A microneedle array 1 has a plurality of microneedles 11 and is to be used as an acupuncture needle for acupuncture therapy. The length of the microneedles 11 of the microneedle array 1 is 250–1500 μm, and the tip strength of the microneedles 11 measured as the maximum value of the stress that occurs at the microneedles 11 when a compressive load is applied to tip parts of the microneedles 11 in the length direction is at least 50 mN. This microneedle array 1 makes it possible to achieve excellent acupuncture therapy effects.
[Problem] To provide a hard coating film in which the occurrence of cracks or the like during construction is suppressed while excellent scratch resistance is exhibited. [Solution] A hard coating film comprising a base material and a hard coating layer disposed on one main surface of the base material. In a mandrel bend test carried out in accordance with JIS K 5600-5-1 by using a cylindrical mandrel bend tester and bringing a base material-side surface of the hard coating film into contact with a mandrel, when the diameter of the mandrel at which cracks occur in the hard coating layer is defined as D μm, and the total thickness of the hard coating film is defined as α μm, D/α is 130 or less.
This invention reduces man-hours required for the manufacture of an electronic component. An adherend is stuck to an adhesive sheet that is larger than the adherend. The adherend stuck to the adhesive sheet is thinned in a state in which an outer peripheral part of the adhesive sheet is fixed. Each of the resulting chips of the adherend are selectively picked up from the adhesive sheet.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
Provided is an adhesive sheet having a novel structure, with which it is possible to change retention force. This adhesive sheet for attaching an electronic component comprises: a base material having a surface with dips and bumps; and an adhesive layer provided in contact with said surface of the base material so as to accommodate the bumps on the surface.
This bonding sheet includes: a base material; and an adhesive layer provided on one surface of the base material. In the bonding sheet, the transmittance of infrared light having a wavelength of 1600 nm is 80% or more. The peeling force between a silicon chip and an energy ray-irradiated product of the adhesive layer, as measured using a test piece that is a laminate of the silicon chip, the energy ray-irradiated product of the adhesive layer, and the base material, is 5 N or less.
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/04 - Homopolymers or copolymers of esters
7.
LAMINATE, WINDOW FILM, AND EXTERNAL LIGHT UTILIZATION TYPE DISPLAY BODY
A laminate (window film 2) includes: a light diffusion control film 1 that has an internal structure in a film, the internal structure including a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index; and ultraviolet absorption layers (adhesive layers 22a, 22b containing an ultraviolet absorber) located closer to an external light incident side than the light diffusion control film 1. The light diffusion control film 1 is obtained from a composition containing a high refractive index component and a low refractive index component having a refractive index lower than that of the high refractive index component. The low refractive index component is urethane acrylate having a structure derived from a hydroxyl group-containing acrylic monomer represented by the following general formula (I). The laminate is suppressed in liquefaction. (In the formula, R is a hydrogen atom, and n is an integer of 1 or more).
A workpiece handling sheet 1 comprises: a base material 12; and an interface ablation layer 11 which is laminated on one surface side of the base material 12, can hold a workpiece fragment, and is subjected to interface ablation by irradiation with laser light. The interface ablation layer 11 contains a photosensitizer, and the absorbance of light at a wavelength of 365 nm, as measured for a solution obtained by dissolving the photosensitizer in an organic solvent at a concentration of 10 ppm, is 0.3 or more. The workpiece handling sheet 1 can satisfactorily handle workpiece fragments of various sizes and thicknesses.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
[Problem] To provide a workpiece machining sheet capable of, when a machined workpiece is joined directly to a wafer, suppressing increases in the area of a void in a joining section between the machined workpiece and the wafer or between machined workpieces. [Solution] A workpiece machining sheet used to machine a workpiece for manufacturing a machined product to be directly joined, wherein: when 10 μL of toluene solvent, obtained as a result of immersing the workpiece machining sheet having a size of 80 mm × 100 mm in 15 g of toluene at 25°C for 24 hours, is measured by gel permeation chromatography and the measurement result is represented in a chromatogram in which the vertical axis indicates detected voltage and the horizontal axis indicates elution time from the toluene solvent introduction to the elution from a column, the peak area of detected components within a range from an elution time, corresponding to a situation in which the number average molecular weight calculated in terms of standard polystyrene is 2,500,000, to an elution time, corresponding to a situation in which the number average molecular weight calculated in terms of standard polystyrene is 200, is 4,000 mV·s or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
[Problem] To provide a workpiece processing sheet that makes it possible to suppress cracks or the like of a workpiece even when the workpiece is thinned, and to reduce the number of particles on a bonding surface of a processed workpiece, which is obtained by singulating the workpiece, when the processed workpiece is directly bonded to a wafer. [Solution] The workpiece processing sheet is used for processing a workpiece for manufacturing a processed article that is to be directly bonded, and has a configuration in which a base material and an adhesive layer are laminated. The tensile elastic modulus of the base material at 23°C is 1400 MPa or more. The surface free energy of the surface of the base material that is in contact with the adhesive layer is less than 40 mN/m.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
11.
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME
A microneedle structure is provided with needle-like parts having a flow path therein. The flow paths open on the surface of the needle-like parts. A coating containing a hydrophilic substance is formed on the inner surface of the flow paths.
A61K 47/18 - AminesAmidesUreasQuaternary ammonium compoundsAmino acidsOligopeptides having up to five amino acids
A61K 47/32 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. carbomers
A61K 47/34 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyesters, polyamino acids, polysiloxanes, polyphosphazines, copolymers of polyalkylene glycol or poloxamers
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
C08J 9/42 - Impregnation with macromolecular compounds
12.
METHOD FOR PRODUCING MICRONEEDLE STRUCTURE, AND MICRONEEDLE STRUCTURE
This method for producing a microneedle structure comprises: a step for preparing a needle-shaped section-forming resin composition containing a pore-forming agent and a water-insoluble resin; a step for producing a microneedle intermediate that has a needle-shaped section formed from the needle-shaped section-forming resin composition; and a water treatment step for treating the microneedle intermediate with water so as to remove the pore-forming agent and forming a porous structure in the needle-shaped section. The pore-forming agent contains water-soluble inorganic particles and a water-soluble resin.
A61K 47/18 - AminesAmidesUreasQuaternary ammonium compoundsAmino acidsOligopeptides having up to five amino acids
A61K 47/32 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. carbomers
A61K 47/34 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyesters, polyamino acids, polysiloxanes, polyphosphazines, copolymers of polyalkylene glycol or poloxamers
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
C08J 9/42 - Impregnation with macromolecular compounds
13.
ARTICLE MANUFACTURING METHOD, IDENTITY DETERMINATION METHOD, AND MANUFACTURING SYSTEM
An article manufacturing method comprising an ink marking process in which an identity determination mark to be used to determine the identity of an article is formed on a marking surface using an ink, wherein the determination of the identity of an article involves comparing information obtained from an image of the identity determination mark on a genuine article with information obtained from an image of an identity determination mark on an article to be assessed, and the image of the identity determination mark has individuality resulting from the wet spreading of ink droplets.
H01L 23/00 - Details of semiconductor or other solid state devices
14.
BINDER AQUEOUS SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY AND MANUFACTURING METHOD THEREFOR, AND LITHIUM-ION BATTERY AND MANUFACTURING METHOD THEREFOR
Provided are: a binder aqueous solution for a lithium-ion battery, the binder aqueous solution comprising a water-soluble polymer (A), carbon nanotubes (B), and a compound (C) represented by general formula (1); an electrode slurry for a lithium-ion battery; an electrode for a lithium-ion battery and a manufacturing method therefor; and a lithium-ion battery and a manufacturing method therefor.
A pressure sensor (100) comprises: a conductive fabric (10) having a conductive linear body (20) and non-conductive fibers (40); and a conductive member (30) provided at a position facing the conductive fabric (10). In the pressure sensor (100), when no external force is applied in a direction for the conductive member (30) to move toward the conductive fabric (10), the conductive linear body (20) and the conductive member (30) are separated by the non-conductive fibers (40) and are in an electrically insulated, non-conductive state, and when an external force is applied in the direction for the conductive member (30) to move toward the conductive fabric (10), at least a portion of the conductive member (30) pushes aside and moves through the non-conductive fibers (40), so that the conductive member (30) and the conductive linear body (20) are in an electrically connected, conductive state.
G01L 5/00 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
16.
WORKPIECE PROCESSING FILM AND WORKPIECE PROCESSING METHOD
[Problem] To provide a workpiece processing film and a workpiece processing method with which it is possible to hold a workpiece while keeping an attachment surface clean by being attached to the workpiece during workpiece processing. [Solution] This workpiece processing film is used for processing a workpiece, wherein: the workpiece processing film is a substrate-less double-sided adhesive film; and when 10 μL of a toluene solvent, obtained by immersing a workpiece processing film having a size of 80 mm×100 mm in 15 g of toluene at 25ºC for 24 hours, is measured by gel permeation chromatography, and the measurement results are shown as a chromatogram in which the vertical axis is a detection voltage and the horizontal axis is an elution time from the introduction of the toluene solvent to the elution from a column, the peak area of a detection component from an elution time corresponding to a time when the number-average molecular weight in terms of standard polystyrene is 2,500,000 to an elution time corresponding to a time when the number-average molecular weight in terms of standard polystyrene is 200 is at most 4,000 mV∙sec.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a heat curable composition comprising a component (A) and a component (B), said heat curable composition having a thixotropic index (the viscosity at a shear rate of 1s-1divided by the viscosity at a shear rate of 103s-1) of not less than 1.1. The component (A) is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (where R1 is represents a C6-20 aryl group that is unsubstituted or that has a substituent). The component (B) is one or more fillers selected from the group consisting of alumina, aluminum nitride, and zinc oxide.
Provided is a thermosetting composition which contains the component (A) and the component (B) described below, wherein the thixotropic index ((viscosity when shear rate is 1 s-1)/(viscosity when shear rate is 103 s-1)) is less than 1.1. Component (A): a silane compound polymer which has a repeating unit (repeating unit (1)) that is represented by formula (a-1) (wherein R1 represents an unsubstituted or substituted aryl group having 6 to 20 carbon atoms); Component (B): one or more fillers which are selected from the group consisting of alumina and zinc oxide
In this component manufacturing method, one surface of a workpiece is a fixed surface and the other surface is a ground surface, and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is fixed to a chuck table, wherein: the chuck table has a fixing portion for fixing an outer peripheral portion of the fixed surface of the workpiece and a recessed portion surrounded by the fixing portion; the outer peripheral portion of the fixed surface of the workpiece is fixed by means of the fixing portion of the chuck table; a space formed by the fixed surface of the workpiece that has been fixed to the fixing portion and the recessed portion of the chuck table is filled with one or more fluids selected from the group consisting of liquids and pressurized gases; and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is in contact with the fluid.
B24B 41/06 - Work supports, e.g. adjustable steadies
B23Q 3/08 - Work-clamping means other than mechanically-actuated
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 55/00 - Safety devices for grinding or polishing machinesAccessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
This laminate is used in an environment irradiated with light including infrared rays having a wavelength of 780 nm to 2500 nm, and satisfies the requirement (A), (B) or (C) below. This outdoor electronic apparatus is used in an environment irradiated with light including infrared rays having a wavelength of 780 nm to 2500 nm, wherein the laminate is disposed on a surface of the outdoor electronic apparatus on which the light is incident. (A) An infrared reflective layer is provided to the surface of the laminate on which light is incident, the total light transmittance being 3% or more, and the heat shielding coefficient being 0.90 or less. (B) An infrared absorption layer is provided to the surface of the laminate on which light is incident, the total light transmittance being 3% or more, and the heat shielding coefficient being 0.90 or less. (C) An infrared shielding layer is provided to the surface of the laminate on the light is incident, and a heat insulating layer is provided to a surface of the infrared shielding layer opposite to a surface on which external light is incident.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
This method for removing a coating layer involves, in the following order, a preparation step for preparing a laminated film (for example, a roll (50C)) having a base material film and a coating layer, an ultrasonic treatment step for irradiating the laminated film with ultrasonic waves via water (W1), a removal step for removing the coating layer from the laminated film by treating the laminated film using treatment water or steam, and a recovery step for recovering the base material film, wherein: the coating layer includes a hydrophilic and water-insoluble intermediate layer, and a release agent layer; and the intermediate layer is disposed between the base material film and the release agent layer.
The present invention addresses the problem of providing an inkjet printing sheet that has an ink-receiving layer having excellent blocking resistance while having excellent ink adhesion and excellent water adhesion resistance of ink. The problem is solved by having a laminated structure in which an ink-receiving layer (X) and a base material (Y) are laminated, and the ink-receiving layer (X) is formed from a resin composition (x1) containing: an acrylic resin (A) having a crosslinkable functional group; a crosslinking agent (B); an ultraviolet curable acrylate compound (C); a photopolymerization initiator (D); and a silicone-based surface modifier (E) having a (meth)acryloyl group.
An adhesive agent for applications in which the adhesive agent itself is to be recycled, wherein the gel fraction (gel fraction G1) after being immersed for 72 hours in ethyl acetate is 25% or greater, and the gel fraction (gel fraction G2) after being immersed for 72 hours in a solvent resulting from mixing ethyl acetate and acetylacetone at a mass ratio of 9:1 is 25% or less. With this adhesive agent and an adhesive sheet that is provided with an adhesive agent layer comprising this adhesive agent, the adhesive agent itself can be recycled. It also becomes possible to recycle an adherend or substrate to which the adhesive agent layer was adhered.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
25.
PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR USING PRESSURE-SENSITIVE ADHESIVE SHEET
Provided is an adhesive which contains an oxygen absorbent and is used in optical applications. When a laminate obtained by bonding two 7.0 cm square soda-lime glass plates which has a thickness of 1.1 mm with an adhesive layer which is formed from the adhesive and has a thickness of 250 μm is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 24 hours, there is no bubble at the edge of the laminate after the endurance condition, or when the laminate is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 96 hours, the number of needle-shaped bubbles present at the edge of the laminate after the endurance condition is less than 5. This adhesive makes it possible to suppress the generation of needle-shaped bubbles at the edge of an optical member.
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 133/04 - Homopolymers or copolymers of esters
C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
27.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a vinyl ether (a) having a hydroxypolyoxyalkylene chain including two or more C1-3 oxyalkylene units. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
28.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-50 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
29.
COATING LAYER REMOVAL DEVICE AND COATING LAYER REMOVAL METHOD
A coating layer removal device 100 includes: a roll-out shaft 10 that rolls out a laminated film 90; a first backup roll 21 that contacts a base film of the laminated film 90 and transports the laminated film downstream; a first spray unit 31 that is disposed facing the first backup roll 21 and that includes one or more nozzles; a second spray unit 32 that is disposed downstream of the first spray unit, is disposed facing a second backup roll 22 and includes one or more nozzles; a pressurized water supply unit 50 that supplies pressurized water to the first spray unit 31 and the second spray unit 32; and a roll take-up shaft 40 that takes up the base film 91 into a roll shape after the coating layer has been removed. The pressurized water supply unit 50 includes one or more pumps.
Provided is a winding roll 1 in which a laminate film 90 includes: a release film including a base material film 91 and a release agent layer 92; and a ceramic green sheet including green sheet parts 931, 932. The green sheet parts 931, 932 are each arranged along a longitudinal direction of the laminate film 90. A recess 94 sandwiched by the green sheet parts 931, 932 is formed on the release agent layer 92. The laminate film 90 is wound around a shaft core 80 by traverse winding having a size of a swing width α. When viewed in a cross section orthogonal to the longitudinal direction of the laminate film 90, the size of the swing width α is, for example, greater than a width β1 from an edge end of the laminate film 90 on a first end part E1 side to an inner side of the first green sheet part 931.
This wiring sheet (100) comprises a wiring body (2) provided with electrically conductive linear bodies (21), and a pair of electrodes (4) that are in direct contact with the electrically conductive linear bodies (21), wherein the electrically conductive linear bodies (21) have an infrared reflectance of 0% to 90% inclusive at a wavelength of 1000 nm, and have a rate of change in resistance value of 50% or less after being allowed to stand for 1000 hours in a hot, humid environment at a temperature of 85°C and a relative humidity of 85% RH.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
32.
PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND DEVICE
[Problem] To provide a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive having excellent resistance to bleaching by humidity. [Solution] This pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive for bonding a first member to a second member, wherein the pressure-sensitive adhesive is a polyester-based pressure-sensitive adhesive containing a surfactant. The pressure-sensitive adhesive has a gel content of preferably 60% or less. The polyester-based pressure-sensitive adhesive preferably has a crosslinking structure including at least a polyester-based polymer and a crosslinking agent.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
33.
WINDOW FILM AND METHOD FOR MANUFACTURING FRONT WINDOW EQUIPPED WITH WINDOW FILM
Provided is a window film having a high heat-insulating performance that is capable of suppressing the occurrence of wrinkles in a resin film when forming a hard coat layer and of following the shape of an adherend at the time of sticking. A window film (1) has a resin film (10) and a hard coat layer (11) disposed on one main surface of the resin film (10). Assuming that the shrinkage rate in an MD direction of the resin film (10) when the resin film (10) is held at 180°C for 5 minutes is A% and that the shrinkage rate in a CD direction is B%, A-B is 0.4% or more. The hard coat layer (11) contains tin-doped indium oxide.
[Problem] To provide a window film that, despite including a transparent resin film, achieves visibility with respect to an outside light source and the property of making it impossible to see an inside part. [Solution] A window film comprising a transparent resin film and a colored adhesive layer which is disposed on one main surface of the resin film, said window film exhibiting total light transmittance of not more than 70% and a haze value of not more than 5%.
Disclosed are: a method for producing a silane compound polymer, the method including a step in which a trifunctional alkoxysilane compound represented by formula (a-1) R133 (wherein R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent, each OR represents an alkoxy group, and OR may be the same as or different from each other) is hydrolyzed and polycondensed in the presence of a solvent that satisfies the requirements 1 and 2 described below; and a method for producing a semiconductor insulating film forming agent. Requirement 1: The solvent is azeotropic with water. Requirement 2: The solvent is a polyether-based solvent.
3/23/2 , and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent]; a semiconductor insulating material comprising the silane compound polymer; and a semiconductor insulating film-forming agent containing the silane compound polymer.
3/23/2 [Me represents a methyl group], and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent], wherein the weight average molecular mass (Mw) is 1,500 or more. The present invention further provides a semiconductor insulating material comprising the silane compound polymer, and a semiconductor insulating film-forming agent containing the silane compound polymer.
[Problem] To provide a window film that is suitable for high-mix low-volume production and demonstrates concealing properties as well as visibility of external light sources. [Solution] This window film has a transparent first resin film, a transparent second resin film, and a colored intermediate layer. The intermediate layer is disposed between one main surface of the first resin film and one main surface of the second resin film. The window film has a total light transmittance of 60% or less and a haze value of 8% or less.
This method for using a degradable film comprises: a step for preparing a degradable film containing an aliphatic polycarbonate and an acid/base generator that generates an acid or a base due to energy ray irradiation, the adhesive resin content of said degradable film other than the aliphatic polycarbonate being 10 mass% or less; an exposure step for exposing the entire surface of the degradable film or a portion thereof in plan view with an energy beam; and a decomposition step for heating the degradable film and decomposing the entire surface of the degradable film or the portion thereof in plan view. According to the aforementioned method for using the degradable film, the degradable film can easily be decomposed.
This binder for firing contains an aliphatic polycarbonate that has a carbonate structure in a main chain and has a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3, and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. By using the above binder for firing, solid matter of a carbon compound derived from the binder does not remain in a sintered body, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains a structural unit derived from a hydroxyl-group-containing vinyl ether (a), and a structural unit derived from an ethylenically unsaturated monomer (b) having a sulfonic acid group or a salt thereof. The amount of the structural unit derived from the hydroxyl-group-containing vinyl ether (a) contained in the water-soluble polymer (A) is 5-80 mol% in all structural units of the water-soluble polymer (A), and the amount of the structural unit derived from the ethylenically unsaturated monomer (b) having the sulfonic acid group or a salt thereof in the water-soluble polymer (A) is 5-30 mol% in all structural units of the water-soluble polymer (A).
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). The viscosity of an aqueous solution containing 13 mass% of the water-soluble polymer (A) as measured by a B-type viscometer at 23°C is 3,000 mPa·s or more. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
43.
ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND OPTICAL LAMINATE
The present invention pertains to an adhesive sheet that is characterized by having a substrate layer and an adhesive agent layer, and that is characterized in that the thickness of the adhesive agent layer is 100 μm or more, and the adhesive agent layer is formed from an adhesive agent that exhibits, when an adhesive agent layer having a thickness of 500 μm is obtained, a chromaticity b*value of -3.0 or more stipulated by the CIE1976L*a*b* color system in a reflection mode of the adhesive agent layer. The present invention also pertains to: a method for producing the adhesive sheet; and an optical laminate provided with the adhesive sheet. The present invention provides: an adhesive sheet that improves, when an adhesive sheet having a thick adhesive agent layer is applied to the outermost surface of an optical laminate, the phenomenon in which the optical laminate appears bluish white; a method for producing the adhesive sheet; and an optical laminate comprising the adhesive sheet.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
The present invention provides a thermoelectric conversion material layer having improved electrical conductivity and high thermoelectric performance. Provided is a thermoelectric conversion material layer comprising thermoelectric semiconductor particles and monometallic particles, wherein, in a longitudinal cross-section that includes the center part of the thermoelectric conversion material layer, the area ratio of a region occupied by the monometallic particles to a region occupied by the thermoelectric semiconductor particles and the monometallic particles is 1-50%.
Provided are: a curable composition comprising the following component (A) and component (B), wherein the total amount of the component (A) and the component (B) is at least 98 mass% with respect to the total amount of the curable composition; and a semiconductor insulating film-forming agent. The (A) component is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) [R1represents a fluoroalkyl group] and a repeating unit [repeating unit (2)] represented by formula (a-2) [R2 represents an unsubstituted hydrocarbon group or a hydrocarbon group (excluding a fluoroalkyl group) having a substituent, wherein the amount of the repeating unit (1) is at least 40 mol% with respect to the total amount of the repeating unit (1) and the repeating unit (2). (B) is a solvent.
C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
46.
CURABLE COMPOSITION AND SEMICONDUCTOR INSULATING FILM FORMING AGENT
Provided are a curable composition and a semiconductor insulating film forming agent, the curable composition containing component (A) and component (B) and having a viscosity of 1,000 mPa·s or less at 23°C. Component (A): A silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (a-1): R13/23/2 [R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent.] Component (B): A solvent satisfying requirements 1 and 2 Requirement 1: A solvent azeotropic with water. Requirement 2: A polyether-based solvent.
This binder for firing contains an aliphatic polycarbonate having a carbonate structure in a main chain and a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate has a weight average molecular weight of 50,000-170,000 inclusive. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. According to the binder for firing, the solid matter of the carbon compound derived from the binder does not remain in a sintered product, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
Provided is a workpiece processing sheet comprising: a release sheet having a release agent layer on one surface side of glassine paper; and a work attachment layer laminated on a surface of the release agent layer on the opposite side to the glassine paper. The workpiece processing sheet can greatly contribute to reducing carbon dioxide emissions and decreasing the use of plastic materials.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/00 - Adhesives in the form of films or foils
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
49.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE
An adhesive (1A) for high-frequency dielectric heating contains: (A) a thermoplastic resin containing a styrene-based thermoplastic elastomer (a1) and a thermoplastic resin (a2) other than the styrene-based thermoplastic elastomer (a1); and (B) a dielectric filler. The content of the styrene component with respect to the entirety of the thermoplastic resin (A) is 20.0-45.0 mass%, the storage elastic modulus in an environment at 110°C is 300 MPa or more, and the complex viscosity at a shear rate of 600 rad/s in an environment of 220°C is 350Pa·s or less.
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
50.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. The adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recessions on the front surface thereof. The adhesive layer has a polymer having an energy ray-curable group.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
51.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention facilitates the pick up of an object held on an adhesive sheet having an adhesive layer comprising protrusions and recesses on the surface thereof. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive sheet can be extended in the surface direction. When the adhesive sheet is attached to an object, the bonding area ratio of the adhesive sheet to the object is 4%-60%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
52.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention suppresses the deformation of protrusions and recesses on the surface of an adhesive layer when an object is attached to the adhesive layer. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The gel fraction of the adhesive layer is 90%-100%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
53.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer has energy ray reactivity, and the value of (loss tangent (tanδ) at 50° C) / (tanδ at 30° C) of the adhesive layer after energy ray irradiation is 1.30 or more.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
54.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer contains an acrylic acid ester copolymer, and the copolymerization ratio of an energy ray-curable group-containing monomer in the acrylic acid ester copolymer is 20%-50%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
55.
METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET AND METHOD FOR MANUFACTURING ARTICLE
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. Provided is a method for peeling an object from an adhesive sheet that comprises a base material and an energy reactive adhesive layer having protrusions and recessions on the surface thereof, the adhesive sheet holding the object on the adhesive layer. Energy is applied to the adhesive sheet. The adhesive sheet is expanded in the plane direction. The object is peeled from the adhesive layer of the adhesive sheet after energy has been applied and the sheet has been expanded in the plane direction.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
56.
SEMICONDUCTOR DEVICE AND COMPOSITION FOR FORMING BACK SURFACE PROTECTIVE FILM
This semiconductor device comprises a semiconductor substrate, a back surface protective film that protects the back surface of the semiconductor substrate, and a forgery prevention layer that is provided on the back surface protective film and contains a pattern-forming substance that forms an authenticity-determining pattern, wherein the back surface protective film contains an inorganic pigment.
The present invention provides a semiconductor device comprising a semiconductor substrate, a protective layer that protects the semiconductor substrate, and anti-counterfeit layer provided on the protective layer. The anti-counterfeit layer includes a pattern-forming substance that forms a pattern for determining the authenticity of the semiconductor device. The protective layer contains a spherical filler.
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japan)
Inventor
Takano, Ken
Matsuno, Sayaka
Sugimoto, Hiroshi
Fujii, Minoru
Abstract
A composition for a forgery prevention layer for forming a forgery prevention layer in a semiconductor device includes pattern formation particles formed by an inorganic material having a refractive index n of 3 or more.
An LED lamp (1) that can be used in a low-temperature environment, comprising: an LED lamp unit (2) that has an LED element; a housing (3) that houses the LED lamp unit (2); and a transparent cover member (4) that transmits light from the LED lamp unit (2). The LED lamp (1) is also provided with an infrared absorption member (infrared absorption layer (6)) that absorbs infrared rays from the LED lamp unit (2) and generates heat, at a position at which heat generated by the infrared absorption member (infrared absorption layer (6)) is conducted to the transparent cover member (4). The LED lamp (1) makes it possible to heat the transparent cover member (4) and solve problems resulting from use in a low-temperature environment.
A LED lamp 1 that may be used in a low-temperature environment comprises: an LED lamp unit 2 having an LED element; a housing 3 that houses the LED lamp unit 2; and a transparent cover member 4 that transmits light from the LED lamp unit 2, an infrared absorbing member (infrared absorbing layer 6) that absorbs infrared rays from the LED lamp unit 2 and generates heat being provided at a position where heat generated by the infrared absorbing member (infrared absorbing layer 6) is conducted to the transparent cover member 4. According to this LED lamp 1, the transparent cover member 4 can be heated, and problems encountered in low-temperature environments can be overcome.
F21S 45/60 - Heating of lighting devices, e.g. for demisting
F21S 41/148 - Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
An LED lamp (1) that can be used in a low-temperature environment comprises: an LED lamp unit (2) having an LED element; a housing (3) that houses the LED lamp unit (2); a transparent cover member (4) that transmits light from the LED lamp unit (2); and a film heater (6). The film heater (6) is provided at a position at which heat generated by the film heater (6) is conducted to the transparent cover member (4). According to the LED lamp (1), ice, snow, and water droplets adhered to the transparent cover member (4) can be removed.
This mid-air image formation device 10a, 10b comprising a display part 1, a light transmission and image formation part 3, a light diffusion control part 2, and an adhesion layer 4, wherein the light transmission and image formation part 3 transmits light originating from the display part 1 and forms an image at a position on the surface side opposite from the display part 1, the light diffusion control part 2 diffuses or transmits light incident on the inside of the light diffusion control part 2 depending on the incident angle thereof, and has a louver-shaped regular internal structure comprising, within a region having a relatively low refractive index, a plurality of plate-shaped regions each having a relatively high refractive index, and the adhesion layer 4 comprises any one of an adhesive, a pressure-sensitive adhesive, and a hardenable pressure-sensitive adhesive, and the number of acidic groups present in the adhesion layer 4 with respect to all components constituting the adhesion layer 4 is 0.050 mmol/g or less. This mid-air image formation device 10a, 10b has excellent durability and makes it possible to satisfactorily view a mid-air image.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
The present invention provides an aerial image forming device 10a, 10b, 10c comprising: a display part 1 which has a display surface and emits light from the display surface; a light transmission and image formation part 2 which is arranged on the display surface side of the display part 1, transmits the light, and forms an image at a position on a surface side opposite to the display part 1; and a coat layer 3 which is laminated on the light transmission and image formation part 2, on the surface side opposite to the display part 1, and contains a plasticizer. The aerial image forming device 10a, 10b, 10c has excellent antifouling properties, and the visibility of an aerial image is improved.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
This operation detection device includes an operation detection unit that detects operation information relating to a part of a user in order to convert the operation information into an operation command corresponding to a device by an operation detection member attached to said part, the part being a body port that can be bent/stretched, the device being subject to an operation. Accordingly, operation information relating to a part of a user can be intuitively converted into an operation command corresponding to a device subject to an operation.
The present invention provides an aerial image forming device 10a, 10b comprising: a display unit 1 which has a display surface and which emits light from the display surface; a light-transmissive image forming unit 2 which is disposed on the display-surface side of the display unit 1, transmits the light, and causes an image to be formed at a position on the opposite side of the display unit 1; and an antistatic layer 3 containing an antistatic agent and laminated on the surface of the light-transmissive image forming unit 2 that is on the display unit 1 side or on the surface of the light-transmissive image forming unit 2 that is on the side opposite from the display unit 1. The aerial image forming device 10a, 10b has excellent antistatic properties and excellent visibility.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
An electromagnetic wave absorption member (1) has a resistance layer (10), a spacer layer (20), and a reflection layer (30). The resistance layer (10), the spacer layer (20), and the reflection layer (30) are laminated in this order. The resistance layer (10) has a conductor pattern (11). The conductor pattern (11) is embedded in the spacer layer (20) in a surface (20a) that is on the reverse side from a surface (20b) facing the reflection layer (30).
An electromagnetic wave absorption member (1) having a resistive layer (10), a spacer layer (30), and a reflective layer (40), wherein the resistive layer (10), the spacer layer (30), and the reflective layer (40) are laminated in that order, the spacer layer (30) includes a thermoplastic resin, a high-permittivity material, and a conductive material, and the relative permittivity of the spacer layer (30) is 5 or greater.
Provided is a semiconductor device manufacturing apparatus capable of verifying a semiconductor device by using a new verification technique. The semiconductor device manufacturing apparatus includes: a sticking means 10 that sticks a coating material AS containing a filler FL to a semiconductor body WF to form a semiconductor device SD; and a first image forming means 30 that images the coating material AS of the semiconductor device SD to form a first image PT1. The first image forming means 30 includes: a first image forming device 31 that forms the first image PT1 by capturing a unique feature appearing in the coating material AS due to the filler FL contained in the coating material AS; and an image output device 32 that outputs the first image PT1 to a verification device 50 that verifies the semiconductor device SD. Drawing_references_to_be_translated:
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
69.
ADHESIVE SHEET FOR WORKPIECE PROCESSING AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Provided are: an adhesive sheet for workpiece processing, the adhesive sheet having a buffer layer, a substrate, and an adhesive layer, wherein the buffer layer contains a cured product of a thermosetting resin composition; and a method for manufacturing an electronic device using said adhesive sheet for workpiece processing.
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
An electromagnetic wave absorbing member (1) has a resistance layer (10), a spacer layer (30), and a reflection layer (40). The resistance layer (10), the spacer layer (30), and the reflection layer (40) are stacked in this order. The resistance layer (10) has three or more conductor patterns (12) having differing sizes in plan view. When the difference between the maximum length L1 of the largest pattern in the conductor patterns (12) and the maximum length L3 of the smallest pattern therein is defined as ΔL, there stands ΔL/L1 > 0.34; the thickness of the spacer layer (30) is 400 μm or less; and the dielectric constant of the spacer layer (30) is 5 or more.
This release sheet comprises a base material and a release agent layer provided on at least one side of the base material, wherein: the release agent layer is formed from a release agent composition containing (A) an alicyclic epoxy group-containing cyclic siloxane compound, (B) a carbinol-modified polyorganosiloxane, and (C) an acid catalyst; and the blending amount of the carbinol-modified polyorganosiloxane (B) with respect to 100 parts by mass of the alicyclic epoxy group-containing cyclic siloxane compound (A) is 3-15 parts by mass. According to said release sheet, a silicone component hardly migrates from the release agent layer, and the release force can be set low.
This method comprises: a step for preparing a first board having a first main surface and a second main surface, with a thermoelectric element bonded to the first main surface; a step for applying a bonding material to a prescribed position on a third main surface of a second board having the third main surface and a fourth main surface; a step for aligning the thermoelectric element and the bonding material by disposing the first board on top of the second board, which has been placed so that the fourth main surface is in contact with a bearing surface of a jig, so that the first main surface faces the second board; and a step for bringing the thermoelectric element and the bonding material into contact with each other to bond the first board and the second board to each other via the thermoelectric element and the bonding material.
Provided is a semiconductor device production method that makes it possible to produce a compact semiconductor device, wherein performed are: a coating material preparation step 10 for preparing a coating material AS which is for coating a semiconductor body WF; an identification member preparation step 20 for preparing an identification member WK in which an identifier ID is formed; and a layering step 50 for layering the identification member WK on the semiconductor body WF with the coating material AS therebetween, to form a semiconductor device SD. In the coating material preparation step 10, prepared as the coating material AS is a material that is capable of bonding to both the semiconductor body WF and the identification member WK. In the layering step 50, the identification member WK is layered on the semiconductor body WF in a state in which the identification member WK is in direct contact with the coating material AS.
An adhesive according to the present invention contains an oxygen absorbent and is to be used for optical purposes. The adhesive is such that, when a laminate obtained by bonding two 7.0 cm squared soda-lime glass panels having a thickness of 1.1 mm by using a 250 μm-thick adhesive layer formed from the adhesive is placed in a 140°C atmosphere under persistent conditions for 100 hours of insertion, the absolute value of the ratio of b*2 to b*1 is 4.5 or less when b*1 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer before the persistent conditions, and b*2 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer at an end of the laminate after the persistent conditions. The adhesive enables suppression of yellowing at the ends of an optical member.
[Problem] To provide a microneedle structure capable of analyzing body fluids by using a means other than a functional member. [Solution] A microneedle structure 10 comprises: a liquid storage layer 20 for absorbing and storing a liquid derived from a living body; and a needle-shaped portion 11 in which a flow path 13 is formed, wherein the flow path 13 in the needle-shaped portion 11 is in contact with the liquid storage layer 20.
This microneedle structure comprises needle-shaped sections to be inserted into an object. The needle-shaped sections have a porous structure. The porous structure includes openings in the side surfaces of the needle-shaped sections, and holes through which a liquid to be injected into the object or a liquid received from the object flows. The side-surface opening count, which is the number of openings per 10,000 μm2 in the side surfaces of the needle-shaped sections, is 30 or greater.
A61M 37/00 - Other apparatus for introducing media into the bodyPercutany, i.e. introducing medicines into the body by diffusion through the skin
B29C 67/20 - Shaping techniques not covered by groups , or for porous or cellular articles, e.g. of foam plastics, coarse-pored
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
A microneedle patch 1 comprises: a liquid absorbent layer 20 that absorbs liquid; needle-shaped parts 11 each including a flow path 13 formed therein, the flow path 13 in each needle-shaped part 11 being connected to one surface side of the liquid absorbent layer 20; and a cover layer disposed detachably on the other surface side of the liquid absorbent layer 20 and covering the liquid absorbent layer 20. Such a microneedle patch has adequate strength and enables a sufficient amount of body fluid to be drawn from a subject and analyzed. The present invention also provides an analysis method using the microneedle patch, with which a sufficient amount of body fluid can be drawn from a subject and analyzed.
The present invention provides a marking device (AE) which makes it possible to reduce the motivation for a third party to reproduce a semiconductor wafer or a semiconductor chip and which imparts a prescribed mark MK on, for example, a semiconductor wafer WF or a semiconductor chip CP. The marking device comprises: a first marking means (10) for imparting, in first impartation form (12), a first mark (MK1) on a semiconductor wafer (WF) or a semiconductor chip (CP); and a second marking means (29) for imparting, in second impartation form (22), a second mark (MK2) on the semiconductor wafer (WF) or the semiconductor chip (CP) on which the first marking means (10) has imparted the first mark (MK1).
In order to prevent a predetermined mark applied to a semiconductor wafer or a semiconductor chip from becoming unreadable later, a marking device (EA) for applying a predetermined mark (MK) to a semiconductor wafer (WF) or a semiconductor chip (CP) is provided with a marking means (10) for applying the predetermined mark (MK) to the semiconductor wafer (WF) or the semiconductor chip (CP), and a covering means (20) for providing a covering material (AS) so as to cover the predetermined mark (MK) applied to the semiconductor wafer (WF) or the semiconductor chip (CP). (FIG. 1)
This semiconductor device manufacturing system comprises: a curing device for irradiating a semiconductor device including a base layer formed of an energy ray-curable resin composition with an energy ray to cure the base layer; and an ink marking device that applies an ink on the base layer to make an identity determination mark for determining the identity of the semiconductor. The curing device and the ink marking device are in-line.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
81.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR DETERMINING IDENTITY OF SEMICONDUCTOR DEVICE, AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
Disclosed is a method for manufacturing a semiconductor device, the method including: a base layer formation step for forming a base layer, which is formed of a curable resin composition, on a semiconductor base material; an ink marking step for applying an identity determination mark onto the base layer with an ink, the identity determination mark being used for determination of the identity of a semiconductor device; and a curing step for curing the base layer after the ink marking step.
An adhesive (1A) for high-frequency dielectric heating contains a thermoplastic resin (A) and a dielectric filler (B). When a cut surface obtained by cutting, along the thickness direction, the adhesive (1A) for high-frequency dielectric heating is observed by a scanning electron microscope, the relationship of the distance Dg between nearest centroids of the dielectric filler (B) to the particle diameter Dn of the dielectric filler (B) satisfies formula (F1). (F1): 1.55 ≤ Dg/Dn ≤ 1.85
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
A writing-feel-improving sheet 1 with a surface to be touched by a touch pen has an average vibration intensity of 1.2mm/s2 or more in a frequency range of 50-100Hz, the average vibration intensity being acquired from a vibration intensity-period chart obtained by: bringing the pen tip of a specific touch pen into contact with the surface to be touched by a touch pen; then applying a load of 200g to the touch pen and maintaining an angle formed by the touch pen and the surface at 45°; detecting, by an accelerometer, a change in power due to acceleration of vibrations in the same direction as the sliding direction of the touch pen while linearly sliding the touch pen at a speed of 16.6mm/s; and subjecting a power value-time chart, which is obtained between the start of sliding and a sliding distance of 100mm, to fast Fourier transform. The writing-feel-improving sheet 1 offers excellent writing feel with a touch pen.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
A writing feel improving sheet 1 having a surface with which a touch pen contacts. After a predetermined pen tip of the touch pen is brought into contact with the surface with which the touch pen is in contact, a load of 200 g is applied to the touch pen, an angle formed by the touch pen and the surface is maintained at 45°, and a change of electric power generated by acceleration of vibration in the same direction as a sliding direction of the touch pen is detected by an accelerometer while linearly sliding the touch pen at a speed of 16.6 mm/s, with the electric power value-time chart obtained in an interval from the start of sliding to a sliding distance of 100 mm being fast Fourier transformed. The average value of the vibration intensities in the range of frequencies 50-100 Hz acquired from the obtained vibration intensity-period is 1.5 mm/s 2 or less, and the arithmetic average roughness Ra of the surface with which the touch pen contacts is 0.1 μm or less, or the ten-point average roughness Rzjis is 1 μm or less. According to the writing feel improving sheet 1, the writing feel of the touch pen is excellent, and excellent transparency can be exhibited.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
A writing-feel improving sheet 1 having a surface on which a touch pen is brought into contact, wherein the distance between the center of gravity point of the writing-feel improving sheet 1 and the reference center of gravity point is 4.8 or lower, said reference center of gravity point being obtained by performing principal component analysis using, as data: an arithmetic average roughness Ra (μm), a ten-point average roughness Rzjis (μm), and a rolling circle maximum height waviness (μm) of a writing surface of a writing object serving as a reference and the surface of the writing-feel improving sheet on which the touch pen is brought into contact; a coefficient of static friction and a coefficient of dynamic friction measured by bringing a writing tool serving as a reference into contact with the writing surface of the writing object serving as a reference, then applying a load of 200 g on the writing tool, and linearly sliding the writing tool at 16.6 m/second while maintaining the angle between the writing tool and the writing surface at 45; and a coefficient of static friction and a coefficient of dynamic friction measured by the same method as above for the writing-feel improving sheet. This writing-feel improving sheet 1 makes it possible to obtain a desired writing feel.
This electromagnetic wave absorbing member has a resistance layer that has conductor patterns. The resistance layer has first and second regions that have different electromagnetic wave transmission characteristics from each other. The first region has a conductor pattern having a plurality of first arrays in which a plurality of first units are arranged, and having a plurality of second arrays in which a plurality of second units that are different from the first units are arranged. The second region has a conductor pattern having a plurality of the first arrays and having a plurality of the second arrays. In the first region, a plurality of the first units and the second units are arranged in a first direction. In the second region, a plurality of the first units and the second units are arranged in a second direction that is different from the first direction. In the first region and the second region, the first arrays and the second arrays are arranged neighboring each other.
A wiring board (100) comprises: a substrate (1) having a transmittance of 70% or more of near-infrared light having a wavelength of 1000 nm; and an electrode (21) provided on the substrate (1) and comprising a conductive paste. The surface of the electrode (21) has a first electroless plating layer (22) formed by electroless plating and containing nickel and boron. The surface of the first electroless plating layer (22) has a second electroless plating layer (23) formed by electroless plating and comprising a metal.
H05B 3/84 - Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05K 1/09 - Use of materials for the metallic pattern
Provided is an adhesive sheet 1 having an adhesive layer 11, wherein, taking the haze value (%) of the adhesive layer 11 by 450 nm light as H(450) and the haze value by 650 nm light as H(650), the absolute value of slope S1 represented by formula (1) is more than 0.026, the haze value of the adhesive layer 11 is 10-100%, and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N/25 mm or more. S1 = (H(650) - H(450))/200 … (1) According to the adhesive sheet 1, the lighting color can be adjusted to a color other than white while manifesting a concealing property.
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 7/10 - Adhesives in the form of films or foils without carriers
C09J 133/04 - Homopolymers or copolymers of esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Provided is a sheet for inkjet printing, wherein an ink-receiving layer is in direct contact with one surface of a substrate layer or with an easy-adhesion layer formed on one surface of the substrate layer, the other surface of the substrate layer has, in this order, an adhesive layer and a release liner in a laminated structure. The release liner has a silicone-based release agent layer on the contact surface contacting the adhesive layer. The ink-receiving layer is a cured layer of a composition for forming the ink-receiving layer, contains an energy ray-curable compound (A), a silicone-based leveling agent (B), and a filler (C). The energy ray-curable compound (A) is an ester of a polyol compound and (meth)acrylic acid. The water contact angle of the ink-receiving layer is 80° or less, and the difference in refractive index [(X)-(Y)] between the refractive index (X) of the ink-receiving layer and the refractive index (Y) of the layer directly in contact with the ink-receiving layer is greater than -0.03.
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
Provided is a display body 1 comprising a light scattering layer 11, at least one light diffusion control layer 12 that is laminated on one surface side of the light scattering layer 11 and has a regular internal structure provided with a plurality of regions having a relatively high refractive index within a region having a relatively low refractive index, and a display device 13 laminated on a surface side of the light diffusion control layer 12 opposite the light scattering layer 11. At a position 0.3 cm from a display surface, the ratio (maximum inclination/0° luminance) of the maximum value of inclination (maximum inclination) of luminance to angles in a luminance distribution measured in a range of −70° to 70°, where 0° indicates a direction perpendicular to the display surface, to the luminance of light emitted in the direction perpendicular to the display surface (front direction) is 0.030 or lower. In the display body 1, the change in luminance resulting from the difference of the recognized angle is excellently uniformized.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
An adhesive sheet 1 has an adhesive layer 11, wherein: an absolute value of an inclination S1 represented by formula (1) is 0.026 or less, where H(450) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 450 nm, and H(650) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 650 nm; the haze value of the adhesive layer 11 is 10%-100%; and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N or more per 25 mm. (1): S1 = (H(650) - H(450))/200 According to the adhesive sheet 1, the luminescent color can be adjusted to white while exhibiting concealability.
C09J 7/10 - Adhesives in the form of films or foils without carriers
C09J 133/04 - Homopolymers or copolymers of esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Provided is a method for removing a coating layer, the method comprising: a step in which a stack (501) obtained by superposing layers of one sheet of a release film (50) including, for example, a substrate film and a coating layer is prepared or a stack obtained by superposing layers of a plurality of sheets of the release film (50) is prepared; a step in which the stack (501) is immersed in treatment water (W1); a step in which after the immersion in the treatment water (W1), the release film (50) is released from the stack (501); and a step in which the coating layer is removed from the released release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substrate film and the releasant layer.
A method for removing a coating layer is provided, the method comprising: a step for preparing a release film (50) comprising, for example, a substrate film and a coating layer; a step for introducing the release film (50) into a pressure vessel (400) (one example of a treatment vessel); a step for exposing the release film (50) to water vapor (V2, V3) inside the pressure vessel (400); and a step for removing the coating layer from the release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substate film and the releasant layer.
The present invention makes it possible to pick up, by a milder operation, an object held by a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer with an uneven surface. This pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer with an uneven surface. The pressure-sensitive adhesive layer has an adhesive force in application to a silicon mirror surface, as determined at a peel angle of 180° and a peel rate of 300 mm/min, of 35 mN/50 mm or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having a relief pattern on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises an adhesive layer having a relief pattern on the surface thereof. After the mirror surface of a silicon chip having a size of 5.0 mm × 5.0 mm is pressed against the adhesive layer of the adhesive sheet at a contact pressure of 0.3 MPa, the workload when peeling the silicon chip from the adhesive layer is 25 μJ or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having a relief pattern on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises an adhesive layer having a relief pattern on the surface thereof. The tensile breaking stress of the adhesive layer at 23°C is 20 MPa or higher.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
[Problem] To provide an adhesive sheet which is capable of securing flexibility of an adhesive layer at low temperatures and is capable of suppressing variation in the degree of deformation even in cases where the adhesive layer is deformed in a specific temperature range. [Solution] An adhesive sheet which has an adhesive layer for bonding a first member and a second member, wherein the Shore hardness of the adhesive layer at -20°C is 70 HS or less as measured with a type E durometer, and the recovery rate of the adhesive layer at 23°C is 70% or more.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
Provided is a reflection-type display body 1 that comprises a light diffusion control layer 11 that has a regular internal structure that comprises a plurality of regions that have a relatively high refractive index within a region that has a relatively low refractive index, a display device 12, and a diffuse reflection plate 13 that has a reflection surface that has an uneven structure. The reflection-type display body 1 is configured such that, when a beam of light that has an angle of incidence of 30° is shined from the four directions at azimuths of 0°, 90°, 180°, and 270° at one arbitrary point on the surface on the light diffusion control layer 11 side to generate reflected light that is diffusely reflected from the one point and the standard deviation of the brightness of the reflected light that both advances within a plane that includes the one point and a normal line and is orthogonal to the azimuth from which the light beam was shined and is also at an angle of no more than 30° from the normal line is calculated for each of the four directions, the average of the four standard deviations is less than 0.25 cd/m2. The reflection-type display body 1 makes it possible to achieve excellent visibility regardless of the vertical direction of display content.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
A contact detecting sensor (100) is provided with a sensor unit (1) that detects contact while alleviating impacts during contact, the sensor unit (1) comprising an expanding/contracting sensor (2).
G01V 3/00 - Electric or magnetic prospecting or detectingMeasuring magnetic field characteristics of the earth, e.g. declination or deviation
B60R 21/0136 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including means for detecting collisions, impending collisions or roll-over responsive to actual contact with an obstacle
G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
Provided is an emulsion containing, as a dispersoid, a (meth)acrylic acid ester polymer comprising, as a monomer unit constituting the polymer, an ethylene carbonate-containing acrylic monomer that has an ethylene carbonate structure represented by formula (1). By using this emulsion, a novel emulsion that uses carbon dioxide as a production starting material, and an article that comprises a resin film formed from an emulsion composition are provided.
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
patents
