An ultrasonic probe includes at least one piezoelectric element configured to transmit and receive ultrasonic waves. The at least one piezoelectric element includes a piezoelectric material formed by a sol-gel process, and at least one electrode being in contact with the piezoelectric material and containing a conductive elastomer.
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H10N 30/06 - Forming electrodes or interconnections, e.g. leads or terminals
H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
In a sensor device, a sensor unit and a wiring portion are connected. The sensor unit is configured as a sol-gel composite piezoelectric sensor including a base material layer, a piezoelectric film layer formed on the base material layer, an electrode layer formed on the piezoelectric film layer, and a protective layer. The base material layer and the electrode layer are covered by the protective layer except for a portion thereof. The wiring portion includes a signal line and a ground line. The signal line has an end having a pressure-bonding tip. An upper housing portion and a lower housing portion cover at least uncovered portions of the sensor unit and the wiring portion. A pressure-applying portion presses the pressure-bonding tip in contact with a portion of the electrode layer that is not covered by the protective layer, so as to pressure-bond them.
H10N 30/30 - Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
3.
ULTRASONIC PROBE AND ULTRASONIC PROBE MANUFACTURING METHOD
This ultrasonic probe comprises at least one piezoelectric element that sends/receives ultrasonic waves. The at least one piezoelectric element includes: a piezoelectric body formed by the sol-gel process; and at least one electrode that contains a conductive elastomer and that contacts the piezoelectric body.
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
A61B 8/00 - Diagnosis using ultrasonic, sonic or infrasonic waves
H10N 30/06 - Forming electrodes or interconnections, e.g. leads or terminals
H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
H10N 30/30 - Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
Provided is a looseness detection system or the like capable of detecting the looseness of a nut without using the natural frequency thereof. A looseness detection system 1 is for detecting the looseness of a nut 3 for fastening a member. A sensor substrate 5 is fastened together with a member by the nut 3. On the sensor substrate 5, a piezoelectric film part 7 and an electrode part 9 transmit ultrasonic waves toward the nut 3, and receive reflection waves resulting from the transmitted ultrasonic waves being reflected on an end surface 4 of the nut 3. An ultrasonic wave-processing device 13 evaluates the looseness of the nut 3 on the basis of the magnitude of the reflected waves.
NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY (Japan)
CAST INC. (Japan)
Inventor
Kobayashi Makiko
Nakatsuma Kei
Tanabe Masayuki
Tsutsumi Kyosuke
Tanaka Yuya
Abstract
Provided are a sensor device and the like suitable for wiring of a flexible sol-gel composite piezoelectric sensor. In a sensor device 1, a sensor portion 3 and a wiring portion 5 are connected to one another. The sensor portion 3 is a sol-gel composite piezoelectric sensor. The sensor portion 3 is provided with a base material layer, a piezoelectric film layer formed on the base material layer, an electrode layer formed on the piezoelectric film layer, and a protective layer. The protective layer covers the base material layer and the electrode layer, excluding a portion thereof. The wiring portion 5 includes a signal line and a ground line. There is a pressure bonding tip at the tip end of the signal line. An upper exterior portion 7 and a lower exterior portion 9 cover at least the parts of the sensor portion 3 and the wiring portion 5 that are not covered. A pressing portion 11 pressure bonds the pressure bonding tip by pressing the same against the part of the electrode layer not covered by the protective layer. The sensor device can, for example, be attached to an inspection target using an attachment that covers the sensor portion, for example.
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/318 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
patents
