Provided are a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing, in which the prepreg contains a thermosetting resin composition and a fiber base material having a thickness of 40 μm or more, the prepreg has a first resin layer which is provided on one surface of the fiber base material and contains the thermosetting resin composition; and a second resin layer which is provided on the other surface of the fiber base material and contains the thermosetting resin composition, in which when a thickness of the first resin layer is di and a thickness of the second resin layer is d2, a ratio R of a thickness difference represented by formula (1) is −9.0% to +9.0%, and surface waviness (Wa) of each of both surfaces of the prepreg is 6 μm or less, and a printed wiring board and a semiconductor package using the metal-clad laminate.
A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
This functional coating material contains: a curable component; a polysiloxane compound having an amino group; and a silane coupling agent having an epoxy group. The functional coating material may be a hard coating material. The hard coating comprises a cured product of the functional coating material. A structure according to the present invention includes a base material and the hard coating provided upon the base material.
This functional coating material contains: a curable component; a polysiloxane compound having an amino group; and a sensitizer. The functional coating material may be a hard coating material. The hard coating comprises a cured product of the functional coating material. A structure according to the present invention includes a base material and the hard coating provided upon the base material.
This functional coating material contains: a curable component; a polysiloxane compound having an amino group; and a polymerization inhibitor. The functional coating material may be a hard coating material. The hard coating comprises a cured product of the functional coating material. A structure according to the present invention includes a base material and the hard coating provided upon the base material.
Provided is a photosensitive resin composition that contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the photopolymerizable compound contains a polyfunctional monomer having two or more radical reactive groups and 8-16 oxyethylene groups, the polyfunctional monomer content is 90 mass% or more with reference to the total amount of the photopolymerizable compound, the mass ratio of the binder polymer to the photopolymerizable compound is greater than 0 and not greater than 1.35, and the absorbance with respect to light having a wavelength of 365 nm per 1 μm of thickness in a photosensitive layer formed using the photosensitive resin composition is less than 0.0220. Also provided is a photosensitive element 10 comprising a support 12, and a photosensitive layer 14 disposed on the support 12, the photosensitive layer 14 including the aforementioned photosensitive resin composition.
G03F 7/031 - Organic compounds not covered by group
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
7.
ADHESIVE FILM, ADHESIVE TAPE, ADHESIVE TAPE WITH RELEASE FILM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
An adhesive film used for joining a semiconductor chip and a base and sealing a gap between the semiconductor chip and the base, the adhesive film being a single layer film formed from an adhesive composition having photocurability and thermosetting properties.
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
H01L 23/00 - Details of semiconductor or other solid state devices
8.
PHOTOSENSITIVE RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, PHOTOSENSITIVE RESIN FILM, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE SUBSTRATE
The purpose of the present disclosure is to provide: a photosensitive resin composition for an optical waveguide, the photosensitive resin composition being used for the formation of an optical waveguide and being capable of reducing the transmission loss at 1,310 nm; and a photosensitive resin film, an optical waveguide, and a photoelectric composite substrate, each of which uses this photosensitive resin composition. A photosensitive resin composition for an optical waveguide (34) according to the present disclosure has an integral value of the absorbance at a wave number of 9,090 cm to 1to 10,526 cm to 1 of 3.00 or less at a thickness of 1 mm.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
9.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT PATTERN, AND METHOD FOR PRODUCING CONDUCTOR PATTERN
A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The photopolymerizable compound contains a polyfunctional monomer having two or more radical reactive groups and 8‒16 oxyethylene groups. The polyfunctional monomer content is 90% or more by mass based on the total amount of the photopolymerizable compound, and the mass ratio of the binder polymer to the photopolymerizable compound is more than 0 and 1.35 or less. A photosensitive element 10 comprises a support 12 and a photosensitive layer 14 disposed on the support 12. The photosensitive layer 14 includes the photosensitive resin composition previously described.
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
10.
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
The present invention relates to a photosensitive multilayer resin film including: a first resin composition layer; and a second resin composition layer, in which the first resin composition layer and the second resin composition layer each contain a compound (A) having an ethylenically unsaturated group, a thermosetting resin (B), a photopolymerization initiator (C), and an inorganic filler (D), and a is smaller than b and a is 10 g/m2 or less, where a is a weight reduction amount when the photosensitive multilayer resin film is irradiated with ultraviolet light of 2 J/cm2, then cured by heating at 170° C. for 1 hour, and then subjected to a roughening treatment under a predetermined roughening treatment condition in a state where a surface of the first resin composition layer is exposed and a surface of the second resin composition layer is not exposed, and b is a weight reduction amount when the photosensitive multilayer resin film is irradiated with ultraviolet light of 2 J/cm2, then cured by heating at 170° C. for 1 hour, and then subjected to a roughening treatment under the predetermined roughening treatment condition in a state where the surface of the second resin composition layer is exposed and the surface of the first resin composition layer is not exposed, a printed wiring board using the photosensitive multilayer resin film and a method for producing the same, and a semiconductor package.
An adhesive film for semiconductors is provided, the adhesive film being used to bond a semiconductor chip to an adherend while embedding a wire connected to another semiconductor chip. In a case where the dynamic viscoelasticity of the adhesive film in a range of 90° C. to 180° C. is measured under the conditions of a temperature increasing rate of 5° C./min and a frequency of 1 Hz, a maximum value of tan δ is 1.0 or less and a minimum melt viscosity is 10000 Pa·s or less.
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
12.
PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
The present invention relates to a photosensitive resin film containing: a compound (A) having an ethylenically unsaturated group; a thermosetting resin (B); a photopolymerization initiator (C); an inorganic filler (D); and a fluorine-containing resin (E). The photosensitive resin film has a first surface and a second surface opposite to the first surface. a is smaller than b and a is 10 g/m2 or less, where a is a weight reduction amount when the photosensitive resin film is irradiated with ultraviolet light of 2 J/cm2, then cured by heating at 170° C. for 1 hour, and then subjected to a roughening treatment under a predetermined roughening treatment condition in a state where the first surface is exposed and the second surface is not exposed, and b is a weight reduction amount when the photosensitive resin film is irradiated with ultraviolet light of 2 J/cm2, then cured by heating at 170° C. for 1 hour, and then subjected to a roughening treatment under the predetermined roughening treatment condition in a state where the second surface is exposed and the first surface is not exposed.
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
C08L 27/18 - Homopolymers or copolymers of tetrafluoroethene
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
13.
METHOD FOR STORING FLUORINE-CONTAINING NITROGEN COMPOUND
There is provided a method for storing a fluorine-containing nitrogen compound that prevents the progress of a reaction of the fluorine-containing nitrogen compound during storage. A fluorine-containing nitrogen compound containing nitrosyl fluoride and nitroyl fluoride contains or does not contain at least one type among sodium, potassium, magnesium, and calcium as metal impurities. When any of the foregoing is contained, the fluorine-containing nitrogen compound is stored in a container with the total concentration of the sodium, the potassium, the magnesium, and the calcium set to 1000 ppb by mass or less.
C01B 21/084 - Compounds containing nitrogen and non-metals containing one or more halogen atoms containing also one or more oxygen atoms, e.g. nitrosyl halides
F17C 1/10 - Pressure vessels, e.g. gas cylinder, gas tank, replaceable cartridge with provision for protection against corrosion, e.g. due to gaseous acid
F17C 5/00 - Methods or apparatus for filling pressure vessels with liquefied, solidified, or compressed gases
14.
PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
The present invention relates to a photosensitive resin film containing: a compound (A) having an ethylenically unsaturated group; a thermosetting resin (B); a photopolymerization initiator (C); an inorganic filler (D); and a fluorine-containing resin (E). The photosensitive resin film has a first surface and a second surface opposite to the first surface. A fluorine atom concentration in a portion at a depth of 1 μm from the first surface is lower than a fluorine atom concentration in a portion at a depth of 1 μm from the second surface.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
15.
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A thermosetting adhesive film for semiconductors is provided, the adhesive film being used to bond a semiconductor chip to an adherend while embedding a wire connected to another semiconductor chip. The adhesive film has a minimum melt viscosity of 2500 Pa·s or more and 10000 Pa·s or less in a range of 90° C. to 180° C. The minimum melt viscosity is a value determined by measurement on a dynamic viscoelasticity of the adhesive film within a temperature range including a range of 90° C. to 180° C. under the conditions of a temperature increasing rate of 5° C./min and a frequency of 1 Hz.
H01L 23/00 - Details of semiconductor or other solid state devices
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
16.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
As an example, a method for mounting a bridge die 20 on a support such as a redistribution layer in a state where a connection terminal of the bridge die 20 faces upward (face-up) is disclosed. In this method, before forming an adhesive layer on a back surface of the bridge die, a resin layer 23 is formed so as to cover terminal electrodes 22 on a semiconductor substrate 21 of the bridge die 20 with a thermosetting resin film (e.g. DAF). Each bridge die 20 is mounted on the support such as a wiring layer 12 by vacuum-suctioning an entire surface of the cured resin layer 23 with a collet. According to this method, it is possible to prevent the bride die from bending as compared with a method of suctioning only at the outer edge avoiding the terminal electrode.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
17.
HEAT-CONDUCTING SHEET, HEAT-DISSIPATING DEVICE, HEAT-CONDUCTING SHEET PRODUCTION METHOD, AND ADHESIVE LAYER-FORMING COMPOSITION
A heat-conducting sheet comprising: a heat-conducting layer containing at least one type of graphite particles (A) selected from the group consisting of flake particles, ellipsoidal particles, and rod-like particles, the planar direction in the case of the flake particles, the major axis direction in the case of the ellipsoidal particles, and the longitudinal axis direction in the case of the rod-like particles being aligned with the thickness direction; and an adhesive layer including a resin component, a thiol compound or reactive product thereof, and a heat-conductive filler, said adhesive layer being positioned on at least a portion of a principal surface of the heat-conducting layer.
A reception unit (32) receives shape values pertaining to the shapes of respective configurations of a semiconductor package, and physical property values of materials to use. Each time the shape values and the physical property values are received, a simulation unit 34simulates warpage of a substrate on the basis of the received shape values and physical property values. A calculation unit (36) calculates, with regard to each of plural materials registered in a material database (40) in advance, the difference between physical property values of the plural materials and the received physical property value. A display control unit (38) displays simulation results and the results of calculating the difference in physical property values at a display device.
A resin composition contains an elastomer; a polymerizable compound; and a polymerization initiator, in which a cured product having a tensile elastic modulus of 50 MPa or more is provided when the resin composition is subjected to a thermal treatment at 120° C. for 30 minutes. A laminate has a base material film; and a transparent resin layer disposed on the base material film, in which the transparent resin layer contains at least one selected from the group consisting of the resin composition and a cured product thereof. A transparent antenna 110 has a transparent base material; a conductive member disposed on the transparent base material; and a covering member disposed on the conductive member, in which at least one selected from the group consisting of the transparent base material and the covering member contains a cured product of the resin composition.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
This SiC ingot is formed of a SiC single crystal grown from a first end inclined by an offset angle from a (0001) plane toward a second end, the SiC ingot includes a step-flow growth region and a facet, and in a cut surface that passes through a center and is in a <11-20> direction, an angle between an inner boundary between the facet and the step-flow growth region and a crystal growth direction is 56° or less.
C30B 29/66 - Crystals of complex geometrical shape, e.g. tubes, cylinders
C30B 33/00 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure
21.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
Provided is a negative electrode material for a lithium-ion secondary battery, said material being graphite particles that satisfy (1) and (2) below. (1) The slope k of a linear approximation line, in which the electrode density d (g/cm3002110002110110) of the (110) diffraction line obtained by X-ray diffraction measurement, is the objective variable, is 930 or less. (2) The compressive load, which is the magnitude of pressure required to compress the material to a density of 1.7 g/cm3, is 1.85 kN/cm2 or more.
H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
22.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
This negative electrode material for a lithium ion secondary battery contains a plurality of graphite particles. In three-dimensional image data of the plurality of graphite particles obtained by X-ray CT measurement, the moments of the center of mass determined from mutually orthogonal principal axes of inertia with respect to the graphite particles are denoted as L, M, and S, with the maximum value L being set to 1. Among the graphite particles having a particle diameter of 15 μm or more, the proportion of the particles according to (1) below is 32% or more by number, and the proportion of the particles according to (4) below is 65% or less by number. (1) L = 1, 0.5 < M < 1.0, and 0.5 < S < 1.0 are satisfied. (2) L = 1, 0.7 < M < 1.0, and S < 0.3 are satisfied. (3) L = 1, M < 0.3, and S < 0.3 are satisfied. (4) None of (1) to (3) are satisfied with respect to the moments L, M, S of the center of mass.
H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
23.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
Provided is a negative electrode material for a lithium-ion secondary battery, the negative electrode material being composed of graphite particles satisfying the following formulas (1) to (5), where x (kN/cm2) is the compression load, which is the magnitude of the pressure required to compress the graphite particles to a density of 1.7 g/cm3, and y is the springback ratio. Formula (1): x + y × 7.6 ≤ 4.50 (1.0 ≤ x ≤ 2.5). Formula (2): x + y × 8.8 ≥ 3.45 (1.0 ≤ x ≤ 2.5). Formula (3): –x + y × 60.8 ≥ 4.00 (2.5 ≤ x ≤ 5.0). Formula (4): –x + y × 55.8 ≤ 12.00(2.5 ≤ x ≤ 5.0). Formula (5): y ≤ 0.270.
H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01M 4/1393 - Processes of manufacture of electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
24.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
Provided is a negative electrode material for a lithium-ion secondary battery comprising graphite particles, wherein when a coating film is formed so that the coating amount after drying is 35.0 ± 0.2 mg/cm2by means of the doctor blade technique using a slurry containing the graphite particles, a density d of the coating film after drying is 1.10 g/cm3to 1.40 g/cm3.
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01M 4/583 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx
25.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
Provided is a negative electrode material for a lithium-ion secondary battery, said material comprising graphite particles that satisfy formula (1) below. (1) y + 50x ≤ 94 In formula (1), x is the tap density (g/cm3) of graphite particles after 250 times, and y is the oil absorption amount (mL/100g) of graphite particles.
A method for manufacturing an electronic component device according to the present disclosure is a method in which: in a mounted body having a circuit board and an electronic component element disposed on one surface of the circuit board, a mask frame having a first opening portion provided corresponding to the location where the electronic component element is disposed is disposed on a surface on the side where the electronic component element is disposed; a pressing plate is disposed on the side opposite to the side of the mask frame that faces the mounted body; and in a state in which a liquid thermosetting resin composition is filled in the first opening portion, the thermosetting resin composition is cured by heating and pressurizing the thermosetting resin composition using a pressure bonding device to seal the electronic component element.
This polishing solution contains: abrasive grains; at least one monocarboxylic acid compound selected from the group consisting of monocarboxylic acids having a nitrogen-containing heterocycle and salts of said monocarboxylic acids; and a nitrogen-containing compound (excluding compounds corresponding to said monocarboxylic acid compound) having a hydrogen atom bonded to a nitrogen atom. The abrasive grains include cerium-based particles, and the topological polar surface area of said monocarboxylic acid compound is 80.0 Å2 or less. This polishing method comprises a step for polishing a surface to be polished of a member to be polished using the polishing solution.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
28.
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
A negative electrode material for a lithium-ion secondary battery includes a plurality of graphite particles, and when binarizing SEM images of cross sections of the graphite particles into void portions and regions other than the void portions, and assigning 0 to the void portions and assigning 1 to the regions other than the voids, a plurality of images of graphite particles having at least 10,000 pixels are selected from the binarized images, and the average value of the amount of voids of the selected images of graphite particles is 0.700 to 0.940.
This suspension arm member is composed of an aluminum alloy having an alloy composition containing 0.2-0.4 mass% of Cu, 0.9-1.2 mass% of Mg, 0.6-0.9 mass% of Si, 0.05-0.15 mass% of Mn, 0.15-0.30 mass% of Fe, 0.2-0.35 mass% of Cr, 0.01-0.05 mass% of Ti, and 0.0010-0.0050 mass% of B, with the remainder consisting of Al and inevitable impurities, and has a full-width at half-maximum of at least 1.58º at a Debye ring diffraction peak, as obtained by X-ray diffraction.
C22F 1/05 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys of the Al-Si-Mg type, i.e. containing silicon and magnesium in approximately equal proportions
C22F 1/047 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
B22D 11/124 - Accessories for subsequent treating or working cast stock in situ for cooling
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
32.
COPOLYMER, RESIN COMPOSITION, CURED PRODUCT, AND POLYMER MIXTURE
Disclosed are: a copolymer which contains a constituent unit (a) that has a monovalent group represented by formula (1) and a constituent unit (b) that has a monovalent group represented by formula (2); a polymer mixture which includes a polymer A that contains a constituent unit (a) that has a monovalent group represented by formula (1) and a polymer B that contains a constituent unit (b) that has a monovalent group represented by formula (2); and a resin composition which contains the copolymer, and a cured product of the resin composition. The details of the substituents in formula (1) and formula (2) are shown in the text of the description.
This fluorine-containing ether compound is represented by the following formula. R122-R222-O-R3(R2is a perfluoropolyether chain. R1is formula (2-1) or formula (2-2). R3is an organic group having at least one polar group and having 2-65 carbon atoms. In formula (2-1), X1is a divalent linking group having 1-40 carbon atoms. Y1and Z1are each an organic group having 1-12 carbon atoms or a hydrogen atom. At least one of X1, Y1, and Z1contains a primary hydroxy group. In formula (2-2), X2is a divalent linking group having 1-40 carbon atoms. Y2is an organic group having 1-12 carbon atoms or a hydrogen atom. Z2is an organic group having 1-12 carbon atoms. At least one of X2, Y2, and Z2 contains a primary hydroxy group.)
C07C 235/08 - Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to acyclic carbon atoms and singly-bound oxygen atoms bound to the same carbon skeleton the carbon skeleton being acyclic and saturated having the nitrogen atom of at least one of the carboxamide groups bound to an acyclic carbon atom of a hydrocarbon radical substituted by singly-bound oxygen atoms
C07C 235/06 - Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to acyclic carbon atoms and singly-bound oxygen atoms bound to the same carbon skeleton the carbon skeleton being acyclic and saturated having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
C08G 65/48 - Polymers modified by chemical after-treatment
C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
C10M 107/44 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
C10N 30/00 - Specified physical or chemical property which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc
34.
ELECTROLYTIC SOLUTION PRODUCTION DEVICE, ELECTROLYTIC SOLUTION PRODUCTION METHOD, AND FLUORINE GAS PRODUCTION METHOD
Provided is a device that produces an electrolyte solution for producing a fluorine gas with a low vapour pressure of hydrogen fluoride. An electrolytic solution production device (1) includes: a positive electrode (3) including a nickel electrode (31) and a carbon electrode (32); a negative electrode (4) including a metal electrode; and an electrolytic solution production tank (2) in which a liquid to be treated (8) containing potassium fluoride and hydrogen fluoride can be stored and the liquid to be treated (8) is electrolysed using the positive electrode (3) and the negative electrode (4). The electrolytic solution production device (1) has a structure whereby direct current can be passed through both the nickel electrode (31) and the carbon electrode (32).
Disclosed is a method for producing a joined body by sequentially joining a columnar base material A, a thermoplastic film B, and a resin C in this order, the method including: heating and melting, and solidifying the thermoplastic film B that is disposed on at least a part of the outer periphery of the columnar base material A so as to join the columnar base material A and the thermoplastic film B; and joining a portion of the columnar base material A, on which the thermoplastic film B is disposed, and the resin C by means of insert molding so as to seal the thermoplastic film B. The heating and melting are performed by bringing the thermoplastic film B into contact with the columnar base material A which has been heated in advance.
B29C 65/02 - Joining of preformed partsApparatus therefor by heating, with or without pressure
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 65/44 - Joining a heated non-plastics element to a plastics element
B29C 65/70 - Joining of preformed partsApparatus therefor by moulding
Provided is a resin composition with which it is possible to form a cured product that has excellent high-frequency characteristics and in which the size of surface pitting after desmearing is kept small. Also provided are a resin film, a prepreg, a laminate, a printed wiring board, and a semiconductor package, all of which use the resin composition. The resin composition contains a maleic anhydride-modified styrene elastomer (A) having a modification rate of 1.0 mass% or more and a thermosetting resin (B).
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C08J 5/10 - Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 25/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ringCompositions of derivatives of such polymers
ii of a substance i is represented by bits, and whether the substance i is included in the composite material is represented by a bit, the constraint conditional expression includes a condition satisfying expressions (1) and (2), and the constraint conditional expression is formulated so as not to be calculated as an optimal solution of the compounding if at least one of expressions (1) and (2) is not satisfied.
G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
G06N 99/00 - Subject matter not provided for in other groups of this subclass
38.
METHOD FOR MANUFACTURING METAL TERMINAL WITH FILM, METHOD FOR MANUFACTURING CONNECTOR TERMINAL, CONNECTOR TERMINAL, ELECTRICAL/ELECTRONIC COMPONENT, AND METHOD FOR EVALUATING CONNECTOR TERMINAL
Disclosed is a method for manufacturing a metal terminal with a film, the method including: disposing one or a plurality of metal terminals between thermoplastic films; and heating, melting and solidifying the thermoplastic films so as to join at least a part of each of the metal terminals and the thermoplastic films.
B29C 65/44 - Joining a heated non-plastics element to a plastics element
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 65/70 - Joining of preformed partsApparatus therefor by moulding
A resin composition containing: a styrene-based block copolymer; a (meth)acrylic compound; and a polymerization initiator. A laminate having: a base material film; and a transparent resin layer disposed on the base material film, in which the transparent resin layer contains at least one selected from the group consisting of the resin composition and a cured product thereof. A transparent antenna 110 having: a transparent base material 110a; a conductive member 110b disposed on the transparent base material 110a; and a covering member 110c disposed on the conductive member 110b, in which at least one selected from the group consisting of the transparent base material 110a and the covering member 110c contains a cured product of the resin composition. An image display device 100 having the transparent antenna 110.
To improve the development efficiency of a new material, a prediction device includes a section determination unit configured to acquire a training data set used for generating a trained prediction model, and determine a plurality of sections for classifying attribute values from a frequency distribution of the attribute values calculated between a plurality of data included in the training data set, an evaluation unit configured to determine sections to which attribute values calculated between prediction target data and the plurality of data are classified into, among the plurality of sections, and evaluate an appropriateness of the prediction target data with respect to conflicting indexes, and a display unit configured to display a predicted value predicted by the trained model in association with an evaluation result of the evaluation unit, by inputting the prediction target data to the trained model.
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
41.
TITANIUM OXIDE POWDER AND METHOD FOR PRODUCING SAME
What is provided is a titanium oxide powder having a BET specific surface area of 300 m2/g to 480 m2/g as measured through a nitrogen adsorption method, an anatase content of a crystalline phase of 90% or more as measured through XRD measurement, and a spin-spin relaxation time T2 of 46 ms to 103 ms obtained by performing pulsed NMR measurement of a 5 mass % suspension prepared using ion exchange water.
This SiC ingot includes a step-flow growth region and a facet, in a cut surface that passes through a center and is in a <11-20> direction, an inner boundary between the facet and the step-flow growth region has a first inclined surface inclined in a [−1-120] direction with respect to a crystal growth direction and a second inclined surface inclined in a [11-20] direction with respect to the crystal growth direction, and an inflection point between the first inclined surface and the second inclined surface is located on a side of a first end, which is a Si plane or a plane inclined by an offset angle from the Si plane, from a center position of an ingot length.
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
This SiC ingot includes a facet, wherein, when a diameter of the SiC ingot is represented as D and in a plan view in a crystal growth direction, a virtual rectangle that surrounds the facet with a minimum area and has a first side parallel to a <11-20>direction and a second side parallel to a <1-100>direction is drawn, and a length of the first side of the virtual rectangle is represented as Lx, Lx/D<0.3 is satisfied at a first end which is a terminal of the crystal growth direction.
A reel body containing: a winding core; and an adhesive tape wound around the winding core, wherein the adhesive tape contains a support and an adhesive film provided on the support, wherein the adhesive film contains an adhesive layer, wherein the adhesive layer contains an adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles contain: first conductive particles that are dendritic conductive particles; and second conductive particles that are conductive particles other than the first conductive particles, each second conductive particle containing a non-conductive core and a conductive layer provided on the core, wherein a part of the plurality of conductive particles protrudes from one surface of the adhesive layer, and wherein the support faces a surface of the adhesive layer opposite to the one surface thereof.
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
B65H 75/02 - Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans
C09J 7/10 - Adhesives in the form of films or foils without carriers
NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY
The purpose of the present invention is to provide: an anatase type titanium oxide powder which has a high specific surface area and high dispersibility; and a method for producing same. Provided is a titanium oxide powder which has a BET specific surface area, as measured using a nitrogen adsorption method, of 300 m2/g-480 m2/g, has an anatase crystal phase content, as measured using XRD measurements, of 90% or more, and has a spin-spin relaxation time T2, as measured by pulsed NMR using a 5 mass% suspension produced using ion exchanged water, of 46-103 ms.
One embodiment of the present disclosure pertains to a photosensitive element comprising: a support film; and a photosensitive layer formed on a first surface of the support film. The support film is composed of a first lubricant layer, a base material layer, and a second lubricant layer, and includes the first lubricant layer at the first surface side and the second lubricant layer at a second surface side of the support film. The thickness of the second lubricant layer is 0.10-0.35 μm.
A suspension member made of an aluminum alloy having an alloy composition comprising CU: 0.3-0.5 mass%, Mg: 0.65-1.05 mass%, Si: 0.9-1.25 mass%, Mn: 0.4-0.6 mass%, Fe: 0.15-0.30 mass%, Cr: 0.09-0.25 mass%, Ti: 0.01-0.05 mass%, B: 0.0010-0.0050 mass%, and the balance being Al and unavoidable impurities, wherein, in a plane perpendicular to a surface of a bush portion formed along a parting line and parallel to the cylindrical axis of the bush portion, the inclination of crystal grain boundaries is 45° or less.
C22C 21/06 - Alloys based on aluminium with magnesium as the next major constituent
C22F 1/05 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys of the Al-Si-Mg type, i.e. containing silicon and magnesium in approximately equal proportions
C22F 1/043 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
C22F 1/047 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
49.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM
Disclosed is a fluorine-containing ether compound which is represented by the formula shown below. R122-R222-R322-R2n22-O-R4(In the formula, R1is formula (2-1) or formula (2-2). R2represents a perfluoropolyether chain. R4represents an organic group that has at least one polar group and 1 to 50 carbon atoms. R3 represents a divalent linking group that has at least one hydroxyl group. n is an integer of 0 to 2.)
C07C 235/06 - Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to acyclic carbon atoms and singly-bound oxygen atoms bound to the same carbon skeleton the carbon skeleton being acyclic and saturated having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
C07C 233/18 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by singly-bound oxygen atoms with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of an acyclic saturated carbon skeleton
C08G 65/48 - Polymers modified by chemical after-treatment
C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
C10M 107/44 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
C10N 30/00 - Specified physical or chemical property which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
C10N 30/06 - OilinessFilm-strengthAnti-wearResistance to extreme pressure
C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc
50.
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
This curable resin composition contains an epoxy resin. A cured product of the curable resin composition exhibits an adhesive strength of 0.40 MPa or more with respect to AgCu at 260°C after being heated and humidified for 168 hours at 85°C and 85% RH.
A method for producing a hydrocarbon-containing composition in which the hydrocarbon-containing composition containing ethylene is produced includes a heating step for heating, in an inert gas atmosphere, a raw material containing at least one substance selected from the group consisting of polyolefin-containing plastics and decomposition products thereof, and a catalyst containing 30 mass% to 100 mass% of lanthanum oxide while in contact with each other.
C07C 4/22 - Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms by depolymerisation to the original monomer, e.g. dicyclopentadiene to cyclopentadiene
C08J 11/16 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with inorganic material
52.
RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
The present invention pertains to: a resin composition that is for use in forming a resin layer for a resin-attached metal foil including a metal foil and a resin layer laminated on one surface of the metal foil, and that contains (A) an epoxy resin including an aliphatic ring and having an epoxy equivalent of 240 g/eq or less; and a resin-attached metal foil, a laminate, a printed wiring board, and a semiconductor package, in all of which the resin composition is used.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
A polishing solution according to the prevent invention contains: abrasive grains; at least one monocarboxylic acid compound selected from the group consisting of monocarboxylic acids having a nitrogen-containing heterocycle and salts of the monocarboxylic acids; and a nitrogen-containing compound (excluding compounds corresponding to the monocarboxylic acid compound) having a hydrogen atom bonded to a nitrogen atom. The abrasive grains include cerium-based particles. The topological polar surface area of the monocarboxylic acid compound is 80.0 Å2 or less. This polishing method includes a step for using the polishing solution to polish a to-be-polished surface of a to-be polished member.
This metal terminal with a film comprises a plurality of metal terminals, a first thermoplastic film, and a second thermoplastic film. Each of the metal terminals is sandwiched between the first thermoplastic film and the second thermoplastic film, and is bonded to each of the first thermoplastic film and the second thermoplastic film.
H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
H02G 1/14 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for joining or terminating cables
55.
CHLOROPRENE LATEX, RUBBER ASPHALT EMULSION, ASPHALT LAYER, AND ASPHALT MIXTURE
The purpose of the present invention is to provide a rubber asphalt emulsion with which it is possible to exhibit a higher aggregate holding property when combined with an aggregate and to provide a chloroprene latex with which it is possible to yield such a rubber asphalt emulsion. Provided is a chloroprene latex containing a polymer that contains a structural unit derived from a chloroprene monomer and a structural unit derived from a second monomer other than the chloroprene monomer. The gel amount in the chloroprene latex is 70% or more, the second monomer has a crystallization temperature, a glass transition temperature, or a melting point of 80°C or higher when homopolymerized, the content of the structural unit derived from the second monomer in the polymer is 3-10 mass parts per 100 mass parts of the total structural units constituting the polymer, and the z average particle size of the polymer is 150 nm or less.
C08F 236/18 - Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated containing elements other than carbon and hydrogen containing halogen containing chlorine
C08L 95/00 - Compositions of bituminous materials, e.g. asphalt, tar or pitch
56.
FILM MANUFACTURING METHOD, FILM, WOUND BODY, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND REMOVING DEVICE
A film manufacturing method includes a removing step of removing at least one removal target adhesive film piece from an original film having a plurality of adhesive film pieces provided on a long release film. A film includes a long release film, a plurality of adhesive film pieces, and a non-adhesive region, the plurality of adhesive film pieces include a first adhesive film piece and a second adhesive film piece which are adjacent to each other through the non-adhesive region and a adhesive film piece and a fourth adhesive film piece which are adjacent to each other through a non-adhesive region, and a separation distance between the first adhesive film piece and the second adhesive film piece is different from a separation distance between the third adhesive film piece and the fourth adhesive film piece.
There is provided a method for storing fluoroalkene in which, even when stabilizers for suppressing reactions of fluoroalkene are not added, the reactions of the fluoroalkene hardly occur and the purity of the fluoroalkene hardly decreases during storage. Fluoroalkene having a bromine atom or an iodine atom in the molecule is at least one type of fluoroethylene represented by a first general formula C2HpFqXr and fluoropropene represented by a second general formula C3HsFtXu (X represents a bromine atom or an iodine atom), and contains or does not contain at least one type among sodium, potassium, magnesium, and calcium as metal impurities. When any of the foregoing is contained, the fluoroalkene is stored in a container with the total concentration of the sodium, the potassium, the magnesium, and the calcium set to 1000 ppb by mass or less.
Petroleum pitch has a quinoline-insoluble fraction of 0.5 mass % or less, toluene-insoluble fraction of 3.0 mass % or less, softening point of 60° C. to 120° C., and viscosity at 200° C. of 200 mPa·s or less, the fixed carbon content Y (mass %) of which satisfies formula (1). A method for producing petroleum pitch includes: heat-treating petroleum heavy oil (step 1); distilling the heat-treated product obtained in step 1 and obtaining pitch 1 as a high-boiling-point component (step 2); removing the toluene-insoluble fraction from pitch 1 obtained in step 2 and obtaining a component in which the toluene-insoluble fraction has been decreased (step 3), and distilling the component in which the toluene-insoluble fraction obtained in step 3 has been decreased and obtaining pitch 2 as a high-boiling-point component (step 4). 80.0≥Y>0.2X+29.5 (1) Y: fixed carbon content (mass %), X: softening point (° C.) (60≤X≤120)
A solder bump forming member, a method for manufacturing a solder bump forming member, a method for manufacturing an electrode substrate provided with solder bumps. The solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H1
A positive photosensitive resin composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) an oxazoline compound having a plurality of oxazoline groups; (C) a photoacid generator containing a compound that generates an acid when exposed to light; and (D) an alkoxy compound having a plurality of alkoxy groups.
The purpose of the present disclosure is to provide: novel boron nitride particles that have a low dielectric property and high thermal conductivity; a resin composition containing the boron nitride particles; and uses therefor. A boron nitride particle according to the present disclosure comprises: a core that contains boron nitride oriented in a direction intersecting the outer periphery of the particle; and a shell that covers at least a portion of the core part and contains boron nitride oriented along the outer periphery of the particle.
The purpose of the present disclosure is to provide: a novel production method for boron nitride particles which is capable of producing boron nitride particles that have a low dielectric property and high thermal conductivity; a production method for a resin composition which includes said method; and uses therefor. A production method for boron nitride particles according to the present disclosure includes a step in which boron-containing particles that contain boron atoms are nitrided in a nitrogen gas atmosphere.
C08L 101/00 - Compositions of unspecified macromolecular compounds
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
64.
ELECTRODE BINDER POLYMER, ELECTRODE BINDER, ELECTRODE BINDER COMPOSITION, ELECTRODE SLURRY, ELECTRODE, SECONDARY BATTERY, PRODUCTION METHOD FOR ELECTRODE BINDER POLYMER, PRODUCTION METHOD FOR ELECTRODE BINDER, PRODUCTION METHOD FOR ELECTRODE BINDER COMPOSITION, PRODUCTION METHOD FOR ELECTRODE SLURRY, AND PRODUCTION METHOD FOR ELECTRODE
An electrode binder polymer according to the present invention has a first functional group, which is at least one moiety selected from the group consisting of a carboxy group and a carboxy group forming a salt, and a second functional group, which is at least one moiety selected from the group consisting of an isocyanato group and a blocked isocyanato group, said electrode binder polymer having a glass transition temperature Tg of -3°C or higher.
ELECTRODE BINDER COMPOSITION, ELECTRODE SLURRY, ELECTRODE, SECONDARY BATTERY, PRODUCTION METHOD FOR ELECTRODE, AND PRODUCTION METHOD FOR ELECTRODE SLURRY
An electrode binder composition according to the present invention contains an aqueous medium and an electrode binder polymer having a first functional group, which is at least one moiety selected from the group consisting of a carboxyl group and a carboxyl group forming a salt, and a second functional group, which is at least one moiety selected from the group consisting of an isocyanato group and a blocked isocyanato group. A film obtained by drying the electrode binder composition at 23°C and an absolute humidity of 10 g/m3 for 5 days at atmospheric pressure and then at 60°C for 12 hours at 0.01 MPa or less has a breaking strength S(St) of 4.00 MPa or greater.
Provided is a method for removing fluorine gas from a fluorine-containing gas that comprises fluorine gas and a fluorine-containing compound gas. This method for removing fluorine gas from a fluorine-containing gas comprising fluorine gas and a fluorine-containing compound gas comprises a removal step for inducing contact between the fluorine-containing gas and at least one metal salt selected from the group consisting of metal chlorides, metal bromides, and metal iodides.
A photosensitive resin composition according to the present disclosure comprises a maleimide compound, a crosslinking agent, a photopolymerization initiator, and a rust prevention agent. The maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), an amine (a2), and maleic anhydride (a3), and the rust prevention agent contains a compound represented by formula (I). [Formula 1] [In formula (I), X represents a carbon atom or a nitrogen atom, and R1and R2each independently represent a hydrogen atom, an alkyl group, an aryl group, or a nitrogen-containing group. However, when X represents a nitrogen atom, R1and R2 do not simultaneously represent hydrogen atoms.]
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
68.
COMPOSITE STRUCTURE ROTATING BODY AND RESIN MOLDED BODY
A composite structure gear is provided with an annular resin molded body including reinforcing fibers and a resin and having a toothed profile formed on the outer periphery, an annular metal bush, and a coupling resin member that connects the resin molded body and the metal bush. In the resin molded body, a plurality of recessed regions are formed at predetermined intervals in the circumferential direction, and the recessed regions are provided with thin parts where recesses are formed on both surfaces of the resin molded body in the thickness direction. In the recessed regions, the total value of the depths of the recesses on both surfaces is less than the thickness of the thin parts.
A composition set comprising a first film-like composition and a second film-like composition that contain a polymerizable compound, wherein the first film-like composition contains (A) a borate anion, the second film-like composition contains (B) a phosphorus compound having a P=O(OH) structure, and at least one selected from the group consisting of the first film-like composition and the second film-like composition contains (X) at least one selected from the group consisting of aromatic carboxylic acids having two or more hydroxy groups, salts of said aromatic carboxylic acids, and hydrates of said aromatic carboxylic acids.
C08F 290/02 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
70.
ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
An adhesive film for a semiconductor contains a thermosetting component, an elastomer, and an inorganic filler. The elastomer contains an acrylic resin having a structural unit derived from a monomer having an aromatic ring. An integrated dicing/die bonding film includes a dicing film and the adhesive film for a semiconductor provided on the dicing film.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
71.
PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A protective sheet for semiconductor processing includes a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic resin (A1) not containing an ethylenically unsaturated group, and a crosslinking agent (B1), and the adhesive layer is a cured product of an adhesive composition comprising a specific ethylenically unsaturated group-containing (meth)acrylic resin (A2), a crosslinking agent (B2), and a photopolymerization initiator (C). The (meth)acrylic resin (A1) not containing an ethylenically unsaturated group has a plurality of functional groups that react with functional groups of the crosslinking agent (B1), and the ethylenically unsaturated group-containing (meth)acrylic resin (A2) has a plurality of functional groups that react with functional groups of the crosslinking agent (B2).
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Provided are a photosensitive composition that can be made halogen-free, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. This photosensitive composition comprises (A) a binder polymer, (B) a photopolymerizable compound, and (C1) a hexaarylbiimidazole compound containing no halogen atom in the molecular structure thereof.
A positive photosensitive resin composition according to the present invention comprises: (A) an alkali-soluble resin; (B) a photoacid generator, which is a compound that generates an acid when exposed to light; and (C) a thermal crosslinking agent, which is a compound that crosslinks the alkali-soluble resin when exposed to heat. The alkali-soluble resin includes a constituent unit obtained by eliminating one or more hydrogen atoms from a bisphenol imide compound represented by general formula (I) or the like. Therein, X1is an atom group that, together with Z1and Z2, forms a tetravalent group containing two cyclic hydrocarbon groups, and the two cyclic hydrocarbon groups are directly bonded to each other by a covalent bond.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
74.
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING RESIN FILM, METHOD OF FORMING INSULATING RESIN FILM, AND SEMICONDUCTOR DEVICE
A positive photosensitive resin composition according to the present invention comprises: (A) an alkali-soluble resin which has a phenolic hydroxyl group and an imide group; (B) a photoacid generator; and (C) a thermal crosslinking agent. The photoacid generator contains an o-quinone diazide compound represented by formula (I). Therein, Q is a group represented by formula (3a) or the like.
A retrieval device comprises: a condition acquisition unit that acquires a retrieval condition designated by a first user; an authority acquisition unit that acquires authority information of the first user and set for information matching the search condition; and a history presentation unit that presents history information including the authority information to a second user who owns the information.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
BINDER POLYMER FOR NONAQUEOUS SECONDARY BATTERY, BINDER FOR NONAQUEOUS SECONDARY BATTERY, BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY, ELECTRODE SLURRY FOR NONAQUEOUS SECONDARY BATTERY, ELECTRODE FOR NONAQUEOUS SECONDARY BATTERY, NONAQUEOUS SECONDARY BATTERY, METHOD OF PRODUCING BINDER POLYMER FOR NONAQUEOUS SECONDARY BATTERY, METHOD OF PRODUCING BINDER FOR NONAQUEOUS SECONDARY BATTERY, METHOD OF PRODUCING BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY, METHOD OF PRODUCING ELECTRODE SLURRY FOR NONAQUEOUS SECONDARY BATTERY, AND METHOD OF PRODUCING ELECTRODE FOR NONAQUEOUS SECONDARY BATTERY
A binder polymer for a nonaqueous secondary battery according to the present invention includes: a first structural unit derived from an aromatic hydrocarbon monomer (a1) which is an aromatic compound that contains a hydrocarbon and has one ethylenically unsaturated bond; a second structural unit derived from a nonionic monomer (a2) which is a nonionic (meth)acrylic acid ester and has one ethylenically unsaturated bond; a third structural unit derived from a carboxylic acid monomer (a3) which is a compound having at least one moiety selected from the group consisting of a single ethylenically unsaturated bond, a carboxyl group, and a carboxyl group forming a salt; and a fourth structural unit derived from an isocyanate monomer (a4) which is a compound having at least one moiety selected from the group consisting of a single ethylenically unsaturated bond, an isocyanato group, and a blocked isocyanato group.
The present invention provides a resin composition that can suppress the production of prepreg powder and can suppress an increase in minimum melt viscosity. The present invention also provides a resin film, a prepreg, a laminate board, a printed wiring board, and a semiconductor package which use the resin composition. The resin composition comprises a maleimide resin (A) and a block copolymer (B), wherein: the component (A) includes a maleimide resin (A1) that includes an indane skeleton and a maleimide resin (A2) that does not include an indane skeleton; the component (B) has a block (b1) that includes a structural unit which is derived from an aromatic hydrocarbon compound and a block (b2) that includes a structural unit which is derived from a conjugated diene compound; and the content of the block (b1) in the component (B) is not less than 15 mass%.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
The present invention assists efforts to reduce greenhouse gas emissions of a supplier chain. A visualization device according to the present invention is provided with: an acquisition unit for acquiring a first greenhouse gas emission that is discharged when a unit amount of the nth order product is generated by an nth business operator among N business operators constituting a supplier chain, a second greenhouse gas emission that is discharged when the (n-1)th order product is generated by each of the first to the (n-1)th business operators from the primary product that is used when generating the unit amount of the nth order product, and a third greenhouse gas emission that is discharged when the Nth order product is generated by each of the (n+1)th to Nth business operators from the (n+1)th order product generated using the unit amount of the nth order product; and a visualization unit that visualizes the greenhouse gas emissions of the N business operators constituting the supplier chain by using the ratio of the second to the first greenhouse gas emissions and the ratio of the third to the first greenhouse gas emissions.
This friction material composition contains a fiber base material that contains a cellulose fiber, and an inorganic filler, and the content of aramid fibers is 3 mass% or less with respect to the total amount of the fiber base material.
A data registration device for registering a retrieval unit of data in a database. The data registration device includes: a division unit for dividing a document into retrieval units of data; a summary acquisition unit for acquiring a first summary text of a first body text included in the retrieval units of data by using a first machine learning model; a synthesis unit for generating first synthetic data of the first summary text of the document and second synthetic data of the first body text and the first synthetic data; a first feature vector acquisition unit for acquiring a feature vector of the second synthetic data by using a second machine learning model; and a registration unit for registering, in a database, a retrieval unit of data including the second synthetic data and the feature vector of the second synthetic data.
G06F 16/383 - Retrieval characterised by using metadata, e.g. metadata not derived from the content or metadata generated manually using metadata automatically derived from the content
82.
CONTINUOUSLY CAST ROD OF ALUMINUM ALLOY AND METHOD FOR PRODUCING CONTINUOUSLY CAST ROD OF ALUMINUM ALLOY
A cylindrical continuously cast rod of an aluminum alloy, said continuously cast rod of the aluminum alloy being characterized in that, in a cross-section perpendicular to the casting direction, in the outer 10-70μm of the equivalent circle diameter, the number of primary crystal Si existing in a 0.5 mm by 0.5 mm area of 0.25 cm2 from the casting surface is 5-15.
A composition set comprising a first film-like composition and a second film-like composition that contain a polymerizable compound, wherein the first film-like composition contains (A) a borate anion, and the second film-like composition contains (B) a phosphorus compound having a P=O(OH) structure.
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
84.
ORGANIC ELECTRONICS MATERIAL AND ORGANIC ELECTRONICS ELEMENT
The present disclosure relates to an organic electronics material that contains a branched charge-transporting polymer including: a divalent structural unit having a fluorene structure that has a substituent; at least one structural unit selected from the group consisting of trivalent structural units having a triphenylamine structure and trivalent structural units having a carbazole structure; and a monovalent structural unit having a polymerizable functional group.
An adhesive film for semiconductors, the adhesive film containing a thermosetting component. The adhesive film exhibits a shear viscosity at a frequency of 4.4 Hz of 2000 Pa·s or more at the minimum and 200000 Pa·s at the maximum in a range of 60 to 150° C. The adhesive film may be used for bonding to a substrate while embedding another semiconductor chip. The adhesive film may be used to bond a semiconductor chip to another semiconductor chip while embedding part or the whole of a wire connected to the other semiconductor chip.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/00 - Details of semiconductor or other solid state devices
86.
EPOXY RESIN B-STAGE FILM, EPOXY RESIN CURED FILM AND METHOD OF PRODUCING EPOXY RESIN CURED FILM
An epoxy resin B-stage film obtained by semi-curing an epoxy resin composition, the epoxy resin composition including: a liquid crystalline epoxy monomer capable of forming a cured product that includes a liquid crystal structure; and a curing agent, in which the epoxy resin B-stage film has an average thickness of less than 8 μm, and in which the liquid crystal structure included in the cured product turns into a liquid crystal structure, in which molecules are orientated in a film thickness direction, by being cured.
A photosensitive resin composition according to one aspect of the present disclosure contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer has a structural unit derived from acrylic acid and a structural unit derived from methacrylic acid.
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
This CMP polishing liquid is for polishing a member to be polished containing a carbon material, and contains abrasive grains, iron ions, and an organic acid. This polishing method comprises a step in which the aforementioned CMP polishing liquid is used to polish a member to be polished containing a carbon material.
This molded stator has a stator, which has a stator core and a coil wound around the stator core, and a molded material covering the stator, wherein: the molded material is a cured product of a thermosetting resin composition containing (A) a saturated polyester resin, (B) a thermosetting resin, (C) an ethylenically unsaturated monomer, (D) a thermal polymerization initiation agent, (E) glass fibers, (F) an inorganic filler material, and (G) a thickening agent; the thermosetting resin (B) includes at least (B-1) an unsaturated polyester resin; the thickening agent (G) is calcium hydroxide; the content of the thickening agent (G) in the thermosetting resin composition is 0.2 to 9 parts by mass, where the total amount of the thermosetting resin (B) and the ethylenically unsaturated monomer (C) is 100 parts by mass; the saturated polyester resin (A) is a polycondensate of a diol and a saturated polybasic acid; the saturated polybasic acid contains an aromatic saturated polybasic acid or an acid anhydride thereof and an aliphatic saturated polybasic acid; the content ratio (molar ratio) of a structure derived from the aromatic saturated polybasic acid or the acid anhydride thereof and a structure derived from the aliphatic saturated polybasic acid in the saturated polyester resin (A) is 20:80 to 80:20; the saturated polyester resin (A) includes a block (X) which is a polycondensate of the diol and the aromatic saturated polybasic acid or the acid anhydride thereof and a block (Y) which is a polycondensate of the diol and the aliphatic saturated polybasic acid; and the weight average molecular weight of the block (X) is 3,000 to 5,000.
A method for removing hydrogen fluoride is provided by which, even when a gas to be treated has a high hydrogen fluoride concentration, hydrogen fluoride can be removed from the gas using sodium fluoride until the hydrogen fluoride concentration becomes low. The method for removing hydrogen fluoride comprises: a first adsorption step in which a gas to be treated is introduced into a first adsorption treatment part provided with sodium fluoride and is brought into contact with the sodium fluoride, and the hydrogen fluoride contained in the gas is adsorbed onto the sodium fluoride to thereby obtain a first adsorption-treated gas; and a second adsorption step in which the first adsorption-treated gas is introduced into a second adsorption treatment part provided with sodium fluoride and is brought into contact with the sodium fluoride, and the hydrogen fluoride contained in the first adsorption-treated gas is adsorbed onto the sodium fluoride to thereby obtain a second adsorption-treated gas. The sodium fluoride of the first adsorption treatment part in the first adsorption step has a higher temperature than the sodium fluoride of the second adsorption treatment part in the second adsorption step.
B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
Disclosed are: a resin composition which contains (A) a siloxane-modified maleimide resin that includes a structure derived from a maleimide resin (A1) which has one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) which has two or more primary amino groups, (B) a polyphenylene ether-based resin that has a functional group which contains an ethylenically unsaturated bond, and (C) a phosphorus-based flame retardant that has a phosphorus atom content of 12 mass% or more; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package, each of which uses the resin composition.
C08G 81/00 - Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
This CMP polishing liquid is for polishing a member to be polished containing a carbon material, has an abrasive grain content of 0-5 mass%, and contains iron ions. This polishing method comprises a step in which the CMP polishing liquid is used to polish the member to be polished containing a carbon material. This method of manufacturing a semiconductor device includes obtaining a semiconductor device using said member polished with the polishing method.
A dicing die-bonding film including a die-bonding film and a dicing film having a pressure-sensitive adhesive layer laminated on the die-bonding film. The thickness of the die-bonding film is 10 μm or less. The thickness of the pressure-sensitive adhesive layer is less than 10 μm. The dicing film may further have a base material film, and the pressure-sensitive adhesive layer may be provided on the base material film.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H10D 89/00 - Aspects of integrated devices not covered by groups
The purpose of the present invention is to stably provide 1,3-butanediol which is less odorous and is suitable for use in cosmetics. The 1,3-butanediol has a content of odorous substance A, which is represented by chemical formula (A), of 2-10 wtppm and a content of odorous substance B, which is represented by chemical formula (B), of 4-25 wtppm.
This resonance sound absorber comprises a resonance box having a hollow part in the interior thereof and also having a first opening where the hollow part is open to the outside. The resonance box has a box body that has a second opening and a lid part that covers the second opening. A lid engagement part provided to the lid part is made to engage with a box engagement part provided to the box body, whereby the lid part is attached to the box body so as to cover the second opening.
This CMP polishing liquid is for polishing a member to be polished containing a carbon material, has an abrasive grain content of 0-5 mass %, and contains iron ions. This polishing method comprises a step in which the aforementioned CMP polishing liquid is used to polish a member to be polished containing a carbon material.
This method for producing a bell structure includes: step A for preparing a composite particle having a core particle and a water-soluble material that covers said core particle; step B for obtaining a precursor for thermoforming, which contains the composite particle and a thermosetting resin particle or a coated particle coated with a thermoplastic resin; step C for thermoforming the precursor for thermoforming to obtain a resin molded body containing the composite particle; and step D for bringing the resin molded body into contact with a solution containing water or an alcohol.
Provided are: a pigment dispersion composition which has good pigment dispersibility; and a photosensitive resin composition from which a resin cured film having excellent developability, excellent solvent resistance and excellent pattern adhesion can be obtained. This pigment dispersion composition comprises a binder resin (A-1) comprising a resin (A-1a) or a resin (A-1b), a pigment (B), a polymeric dispersant (C), and a solvent (D). The resin (A-1a) has a structure such that an ethylenically unsaturated group-containing compound (m-4) that has a group having reactivity with a carboxyl group is added to some of carboxyl groups in a copolymer (P) of monomers (M), wherein the monomers (M) include: a polymerizable monomer (m-1) comprising a polymerizable monomer (m-1a) that has a bridged cyclic hydrocarbon group or a polymerizable monomer (m-1b) represented by formula (1); acrylic acid (m-2); and an aromatic ring-containing polymerizable monomer (m-3).
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Provided is a molded stator which comprises a stator comprising a stator core and a coil wound on the stator core and a molding material covering the stator, wherein the molding material is a cured object formed from a heat-curable resin composition comprising (A) a saturated polyester resin, (B) one or more unsaturated polyester resins, (C) an ethylenically unsaturated monomer, (D) a thermal polymerization initiator, (E) glass fibers, and (F) an inorganic filler. The unsaturated polyester resins (B) at least include (B-1) an unsaturated polyester resin, the unsaturated polyester resin (B-1) being a product of polycondensation of a mixture comprising a diol and an unsaturated polybasic acid, and the unsaturated polyester resin (B-1) including a structure derived from propylene glycol and a structure derived from neopentyl glycol.
This molded stator includes: a stator which includes a stator core and a coil wound around the stator core; and a molding material which covers the stator. The molding material is a cured product of a thermosetting resin composition containing (A) a saturated polyester resin, (B) a thermosetting resin, (C) an ethylenically unsaturated monomer, (D) a thermal polymerization initiator, (E) glass fibers, and (F) an inorganic filler. The weight-average molecular weight of the (A) saturated polyester resin is 9,500-13,500.
