imageimageimage) overlap at the target area (T). The invention further describes a method of manufacturing such an illumination assembly (1), and a portable device (2) comprising such an illumination assembly (1).
A scent switching mechanism is provided. The scent switching mechanism includes air guides, an outer barrel, and an inner barrel rotatable within the outer barrel. An angle disc is fixed to the inner barrel. The inner and outer barrels include sets of air inlets and sets of air outlets that align with the air guides to form air circuits based on a position of the inner barrel and the angle disc with respect to the outer barrel. Further, an aroma device can include a fragrance cartridge and the scent switching mechanism. The fragrance cartridge includes a case with a cavity and ventilation holes. A gasket is on an exterior of the case and surrounds the ventilation holes. A solid state fragrance is contained with the cavity. The fragrance cartridge includes a cover that closes the case and secures the solid state fragrance within the cavity.
A61L 9/04 - Disinfection, sterilisation or deodorisation of air using gaseous or vaporous substances, e.g. ozone using substances evaporated in the air without heating
A scent switching mechanism is provided. The scent switching mechanism includes air guides, an outer barrel, and an inner barrel rotatable within the outer barrel. An angle disc is fixed to the inner barrel. The inner and outer barrels include sets of air inlets and sets of air outlets that align with the air guides to form air circuits based on a position of the inner barrel and the angle disc with respect to the outer barrel. Further, an aroma device can include a fragrance cartridge and the scent switching mechanism. The fragrance cartridge includes a case with a cavity and ventilation holes. A gasket is on an exterior of the case and surrounds the ventilation holes. A solid state fragrance is contained with the cavity. The fragrance cartridge includes a cover that closes the case and secures the solid state fragrance within the cavity.
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
11 - Environmental control apparatus
Goods & Services
Air fragrancing preparations; preparations for perfuming or
fragrancing the air in vehicles; fragrance refills for
electric fragrance dispensers; automobile air fresheners in
the nature of air fragrancing preparations; non-medical
preparations in the nature of scents and fragrances for
electric fragrance dispensers to aid with motion sickness,
odor removal, drowsiness and air purification. Apparatus and instruments, namely, dispensing units and
diffusers for fragrances, deodorants and odor neutralizing
preparations; apparatus and instruments for scenting,
purifying or freshening the air in a vehicle; apparatus for
ventilating purposes, namely, air purifiers for use in cars.
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
11 - Environmental control apparatus
Goods & Services
(1) Air fragrancing preparations; preparations for perfuming or fragrancing the air in vehicles; fragrance refills for electric fragrance dispensers; automobile air fresheners in the nature of air fragrancing preparations; non-medical preparations in the nature of scents and fragrances for electric fragrance dispensers to aid with motion sickness, odor removal, drowsiness and air purification.
(2) Apparatus and instruments, namely, dispensing units and diffusers for fragrances, deodorants and odor neutralizing preparations; air deodorizing apparatus for scenting and freshening the air in a vehicle; apparatus for ventilating purposes, namely, air purifiers for use in cars.
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
11 - Environmental control apparatus
Goods & Services
Air fragrancing preparations; Air fragrancing preparations for perfuming and fragrancing the air in vehicles; Refills for electric diffusers for air fragrancing preparations; automobile air fresheners in the nature of air fragrancing preparations; non-medicated air fragrancing preparations in the nature of refills for electric diffusers for air fragrancing preparations used to aid with motion sickness, odor removal, drowsiness and air purification Air deodorizing apparatus utilizing fragrances, deodorants and odor neutralizing preparations; Plug-in diffusers for air deodorizers fragrances and odor neutralizing preparations; Air deodorizing apparatus for scenting and freshening the air in a vehicle; apparatus for ventilating purposes, namely, air purifiers for use in cars
Multi-color flash with image post-processing that uses a camera device with a multi- color flash and implements post-processing to generate images is described. In one aspect, the multi-color flash with image post-processing may be implemented by a controller configured to control a camera and flashes of at least two different colors. The controller may be configured to cause the camera to acquire a first image of a scene while the scene is being illuminated with the first flash but not the second flash, then cause the camera to acquire a second image of the scene while the scene is being illuminated with the second flash but not the first flash, and generate a final image of the scene in post-processing based on a combination of the first image and the second image.
The invention describes an infrared imaging assembly (1) for capturing an infrared image (M0, M1) of a scene (S), comprising an infrared-sensitive image sensor (14); an irradiator (10) comprising an array of individually addressable infrared-emitting LEDs, wherein each infrared-emitting LED is arranged to illuminate a scene region (S1,..., S9); a driver (11) configured to actuate the infrared irradiator (10) by applying a switching pulse train (T1,..., T9) to each infrared-emitting LED; an image analysis module (13) configured to analyse a preliminary infrared image (M0) to determine the required exposure levels (130) for each of a plurality of image regions (R1,..., R9); and a pulse train adjusting unit (12) configured to adjust the duration (L1,..., L9) of a switching pulse train (T1,..., T9) according to the required exposure levels (130). The invention also described a method of generating a depth map (D) for a scene (S); a depth map generator comprising an embodiment of the inventive infrared imaging assembly (1); and a camera comprising such a depth map generator (2).
The present invention relates to the field of automotive front-lighting, and particularly to a front-lighting system for a vehicle. The front-lighting system (10, 60, 70) comprises: a first light source (BS1), a second light source (BS2), a first primary optics (11, 61, 71), a second primary optics (12, 72), a transparent shutter (14, 74), and a secondary optics (13, 63, 73). The first primary optics (11, 61, 71) is designed to receive light from the first light source (BS1) and project it onto the transparent shutter (14, 74) and the secondary optics (13, 63, 73). The second primary optics (12, 72) is designed to receive light from the second light source (BS2) and project it onto the transparent shutter (14, 74). The transparent shutter (14, 74) is designed to receive light from the first light source (BS1) via the first primary optics (11, 61, 71) and prevent a lower part of it from entering the secondary optics (13, 63, 73). The transparent shutter (14, 74) is further designed to receive light from the second light source (BS2) via the second primary optics (12, 72) and project it onto the secondary optics (13, 63, 73). The secondary optics (13, 63, 73) is designed to receive light from the first primary optics (11, 61, 71) and the transparent shutter (14, 74), and project it onto a road in front of the vehicle. The transparent shutter (14, 74) comprises an air-exposed slit (15, 65, 75) designed to redirect the light received by the transparent shutter (14, 74) from the second light source (BS2) towards a middle axis (X) of the transparent shutter (14, 74).
F21S 41/148 - Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
F21S 41/151 - Light emitting diodes [LED] arranged in one or more lines
F21S 41/153 - Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
F21S 41/36 - Combinations of two or more separate reflectors
F21S 41/37 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
F21S 41/40 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades
The invention describes a semiconductor light-emitting device (1) comprising an emitter matrix (10) comprising an arrangement of emitter cells (10E) interspersed with non-emitter cells (10e), wherein an emitter cell (10E) comprises a semiconductor emitter (10L), and a non-emitter cell (10e) does not comprise a semiconductor emitter; a number of bond pads (10B) for connection to a power supply (80); and a plurality of wirebonds (10W), wherein each wirebond (10W) extends from a bond pad (10B) to the semiconductor emitter (10L) of an emitter cell (10E). The invention also describes an imaging arrangement (5) comprising a light source (1L) for illuminating a scene (S), which light source (1L) comprises a pair of such semiconductor light-emitting devices (1). The invention also describes a method of manufacturing such a semiconductor light-emitting device.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Inter-alia, a support for light-emitting elements is disclosed, the support comprising: a mounting section (4) with at least one mounting face (6a, 6b, 6c), wherein the at least one mounting face (6a, 6b, 6c) has an arrangement direction (8) and is configured for accommodating at least one light-emitting element (22) arranged along the arrangement direction (8); a body section (10) arranged adjacent to the mounting section (4); and conductors (12) for providing electric connection from the body section (10) to the at least one mounting face (6a, 6b, 6c); wherein the at least one mounting face (6a, 6b, 6c) comprises at least two contact sections (16) along the arrangement direction (8), each contact section corresponding to a conductor (12) and being separated by an insulating section, wherein the body section (10) protrudes sidewards from the at least one mounting face (6a, 6b, 6c), and wherein a voltage is applied between any of the at least two contact sections (16) when the body section (10) is connected to a power source. It is further disclosed a lighting device (20) and a method for producing a lighting device (20).
F21K 9/23 - Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
F21Y 107/30 - Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
According to the invention a light emitting device (210) is provided comprising: - a body (216); - a base portion (217, 218, 219) configured for mounting the light emitting device (210) to a reflector (141) of a headlight or taillight, the base portion (216) being arranged at a first end portion (220) of the body (216); - at least one light-emitting diode (211) arranged at or inside of the body (216); - at least one infrared light source (213, 214) provided at the body (216) and configured to emit infrared light; and - a thermal barrier (224) arranged in between the at least one infrared light source (213, 214) and the at least one LED (211) and configured to block at least part of radiation emitted from the at least one infrared light source (213, 214) towards the at least one LED (211).
F21S 45/60 - Heating of lighting devices, e.g. for demisting
F21K 9/232 - Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
F21S 41/148 - Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
Lighting device, in particular for automotive lighting applications, comprising a plurality of lighting elements arranged in one or more rows in order to form a luminous band, wherein each lighting element comprises at least one or more light emitting diodes (LEDs). The plurality of lighting elements is divided into one or more segments, wherein the lighting elements within each segment are electrically connected in series or in parallel. The lighting device further comprises at least one contacting element providing current for the plurality of lighting elements, wherein at least a first contacting element provides current for a first group of segments such that groups of lighting elements are independently and dynamically controlled.
H05B 33/08 - Circuit arrangements for operating electroluminescent light sources
H05B 45/48 - Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 μm and less than 10 μm.
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The invention refers to a lighting device (2) comprising light-emitting elements (10). The object to provide a lighting device (2) having an elongated shape, wherein the width of a slit-shaped light-emitting area (24) can be controlled while enhancing the effectiveness of the lighting device (2), is solved in that the lighting device (2) comprises a housing (4), the housing (4) having: reflective side walls (6) extending in a longitudinal direction of the housing (4); a cavity (8) formed between the reflective side walls (6); and light-emitting elements (10) arranged at least partially along the longitudinal direction relative to each other in the cavity (8), wherein an opening (16) of the cavity (8) forms a light-emitting area (20) of the lighting device (2), and wherein a width of the cavity (8) expands from the light-emitting elements (10) towards the opening (16) at least in sections; the lighting device (2) further comprising: a reflective element (22) covering at least a section of the opening (16), wherein the reflective element (22) is configured to reflect a part of light emitted from the light-emitting elements (10) towards the cavity (8), wherein the reflective element (22) is configured to reduce a width of the light-emitting area (20) compared to a width of the opening (16), and wherein the reflective element (22) is formed either integrally with the housing (4) or separately from the housing (4). The invention also refers to a method for producing a lighting device (2).
F21S 4/22 - Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
F21Y 103/10 - Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
F21Y 107/70 - Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.
Embodiments include a device having a component with a component surface; a phosphor converter body with a phosphor converter body surface facing the component surface; a plurality of particles between and in contact with the component surface and the phosphor converter body surface; and an inorganic coating on and in contact with at least a portion of the particles, at least a portion of the component surface, and at least a portion of the phosphor converter body surface, and a method making such device.
hihilololo), and wherein the plurality of VCSELs (10) shares a common anode (101) and a common cathode (106) for collective switching of the plurality of VCSELs (10). The invention further describes a method of manufacturing such a VCSEL die (1).
A lighting arrangement (10) includes a plurality of light sources (22) in spaced arrangement. Collimator elements (18) are arranged in front of the light sources (22). A holder with a plurality of spaced openings (36) is provided to hold the collimator elements (18) within the openings (36) in such a way that said openings (36) are arranged to contact said collimator elements (18) from at least two opposed sides, In order to allow exact positioning and easy manufacturing, the holder (14) comprises at least a first portion (14a) and a second portion (14b), such that at least some of the openings (36) are formed between the first and the second portions (14a), (14b).
According to the invention a lighting device (10, 10.1, 10.2, 10.3, 10.4, 10.5) is provided comprising: at least one light-emitting element comprising a light-emitting surface (11a) configured to emit light; and a light-guiding sheet (17) at least partially covering the light-emitting surface (11a) and comprising at least one cavity (18, 18a, 18.1a, 18b, 18.1b, 18c, 18d, 18e, 18f) forming a passage for light emitted from the light-emitting surface (11a). Thereby, at least one lateral surface (17a, 17b, 17c, 17d, 17e, 17f) limiting the at least one cavity (18, 18a, 18.1a, 18b, 18.1b, 18c, 18d, 18e, 18f) is configured to reflect light emitted from the light-emitting surface (11a). Further, a size of an opening of the at least one cavity (18, 18a, 18.1a, 18b, 18.1b, 18c, 18d, 18e, 18f) facing the light-emitting surface (11a) is smaller than an area of the light-emitting surface (11a).
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
1-x-yyx39312,3122; A = Lu, In, Yb, Tm, Y, Ga, Al, where 0 ≤ x ≤ 0.75, 0 ≤ y ≤ 0.9. A wavelength converting structure including the luminescent phosphor is also disclosed.
Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent sidewall having a curved or angled profile, attaching the LED sub-assembly to the lead frame, and dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame. The LED assembly is a high power LED assembly.
The present disclosure relates to a lighting device (2) comprising light- emitting elements (4) such as light-emitting diodes arranged on a substrate (6). The object to provide a lighting device (2) comprising multiple light-emitting elements (4) and light guides (14), wherein the thermal sensitivity of the lighting device (2) is reduced in a particularly simple manner, is solved in that the lighting device (2) comprises: a lens (8) with a light entry side (10) and a light exit side (12); light guides (14), each light guide (14) being arranged in optical contact to at least one of the light-emitting elements (4) and being configured to guide light emitted by the at least one of the light-emitting elements (4) towards the light entry side (10) of the lens (8); and a transparent stabilizer element (16) being arranged in mechanical contact to the light exit side (12) of the lens (8), wherein the transparent stabilizer element (16) is configured to define the shape of the light exit side (12) of the lens (8) at least in regions. The invention further refers to a method for producing a lighting device (2).
F21V 17/00 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
F21V 17/10 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
F21Y 105/16 - Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
A light emitting device may comprise a cup having a wall extending from a first area of the cup to a second area of the cup. The wall is formed from or coated with a reflective material. The light emitting device may comprise a light extraction bridge extending beyond an outer diameter of at least a portion of the wall for directing light into the air. The light may be produced by an LED die mounted at the second area of the cup such that at least some of a light emitted from the LED die exits the cup, having been reflected from the wall and the light extraction bridge.
The invention describes a modular LED string (1) comprising a plurality of LED module groups (G) mounted on a carrier (10), wherein an LED module group (G) comprises a series-connected row of LED modules (M1, M2, M3) commencing with a first LED module (M1) followed by a number of inner LED modules (M2) and terminated by a final LED module (M3); a plurality of main contact pads (11C), wherein each main contact pad (11C) is electrically connected to a main supply track (11) formed on the carrier (10) and is arranged between neighbouring LED modules (M1, M2, M3); a plurality of secondary contact pads (12C),wherein each secondary contact pad (12C) is electrically connected to a secondary supply track (12) formed on the carrier (10) and is arranged on either side of an inner LED module (M2, M3); and wherein an anode contact (P1_a) of each first LED module (M1) is electrically connected to the main supply track (11), and an anode contact (P2_a, P3_a) of each remaining LED module (M2, M3) is electrically connected to a secondary supply track (12). The invention further describes an LED lighting assembly (3) and a method of manufacturing an LED lighting assembly (3).
F21S 4/22 - Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
A lighting device (10) and a method of manufacturing a lighting device (10) are described. In order to allow high flexibility in manufacturing, the lighting device (10) comprises a heat sink (12) providing a first mounting area (22) for at least one LED element (24), a second mounting area (23) for at least one electrical connection assembly (36), a cavity (20) in the heat sink (12) adjacent to said first mounting area (22). An inner part (34) is arranged at least partially inside the cavity (20) comprising at least a first (26a, 28a) and a second connection terminal (26b, 28b) and at least one electrical connection path (44). The first (26a, 28a) and the second connection terminal (26b, 28b) are provided on a surface of the inner part (34). The first connection terminal (26a, 28a) is arranged between the first mounting area (22) and the second connection terminal (26b, 28b). The second connection terminal (26b, 28b) is arranged between the second mounting area (23) and the first connection terminal (26a, 28a). The electrical connection path (44) is provided at least partially inside the inner part (34) connecting the first (26a, 28a) and second electrical terminal (26b, 28b).
The invention describes a method of manufacturing an LED assembly (1), which method comprises the steps of providing an LED package (10P) comprising one or more LEDs (100) arranged in a support body (10), and comprising thermal and electrical contact regions (101, 102, 103) on one or more surfaces (10B, 10T) of the support body (10); providing a heatpipe (12); and forming a thermal contact between a contact region (101, 102, 103) of the LED package (10P) and a first end region (121) of the heatpipe (12). The invention further describes an LED package (10P), an LED assembly (1), and an LED lighting arrangement (2).
Lighting device, in particular for automotive applications, comprising a plurality of lighting elements, wherein each lighting element comprises at least one or more light emitting diodes (LEDs). The lighting device comprises a first connector for connecting the lighting device to a lighting driver. The lighting elements are arranged in a row in order to form a luminous band. The plurality of lighting elements is divided into more than one group, each group consisting of at least one or more lighting elements. The lighting elements of one group are electrically connected in series. The groups are electrically connected in parallel in order to control each group individually.
The invention relates to a lighting system, in particular for 3D imaging. The object to provide a lighting system (100, 400) that is capable of providing illumination for 3D imaging for a large range of distances and wider view angles, while the heat generation may be limited, is solved in that the lighting system (100, 400) comprises: a first lighting device (110a, 410a) configured to generate a first beam profile (200a, 300a), wherein the first lighting device (110a, 410a) comprises at least one individual light-emitting element (101a, 401a); a second lighting device (110b, 410b) configured to generate a second beam profile (200b, 300b), wherein the second lighting device (110b, 410b) comprises at least one individual light-emitting element (101b, 401b); wherein the lighting system (100, 400) is configured to combine the first beam profile (200a, 300a) and the second beam profile (200b, 300b) into a total beam profile (200c, 300c); and a pattern element (420) configured to generate a pattern on the first beam profile ((200a, 300a)) and/or the second beam profile (200b, 300b). The invention further relates to a method for producing a lighting system (100, 400) and the use of a lighting system (100, 400)
The invention describes a method of manufacturing a wavelength- converting pixel array structure (1), which method comprises the steps of forming an array of photoresist blocks (10), wherein the photoresist blocks (10) are separated by gaps (G), and wherein the position of a photoresist block (10) in the array of photoresist blocks (10) corresponds to the position of a light-emitting diode (20) in a light-emitting diode array (2); filling the gaps (G) around each photoresist block (10) with a filler material to form a grid (11); removing the photoresist blocks (10) to expose an array of cavities (C) in the grid (11); and filling each cavity (C) defined by the walls of the grid (11) with a wavelength-converting material to form the wavelength-converting pixels (12) of the wavelength-converting pixel array structure (1), wherein the wavelength-converting pixel array structure (1) is prepared in a recess (50) formed in a wafer. The invention further describes a method of manufacturing a light- emitting device (3).
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
A device includes an analog current division circuit configured to divide an input current into a first current and a second current, and a multiplexer array including a plurality of switches to provide the first current to a first of three colors of LEDs and the second current to a second of three colors of LEDs simultaneously during a first portion of a period, the first current to the second of three colors of LEDs and the second current to a third of three colors of LEDs simultaneously during a second portion of the period, and the first current to the first of three colors of LEDs and the second current to the third of three colors of LEDs simultaneously during a third portion of the period.
The disclosure relates to a lighting device (2) for frequency-modulated emission, the lighting device comprising: multiple light-emitting diodes (LEDs) (4); electronic switching means (6); connection elements, wherein the connection elements provide electrical connection between the LEDs (4) and the electronic switching means (6). The object to provide a lighting device that allows for higher operating frequencies and also a simplified layout of the electronic components is solved in that a common substrate (10) is provided, wherein the common substrate (10) is configured as an integrated element, wherein the LEDs (4) and the electronic switching means (6) are fixed on the common substrate (10). The disclosure further relates to a method of producing a lighting device (2) and a use of a lighting device (2).
The disclosure relates to a lighting device (20) for frequency-modulated emission. The object to provide a lighting device (20) comprising a light-emitting diode (LED) that allows for higher operating frequencies and that in particular has an improved quality of the emitted light signal is solved in that the lighting device (20) comprises: an LED (26); a resonant driver circuit (22) with a tuned circuit (24); wherein the resonant driver circuit (22) is configured to drive the tuned circuit (24) with an operating frequency, and wherein the tuned circuit (24) comprises the LED (26). The disclosure further relates to a method of operating a lighting device (20) and a use of a lighting device (20).
H03K 17/0416 - Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the output circuit
The invention relates to a lighting device (2, 100) comprising at least two light-emitting elements (8, 10, 12, 14, 16, 18), wherein the light-emitting elements (8, 10, 12, 14, 16, 18) are connected with each other into a module (24, 30) via a connection element (20, 22, 26, 28, 108, 112), wherein the connection element (20, 22, 26, 28, 108, 112) has at least one region, the at least one region being spaced apart from the at least two light-emitting elements (8, 10, 12, 14, 16, 18), and wherein at least two modules (24, 30) are connected with each other in parallel. The lighting device is characterized in that the at least one region of the connection element (20, 22, 26, 28, 108, 112) has a specific electrical resistance, wherein the electrical resistance of the at least one region of the connection element (20, 22, 26, 28, 108, 112) is configured to compensate differences between electrical characteristics of at least two light-emitting elements (8, 10, 12, 14, 16, 18). A method for producing a lighting device (2, 100), in particular the lighting device (2, 100) according to the invention is also described.
The invention refers to a lighting device for providing backlighting to a display screen (4). The object to provide a lighting device for providing illumination in the IR range, wherein the lighting device optimizes the available space for the display screen (4), is solved in that the lighting device comprises: a light guide (10) comprising at least one light entry face (12) and a light exit face (14), wherein the light guide (10) is configured to redirect light entering the light entry face (12) towards the light exit face (14), wherein the light exit face (14) is configured to be coupled to a back side of a display screen (4); at least one visible light-emitting diode (LED) (18) capable to emit light in the visible range, wherein the visible LED (18) is optically coupled to at least one light entry face (12); and at least one infrared (IR) LED (20) capable to emit light in the IR range, wherein the at least one IR LED (20) is configured to provide illumination for the light exit face (14). The invention further corresponds to an electronic device comprising the lighting device (9) according to the invention and a display screen (4). The invention also relates to a use of a lighting device (9) for optical identification and a light-emitting element (26).
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.
Pixelated array light emitters are formed with closely-spaced pixels having ultrasmooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.
Patterned ceramic wavelength-converting phosphor structures may be bonded to an LED to form a pcLED. The phosphor structures are patterned with features that provide enhanced oxygen permeability to an adhesive bond used to attach the phosphor structure to the LED. The enhanced oxygen permeability reduces transient degradation of the pcLED occurring in the region of the adhesive bond.
Systems, apparatus and methods for zero current detection and start-up for DC-DC converters are described herein. A device includes a first circuit and a second circuit. The first circuit receives a first voltage, at a first input, and provides a second voltage having one of a first level and a second level based on a level of the first voltage being above or below a threshold voltage. The second circuit is electrically coupled to the first input of the first circuit and decreases the level of the first voltage below a threshold voltage on a condition that the level of the first voltage is above the threshold voltage for a maximum time.
H02M 1/36 - Means for starting or stopping converters
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H05B 33/08 - Circuit arrangements for operating electroluminescent light sources
A method of fabricating closely spaced pcLEDs (100) arranged in a matrix array (200) of perpendicular rows and columns comprises an initial phosphor deposition step in which phosphor (803, 905) is deposited at alternating locations (pixels) in the matrix array in a checkerboard pattern, so that the locations (504) in the array at which phosphor (803, 905) is deposited are not adjacent to each other. In a subsequent phosphor deposition step phosphor is deposited at the alternating locations at which phosphor was not deposited in the first deposition step. In between the two phosphor deposition steps, reflective or scattering structures (606) may be fabricated on sidewalls of the phosphor pixels to optically isolate pcLEDs in the resulting array from each other
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
50.
HIGH BRIGHTNESS DIRECTIONAL DIRECT EMITTER WITH PHOTONIC FILTER OF ANGULAR MOMENTUM
A nano-structure layer is disclosed. The nano-structure layer includes a plurality of nano-photonic structures that are configured in a first configuration such that light incident upon the nanostructured layer below a cut-off angle passes through the nanostructured layer and light incident upon the nanostructured layer above the cut-off angle is reflected back in direction of the incidence.
A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.
A method is described for providing an LED package including a LED stack having an LED, a phosphor layer, and a sacrificial layer, the LED stack having a top and a sidewall. The top and sidewall of the LED stack are covered with a light reflective material, followed by removal of any excess light reflective material from the top of the LED stack. Using screen printing or other suitable techniques, a light absorbing layer is deposited on the light reflective material, with the deposited light absorbing layer at least partially surrounding the LED stack and defining a gap therebetween of at least 30 microns.
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
An illumination device comprises at least a laser (1) emitting a laser beam (6) of light of a first wavelength, a wavelength converting member (5) converting at least part of the light of the first wavelength into light of a second wavelength, a scanning unit (4) adapted to scan the laser beam (6) across the wavelength converting member (5) and an imaging optics (2) imaging a light emitting face of the laser (1) via the scanning unit (4) onto the wavelength converting member (5). In the proposed device, the laser beam (6) is guided via reflection at a reflective member (3) to the wavelength converting member (5). The reflective member (3) comprises a combination of at least a first and a second reflective element (8, 9), wherein the first and second reflective elements (8, 9) are formed and arranged such that the light emitting face of the laser (1) is imaged as a mirror-inverted image on the wavelength converting member (5) via the first reflective element (8) and as a non-mirror-inverted image via the second reflective element (9), both images being superimposed on the wavelength converting member (5). Due to this reflective member, intensity fluctuations in the image of the light emitting face on the wavelength converting member are reduced without enlarging the image.
F21S 41/176 - Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
F21S 41/365 - Combinations of two or more separate reflectors successively reflecting the light
F21S 41/675 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
The disclosure relates to a lighting device (22). The object to provide a lighting device (22) comprising a light guide (28), wherein the amount of guided light is further optimized, is solved in that the lighting device (22) comprises: a light-emitting element (24) with a light-emitting face (26); the light guide (28) having a light entry face (30), the light guide (28) being configured to guide light emitted by the light- emitting element (24) by means of total internal reflection; and a separator sheet (36) comprising a first face (38) and a second face (40), wherein the first face (38) is arranged in direct contact to the light entry face (30), wherein the second face (40) is arranged opposite the light-emitting face (26), wherein the separator sheet (36) is arranged such that a minimum distance (d) between the light-emitting face (26) and the light entry face (30) is 300 µm or less, and wherein the separator sheet (36) is arranged such that a gap is provided between the light-emitting element (24) and the separator sheet (36) at least in sections. The invention further relates to a method for production of such a lighting device (22) and to an automotive head light comprising an inventive lighting device (22).
A light source (210, 310) for a reflection luminaire, a reflection luminaire (200, 300) for an automobile and an automotive headlamp comprising the reflection luminaire (200, 300) are disclosed. The light source (210, 310) comprises a substrate (212), and a light emitting component (214), being a Chip Scale Package light emitting diode, and a light absorbing component (216) on the substrate (212). The light absorbing component (216) is configured to absorb light which is emitted from a side surface of the light emitting component (214) and incident on a surface of the substrate (212). The light source facilitates reducing or eliminating glare of a CSP LED reflection luminaire for an automobile.
F21S 41/19 - Attachment of light sources or lamp holders
F21V 19/00 - Fastening of light sources or lamp holders
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
An adhesive layer is disclosed that may include a plurality of short chain molecules, each of the plurality of the short chain molecules including a first end and a second end such that the distance between the first end and second end is less than 100 nm and such that first end Is configured to attach to a first surface and the second end is configured to attach to a second surface. Another adhesive layer is disclosed that may include a nanostructured layer imposing a local phase gradient that increases a critical angle for total internal reflection for light incident on the adhesive layer at an interface between layers bonded to each other by the adhesive layer and each having a higher index of refraction than the adhesive layer. Another adhesive layer is disclosed that combines the features of the two adhesive layers summarized above.
H01L 33/20 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
C09K 11/02 - Use of particular materials as binders, particle coatings or suspension media therefor
A nanostructure layer is disclosed. The nanostructure layer includes an array of nanostructure material configured to receive a first light beam at a first angle of incidence and to emit the first light beam at a second angle greater than the first angle, the nanostructure material each having a largest dimension of less than l000nm.
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
A dual CCT automotive headlight (100) is described herein, comprising: at least one first LED (101) configured to emit light of a first color; at least one second LED (102) configured to emit light of a second color different from the first color; a light mixing device (103) arranged to receive and mix light from the at least one first LED (101) and the at least one second LED (102) and to emit the mixed light. The dual CCT automotive headlight can not only provide homogeneous light of the first color and homogeneous light of the second color, but can also provide homogeneous light of a mixed color.
F21S 41/14 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
F21S 41/663 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
The invention describes a precollimator (P) for a lighting device (L), comprising: a) a number of first collimator units (1) each having an entry face (1a) and an exit plane (1b), wherein for each first collimator unit (1) - the exit plane (1b) is wider than the entry face (1a) in a first direction (x) and - the entry face (1a) and the exit plane (1b) have the same width in a second direction (y) that is perpendicular to the first direction (x) and b) a second collimator unit (2) having an entry plane (2a) and an exit face (2b), wherein the exit face (2b) is wider than the entry plane (2a) in the second direction (y), and wherein the exit plane (1b) of each first collimator unit (1) is optically connected to the entry plane (2a) of the second collimator unit (2), wherein the precollimator (P) is joined together from at least two components. The invention further describes such lighting device and a method to manufacture such precollimator.
F21S 41/663 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
F21S 41/143 - Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
F21S 43/239 - Light guides characterised by the shape of the light guide plate-shaped
F21S 43/243 - Light guides characterised by the emission area emitting light from one or more of its extremities
A carrier base module (1) for a lighting module for automotive lighting and/or signaling and a method for producing a customizable lighting module are described. The carrier base module (1) for a lighting module for automotive lighting and signaling comprises a module body (2) made of a polymer material, at least two lead frame elements (3a, b) embedded in the polymer material of the mounting body, an LED element (4) as a light source mounted on a mounting surface (5) of the module body (2), wherein the mounting surface (5) is arranged in or adjacent to a component potting area (6) in the module body (2). At least two lead frame elements (3a, b) have a first terminal side (8) arranged on the mounting surface (5) or in the component potting area (6) for electrically connecting the LED element (4) and at least two second terminal sides (9) are arranged on the mounting surface (5) or in the component potting area (6), so that at least one additional electronic component (7) can be mounted after the mechanical assembly of the carrier base module (1) to build the lighting module.
A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
The invention refers to a system (4) for optical imaging. The object to provide a system (4) for optical imaging comprising a light source (6) and a light detection unit (8), wherein the light emitted by the light source (6) may be detected in an efficient manner while improving the suppression of ambient light, is solved in that the system further comprises: a first spectral filter (12) of the light source (6), wherein the first spectral filter (12) has a first angular dependence of a transmission passband on an incidence angle; and a second spectral filter (14) of the light detection unit (8), wherein the second spectral filter (14) has a second angular dependence of a transmission passband on an incidence angle; wherein the first angular dependence and the second angular dependence are matched to each other. The invention further corresponds to a use of a lighting device and a method for producing a lighting device for optical imaging.
The invention describes an LED lighting arrangement (10) comprising a single- layer carrier (3) comprising a mounting surface (30), a metal core (32), and a dielectric layer (31) between the mounting surface (30) and the metal core (32);at least one LED string (S1, S2, S3, S4) comprising a plurality of series-connected LED die packages (2) mounted on the mounting surface (30), wherein the LED die packages (2) of a string (S1, S2, S3, S4) are arranged in a two-dimensional array (1) comprising at least two rows; and at least one micro -via (33) extending through the dielectric layer (31) of the single- layer carrier (3) and arranged to electrically connect the final cathode (22) of an LED string (S1, S2, S3, S4) to the metal core (31) of the single- layer carrier (3). The invention further describes a lighting unit (5); and a method of manufacturing an LED lighting arrangement (10).
The invention relates to an optical arrangement (10) including LED lighting elements (20) arranged on a support surface (18). An optical axis X extends from the support surface (18). A first collimator unit (22) includes at least one support element (38) and first collimator elements (40). The support element (38) is supported on the support surface (18) between at least two of the LED lighting elements (20). The first collimator elements (40) are arranged in front of the LED lighting elements (20) in the direction of the optical axis X to collimate light emitted from the LED lighting elements (20). A second collimator unit (24) is arranged in front of the first collimator unit (22) in the direction of the optical axis X. The second collimator unit (24) includes second collimator elements (50) arranged in front of the first collimator elements (40) to collimate light emitted therefrom.
H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
An LED light source (100) is described herein, which comprises: a hollow heat sink (101) having a top wall (201), a bottom opening (202), and a sidewall (203), the top wall (201) including an upper surface (204) and a lower surface (205), the upper surface (204) having a central area (301) and a peripheral area (302), and the top wall (201) having at least one first hole (206) in the peripheral area (302); an interposer (102) being overmolded on the peripheral area (302) and the lower surface (205), and extending through the at least one first hole (206); an LED package (103) comprising at least one LED chip (402) and mounted in the central area (301); an LED driver (104) located within the hollow heat sink (101) and positioned on a side of the interposer (102) facing the bottom opening (202).
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
F21V 29/83 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
H01L 33/54 - Encapsulations having a particular shape
H01L 33/56 - Materials, e.g. epoxy or silicone resin
The invention refers to a lighting device based on at least one light-emitting element arranged on wires. The object to provide a lighting device that is simple and cost-effective to produce and that is in particular conformable to different shapes and may provide for various arrangements of light-emitting elements is solved in that the lighting device (20) comprises: a first wire (2) having a first longitudinal axis (4), a second wire (6) having a second longitudinal axis (8), a light-emitting element (22) being in electrical contact to the first wire (2) and to the second wire (6), wherein the first wire (2) and the second wire (6) intersect within an intersection region (10), wherein the first wire (2) comprises a bent section (12) arranged in the intersection region (10), such that a predefined minimum distance (14) is provided between the first wire (2) and the second wire (6) in the intersection region (10). The invention further relates to a method for producing a lighting device (20) and a use of a lighting device (20).
F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
71.
A METHOD OF MANUFACTURING A LIGHT CONVERTING DEVICE
In a method of manufacturing light converting devices (8) each in form of a converter element (1) attached on a carrier substrate (2), a carrier wafer (7) and a converter wafer (6) with lateral dimensions larger than the lateral dimensions of the converter elements (1) are provided. A bond layer is applied to one of the carrier wafer (7) and the converter wafer (6), and the converter wafer (6) is securely fixed on the carrier wafer (7) via the bond layer, thereby forming a wafer stack. The wafer stack is then separated into pieces (8, 9) such that first (8) of said pieces (8, 9) have the lateral dimensions of the converter elements (1) and do not share any edge with an edge of the wafer stack, said first pieces (8) forming the light converting devices (8). With this method, a light converting device (8) without any squeezed out bonding material, e.g. glue, is achieved.
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
The invention describes a circuit assembly (1) comprising a circuit board (10) with a metal core (11), a pattern of conductive tracks (13), and a dielectric layer (12) between the metal core (11) and the conductive tracks (13); at least one circuit component (20) mounted to the circuit board (10) by means of solder interconnects (33), wherein a solder interconnect (33) is formed between a contact pad (23) of the circuit component (20) and a conductive track (13); characterized in that the metal core (11) comprises at least one cavity (110), wherein a cavity (110) is arranged in the vicinity of a solder interconnect (33). The invention further describes a circuit board (10) for such a circuit assembly (1), and a method of manufacturing such a circuit assembly (1).
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
The invention describes a method of driving an emitter array (1), which method comprises at least the steps of determining a thermal environment profile (30) for the emitters (E11, E12, …, E33) of the emitter array (1); computing a current pulse profile (40) for an emitter (E11, E12, …, E33) on the basis of the thermal environment profile (30); and applying the current pulse (I11, I12, …, I33) with the computed current pulse profile (40) to that emitter (E11, E12, …, E33). The invention also describes an LED arrangement (10).
The invention describes an LED lighting device (LD) comprising an imaging optic (1) and an illumination unit (2), wherein - the illumination unit (2) comprises a row (3) of a plurality of LEDs (3a) and a pre-collimator (4) collimating the light emitted by the LEDs (3 a), and - the imaging optic (1) is arranged such that a focal plane (Pl) of the imaging optic (1) coincides with the LED row (3) of the illumination unit (2). The invention further describes a respective automotive headlight (5), and a method for the assembly of an LED lighting device (LD).
The disclosure relates to an optical element (2) for a lighting device (26), the optical element (2) comprising a body (4) capable of conducting light, wherein the body (4) comprises: a light incoupling surface (6); a light outcoupling surface (8); and side faces (10, 12) situated opposite to each other and extending from the light incoupling surface (6) to the light outcoupling surface (8); wherein at least one of the side faces (10) has an aspherical shape at least in sections. The at least one side face (10) having the aspherical shape is capable of focussing light originating from a first point (16) on the light incoupling surface (6) to a second point (18) on the light outcoupling surface (8) by internal reflection at least in the sections. The optical element (2) may serve in the lighting device (26) as a precollimator with configurable intensity distribution of the precollimated light. The shape of the optical element (2) may be easily determined for various dimensions of the optical element (2). The disclosure further relates to a lighting device (26) and a method for production of a lighting device (26).
A light emitting device (100; 300) includes a semiconductor light emitting diode (LED) (120; 320) having a (e.g., top) light output surface, a ceramic phosphor (130), and an adhesive layer (140; 340) positioned to attach the light output surface of the LED (120; 320) to the ceramic phosphor (130). In one embodiment the adhesive layer (140; 340) is composed of a high refractive index polysiloxane arranged as multiple separate patches (regions) that define at least one channel (142; 346) therebetween, with the at least one channel (142; 346) being open to an environment external to the adhesive layer (140; 340) to permit oxygen permeation into the adhesive layer (140; 340). The adhesive layer (140; 340) can be applied by a patternable dispensing system.
A light source includes a plurality of light emitting diodes, with at least some light emitting diodes (210) sized between 30 microns and 500 microns. A plurality of micro-optics (232, 234) are associated with a light guide plate (230) and sized less than 1 millimeter, with each micro-optic positioned over at least one of the plurality of light emitting diodes. At least some of the combinations of light emitting diode and micro-optics associated with the light guide plate are positioned within a distance to each other sufficient to provide a substantially uniform light beam.
Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60% - 90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are placed in an array type frame. Heat and pressure are applied to the wavelength converting structures in the array type frame.
the imaging optic is arranged such that a focal plane of the imaging optic coincides with the LED row of the illumination unit.
The invention further describes a respective automotive headlight, and a method for the assembly of an LED lighting device.
Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 33/24 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
81.
MULTI-FOCAL COLLIMATING LENS AND BI-FUNCTION HEADLIGHT ASSEMBLY
The embodiments of the invention provide a multi-focal collimating lens (100) and a bi-function headlight assembly. With the relative positions referring to the mounting position of the multi-focal collimating lens (100) within the bi-function headlight assembly, the multi-focal collimating lens (100) includes a lower collimating lens part (101) and an upper collimating lens part (102) located on top of the lower collimating lens part (101). One focal point (103) of the lower collimating lens part (101) is located on a vertical symmetry plane (4) of the lower collimating lens part (101), and two focal points (105, 105') of the upper collimating lens part (102) are symmetrically located on both sides of a vertical symmetry plane (4) of the upper collimating lens part (102), so that a cut-off line (20) of a low beam can be generated in a far-field light pattern of the multi-focal collimating lens (100).
An LED controller system includes an LED controller including an image frame buffer able to receive image data. A sensor processing module is used to receive and process sensor data and a decision module is used to determine actions taken in response to processed sensor data. An image creation module is used to create images to be sent to the image frame buffer of the LED controller.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
83.
DYNAMIC PIXEL DIAGNOSTICS FOR A HIGH REFRESH RATE LED ARRAY
A LED controller for an LED pixel array includes a switch K1 activated in response to a row and column select signal; a switch K2 activated in response to a pulse width modulation duty cycle; and a switch K3 providing a current source from Vbias. Pixel activation is determined at least in part by state of switch K1 and K2. In operation, the LED pixel in the LED pixel array is selected by switch K1 and a fault determination for the LED pixel is made based on determined Vf on a Vf bus.
H05B 33/08 - Circuit arrangements for operating electroluminescent light sources
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
A vehicle headlamp system includes a vehicle supported power and control system including a data bus. A sensor module can be connected to the data bus to provide information related to environmental conditions or information relating to presence and position of other vehicles and pedestrians. A separate headlamp controller can be connected to the vehicle supported power and control system and the sensor module through the bus. The headlamp controller can include an image frame buffer that can refresh held images at greater than 30Hz speed. An active LED pixel array can be connected to the headlamp controller to project light according to a pattern and intensity defined by the image held in the image frame buffer and a standby image buffer can be connected to the image frame buffer to hold a default image.
B60Q 1/06 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights adjustable, e.g. remotely-controlled from inside vehicle
A LED controller for an LED pixel array includes an image frame buffer to receive image data and a standby image buffer connected to the image frame buffer to hold a standby image. A command and control module connected is configured to substitute the standby image in the standby image buffer for the image in the image frame buffer when image data is unavailable.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
B60Q 1/14 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights having dimming means
F21S 41/153 - Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
G09G 3/30 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels
F21S 41/00 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
The invention refers to a lighting device (1) comprising at least one heat sink (2) and/or lead frame and an overmould (3), in particular in the area of automotive exterior or interior lighting. The object of the invention, to provide a lighting device having a flexible design, which allows for inexpensive adaptations both in the production process and preferably also at a later stage in the life time of the lighting device, is solved according to a first aspect of the present invention, in that a lighting device is proposed, the lighting device (1) comprising at least one heat sink (2) and/or lead frame; at least one lighting module (5) thermally connected with the at least one heat sink and/or lead frame; an overmould (3) configured to at least partially encase the at least one heat sink (2) and/or lead frame, wherein the overmould (3) comprises at least one receiving portion (34) configured for receiving at least one circuit board (4); at least one circuit board (4) mounted in the at least one receiving portion (34), the at least one circuit board (4) comprising at least two bond pads (41) for establishing an electrical connection to the at least one lighting module (5). The invention further relates to a method employed in the production of a lighting device and a use of a lighting device.
F21V 29/70 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
F21V 17/00 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
F21V 19/00 - Fastening of light sources or lamp holders
F21S 43/19 - Attachment of light sources or lamp holders
F21S 41/19 - Attachment of light sources or lamp holders
F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
The invention refers to a support (2) for light-emitting elements (22). The object to provide a support (2) that provides effective heat transport and electrical conduction when at least one light-emitting element (22) is arranged on the support (2), 5 that also may provide for various shapes and in particular three-dimensional arrangements of light-emitting elements (22), as well as allowing to obtain optical properties desirable for retrofitting applications, is solved in that the support comprises: a mounting section (4) with at least one mounting face (6a, 6b, 6c), wherein the at least one mounting face (6a, 6b, 6c) has an arrangement direction (8) and is configured for accommodating at least one light-emitting element (22) arranged along the arrangement direction (8); a body section (10) arranged adjacent to the mounting section (4); and conductors (12) for providing electric connection from the body section (10) to the at least one mounting face (6a, 6b, 6c); wherein the at least one mounting face (6a, 6b, 6c) comprises at least two contact sections (16) along the arrangement direction (8), each 15 contact section corresponding to a conductor (12) and being separated by an insulating section, and wherein the body section (10) protrudes sidewards from the at least one mounting face (6a, 6b, 6c). The invention further relates to a lighting device (20) and a method for producing a lighting device (20).
F21S 41/151 - Light emitting diodes [LED] arranged in one or more lines
F21K 9/23 - Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
F21V 29/70 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
F21S 41/19 - Attachment of light sources or lamp holders
F21S 45/47 - Passive cooling, e.g. using fins, thermal conductive elements or openings
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The present invention relates to an optical device for automotive lighting. The optical device comprises: a plurality of light sources; a plurality of primary optics arranged in a matrix and configured to receive and redirect light from the plurality of light sources; and a secondary optics configured to receive the redirected light from the plurality of primary optics and project out the received light into a desired beam pattern. Each of the primary optics is shaped as a light guide with a light entrance face and a light exit face at two opposite ends thereof, which light guide is configured to guide light incident at the light entrance face via total internal reflection to the light exit face where light is refracted out towards the secondary optics. Each light guide further comprises a plurality of side faces extending between the light entrance face and the light exit face. For at least one light guide, at least one side face comprises a curved face, whose curvatures at different positions are designed, by sweeping a polygonal line along a direction perpendicular to the desired direction and perpendicular to a light guiding direction of the at least one light guide, such that a first desired gradient light intensity distribution is projected out along a desired direction by the secondary optics.
The present invention relates to an optical device for automotive lighting. The optical device (10, 20, 30, 40) comprises: a plurality of light sources (11); a plurality of primary optics (12) arranged in a matrix and configured to receive and redirect light from the plurality of light sources (11); and a secondary optics (13) configured to receive the redirected light from the plurality of primary optics (12) and project out the received light into a desired beam pattern. Each of the primary optics (12) is shaped as a light guide (22, 32, 42, 62a, 62b) with a light entrance face (221, 321) and a light exit face (222, 322, 622a, 622b, 722) at two opposite ends thereof, which light guide (22, 32, 42, 62a, 62b) is configured to guide light incident at the light entrance face (221, 321) via total internal reflection to the light exit face (222, 322, 622a, 622b, 722) where light is refracted out towards the secondary optics (13). Each light guide (22, 32, 42, 62a, 62b) further comprises a plurality of side faces (223, 323, 224, 324) extending between the light entrance face (221, 321) and the light exit face (222, 322, 622a, 622b, 722). For at least one light guide (22, 32, 42, 62a, 62b), at least one side face comprises a curved face (224, 324), whose curvatures at different positions are designed, by sweeping a polygonal line along a direction which is perpendicular to the desired direction and perpendicular to a light guiding direction of the at least one light guide (32), such that a first desired gradient light intensity distribution is projected out along a desired direction by the secondary optics.
F21S 41/143 - Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
F21S 41/663 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
F21S 41/153 - Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
PPPPXPPP) according to a predefined illumination pattern (X1, …, X4, XC); a number of image sensors (S, S1, S2), wherein an image sensor (S, S1, S2) is arranged to detect light (R) reflected from a scene (3) irradiated by the irradiation pattern (X1, …, X4, XC); and a processing unit (12) realised to compute a depth map (DM) of the scene (3) on the basis of a light pattern detected by an image sensor (S, S1, S2). The invention further describes an irradiation arrangement for use in such a depth map generator (1); a method of generating a depth map (DM) of a scene (3); and a device comprising such a depth map generator (1).
An illumination device comprises one or several lasers (1) emitting light of a first wavelength or wavelength range, a wavelength converting member (3) converting at least part of the light of the first wavelength or wavelength range into light of a second wavelength or wavelength range, a scanning unit (2) adapted to scan one or several laser beams (9) of said one or several lasers (1) across said wavelength converting member (3) in order to generate an illumination pattern formed at least of the light of the second wavelength or wavelength range, and, optionally, an imaging optics imaging said illumination pattern to the far field. A first light guiding structure (7) is arranged on a light emitting side of said wavelength converting member (3), said first light guiding structure (7) forming a grid of first light guiding channels (8). The illumination device can be used as an adaptive headlamp of a vehicle and achieves a high contrast between illuminated and dark regions as well as a high efficiency with a small projection optics.
F21S 41/675 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
A lighting system (22, 32) includes a plurality of lighting units (10). Each lighting unit (10) includes a unit control circuit (18) and a lighting element (16). The unit control circuit (18) is disposed to store at least one lighting scenario (20). The lighting scenario (20) comprises a succession of settings of intensity and / or color of the lighting element (16). A system control circuit (34) is disposed to transmit an execute signal to one or more of the lighting units (10). The unit control circuit (18) is disposed to control, upon reception of the execute signal, the lighting element (16) according to the lighting scenario (20). The lighting units (10) are connected to a common electrical power supply (24) via two conductors (12, 14). The execute signal is transmitted from the system control circuit (34) to the lighting units (10) wirelessly or via the two conductors (12, 14).
A flexible lighting strip (100) comprising a multitude of LEDs (22) which arranged in at least two groups, each comprising at least two LEDs (22) connected series. The at least two groups of LEDs (22) are arranged in parallel to at least an anode track (12) and a cathode track (14) as outer lines (12,14). A last LED (22) of a first group is arranged next to a first LED (22) of a second group. Each of the outer lines (12, 14) consists of a substantially circular wire (30) being bend building zones. A third wire line (15) having a substantially circular wire (30) is arranged between the outer lines (12, 14) that are able to receive compressive and/or tensile stress. At least one LED (22) of every group is mounted on an interposer (24), whereby the interposer (24) contacts all three wire lines (12, 14, 15).
F21S 4/22 - Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
F21S 4/10 - Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
F21S 41/151 - Light emitting diodes [LED] arranged in one or more lines
The invention describes a method for producing a flexible lighting strip (100) comprising a multitude of functional elements (21) in a longitudinal arrangement. The functional elements (21) comprise light-emitting diodes (22). In one alternative, the functional elements (21) may be light-emitting diodes (22) itself. In another alternative, the functional elements (21) may be interposers (24) with light-emitting diodes (22) mounted thereon. The functional elements (21) are arranged in at least two groups. Each group comprises at least two functional elements (21) arranged in an electrical series connection. The at least two groups are arranged in an electrical circuit having at least an anode track (12) and a cathode track (14) as outer lines (12, 14), wherein the at least two functional elements (21) are arranged in an electrical parallel connection to the anode track (12) and the cathode track (14). The at least two groups are arranged in a longitudinal arrangement such that a last functional element (21) of a first group is arranged next to a first functional element (21) of a second group. Each of the outer lines (12, 14) consists of a wire line having substantially circular wires (30), whereby the wires (30) of the outer lines (12, 14) are bent building zones that are capable to receive compressive and/or tensile stress. The electrical circuit provides a third wire line (15) having a substantially circular wire (30) as a center line arranged between the outer lines (12, 14). The method comprises the steps of soldering a first functional element (21) to a first wire segment and connecting of the at least one wire segment to a second functional element.
F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
F21S 4/24 - Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
F21Y 103/10 - Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
F21Y 107/70 - Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
95.
LIGHTING DEVICE COMPRISING LEDS AND REFLECTION ELEMENT
The invention refers to a lighting device (20) comprising multiple light emitting diodes (LEDs) (30). The object to provide a lighting device (20), wherein the effectivity of the lighting device (20) is increased and allows maintaining a simple manufacturing process, is solved in that the lighting device (20) comprises: a housing (22) having a longitudinal direction, the housing (22) comprising: reflective side walls (24) extending in the longitudinal direction, a first cavity (26) disposed between the reflective side walls (24), and an opening (28) of the first cavity (26) for the passage of light from the first cavity (26); LEDs (30), each LED (30) having a light-emitting face (32) and side faces (34), wherein the LEDs (30) are arranged on interposers (36) for providing electrical connection of the LEDs (30), wherein the LEDs (30) are arranged in the first cavity (26) such that the LEDs (30) are at least partially arranged along the longitudinal direction of the housing (22) relative to each other; and a reflection element (40) that covers a side of the interposers (36) facing the opening (28), wherein the reflection element (40) surrounds the LEDs (30) on the side faces (34), wherein the reflection element (40) is configured as strip comprising through holes in which the LEDs (30) are arranged. The invention further refers to a method for producing a lighting device (20) and a use of a lighting device (20).
Light converting device (130) comprising: - a substrate (131) functioning as a heatsink, - a light converter (134) adapted to convert laser light (10) to converted light (20) having a longer wavelength than the laser light (10), wherein the light converter (134) comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, wherein the bonding surface is mechanically and thermally coupled to the substrate (131), - a reflective structure (137) attached to or part of the substrate (131) and comprising at least one reflective metal surface arranged to reflect laser light (10) and converted light (20), wherein the reflective structure (137) is arranged on the side of the substrate (131) facing the light converter (134), and - a translucent ceramic protection layer (138), arranged between the reflective structure (137) and the light converter (134), and having a thickness of less than 50 m icrometres.
F21K 9/64 - Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
F21V 9/30 - Elements containing photoluminescent material distinct from or spaced from the light source
F21V 9/32 - Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
F21S 45/47 - Passive cooling, e.g. using fins, thermal conductive elements or openings
F21V 29/502 - Cooling arrangements characterised by the adaptation for cooling of specific components
F21V 29/505 - Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
97.
Light converting device with ceramic protection layer
F21S 41/37 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
F21S 41/176 - Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
The invention refers to a lighting device comprising at least one light emitting diode (LED). The object to provide a lighting device that is capable of providing a light pattern for illuminating an object in 3D imaging, wherein the lighting device is simple and cost-effective to manufacture, while the lighting device may in addition have a very small form factor, is solved in with a lighting device comprising: at least one LED (4) for emitting light towards a light-emitting side (6); a first grating (8) with a regular pitch having light-blocking sections (10) and light-permeable sections (12); wherein the first grating (8) is arranged on the light-emitting side (6) to block the passage of light at the light-blocking sections (10), such that the light passing the light-permeable sections (12) is capable to illuminate an object with a line pattern. The invention further corresponds to a method for producing a lighting device (2) and the use of a lighting device (2).
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
χγZχγZZ) is arranged in the same plane as the optical centre of the LED arrangement (2_lo, 2_hi). The invention further describes a method of manufacturing such an LED lighting assembly (1).
A lighting module (10), a lighting system (60) with a lighting module (10), and a method of replacing a lighting module (10) in a lighting system (60) are described. The lighting module (10) comprises a heat sink (12) with a body portion (14) and a protrusion portion (16) protruding from the body portion (14) into a forward direction F. An LED element (30a) is mounted on a mounting surface (26a) of the protrusion portion (16). The mounting surface (26a) is arranged facing partially backwards and forming an angle of 5- 45° to the forward direction F. An electrical plug connector (40) is provided at the body portion (14). The LED element (30a), (30b) is electrically connected to the electrical plug connector (40) and the electrical plug connector (40) is provided within a cavity (42) of the body portion (14). In the lighting system, a reflector assembly (62) comprises a concave reflector with an inner reflector space (70). A lighting module (10) is arranged such that its protrusion portion (16) projects into the inner reflector space. Light emitted from the LED element (30a) is reflected by the reflector. The body portion (14) is arranged outside of the reflector space (70). The lighting module (10) may be replaced by separating the lighting module from the reflector assembly (62) and providing a new lighting module (10).
F21S 41/19 - Attachment of light sources or lamp holders
F21S 45/47 - Passive cooling, e.g. using fins, thermal conductive elements or openings
F21Y 107/50 - Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
