The disclosure provides a thermally assisted magnetic head comprising a slider and a light source unit provided on the slider. An intermediate connection pad is provided in such a manner that the first light source connection pad and the second light source connection pad of the slider are arranged in a row on a straight line while the intermediate connection pad is not located on the said straight line. The first electrode of the light source unit is electrically connected with the first light source connection pad, and both the second electrode of the light source unit and the second light source connection pad are electrically connected with the intermediate connection pad. Accordingly, a head gimbal assembly and a hard disk drive are further provided in the embodiment of the disclosure.
A PMR read/write transducer head configured for heat assisted recording (HAMR) includes thermally active nano-bumper pads formed from a thermally active bulge that protrudes proximally to each side of a read element to provide enhanced touchdown (TD) protection to the transducer head element where it emerges adjacent to the HAMR apparatus. The bumper pads, which can be multiple, are disposed about the transducer head and absorb heat energy generated by active heating elements, including the write current. Absorption of this energy causes the bulge to expand and vary its shape and protrude proximally outward from the slider ABS to protect the read/write head from both intentional and unanticipated touchdown events. The PMR read/write head is then mounted on a slider and the assembly is incorporated into a hard disk drive (HDD).
The present disclosure provides a laser diode and a method for preparing a stacked high-density laser diode array. The laser diode includes a substrate and a stack layer, where the stack layer includes a P-type layer with a ridge strip; the laser diode is provided with a waveguide surface, a light output surface, a reflective surface, and a bottom surface; a top side of the P-type layer forms the waveguide surface, and a bottom side of the substrate forms the bottom surface; the waveguide surface is provided opposite to the bottom surface; the bottom surface is provided with at least one groove; an extension direction of the groove is perpendicular to the ridge strip; and edges of two sides of the waveguide surface, the light output surface, and the reflective surface are all coated.
A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
5.
Self-aligned hybrid near field transducer with single peg grain
SAE Technologies Development (Dongguan) Co., Ltd. (China)
SAE Magnetics (Hong Kong) Limited (Hong Kong)
Inventor
Jin, Xuhui
Yang, Pengbo
Shimazawa, Koji
Guo, Hong
Guo, Qinghui
Chiah, Vincent Man Fat
Abstract
A near field transducer (NFT) having improved reliability is disclosed. In some embodiments, a NFT includes a resonator body layer having a front side at a first plane that is recessed a first distance from an air bearing surface (ABS), and a peg layer that is a single layer made of a noble metal or alloy thereof. The peg layer includes a peg portion or peg with a front side at the ABS, a back side at the first plane, and two sides aligned orthogonal to the ABS and separated by the first cross-track width. The peg portion or the peg having a single peg grain with or without a desired (111) orientation through laser self-annealing process.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
6.
Magnetic head, head gimbal assembly, hard disk drive, and method for processing magnetic head
The present disclosure discloses a magnetic head, a head gimbal assembly, a hard disk drive, and a method for processing a magnetic head. The method comprises irradiating at a fixed point proximal to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar; and disassembling the magnetic strip to obtain a lapped magnetic head. Through laser heating induced compensation, the heights of lapped read head and write head of the magnetic head meet their respective target values, ensuring the normal reading and writing of the storage medium of the magnetic disk.
The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
8.
Microwave-assisted magnetic recording (MAMR) head slider with diamoind-like carbon layer and a silicon nitride layer, and related head gimbal assembly and disk drive unit
The present disclosure discloses a device with a protective layer, including a substrate, a seed layer formed on the substrate, and a diamond-like carbon layer formed on the seed layer, where the seed layer is a silicon nitride layer, and a content of nitrogen in the silicon nitride layer is 9%-17%. The present disclosure further discloses a microwave-assisted magnetic recording (MAMR) head slider, a head gimbal assembly, and a disk drive unit. The device has good thermal stability, oxidation resistance and corrosion resistance, thereby improving reliability and prolonging service life of an MAMR head.
G11B 5/255 - Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to, the recording mediumPole piecesGap features comprising means for protection against wear
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/40 - Protective measures on heads, e.g. against excessive temperature
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 5/48 - Disposition or mounting of heads relative to record carriers
9.
Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.
A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
11.
Thermally assisted magnetic head including a record/read separate protective structure, head gimbal assembly and hard disk drive each having the thermally assisted magnetic head
A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a recording head, a reading head, a near field transducer and a medium-opposing surface. The medium-opposing surface includes a recording area and a reading area. The magnetic head part includes a record/read separately protective structure which a stabilized protective film is formed on the recording area and a reading head protective film is formed on the reading area. The stabilized protective film includes a three-layers structure which a seed layer and a double protective layer are laminated. The double protective layer includes a YSZ protective layer and a hard protective layer. The reading head protective film includes a thickness which is thinner than the stabilized protective film.
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
12.
Adhesive glue, curing method therefor, and application thereof
The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.
A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.
A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a recording head, a reading head, a near field transducer and a medium-opposing surface. The medium-opposing surface includes a recording area and a reading area. The magnetic head part includes a record/read separately protective structure which an enhanced protective film is formed on the recording area and a reading head protective film is formed on the reading area. The enhanced protective film includes a plurality of films for effectively protecting the recording head and the near field transducer. The reading head protective film includes a thickness which is thinner than the enhanced protective film.
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
15.
Head gimbal assembly, manufacturing method thereof, and disk drive unit
An HGA includes a slider and a suspension for supporting the slider, wherein the suspension includes a flexure having a plurality of electrical traces formed thereon and a gimbal connection area supported and connected to the slider, a first surface of the gimbal connection area is provided with a first adhesive and a second adhesive respectively formed thereon and between the first surface and an opposite surface of an air bearing surface of the slider, an opposite surface of the first surface of the gimbal connection area is contacted with a dimple, and the dimple is located at a position between first adhesive and the second adhesive. The HGA can eliminate torsion and sway gain in frequency response function testing, and maintain AC stroke sensitivity and linearity of elements, thereby finally improving the performance of the disk drive unit.
A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.
H01S 5/34 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
G01S 17/931 - Lidar systems, specially adapted for specific applications for anti-collision purposes of land vehicles
H01L 33/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
A thin-film piezoelectric material elements are arranged on a thin-film piezoelectric material substrate. The thin-film piezoelectric material substrate includes an insulator on Si substrate including a substrate including silicon and an insulating layer on a surface of the substrate. The thin-film piezoelectric material element includes a thin-film laminated part on a top surface of the insulating layer. The thin-film laminated part includes a YZ seed layer including yttrium and zirconium, and formed on the top surface; a lower electrode film laminated on the YZ seed layer; a piezoelectric material film including lead zirconate titanate, shown by a formula Pb (ZrxTi(1-x)) O3(0≤×≤1), and an upper electrode film laminated on the piezoelectric material film. The thin-film laminated part further includes an upper piezoelectric-material protective-film, laminated on the upper side of the upper electrode film.
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
C23C 14/02 - Pretreatment of the material to be coated
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/319 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
A slider-mounted read/write transducer for a hard disk drive (HDD) has a topology that mitigates attraction and accumulation of lubricant and hydrocarbons during the HDD operation. The slider topology may include a pattern of cavities and channels symmetrically disposed about a central longitudinal axis. The slider may also have a transverse channel extending perpendicularly inward from an opening in each side edge of the slider to intersect a channel that extends longitudinally along a middle axis towards a leading-edge pad in which a read/write transducer is embedded. The ends of the transverse channel open into an air-carrying groove extending vertically upward in the side of the slider in which a side flow blocker (SFB) restricts the air flow into the channel portion.
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 21/21 - Supporting the headsSupporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
19.
Microwave assisted magnetic recording head slider and lapping method thereof
A lapping method of a MAMR head slider includes a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider; and the second lapping process includes a final lapping process section, and the second force in the final lapping process being zero. In such a way, lapping marks on the ABS are reduced to improve the roughness and the reliability.
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
G11B 5/255 - Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to, the recording mediumPole piecesGap features comprising means for protection against wear
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
20.
Angle detection apparatus, angle detection system, park lock system, pedal system, and magnetic field generation module
An angle detection apparatus includes a magnetic sensing element, a magnetic field generator, and a yoke. The magnetic field generator is rotatable around a rotation axis with respect to the magnetic sensing element and generates a magnetic field. The yoke is disposed in a magnetic-field influence region and is rotatable together with the magnetic field generator. The magnetic-field influence region is a region that lies between the magnetic field generator and the magnetic sensing element in a rotation axis direction along the rotation axis, and that is to be influenced by the magnetic field.
G01D 5/14 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
21.
Protective shields under touchdown conditions for thermally assisted perpendicular magnetic recording
A Perpendicular Magnetic Recording (PMR) head is configured for use in Thermally Assisted Magnetic Recording (TAMR). Two or three contiguous write shields, of various widths and thicknesses, formed on a leading edge side of the write gap (WG), main pole (MP) and near-field transducer (NFT), protect the head during write touchdowns (TD) and signal the approach of such a touchdown. Moreover during a write touchdown the contact with the head is restricted to the large write shields, producing a large touchdown area (TDA) and insuring the lifetime of the head.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 5/39 - Structure or manufacture of flux-sensitive heads using magneto-resistive devices
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
22.
Thermally-assisted magnetic recording head having active layer with quantum dot structure
A light source-unit includes a laser diode, a sub-mount which the laser diode is joined. The laser diode includes an optical generating layer including an active layer which emits laser-light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/39 - Structure or manufacture of flux-sensitive heads using magneto-resistive devices
G11B 13/04 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom magnetically and optically
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
23.
MEMS package, MEMS microphone and method of manufacturing the MEMS package
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
A thermally assisted magnetic head including a main magnetic pole layer having a magnetic pole end face arranged in a medium-opposing surface, a near-field transducer which generates a near-field light for heating the magnetic recording medium, a waveguide guiding light to the near-field transducer; and an optical side shield being arranged in the medium-opposing surface side of the waveguide and being formed so as to sandwich a part of the near-field transducer, in the medium-opposing surface side, from both sides of a direction along the medium-opposing surface. The near-field transducer includes a protruding end-part (PEG). Then the protruding end-part is arranged to have a PEG end-surface at a position receded from the medium-opposing surface.
A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The slider substrate includes a light source-cavity formed in a light source-placing surface on which the light source-unit is placed. The light source-cavity includes an opening concave part being formed larger than a mount bottom surface of the sub-mount. The mount bottom surface of the sub-mount is inserted into the opening concave part to be joined to the light source-cavity.
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/39 - Structure or manufacture of flux-sensitive heads using magneto-resistive devices
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
27.
Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone
A thin-film filter includes thin-film part having a film surface and a rear film surface arranged at the rear side of the film surface, a plurality of through holes, being formed to penetrate the thin-film part from the film surface to the rear film surface, the through holes are formed along by a slanting direction being made an acute angle or an obtuse angle with the film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along by the slanting direction. The stripes-formed inner wall surfaces are formed inside the respective through holes.
A slider design for a hard disk drive (HDD) features a shallow cavity adjacent to a leading edge that has patterns of sub-cavities of various shapes etched into its base to reduce its original surface area. The presence of these patterns of sub-cavities significantly reduces the probability that the slider will capture particles on the surface of a rotating disk and thereby reduces the corresponding probability of surface scratches that such captured particles inevitably produce.
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 21/21 - Supporting the headsSupporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
G11B 5/48 - Disposition or mounting of heads relative to record carriers
A light source unit for thermally-assisted magnetic head includes a substrate member having a first bonding surface; a light source assembly attached on the first bonding surface of the substrate member and having a second bonding surface; and a heater circuit assembly formed between the substrate member and the light source assembly, the heater circuit assembly having a heater formed on the substrate member and two leads connected at two ends of the heater, the lead being thicker than the heater, thereby a distance between the heater and the second bonding surface is farther than that between the lead and the second bonding surface. The light source unit can reduce mechanical stress and thermal conduction between a light source assembly and a substrate member, thereby improving the performance of the light source assembly and the heater.
A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
A method of operating an HDD having a slider-mounted read/write head that is configured for dynamic fly-height operation (DFH) and includes at least one head-disk interference sensor (HDIs). By operating the DFH to lower the head and subjecting the HDIs signal to a power-law enhancement, a consistent and accurate determination of the touchdown power (TDP) can be obtained. Combining absolute TDP determination with a method for measuring relative changes of FH, an absolute determination of FH can be determined.
A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the package substrate has a sound hole. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the movable element, and a gel member. The MEMS chip is mounted on the package substrate so that the movable element opposes to the sound hole. The gel member is formed by hardening of gel which is applied on the annular dam-member from outside so as to surround the annular dam-member.
H04R 1/04 - Structural association of microphone with electric circuitry therefor
34.
Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone
A thin-film filter includes thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along with an intersecting direction intersecting the film surface. The stripes-formed inner wall surfaces are formed inside the respective through holes.
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
The present invention relates to the field of camera shake reduction technology and discloses a suspension assembly of OIS, which comprises a printed circuit board and a spring plate movably disposed on the printed circuit board, wherein the printed circuit board is electrically connected with the spring plate, the printed circuit board comprises a substrate plate and a bend portion extending downwards along any side edge of the substrate plate, a support component is attached to a bottom surface of the substrate plate, a plurality of conductive terminals are arranged on an outside surface of the bend portion, a plurality of reinforce components are arranged on an inside surface of the bend portion and corresponding to the plurality of conductive terminals one to one, and the plurality of reinforce components are placed at intervals and do not contact with each other.
A piezoelectric device comprises a pressure chamber forming layer, a vibration plate disposed on and connected with the pressure chamber forming layer to form a pressure chamber, and a piezoelectric element disposed on the vibration plate and used for driving the vibration plate to move and thus changing a volume of the pressure chamber, wherein the piezoelectric element is disposed on the vibration plate in such a manner as to cover a portion of the pressure chamber, the piezoelectric element has two opposite ends respectively extending beyond an edge of the pressure chamber and covering the pressure chamber forming layer. The piezoelectric device of the present invention can efficiently actuate the vibration plate, eliminate undesired displacements of the vibration plate in the opposite direction at the edge of the chamber, and provide higher displacement sensitivity to driving voltage.
A method of operating a HDD having a read/write head configured for Perpendicular Magnetic Recording (PMR) and configured for use in Thermally Assisted Magnetic Recording (TAMR). By using selected settings of a power ratio (PR) value to ensure that accurate fly height (FH) measurements of head-disk interference (HDI) can be taken during write touchdowns (TDs), head damage can be eliminated during HDI events. Under normal operating conditions the PMR head develops a sharp protrusion due to heating from the TAMR apparatus as well as the write current and read and write heaters. The sharp protrusion is prone to striking the disk surface, instead of the shields doing so. The shields would be more capable of absorbing the HDI, which would allow the HDI sensors (HDIs) to provide a more sensitive reading of the HDI which would prevent head wear caused by the sharp protrusion. By adjusting the power ratio (PR) to be at least the turning point (TP) value, the write shield will approach the disk surface before the sharp protrusion.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 11/10 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
39.
Thermally-assisted magnetic recording head having optimal reflecting position inside waveguide
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 13/04 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom magnetically and optically
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 11/24 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by near-field interactions
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
40.
Disk drive thermally assisted magnetic recording head having a slider and a tilted light incident surface
A thermally assisted magnetic recording head and a thermally assisted magnetic recording disk drive are disclosed. The thermally assisted magnetic recording head includes a slider body, a laser substrate, a laser and a magnetic head, wherein the laser substrate is provided on the slider body, the laser is provided on the laser substrate, and the magnetic head is provided at a front end of the slider body. The magnetic head includes an optical waveguide facing the laser. The angle between a light incident surface of the optical waveguide and an incident direction of a laser light incident on the optical waveguide is less than 90 degrees. The thermally assisted magnetic recording disk drive includes a plurality of magnetic disks and a magnetic head suspending frame. A front end of the magnetic head suspending frame is provided with the thermally assisted magnetic recording heads mentioned above.
A PMR read/write head configured for thermally assisted recording (TAMR) includes thermally active bumper pads formed to each side of a write element to provide enhanced touchdown (TD) protection to the write head element where it emerges adjacent to the plasmon near-field spot produced by the TAMR apparatus. The bumper pads are disposed about the write head and absorb heat energy generated by active heating elements, the write current and the energy generated by the TAMR apparatus. Absorption of this energy causes the bumper pads to expand and protrude outward from the slider ABS to protect the read/write head from both intentional and unanticipated touchdown events. The PMR read/write head is then mounted on a slider and the assembly is incorporated into a hard disk drive (HDD).
A light source-unit which is used for a thermally assisted magnetic head, comprises a laser diode and a sub-mount which the laser diode is joined. The sub-mount comprises a joint-surface which the laser diode is joined and a convex part protruding from the joint-surface. The light source-unit comprises an alloy layer, made of alloy, which is formed between the surface of the convex part and an opposing-surface, of the laser diode, opposing to the joint-surface.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
A thermally assisted magnetic head includes a slider, the slider includes a slider substrate and a magnetic head part. The magnetic head part includes a medium-opposing surface opposing a magnetic recording medium, a light source-opposing surface arranged rear side of the medium-opposing surface, an anti-reflection film formed on the light source-opposing surface, a core layer and a cladding layer. The anti-reflection film includes a stacked structure which a first layer and a second layer are stacked. The second layer is formed with high refractive index dielectric having the refractive index higher than the first layer.
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
44.
System for transition curvature improvement on a thermally assisted magnetic recording
A system for transition curvature improvement on thermally assisted magnetic recording, includes: an energy source, a thermally assisted magnetic recording head including a magnetic main pole for writing of a thermally assisted magnetic recording medium, a waveguide for directing an energy produced by the energy source, and a PPG including a peg and adjacent to the waveguide, the PPG being for turning the energy into a surface plasmon which travels down the peg to heat the thermally assisted magnetic recording medium. The magnetic main pole includes a first portion enabling a first magnetic field strength and at least one additional portion enabling a magnetic field strength stronger than the first magnetic field strength such that a magnetic field of the magnetic main pole along a horizontal direction thereof enables generation of a substantially straight transition curve while writing on the thermally assisted magnetic recording medium.
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G11B 5/147 - Structure or manufacture of heads, e.g. inductive with cores being composed of metal sheets, i.e. laminated cores
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/187 - Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to, the recording mediumPole piecesGap features
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
46.
Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film
A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.
H01L 41/053 - Mounts, supports, enclosures or casings
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/083 - Piezo-electric or electrostrictive elements having a stacked or multilayer structure
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
H01L 41/27 - Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes
A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
G11B 5/48 - Disposition or mounting of heads relative to record carriers
48.
Head gimbal assembly thin-film piezoelectric-material element arranged in step part configuration with protective films
A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part.
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/083 - Piezo-electric or electrostrictive elements having a stacked or multilayer structure
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/27 - Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes
A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface.
A light source unit for thermally-assisted magnetic head includes a substrate member having a bonding surface, multiple layers formed on the bonding surface and comprising a base layer, a connection pad layer, an insulation layer and a bonding layer; a light source assembly attached on the bonding layer of the substrate member and having a laser diode embedded therein and connected to the connection pad layer on the bonding surface, so as to form a laser diode circuit; and a heater buried in the insulation layer and connected to the connection pad layer, so as to form a heater circuit. The light source unit can maintain stable heat power for facilitating performance of the thermally-assisted magnetic head, and further reduce the sizes of the light source unit and substrate member.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 5/012 - Recording on, or reproducing or erasing from, magnetic disks
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
51.
Air-bearing surface (ABS) design to reduce particle scratch risk
A slider design for a hard disk drive (HDD) features a shallow cavity adjacent to a leading edge that has patterns of sub-cavities of various shapes etched into its base to reduce its original surface area. The presence of these patterns of sub-cavities significantly reduces the probability that the slider will capture particles on the surface of a rotating disk and thereby reduces the corresponding probability of surface scratches that such captured particles inevitably produce.
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 21/21 - Supporting the headsSupporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
G11B 5/48 - Disposition or mounting of heads relative to record carriers
A light source-unit comprises a laser diode, a sub-mount which the laser diode is joined, and a heater which is joined on a joint surface of the sub-mount. The sub-mount comprises a pair of barrier-members. The barrier-members are formed with lower thermal conductivity material which thermal conductivity is lower than joining metal which is used for joining the laser diode and the sub-mount. The barrier-members are formed on the joint surface so as to sandwich the heater.
G11B 11/105 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor using recording by magnetisation or demagnetisation using a beam of light or a magnetic field for recording and a beam of light for reproducing, e.g. light-induced thermomagnetic recording or Kerr effect reproducing
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
53.
Thin-film piezoelectric material substrate, thin-film piezoelectric material element, head gimbal assembly, ink jet head and method of manufacturing the thin-film piezoelectric
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/319 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
Disclosed is a camera module that comprises a lens assembly that includes a lens base and a lens tube integrated with the lens base for receiving at least one lens; and a voice coil motor assembly for driving the lens assembly, comprising a base, two leaf springs, at least two coils, and at least two magnets. The coils are respectively fixed on two opposite sides of the base, the magnets are fixed on two opposite sides of the lens assembly respectively, and the magnets are located by inner sides of the coils respectively, the lens assembly is clamped by the leaf springs and supported on the base, the coils drive the magnets and the lens assembly to move after being energized. The camera module is simply structured, easy to assembly, less bulky and fit for the demand of thin products.
G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
G02B 7/28 - Systems for automatic generation of focusing signals
H02K 41/00 - Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
Disclosed is a piezoelectric apparatus, comprising a pressure chamber forming layer, a vibrating reed arranged on the pressure chamber forming layer and connected to the pressure chamber forming layer to form a pressure chamber, and a piezoelectric element arranged on the vibrating reed and used for driving the movement of the vibrating reed so as to change the volume of the pressure chamber, wherein the piezoelectric element on the vibrating reed covers a part of the pressure chamber, and the piezoelectric element has two end portions arranged opposite each other; and the two end portions respectively extend out of an edge of the pressure chamber and cover the pressure chamber forming layer. The piezoelectric apparatus of the present invention can drive a vibrating reed with high efficiency, eliminates disadvantageous displacement of the vibrating reed on an edge of a chamber in opposite directions, and has high displacement sensitivity to a driving voltage.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
56.
Procedure for setting laser and heater power in HAMR device
A heater power of a heat-assisted magnetic recording head is set based on an initial head-medium clearance estimate in response to the heater power. For a plurality of iterations, an optimum laser power of the recording head is determined and a heater power is set for a next iteration that results in an optimum heater power for the optimum laser power. If differences in the heater and laser powers between two subsequent iterations are below thresholds, the iterations are stopped and the optimum heater power and the optimum laser power for one of the subsequent iterations are used as an operational heater power and an operational laser power.
A method of testing dynamic performances for a slider body of a thermally-assisted magnetic head includes: providing a slider body which is disconnected with a light source unit; removably mounting the slider body to a test head suspension assembly; keeping to provide a flat top beam to the slider body, the flat top beam being aligned with the optical waveguide, and a projection of an incident end of the optical waveguide being located within a light spot of the flat top beam; and testing the dynamic performance of the slider body. It can save the material cost and labor cost, and eliminate a precise optical alignment between an input light and an optical waveguide in the slider body to improve testing efficiency.
A light source unit for thermally-assisted magnetic head includes a support member and a light source attached on the support member via a solder, and the light source unit further includes a positioning structure formed between the support member and the light source for positioning the light source and the solder. The light source unit can maintain stable height control of the light source, prevent solder over flow and prevent the light source from shifting and moving during the bonding process.
A coupling structure of optical components has a first optical component, a second optical component and a coupling solder layer. The first optical component has a lensed fiber, a first holder holding the lensed fiber and a first metal layer formed on a first connecting end face of the first holder. The second optical component has a waveguide, a second holder holding the waveguide and a second metal layer formed on a second connecting end face of the second holder. The coupling solder layer is in direct contact with both of the first metal layer and the second metal layer, and formed with solder.
A thin-film piezoelectric material element includes a piezoelectric part having a laminated structure which a lower electrode film, a piezoelectric material film and an upper electrode film are laminated sequentially, and electrode pads connected with the piezoelectric part. The thin-film piezoelectric material element has solder regulating parts formed on pad surfaces being surfaces of the electrode pads. The solder regulating parts have peripheral edge parts and crossing edge parts connected with the two outer edge parts, and formed to cross the pad surfaces. The crossing edge parts are formed in a bow like curve-shape having curved parts, being gradually distant from the shortest line as they are distant more from the outer edge parts.
G11B 5/596 - Disposition or mounting of heads relative to record carriers with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following for track following on disks
G11B 21/10 - Track finding or aligning by moving the head
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/29 - Forming electrodes, leads or terminal arrangements
G11B 5/48 - Disposition or mounting of heads relative to record carriers
61.
ABS design with soft bumper pads (SBP) for mitigating media damage and thermal erasure in hard disk drives (HDD)
A slider design for a hard disk drive (HDD) features an air-bearing surface (ABS) topography with soft bumper pads (SBP) formed proximally to corners of the leading edge and the trailing edge. The bumper pads are formed by a process that combines the use of a first photomask for subtractive etching of the ABS to form pedestals, followed by additive depositions onto the pedestals using a second lift-off photomask. The additive process deposits sequences of Si layers and diamond-like carbon (DLC) layers to produce a soft bumper pad that is energy absorbing and heat conducting, thereby protecting the recording media from surface damage and thermal erasures.
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 5/10 - Structure or manufacture of housings or shields for heads
G11B 5/48 - Disposition or mounting of heads relative to record carriers
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers
G11B 17/32 - Maintaining desired spacing between record carrier and head, e.g. by fluid-dynamic spacing
G11B 21/21 - Supporting the headsSupporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.
An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
B23K 28/00 - Welding or cutting not covered by groups
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
A slider design for a hard disk drive (HDD) features an air-bearing surface (ABS) topography with arrays of micro-dots formed on bases of a multiplicity of cavities at different depths. The design eliminates the accumulation of hydrocarbons (e.g., spindle oil and disk lubricant) deposits in regions of air stagnation within the cavities where backflows and foreflows of air meet and cancel during HDD operation. The micro-dots are small raised regions of various shapes having sizes and spacings in the range between 2 and 100 microns and, in a preferred embodiment, heights of 0.15 microns above the cavity bases.
This thin film magnetic head includes a magnetic pole including an end surface exposed on an air bearing surface, and a contact detection section including a magnetic material layer provided near the air bearing surface, and a magnetic-domain stabilizing structure stabilizing a magnetic domain structure of the magnetic material layer.
A manufacturing method of an epitaxial thin film piezoelectric element includes: providing a substrate; forming a bottom electrode layer on the substrate by epitaxial growth process; forming a first piezoelectric layer that has c-axis orientation on the bottom electrode layer by epitaxial growth process; forming a second piezoelectric layer that has c-axis orientation and different phase structure from the first piezoelectric layer on the first piezoelectric layer by epitaxial growth process; and forming a top electrode layer on the second piezoelectric layer. The thin film piezoelectric element has good thermal stability, low temperature coefficient and high piezoelectric constant.
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/083 - Piezo-electric or electrostrictive elements having a stacked or multilayer structure
H01L 41/27 - Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes
H01L 41/297 - Individual layer electrodes of multilayered piezo-electric or electrostrictive parts
A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved.
A manufacturing method for a head slider coated with Diamond-like Carbon (DLC) includes: providing a substrate that is to be finally made into a head slider; depositing a DLC layer on a surface of the substrate, with carbon plasma source being sputtered in a direction that is vertical to the surface of the substrate; and doping a fluorine-doping (F-doping) layer on the DLC layer. Whereby the head slider has good film adhesion performance, higher hardness, better wear resistance, lower surface energy to obtain good hydrophobicity and oleophobicity, and lower fly height in HDD.
A thin-film piezoelectric material element includes a laminated structure part having a lower electrode film, a piezoelectric material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric material film. The thin-film piezoelectric material element includes a surface layer insulating film disposed on side surfaces of the laminated structure part, a first top surface of the upper electrode film and a second top surface of the lower electrode film, and has a first through hole formed on a first top disposed part and a second through hole formed on a second top disposed part. Further, the surface layer insulating film has an upper electrode pad being in directly contact with a first inside exposed surface and a lower electrode pad being in directly contact with a second inside exposed surface.
Thin-film piezoelectric material substrate, thin-film piezoelectric material element, head gimbal assembly, ink jet head and method of manufacturing the thin-film piezoelectric material element
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
C23C 14/02 - Pretreatment of the material to be coated
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/319 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
A camera lens module includes a case and a bottom coupled with the case to form an accommodating space, having an upper spring, a lens assembly and a lower spring accommodated in the accommodating space. The lens assembly includes a lens barrel main body and a group of lenses provided in the lens barrel main body. An upper end of the lens barrel main body is suspended on the upper spring, and a lower end of the lens barrel main body is suspended on the lower spring. The upper spring is connected with the case, and the lower spring is connected with the bottom. In the camera lens module, the lens assembly is directly suspended on upper and lower springs. This eliminates the camera lens mount of existing camera lens module as well as the connecting screw structure between the camera lens mount and the lens barrel.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
A thin-film piezoelectric material element includes a laminated structure part having a lower electrode film, a piezoelectric material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric material film. The thin-film piezoelectric material element includes a surface layer insulating film disposed on side surfaces of the laminated structure part and a top surface of the upper electrode film, and has a through hole formed on a top disposed part disposed on the top surface. The surface layer insulating film has a long-side disposed part disposed outside than the top disposed part, the long-side disposed part has a long-side width, along with the long-side direction, formed shorter than the through hole.
A heater power of a heat-assisted magnetic recording head is set to an initial power to induce an initial head-medium clearance. For a plurality of iterations, a heater power at an optimum laser power is determined that achieve a target clearance. If differences in the heater power and optimum laser power between the two subsequent iterations are below a threshold, the iterations are stopped and the heater power and the optimum laser power for one of the two subsequent iterations is used as an operational heater power and laser power for the heat-assisted magnetic recording head.
A method of making an article coated with DLC, includes providing a substrate; depositing a transition layer on the substrate by means of magnetron sputter deposition (MSD); depositing a DLC layer without hydrogen (H) on the transition layer by means of filtered cathodic vacuum arc (FCVA); and doping a fluorine-doping (F-doping) layer on the DLC layer. The article has good film bonding force, high hardness, good wear resistance, good hydrophobicity and oleophobicity and high light transmittance, and the DLC layer has no H included.
A voice coil motor includes a housing having a cavity; a movable assembly received in the cavity; a fixing assembly configured outside of the movable assembly; and a first spring plate and a second spring plate configured at an upper surface and a lower surface of the movable assembly respectively. The fixing assembly comprises at least two magnetic elements connected with the first spring plate and a spacer member configured on the second spring plate to connect the second spring plate to the magnetic elements or the housing. The voice coil motor is served as an actuator of electronic products such as digital cameras, mobile phones, and digital cameras, which has thin thickness, good performance and strong applicability.
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
76.
Electronic component module and manufacturing method thereof
An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.
A method of testing a TAMH includes providing a slider body having a waveguide embedded therein with an incidence end extending toward a back surface of the slider body; providing a light source unit including a light source and a unit substrate; coating a bonding material layer on the back surface, under the bottom, or both on the back surface and under the bottom of the unit substrate; coating a localization material layer on the back surface; aligning the light source unit to the slider body; causing a light emitted from the light source and allowed to be incident on the incidence end to anneal the localization material layer to generate an annealing mark; removing the light source unit or the light source from the slider body; and measuring a position offset between the annealing mark and the incidence end. The method can evaluate alignment accuracy of a slider body and a light source unit in two dimensional directions.
A thermally assisted magnetic recording head slider includes a light source unit having a light emitting element emitting laser light and a submount holding the light emitting element, and slider including a thin-film laminated part having a main magnetic pole layer, a near-field light generating element and an optical waveguide. A combination of the light emitting element and near-field light generating element is composed of a first pattern or second pattern. The light source unit is mounted on a light source placing surface so that a substrate surface of the light emitting element is orthogonal to a laminated surface of the thin-film laminated part. A plurality of electrode pads are formed on the outer end surface of the slider. The light source unit has a first element electrode and second element electrode. A first connecting wiring part and second connecting wiring part, which connected the first element electrode and second element electrode with a first electrode pad and second electrode pad, are formed on a light source placing surface.
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G11B 11/00 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor
G11B 5/02 - Recording, reproducing or erasing methodsRead, write or erase circuits therefor
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
79.
Light source unit, heat-assisted magnetic recording head using the same, and light source for light source unit
A light source unit has a substrate, a light source that is mounted to the substrate. The light source includes; a first emission part that emits a forward light, the forward light being a laser light in an oscillation state; a second emission part that is located on a side opposite to the first emission part and that emits a rearward light, the rearward light being a laser light in an oscillation state; and a light leakage part located at a position different from the first emission part and the second emission part. The light source further includes a photodetector that is provided on the substrate, wherein the photodetector has a light receiving surface for detecting a leakage light that leaks from the light leakage part.
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
80.
Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same
A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
81.
Thin-film piezoelectric material element, method of manufacturing the same, head gimbal assembly, hard disk drive, ink jet head, variable focus lens and sensor
A thin-film piezoelectric material element includes a lower electrode film, a piezoelectric material film, and an upper electrode film, the lower electrode film, the piezoelectric material film and the upper electrode film are laminated sequentially. An upper surface of the piezoelectric material film is a concavity and convexity surface having a convex part and a concave part, the convex part is a curved surface convexly projected, and the concave part is a curved surface concavely hollowed, the upper electrode film is formed on the concavity and convexity surface. The thin-film piezoelectric material element has a stress balancing film formed with a material having an internal stress capable of cancelling an element stress, the stress balancing film is formed on the upper electrode film.
H01L 41/113 - Piezo-electric or electrostrictive elements with mechanical input and electrical output
G02B 3/14 - Fluid-filled or evacuated lenses of variable focal length
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
A surface forming method for electronic component includes: forming a body that has at least one waveguide, with two ends of the waveguide exposed on a front end surface and a back end surface of the body; forming a photoresist film to cover on the front end surface of the body; irradiating a light from the back end surface of the body to remove a part, of the photoresist film, that covers at least a part of an end surface of the waveguide, thereby forming an exposed area on the end surface of the waveguide; etching the exposed area of the waveguide to form a recess; and removing the photoresist film. The position and size of the pattern could be controlled accurately and efficiently, instead of inefficient complex procedures of alignment.
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G11B 13/04 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom magnetically and optically
83.
Method for evaluating bit error rate for a magnetic head by using a quasi-static test system, and system thereof
A method for evaluating bit error rate for a magnetic head by using a quasi-static test system, includes step (a), measuring a noise characteristic curve for a magnetic head, and the noise characteristic comprising noise amplitude and maximum noise amplitude; step (b), constructing a noise waveform by appropriately scaling a signal noise ratio of the magnetic head based on the noise characteristic curve measured in step (a); and step (c), injecting the noise waveform constructed in step (b) into a model comprising a transmitter module and a receiver module to evaluate a bit error rate. The method saves testing time, reduces manpower, and obtains accuracy testing result.
A thermal assisted magnetic recording head of the present invention has an air bearing surface (ABS) opposite to a magnetic recording medium, a core that can propagate laser light as propagating light, a plasmon generator that includes a generator front end surface facing the ABS, and a main pole that faces the ABS and emits magnetic flux to the magnetic recording medium. The plasmon generator is opposite to a part of the core and extends to the generator front surface, is coupled with a portion of the propagating light that propagates through the core in the surface plasmon mode to generate a surface plasmon, propagates the surface plasmon to the generator front end surface, and generates near-field light (NF light) at the generator front end surface to irradiate the NF light to the magnetic recording medium. The ABS has a protrusion that is closer to the leading side than the generator front end surface in the down track direction, and that protrudes more toward the magnetic recording medium than the generator front end surface upon operation of the thermal assisted magnetic recording head.
A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the front side in the direction of travel of a recording medium relative to a waveguide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion. A heater and an expansion layer are located on the rear side in the direction of travel of the recording medium relative to the core.
A plasmon generator includes a first portion and a second portion. A core of a waveguide includes a main body portion and a protruding portion. The main body portion has a first surface and a second surface parallel to each other. The protruding portion lies on the first surface. A cladding of the waveguide includes a receiving-portion-forming layer lying on the first surface. At least part of the first portion of the plasmon generator is received in a receiving portion defined by the protruding portion and the receiving-portion-forming layer.
A method of manufacturing a thermally-assisted magnetic head includes providing a light source unit including a laser diode; providing a reflection board, and a photo detector; driving the laser diode to emit a light beam towards the reflection board; performing an alignment between the light source unit and the thermally-assisted magnetic recording head section, based on a reflected light of the light beam reflected by the reflection board, then passed through the optical waveguide and finally detected by the photo detector obtaining the maximum power in a LED emission state of the laser diode; and bonding the light source unit to the slider after the alignment is completed. It improves alignment accuracy between a light source unit and a slider during a bonding process therebetween, prevents a laser diode of the light source unit instability, and improves performance of the thermally-assisted magnetic head finally.
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/60 - Fluid-dynamic spacing of heads from record carriers
G11B 9/12 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using near-field interactionsRecord carriers therefor
G11B 5/48 - Disposition or mounting of heads relative to record carriers
88.
Disk drive head suspension including a grounded conductive substrate
A suspension includes a flexure including a conductive substrate, and a dielectric layer formed on the conductive substrate, and the conductive substrate being grounded; and a plurality of electrical traces formed on the dielectric layer and extending from a leading portion to a trailing portion of the flexure, and the electrical traces at least having a pair of read traces. At least one via is formed at certain position on the read traces to connect the read traces with the conductive substrate that is etched partially. It can minimize ESD damage during various stages of manufacturing process of the disk drive unit, reduce manufacturing cost, and also improve electrical performance of the suspension interconnection.
A magnetic head includes a medium facing surface, a read head unit, a write head unit, and a protrusion device. The protrusion device causes part of the medium facing surface to protrude toward a recording medium. The read head unit has a first end face located in the medium facing surface and includes a first contact sensor for detecting contact of the first end face with the recording medium. The write head unit has a second end face located in the medium facing surface and includes a second contact sensor for detecting contact of the second end face with the recording medium. The first end face and the second end face are located at positions different from each other in a direction of travel of the recording medium.
A manufacturing method of a write portion for a thermally assisted magnetic head slider includes providing a write portion including a write element, a waveguide, and a plasmon unit; lapping opposed-to-magnetic recording medium surfaces of the write element and the waveguide, and an near-field light generating surface of the plasmon unit; only forming a carbon layer on the opposed-to-magnetic recording medium surface of the write element. Corrosive elements in the write portion can be prevented from being corroded and the write element can be prevented from being worn and abraded not only, stable thermal ability for a plasmon unit can be maintained but also.
The thermally-assisted magnetic recording method is a method to perform information recording on a magnetic recording medium by a thermally-assisted magnetic recording head having a magnetic pole and a heating element, and the method includes: performing annealing treatment of the heating element through applying first energy to the heating element and heating the heating element; and performing information recording to a predetermined recording region of the magnetic recording medium after the annealing treatment. The information recording is performed through rotating the magnetic recording medium as well as floating the thermally-assisted magnetic recording head above the magnetic recording medium, and applying second energy to the heating element to heat a predetermined recording region of the magnetic recording medium as well as applying a write magnetic field from the magnetic pole to the predetermined recording region.
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
92.
Magnetic head for perpendicular magnetic recording including a main pole and a write shield to provide improved write characteristics without compromising the function of the write shield
A magnetic head includes a main pole, a write shield, and first and second nonmagnetic layers. The main pole has a top surface including an inclined surface portion. The write shield includes an inclined portion facing toward the top surface of the main pole. The first nonmagnetic layer is interposed between the inclined surface portion and the inclined portion. The second nonmagnetic layer is interposed between the first nonmagnetic layer and the inclined portion. The first nonmagnetic layer has a first front end located in a medium facing surface. The second nonmagnetic layer has a second front end that is located closest to but at a distance from the medium facing surface.
A magnetic head includes a coil, a main pole, a write shield, a first insulating film, and a second insulating film. The coil includes a specific coil element. The main pole has a top surface including an inclined surface portion and a flat surface portion. The write shield includes an inclined portion. The inclined portion includes a first portion opposed to the inclined surface portion, and a second portion located farther from a medium facing surface than the first portion. The specific coil element includes an interposition part interposed between the flat surface portion and the second portion. The first insulating film is interposed between the inclined surface portion and the first portion of the inclined portion, and between the interposition part and the second portion of the inclined portion. The second insulating film is interposed between the first insulating film and the second portion of the inclined portion.
A magnetic head includes a main pole, an expansion member, and a heater. The main pole has an end face located in a medium facing surface. The expansion member is located farther from the medium facing surface than is the main pole and adjacent to the main pole in a direction perpendicular to the medium facing surface. The heater heats the expansion member. The expansion member has a linear expansion coefficient higher than that of the main pole.
A magnetic head includes a main pole, a write shield, and first and second nonmagnetic layers. The main pole has a top surface including an inclined surface portion. The inclined surface portion includes a first portion and a second portion, the first portion being closer to a medium facing surface. The write shield includes an inclined portion facing toward the top surface of the main pole. The first nonmagnetic layer is interposed between the inclined portion and the second portion of the inclined surface portion. The second nonmagnetic layer is interposed between the inclined portion and a combination of the first portion of the inclined surface portion and the first nonmagnetic layer.
An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.
A plasmon generator includes a first portion and a second portion that are adjacent in a first direction orthogonal to the direction of travel of light propagating through a core. The second portion includes a front end face located in a medium facing surface of a magnetic head. The core has a concave portion recessed from the top surface of the core. At least part of the first portion is received in the concave portion. The concave portion has a surface including an evanescent light generating portion. The first portion includes a plasmon exciting portion opposed to the evanescent light generating portion. The evanescent light generating portion is inclined relative to a first surface.
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
G11B 9/12 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using near-field interactionsRecord carriers therefor
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G11B 5/31 - Structure or manufacture of heads, e.g. inductive using thin film
G11B 7/24059 - Light transmission layers lying on the light entrance side and being thinner than the substrate, e.g. specially adapted for Blu-ray® discs specially adapted for near-field recording or reproduction
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
98.
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive
A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer, a substrate side shield part comes in contact with the leading shield part. The thin-film coil has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, the spaces to the substrate about a leading lower end face of the leading shield part, a shield upper end face of the substrate side shield part, and coil upper end face of the substrate side coil layer are formed to be equal to each other. Further, a depth of the leading shield part is formed to be small than the depth of the substrate side shield part.
A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a laminated structure in which a first thin-film metal layer formed in a thin film form along a direction intersecting the medium-opposing surface and a second thin-film metal layer formed in a thin film form and formed using a second metal larger in hardness than a first metal forming the first thin-film metal layer are alternately laminated. Further, in the second thin-film metal layer, a defect part is formed, the defect part is a part smaller in thickness than another part or is a hole part, and a flat layer part other than the defect part surrounds the defect part.
G11B 11/00 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor
G11B 5/48 - Disposition or mounting of heads relative to record carriers
G11B 5/127 - Structure or manufacture of heads, e.g. inductive
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
100.
Thermally-assisted magnetic recording head having a plasmon generator
A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the same side in the direction of travel of the recording medium relative to a wave guide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion.
G11B 11/00 - Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group Record carriers therefor
G11B 13/08 - Recording simultaneously or selectively by methods or means covered by different main groupsRecord carriers thereforReproducing simultaneously or selectively therefrom using near-field interactions or transducing means and at least one other method or means for recording or reproducing
G11B 5/00 - Recording by magnetisation or demagnetisation of a record carrierReproducing by magnetic meansRecord carriers therefor
patents
