06 - Common metals and ores; objects made of metal
Goods & Services
Multilayer metal laminate composites, namely composites
consisting of multiple layers of laminated metal; multilayer
laminate composites consisting of a central layer of copper,
intermediate layers of stainless steel, and skin layers of a
copper alloy; multilayer metal laminate composites used in
the manufacture of battery interconnect devices.
A process for producing a copper-beryllium alloy product. The process comprises preparing a base alloy having 0.15 wt %-4.0 wt % beryllium and having grains and an initial cross section area. The process further comprises cold working the base alloy to a percentage of cold reduction of area (CRA) greater than 40%, based on the initial cross section area, and heat treating the cold worked alloy to produce the copper-beryllium alloy product. The grain structure of the copper-beryllium alloy product has an orientation angle of less than 45° when viewed along the direction of the cold working. The copper-beryllium alloy product demonstrates a fatigue strength of at least 385 MPa after 106 cycles of testing.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Methods are described for densifying articles produced from additive manufacturing processes, such as binder jet processes and laser powder bed fusion processes. The method may be used to make articles that comprise beryllium. The article may have an open cavity, a designed internal structural feature. In one embodiment, the method uses a sinter step prior to isostatic pressing.
B22F 5/10 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
B22F 10/14 - Formation of a green body by jetting of binder onto a bed of metal powder
B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
C22C 1/04 - Making non-ferrous alloys by powder metallurgy
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
A sputtering target comprising a target plate comprising high purity tantalum or tantalum alloy and a backing plate. The portion of the target plate being adjacent to the backing plate contains a different texture than the remaining sputtering portion of the target plate. In one embodiment, the volume percentage of <110> texture of the target plate is from 2% to 20% through thickness as determined by electron backscatter diffraction (EBSD), while the volume percentage of the <110> texture in the target plate adjacent to the backing plate is less than 8%.
A stranded wire is disclosed for feeding to an additive manufacturing process. The stranded wire comprises one or more first wire filaments comprising a first metal or a first pre-alloy and one or more second wire filaments comprising a second metal or a second pre-alloy, wherein the second metal or a second pre-alloy is different than the first metal or the first pre-alloy. The first metal or a first pre-alloy and the second metal or a second pre-alloy have high purity.
A metallic laminate composite comprising a first layer comprising a copper-containing compound, a second layer selected from steel or stainless steel, and a third layer selected from copper or copper alloys. The second layer comprises 7 vol% to 25 vol% of the metallic laminate composite. In some cases, the composite the composite demonstrates a yield strength greater than 80 MPa.
A process of synthesizing a lithium lanthanum zirconium oxide (LLZO) powder may include mixing a lithium salt, water, and a precursor blend comprising a lanthanum precursor and a zirconium precursor to form a mixture. The process may include heating the mixture at low pressure to form a dried lithiated powder. The process may include calcining the dried lithiated powder to form a lithium lanthanum zirconium oxide powder. The LLZO powder may include a cubic garnet phase purity of greater than 95 wt%.
x1-x1-x to form a powder, wherein x ranges from 0.05 and 0.5; and consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns. An aluminum-scandium alloy sputtering target comprising one or more Al-Sc intermetallic phases including Al-Sc intermetallic grains, wherein an average Al-Sc intermetallic grain size is at most 50 microns.
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
C22C 28/00 - Alloys based on a metal not provided for in groups
C22F 1/04 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
06 - Common metals and ores; objects made of metal
Goods & Services
Multilayer laminate composites, namely composites consisting of multiple layers of laminate materials; Multilayer laminate composites consisting of a central layer of copper, intermediate layers of stainless steel, and skin layers of a copper alloy; multilayer laminate composites used in the manufacture of battery interconnect devices
10.
INTEGRAL RESISTANCE HEATERS INCLUDING NIOBIUM AND PROCESSES FOR MAKING SAME
A process of forming an integral resistance heater. The process comprises applying a metal layer in a pattern on a beryllium oxide ceramic body, wherein the pattern of the metal layer is connected to a conductor, contacting a first surface of a substrate with the metal layer to position the substrate in line with the ceramic body to form a pre-assembly body, wherein the substrate comprises a ceramic, and heating the pre-assembly body to a joining temperature from 800 °C to 1900 °C to form a heating element that joins the substrate to the ceramic body, wherein the pattern retains integrity when forming the heating element. The metal layer comprises from 10% to 100 % by weight of niobium.
H05B 3/10 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
H05B 3/18 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
A process for producing beryllium carbide powder comprising calcining a blend composition comprising a beryllium-containing compound and a carbon powder at a first calcination temperature to yield a composite powder, milling the composite powder to form a milled powder, stirring the milled powder in a heavy liquid to form a suspension, and separating at least a portion from the suspension to yield the beryllium carbide powder. In one embodiment, a sacrificial layer may be used during the calcination. The process produces a high purity beryllium carbide powder.
Disclosed herein are aluminum alloys with scandium as the alloying element. The alloys have a high scandium content, as measured by atomic percentage, and are highly uniform, as described herein. Methods of forming articles from these alloys are also disclosed, such articles including sputtering targets that can be used to form thin films containing high amounts of scandium.
An apparatus is disclosed which includes an ultraviolet laser and at least one reflective mirror having a substrate which is made from beryllium, an aluminum metal matrix, or silicon carbide. The at least one mirror is adapted to reflect a laser beam generated from the ultraviolet laser, which can then be used on a silicon film used in the production of an electronic display. The laser beam can be used to anneal the silicon film, or in a laser lift-off process for separating the silicon film from a temporary substrate upon which the silicon film was mounted.
Methods for manufacturing a beryllium-based article object comprising beryllium by depositing layers of beryllium. An element is added to the beryllium that dissolved to form a secondary phase to limit columnar grain. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability.
Methods for manufacturing an object comprising beryllium by depositing layers of beryllium and metal inoculants are disclosed. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability.
C01F 1/00 - Methods of preparing compounds of the metals beryllium, magnesium, aluminium, calcium, strontium, barium, radium, thorium, or the rare earths, in general
16.
METHOD FOR MANUFACTURING OBJECTS COMPRISING BERYLLIUM
Methods for manufacturing an object comprising beryllium by depositing layers of beryllium and metal inoculants are disclosed. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability.
B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
B22F 12/90 - Means for process control, e.g. cameras or sensors
B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
17.
METHOD FOR MANUFACTURING A BERYLLIUM-BASED ARTICLE
Methods for manufacturing a beryllium-based article object comprising beryllium by depositing layers of beryllium. An element is added to the beryllium that dissolved to form a secondary phase to limit columnar grain. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability.
B22F 12/90 - Means for process control, e.g. cameras or sensors
B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
18.
METHOD FOR GRAIN REFINEMENT OF A BERYLLIUM ARTICLE
Methods for grain refinement of beryllium articles are disclosed. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability. One method stabilizes the β-phase of the beryllium that is precipitated after cycling above a temperature that is greater than or equal to the beta transus temperature.
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
19.
METHOD FOR GRAIN REFINEMENT OF A BERYLLIUM ARTICLE
Methods for grain refinement of beryllium articles are disclosed. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability. One method stabilizes the β-phase of the beryllium that is precipitated after cycling above a temperature that is greater than or equal to the beta transus temperature.
Methods for grain refinement of beryllium articles are disclosed. Grain refinement allows the beryllium article to have beneficial properties in terms of strength and durability. The method disclosed herein provide for efficient grain refinement using in situ formed intermetallic compounds of beryllium.
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
B22F 10/36 - Process control of energy beam parameters
B22F 10/38 - Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B33Y 70/00 - Materials specially adapted for additive manufacturing
22.
PHOTO RESIST AS OPAQUE APERTURE MASK ON MULTISPECTRAL FILTER ARRAYS
An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
Provided is a light converter and its method of manufacture. A light conversion layer containing light conversion particles in a binding material is provided for generating emission light from excitation light incident on the light conversion layer. A planarization layer is disposed on a surface of the light conversion layer. At least one optical coating is part of or on a surface of the planarization layer that is relatively smooth in comparison with the surface of the light conversion layer.
G02B 26/00 - Optical devices or arrangements for the control of light using movable or deformable optical elements
H04N 9/31 - Projection devices for colour picture display
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
Systems and methods for reducing the thickness of a strip of an aluminum-based material are disclosed. The aluminum-based material is pre-heated before running the material through a warm rolling process. The systems include devices for pre-heating, which can include a heated payoff station or a dedicated pre-heating station that applies heated rolls or acts as a heated tunnel.
B21B 45/00 - Devices for surface treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
A reinforced alloy comprising reinforcement particles (fine and/or coarse) for a bracket that provides enhanced theft deterrence and lightweight. The bracket may be used for a lock for a personal transportation vehicle.
C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
C22C 21/16 - Alloys based on aluminium with copper as the next major constituent with magnesium
E05B 71/00 - Locks specially adapted for bicycles, other than padlocks
An optical device comprises two flat plates each having a reflective flat surface, and two flat spacer plates of thickness H each having a reflective sidewall. The flat plates and flat spacer plates are arranged as a stack with the reflective flat surfaces facing each other and the flat spacer plates arranged in a single plane and disposed between the two flat plates with the reflective sidewalls facing each other and with a gap between the two reflective sidewalls. The facing reflective flat surfaces and facing reflective sidewalls define a light tunnel passage with dimension H in the direction transverse to the single plane. The facing reflective sidewalls may be mutually parallel and spaced by a constant gap W to provide a light tunnel passage with constant cross-section H×W, or may be oriented at an angle to provide a tapered light tunnel passage.
A reinforced alloy comprising reinforcement particles (fine and/or coarse) for a bracket that provides enhanced theft deterrence and lightweight. The bracket may be used for a lock for a personal transportation vehicle.
C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
The present disclosure relates to an electrode for measuring an analyte. The electrode includes a first base layer, a first electrode layer upon the first base layer, and a second base layer. The first electrode layer is arranged between the first base layer and the second base layer. The first base layer includes a conductive metal, a conductive metal alloy, or carbon. The first electrode layer includes ruthenium metal, a ruthenium based metal alloy, nickel metal, or a nickel based metal alloy. The first base layer is made of different elements than the first electrode layer. The first base layer is more conductive than the first electrode layer.
09 - Scientific and electric apparatus and instruments
Goods & Services
Radio frequency housings for electronic devices, namely, semiconductors, electronic chips, substrates, and radio frequency power transistors; housings for electronic chips, substrates, and radio frequency power transistors; semiconductor housings, namely, housings for radio frequency power transistors and radio frequency semiconductors; radio frequency housings for 5G cellular network technology applications, electronic devices, namely, semiconductors, electronic chips, substrates, and radio frequency power transistors and 5G cellular network technology electronics.
30.
High optical power light conversion device using a phosphor element with solder attachment
A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.
H01L 31/0232 - Optical elements or arrangements associated with the device
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
Provided herein is a semiconductor package and method of forming the same. The semiconductor package has a cap including a first window wafer with a first face and opposing second face, a second window wafer, and a perforated spacer wafer with through-holes extending therethrough. The first and second faces of the first window wafer are mutually parallel and at least one face includes an antireflective surface. The spacer wafer is disposed between the first and second window wafers with the first and second window wafers bonded to opposing faces of the spacer wafer. The window wafers and spacer wafer together define a cavity in the cap. An edge-emitting laser diode is disposed on a submount and configured to direct a laser beam at normal incidence to the first face of the first window wafer. The cap is mounted on the submount with the edge-emitting laser diode enclosed in the cavity.
Provided herein is a semiconductor package and method of forming the same. The semiconductor package has a cap including a first window wafer with a first face and opposing second face, a second window wafer, and a perforated spacer wafer with through-holes extending therethrough. The first and second faces of the first window wafer are mutually parallel and at least one face includes an antireflective surface. The spacer wafer is disposed between the first and second window wafers with the first and second window wafers bonded to opposing faces of the spacer wafer. The window wafers and spacer wafer together define a cavity in the cap. An edge-emitting laser diode is disposed on a submount and configured to direct a laser beam at normal incidence to the first face of the first window wafer. The cap is mounted on the submount with the edge-emitting laser diode enclosed in the cavity.
06 - Common metals and ores; objects made of metal
Goods & Services
Sputtering targets, namely tantalum sputtering targets; metal sputtering targets for use in the semiconductor industry; metal sputtering targets for use in vacuum sputter deposition of inorganic coatings on substrates; metallic and other inorganic material sputtering targets for use in vacuum coating of metallic and inorganic material on substrates such as semiconductor wafers.
06 - Common metals and ores; objects made of metal
Goods & Services
metal sputtering targets, namely, tantalum sputtering targets; metal sputtering targets for use in the semiconductor industry; metal sputtering targets for use in vacuum sputter deposition of inorganic coatings on substrates; metallic material sputtering targets for use in vacuum coating of metallic and inorganic material on substrates such as semiconductor wafers
35.
Aluminum-Scandium Composite, Aluminum-Scandium Composite Sputtering Target And Methods Of Making
An Al—Sc alloy sputtering target. The target comprising from 1.0 at % to 65 at % scandium and from 35 at % to 99 at % aluminum and having a microstructure including a first aluminum matrix phase and a second phase dispersed uniformly therethrough. The second phase comprises one or more compounds corresponding to the formula ScxAly, where x is from 1 to 2 and y is from 0 to 3.
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
C22C 5/08 - Alloys based on silver with copper as the next major constituent
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01H 1/023 - Composite material having a noble metal as the basic material
H01H 11/04 - Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Processes are disclosed for forming beryllium-copper metal rings having a fine and uniform grain structure. A raw BeCu casting is pre-forged and turned to form a BeCu billet. The BeCu billet is subjected to various heat treatment and cooling cycles to obtain/maintain combinations of advantageous material properties. Generally, the BeCu billet is preheated, hot worked via forging, heated again, hot worked again via ring rolling followed by air cooling, solution annealed followed by quenching, and heated a final time followed by air cooling.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
B21K 1/76 - Making machine elements elements not mentioned in one of the preceding groups
Techniques and/or systems are disclosed herein for forming a window cavity wafer that includes fabricating a window wafer by: providing a window wafer substrate having two faces; etching fiducials onto one or more faces of the window wafer substrate; and applying one or more optical coatings to on one or more faces of the window wafer substrate. Next, fabricating a spacer wafer separate from the window wafer by: providing a spacer wafer substrate having two faces; and forming an array of through-holes in the spacer wafer substrate. Then, bonding the spacer wafer to the window wafer to form the window cavity wafer; and forming discrete metal frames on a face of the window cavity wafer.
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
H01L 31/09 - Devices sensitive to infrared, visible or ultra- violet radiation
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
09 - Scientific and electric apparatus and instruments
Goods & Services
Radio frequency packages and packaging for electronic devices; packaging for electronic chips, substrates, and radio frequency power transistors; semiconductor packages and packaging, namely, packages and packaging for radio frequency power transistors and radio frequency semiconductors; radio frequency packaging for 5G cellular network technology applications electronic devices and 5G cellular network technology electronics
40.
MODULAR SPUTTERING TARGET WITH PRECIOUS METAL INSERT AND SKIRT
A sputtering target comprising a target insert comprising a target metal compound and a skirt structure including a primary skirt and a secondary skirt. The primary skirt is disposed adjacent least a portion of a secondary skirt and comprises a first metal compound. The secondary skirt comprises a second metal compound that is different from the first metal compound.
A sputtering target comprising a target insert comprising a target metal compound and a skirt structure including a primary skirt and a secondary skirt. The primary skirt is disposed adjacent least a portion of a secondary skirt and comprises a first metal compound. The secondary skirt comprises a second metal compound that is different from the first metal compound.
Molybdenum oxychloride consolidated masses, comprising molybdenum oxychloride and less than 10 wt % binder. The consolidated masses have a bulk density greater than 0.85 g/cc.
A white light source includes a light source and a phosphor conversion component. The light source emits short wavelength light peaked at a peak wavelength of 570 nanometers or shorter. The phosphor conversion component includes a light conversion layer comprising a phosphor effective to convert the short wavelength light to converted light. The light conversion layer includes light passages comprising openings or passage material that does not comprise the phosphor and is light transmissive for the short wavelength light. The light source is disposed respective to the phosphor conversion component so as to illuminate the light conversion layer with the emitted short wavelength light and to pass the short wavelength light through the light passages.
F21V 9/32 - Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
F21K 9/64 - Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
H01L 33/10 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/373 - Cooling facilitated by selection of materials for the device
A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.
H01L 23/053 - ContainersSeals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
The present disclosure relates to an electrode for measuring an analyte. The electrode includes a first base layer, a first electrode layer upon the first base layer, and a second base layer. The first electrode layer is arranged between the first base layer and the second base layer. The first base layer includes a conductive metal, a conductive metal alloy, or carbon. The first electrode layer includes ruthenium metal, a ruthenium based metal alloy, nickel metal, or a nickel based metal alloy. The first base layer is made of different elements than the first electrode layer. The first base layer is more conductive than the first electrode layer.
06 - Common metals and ores; objects made of metal
Goods & Services
Metal matrix composites in the form of bars, sheets, panels, plates, powder, and machined blanks composed of a metal matrix combined with a reinforcing material for use in further manufacture.
48.
NEAR INFRARED OPTICAL INTERFERENCE FILTERS WITH IMPROVED TRANSMISSION
An interference filter includes a layers stack comprising a plurality of layers of at least: layers of amorphous hydrogenated silicon with added nitrogen (a-Si:H,N) and layers of one or more dielectric materials, such as SiO2, SiOx, SiOxNy, a dielectric material with a higher refractive index in the range 1.9 to 2.7 inclusive, or so forth. The interference filter is designed to have a passband center wavelength in the range 750-1000 nm inclusive. Added nitrogen in the a-Si:H,N layers provides improved transmission in the passband without a large decrease in refractive index observed in a-Si:H with comparable transmission. Layers of a dielectric material with a higher refractive index in the range 1.9 to 2.7 inclusive provide a smaller angle shift compared with a similar interference filter using SiO2 as the low index layers.
A base plate containing a having a top and a bottom and comprising a beryllium oxide composition containing at least 95 wt % beryllium oxide and optionally fluorine/fluoride ion. The base plate demonstrates a clamping pressure of at least 133 kPa at a temperature of at least 600° C. and a bulk resistivity greater than 1×105 ohm-m at 800° C.
C04B 35/08 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on beryllium oxide
In a method of manufacturing a one-dimensionally varying optical filter, a substrate is coated to form a stack of layers of two or more different types. The coating may, for example, employ sputtering, electron-beam evaporation, or thermal evaporation. During the coating, the time-averaged deposition rate is varied along an optical gradient direction by generating reciprocation between a shadow mask and the substrate in a reciprocation direction that is transverse to the optical gradient direction. In some approaches, the shadow mask is periodic with a mask period defined along the direction of reciprocation, and the generated reciprocation has a stroke equal to or greater than the mask period along the direction of reciprocation. The substrate and the shadow mask may also be rotated together as a unit during the coating. Also disclosed are one-dimensionally varying optical filters, such as linear variable filters, made by such methods.
12. Milling the YAG compact, without a grinding media, and drying produces the YAG powder. Processes further include introducing a dopant to the powder mixture to produce doped YAG powder.
C04B 35/18 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in aluminium oxide
C04B 35/626 - Preparing or treating the powders individually or as batches
52.
YTTRIUM ALUMINUM GARNET POWDER AND PROCESSES FOR SYNTHESIZING SAME
A process of synthesizing a yttrium aluminum garnet (YAG) powder. The process comprises introducing powders of yttria and silica to form a powder mixture, wherein alumina is not added to the powder mixture. Milling the powder mixture in the presence of an alumina grinding media and a solvent forms a powder slurry. Processing the powder slurry forms a green compact. Calcining the green compact at a temperature of from 1100 °C to 1650 °C for greater than 8 hours in air to 50% or less theoretical density forms a YAG compact of at least 92 wt% Y3Al5O12. Milling the YAG compact, without a grinding media, and drying produces the YAG powder. Processes further include introducing a dopant to the powder mixture to produce doped YAG powder.
C04B 35/44 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on aluminates
C01F 17/34 - Aluminates, e.g. YAlO3 or Y3-xGdxAl5O12
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C04B 35/626 - Preparing or treating the powders individually or as batches
06 - Common metals and ores; objects made of metal
Goods & Services
metal matrix composites in the form of bars, sheets, panels, plates, powder, and machined blanks composed of a metal matrix combined with a reinforcing material for use in further manufacture
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
The present disclosure relates to piston assembly comprising a piston having a circumferential groove and a ring groove insert within the circumferential groove of the piston. Particularly, the ring groove insert is a second material different from a first material of the piston. The second material has at least one of the following: a) a density from 90% to 120% of a density of the first material; b) a coefficient of thermal expansion (CTE) from 50% to 90% of a CTE of the first material; or c) a thermal conductivity greater than a thermal conductivity of the first material.
B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
C22C 21/16 - Alloys based on aluminium with copper as the next major constituent with magnesium
C22C 21/14 - Alloys based on aluminium with copper as the next major constituent with silicon
F16J 9/22 - Rings for preventing wear of grooves or like seatings
The present disclosure relates to piston assembly comprising a piston having a circumferential groove and a ring groove insert within the circumferential groove of the piston. Particularly, the ring groove insert is a second material different from a first material of the piston. The second material has at least one of the following: a) a density from 90% to 120% of a density of the first material; b) a coefficient of thermal expansion (CTE) from 50% to 90% of a CTE of the first material; or c) a thermal conductivity greater than a thermal conductivity of the first material.
A crucible having a heat treated body. The heat treated body comprises a composition including an oxide material, from 5 wt % to 50 wt % a nitride material, and optionally a sintering aid. A weight ratio of the nitride material to the oxide material ranges from 0.02:1 to 2.0:1. The heat treated body has an oxide material lattice structure with nitride material at least partially encapsulated therein.
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C21D 8/02 - Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
A cask liner includes a hollow cylinder comprising a boron-containing composition. The hollow cylinder has no longitudinal joints. The hollow cylinder may be formed as a single unit by isostatic pressing, for example by hot isostatic pressing (HIP) of a blend of a boron-containing powder and an aluminum or aluminum alloy powder which is blended by mechanical alloying. Casked nuclear fuel includes a nuclear fuel rod comprising uranium, which is disposed in or extends through the hollow cylinder of the cask liner.
B22F 5/10 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
C22C 1/04 - Making non-ferrous alloys by powder metallurgy
C22C 1/05 - Mixtures of metal powder with non-metallic powder
An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
61.
High optical power light conversion device using a phosphor element with solder attachment
A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/024 - Arrangements for cooling, heating, ventilating or temperature compensation
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
An Al-Sc alloy sputtering target. The target comprising from 1.0 at% to 65 at% scandium and from 35 at% to 99 at% aluminum and having a microstructure including a first aluminum matrix phase and a second phase dispersed uniformly therethrough. The second phase comprises one or more compounds corresponding to the formula ScxAly, where x is from 1 to 2 and y is from 0 to 3.
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
B22F 7/00 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
C22C 1/047 - Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
C22C 45/08 - Amorphous alloys with aluminium as the major constituent
C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
An apparatus which includes an ultraviolet laser and at least one reflective mirror having a substrate which is made from beryllium, an aluminum metal matrix, or silicon carbide. The at least one mirror is adapted to reflect a laser beam generated from the ultraviolet laser, which can then be used on a silicon film used in the production of an electronic display. The laser beam can be used to anneal the silicon film, or in a laser lift-off process for separating the silicon film from a temporary substrate upon which the silicon film was mounted.
Methods for producing a coiled strip of metal matrix composite (MMC) material are disclosed. The methods include a combination of hot rolling and warm rolling processes that reduce the thickness of the input material and increase its ductility. The resulting MMC strip can be coiled, which is useful for high volume coil-to-coil applications.
A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B32B 3/06 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers togetherLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
67.
Methods of packaging thin metal films to maintain their physical characteristics
The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.
B65B 11/58 - Applying two or more wrappers, e.g. in succession
B65B 11/00 - Wrapping, e.g. partially or wholly enclosing, articles or quantities of material, in strips, sheets or blanks, of flexible material
B65D 1/00 - Rigid or semi-rigid containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material or by deep-drawing operations performed on sheet material
B65D 75/00 - Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
B65D 75/06 - Articles or materials wholly enclosed in single sheets or wrapper blanks in sheets or blanks initially folded to form tubes
B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
B65B 25/14 - Packaging paper or like sheets, envelopes, or newspapers, in flat, folded, or rolled form
Systems and methods for reducing the thickness of a strip of an aluminum-based material are disclosed. The aluminum-based material is pre-heated before running the material through a warm rolling process. The systems include devices for pre-heating, which can include a heated payoff station or a dedicated pre-heating station that applies heated rolls or acts as a heated tunnel.
B21B 45/00 - Devices for surface treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
B21B 1/22 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-sectionSequence of operations in milling trainsLayout of rolling-mill plant, e.g. grouping of standsSuccession of passes or of sectional pass alternations for rolling bands or sheets of indefinite length
69.
SILVER ALLOY CLAD STRUCTURE FOR CHARGING TERMINALS AND MANUFACTURING METHOD THEREOF
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
B60L 53/16 - Connectors, e.g. plugs or sockets, specially adapted for charging electric vehicles
H01R 13/00 - Details of coupling devices of the kinds covered by groups or
B23K 20/00 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01H 11/04 - Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
70.
Wavelength conversion element with convective cooling
A phosphor wheel comprises a disk, a wavelength conversion layer comprising phosphor disposed on the disk, and an impeller disposed on the disk. The impeller comprises vanes which are shaped as airfoils with each vane oriented to drive outward airflow across the disk and across the wavelength conversion layer when the disk is rotated in the rotation direction. The wavelength conversion layer may be disposed at a larger radial position than the impeller on the disk, and may optionally be an annular wavelength conversion layer. In operation, a light source is arranged to output a pump beam impinging on the wavelength conversion layer while the disk rotates.
A cold worked and spinodally-hardened copper alloy comprising from about 8 to about 20 wt % nickel, and from about 5 to about 11 wt % tin, the remaining balance being copper, and having a 0.2% offset yield strength of at least 75 ksi, is used to form a sucker rod coupling or subcoupling. Each coupling is formed from a core having two ends, each end having an internal thread. These box ends engage the pin of a sucker rod or other rod. The exterior surface of the core includes grooves running between the two ends.
A three-dimensional inkjet printer and method for printing an aperture mask on a multi-spectral filter array. A custom tray is used by the printer allowing for printing on a prefabricated filter array. Photopolymer resin is deposited on the prefabricated filter array to form the aperture mask of dark mirror coating. An ultraviolet lamp illuminates the deposited photopolymer resin on the surface of the prefabricated multi-spectral optical filter array to cure the resin, thereby forming the mask. The prefabricated multi-spectral optical filter array includes an optical coating on at least one side, the aperture mask being formed on the optical coating, without the use of heat, chemical etching, or deformation of the optical coating.
The present disclosure relates to electrodes for biosensors. An electrode is made from a stack including (A) a layer made from ruthenium metal, a ruthenium-based alloy, nickel metal, or a nickel-based alloy; and (B) a layer made from a conductive metal or conductive metal alloy or carbon. The resulting electrode stack has physical and electrical property advantages when compared with existing pure metal electrodes.
Wavelength conversion elements formed from phosphors and dielectric interference particles dispersed in a host material, either in a single layer or in separate layers, are disclosed. Optical light conversion devices having such wavelength conversion elements, methods of making such wavelength conversion elements, and methods of using such wavelength conversion elements are also disclosed.
An optical device comprises two flat plates each having a reflective flat surface, and two flat spacer plates of thickness H each having a reflective sidewall. The flat plates and flat spacer plates are arranged as a stack with the reflective flat surfaces facing each other and the flat spacer plates arranged in a single plane and disposed between the two flat plates with the reflective sidewalls facing each other and with a gap between the two reflective sidewalls. The facing reflective flat surfaces and facing reflective sidewalls define a light tunnel passage with dimension H in the direction transverse to the single plane. The facing reflective sidewalls may be mutually parallel and spaced by a constant gap W to provide a light tunnel passage with constant cross-section H×W, or may be oriented at an angle to provide a tapered light tunnel passage.
A copper alloy that does not contain beryllium and has a 0.2% offset yield strength of at least 80 ksi and an electrical conductivity of at least 48% IACS is disclosed. The copper alloy contains nickel, silicon, chromium, manganese, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used for example, as a heat sink.
C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Molybdenum oxychloride consolidated masses, comprising molybdenum oxychloride and less than 10 wt% binder. The consolidated masses have a bulk density greater than 0.85 g/cc.
Molybdenum oxychloride consolidated masses, comprising molybdenum oxychloride and less than 10 wt% binder. The consolidated masses have a bulk density greater than 0.85 g/cc.
C04B 35/515 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides
C04B 35/636 - Polysaccharides or derivatives thereof
C04B 35/626 - Preparing or treating the powders individually or as batches
A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
C22C 9/02 - Alloys based on copper with tin as the next major constituent
A white light source includes a light source and a phosphor conversion component. The light source emits short wavelength light peaked at a peak wavelength of 570 nanometers or shorter. The phosphor conversion component includes a light conversion layer comprising a phosphor effective to convert the short wavelength light to converted light. The light conversion layer includes light passages comprising openings or passage material that does not comprise the phosphor and is light transmissive for the short wavelength light. The light source is disposed respective to the phosphor conversion component so as to illuminate the light conversion layer with the emitted short wavelength light and to pass the short wavelength light through the light passages.
F21V 9/32 - Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
F21K 9/64 - Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
H01L 33/10 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
A coupling for joining a downhole pump to a sucker rod string is disclosed. The coupling includes a core having a first end, a central portion, and a second end. The first end and the second end each have an end surface. The first end tapers linearly inwards from the central portion to the first end surface. The second end has a rounded edge along the second end surface. The coupling is made from a spinodally-hardened copper-nickel-tin alloy and has a sliding coefficient of friction of less than 0.4 when measured against carbon steel.
A base plate containing a having a top and a bottom and comprising a beryllium oxide composition containing at least 95 wt% beryllium oxide and optionally fluorine/fluoride ion. The base plate demonstrates a clamping pressure of at least 133 kPa at a temperature of at least 600 °C and a bulk resistivity greater than 1 x 105 ohm-m at 800 °C.
C04B 35/08 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on beryllium oxide
C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
The present disclosure relates to metal alloys for biosensors. An electrode is made from the metal alloy, which more specifically can be a nickel-based alloy. The alloy provides physical and electrical property advantages when compared with existing pure metal electrodes.
C22C 19/05 - Alloys based on nickel or cobalt based on nickel with chromium
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
C23C 14/20 - Metallic material, boron or silicon on organic substrates
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
A61B 5/1468 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using chemical or electrochemical methods, e.g. by polarographic means
85.
Low friction and high wear resistant sucker rod string
A sucker rod string is formed from sucker rods and sucker rod couplings. The sucker rod couplings are formed from a spinodally-hardened copper alloy comprising from about 8 to about 20 wt % nickel, and from about 5 to about 11 wt % tin, the remaining balance being copper, and having a sliding coefficient of friction of 0.4 or less when measured against carbon steel. The sucker rod string has low friction and improved pumping stroke, enhanced pumping capacity, and less load in the overall system.
A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/024 - Arrangements for cooling, heating, ventilating or temperature compensation
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
A cask liner includes a hollow cylinder comprising a boron-containing composition. The hollow cylinder has no longitudinal joints. The hollow cylinder may be formed as a single unit by isostatic pressing, for example by hot isostatic pressing (HIP) of a blend of a boron-containing powder and an aluminum or aluminum alloy powder which is blended by mechanical alloying. Casked nuclear fuel includes a nuclear fuel rod comprising uranium, which is disposed in or extends through the hollow cylinder of the cask liner.
A process for producing a copper-beryllium alloy product. The process comprises preparing a base alloy having 0.15 wt% - 4.0 wt% beryllium and having grains and an initial cross section area. The process further comprises cold working the base alloy to a percentage of cold reduction of area (CRA) greater than 40%, based on the initial cross section area, and heat treating the cold worked alloy to produce the copper-beryllium alloy product. The grain structure of the copper-beryllium alloy product has an orientation angle of less than 45° when viewed along the direction of the cold working. The copper-beryllium alloy product demonstrates a fatigue strength of at least 385 MPa after 106 cycles of testing.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
A sucker rod guide having low friction and high wear resistance is disclosed herein, along with a fluid extraction system comprising the same. At least a part of the exterior surface of the sucker rod guide is formed from a cold worked and spinodally-hardenable or spinodally-hardened copper alloy comprising from about 5 to about 20 wt % nickel, and from about 5 to about 10 wt % tin, the remaining balance being copper, and having a 0.2% offset yield strength of at least 75 ksi. The guide includes a smoothbore adapted to surround and engage the surface of a sucker rod. The exterior surface of the guide can include grooves miming between the two ends. In particular embodiments, the guide is made by joining together two identical guide segments. In other embodiments, the guide is a single integral piece molded around a sucker rod.
A crucible having a heat treated body. The heat treated body comprises a composition including an oxide material, from 5 wt% to 50 wt% a nitride material, and optionally a sintering aid. A weight ratio of the nitride material to the oxide material ranges from 0.02:1 to 2.0:1. The heat treated body has an oxide material lattice structure with nitride material at least partially encapsulated therein.
C04B 35/08 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on beryllium oxide
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.
The present disclosure relates to metal alloys for biosensors. An electrode is made from ruthenium metal or a ruthenium-based alloy. The resulting electrode has physical and electrical property advantages when compared with existing pure metal electrodes.
C22C 5/04 - Alloys based on a platinum group metal
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering
C23C 14/20 - Metallic material, boron or silicon on organic substrates
C22C 27/00 - Alloys based on rhenium or a refractory metal not mentioned in groups or
G01N 27/30 - Electrodes, e.g. test electrodesHalf-cells
The present disclosure relates to a method of applying a wear-resistant copper-nickel-tin coating to a substrate using a thermal spray process. Briefly, a copper-nickel-tin alloy feedstock is converted into a powder or droplet form, then sprayed onto a substrate to form a coating thereon.
Methods and systems for casting and thermoplastically forming bulk metallic glass articles are described. A molten alloy can be fed into a mold with a three-dimensional shape and a cavity. The mold is configured such that multiple two-dimensional cross sections of the cavity of the mold are different from one another in multiple first mathematical planes intersecting the cavity displaced from one another in a direction normal to the mathematical planes intersecting the cavity. Cooling the molten alloy in the mold provides one or more near net shape bulk metallic glass castings, can be thermoplastically formed using forms at a temperature above Tg to provide a bulk metallic glass article with a desired final shape.
B22D 27/11 - Treating the metal in the mould while it is molten or ductile by using pressure making use of mechanical pressing devices
B22D 29/00 - Removing castings from moulds, not restricted to casting processes covered by a single main groupRemoving coresHandling ingots
B22D 30/00 - Cooling castings, not restricted to casting processes covered by a single main group
B22D 27/04 - Influencing the temperature of the metal, e.g. by heating or cooling the mould
B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
96.
Method of fabricating anisotropic optical interference filter
In a method of manufacturing a one-dimensionally varying optical filter, a substrate is coated to form a stack of layers of two or more different types. The coating may, for example, employ sputtering, electron-beam evaporation, or thermal evaporation. During the coating, the time-averaged deposition rate is varied along an optical gradient direction by generating reciprocation between a shadow mask and the substrate in a reciprocation direction that is transverse to the optical gradient direction. In some approaches, the shadow mask is periodic with a mask period defined along the direction of reciprocation, and the generated reciprocation has a stroke equal to or greater than the mask period along the direction of reciprocation. The substrate and the shadow mask may also be rotated together as a unit during the coating. Also disclosed are one-dimensionally varying optical filters, such as linear variable filters, made by such methods.
A method of making an article includes depositing a plurality of layers to form a three-dimensional preform, sintering the preform to form a sintered preform, and infiltrating the preform with at least one metal to form the article. At least one layer of the plurality of layers is formed from a beryllium-containing composition including beryllium powder. The infiltrating metal can be selected from aluminum and magnesium.
B22F 1/102 - Metallic powder coated with organic material
B22F 1/105 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
C22F 1/16 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
B22F 10/32 - Process control of the atmosphere, e.g. composition or pressure in a building chamber
B22F 10/36 - Process control of energy beam parameters
B22F 10/66 - Treatment of workpieces or articles after build-up by mechanical means
An apparatus is disclosed which includes an ultraviolet laser and at least one reflective mirror having a substrate which is made from beryllium, an aluminum metal matrix, or silicon carbide. The at least one mirror is adapted to reflect a laser beam generated from the ultraviolet laser, which can then be used on a silicon film used in the production of an electronic display. The laser beam can be used to anneal the silicon film, or in a laser lift-off process for separating the silicon film from a temporary substrate upon which the silicon film was mounted.
The present disclosure relates to sputtering target assemblies formed from a sputtering target with a sculpted lower surface that is bonded to a backing plate. The upper surface can be planar or include a racetrack. This assembly reduces premature burn-through while accounting for unpredictable plasma formation and also reduces particulation.
Wavelength conversion elements formed from phosphors and dielectric interference particles dispersed in a host material, either in a single layer or in separate layers, are disclosed. Optical light conversion devices having such wavelength conversion elements, methods of making such wavelength conversion elements, and methods of using such wavelength conversion elements are also disclosed.
