensor elements being located substantially on a circle at a second distance from the rotation axis; a calculator that determines the angular position by calculating it from the measurement signals.
G01R 33/06 - Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
G01D 5/14 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
G01D 5/244 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trainsMechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means generating pulses or pulse trains
A memory device includes a non-volatile memory block, a protection unit arranged for connecting to a communication bus, and a sequencer arranged to receive commands from the protection unit. A logic circuit is arranged to output an enabling signal, and includes first and second logic subcircuits, and a combiner logic circuit.
T) of a series of values limited to the ambient temperature value to solve the system of equations in respect of the measurement value for the object, thereby determining (208) a temperature (To) for the object from the measurement value.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/10 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
G01J 5/16 - Arrangements with respect to the cold junctionCompensating influence of ambient temperature or other variables
G01J 5/53 - Reference sources, e.g. standard lampsBlack bodies
G01J 5/068 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity by controlling parameters other than temperature
A lead angle estimator is provided for estimating a lead angle of a brushless DC motor. The lead angle is the angle between a phase-voltage-vector of a phase-voltage, and a phase-current-vector of a phase-current. The lead angle estimator comprises a sampling unit and a processing unit. The sampling unit is adapted for obtaining phase-samples, which are a measure of the phase-current. The processing unit is adapted for estimating the lead angle by calculating a difference of the phase-samples in a extremum period around a maximum or around at least the phase-voltage, and by normalizing the obtained difference.
A method of generating a time domain echo waveform comprises: a triggered source of pulsed electromagnetic radiation (108) emitting (202) a plurality of electromagnetic radiation pulses (132). A plurality of reflected pulses (134) irradiates an electromagnetic radiation detector cell (116), the detector (116) generating a plurality of stored electrical measurements in response thereto. The method also comprises generating a time-varying mixing signal and respectively applying (204, 206) phase-shifted variations thereof to the detector (116) while generating the plurality of electrical measurements. A signal pre-processor (126) reads out (210) the plurality of electrical measurements from the detector (116). A signal reconstruction unit (128) and then generates (300, 302, 500, 502) a spectrum (404, 604) in respect of the electrical measurements and a spectrum (406, 606) of the mixing signal. The signal reconstruction unit (126) generates a reconstruction signal spectrum (408) by deconvolving (304, 504) the spectrum (404, 604) of the stored electrical measurements using the spectrum (406, 606) of the mixing signal and then generates the echo waveform by converting (306, 506) the reconstruction signal spectrum (408) to the time domain.
A pixel circuit wherein a pixel arrangement comprises a pixel comprising a photodetector, an integrator for accumulating a signal from the photodetector, a source following output transistor for amplifying the integrated signal, and a current source for applying a readout current through the output transistor, a voltage regulating circuit comprising an amplifier, a replica transistor dimensioned substantially the same as the output transistor, and a replica current source for providing substantially the readout current through each replica transistor, a gate of the replica transistor is connected with an output node of the amplifier connected with the pixel arrangement, and a source of the replica transistor is connected with a negative input of the amplifier, and with the replica current source, a predefined reference voltage is applicable to a positive input.
A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
A sensor interface circuit comprises an input arranged to receive a sensor signal being an electrical signal representative of an electrical quantity. The electrical quantity includes a physical quantity converted in a sensor. The sensor interface circuit includes conversion means arranged for converting the sensor signal into a digital signal, memory to store sensor characterisation data, signal processing means adapted to obtain a first sensor result by processing the digital signal using the sensor characterisation data, and an output unit arranged to receive and output the first sensor result, the digital signal and the sensor characterisation data.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 19/252 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with conversion of voltage or current into frequency and measuring of this frequency
G01D 3/02 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group with provision for altering or correcting the transfer function
G01D 3/036 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
G01D 18/00 - Testing or calibrating apparatus or arrangements provided for in groups
An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 kΩ, adapted for reducing self-resonance.
A method and a circuit for measuring an absolute voltage signal, such that the circuit comprises: an A/D convertor, and a controller adapted for: a) obtaining a first digital reference value for a first reference signal having a positive temperature coefficient; b) obtaining a second digital reference value for a second reference signal having a negative temperature coefficient; c) obtaining a raw digital signal value for the signal to be measured, while applying a same reference voltage for step a) to c); and d) calculating the absolute voltage value in the digital domain using a mathematical function of the first and second digital reference value, and the raw digital signal value.
A semiconductor device includes an electronic circuit, an interconnection contact such as a solder ball, and a plate configured to concentrate magnetic flux to a predetermined area. The plate is electrically conductive, and it is electrically connected to the electronic circuit.
H01L 43/04 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof - Details of Hall-effect devices
G01R 33/24 - Arrangements or instruments for measuring magnetic variables involving magnetic resonance for measuring direction or magnitude of magnetic fields or magnetic flux
A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
09 - Scientific and electric apparatus and instruments
Goods & Services
Engine components incorporating magnetic sensors; engine
components incorporating hall effect magnetic sensors;
electric motors; direct current electric motors, brushless
direct current electric motors. Electrical integrated circuit devices; magnetic sensors for
use in automotive or industrial applications; hall effect
magnetic sensors for use in automotive or industrial
applications; controllers for electric motors, direct
current electric motors or brushless direct current electric
motors; microprocessor based controllers for electric
motors, direct current electric motors or brushless direct
current electric motors; microcontrollers and
microprocessors; single chip microcontrollers and
microprocessors; firmware for use with microcontrollers and
microprocessors; firmware for use with single chip
microcontrollers and microprocessors; software for use with
microcontrollers and microprocessors; software for use with
single chip microcontrollers and microprocessors; optical
sensors, control and/or processing electronics or electronic
devices associated therewith; electronic optical sensors,
control and/or processing electronics or electronic devices
associated therewith.
The present invention relates to a half-bridge signal processing circuit comprising a first and a second branch. The first branch comprises a first stimulus responsive sense element and a first current source arranged to provide a current to the first sense element. The second branch comprises a second stimulus responsive sense element and a second current source arranged to provide a current to said second sense element. The first and the second branch have a terminal in common. The first branch comprises a first node between said the current source and the first stimulus responsive sense element configured to generate a first signal related to a voltage over the first sense element. The second branch comprises a second node between the second current source and the second stimulus responsive sense element configured to generate a second signal related to a voltage over the second sense element.
A piezo-resistor-based sensor, and a method to fabricate such sensor, comprise a sensor having at least a sensing element provided on a flexible structure, such as a membrane or cantilever or the like. The sensing element includes at least one piezo-resistor comprising at least a first region of the flexible structure doped with dopant atoms of a first type. The flexible structure furthermore comprises a second doped region within it, at least partially overlapping the first doped region, forming a shield for shielding the sensing element from external electrical field interference, wherein dopant atoms of the second doped region are of a second type opposite to the dopant atoms of the first doped region, for generating a charge depletion layer within the flexible structure at the overlapping region between the first doped region and the second doped region.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
H01L 21/22 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant
H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
The invention relates to sensors comprising a substrate, a platinum component having a first surface facing toward the substrate and a second surface facing away from the substrate, a protective covering over the platinum component, the protective covering comprising one or more layers, at least on of which is an oxygen getter material, a lower surface in physical contact with the second surface of the platinum component, and an upper surface; and a method for forming such a sensor. The protective covering with oxygen getter material protects the platinum component against oxygen dissolution therein, thereby reducing sensor drift.
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
C23C 14/16 - Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
A semiconductor device comprising a first and second doped semiconductor layer wherein the first layer is a monosilicon layer and the second layer is a polysilicon layer, an oxide layer covering the first and second layer, and an interconnect which electrically connects the first and second layer comprises a metal alloy which has a first part in contact with the first layer and a second part in contact with the second layer, wherein a part of the metal alloy between the first and the second part crosses over a sidewall of the second layer; at least one electronic component is formed in the first and/or second layer; the semiconductor device moreover comprises a stoichiometric passivation layer which covers the first and second layer and the oxide layer.
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
H01L 35/22 - Selection of the material for the legs of the junction using inorganic compositions comprising compounds containing boron, carbon, oxygen, or nitrogen
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
A semiconductor device comprises a first doped semiconductor layer, a second doped semiconductor layer, an oxide layer covering the first doped semiconductor layer and the second doped semiconductor layer, and an interconnect. The first doped semiconductor layer is electrically connected with the second doped semiconductor layer by means of the interconnect which crosses over a sidewall of the second doped semiconductor layer. The interconnect comprises a metal filled slit in the oxide layer. At least one electronic component is formed in the first and/or second semiconductor layer. The semiconductor device moreover comprises a passivation layer which covers the first and second doped semiconductor layers and the oxide layer.
H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 37/02 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using Nernst-Ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof using thermal change of dielectric constant, e.g. working above and below the Curie point
09 - Scientific and electric apparatus and instruments
Goods & Services
vehicle engine components incorporating electromagnetic sensors, namely, electronic throttle body and positioning actuators for valves; electric motors for machines; direct current electric motors for machines, brushless direct current electric motors for machines Electrical integrated circuit devices, namely, electronic integrated circuits; Electrical integrated circuit devices, namely, electronic integrated circuits for inductive position sensing; Electrical integrated circuit devices, namely, electronic integrated circuits for inductive position sensing with transmitting and receiving coils encapsulated in the same housing as the semiconductor chip; magnetic sensors for use in automotive or industrial applications; hall effect magnetic sensors for use in automotive or industrial applications; controllers for electric motors, direct current electric motors or brushless direct current electric motors; microprocessor based controllers for electric motors, direct current electric motors or brushless direct current electric motors; microcontrollers and microprocessors; single chip microcontrollers and microprocessors; recorded computer firmware for measuring positions using a position sensing algorithm for use with single chip microcontrollers and microprocessors
The present invention relates to a receiver circuit for processing an incoming bit stream from a bus system. The circuit comprises an analog interface for converting the analog signal to a digital input data stream. The interface comprises an analog filter and a switch to process the analog signal before generating the digital input data stream using the filter if, and only if, a selection criterion controlling the switch is met. The circuit comprises a frame decoding unit for decoding a data frame encoded in the digital input data stream in accordance with a CAN protocol, and a frame processing unit that comprises a flexible data rate detector and a recessive bit counter for counting consecutive recessive bits after detecting the flexible data rate frame. The selection criterion is satisfied when the flexible data rate frame is detected and unsatisfied when the recessive bit counter reaches a predetermined number.
A data transceiver device for bus communication includes: first and second semiconductor areas; a galvanic isolation means to galvanically isolate the first and second semiconductor areas; an input for receiving a signal to be transferred from the first semiconductor area to the second semiconductor area; a first capacitor in a first signal path and a second capacitor in a second signal path, each capacitor having a first plate connected to the first semiconductor area and a second plate connected to the second semiconductor area and each arranged for transferring a version of the received signal via the first and second signal paths, respectively; storage means having memory states controllable by the versions of the received signal and arranged to derive from the versions of the received signal the memory states. The storage means is arranged to obtain from the memory states an output signal in according to the received signal.
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
A device for position sensing comprises sensing means arranged for producing at least two sensor signals, and a signal construction unit. The signal construction unit comprises selection means for selecting in a serial way one of at least two time-synchronous signals, sampling means for sampling a selected time-synchronous signal at given sampling instants, storage means for storing sampled data representing the selected time-synchronous signal and timing information indicating which of the given sampling instants were used to obtain the sampled data, and processing means for determining at one of the given sampling instants a value for at least one of said time-synchronous signals that was not sampled at the one given sampling instant by performing an interpolation using data values of the at least one time synchronous signal stored in the storage means and obtained at another point in time than the one given sampling instant.
G01B 7/00 - Measuring arrangements characterised by the use of electric or magnetic techniques
G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
Goods & Services
Electric and electronic components, in particular for
illuminators, luminaires and lighting installations. Illuminators, luminaires and lighting installations;
lighting apparatus and lighting fittings, in particular in
the form of ambience light, exterior light or interior light
and in particular for automotive use, consumer use and
industrial use, including parts of the aforesaid goods;
lighting apparatus and lighting fittings, in particular in
the form of ambience light, exterior light or interior light
and in particular for automotive use, consumer use and
industrial use.
89.
Pulsed-light detection and ranging apparatus, system and method of detection and ranging of an object in a pulsed light detection and ranging system
A pulsed-light detection and ranging apparatus comprises an optical detector arranged to generate, when in use, time-series data in response to an optical pulse incident thereupon. A processing resource is also provided and arranged to support a pulse analyser (132). The pulse analyser (132) is arranged to identify (134) an inflection point of a pulse described by the time-series data. The pulse analyser (132) is further arranged to calculate (138) a distance based upon determined inflection point relative to a time axis associated with the time-series data.
G01S 17/00 - Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
G01S 17/26 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves wherein the transmitted pulses use a frequency-modulated or phase-modulated carrier wave, e.g. for pulse compression of received signals
G01S 17/42 - Simultaneous measurement of distance and other coordinates
G01S 7/4865 - Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
G01S 17/10 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
A system having a plurality of devices configured in a daisy chain network including a communication bus connecting the devices and adapted to exchange address-setting information. Each device includes an input pin adapted to receive via an input signal line different from the communication bus a signal comprising configuration information for configuring at least the device; a configuration handling unit adapted to detect a configuration mode and to configure the device according to the configuration information; an indicator adapted to indicate whether the configuration handling unit has finished configuring the device; an output pin adapted to forward the configuration information to the daisy chain network when the indicator indicates the configuration of the device is done; and a safety handling unit adapted to be operable in a safety handling mode when the indicator indicates the configuration of the device is done.
A method for detecting a failure in an electronic signal processing system having a signal processing path comprises a configurable functional unit for performing a given function and at least one redundant version of the signal processing path including a corresponding configurable functional unit for performing the given function and configuring a first operating point for the functional unit in the signal processing path for performing the given function and configuring a second operating point for the corresponding functional unit in the redundant version of the signal processing path. The second operating point is different from the first operating point. The method further comprises applying a same input signal to the functional unit and the corresponding functional unit, comparing a first output signal produced by the functional unit with a second output signal produced by the corresponding functional unit, and deriving a failure indication from the comparing.
G06F 11/07 - Responding to the occurrence of a fault, e.g. fault tolerance
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G07C 5/08 - Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle, or waiting time
G06F 11/16 - Error detection or correction of the data by redundancy in hardware
92.
Arrangement, method and sensor for measuring an absolute angular position using a multi-pole magnet
A system for measuring an angular position of a rotor with respect to a stator, wherein the rotor is rotatable around a rotation axis, the system comprising: a magnetic source mounted on the rotor, having at least four magnet poles and providing a periodically repetitive magnetic field pattern with respect to the rotation axis; a sensor mounted on the stator and comprising a plurality of sensor elements for measuring at least one magnetic field component of the magnetic field and for providing a measurement signal thereof; the sensor being located substantially centered around the rotation axis, in a plane substantially perpendicular to the rotation axis at a first distance from the magnetic source; the sensor elements being located substantially on a circle at a second distance from the rotation axis; a calculator that determines the angular position by calculating it from the measurement signals.
G01R 33/06 - Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
G01D 5/14 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
G01D 5/244 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trainsMechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means generating pulses or pulse trains
09 - Scientific and electric apparatus and instruments
Goods & Services
Engine components incorporating magnetic sensors; engine components incorporating hall effect magnetic sensors; electric motors; direct current electric motors, brushless direct current electric motors. Electrical integrated circuit devices; magnetic sensors for use in automotive or industrial applications; hall effect magnetic sensors for use in automotive or industrial applications; controllers for electric motors, direct current electric motors or brushless direct current electric motors; microprocessor based controllers for electric motors, direct current electric motors or brushless direct current electric motors; microcontrollers and microprocessors; single chip microcontrollers and microprocessors; firmware for use with microcontrollers and microprocessors; firmware for use with single chip microcontrollers and microprocessors; software for use with microcontrollers and microprocessors; software for use with single chip microcontrollers and microprocessors; optical sensors, control and/or processing electronics or electronic devices associated therewith; electronic optical sensors, control and/or processing electronics or electronic devices associated therewith.
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor chips; sensor; microprocessors; chips and
sensors for image recording apparatus and image reproducing
apparatus; chips and sensors for apparatus and instruments
for processing images; chips and sensors for cameras; chips
and sensors for monitoring instruments; chips and sensors
for motion measuring instruments; chips and sensors for
image and pattern recognition; chips and sensors and
electronic components for recognising motion, detecting and
identifying objects; chips and sensors for distance
measuring apparatus (telemeters); chips and sensors for
automatic vehicle controllers; chips and sensors for
distance warning systems and vehicle distance systems; chips
and sensors for computer interfaces; chips and sensors for
vehicle on-board apparatus; image processing computer
software; electronic components; integrated electronic
circuits; optical and optoelectronic apparatus; optical and
optoelectronic apparatus; light detectors, optical detectors
and sensors; infrared detectors and infrared ray sensors;
semi-conductors or optoelectronic components; infrared
imaging retinas; electronic components for light-emitting
elements/light transmitters; proximity sensors and ambient
light sensors; sensors for 3D cameras.
A semiconductor device for measuring IR radiation comprising: at least one sensor pixel; at least one reference pixel shielded from said IR radiation comprising a heater; a controller adapted for: measuring a responsivity by applying power to the heater, while not heating the sensor pixel; measuring a first output signal of an unheated pixel and a first reference output signal of the heated pixel, obtaining the responsivity as a function of a measure of the applied power to the heater and of the difference between the first output signal and the first reference output signal; applying a period of cooling down until the temperature of the reference pixel and the sensor pixel are substantially the same; generating the output signal indicative of the IR radiation, based on the difference between the sensor and the reference output signal, by converting this difference using the responsivity.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
A circuit for determining and/or compensating for a measurement error of a sheathed sensor due to a property of a sheath of that sheathed sensor comprises a first and a second terminal for connecting to a pair of sensor signal leads of a sensor element in a sheathed sensor and a voltage measurement circuit. A switching unit controls switching an electrical connection between a first and a second state. A correction measurement circuit generates a correction signal indicative of that a measured current running from the first terminal through the switching unit. A controller receives the measurement and correction signal in both the first and second state, and calculates an error value indicative of the measurement error and/or a sensor readout value that is corrected for the measurement error by taking the measurement and correction signal into account as obtained in both the first and second state.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 27/08 - Measuring resistance by measuring both voltage and current
G01K 15/00 - Testing or calibrating of thermometers
97.
Transceiver unit for transmitting data via a differential bus
A transmitter for establishing communication between a device and a differential network bus includes current driving means connected to each of the two conduction lines of the differential network bus, through a first and second conduction paths of the transmitter; at least one unidirectional current regulator for extracting a first current equal to a known ratio of a parasitic current circulating through the first conduction path, with a direction inverse to the driving current through the conduction path connected to one of the lines of the differential bus; means for obtaining, from the first current, a second current with a magnitude equal to the original magnitude of the parasitic current; and means for introducing the second current into the second conduction path connected to the other line of the differential bus.
A device having a light emitting diode (LED) of a red-green-blue type, a pulse width modulation (PWM) control, a current supply, and a microcontroller. The RGB LED device arranged for setting a PWM duty cycle using the PWM control and for supplying to the LED either a current of a first value or a current of a second value higher than the first value from the current supply. A method for calibrating the LED of the RGB LED device by measuring sets of tristimulus values when the PWM duty cycle and currents are applied, and calculating from the measured tristimulus values parameters to express colour intensity as a function of PWM duty cycle under the applied current. A method for operating the RGB LED device where calibration parameters linked to the use of a current having a low value and calibration parameters linked to the use of a high current value are determined and used to account for a possible working point shift when switching between the two currents. The calibration parameters including the parameters calculated from sets of tristimulus values to express colour intensity as a function of PWM duty cycle for the applied currents.
A method of operating a plurality of driving units for powering electronic units comprises interchanging a data frame including a bit sequence, between a master control unit and at least one of a plurality of driving units at slave nodes. A step of applying an ID field comprises indicating the driving unit address using a first bit sub-string comprising N bits, allowing the master control unit to identify whether data should be received or transmitted, or allowing each addressed driving unit to decode which action is required by the master control unit, using an R/T command bit, performing a length decoding step, for including information in the ID field regarding the type of instructions included in the data frame, using an F function bit, and assigning data bits to different electronic units or indicating in the length of the bit string in the data field, using a second bit sub-string.
B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
B60Q 1/00 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
B60R 16/023 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for transmission of signals between vehicle parts or subsystems
A magnetic field sensor is described comprising at least three magnetic flux concentrator sections integrated on a planar substrate, each section being adjacent to at least one of the other sections and being separated by gaps. The sensor comprises at least a first sensing element positioned for sensing flux density in or near the gap between a first section and a second section and at least a second sensing element positioned for sensing flux density in or near the gap between the first section and at least a further section. The magnetic field sensor further comprises further sensing elements arranged to measure changes of the magnetic field in the direction perpendicular to the substrate.
G01D 5/16 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
G01R 33/00 - Arrangements or instruments for measuring magnetic variables
