Abstract

A mobile device and a wound capacitor package structure thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly and a packaging assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging assembly includes a filling body for completely encapsulating the wound assembly, and a single-piece packaging casing for accommodating the filling body. The filling body includes a bottom filling material layer configured to encapsulate the wound assembly and a part of the conductive assembly. The single-piece packaging casing has an annular deformation structure configured for surroundingly accommodating the top filling material layer. The top filling material layer of the filling body cannot be squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly cannot be offset relative to the wound assembly by the annular deformation structure.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 4/236 - Terminals leading through the housing, i.e. lead-through
• H01G 4/32 - Wound capacitors

Abstract

A wound capacitor package structure and a method for manufacturing the same, and a movable device are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a packaging casing, an elastic sealing component and an elastic buffer body. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging casing is configured to accommodate the wound assembly. The elastic sealing component is disposed inside the packaging casing. The elastic sealing component is configured to isolate the wound assembly from an external environment. The elastic buffer body is disposed on a first surface of the elastic sealing component and surrounded by the packaging casing. The elastic buffer body is configured to slow down an impact force caused by an external force on the wound assembly and reduce a thermal shock caused by an external temperature on the wound assembly.

IPC Classes  ?

• H01G 9/10 - Sealing, e.g. of lead-in wires
• H01G 9/008 - Terminals
• H01G 9/15 - Solid electrolytic capacitors
• H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups

Abstract

A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structure. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package body is configured to cover the capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure disposed on the positive electrode portion to reduce a shortest vertical distance between the positive electrode portion and the negative electrode portion of each capacitor element.

IPC Classes  ?

• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/08 - HousingEncapsulation
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 4/005 - Electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 μm, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.

IPC Classes  ?

• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/008 - Terminals
• H01G 9/042 - Electrodes characterised by the material
• H01G 9/052 - Sintered electrodes

Abstract

A movable device and a wound capacitor package structure thereof are provided. A first gap defined between a first exposed portion of a first conductive pin and an inner surface of a first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a first exposed height defined from a bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm. A second gap defined between a second exposed portion of a second conductive pin and an inner surface of a second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/08 - HousingEncapsulation

Abstract

A stacked capacitor assembly and a method of manufacturing the same, and a stacked capacitor package structure are provided. The stacked capacitor assembly includes a plurality of conductive substrates, an inner conductive structure and an outermost covering structure. Each of the conductive substrates has a first portion and a second portion opposite to the first portion. The inner conductive structure is configured to cover the first portion of each of the conductive substrates and be disposed between any two adjacent ones of the conductive substrates. The outermost covering structure is configured to cover the inner conductive structure. The inner conductive structure is provided without carbon-containing materials or silver-containing materials, and a space is formed between any two adjacent ones of the conductive substrates without carbon-containing materials or silver-containing materials.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/008 - Selection of materials
• H01G 4/30 - Stacked capacitors

Abstract

A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

A method for manufacturing a semi-solid electrolytic capacitor includes: providing a capacitor element; impregnating the capacitor element with a dispersant; baking the capacitor element impregnated with the dispersant; impregnating the baked capacitor element with an electrolyte; and packaging the capacitor element impregnated with the electrolyte. The dispersant is a conductive polymer formed from at least one of polythiophene having at least one sulfonic acid group and polyselenophene having at least one sulfonic acid group.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• C08F 234/02 - Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring in a ring containing oxygen
• C08F 234/04 - Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring in a ring containing sulfur
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• H01G 9/035 - Liquid electrolytes, e.g. impregnating materials
• H01M 10/0565 - Polymeric materials, e.g. gel-type or solid-type

Abstract

A wound capacitor package structure and a sealing element thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The sealing element is disposed inside the package casing and cooperating with the package casing, and the sealing element is configured to prevent the wound assembly from contacting an external environment. The package casing has a surrounding concave position-limiting portion recessed inward to press the sealing element, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion to abut against the sealing element. The sealing element includes an elastomeric seal structure pressed by the surrounding concave position-limiting portion, and an oleophobic structure for protecting the elastomeric seal structure.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 4/32 - Wound capacitors

Abstract

A conductive paste, a manufacturing method of a conductive paste, a capacitor element and a manufacturing method of a capacitor element are provided. The conductive paste includes a conductive composite material powder and a resin. The conductive composite material powder is obtained by grinding a conductive composite material in a solid state. The resin is mixed with the conductive composite material powder.

IPC Classes  ?

• H01G 9/025 - Solid electrolytes
• C09D 5/24 - Electrically-conducting paints
• C09D 7/40 - Additives
• C09D 7/65 - Additives macromolecular
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

IPC Classes  ?

• H01G 9/10 - Sealing, e.g. of lead-in wires
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion. The protruding sealing element has a main sealing portion pressed by the surrounding concave position-limiting portion, and an auxiliary sealing portion protruding from the main sealing portion.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 4/236 - Terminals leading through the housing, i.e. lead-through
• H01G 4/32 - Wound capacitors

Abstract

A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.

IPC Classes  ?

• H01G 4/32 - Wound capacitors
• H01G 4/005 - Electrodes
• H01G 4/224 - HousingEncapsulation

Abstract

A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a rough inner surface, and the base layer and the filling layer are limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/15 - Solid electrolytic capacitors
• H01G 13/02 - Machines for winding capacitors
• H01G 9/08 - HousingEncapsulation

Abstract

A method of manufacturing a capacitor assembly package structure includes providing a capacitor unit and a conductive connection layer, in which the capacitor unit includes a plurality of capacitors, and each of the capacitors includes a positive portion and a negative portion electrically connected to the conductive connection layer; partially enclosing the capacitors by an insulative package body, in which the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body; and then enclosing a first portion of the insulative package body and electrically connecting to the positive portion of each of the capacitors by a first electrode structure, and enclosing a second portion of the insulative package body and electrically connecting to the conductive connection layer by a second electrode structure.

IPC Classes  ?

• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/08 - HousingEncapsulation
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

A stacked solid electrolytic capacitor is provided in the present disclosure. The stacked solid electrolytic capacitor includes a capacitive module, a conductive module and a packaging structure. The capacitive module includes capacitive units stacked up sequentially. The conductive module includes a positive terminal, a negative terminal and at least one anti-oxidizing layer. The positive terminal is electrically connected to one of the capacitive units. The negative terminal is electrically connected to the one of the capacitive units through a conductive paste layer. The at least one anti-oxidizing layer is arranged between the negative terminal and the conductive paste layer. The packaging structure surrounds the capacitive module and the conductive module. Therefore, it is difficult for an oxide layer forming between the negative terminal and the capacitive units, and the equivalent series resistance of the stacked solid electrolytic capacitor can be reduced.

IPC Classes  ?

• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/14 - Structural combinations for modifying, or compensating for, electric characteristics of electrolytic capacitors
• H01G 9/012 - Terminals specially adapted for solid capacitors

Abstract

A method for manufacturing an electrolytic capacitor is provided. A crosslinking agent is applied onto a capacitor body. A solution containing a conjugated polymer is applied onto the capacitor body after applying the crosslinking agent. A part of a solvent of the solution is removed, so as to form a polymer outer layer onto the capacitor body. The capacitor body includes an electrode body, an electrode material, a dielectric layer, and a solid electrolyte. The electrode material is formed on the electrode body. A surface of the electrode material is covered by the dielectric layer. The dielectric layer is covered by the solid electrolyte. The electrode body or the solid electrolyte is formed from at least one of polythiophene having at least one sulfonic acid group and polyselenophene having at least one sulfonic acid group.

IPC Classes  ?

• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/042 - Electrodes characterised by the material
• C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule

Abstract

A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

IPC Classes  ?

• H01G 4/32 - Wound capacitors
• H01G 4/005 - Electrodes
• H01G 4/224 - HousingEncapsulation

Abstract

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

IPC Classes  ?

• H01G 4/32 - Wound capacitors
• H01G 4/224 - HousingEncapsulation

Abstract

A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.

IPC Classes  ?

• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/08 - HousingEncapsulation
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

IPC Classes  ?

• H01G 9/08 - HousingEncapsulation
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A capacitor element and a method of manufacturing the same are provided. The method includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer onto the oxide layer so as to divide the outer surface of the oxide layer into a first part outer surface and a second part outer surface separated from each other; forming a base layer onto the oxide layer so as to partially encapsulate the oxide layer; cleaning the base layer by a cleaning solution and then drying the base layer; forming a conductive polymer layer onto the base layer; and forming a conductive paste layer onto the conductive polymer layer.

IPC Classes  ?

• H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 13/04 - DryingImpregnating

Abstract

A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCoating compositions based on derivatives of such polymers
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• C09D 5/24 - Electrically-conducting paints
• H01G 9/004 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture Details

Abstract

A capacitor assembly structure and a method of manufacturing the same are provided. The capacitor assembly structure includes a capacitor unit, an insulative package body, a plurality of positive composite material layers, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors each having a positive portion and a negative portion. The insulative package body partially covers the capacitors. A lateral side of the positive portion is exposed from a first lateral surface of the insulative package body. Each positive composite material layer is disposed on the first lateral surface and the lateral side so as to electrically connect to the positive portion. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure electrically contacting the positive composite material layer and a second electrode structure electrically contacting the conductive connection layer.

IPC Classes  ?

• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/042 - Electrodes characterised by the material
• H01G 4/002 - Fixed capacitorsProcesses of their manufacture Details
• H01G 9/08 - HousingEncapsulation
• H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A method for forming the polymer composite material onto the capacitor element is provided. The method includes a preparing step, a resting step, an immersing step, and a polymerization step. The preparing step includes forming a homogeneous reaction solution containing 3,4-ethylenedioxythiophene, an emulsifier, polystyrene sulfonic acid or salts thereof, an oxidant, and a solvent. The resting step includes resting the homogeneous reaction solution to generate microparticles so that a nonhomogeneous reaction solution containing the microparticles is formed. The immersing step includes immersing the capacitor element into the nonhomogeneous reaction solution so that the nonhomogeneous reaction solution is coated onto the capacitor element and a reaction layer is formed on the capacitor element. The polymerization step includes heating the reaction layer to form a polymer composite layer containing the polymer composite material, and the polymer composite material is polymerized from 3,4-ethylenedioxythiophene and polystyrene sulfonic acid and salts thereof.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• C08J 3/205 - Compounding polymers with additives, e.g. colouring in the presence of a liquid phase

Abstract

A winding type capacitor assembly with enhanced structural strength and a manufacturing method thereof are provided. The winding type capacitor assembly includes a positive conductive foil, a negative conductive foil, and at least one isolation element. The isolation element is disposed between the positive conductive foil and the negative conductive foil. A conductive polymer dispersed sol and an electrolyte filler are disposed between the positive conductive foil, the negative conductive foil, and the isolation element. The electrolyte filler is at least one selected from one of a conductive composition synthesized by a chemical polymerization method and a resin-blended conductive particle. The winding type capacitor assembly has enhanced structural strength through the use of the electrolyte filler.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

The present invention provides a device for manufacturing a multi-layer stacked structure and a method for manufacturing a thin film capacitor. The method includes providing a carrier substrate, forming a plurality of first material layers and a plurality of second layers that are alternately stacked on top of one another to form a multi-layer stacked structure, and then forming two terminal electrode structures for respectively enclosing two opposite side portions of the multi-layer stacked structure. One of the first material layer and the second material layer has a plurality of conductive particles randomly distributed therein. The conductive particles are heated to form a spherical structure or a sphere-like structure with low melting point and high surface energy at a temperature that is smaller than the degradation temperature of polymers. Therefore, the dielectric constant of the multi-layer stacked structure and the thin film capacitor can be increased.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• C23C 14/24 - Vacuum evaporation
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/33 - Thin- or thick-film capacitors
• C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
• H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups

Abstract

A low leakage electrolytic capacitor includes a winding-type capacitor element, a hybrid electrically conductive medium and a package body. The winding-type capacitor element includes an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil. The hybrid electrically conductive medium is impregnated in the winding-type capacitor element and includes an electrically conductive polymer, an auxiliary polymer, an ion liquid, and a carbon filler. The package body encloses the winding-type capacitor element and the hybrid electrically conductive medium.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• H01G 9/145 - Liquid electrolytic capacitors
• H01G 9/10 - Sealing, e.g. of lead-in wires

Abstract

The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.

IPC Classes  ?

• H01G 2/02 - Mountings
• H01G 9/08 - HousingEncapsulation
• H01G 9/008 - Terminals
• H01G 9/06 - Mounting in containers
• H01G 9/15 - Solid electrolytic capacitors

Abstract

The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

IPC Classes  ?

• H01G 9/08 - HousingEncapsulation
• H01G 4/33 - Thin- or thick-film capacitors
• H01G 2/10 - HousingEncapsulation
• H01G 2/12 - Protection against corrosion

Abstract

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.

IPC Classes  ?

• H01G 9/025 - Solid electrolytes
• H01G 9/042 - Electrodes characterised by the material
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• C08L 25/16 - Homopolymers or copolymers of alkyl-substituted styrenes
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• C08F 8/14 - Esterification
• H01G 9/012 - Terminals specially adapted for solid capacitors
• C08L 25/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Abstract

The present disclosure provides a stacked-type solid electrolytic capacitor package structure and a method of manufacturing the same. The capacitor package structure includes a capacitor unit, a solder unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors. Each first stacked capacitor includes a first positive portion and a first negative portion. The first positive portion has at least one first through hole. The first through holes of the first positive portions are in communication with each other to form a first communication hole. The solder unit includes a first connection solder for filling the first communication hole so as to connect the first positive portions with each other. The package unit includes a package body for enclosing the capacitor unit and the solder unit. The conductive unit includes a first conductive terminal and a second conductive terminal.

IPC Classes  ?

• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/10 - Sealing, e.g. of lead-in wires
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/08 - HousingEncapsulation

Abstract

The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.

IPC Classes  ?

• H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
• G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
• H01G 2/10 - HousingEncapsulation
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H01G 9/08 - HousingEncapsulation
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A capacitor detection system and an active-type pin-diverging module thereof are disclosed. The active-type pin-diverging module is applied to two conductive pins of a capacitor, and active-type pin-diverging module includes a base structure and a swingable structure. The swingable structure is swingably disposed on the base structure, and the swingable structure includes two swingable elements. The two conductive pins of the capacitor respectively pass through two through holes of a seat board, and each conductive pin has a lateral contact surface. The two swingable elements concurrently slidably contact the two lateral contact surfaces of the two conductive pins of the capacitor so as to diverge the two conductive pins of the capacitor, and the seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor.

IPC Classes  ?

• G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
• G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
• H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
• H01G 9/045 - Electrodes characterised by the material based on aluminium

Abstract

The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/08 - HousingEncapsulation
• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/025 - Solid electrolytes

Abstract

The instant disclosure relates to a stacked-type solid electrolytic capacitor capable of increasing welding effect and a manufacturing method of the same. The stacked-type solid electrolytic capacitor includes a plurality of solid electrolytic capacitor units, each of which has an anode part and a cathode part connected to the anode part, characterized in that the anode part is formed with at least one buffering via-hole in a welding area thereof. When each of the anode parts is compressed in a welding process, the volume of the corresponding buffering via-hole decreases accordingly. Therefore, the soldering performance of the anode part solid electrolytic capacitor is enhanced and the connection stability is increased.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/14 - Structural combinations for modifying, or compensating for, electric characteristics of electrolytic capacitors
• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 2/12 - Protection against corrosion

Abstract

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

IPC Classes  ?

• H05H 1/24 - Generating plasma
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/042 - Electrodes characterised by the material
• H01G 9/045 - Electrodes characterised by the material based on aluminium
• H01G 9/048 - Electrodes characterised by their structure
• C23C 16/00 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
• B82Y 40/00 - Manufacture or treatment of nanostructures

Abstract

The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.

IPC Classes  ?

• H01G 9/10 - Sealing, e.g. of lead-in wires
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/012 - Terminals specially adapted for solid capacitors
• H01G 9/14 - Structural combinations for modifying, or compensating for, electric characteristics of electrolytic capacitors

Abstract

A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.

IPC Classes  ?

• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/04 - Electrodes
• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/042 - Electrodes characterised by the material

Abstract

The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.

IPC Classes  ?

• H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
• H01G 9/055 - Etched foil electrodes
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support

Abstract

The instant disclosure relates to a solid electrolytic capacitor with improved metallic anode and a method for manufacturing the same. The solid electrolytic capacitor includes a substrate layer, a conductive polymer layer and an electrode layer. The substrate layer has a cathode portion and an anode portion having a smaller thickness than the cathode portion. The conductive polymer layer is formed to cover the cathode portion of the substrate layer. The electrode layer is formed to cover the conductive polymer layer. Therefore, the instant solid electrolytic capacitor can be applied to a packing process, and welding success yield rate can be improved.

IPC Classes  ?

• H01G 9/04 - Electrodes
• H01G 9/15 - Solid electrolytic capacitors
• H01G 9/045 - Electrodes characterised by the material based on aluminium
• H01G 9/048 - Electrodes characterised by their structure
• H01G 9/042 - Electrodes characterised by the material
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/052 - Sintered electrodes

Abstract

A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved.

IPC Classes  ?

• H01G 9/10 - Sealing, e.g. of lead-in wires
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/042 - Electrodes characterised by the material
• H01G 9/045 - Electrodes characterised by the material based on aluminium
• H01G 9/052 - Sintered electrodes
• H01G 9/15 - Solid electrolytic capacitors

Abstract

A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

IPC Classes  ?

• H01G 4/32 - Wound capacitors

Abstract

A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

IPC Classes  ?

• H01G 2/10 - HousingEncapsulation
• H01G 9/08 - HousingEncapsulation

Abstract

A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

IPC Classes  ?

• H01G 5/38 - Multiple capacitors, e.g. ganged

Abstract

A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

An insulating encapsulation structure is applied to a chip type solid electrolytic capacitor that includes an aluminum metallic body having an aluminum core layer. An upper oxide film and a lower oxide film respectively having fine holes on their surfaces are respectively formed on the top and the bottom of the aluminum core layer. On side surfaces of the metallic body is a plurality of cut burrs. The upper oxide film and the lower oxide film of the metallic body are respectively separated by a separating layer to form an anode and a cathode. The insulating encapsulation structure includes an insulating cover layer enclosing an outer surface of the metallic body to cover the cut burrs. Thereby, the required chemical conversion process is reduced along with current leakage, the overall manufacturing cost is lowered, and the mechanical strength for the edge of the metallic body is reinforced.

IPC Classes  ?

• H01G 9/08 - HousingEncapsulation

Abstract

A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.

IPC Classes  ?

• H01G 9/04 - Electrodes
• H01G 9/15 - Solid electrolytic capacitors
• H01G 4/228 - Terminals

Abstract

A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.

IPC Classes  ?

• H01G 4/228 - Terminals
• H01G 5/38 - Multiple capacitors, e.g. ganged
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

A stacked capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit has a positive electrode that has a positive pin extended outwards therefrom. The positive pins of the capacitor units are divided into a plurality of positive pin units that are separated from each other, and the positive pins of each positive pin unit are electrically stacked onto each other. Each capacitor unit has a negative electrode, and the negative electrodes of the capacitor units are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins of the capacitor units and a negative guiding substrate electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

IPC Classes  ?

• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 5/38 - Multiple capacitors, e.g. ganged
• H01G 4/30 - Stacked capacitors
• H01G 4/228 - Terminals

Goods & Services

Capacitors, resistors, static electicity eliminators, film switches, surge absorbers, photoelectric switches

Goods & Services

Capacitors, resistors, static electricity eliminators, film switches, surge absorbers, photoelectric switches

Goods & Services

Capacitors, resistors, varistors, static electricity eliminators, film switches, surge absorbers, photoelectric switches

Goods & Services

Capacitors, resistors, static electricity eliminators, film switches, surge absorbers, and photoelectric switches