A pellicle film attachment apparatus includes: a liquid support unit configured to support a liquid to be adhered to an adherend surface of a frame member; a pellicle film support unit configured to support a pellicle film to be attached to the adherend surface; and a frame conveyance unit configured to convey the frame member and to attach the pellicle film to the frame member, in which the frame conveyance unit is configured to convey the frame member to a liquid adhesion location where the liquid is adhered to the frame member and a pellicle film attachment location where the pellicle film is attached to the frame member.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
A laminated sheet that includes a base material and a metal layer provided on one surface side of the base material, wherein one or more holes having an area of 0.5 μm2 or more when viewed in a plan view are present in the metal layer, and a method of manufacturing the same.
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
3.
LIQUID ADHESION APPARATUS AND LIQUID ADHESION METHOD
A liquid adhesion apparatus that causes a liquid to adhere to an adherend surface of an adherend to which a pellicle film is to be attached, includes: a liquid storage unit that stores the liquid in a liquid storage portion including an opening; a liquid supply unit that supplies the liquid to the liquid storage portion; and a liquid adhesion unit that causes the liquid to adhere to the adherend surface by bringing the adherend surface of the adherend into contact with the liquid stored in the liquid storage portion, in which the liquid supply unit includes a controller that controls an amount of the liquid to be supplied to the liquid storage portion.
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
B05C 3/18 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material only one side of the work coming into contact with the liquid or other fluent material
B05C 3/20 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material for applying liquid or other fluent material only at particular parts of the work
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
An electromagnetic wave absorbing member comprises a resistive layer including a conductive pattern, wherein: the resistive layer includes a first region and a second region having different electromagnetic wave transmission characteristics; the first region has a conductive pattern including first arrays in which first units are arranged, and second arrays in which second units different from the first units are arranged; the second region has a conductive pattern including the first arrays, and the second arrays; the first units and the second units are arranged in a first direction in the first region; the first units and the second units are arranged in a second direction different from the first direction in the second region; and the first array and the second array are arranged adjacent to each other in the first region and the second region.
A pellicle film attachment device, which is configured to attach a pellicle film to an adherend surface of a frame member, includes an attachment unit configured to attach the pellicle film to the adherend surface to which a liquid adheres; and a dryer configured to dry the pellicle film attached to the adherend surface.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
6.
STORAGE CONTAINER OPENING/CLOSING DEVICE AND STORAGE CONTAINER OPENING/CLOSING METHOD
A storage container opening/closing device includes: a storage portion configured to house a frame member to which a pellicle film is attached; a cover configured to cover the storage portion; a storage container support unit configured to support the storage container; and an opening/closing unit configured to open and close the storage container by moving the cover, in which the opening/closing unit includes: a retainer configured to retain the cover; a first movement unit configured to move the cover retained by the retainer in a direction away from and toward the storage portion; and a second movement unit configured to tilt the cover retained by the retainer with respect to the storage portion.
A method for manufacturing a twisted carbon nanotube yarn includes: drawing carbon nanotubes in sheet form from an end portion of a carbon nanotube forest to provide a carbon nanotube sheet; performing false twisting by twisting the carbon nanotube sheet and then performing untwisting to provide a carbon nanotube linear body; and twisting the carbon nanotube linear body to provide a twisted carbon nanotube yarn, in which the number of twists when the carbon nanotube sheet is false-twisted in the false twisting is in a range from 300 T/m to 5,000 T/m, and the number of twists when the carbon nanotube linear body is twisted in the providing of the twisted carbon nanotube yarn is in a range from 900 T/m to 5,000 T/m.
There is provided a thermoelectric module including: a first substrate having a first main surface; a second substrate having a second main surface arranged to face the first main surface; a plurality of thermoelectric elements arranged between the first main surface and the second main surface; and an electrode arranged on the first main surface and connected to a first thermoelectric element and a second thermoelectric element among the plurality of thermoelectric elements. An insulating layer including a first portion and a second portion is arranged on the first main surface, the first portion being arranged to surround the electrode and to be spaced apart from the electrode, the second portion being arranged between the first thermoelectric element and the second thermoelectric element.
Protective sheet includes a base material and a coat layer. The protective sheet has a tensile elongation of 60% or more at which the base material does not break but the coat layer cracks when the protective sheet is stretched at a width of 15 mm, a measurement length of 50 mm, and a tensile speed of 200 mm/min in an environment of 23° C. and 50% RH. The protective sheet has an indentation stress of 1 N or more and 8.8 N or less when a surface of the protective sheet or a laminate including the protective sheet on the coat layer side is indented to a depth of 100 μm at a speed of 0.01 mm/sec over an area of 5 mmφ.
A pellicle film attachment device includes: an affinity improvement treatment unit configured to perform, on an adherend surface of a first frame member, an affinity improvement treatment to improve an affinity for a liquid; a liquid adhesion unit configured to cause the liquid to adhere to the adherend surface having been subjected to the affinity improvement treatment; and an attachment unit configured to attach a pellicle film to the adherend surface to which the liquid adheres.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
There is provided a pressure sensitive adhesive sheet from which an element is more easily peeled. The pressure sensitive adhesive sheet includes a pressure sensitive adhesive layer having a surface with unevenness, the pressure sensitive adhesive sheet is stretchable in a planar direction, and a surface peeling force of an object on the pressure sensitive adhesive sheet after stretching is reduced as compared with a surface peeling force of the object on the pressure sensitive adhesive sheet before stretching.
A laminate including: a pressure sensitive adhesive sheet configured to catch an element distant from a holding substrate, and a release sheet laminated on one of faces of the pressure sensitive adhesive sheet; the pressure sensitive adhesive sheet including a pressure sensitive adhesive layer, the pressure sensitive adhesive layer having an unevenness on a surface; the release sheet including a release layer that is in contact with the pressure sensitive adhesive layer, the release layer having unevenness on a surface; and a peel strength at a release angle of 180° of the release sheet with respect to the pressure sensitive adhesive sheet measured at a release speed of 300 mm/min being 1000 mN/50 mm or less.
Pressure sensitive adhesive sheet (1) includes a pressure sensitive adhesive layer (11) to be attached to a planar heating element. The average value of luminous transmittance of the pressure sensitive adhesive layer (11) in a wavelength region of 380 to 780 nm is 60% or more. The average value of luminous transmittance of the pressure sensitive adhesive layer (11) in a wavelength region of 800 to 1,000 nm is 60% or more. The adhesive strength for the pressure sensitive adhesive sheet (1) is 10 N/25 mm or more when measured through: preparing a laminate configured such that a polyethylene terephthalate film having a thickness of 100 μm and a soda-lime glass plate having a thickness of 1.1 mm are bonded together via the pressure sensitive adhesive layer (11); subjecting the laminate to 200 cycles of a heat shock test in which −35° C. and 70° C. are each applied for 30 minutes in alternation; and then peeling off a laminate of the polyethylene terephthalate film and the pressure sensitive adhesive layer from the soda-lime glass plate. The pressure sensitive adhesive sheet (1) is suitable for attachment to a planar heating element.
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
14.
ANTI-FINGERPRINT COMPOSITION, CURED ARTICLE LAYER, ANTI-FINGERPRINT ARTICLE, AND HARD COAT FILM
An anti-fingerprint composition comprising: at least one selected from a polyfunctional (meth)acrylate-based monomer, a (meth)acrylate-based prepolymer, and a urethane-based polymer; and a plasticizer, wherein when a cured article layer having a thickness of 10 μm and formed by curing the anti-fingerprint composition is formed on a polyethylene terephthalate film having a thickness of 125 μm and a surface of the cured article layer is rubbed back and forth 5 times over a distance of 10 cm using a #0000 steel wool with a load of 125 g/cm2, the number of scratches generated is 10 or less. According to such a cured article layer formed using the anti-fingerprint composition, the scratch resistance is excellent and a fingerprint residue of sebum can be made invisible without the need to wipe off the fingerprint residue.
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
Provided is a π-type thermoelectric conversion module having excellent cooling performance with suppressed back-flow of heat, including: a pair of a first substrate including a first electrode and second substrate including a second electrode, the first substrate and the second substrate opposing each other; a thermoelectric conversion member A including a thermoelectric conversion element M; and a heat back-flow suppression member B including a thermoelectric conversion element K, the thermoelectric conversion member A and the heat back-flow suppression member B being arranged alternately and apart from each other between the first and second substrates, and electrically connected in series via the first electrode on the first substrate and the second electrode on the second substrate, in which carriers of the thermoelectric conversion element M and the thermoelectric conversion element K are different from each other, one of the carriers being a hole and the other of the carriers being an electron, and a sum SA (m2) of areas of surface sides of the thermoelectric conversion member A bonded to the first electrode and the second electrode is larger than a sum SB (m2) of areas of surface sides of the heat back-flow suppression member B bonded to the first electrode and the second electrode.
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
16.
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEET
A pressure sensitive adhesive sheet includes at least a pressure sensitive adhesive layer, wherein a pressure sensitive adhesive constituting the pressure sensitive adhesive layer is an emulsion-type pressure sensitive adhesive containing a cyclic oligosaccharide, and an adhesive strength to soda-lime glass is 5 N/25 mm or more. The above emulsion-type pressure sensitive adhesive is preferably an emulsion-type acrylic-based pressure sensitive adhesive.
A method includes preparing a first substrate including a first main surface and a second main surface and having a thermoelectric element bonded to the first main surface, dispensing a bonding material to a predetermined position on a third main surface of a second substrate including the third main surface and a fourth main surface, aligning the thermoelectric element and the bonding material with each other by disposing the first substrate on the second substrate placed with the fourth main surface in contact with a placement surface of a fixture such that the first main surface faces the second substrate, and bonding the first substrate and the second substrate via the thermoelectric element and the bonding material by bringing the thermoelectric element and the bonding material into contact with each other.
A light diffusion control member includes a light diffusion control layer having a regular internal structure that includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index, and a diffusion pressure sensitive adhesive layer containing light-diffusing fine particles. L1, L2, and L3 identified from reflected light measured for the light diffusion control member (1a, 1b) satisfy the following expressions: (1) L1>1.00; (2) 0.70≤L2≤1.00; and (3) L3<2.00.
An aliphatic polycarbonate resin having an ether structure in its main chain and having a structure in which a repeating unit represented by Formula (Ia) below, a repeating unit represented by Formula (Ib) below, a repeating unit represented by Formula (Ic) below, and a repeating unit represented by Formula (Id) below are randomly copolymerized, wherein R1 and R2 are each a hydrocarbon group whose carbon number is 6 or more, and may be the same or different, and R3 and R4 are each a hydrocarbon group having a crosslinkable functional group and may be the same or different.
An aliphatic polycarbonate resin having an ether structure in its main chain and having a structure in which a repeating unit represented by Formula (Ia) below, a repeating unit represented by Formula (Ib) below, a repeating unit represented by Formula (Ic) below, and a repeating unit represented by Formula (Id) below are randomly copolymerized, wherein R1 and R2 are each a hydrocarbon group whose carbon number is 6 or more, and may be the same or different, and R3 and R4 are each a hydrocarbon group having a crosslinkable functional group and may be the same or different.
An electromagnetic wave absorbing member (10) includes an electromagnetic wave absorbing layer (20), a spacer layer (30), and a reflective layer (40). The electromagnetic wave absorbing layer (20), the spacer layer (30), and the reflective layer (40) are laminated in this order. A relative permittivity of the spacer layer (30) is 5 or greater, and a melting point of the spacer layer (30) is 150° C. or higher.
An aerial image forming device includes a display unit that has a display surface and emits light from the display surface; a light diffusion control unit that is disposed on the display surface side of the display unit and diffuses or transmits the light depending on its incident angle; and a light-transmitting image formation unit that is laminated on a surface side of the light diffusion control unit opposite to the display unit, transmits the light transmitted through the light diffusion control unit, and forms an image in a position on a surface side opposite to the light diffusion control unit. The light diffusion control unit has a louver-shaped regular internal structure that includes a plurality of plate-shaped regions having a relatively high refractive index in a region having a relatively low refractive index.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
Microneedle structure of the present invention includes a needle-shaped portion having an interior formed with a hole portion. The needle-shaped portion contains a low-melting-point resin having a weight-average molecular weight of 25,000 or more and a melting point of 130° C. or lower. Such a microneedle structure can be configured to have a needle-shaped portion having high strength.
G01N 5/02 - Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
23.
RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
where, in the formulae (1) and (2): R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; L1 and L2 are each independently a single bond or an alkylene group having 1 to 3 carbon atoms; and X1 is a reactive group selected from groups represented by a structural formula (2-1) and a structural formula (2-2) below.
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
where, in the formulae (1) and (2): R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; L1 and L2 are each independently a single bond or an alkylene group having 1 to 3 carbon atoms; and X1 is a reactive group selected from groups represented by a structural formula (2-1) and a structural formula (2-2) below.
A brittle adhesive sheet includes a film base material, and an adhesive layer provided at a first surface side of the film base material, wherein the film base material has a film base material main body formed of a polystyrene-based resin and a print receptive layer provided at a second surface side, opposite to a side of the film base material where the adhesive layer is provided, and the print receptive layer includes a polyester-based resin or an acrylic-based resin.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/26 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the laminating process, e.g. release layers or pressure equalising layers
25.
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING MICRONEEDLE STRUCTURE
Microneedle structure includes needle-shaped portions having hole portions formed therein and a base material having one surface side on which the needle-shaped portions are formed. Each of the needle-shaped portions is formed with a porous structure, and the value of tip strength of the needle-shaped portions is 40 mN or more. The method for producing a microneedle structure is used to produce the microneedle structure. Thus, it is possible to provide: a microneedle structure having needle-shaped portions that are suppressed in the defect or breakage during use; and a method for producing such a microneedle structure.
The present invention provides a label having excellent barrier property and transparency, wherein contamination of the container and adhesive residue due to the residual monomer in the adhesive layer are suppressed. The label is a label that is used for shrink-wrapping a container body of a resin container by wrapping around a barrel of the container body and heat-shrinking the shrinkable label, wherein the label comprises at least one heat shrinkable base material, a transparent vapor-deposited film consisting of an inorganic oxide, and an adhesive layer, and the adhesive layer comprises an adhesive composition comprising a triblock copolymer having a block structure of segment A1-segment B-segment A2.
A pellicle film has a porous structure. The pellicle film includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, and a standard deviation of an orientation angle of the carbon nanotubes is 8.0 degrees or less, the standard deviation being determined based on an approximate ellipse of a power spectrum image acquired by subjecting an image obtained by imaging the first pellicle film surface or the second pellicle film surface of the pellicle film to two-dimensional Fourier transform.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
(In the numerical formula (Numerical Formula 1), T represents a visible light transmittance of the pellicle film, Tp represents a pixel value in the image of the pellicle film in the light-transmitting state, Tb represents a pixel value in the image of the image-capturing position in the bright state, and Td represents a pixel value in the image of the image-capturing position in the dark state.)
Provided is a thermoelectric conversion module including a release sheet in which thermoelectric performance is not suppressed, a function as a support base material during a manufacturing process is provided and deformation and damage during conveyance and handling are suppressed. The thermoelectric conversion module includes: a thermoelectric element layer in which a P-type thermoelectric element and an N-type thermoelectric element are arranged alternately and electrically connected in series; a first conductive layer provided on a first surface of the thermoelectric element layer; a first pressure sensitive adhesive layer provided on a surface of the first conductive layer on a side opposite to a surface on the thermoelectric element layer side; and a first release sheet provided on a surface of the first pressure sensitive adhesive layer on a side opposite to a surface on the first conductive layer side. A curvature of the first release sheet is R1000 or greater when the first release sheet is cut to a length of 250 mm and suspended at a center in a length direction.
B32B 3/08 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
A pressure sensitive adhesive composition containing a multimer of modified cyclodextrin; a pressure sensitive adhesive obtained from the pressure sensitive adhesive composition; and a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer formed of the pressure sensitive adhesive. The multimer of modified cyclodextrin is preferably a dimer. The pressure sensitive adhesive is preferably an acrylic-based pressure sensitive adhesive and, in particular, preferably contains a crosslinked product obtained by crosslinking a (meth)acrylic ester polymer using a crosslinker.
A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.
A film for latex ink including a latex ink-receiving layer achieving excellent ink adhesion and excellent scratch resistance. A film having a laminate structure in which a latex ink-receiving layer and a substrate are layered, and the latex ink-receiving layer formed from a resin composition containing an acrylic resin having a cross-linkable functional group, a specific cross-linking agent, an ultraviolet curable acrylate compound, and a photopolymerization initiator.
C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
Projection screen (1) includes a light diffusion control film (10) having an incident light diffusion angle region. When the projection screen (1) is installed vertically to the ground surface, the incident light diffusion angle region in an up-down direction does not include a front face 0° in the horizontal direction with respect to the ground surface, and the haze value at the above front face 0° is 1% or more and 80% or less. According to the projection screen (1), it is possible to suppress unwanted reflection of images projected from a projector onto those other than the projection screen.
A projection screen (1) comprising: a first light-scattering layer (11); a light diffusion control layer (10) laminated on one surface side of the first light-scattering layer (11), the light diffusion control layer (10) having a regular internal structure comprising a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index; and a second light-scattering layer (12) laminated on a surface side of the light diffusion control layer (10) opposite to the first light-scattering layer (11). The projection screen (1) exhibits excellent visibility while suppressing unwanted reflection of images projected from the projector onto those other than the projection screen (1).
A processing method of a workpiece capable of reducing Total Thickness Variation (TTV) of the workpiece includes adhering a front surface protection sheet on a front surface of a workpiece having the front surface and a back surface; grinding the back surface of the workpiece on which the front surface protection sheet is adhered; wherein the front surface of the workpiece has bump electrodes, a raised pattern has been formed along an outer circumference part on the front surface of the workpiece which is an area different from an area where the bump electrodes are formed when adhering the front surface protection sheet, the front surface protection sheet is adhered on the front surface of the workpiece so as to embed the bump electrodes, and a height Hb of each of the bump electrodes and a height H1 of the raised pattern satisfy Hb/8
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
36.
PROTECTIVE FILM-EQUIPPED WRITING-PERFORMANCE ENHANCEMENT FILM
Provided is a protective film-equipped writing feel improving film which is formed by laminating a protective film on at least one surface of a writing feel improving film having a writing feel improving film base material layer and a writing feel improving layer, in which given that a linear expansion coefficient of the writing feel improving film is α (×10−5/K) and a linear expansion coefficient of the protective film is β (×10−5/K), the following formula is satisfied: −6.5<(α−β)<6.5. According to the disclosure, there is provided a protective film-equipped writing feel improving film, which does not curl even due to temperature changes during storage, transportation, processing, and the like and maintains the quality of the writing feel improving film.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class
37.
WRITING FEELING IMPROVEMENT FILM WITH PROTECTION FILM
According to the present disclosure, provided is a protective film-equipped writing feel improving film which is formed by laminating a writing feel improving film having a writing feel improving film base material layer and a writing feel improving layer with a protective film having an adhesive layer and a protective film base material layer, thereby allowing the writing feel improving layer of the writing feel improving film and the adhesive layer of the protective film to be in contact with each other, in which a ratio of a maximum height of rolling circle waviness profile (WEM) of the writing feel improving layer to a thickness a (μm) of the adhesive layer (WEM/a) is 0.01 to 1.00, and even with temperature changes occurring during storage, transportation, processing, or the like, lifting or peeling off does not occur, allowing the quality of the writing feel improving film to be maintained.
G06F 3/039 - Accessories therefor, e.g. mouse pads
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
An energy-ray-crosslinkable pressure-sensitive adhesive composition may contain a (meth)acrylic resin (A) having no energy ray crosslinkability and an acrylic resin (B) having energy ray crosslinkability. A pressure-sensitive adhesive sheet may use such a energy-ray-crosslinkable pressure-sensitive adhesive composition. A crosslinked pressure-sensitive adhesive may be obtained by subjecting the energy-ray-crosslinkable pressure-sensitive adhesive composition to energy ray crosslinking. A pressure-sensitive adhesive sheet may use the crosslinked pressure-sensitive adhesive.
Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.
An element transfer sheet is provided. The element transfer sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the surface. A tensile stress in the first direction of the base material at 100% elongation is larger than a tensile stress in the second direction orthogonal to the first direction. The tensile stress in the first direction is 12 MPa or more, and the tensile stress in the second direction is 9 MPa or more.
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
0
.
2
5
<
S
/
H
<
4
.
7
5
Relational
Expression
(
1
)
A pressure sensitive adhesive sheet includes a base material and a pressure sensitive adhesion layer having unevenness on the layer surface. The pressure sensitive adhesion layer includes an underlying base constituted by a part from a concave portion where, in the thickness direction of the pressure sensitive adhesion layer, a thickness of the pressure sensitive adhesion layer is smallest, to a face on the opposite side of the surface with the unevenness, and a convex portion provided on the underlying base. The pressure sensitive adhesion layer satisfies Relational Expression (1) given below.
0
.
2
5
<
S
/
H
<
4
.
7
5
Relational
Expression
(
1
)
(In Relational Expression (1), S represents a thickness of the underlying base, and H represents a height of the convex portion.)
C09J 151/00 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers
42.
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
43.
PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
A pressure sensitive adhesive sheet includes a pressure sensitive adhesive layer catching elements distant from a holding substrate. The pressure sensitive adhesive layer has unevenness on a surface and having a complex shear elastic modulus at 23° C. of 0.001 MPa or greater and 1.0 MPa or less.
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
44.
THERMOELECTRIC CONVERSION MODULE AND PRODUCTION METHOD FOR SAME
Provided are a thinner thermoelectric conversion module in which a thermistor for temperature detection is embedded inside a substrate included in the thermoelectric conversion module, and a method for manufacturing the thermoelectric conversion module. The thermoelectric conversion module includes a first substrate having a first principal surface and a second principal surface opposite to the first principal surface, a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface, a first electrode provided on the second principal surface, a second electrode provided on the third principal surface, a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface, and a thermistor for temperature detection embedded inside the first substrate and/or the second substrate, and current-carrying electrodes that energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface.
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
A pressure sensitive adhesive sheet, including a laminate of: a substrate; and a pressure sensitive adhesive layer, where the substrate is formable by irradiating a resin film including a polymer and a hydrogen abstraction type photoinitiator with an energy ray, where the hydrogen abstraction type photoinitiator is capable of abstracting a hydrogen from the polymer, the pressure sensitive adhesive layer is formable by irradiating an energy ray-crosslinkable pressure sensitive adhesive composition layer including an energy ray-crosslinkable pressure sensitive adhesive composition with an energy ray, and the laminate of the substrate and the pressure sensitive adhesive layer is formed by irradiating a laminate of the resin film and the energy ray-crosslinkable pressure sensitive adhesive composition layer with an energy ray.
An energy-ray-crosslinkable pressure-sensitive adhesive composition containing an acrylic polymer having energy ray crosslinkability, and another acrylic polymer that is substantially free of radical-reactive unsaturated double bonds and has a weight-average molecular weight (Mw) of 280000 or less. The energy-ray-crosslinkable pressure-sensitive adhesive composition is included in a pressure-sensitive adhesive sheet and a crosslinked pressure-sensitive adhesive obtained by crosslinking the energy-ray-crosslinkable pressure-sensitive adhesive composition with an energy ray. A method for producing the crosslinked pressure-sensitive adhesive, a method for producing the crosslinked pressure-sensitive adhesive, and a method for producing the pressure-sensitive adhesive sheet are also provided.
A film-shaped firing material for heating and pressurizing, the material including: metal particles; and a binder component that contains a resin having a decomposition initiation temperature of 200° C. or less.
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
The exterior window film according to the present invention comprises a substrate, a hard coat layer provided on one surface side of the substrate, and a pressure-sensitive adhesive layer provided on the opposite surface side of the substrate from the side provided with the hard coat layer. The hard coat layer is composed of a material containing a (meth)acrylate-based resin having a urethane (meth)acrylate as a constituent component, a hindered amine light stabilizer, and an ultraviolet absorber. The exterior window film according to the present invention is characterized in that, relative to 100.0 parts by mass of the (meth)acrylate-based resin, a proportion of the hindered amine light stabilizer is 2.0 parts by mass or more and 15.0 parts by mass or less, and a proportion of the ultraviolet absorber is 5.0 parts by mass or more and 30.0 parts by mass or less.
Provided is a sheet for workpiece processing that includes a base material and a pressure sensitive adhesive layer laminated on one side of the base material. The pressure sensitive adhesive layer is composed of an active energy ray-curable pressure sensitive adhesive that contains a hindered amine-based stabilizer. Such a sheet for workpiece processing enables easy separation of workpieces even when a heating treatment is performed.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A window film includes a substrate and an adhesive agent layer disposed on one main surface of the substrate, in which the creep compliance of the adhesive agent layer after 1200 seconds of continuous application of a shear stress of 3000 Pa at 23° C. is 200 (1/MPa) or less.
An information processing apparatus, an information processing program, and a system and a method for manufacturing a decorative sheet which can be applied for any article and easily customize a seal, a cover, or the like that covers the article. An information processing apparatus is applied to a system that manufactures a decorative sheet, which is attached to an article to decorate the article, and includes an acquisition unit, a model generation unit, and an image generation unit. The acquisition unit acquires an image of the article. The model generation unit generates a three-dimensional model of the article based on the image of the article. The image generation unit arranges a design on at least a part of a surface of the three-dimensional model, and generates image data for printing the arranged design on a pressure-sensitive adhesive sheet.
Provided are a gas barrier film and manufacturing methods for making the gas barrier film. The gas barrier film includes a gas barrier layer containing silicon and oxygen as main components. The gas barrier layer has a region in the thickness direction containing silicon, oxygen, and nitrogen. The region has an element ratio of nitrogen of 5 at % or greater and a thickness of 30 nm or greater.
B32B 7/00 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C08J 3/28 - Treatment by wave energy or particle radiation
Provided is a curable resin film for use in forming a cured resin film as a protective film on a bump-formed surface of a semiconductor chip having the bump-formed surface provided with a bump, the curable resin film satisfying requirement (1) below: requirement (1): a near-infrared transmittance at 940 nm is less than 13% after thermal curing treatment at 130° C. and 0.5 MPa for 240 minutes.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/552 - Protection against radiation, e.g. light
54.
SHEET FOR FORMING FIRST PROTECTIVE MEMBRANE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND USE OF SHEET
A first protective membrane forming sheet for forming a first protective membrane on at least a surface of a semiconductor wafer having a bump, the first protective membrane forming sheet including a first base material, a buffer layer, an intermediate release layer, and a first protective membrane forming film stacked in this order in a thickness direction thereof, wherein the intermediate release layer contains an ethylene-vinyl acetate copolymer.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
55.
HARD COAT FILM FOR PROJECTION SCREEN AND PROJECTION SCREEN
Provided is a hard coat film (1) for a projection screen, comprising: a base material film (11); and a hard coat layer (12) formed on one surface side of the base material film, wherein the total luminous haze value is 1% or more and 60% or less, and the ratio of a maximum haze value to a minimum haze value in a wavelength region of 400 nm to 700 nm is less than 7. According to the hard coat film (1) for a projection screen, it is possible to achieve both the visibility when a projector is turned on and the background visibility when the projector is turned off, and reduce color tone change.
Provided is a projection screen used by being attached to an optically transparent adherend. The projection screen includes a transparent base material and a pressure sensitive adhesive layer. The luminance at frontal 0° on the transparent base material side as measured using transmitted light from a white light source of 1100 cd/m2 is 10 cd/m2 or more and 400 cd/m2 or less. The luminance ratio of a luminance at diagonal 45° on the transparent base material side as measured using transmitted light from a white light source of 1100 cd/m2 with respect to the luminance at frontal 0° is 0.5 or more. According to the projection screen, it is possible to achieve both the background visibility when the projector is turned off and the frontal and diagonal visibility when the projector is turned on.
A pressure sensitive adhesive sheet including a base material, a metallized layer, and a rubber-based hot-melt pressure sensitive adhesive layer in this order, the pressure sensitive adhesive sheet further including a coating layer disposed between the metallized layer and the rubber-based hot-melt pressure sensitive adhesive layer and containing a polyester-based resin.
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 121/00 - Adhesives based on unspecified rubbers
A microneedle structure of the present invention comprises: a liquid-impermeable base material that has a through-hole; a liquid-absorbable absorbent material that fills the through-hole; a needle-shaped portion that is provided on one surface side of the base material and has a flow channel formed therein; and a functional member that is provided on the other surface side of the base material. The needle-shaped portion and the absorbent material are connected to each other, and the absorbent material and the functional member are connected to each other.
There is provided a gas barrier laminate capable of providing a singulated product in which occurrence of breakage of a gas barrier layer is suppressed when the gas barrier laminate is laminated on an adherend and singulated together with the adherend, the gas barrier laminate including a base material, the gas barrier layer, and a hardenable pressure sensitive adhesion agent layer in this order, wherein the hardenable pressure sensitive adhesion agent layer has a post-curing storage modulus E1 at 23° C. of 1.0 GPa or more.
A solid electrolyte contains: an electrolyte solution containing a lithium salt and a carbonate solvent; metal oxide particles; and an ion conductive polymer. The ion conductive polymer contains a cross-linked product of a cross-linked polyether. Assuming that a total content of the electrolyte solution and the ion conductive polymer is 100 mass %, a content of the electrolyte solution is in a range from 87 mass % to 93 mass % and a content of the ion conductive polymer is in a range from 7 mass % to 13 mass %.
A high-frequency dielectric heating adhesive contains a thermoplastic resin and a cyano group-containing organic compound, and the high-frequency dielectric heating adhesive satisfies (1) below: (1) the high-frequency dielectric heating adhesive has a total luminous transmittance of 50% or more as measured in accordance with JIS K 7361-1:1997.
A pressure sensitive adhesive sheet includes at least a pressure sensitive adhesive layer, wherein the gel fraction of a pressure sensitive adhesive that constitutes the pressure sensitive adhesive layer is less than 10%, and the 500% modulus when performing a tensile test at 23° C. for the pressure sensitive adhesive layer is 0.02 N/mm2 or more and 5 N/mm2 or less. In the pressure sensitive adhesive sheet, the pressure sensitive adhesive that constitutes the pressure sensitive adhesive layer may contain a polymer having a main chain obtained by copolymerizing an acrylic-based monomer and a cyclodextrin derivative having a polymerizable group. Such a pressure sensitive adhesive sheet enables the pressure sensitive adhesive layer to be recycled.
A preform structure includes a carbon fiber, a support layer that serves as a substrate for the carbon fiber, and a carbon-based thread for securing the carbon fiber to the support layer.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B29C 70/08 - Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, with or without non-reinforced layers
B29C 70/22 - Fibrous reinforcements only characterised by the structure of fibrous reinforcements using fibres of substantial or continuous length oriented in at least two directions forming a two dimensional structure
The present invention relates to a method for manufacturing a gas barrier film, including at least steps 1 to 3 (each step is as defined in the specification) in this order;
a gas barrier film including: a substrate; and a polysilazane-based compound-derived layer on at least one surface side of the substrate, wherein the polysilazane-based compound-derived layer satisfies a specific requirement; and
a gas barrier film including: a substrate; and a gas barrier layer laminate provided on at least one surface side of the substrate and including a gas barrier layer (XG) not adjacent to the substrate and a gas barrier layer (YG) located closer to the substrate than the layer (XG) and adjacent to the layer (XG), the gas barrier layers (XG) and (YG) being directly laminated, wherein the gas barrier layer laminate satisfies a specific requirement.
An energy-beam-crosslinkable pressure sensitive adhesive composition, including an acrylic resin (A) having energy beam crosslinkability, and a tackifier (B). The tackifier (B) contains a styrene-based resin (B1). A pressure sensitive adhesive sheet including an energy-beam-crosslinkable pressure sensitive adhesive composition layer containing the energy-beam-crosslinkable pressure sensitive adhesive composition on a substrate or a release liner.
Microneedle structure of the present invention includes a needle-shaped portion on one surface side of a base material. The base material has fluid permeability in its thickness direction. The needle-shaped portion is composed of a composition that contains a low-melting-point resin having a melting point of 150° C. or lower. The needle-shaped portion has a surface and an interior that are formed with hole portions. The method for producing a microneedle structure of the present invention includes a bonding step of heating a composition containing a low-melting-point resin having a melting point of 150° C. or lower to bond the heated low-melting-point resin and the base material. Thus, the microneedle structure and the method for producing the microneedle structure are provided, in which the influence of high temperature on the base material is reduced and the degree of freedom in selecting the base material is high.
A solid electrolyte contains: an electrolyte solution containing a lithium salt and a carbonate solvent; and metal oxide particles. In the solid electrolyte, the lithium salt is at least one selected from lithium-bis(fluorosulfonyl)imide and lithium borofluoride, the carbonate solvent is at least one selected from dimethyl carbonate and propylene carbonate, a molar ratio (lithium salt/carbonate solvent) of the lithium salt to the carbonate solvent is in a range from 1/4 to 1/1, a mass ratio (electrolyte solution/metal oxide particle) of the electrolyte solution to the metal oxide particles is in a range from 72/28 to 93/7, and a specific surface area of the metal oxide particles measured by a BET method is in a range from 160 m2/g to 700 m2/g.
A pressure sensitive adhesive sheet for bonding two rigid plates together, at least one of the two rigid plates having irregularities on a surface on a side to be bonded to the other rigid plate, the pressure sensitive adhesive sheet containing: a composite pressure sensitive adhesive layer containing an optically functional pressure sensitive adhesive layer and a transparent pressure sensitive adhesive layer that does not have an optical function of the optically functional pressure sensitive adhesive layer; and a release sheet laminated on the transparent pressure sensitive adhesive layer in the composite pressure sensitive adhesive layer, the composite pressure sensitive adhesive layer having a straightforward transmittance of 90% or less for light rays having a wavelength of 550 nm. According to such a pressure sensitive adhesive sheet, uneven optical function in the pressure sensitive adhesive layers can be suppressed.
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
A wiring sheet for three-dimensional molding includes a pseudo-sheet structure including a plurality of conductive linear bodies arranged at an interval; a first embedding layer; and a second embedding layer, the pseudo-sheet structure being sandwiched between the first embedding layer and the second embedding layer. The conductive linear bodies have a wave shape when viewed from above. A storage shear modulus at 23° C. of each of the first embedding layer and the second embedding layer is from 1×104 to 3×106 Pa. When a thickness of the first embedding layer is T1, a thickness of the second embedding layer is T2, and a thickness of the pseudo-sheet structure is T3, a specific relational equation is satisfied.
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
70.
ACTINIC RAY-CROSSLINKABLE ADHESIVE AGENT COMPOSITION, CROSS-LINKED ADHESIVE AGENT, ADHESIVE SHEET, AND METHODS FOR MANUFACTURING SAME
Provided are an energy ray-crosslinkable pressure sensitive adhesive composition, a pressure sensitive adhesive sheet containing the composition, a crosslinked pressure sensitive adhesive obtained by crosslinking the composition using an energy ray, a method for producing the crosslinked pressure sensitive adhesive, a pressure sensitive adhesive sheet containing the crosslinked pressure sensitive adhesive, and a method for producing the pressure sensitive adhesive sheet. The energy ray-crosslinkable pressure sensitive adhesive composition contains: (A) a block copolymer of an aromatic vinyl compound and a diene compound, the block copolymer containing a vinyl group in a side chain; (B) a tackifier having a softening point of 80° C. or higher and 150° C. or lower; and (C) a photopolymerization initiator.
[Problem] A release liner and an adhesive sheet with which contact area of an adhesive layer on an adherend is reduced at positioning and adhesive force can excellently develop at the adhesive layer after positioning are provided.
[Problem] A release liner and an adhesive sheet with which contact area of an adhesive layer on an adherend is reduced at positioning and adhesive force can excellently develop at the adhesive layer after positioning are provided.
[Solution] A release liner 100 has a surface 101 at which concave portions 120 are formed. The concave portion narrows toward a deepest part 121, and a portion 110 between the concave portions has a convex sectional shape in a thickness direction D1 of the release liner. The convex sectional shape narrows at a continuous tilt from the deepest part to an apex 111 of the convex sectional shape, and in the convex sectional shape, a width w at a height of ½h, which is half of a height h, and the height h have a relation of w>h.
A carbon fiber reinforced plastic includes: a base portion including a plurality of stacked carbon fiber layers including carbon fibers arranged at least in a single direction; a resin with which the base portion is impregnated; and a carbon yarn, in which the carbon yarn penetrates the plurality of carbon fiber layers.
B32B 5/06 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer needled to another layer, e.g. of fibres, of paper
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
A pressure sensitive adhesive used in optical applications. The pressure sensitive adhesive contains a modified cyclodextrin having a degree of modification of more than 2.5 and 3.0 or less. The gel fraction of the pressure sensitive adhesive is 1.0% or more. Such a pressure sensitive adhesive is excellent in the durability even at high temperatures.
There is provided a pressure sensitive adhesive label, including: a pressure sensitive adhesive layer, a base material layer, and a detachment coat layer in this order, in which the detachment coat layer is formed of a composition for forming a detachment coat layer that contains an aqueous polyester-based resin, and the aqueous polyester-based resin has an acid value of 10 KOHmg/g or more, and a glass transition temperature Tg of 0° C. or more and 70° C. or less.
An object is to provide an inkjet printing sheet that can suppress uneven printing by suppressing variation in the interference among dots in an ink-receiving layer surface. This object was achieved by a sheet for inkjet printing, the sheet having a multilayer structure including in this order an ink-receiving layer, a base material, a pressure sensitive adhesive layer, and a release liner, the release liner including a silicone-based release agent layer on a contact face with the pressure sensitive adhesive layer, the ink-receiving layer including a composition for forming ink-receiving layer containing a resin and a silicone-based leveling agent. A content of the silicone-based leveling agent is 0.005 parts by mass or greater and less than 0.30 parts by mass per 100 parts by mass of the resin.
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,
A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,
TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C. (Numerical Formula 11)
A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,
TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C. (Numerical Formula 11)
TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)−10 degrees C. (Numerical Formula 12).
C09J 9/00 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
A pressure sensitive adhesive sheet may include a base material and a hot-melt pressure sensitive adhesive layer which contains a softener, and further include a barrier layer disposed between the base material and the hot-melt pressure sensitive adhesive layer, the barrier layer containing at least one selected from the group consisting of a polyester-based resin, a polyurethane-based resin, and a polyolefin-based resin. The polyester-based resin may be at least one of a polyester resin or a modified polyester resin.
A pressure sensitive adhesive sheet having a pressure sensitive adhesive layer that includes at least one colored pressure sensitive adhesive layer, the colored pressure sensitive adhesive layer having a pressure sensitive adhesive that contains a colorant, the pressure sensitive adhesive layer having a lightness L* of 90 or less as defined by a CIE 1976 L*a*b* color system, the pressure sensitive adhesive layer having a total luminous transmittance of 3% or more and a thermal conductivity of 0.1 W/m·K or more.
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
79.
PROJECTION-BEARING BODY MANUFACTURING METHOD AND PROJECTION-BEARING BODY MANUFACTURING DEVICE
A device EA that manufactures a projection-bearing body having a structure in which projections CV are formed on a bearing sheet BS comprises: a material transfer unit 10 that executes a material transfer step of transferring a base material BM containing a plastic material PM; a material support unit 20 that executes a material support step of supporting the base material BM transferred by the material transfer unit 10, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; and a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material PM. In the base material BM, the plastic material PM is stacked on one surface of the bearing sheet BS. When transferring the base material BM, the material transfer unit 10 places the base material BM on the support member 22, with the plastic material PM in contact with the support surface 22A.
F16C 33/20 - Sliding surface consisting mainly of plastics
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
B29C 71/00 - After-treatment of articles without altering their shapeApparatus therefor
A wiring sheet includes a pair of electrodes and a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals, in which the pseudo sheet structure is electrically connected to the electrodes, and the conductive linear bodies and the electrodes are fixed with contact fixing members.
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
H05B 3/36 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
81.
Method for manufacturing thermoelectric conversion module
Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
H10N 10/857 - Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1−VB1)/VA1}×100 (Formula 2): Vx2={(VA2−VB2)/VA2}×100
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
A device EA that manufactures a projection-bearing body CB in which projections CV are formed comprises: a material support unit 20 that executes a material support step of supporting a base material BM, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material to form the projection-bearing body CB; and a separating unit 60 that executes a separating step of separating the projection-bearing body CB from the support member 22. The support member 22 has a structure dividable into a plurality of support members, and the separating unit 60 includes an individually separating unit 63 that separates the divided first and second support member 22α, 22β individually from the projection-bearing body CB.
B29C 67/20 - Shaping techniques not covered by groups , or for porous or cellular articles, e.g. of foam plastics, coarse-pored
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
84.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan δ/ε′r), where tan δ and ε′r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,
A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan δ/ε′r), where tan δ and ε′r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,
0
A viewing angle control film having an incident light diffusion angle region, wherein when the viewing angle control film is installed vertically to a ground surface, the incident light diffusion angle region in an up-down direction does not include a front face 0° in a horizontal direction with respect to the ground surface, and a total luminous transmittance at the front face 0° is 85% or more and 100% or less. The viewing angle control film preferably has a louver-shaped internal structure including a plurality of regions having a relatively high refractive index (plate-like high refractive index regions) in a region having a relatively low refractive index (low refractive index region).
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,
r/R≤300 (F1)
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,
r/R≤300 (F1)
Rn≤Rn−1 (F2)
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,
r/R≤300 (F1)
Rn≤Rn−1 (F2)
where n is an integer of 2 or more,
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,
r/R≤300 (F1)
Rn≤Rn−1 (F2)
where n is an integer of 2 or more,
0
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
An attachment apparatus includes: a guide mechanism provided along an attaching direction on an adhesion target surface; a slider supported by the guide mechanism in a manner movable in the attaching direction; a shaft body rotatably supported by the slider; a biasing unit that applies a biasing force in a rotation direction to the shaft body; a connector extending from the shaft body in a radial direction of the shaft body; and an elastic roller supported by the connector. The elastic roller separates a sheet piece into an adhesive sheet to be inverted by the elastic roller and a release sheet to be delivered in the attaching direction. The adhesive sheet inverted by the elastic roller is pressed to be attached on the adhesion target surface by the biasing force.
CONDUCTIVE STRUCTURE, MANUFACTURING METHOD FOR CONDUCTIVE STRUCTURE, ARTICLE INCLUDING CONDUCTIVE STRUCTURE, AND MANUFACTURING METHOD FOR ARTICLE INCLUDING CONDUCTIVE STRUCTURE
Provided are a conductive structure having low contact resistance, the conductive structure including a cured layer formed by curing a curable composition, a conductive linear body fixed by the cured layer, and a pair of electrodes placed so as to directly contact the conductive linear body, wherein the curable composition contains a cationic polymerizable compound and a photocationic polymerization initiator, and the cured layer fixes the electrodes; a manufacturing method for the conductive structure; and article including the conductive structure; and a manufacturing method for the article.
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
90.
MOLDED BODY, JOINING METHOD, AND METHOD FOR PRODUCING MOLDED BODY
A molded body includes: a first portion including a first material that contains a first thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field; and a second portion including a second material different from the first material of the first portion.
A high-frequency dielectric heating adhesive sheet includes an adhesive layer that at least contains a thermoplastic resin and a dielectric material that generates heat upon application of a high-frequency electric field. The adhesive layer contains silane-modified polyolefin as the thermoplastic resin, and a melt flow rate (MFR) at 190 degrees C. of the thermoplastic resin is in a range from 2 g/10 min to 50 g/10 min.
A protective film comprising a release liner, a pressure sensitive adhesive layer, and a base material film laminated in this order in a thickness direction thereof, wherein the base material film contains polyurethane or poly(vinyl chloride), and information is printed on an opposite side, of the release liner, from the pressure sensitive adhesive layer.
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
The present invention provides a label having excellent barrier property and transparency, wherein contamination of the container and adhesive residue due to the residual monomer in the adhesive layer are suppressed. The label is a label that is used for shrink-wrapping a container body of a resin container by wrapping around a barrel of the container body and heat-shrinking the shrinkable label, wherein the label comprises at least one heat shrinkable base material, a transparent vapor-deposited film consisting of an inorganic oxide, and an adhesive layer, and the adhesive layer comprises an adhesive composition comprising a triblock copolymer having a block structure of segment A1-segment B-segment A2.
An object is to provide a film for latex ink having a latex ink-receiving layer containing an acrylic resin, the latex ink-receiving layer having excellent adhesion to both a printed portion using latex ink and a base material. Then, the object is achieved by the following: a film for latex ink having a laminate structure in which a latex ink-receiving layer (X) and a base material (Y) are stacked, in which the latex ink-receiving layer (X) is formed of a resin composition (x1) containing an acrylic resin (A) having a cross-linkable functional group and a cross-linking agent (B), and the cross-linking agent (B) contains an isocyanurate compound (B1) and a modified product (B2) of the isocyanurate compound.
2 to cure the adhesive layer, the difference in a gel fraction of the adhesive constituting the adhesive layer before and after the irradiation is from 5 to 50 points.
A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film contains a weakly basic hindered amine-based compound having a carbonate skeleton.
A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.
2/R)×(1/L)≥0.003, wherein D represents the diameter of the linear-bodies, L represents the spacing between adjacent ones of the linear-bodies, R represents the volume resistivity of the linear-bodies, and D and L are in units of cm. A heating element and a heating device each include the sheet.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 3/08 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/10 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of paper or cardboard
B32B 29/00 - Layered products essentially comprising paper or cardboard
H05B 3/84 - Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
100.
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, AND LAMINATE
A pressure sensitive adhesive composition that includes: a (meth)acrylic ester polymer (A) containing, as a monomer unit constituting the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below; and an ionic compound (B).
A pressure sensitive adhesive composition that includes: a (meth)acrylic ester polymer (A) containing, as a monomer unit constituting the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below; and an ionic compound (B).
patents
