A reception unit (34) receives, in regard to one or more materials preregistered as candidates for materials to be used in a product, a range of values for one or more parameters affecting a phenomenon occurring in the product; a calculation unit inputs, as explanatory variables, a plurality of values to a statistical model created based on results obtained by a simulation or an experiment on a value representing the phenomenon occurring in the product, the statistical model using a portion of a plurality of parameters affecting the phenomenon as explanatory variables and using the results as response variables, and that calculates estimates for the value representing the phenomenon occurring in the product which correspond to each of the plurality of values; and a display control unit performs control to display an image in which the calculated estimates are correlated with each of the plurality of values.
A metal-clad laminate or the like can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured using a laser displacement meter is 400 μm or more, and an average value of absolute values of differences between a maximum value and a minimum value of thicknesses is 20 μm or less.
A design assistance device acquires a recommended design parameter group by optimizing a target-oriented acquisition function constructed using a prediction model that predicts an observation value of a characteristic item, acquires an n-th observation value probability distribution by inputting an n-th (n is an integer of 1 to (K−1)) recommended design parameter group to the prediction model, acquires an n-th conditional expected value based on the n-th observation value probability distribution, reconstructs each prediction model based on first to n-th predicted performance data including first to n-th recommended design parameter groups and the conditional expected value, reconstructs the target-oriented acquisition function based on the prediction model, acquires an (n+1)th recommended design parameter group by optimizing the target-oriented acquisition function, and outputs sequentially acquired first to K-th recommended design parameter groups.
An objective of the present invention is to provide a SiC epitaxial wafer with a large diameter, a thin thickness, and few triangular defects. A SiC epitaxial wafer includes a SiC substrate and a SiC epitaxial layer. The SiC substrate has a diameter of 195 mm or more and a thickness of 460 μm or less. The SiC epitaxial layer has a triangular defect density of 0.2 pieces/cm2 or less.
C30B 25/20 - Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
A polishing liquid contains abrasive grains; an ether compound having at least one selected from the group consisting of a carboxy group and a carboxylate group; and water. A polishing liquid set contains constituent components of the polishing liquid separately stored in a first liquid and a second liquid, in which the first liquid contains abrasive grains and water, and the second liquid contains an ether compound having at least one selected from the group consisting of a carboxy group and a carboxylate group and water. A polishing method includes a step of polishing a surface to be polished containing silicon oxide using the polishing liquid.
A vehicular back door includes a first panel formed from resin, a second panel formed from resin, an adhesive disposed at a join face of the first panel, and a protrusion that is provided at a join face of the second panel, that protrudes toward the join face of the first panel, and that contacts the adhesive.
One embodiment of the present invention relates to an organic electronic material comprising a charge-transporting branched polymer including a structural unit having a spirofluorene structure.
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
H10K 30/60 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation in which radiation controls flow of current through the devices, e.g. photoresistors
H10K 30/86 - Layers having high hole mobility, e.g. hole-transporting layers or electron-blocking layers
To provide a metal-clad laminate or the like which can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured according to the following method using a laser displacement meter is 400 μm or more, and a value calculated from the following formula (1) is 0.70% or less:
To provide a metal-clad laminate or the like which can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured according to the following method using a laser displacement meter is 400 μm or more, and a value calculated from the following formula (1) is 0.70% or less:
(
average
value
of
standard
deviation
of
thickness
obtain
ed
b
y
the
following
method
)
×
100
/
average
thickness
of
metal
-
clad
laminate
)
(
1
)
To provide a metal-clad laminate or the like which can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured according to the following method using a laser displacement meter is 400 μm or more, and a value calculated from the following formula (1) is 0.70% or less:
(
average
value
of
standard
deviation
of
thickness
obtain
ed
b
y
the
following
method
)
×
100
/
average
thickness
of
metal
-
clad
laminate
)
(
1
)
(Method for measuring thickness of metal-clad laminate)
To provide a metal-clad laminate or the like which can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured according to the following method using a laser displacement meter is 400 μm or more, and a value calculated from the following formula (1) is 0.70% or less:
(
average
value
of
standard
deviation
of
thickness
obtain
ed
b
y
the
following
method
)
×
100
/
average
thickness
of
metal
-
clad
laminate
)
(
1
)
(Method for measuring thickness of metal-clad laminate)
The thickness is measured by cutting out four measurement substrates each having a size of 60 mm (vertical)×60 mm (horizontal) in a plane direction from an arbitrary portion of the metal-clad laminate. Measurements are carried out at intervals of 1 mm on two diagonal lines, with the starting point and the ending point of the measurement not located at the ends of the metal-clad laminate. For each of the four measurement substrates, a standard deviation is obtained from the measured thicknesses at all the points, and then an average value of the standard deviations of the thicknesses of each of the four measurement substrates is obtained. Further, the average thickness of all the points measured for the four measurement substrates is calculated, and this is taken as the average thickness of the metal-clad laminate. Details are as described in the description herein.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
9.
DATA STRUCTURE INFORMATION GENERATION DEVICE, DATA EXTRACTION DEVICE, DATA EXTRACTION SYSTEM, DATA STRUCTURE INFORMATION GENERATION METHOD, AND DATA EXTRACTION METHOD
Provided is a data structure information generation device for generating, by using a large-scale language model for processing according to a prompt, data structure information in which pieces of position information about keys and values included in a table portion of data described in a table format is designated in a text format. The device comprises: an input reception unit for receiving an input of the table portion of the data described in the table format; a proposal unit for proposing, to an operator, candidates of the keys and the values analyzed from the table portion; an instruction reception unit for receiving, from the operator, an instruction for correcting or confirming the candidates of the keys and the values; a range designation reception unit for receiving, from the operator, designation of a range of the table portion in the data described in the table format; a data structure information generation unit for generating the data structure information on the basis of the confirmed keys and values and the designation of the range of the table portion; and a presentation unit for presenting the generated data structure information to the operator.
This method for producing alumina particles comprises subjecting a liquid mixture that contains a dispersion medium and surface-treated alumina particles that are at least partially aggregated to a wet crushing treatment and subjecting the liquid mixture that has been subjected to the wet crushing treatment to a wet sorting treatment. This method for producing a resin composition comprises mixing a resin with alumina particles obtained through the aforementioned production method.
A structured data creation assistance device assists with creation of structured data by using a large language model which performs processing according to a prompt. The device includes: a prompt generation unit that generates a prompt including a structured data rule, an instruction sentence, and table data; an answer reception unit that causes the large language model to perform processing according to the prompt and that receives an answer generated by the large language model; and an output unit that, according to the answer, outputs a proposal for improving the table data.
A conductive adhesive film including an adhesive layer located at an adherend side, and a base material layer, in which a surface resistivity at 140° C. of the conductive adhesive film at a side opposite to an adhesive layer side is from 1×107Ω/□ to 1×1012Ω/□.
A composition containing a (meth)acrylic polymer having (meth)acryloyl groups at both ends of a poly(meth)acrylate chain, and metal particles. An article including a heat source and a cured product of the composition containing a (meth)acrylic polymer and metal particles, wherein the cured product is in thermal contact with the heat source.
An information processing device is configured to perform inference by artificial intelligence in a container that is a virtual environment constructed by a container virtualization technology, and includes a build unit configured to build a container image of an operating environment of software that causes the information processing device to perform a screen display, a database operation, and inference by artificial intelligence; and an operation unit configured to perform the screen display, the database operation, and an operation of the inference by the artificial intelligence in the container reproduced by a launch of the container image.
Provided is a laminate excellent in thermal durability and a method for manufacturing a laminate. A laminate includes, in this order: a first resin layer (31); a first conductive layer (32); an insulating layer (33); and a second conductive layer (34). The first resin layer includes an accommodation portion, and the first conductive layer is disposed in the accommodation portion. An adhesive layer (35) is provided between the first conductive layer and the insulating layer, and/or between the insulating layer and the second conductive layer. The adhesive layer contains a solid joining agent containing, as a main component, an amorphous thermoplastic resin including at least one selected from a thermoplastic epoxy resin and a phenoxy resin. The amorphous thermoplastic resin has an epoxy equivalent of 1600 or more or is free of an epoxy group, and has a heat of fusion of 15 J/g or less.
B32B 37/04 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/16 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
An adhesive composition contains a (meth)acrylic resin (A), a photopolymerization initiator (B), and a crosslinking agent (C), wherein the (meth)acrylic resin (A) contains structural units of formulas (2) and (3). In formula (2), R3 represents hydrogen or a methyl group, and R4 represents a group having a hydroxy group on a first carbon atom and having, on a second carbon atom adjacent to the first carbon atom, a residue removed of a hydrogen atom from a carboxy group of an unsaturated monocarboxylic acid. In formula (3), R5 represents hydrogen or a methyl group, and R6 represents a group having, on a first carbon atom, a residue removed of a hydrogen atom from a carboxy group of an unsaturated monocarboxylic acid and having, on a second carbon atom adjacent to the first carbon atom, a residue removed of a hydrogen atom from a carboxy group of an unsaturated monocarboxylic acid.
A photosensitive resin composition which contains a copolymer (A-1), a copolymer (A-2), a photopolymerization initiator (C), and a solvent (D), wherein: the copolymer (A-1) contains a constituent unit (a) having a hydroxy group and a blocked isocyanate group, a constituent unit (b) having a nitrogen atom, and a constituent unit (c) having an acid group; and the unsaturated group equivalent of the copolymer (A-2) is 30-3,000 g/mol.
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
C08F 290/12 - Polymers provided for in subclasses or
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
18.
LUBRICANT SELECTION SYSTEM, LUBRICANT SELECTION METHOD, LUBRICANT SELECTION PROGRAM, LUBRICANT, AND COMPOSITE MATERIAL
A lubricant that suppresses an influence on the battery performance of a lithium-ion battery is selected. A lubricant selection system selects a lubricant to be added to a resin film of a composite material used as an exterior material of a lithium-ion battery. The lubricant selection system includes a first calculation unit configured to calculate a solvation energy between a lubricant candidate and a lithium cation; a second calculation unit configured to calculate a distance between the resin film and the lubricant candidate in an interaction space; and a prediction unit configured to predict a degree of influence of the lubricant candidate on battery performance of the lithium-ion battery based on the solvation energy calculated by the first calculation unit and the distance calculated by the second calculation unit.
C10M 171/00 - Lubricating compositions characterised by purely physical criteria, e.g. containing as base-material, thickener or additive, ingredients which are characterised exclusively by their numerically specified physical properties, i.e. containing ingredients which are physically well defined but for which the chemical nature is either unspecified or only very vaguely indicated
An objective of the present invention is to provide a SiC epitaxial wafer with a large diameter, a thin thickness, and high carrier concentration uniformity. A SiC epitaxial wafer includes a SiC substrate and a SiC epitaxial layer. The SiC substrate has a diameter of 195 mm or more and a thickness of 460 μm or less. The SiC epitaxial layer has a carrier concentration variation of 20% or less.
C30B 25/20 - Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
This photosensitive resin composition contains a copolymer (A-1), a copolymer (A-2), a photopolymerization initiator (C), and a solvent (D). The copolymer (A-1) contains a hydroxy group, a structural unit (a) having a block isocyanate group, a structural unit (b) having a partial structure represented by formula (1), and a structural unit (c) having an acid group. The unsaturated group equivalent of the copolymer (A-2) is 30-3000 g/mol. Formula (1): -(R1n1n1- (In formula (1), R1is a divalent hydrocarbon group, and n1 is an integer of 2-20.)
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
21.
PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, AND IMAGE DISPLAY ELEMENT
This photosensitive resin composition contains a copolymer (A), a photopolymerization initiator (C), and a solvent (D). The copolymer (A) contains a structural unit (a) having a block isocyanate group and a structural unit (b) having a partial structure represented by formula (1). The hydroxyl equivalent of the copolymer (A) is 100-5000 g/mol, the acid value of the copolymer (A) is 5-400 KOH mg/g, and the unsaturated group equivalent of the copolymer (A) is 30-3000 g/mol. Formula (1): -(R1n1n1- (In formula (1), R1 is a divalent hydrocarbon group, and n1 is an integer of 2-20.)
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
22.
PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, AND IMAGE DISPLAY ELEMENT
A photosensitive resin composition which contains a copolymer (A), a photopolymerization initiator (C), and a solvent (D), wherein: the copolymer (A) contains a constituent unit (a) having a blocked isocyanato group and a constituent unit (b) having a nitrogen atom; the hydroxyl equivalent of the copolymer (A) is 100-5,000 g/mol; the acid value of the copolymer (A) is 5-400 KOHmg/g; and the unsaturated group equivalent of the copolymer (A) is 30-4,500 g/mol.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
23.
METHOD FOR PRODUCING PRINTED WIRING BOARD, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
The present invention provides a method for producing a printed wiring board that exhibits high adhesive strength with plated copper while reducing surface roughness of an interlayer insulating layer, provides a photosensitive resin composition and a photosensitive resin film that can provide the printed wiring board, and provides the printed wiring board obtained by the method for producing the printed wiring board and a semiconductor package having the printed wiring board. The method for producing the printed wiring board is a method for producing the printed wiring board, the method including the following (1) to (4). (1): Laminating a photosensitive resin film containing particles (X) that dissolve 95% by mass or more in an aqueous sulfuric acid solution having a concentration of 5 to 100 ml/L under conditions of 70° C. for 20 minutes onto one or both sides of a circuit board. (2) Forming an interlayer insulating layer having a via by exposing and developing the photosensitive resin film laminated in the (1). (3-1) Performing roughening treatment on surfaces of the via and the interlayer insulating layer. (3-2) Dissolving the particles (X) present on the surface of the interlayer insulating layer by treating the interlayer insulating layer subjected to the roughening treatment with an acidic solution. (4) Forming a circuit pattern on the interlayer insulating layer.
The present invention relates to a resin composition containing (A) one or more selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups, and derivatives of the maleimide resins and (B) a phosphate ester compound containing two or more phosphorus atoms, in which the group connecting at least two phosphorus atoms contains two or more aromatic rings, a prepreg, a laminated plate, a resin film, a printed wiring board and a semiconductor package, using the resin composition.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
The present invention relates to a prepreg containing a thermosetting resin composition and a fiber base material, in which the prepreg has one surface and other surface opposite to the one surface, and in a direction from at least any surface of the one surface and the other surface as a starting point toward the surface opposite to the surface serving as the starting point, the prepreg has, in the following order, a first region that configures the surface of the prepreg serving as the starting point and is a region containing a thermosetting resin composition, and a second region that is a region containing a thermosetting resin composition different from the thermosetting resin composition contained in the first region, and a storage elastic modulus E′(1) at 260° C. of a cured product of the thermosetting resin composition contained in the first region is lower than a storage elastic modulus E′(2) at 260° C. of a cured product of the thermosetting resin composition contained in the second region.
A method for manufacturing a semiconductor device, which includes heating and pressurizing a laminate including a first circuit member, a second circuit member, and a thermosetting adhesive layer by pressing members to form a temporary pressure-bonded body; and heating the temporary pressure-bonded body in a pressurizing atmosphere to form a connected body. The first circuit member may be a semiconductor chip. The laminate is pressurized by pressing members at a predetermined pressure of 1.50 MPa or less. For a part or the whole of the time for which the laminate is heated and pressurized by pressing members, at least one of the pressing members is heated to a temporary pressure bonding temperature that is equal to or higher than the onset temperature of the thermosetting adhesive layer.
FILM-SHAPED ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-SHAPED ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
A film-shaped adhesive for semiconductors having: a first adhesive region that does not include a flux compound; and a second adhesive region including a flux compound, along the thickness direction, in which the first adhesive region includes a first epoxy resin, a first imidazole-based curing agent, and a (meth)acrylic compound, and the second adhesive region includes a second epoxy resin, a second imidazole-based curing agent, and a flux compound.
A slurry containing abrasive grains and water, in which the abrasive grains include cerium oxide particles, and at a peak P of a maximum intensity in a range of a diffraction angle 2θ=27.000 to 29.980 deg in an X-ray diffraction pattern of the cerium oxide particles, a ratio Wa/Wb of a peak line width Wa at an intensity of 10% of the maximum intensity and a peak line width Wb at an intensity of 50% of the maximum intensity is 2.50 to 3.30.
A polishing liquid for CMP, the polishing liquid containing abrasive grains, a nitrogen-containing compound having an aromatic ring, and water, in which the abrasive grains include cerium-based particles, and the abrasive grains have a negative zeta potential. A polishing method including a step of polishing a surface to be polished using the polishing liquid for CMP.
C09G 1/02 - Polishing compositions containing abrasives or grinding agents
B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
C09K 13/00 - Etching, surface-brightening or pickling compositions
30.
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT ELEMENT
A method for producing a semiconductor device is disclosed. A method for producing a semiconductor device includes preparing a multilayer body including a semiconductor base material, an electrode disposed on a main surface of the semiconductor base material, and an organic insulating film disposed on the main surface and containing a resin material that exhibits curability; curing the organic insulating film; cutting the multilayer body along a planned cutting line to acquire at least one integrated circuit element; and bonding the acquired integrated circuit element to another integrated circuit element. The method for producing the semiconductor device includes removing at least a part of the planned cutting portion corresponding to the planned cutting line in the organic insulating film before the curing of the organic insulating film.
A novel method for manufacturing a wiring structure includes: forming a conductor layer by two-stage electrolytic plating on a substrate having a main surface where a first concave portion and a second concave portion are formed, a minimum width of a first bottom surface being larger than a minimum width of a second bottom surface. This method includes: forming a temporary protective layer having a pattern including an opening through which at least a part of a first bottom surface is exposed; forming a first metal plating layer on the first bottom surface; removing the temporary protective layer to expose a second concave portion; and forming a second metal plating layer including a portion configured to fill the second concave portion and a portion provided on the first metal plating layer, thereby forming a conductor layer including the first metal plating layer and the second metal plating layer.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
32.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
A photosensitive resin composition of one aspect of the present disclosure is a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a structural unit derived from an acrylic acid and a structural unit derived from styrene or a styrene derivative, and an absorbance of the photosensitive resin composition per 1 μm of thickness with respect to light having a wavelength of 365 nm is 0.0030 to 0.0120.
G03F 7/031 - Organic compounds not covered by group
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The present invention provides a resin composition and the like having excellent high-frequency characteristics, while exhibiting high adhesion to conductors and high heat resistance. The resin composition specifically contains a thermosetting resin (A), and a thermoplastic resin (B), in which the thermoplastic resin (B) contains a block copolymer (B1) including a block (b1) that contains a structural unit derived from an aromatic hydrocarbon compound, and a block (b2) that contains a structural unit derived from a conjugated diene compound, the component (B1) does not contain a diblock copolymer, or when the component (B1) contains a diblock copolymer, the content thereof is 50% by mass or less in the component (B1), and the weight-average molecular weight of the component (B1) is 130,000 or less.
As an example of a method for manufacturing a semiconductor device, four semiconductor wafers 40, 50, 60, and 70 are prepared. In this manufacturing method, the semiconductor wafer 40 and the semiconductor wafer 50 are bonded to each other by hybrid bonding to fabricate a stacked wafer 100. Similarly, the semiconductor wafer 60 and the semiconductor wafer 70 are bonded to each other by hybrid bonding to fabricate another stacked wafer 110. Thereafter, the stacked wafer 100 and the other stacked wafer 110 are further bonded to each other by hybrid bonding to fabricate a stacked wafer 120. According to this method, the process can be shortened as compared with a case of sequentially stacking layers one by one, and an effect of shortening the process is remarkable particularly when the number of stacked layers is large.
A compound contains a metal powder, and a resin composition. The metal powder is a soft magnetic material. The resin composition contains a thermosetting resin. The compound powder contains a plurality of large particles with a particle diameter of greater than 500 μm. A content of the large particles in the compound powder is 40% by mass or more and 100% by mass or less. At least a part of the plurality of large particles includes at least one metal particle constituting the metal powder, and the resin composition covering the metal particle.
A multifunctional vinylbenzyl compound is obtained by a reaction between a compound having an aromatic condensed ring, a compound having a biphenylene group, and a compound having a vinylbenzyl group. Further, a resin composition, a prepreg, a resin film, a metal-clad laminate, a printed wiring board, and a semiconductor package are obtained using the multifunctional vinylbenzyl compound.
C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex and (meth)acrylamide having a heterocyclic ring. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains at least one selected from the group consisting of a metal halide salt and a compound having a thiocarbonyl thio structure.
A trained model is trained using training data in which a material composition of a material to be trained, and a phase ratio of the material to be trained at each temperature within a specific temperature range, are associated with each other. An analysis device includes generating a material composition of intermediate materials, by dividing between the material composition of the material to be predicted and a material composition of a baseline material, partially differentiating a value predicted for a specified phase at each temperature, when predicting a phase ratio of the intermediate materials at each temperature within the specific temperature range, by inputting the material composition of the intermediate materials to the model, integrating the calculated partial derivative for each component included in the material composition of the intermediate materials at each temperature, and displaying a heat map in a display mode corresponding to an integral gradient.
A method for producing a chemical product according to the present disclosure includes pyrolyzing a plastic-containing raw material in a steam atmosphere.
C07C 4/22 - Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms by depolymerisation to the original monomer, e.g. dicyclopentadiene to cyclopentadiene
C08J 11/14 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with steam or water
40.
REACTION INDEX CALCULATION DEVICE, MANUFACTURING METHOD, REACTION INDEX CALCULATION METHOD, AND REACTION INDEX CALCULATION PROGRAM
The present invention reduces workload when optimizing a polymer mixture. This reaction index calculation device comprises: a molecular dynamics calculation unit that calculates molecular dynamics in a system comprising a mixture of a first model and a second model, which are models of a first compound and a second compound constituting polymer mixtures; an existence probability calculation unit that calculates, during the molecular dynamics calculation, using a radial distribution function, a probability of existence at each interatomic distance for two atoms involved in the reaction between the first compound and the second compound; a sum total calculation unit that calculates a sum total up to the first peak in the calculated probability of existence, as a first index value indicating reactivity when the first compound and the second compound are mixed; and a first output unit that, when the first index value indicating the reactivity is calculated for a plurality of combinations of the first compound and the second compound, outputs the first index value in association with each combination.
G16C 20/10 - Analysis or design of chemical reactions, syntheses or processes
G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
41.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE
Provided is a photosensitive resin composition containing: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent; and (B) at least one selected from the group consisting of silane coupling agents having a (meth)acryloyl group and an alkoxysilyl group, and components derived from said silane coupling agents. Also provided are a photosensitive resin film using said photosensitive resin composition, a printed wiring board, a production method therefor, and a semiconductor package.
Provided is a photosensitive resin composition containing: (A) a photopolymerizable compound having an ethylenically unsaturated group, and an acidic substituent; (B) a compound having an ethylenically unsaturated group, and an isocyanurate ring or glycoluril ring; and (C) a maleimide resin having two or more N-substituted maleimide groups, and a group including a condensed ring composed of an aromatic ring and aliphatic ring. Also provided are a photosensitive resin film using said photosensitive resin composition, a printed wiring board, a production method therefor, and a semiconductor package.
Provided is a binder polymer which is a polymer of a monomer having an ethylenically unsaturated bond, wherein the monomer contains a styrene compound and an alkyl (meth) acrylate that satisfies the following conditions A or B. Condition A: a methacrylate having an alkyl group having 8-14 carbon atoms. Condition B: an acrylate or a methacrylate having an alkyl group having 15 or more carbon atoms.
Provided is a binder polymer which is a polymer of a monomer having an ethylenically unsaturated bond, wherein the monomer contains a styrene compound and an alkyl (meth) acrylate having an SP value of 9.1 or less.
The present invention provides an SiC composite substrate, an SiC epitaxial wafer, and a method for manufacturing an SiC epitaxial wafer with which it is possible, in a CVD process, to inhibit the occurrence of warpage caused by a stress difference and to inhibit pasted substrates from peeling off from each other. This invention includes a first layer and a second layer formed from an α-SiC single crystal and pasted together with a first main surface of the first layer. The first layer includes a first crystal part formed from an α-SiC single crystal or an α-SiC quasi-single crystal, and a second crystal part formed from β-SiC crystals. With respect to the total area of the first main surface, the area ratio of the first crystal part is 50% or more, and the area ratio of the second crystal part is 10% or less.
The present invention addresses the problem of providing a diluent with which the elastic modulus of a cured product after photocuring can be adjusted in a curing system in which photocuring and thermal curing can be performed in combination. The present invention contains a mixture that: contains a compound (A) containing one or more isocyanate groups and one or more ethylenically unsaturated groups, and a carboxylic acid anhydride (B) containing an ethylenically unsaturated group; and contains 0.001 to 10 mass% of the carboxylic acid anhydride (B) with respect to the total 100 mass% of the compound (A) and the carboxylic acid anhydride (B).
In this cooling device, a first member formed of a metal and a second member formed of a metal of a type different from that of the first member are joined by irradiating the first member with laser light in a state where the first member and the second member are overlapped. The second member has, on a surface thereof overlapping and contacting the first member, a recessed part recessed so as to be separated from the first member. A portion of the first member opposing the recessed part is melted and enters the recessed part, and is melted and joined to a portion of the second member around the recessed part.
Provided is a method for producing a high-purity ethylenic isocyanate compound, in which (meth)acrylic anhydride is suppressed. Provided is a method for producing a purified ethylenic isocyanate composition from a crude ethylenic isocyanate composition, wherein an alcohol is added to the crude ethylenic isocyanate composition, and the purified ethylenic isocyanate composition contains a (meth)acrylic acid ester compound which has an isocyanate group, and 0.2 mass% or less of an acid anhydride. Also provided is an ethylenic isocyanate composition which contains an ethylenic isocyanate compound and 0.2 mass% or less of an acid anhydride.
This semiconductor device comprises: a heat sink having a flat plate-shaped part and fins protruding from the flat plate-shaped part; an insulating substrate metal-bonded to one surface of the flat plate-shaped part of the heat sink; a semiconductor element metal-bonded to the insulating substrate; a holding member bonded to a surface of the flat plate-shaped part of the heat sink opposite to the one surface by being irradiated with laser light, the holding member holding the heat sink; and a sealing resin part covering at least the insulating substrate, the semiconductor element, and a region of the one surface of the flat plate-shaped part corresponding to a region to which the holding member is bonded. The thickness of the flat plate-shaped part of the heat sink is greater in the region to which the holding member is bonded than in a region provided with the fins.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
50.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD AND PRODUCTION METHOD FOR SAME, AND SEMICONDUCTOR PACKAGE
Provided is a photosensitive resin composition that contains (A) a photopolymerizable compound that has an ethylenically unsaturated group and an acidic substituent, (B) at least one of a silane coupling agent that has a (meth)acryloyl group and an alkoxysilyl group and a component derived from a silane coupling agent that has a (meth)acryloyl group and an alkoxysilyl group, (C) a thermosetting resin, and (D) an organic peroxide, the (C) thermosetting resin containing at least one of a maleimide resin and an allyl resin. Also provided are a photosensitive resin film that uses the photosensitive resin composition, a printed wiring board and a production method for the printed wiring board, and a semiconductor package.
A method for producing a solid raw material, said method involving: preparing a shredding system comprising a shredder that has a raw material reception port, a cutting blade, and a shredded matter discharge port, and a magnetic separator disposed on the downstream side of the shredder; introducing organic waste into the raw material reception port of the shredding system; shredding the organic waste with the cutting blade to generate shredded matter; separating the shredded matter discharged from the shredded matter discharge port into non-magnetic matter and magnetic matter that contains flammable matter by means of the magnetic separator; and immersing the magnetic matter in water.
This temporary fixing film comprises a thermosetting component and an antioxidant, wherein: the thermosetting component contains (A) a hydrocarbon resin having a monomer unit derived from styrene; and the antioxidant contains (D-a) a hindered phenolic antioxidant and (D-b) a thioether-based antioxidant having an aromatic ring, or (D-c) a hindered phenolic antioxidant having a thioether bond.
C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers
A method for operating a chemical product production device according to the present disclosure comprises, in a chemical product production device equipped with a reaction furnace 1, a filler 2 packed inside the reaction furnace 1, a raw material supply part 3 for supplying a raw material M to the interior of the reaction furnace 1, an inert gas supply part 4 for supplying an inert gas G to the interior of the reaction furnace 1, a heating part 5 for heating the filler 2, and a retrieval part 6 for retrieving a chemical product R from the reaction furnace 1: (Sa1) supplying the inert gas G to the interior of the reaction furnace 1 by using the inert gas supply part 4; (Sa2) supplying the raw material M by using the raw material supply part 3 while heating the reaction furnace by using the heating part 5; (Sa3) retrieving the chemical product R produced from the raw material M from the interior of the reaction furnace 1 by using the retrieval part 6; and (Sa4) heating the filler 2 to 400-720°C by using the heating unit 5 after (Sa3).
C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
B01J 8/26 - Chemical or physical processes in general, conducted in the presence of fluids and solid particlesApparatus for such processes with fluidised particles according to "fluidised-bed" technique with two or more fluidised beds, e.g. reactor and regeneration installations
C07C 4/22 - Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms by depolymerisation to the original monomer, e.g. dicyclopentadiene to cyclopentadiene
The purpose of the present invention is to provide an inexpensive method for producing N-vinylacetamide without material loss. This method for producing N-vinylacetamide by using acetamide and vinyl acetate as raw materials and using a catalyst is characterized by including, in the following order, a step for synthesizing N-vinylacetamide, a step for distilling off a residual low boiling-point substance, a step for extracting N-vinylacetamide, a step for distilling off aldehydes from the residue after separation of the N-vinylacetamide, a step for adding an alkali to the residue after distillation, a purification step for separating out the catalyst, and a step for drying the recovered catalyst.
C07C 233/05 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having nitrogen atoms of carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals with carbon atoms of carboxamide groups bound to carbon atoms of an acyclic saturated carbon skeleton having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
[Problem] To provide a refinement method for producing refined N-vinyl carboxylic acid amides that exhibit good polymerization properties even if a conventional refinement step is used without a hydrogenation step. [Solution] A method of producing a refined N-vinyl carboxylic acid amide from a crude N-vinyl carboxylic acid amide, said method being characterized by including a distillation step and a crystallization step.
C07C 231/08 - Preparation of carboxylic acid amides from amides by reaction at nitrogen atoms of carboxamide groups
C07C 233/05 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having nitrogen atoms of carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals with carbon atoms of carboxamide groups bound to carbon atoms of an acyclic saturated carbon skeleton having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
56.
DECOMPOSITION DEVICE, DECOMPOSITION METHOD, AND METHOD FOR PRODUCING HYDROCARBON COMPOUND
One embodiment of a decomposition device according to the present disclosure comprises: a reaction furnace; a processing target supply unit that supplies a processing target to the inside of the reaction furnace; a steam generation unit that generates steam; a steam supply unit that is connected to the reaction furnace and the steam generation unit; and a gas-liquid discharge unit that discharges at least one of a gas and a liquid inside the reaction furnace to the outside of the reaction furnace.
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
C08J 11/14 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with steam or water
C10B 53/07 - Destructive distillation, specially adapted for particular solid raw materials or solid raw materials in special form of synthetic polymeric materials, e.g. tyres
57.
DECOMPOSITION DEVICE, METHOD FOR OPERATING DECOMPOSITION DEVICE, METHOD FOR REGENERATING DECOMPOSITION DEVICE, AND METHOD FOR PRODUCING HYDROCARBON COMPOUND
One aspect of a decomposition device according to the present disclosure comprises: a reaction furnace which has a lower member and an upper member that has a supply part for supplying an object to be processed to the inside of the reaction furnace; a filler layer which is disposed inside the reaction furnace; a heating part which is disposed outside or inside the reaction furnace and heats the filler layer; a through hole which is disposed at the bottom of the lower member of the reaction furnace; and a gap which is formed between the lower member and the upper member.
C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
58.
RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCT OF COMPOSITE MATERIAL
This resin composition comprises: a vinyl ester resin (A) having an epoxy group and having an acid value of less than 1 KOHmg/g; at least one monomer (B) selected from radically polymerizable monomers and epoxy monomers; at least one component (C) selected from benzoic acid and benzoic acid derivatives; and a thickening component (D). In the resin composition, the content ratio of the component (C) to the component (D) ([at least one component selected from benzoic acid and benzoic acid derivatives]/[thickening component]) is more than 0.5 and 6.0 or less in terms of mass ratio.
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
59.
RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCT OF COMPOSITE MATERIAL
Provided is a resin composition containing: a vinyl ester resin (A) having an epoxy group and an acid value of less than 1 KOHmg/g; at least one type of monomer (B) selected from radical-polymerizable monomers and epoxy monomers and excluding methacrylic acid; methacrylic acid (C); and a thickening component (D). In the resin composition, the content ratio of component (C) to component (D) ([methacrylic acid]/[thickening component]) in terms of a mass ratio is 0.5-4.5.
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
Provided is a hexagonal boron nitride filler containing: hexagonal boron nitride particles; and a film (a) including a compound (A) that has a polyethyleneimine skeleton and a polyalkylene oxide chain and that has a weight-average molecular weight of 2,000-10,000.
Provided is a learning device that generates a machine learning model for predicting impact strength of a polymer composite material, the learning device comprising: a first learning unit that causes a first machine learning model to learn correspondence between material information and transition temperatures of brittle fracture and ductile fracture of a polymer composite material to be learned; a first prediction unit that outputs a predicted transition temperature of the polymer composite material to be learned by inputting the material information of the polymer composite material to be learned into the trained first machine learning model; and a second learning unit that causes a second machine learning model for predicting impact strength of a polymer composite material to be predicted to learn correspondence between the material information of the polymer composite material to be learned and the predicted transition temperature, and the impact strength.
G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
One embodiment of the present invention relates to a charge transport material containing: an ionic compound containing a cation including at least one structure selected from the group consisting of a pyridine ring, a quinoline ring, an isoquinoline ring, and an acridine ring; and a charge transport polymer having a polymerizable functional group.
H10K 30/30 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
H10K 30/60 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation in which radiation controls flow of current through the devices, e.g. photoresistors
H10K 30/86 - Layers having high hole mobility, e.g. hole-transporting layers or electron-blocking layers
H10K 71/12 - Deposition of organic active material using liquid deposition, e.g. spin coating
A prediction system according to the present invention: acquires operation data for each of a plurality of past operation cycles and a target operation cycle of a chemical processing apparatus; for each of the plurality of past operation cycles and the target operation cycle, generates a first mathematical model on the basis of the operation data, and acquires a coefficient for each of the operation cycles from the first mathematical model; selects one or more past operation cycles that each have a coefficient satisfying a selection condition which is set on the basis of the coefficient of the target operation cycle; generates a second mathematical model on the basis of the group of operation data of the one or more selected past operation cycles and the target operation cycle; and inputs, to the second mathematical model, an operation condition at a time that is later than any time indicated in the operation data of the target operation cycle, and predicts a state in the target operation cycle at said later time.
Provided is a resin composition that exhibits excellent flame retardancy and that reduces the minimum melt viscosity of a prepreg. Also provided are a prepreg, a resin film, a laminate, a printed wiring board, and a semiconductor package, which are produced using the resin composition. Specifically, the resin composition contains (A) a thermosetting resin, (X) a metal phosphate, and (Y) a phosphazene compound.
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 3/016 - Flame-proofing or flame-retarding additives
Provided is a binder polymer which is a polymer of a monomer having an ethylenically unsaturated bond, wherein the monomer contains a styrene compound and an alkyl (meth)acrylate, and the swelling ratio with respect to ethylene carbonate is 6% or less.
Provided is a thermosetting resin composition capable of suppressing the occurrence of molding defects in an insulating layer. The present invention also provides a prepreg, a resin film, a laminate, a laminate plate, a printed wiring board, and a semiconductor package that are obtained using the thermosetting resin composition. Specifically, the thermosetting resin composition contains (A) a maleimide compound and (B) an inorganic filler having a volume-average particle size of 2.5 μm or more.
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is a prepreg capable of suppressing the occurrence of molding defects in an insulating layer. Further provided are a cured product of a prepreg obtainable using the prepreg, a laminate, a printed wiring board, and a semiconductor package. Specifically, the prepreg contains a fiber base material, and a thermosetting resin composition or a semi-cured product of the thermosetting resin composition. The thermosetting resin composition contains (B) an inorganic filler having a volume average particle diameter of 2.0 μm or more. The thermosetting resin composition or the semi-cured product of the thermosetting resin composition protrudes from the surface of the fiber base material, and the thickness of the layer of the thermosetting resin composition or the semi-cured product of the thermosetting resin composition protruding from the surface of the fiber base material is 10 μm or more.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08K 3/013 - Fillers, pigments or reinforcing additives
G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
A method for manufacturing a circuit connection structure includes: disposing a circuit connection material including a solder connection material and an adhesive on a surface of a first circuit member having the first electrode; disposing a second circuit member having a second electrode on the first circuit member thermally compressing the first and the second circuit member at a temperature equal to or higher than a melting point of the solder connection material in a state in which the solder connection material is interposed between the first and the second electrode; and cooling while applying a pressure between the first and the second electrode until a temperature between the first and the second electrode becomes a temperature equal to or lower than the above melting point from a temperature equal to or higher than the above melting point.
A method of manufacturing a wiring structure by a novel wiring forming method includes forming a trench including a bottom surface including a surface of a substrate and a wall surface including a surface of a resist layer, forming a seed layer including an in-trench seed portion continuously formed from a position on the bottom surface to a position on the wall surface in the trench, forming a metal plating layer on the seed layer, the metal plating layer including a filling plating portion filling the trench together with the in-trench seed portion, and removing the resist layer so that wiring including the in-trench seed portion and the filling plating portion remains.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE OR PRINTED WIRING BOARD
This photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, in which the photosensitive resin composition has an absorbance with respect to light at a wavelength of 365 nm per 1 μm of thickness of more than 0.0041 and 0.0130 or less.
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
A resist pattern inspection method includes performing an outer appearance inspection on a resist pattern based on light emission from a substrate on which the resist pattern is formed. A resist pattern manufacturing method includes forming a resist pattern on a substrate; and adhering a light-emitting material on a conductor surface of the substrate. A substrate selection method includes performing an outer appearance inspection on a resist pattern based on light emission from a substrate on which the resist pattern is formed; and evaluating the resist pattern based on the outer appearance inspection in performing the outer appearance inspection. A manufacturing method for a semiconductor package substrate or a printed circuit board includes forming a conductor pattern by performing etching process or plating process on the substrate in which evaluation of the resist pattern in the substrate selection method satisfies a reference.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method for producing a member for semiconductor device production includes forming a recess on an insulating material layer; forming a first electroless Ni plating layer on the insulating material layer and an inner surface of the recess by electroless nickel plating; forming a Cu plating layer on the first electroless Ni plating layer; forming a wiring layer including the Cu plating layer in the recess by removing the Cu plating layer and the first electroless Ni plating layer formed on the surface of the insulating material layer; and forming a second electroless Ni plating layer on the exposed surface of the wiring layer by electroless nickel plating; in which the first electroless Ni plating layer contains nickel and boron, and a boron content of the first electroless Ni plating layer is 0.3 to 1.0 mass % based on a mass of the first electroless Ni plating layer.
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
A method for producing a carbon material using pitch having a softening point of 70° C. to 120° C., a fixed carbon content of 50.0% by mass or more, a quinoline insoluble matter of 18.0% by mass or less, an initial boiling point of 320° C. or more, and a Casson yield value at the softening point +100° C. of 0.18 Pa or more, as a binder pitch.
A method for manufacturing a semiconductor package such as InFO-L, the method including preparing an intermediate structure including a base material and a redistribution layer, the base material having a first main surface and a second main surface on the rear side of the first main surface, the redistribution layer being provided on the first main surface and having an insulating resin layer and wiring provided in the insulating resin layer, the base material having a resin portion including a through portion penetrating from the first main surface to the second main surface, the redistribution layer forming a trench having a bottom surface on which the through portion is exposed; and cutting the through portion along the trench to form a plurality of wiring structures having divided base material.
Disclosed are a substrate including a metal clad laminate including a metal foil and a cured product of a prepreg, and an insulating layer laminated on at least one surface of the metal clad laminate, in which the metal clad laminate has 400 μm or more of an average thickness T1 measured by a predetermined method using a laser displacement gauge, and 10 μm or less of an absolute value D1 of a difference between a maximum value and a minimum value of a thickness, and a printed wiring board and a semiconductor package using the substrate.
Provided is a resin sheet which withstands adsorption and transportation by a vacuum adsorption pad for transportation, has low thermal expansion, and has a relative dielectric constant (Dk) of 2.50 to 3.30 in a high frequency band of 10 GHz band or more, and a dielectric dissipation factor (Df) of 0.0020 or less in a high frequency band of 10 GHz band or more. In addition, provided are a laminate, a printed wiring board, and a semiconductor package produced using the resin sheet. The resin sheet is specifically a resin sheet including a resin component (A), and an inorganic filler (B), in which the component (A) contains an elastomer (A1) having a number-average molecular weight of 10,000 or more, a content of the component (B) is 25 to 70 volume % based on a total amount of the resin sheet, and a breaking energy is 0.1 mJ/mm3 or more.
B32B 15/06 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of rubber
B32B 25/02 - Layered products essentially comprising natural or synthetic rubber with fibres or particles embedded in it or bonded with it
A polishing liquid contains abrasive grains and an acid component, in which the acid component contains a compound (excluding sulfuric acid and a salt thereof) having at least one selected from the group consisting of a sulfo group and a sulfonate group, and a pH is more than 4.5. A polishing method includes a step of polishing a surface to be polished using the polishing liquid.
The present invention relates to: a resin composition containing (A) a thermosetting resin, (B) one or more selected from the group consisting of a conjugated diene polymer and its derivative, having 2 or more of a functional group including an ethylenically unsaturated bond, and (C) an inorganic filler whose surface is treated with a silane coupling agent having a functional group including an ethylenically unsaturated bond; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package, all of which use the said resin composition.
A dicing/die-bonding integrated film 10 including a dicing film 5 including a substrate film 3 and a pressure-sensitive adhesive layer 2 provided on the substrate film 3, and a bonding adhesive layer composed of a die-bonding film 1 disposed on the pressure-sensitive adhesive layer 2 of the dicing film 5. The loss tangent of the dicing film 5 at 0° C. is 0.15 or less.
A resin composition containing a curable prepolymer which contains a vinylbenzyl group and an indene ring and has a weight average molecular weight of 50,000 or higher. Also provided is a prepreg, a resin film, a metal-clad laminate, a printed wiring board and a semiconductor package obtained using the resin composition.
C08F 257/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group on to polymers of styrene or alkyl-substituted styrenes
This fluorine-containing ether compound is a fluorine-containing ether compound represented by the following formula: R1—CH2—R2—(CH2—R3—CH2—R2)h—CH2—R4 (z represents 1 or 2. R2 is a perfluoropolyether chain. R1 is Formula (2). R4 is an organic group having 3 to 35 carbon atoms and having 1 to 3 polar groups. R3 is Formula (4).)
This fluorine-containing ether compound is a fluorine-containing ether compound represented by the following formula: R1—CH2—R2—(CH2—R3—CH2—R2)h—CH2—R4 (z represents 1 or 2. R2 is a perfluoropolyether chain. R1 is Formula (2). R4 is an organic group having 3 to 35 carbon atoms and having 1 to 3 polar groups. R3 is Formula (4).)
A release film includes a release layer and a substrate layer, the release layer includes two or more polymers, and satisfies at least one of the following (1) to (4). (1) The release layer has a plurality of different regions with different component ratios, and in a case in which Raman spectroscopy is performed on the different regions, at least a part of the different regions exhibits different peak intensities. (2) A surface of the release layer has a convex portion and a concave portion, and in a case in which Raman spectroscopy is performed on the convex portion and the concave portion, at least a part of the convex portion and at least a part of the concave portion exhibits different peak intensities. (3) A difference in SP value between at least two of the polymers is 0.3 or more. (4) At least one of the polymers is a nitrile group-containing (meth)acrylic polymer.
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
An embodiment relates to a thermosetting resin composition including: a resin (A) having at least one group selected from the group consisting of an acid anhydride group and a carboxy group; an ion trapping agent (B) containing Zr, Mg, and Al; an inorganic filler (C); and an epoxy resin (D).
A secondary battery includes a plurality of positive electrodes provided with a positive electrode current collector and a positive electrode mixture layer including a positive electrode active material, which is disposed on the positive electrode current collector; a plurality of negative electrodes provided with a negative electrode current collector and a negative electrode mixture layer including a negative electrode active material, which is disposed on the negative electrode current collector; and a packaging material that accommodates the electrodes, the secondary battery has a structure formed by laminating the electrodes in a thickness direction, and the positive electrode mixture layer includes a fibrous carbon, and σ/A as defined in the specification is 0.35 (° C./Ah) or less when the secondary battery is discharged from a fully charged state to a discharge cut-off voltage with a current of 5 C.
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/583 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
86.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING MEDIUM
A fluorine-containing ether compound represented by the following formula R1—CH2—R2[—CH2—R3—CH2—R2]x—CH2—R4 (R1 and R4 are terminal groups containing two or three polar groups, wherein the polar groups are bonded to different carbon atoms, and carbon atoms to which the polar groups are bonded are bonded via a linking group containing carbon atoms to which no polar group is bonded; x is 1 to 2; R2 is a perfluoropolyether chain; R3 is Formula (3-1) or (3-2)).
A fluorine-containing ether compound represented by the following formula R1—CH2—R2[—CH2—R3—CH2—R2]x—CH2—R4 (R1 and R4 are terminal groups containing two or three polar groups, wherein the polar groups are bonded to different carbon atoms, and carbon atoms to which the polar groups are bonded are bonded via a linking group containing carbon atoms to which no polar group is bonded; x is 1 to 2; R2 is a perfluoropolyether chain; R3 is Formula (3-1) or (3-2)).
A radio wave transmissive member, including an outer layer, an intermediate layer and an inner layer in this order, the radio wave transmissive member having a region in which X1, as a total thickness of the outer layer and the inner layer in a transmission direction of a radio wave, satisfies the following Formula (1) and Formula (3), and X2, as a thickness of the intermediate layer in a transmission direction of the radio wave satisfies the following Formula (2) and Formula (3):
A radio wave transmissive member, including an outer layer, an intermediate layer and an inner layer in this order, the radio wave transmissive member having a region in which X1, as a total thickness of the outer layer and the inner layer in a transmission direction of a radio wave, satisfies the following Formula (1) and Formula (3), and X2, as a thickness of the intermediate layer in a transmission direction of the radio wave satisfies the following Formula (2) and Formula (3):
Z
-
0.6
mm
≤
X
1
≤
Z
+
0.6
mm
Formula
(
1
)
Z
-
0.3
mm
≤
X
2
≤
Z
+
0.3
mm
Formula
(
2
)
Z
=
λ
÷
√
ε
r
×
0.5
×
Y
Formula
(
3
)
wherein, in the Formulas, λ represents a wavelength in vacuum of the radio wave, εr represents a relative permittivity of each layer at a frequency of the radio wave, and Y represents an integer of 1 or more.
An aspect of the present invention relates to a method for manufacturing a printed wiring board, the method comprising: a step for forming a first photosensitive layer on a substrate; a step for exposing and developing the first photosensitive layer to form a first resist pattern on the substrate; a step for forming a second photosensitive layer on the first resist pattern; a step for exposing and developing the second photosensitive layer to form a second resist pattern on the first resist pattern; and a step for curing the first resist pattern and the second resist pattern to form a first permanent resist layer and a second permanent resist layer, wherein the second permanent resist layer is a protruding dam for preventing the outflow of underfill.
Provided are: a prepreg capable of exhibiting low thermal expansion; a metal-clad laminate having low thermal expansion; a printed wiring board having the metal-clad laminate; and a semiconductor package having the printed wiring board. Specifically, the prepreg contains a resin composition or a semi-cured product of the resin composition, wherein the resin composition contains (A) a bismaleimide compound. In the bismaleimide compound (A), nitrogen atoms in two maleimide groups are bonded by an organic group, and the organic group has three aromatic hydrocarbon groups.
[Problem] To provide a method for producing a coating liquid with which thermal shrinkage resistance is high even if the film thickness of a coating layer is thin. [Solution] Provided is a method for producing a coating liquid including an inorganic filler and a poly-N-vinyl carboxylic acid amide, said method being characterized by including a step in which high shearing treatment is performed using a stirring means.
H01M 50/451 - Separators, membranes or diaphragms characterised by the material having a layered structure comprising layers of only organic material and layers containing inorganic material
C09D 139/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogenCoating compositions based on derivatives of such polymers
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
H01M 50/403 - Manufacturing processes of separators, membranes or diaphragms
H01M 50/414 - Synthetic resins, e.g. .thermoplastics or thermosetting resins
This method for producing titanium oxide particles includes: a reaction step for introducing a raw material gas (G1) containing titanium tetrachloride and an inert gas and an oxidizing gas (G2) containing at least one of oxygen gas and water vapor and an inert gas into a reaction tube to generate a reaction gas; a cooling step for introducing a cooling medium and cooling the reaction gas to obtain raw material titanium oxide particles; a first dechlorination step for heating the raw material titanium oxide particles at 300-600°C while bringing water vapor into contact with the raw material titanium oxide particles, the mass ratio (mass of water/mass of raw material titanium oxide particles) of water and raw material titanium oxide particles being 0.01 or more; and a second dechlorination step for heating the raw material titanium oxide particles that have been subjected to the first dechlorination step at 30°C to less than 100°C while bringing water vapor into contact with the raw material titanium oxide particles, the mass ratio (mass of water/mass of raw material titanium oxide particles) of water and raw material titanium oxide particles being 0.01 or more.
C04B 35/46 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates
H01B 3/12 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
In this joined body, a mixed molten part in which a molten part of a plate-like aluminum material and a molten part of a plate-like copper material are mixed is formed by irradiating the aluminum material with a laser beam in a state where the aluminum material and the copper material are overlapped with each other, and Vickers hardness of the mixed molten part at the interface between the aluminum material and the copper material is 55-150 HV.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
93.
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A semiconductor device comprising: a heat sink having a flat plate-like part and a plurality of fins that protrude from the flat plate-like part; a semiconductor module joined to the flat plate-like part in a state of being laminated on the flat plate-like part; a housing for housing the fins; an inflow port for allowing a liquid to flow into the housing; an outflow port for allowing the liquid to flow out of the housing; an inflow passage for allowing the liquid to flow into between the plurality of fins from the inflow port; and an outflow passage for allowing the liquid to flow out from between the plurality of fins to the outflow port, wherein at least one of the inflow port, the outflow port, the inflow passage, and the outflow passage overlaps the fins in the lamination direction of the heat sink and the semiconductor module.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
94.
TEMPORARY FIXATION FILM, LAMINATE FOR TEMPORARY FIXATION, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
According to the present invention, a temporary fixation film that is to be used to temporarily fix a semiconductor member and a support member contains (A) a bismaleimide compound, (B) a thermosetting component, and (C) a filler. The (B) component includes (B-1) an epoxy resin, and the (C) component content is at least 10 parts by mass per 100 total parts by mass of the (A) component and the (B-1) component.
C09J 135/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofAdhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
Provided is a prepreg exhibiting high reflow heat resistance while containing a component having low dielectric characteristics. Also provided are a laminate, printed wiring board, and semiconductor package, each being obtained using the prepreg. Specifically, this thermosetting resin composition contains: a maleimide resin (A) including an indane skeleton; and an acrylic resin (X) having one or more functional groups selected from the group consisting of a hydroxy group, a carboxy group, and a substituted amino group.
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
A shredding system comprising: a shredder that has a raw material reception port, a cutting blade, and a shredded matter discharge port; a cover that shields the region between the cutting blade and the shredded matter discharge port from external air; a water vapor inlet installed in the cover; and a water vapor supply device connected to the water vapor inlet.
B02C 18/00 - Disintegrating by knives or other cutting or tearing members which chop material into fragmentsMincing machines or similar apparatus using worms or the like
This production method for a chemical involves heating a fixed-bed reaction unit that includes a filler layer that is filled with a filler and thermally decomposing a starting material that includes plastic in the fixed-bed reaction unit in the presence of an inert gas. At the thermal decomposition, the gas space velocity (GHSV) of the inert gas at the filler layer as found from expression 1 is at least 5,000 h-1. [Expression 1] GHSV=Q/V. GHSV is the gas space velocity (h-1) of the inert gas at the filler layer, Q is the flow rate (Nm3/h) of the inert gas, and V is the volume (m3) of the filler at the filler layer.
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
C07C 1/00 - Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon
C07C 4/00 - Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms
C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
C10B 53/07 - Destructive distillation, specially adapted for particular solid raw materials or solid raw materials in special form of synthetic polymeric materials, e.g. tyres
98.
CHEMICAL PRODUCT PRODUCTION METHOD, CHEMICAL PRODUCT PRODUCTION APPARATUS, AND GRANULAR MEDIUM
A chemical product production method according to the present disclosure involves: introducing an inert gas into a reactor accommodating a granular medium that contains a fluid material A and an additive B having a pore volume of 0.01 cm3/g to 10 cm3/g, inclusive, to cause the granular medium to flow; heating the reactor; and supplying a starting material that contains a plastic to the heated reactor.
C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
C10B 53/07 - Destructive distillation, specially adapted for particular solid raw materials or solid raw materials in special form of synthetic polymeric materials, e.g. tyres
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
99.
CHEMICAL PRODUCT PRODUCTION METHOD, CHEMICAL PRODUCT PRODUCTION APPARATUS, AND FLUID MATERIAL
A chemical product production method according to the present disclosure involves: introducing an inert gas into a reactor accommodating a fluid material containing a calcium compound to cause the fluid material to flow; heating the reactor; and supplying a starting material that contains a plastic to the heated reactor. The chemical product contains ethylene and propylene.
C08J 11/12 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by dry-heat treatment only
C10B 53/07 - Destructive distillation, specially adapted for particular solid raw materials or solid raw materials in special form of synthetic polymeric materials, e.g. tyres
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
100.
PRODUCTION METHOD FOR REFINED N-VINYL CARBOXYLIC ACID AMIDE
[Problem] To provide a refinement method for producing refined N-vinyl carboxylic acid amides which is inexpensive and easy to manage. [Solution] A method of producing a refined N-vinyl carboxylic acid amide from a crude N-vinyl carboxylic acid amide, said method being characterized by including a base addition step and a distillation step, wherein a base is added to the crude N-vinyl carboxylic acid amide in the base addition step.
C07C 233/05 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having nitrogen atoms of carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals with carbon atoms of carboxamide groups bound to carbon atoms of an acyclic saturated carbon skeleton having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
