01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
(1) Industrial chemicals used in metal and plastic finishing, plating, etching, and the manufacture of printed circuit boards and other electronic components
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; chemicals for use in plating
metals onto various substrates; chemical for use in
non-electrolytic nickel-plating; chemicals having a nickel
base; metal plating chemical compositions; additives for
metal plating solutions; chemical products used in
sensitizing compositions, catalysts, accelerators, etchants,
etchant neutralizers, nickel compounds and solutions;
chemicals for the preparation of photoresists; chemicals
used in baths with nickel being used to carry out nickel
plating; artificial and synthetic resins; unprocessed
plastic materials in powder, liquid or paste form; chemical
tempering and soldering preparations; adhesive substances
for industrial use.
3.
Regeneration of etch solutions containing trivalent manganese in acid media
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
chemicals; raw chemicals; chemicals for use in plating metals onto various substrates; chemical products used in industry, especially chemicals used in non-electrolitic nickel-plating; chemical products for use in industry, all having a nickel base; metal plating solution; additives for metal plating solution; chemical products used in industry including sensitizing compositions, catalysts, accelerators, etchants, etchant neutralisers, nickel compounds and solutions; chemical materials for the preparation of photoresists; chemicals used in industry, in particular baths with nickel being used to carry out nickel plating; chemicals used in science, photography, agriculture, horticulture and forestry; artificial and synthetic resins, unprocessed plastic materials (in powder, liquid or paste form); chemical tempering and soldering preparations; adhesive substances for industrial use; chemicals used in industry; chemicals for use in industry.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
chemical compositions and solutions, all for use in chromium plating processes; chemical compounds and baths for chrome plating; chromium plating compositions and solutions; chemicals used in industry; chemicals for use in industry.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
industrial chemicals; chemicals for use in metal plating; chemical plating solutions, namely, metal plating chemical compositions; electroplating solutions, namely, chromium-free chemicals used in electroplating zinc and zinc alloys; electroplating chemical additives; chemical additives for paints and surface coatings; chemical additives for use in the production of coatings; galvanizing preparations; chemicals for the manufacture of protective coatings; chemical preparations for use in treating metal surfaces; chemicals for preventing corrosion; chemical preparations for facilitating the alloying of metals; preservatives for metals; passivating agents, namely, metallic oxides; chemical preparations for metal surface treatment, namely, preparations for passivating, cleaning, coating, descaling, anodizing metals; chemical preparations for treating, namely, passivating, cleaning, coating, descaling, anodizing metal surfaces made of zinc and zinc alloys corrosion resistant coatings; coatings for use as primers; coating materials for protection of surfaces exposed to galvanic corrosion; preservative coatings for use against corrosion; primers; conversion coating compositions, namely, anti-corrosive coatings, primers for preparing surfaces to be painted, protective coatings for metal surfaces; protective coatings for application to prepared metal substrates; conversion coatings compositions, namely, decorative or protective coatings for application to zinc, zinc-alloys, aluminum, copper, copper alloys, steel, and prepared metal substrates
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
Goods & Services
Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemicals for use in etching; Chemicals for use in plate etching; Descaling preparations for industrial purposes; Descalants for industrial use; Chemicals [other than household] in liquid form for use as descalers; Acids for use in pickling; Acids for metal pickling; Pickling solutions for industrial use; Pickling solutions for use in the removal of deposits from metal; Pickling solutions for use in the removal of coatings from metals; Chemical cleaning agents for use in industrial processes; Chemicals for use in removing coatings. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Anti-corrosive agents having descaling properties; Anti-corrosive preparations. Cleaning agents for metal; Polishing preparations; Abrasives; Scouring substances; Cleaning and fragrancing preparations; Rust removing preparations.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Chemicals used in industry; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chromating agents; Passivating agents; Baths for galvanizing; Chemicals for use in immersion baths [other than medical or veterinary]. Paints and washes; Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-rust preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Conversion coatings [paints]; Conversion coating compositions [paints]; Lacquers and varnishes; Varnish; Lacquers for use in industry.
9.
Etching of plastic using acidic solutions containing trivalent manganese
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
04 - Industrial oils and greases; lubricants; fuels
Goods & Services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for use in the production of coatings; Chemical additives for paints and surface coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chemical friction reducers; Chemical additives for lubricants; Chemical additives for oils; Chemicals in the form of water soluble lubricants; Chemical substances for use as additives to industrial lubricating oils; Chemical substances for use as additives to industrial lubricating greases; Rust preventive resins of high friction coefficient; Moistening agents; Passivating agents; Chromating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Conversion coatings [paints]; Conversion coating compositions [paints]; Primers; Coating preparations for protection against friction. Lubricants; Industrial lubricants; Lubricants for metal working; Lubricants for metallic surfaces; Lubricants containing low friction additives; Lubricating fluids; Industrial oils and greases, lubricants; Non-chemical additives for lubricants; Non-chemical additives for oils; Oils containing rust preventing additives; Anti-seize substances [oils]; Lubricating oils containing additives which protect metal against wear by friction; Preparations for reducing sliding friction between two surfaces.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Passivating agents; Chromating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chromating agents; Passivating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Conversion coatings [paints]; Conversion coating compositions [paints].
14.
Sealing anodized aluminum using a low-temperature nickel-free process
The inventive two-step process operates at low temperature, without any toxic heavy metals, to provide excellent sealing on anodized aluminum substrates, especially those aluminum substrates comprising silicon. The first step of the process seals the anodized surface and the second step passivates the anodized surface. The process allows for corrosion resistance in anodized aluminum and anodized aluminum alloys to be achieved that is comparable to traditional nickel based sealants, without the toxicity of nickel. The process additionally does not require any excessive temperatures, as required by hot water sealing processes. The composition used for the sealing step comprises soluble lithium ions, fluoride ions, and preferably, a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid. The composition used for the passivation step comprises metal ions and preferably a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid.
The inventive two-step process operates at low temperature, without any toxic heavy metals, to provide excellent sealing on anodized aluminum substrates, especially those aluminum substrates comprising silicon. The first step of the process seals the anodized surface and the second step passivates the anodized surface. The process allows for corrosion resistance in anodized aluminum and anodized aluminum alloys to be achieved that is comparable to traditional nickel based sealants, without the toxicity of nickel. The process additionally does not require any excessive temperatures, as required by hot water sealing processes. The composition used for the sealing step comprises soluble lithium ions, fluoride ions, and preferably, a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid. The composition used for the passivation step comprises metal ions and preferably a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid.
C23C 22/40 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing molybdates, tungstates or vanadates
C23C 22/42 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing molybdates, tungstates or vanadates containing also phosphates
C23C 22/44 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing molybdates, tungstates or vanadates containing also fluorides or complex fluorides
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C25B 9/06 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof
C25C 1/10 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of chromium or manganese
An aqueous trivalent chromium electrolyte comprising trivalent chromium ions and amino acids that allow for producing a dark colored hue in the trivalent chromium coating which is plated on a substrate. The amino acids described herein comprise a cationic side chain and are at least essentially free of sulfur. The cationic side chain of the amino acid further comprises nitrogen. When used in the trivalent chromium electrolyte, these amino acids allow for producing significantly darker trivalent chromium deposits. The trivalent chromium electrolyte is used in a method for producing the desired dark colored hue in the trivalent chromium coating that is produced on a substrate using electrodeposition.
A method of maintaining a concentration of sulfuric acid in an electrolyte comprising manganese(III) ions in a solution of sulfuric acid. The method includes the steps of a) removing a portion of the electrolyte from the electrolytic cell to an annex tank; b) treating the removed portion of the electrolyte in the annex tank to remove moisture from the portion of the electrolyte; and c) returning the treated portion of the electrolyte to the electrolytic cell. The removed portion of the electrolyte is treated by passing a dry gas over the surface of the electrolyte in the annex tank to absorb moisture from the electrolyte and restore the concentration of sulfuric acid in the electrolyte.
C25C 1/10 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of chromium or manganese
H01M 6/50 - Methods or arrangements for servicing or maintenance, e.g. for maintaining operating temperature
A method of preparing a plastic substrate to accept metal plating thereon is described. The method includes the steps of pretreating the plastic substrate by contacting the plastic substrate with an aqueous electrolyte comprising an organic salt to raise the surface energy of the plastic substrate. Thereafter, the plastic substrate can be etched and metal plated.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
20.
ELECTROLESS SILVER PLATING BATH AND METHOD OF USING THE SAME
An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath, The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).
a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.
A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.
C09D 181/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon onlyCoating compositions based on polysulfonesCoating compositions based on derivatives of such polymers
C25D 5/34 - Pretreatment of metallic surfaces to be electroplated
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.
A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative temiinal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
C22C 19/03 - Alloys based on nickel or cobalt based on nickel
29.
ELECTROPLATING OF METALS ON CONDUCTIVE OXIDE SUBSTRATES
A method of electroplating metal onto a transparent conductive oxide layer is described. The method comprises the steps of a) electroplating a zinc or zinc oxide seed layer directly onto the transparent conductive oxide layer and thereafter, b) electroplating one or more additional metal layers over the zinc layer. The one or more additional metal layers may include a cobalt strike layer electroplated over the zinc or zinc oxide seed layer and another metal layer such as copper, electroplated over the cobalt strike layer.
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium
C25D 5/00 - Electroplating characterised by the processPretreatment or after-treatment of workpieces
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
31.
PASSIVATION OF MICRO-DISCONTINUOUS CHROMIUM DEPOSITED FROM A TRIVALENT ELECTROLYTE
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium
C25D 5/10 - Electroplating with more than one layer of the same or of different metals
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.
An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals used in metal and plastic finishing,
plating, etching, and the manufacture of printed circuit
boards and other electronic components; chemicals used in
the manufacture of commercial and industrial printing
plates, namely, polymer compositions.
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
C23C 18/34 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
37.
Etching of plastic using acidic solutions containing trivalent manganese
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
C25C 1/10 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of chromium or manganese
A method of etching a plastic part as described. The method comprises contacting the plastic part with a solution comprising manganese(III) ions and at least one acid.
A copper electrolyte comprising a copper nitrate salt is described. The electrolyte is suitable for use in a light induced plating process for metallizing contacts in a photovoltaic solar cell. A method of metallizing an electrical contact in a photovoltaic solar cell using the copper electrolyte is also described.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals used in metal and plastic finishing, plating, etching, and the manufacture of printed circuit boards and other electronic components [ ; chemicals used in the manufacture of commercial and industrial printing plates, namely, polymer compositions ]
45.
Method of producing polymeric phenazonium compounds
A process of making a polymeric phenazonium compound having the general formula:
5,
y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
46.
ELECTROLYTIC GENERATION OF MANGANESE (III) IONS IN STRONG SULFURIC ACID
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises ( 1 ) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C09K 13/12 - Etching, surface-brightening or pickling compositions containing heavy metal salts in an amount of at least 50% of the non-solvent components
47.
ELECTROLYTIC GENERATION OF MANGANESE (III) IONS IN STRONG SULFURIC ACID
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises ( 1 ) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.
C23C 18/54 - Contact plating, i.e. electroless electrochemical plating
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
An aqueous conversion coating composition for treating steel substrates to provide a conversion coating thereon. The conversion coating composition comprises a) a source of aluminum ions; b) hexafluorozirconic acid or its salts; c) at least one pH adjuster; and d) optionally, a surfactant. The conversion coating composition provides a corrosion resistant coating on the metal surface and improves the adhesion of subsequently applied layers.
C23C 22/34 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing fluorides or complex fluorides
C23C 22/06 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6
50.
Adhesion promoting composition for metal leadframes
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
C09K 13/06 - Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
A copper electroplating bath for producing copper electrodeposits is described, The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl5 aryl or atkylaryl diamine. The copper electroplating bath can be used for producing eleetroformed copper deposits having low oxygen content,
An additive for use in a wash solution of a PET recycling process is described. The PET recycling process includes the steps of sorting the scrap PET to remove other materials, granulatirsg or shredding the scrap PET to produce PET flakes, and washing the PET to remove contaminants. The wash step comprises the steps of contacting the PET flakes with a wash solution comprising: (a) an alkali hydroxide; and (b) an additive comprising: (i) at least one non-ionic surfactant; (ji) at least one catiomc surfactant; (iii) a hydrotrope; (iv) water, and (v) optionally, a solvent.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of plating a part comprised of aluminum, alloys of aluminum, magnesium or alloys of magnesium to improve the corrosion resistance of the part. The method comprises the steps of plating the part with a plating bath comprising: (i) particles selected from the group consisting of polytetrafluoroethylene (PTFE), colloidal silica, colloidal graphite, ceramics, carbon nanotubes, silicon carbide, nano-diamond, diamond and combinations of one or more of the foregoing, which have been treated with a corrosion inhibitor and are dispersed in said plating bath; and (ii) metal ions to be plated, The dispersed particles co-deposit with the plated metal.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(in) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese (II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese (III) ions, wherein the manganese (III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C25C 1/10 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of chromium or manganese
An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to form a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
C25C 1/10 - Electrolytic production, recovery or refining of metals by electrolysis of solutions of iron group metals, refractory metals or manganese of chromium or manganese
C25C 7/00 - Constructional parts, or assemblies thereof, of cellsServicing or operating of cells
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
C08J 7/18 - Chemical modification with polymerisable compounds using wave energy or particle radiation
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the ekctroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).
A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.
B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
66.
Light induced plating of metals on silicon photovoltaic cells
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
C23C 18/54 - Contact plating, i.e. electroless electrochemical plating
An aqueous electrolytic plating solution and a method, of using the same for depositing a cobalt/nickel/phosphorus alloy on an electrically conductive substrate are provided. The aqueous electrolytic plating solution comprises: a) a source of nickel ions; b) a source of cobalt ions; c) a source of phosphite ions; d) an amino acid; and e) optionally, boric acid. The deposited cobalt/nickel/phosphorus alloy exhibits high coercivity and high remanence.
An aqueous tarnish inhibiting solution comprising a mercapto carboxylic acid find a corrosion inhibitor to produce an anti-tarnish layer on metal surfaces, such as silver plated copper leadframes and a method of using the same is pro vided. The composition provides an improved anti-tamish layer that does not affect wirebondability or the adhesion of a mold compound to a leadfrarne.
C23F 11/00 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
69.
LIGHT INDUCED PLATING OF METALS ON SILICON PHOTOVOLTAIC CELLS
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfations; b) a soluble salt of chloroacetic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consistmg of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarm and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.
C25D 3/12 - ElectroplatingBaths therefor from solutions of nickel or cobalt
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
C23C 22/56 - Treatment of aluminium or alloys based thereon
C23C 22/00 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
73.
ADHESION PROMOTING COMPOSITION FOR METAL LEADFRAMES
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
75.
Adhesion promoting composition for metal leadframes
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
An eleciroiytic cell for replenisHng chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electiOde and the second electrode, In this manner, trivalent; chromium is eieetrolytically dissolved from the cliromiuni electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.
An electrolytic cell for replenishing chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.
An aqueous acidic trivalent chromium electrolyte comprising trivalent chromium ions and a complexing agent for maintaining the trivalent chromium ions in solution is provided in which the aqueous electrolyte comprises additives capable of producing a coating on a substrate having a desired dark hue. The additives typically comprise a dispersion of colloidal silica and an additional additive selected from thiocyanate ions and/or iron ions. The electrolyte is used in a method of producing the desired dark-hued decorative chromium coating on a substrate by electrodeposition.
An aqueous acidic trivalent chromium electrolyte comprising trivalent chromium ions and a complexing agent for maintaining the trivalent chromium ions in solution is provided in which the aqueous electrolyte comprises additives capable of producing a coating on a substrate having a desired dark hue. The additives typically comprise a dispersion of colloidal silica and an additional additive selected from thiocyanate ions and/or iron ions. The electrolyte is used in a method of producing the desired dark-hued decorative chromium coating on a substrate by electrodeposition,
A process of making a polymeric phenazonium compound having the general formula: Formula (I) wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts as NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, and wherein RX-N-RY represents a substituted amine, and Rx and Ry represent any combination of CH3, C2H5,:Formula (II) and hydrogen, except that Rx and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be fonned in step b), whereby a polymeric phenazonium compound is produced.
C08G 63/48 - Polyesters chemically modified by esterification by unsaturated higher fatty oils or their acidsPolyesters chemically modified by esterification by resin acids
81.
Method of producing polymeric phenazonium compounds
A process of making a polymeric phenazonium compound having the general formula:
5,
Y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.
A process of making a polymeric phenazonium compound having the general formula:
5,
Y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
B05D 5/06 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
86.
Nano-oxide process for bonding copper/copper alloy and resin
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
C04B 28/36 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing sulfur, sulfides or selenium
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
C08J 5/12 - Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
C08J 3/09 - Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylaied alcohol surfactant; and (ill) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound, The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
C08J 7/18 - Chemical modification with polymerisable compounds using wave energy or particle radiation
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
90.
SEMI-BRIGHT NICKEL PLATING BATH AND METHOD OF USING SAME
A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexine diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range, it does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.
A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between -2 to +5 such as thiosulfate, sulfide, sulfite, bisulfite, rnetabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits Is disclosed.
A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between −2 to +5, such as thiosulfate, sulfide, sulfite, bisulfite, metabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits is disclosed.
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a chemical reducing agent. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact, without backside anodic corrosion and without the need for backside sacrificial material.
A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti -reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti -reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is elecrolessly plated.
The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
C23C 18/40 - Coating with copper using reducing agents
98.
PROCESS FOR IMPROVING ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES
A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
99.
Process for improving adhesion of polymeric materials to metal surfaces
A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride.
