This semiconductor device (100) comprises an element body (10), a capacitor part (30), an inductor part (50), and a first columnar interconnect (81). The capacitor part (30) and the inductor part (50) are located inside the element body (10). A part of the inductor part (50) is located in the same layer as the capacitor part (30) in a direction orthogonal to a first main surface (100A) of the element body (10). The capacitor part (30) comprises an aluminum oxide body (41), a first electrode layer (46), a dielectric layer (48), and a second electrode layer (47). The first electrode layer (46), the dielectric layer (48), and the second electrode layer (47) are layered along the outer surface of the aluminum oxide body (41) on a third positive direction (ZA) side, and along the inner surfaces of a plurality of holes (42) in the aluminum oxide body (41). The dimension of an inductor interconnect (51) of the inductor part (50) in the direction orthogonal to the first main surface (100A) is greater than the dimension of the capacitor part (30) in the direction orthogonal to the first main surface (100A).
This semiconductor device (100) comprises an element body (10), a capacitor part (30), and an inductor part (50). The capacitor part (30) and the inductor part (50) are located inside the element body (10). The capacitor part (30) comprises an aluminum oxide body (41), a first electrode layer (46), a dielectric layer (48), and a second electrode layer (47). The first electrode layer (46), the dielectric layer (48), and the second electrode layer (47) are layered along the outer surface of the aluminum oxide body (41) on a third positive direction (ZA) side, and along the inner surfaces of a plurality of holes (42) in the aluminum oxide body (41). The inductor part (50) comprises an inductor interconnect (51) that turns about a turning axis parallel to a first main surface (100A). The inductor interconnect (51) is located in a layer different from that of the capacitor part (30) in a direction orthogonal to the first main surface (100A), and overlaps the capacitor part (30) in a perspective view of the semiconductor device (100) facing the third positive direction (ZA).
This optical coupling module comprises a substrate, an optical coupler, and an adhesive member. The optical coupler includes a base portion having a first main surface and a second main surface, a first support portion supporting an optical fiber, a second support portion disposed with a gap from the first support portion along the longitudinal direction of the optical fiber, and a metal reflection mirror including a heat transfer portion that has a facing surface facing the substrate. The second support portion has an inclined portion. The metal reflection mirror is at least partially disposed along the inclined portion, and reflects emitted light. The heat transfer portion is positioned on the substrate side in the arrangement direction of the first main surface and the second main surface with respect to the reflection position of the emitted light, and the thickness of the heat transfer portion along the normal direction of the inclined portion increases toward the substrate. The adhesive member is disposed between the facing surface and the substrate. The thermal conductivity of the heat transfer portion and the thermal conductivity of the adhesive member are each higher than the thermal conductivity of the second support portion.
A semiconductor device (100) comprises: an element body (10); a capacitor unit (30); and an inductor unit (50). The capacitor unit (30) and the inductor unit (50) are positioned inside the element body (10). The inductor unit (50) is positioned in the same layer as the capacitor unit (30) in a direction orthogonal to a first main surface (100A) of the element body (10). The capacitor unit (30) is provided with an aluminum oxide body (41), a first electrode layer (46), a dielectric layer (48), and a second electrode layer (47). The aluminum oxide body (41) has a plurality of holes (42) extending from an outer surface thereof on a third positive direction (ZA) side toward a third negative direction (ZB) side. The first electrode layer (46) is layered on the outer surface of the aluminum oxide body (41) facing the third positive direction (ZA) and inner surfaces of the plurality of holes (42). The dielectric layer (48) is layered on the side of the first electrode layer (46) opposite from the aluminum oxide body (41). The second electrode layer (47) is layered on the side of the dielectric layer (48) opposite from the first electrode layer (46).
Provided is a multilayer ceramic electronic component with improved moisture resistance. In a multilayer ceramic capacitor 1, a first lead-out portion 31B of a first internal electrode layer 31 has a first inclined portion 31Ba that is led out from a first facing portion 31A and is inclined inward in the lamination direction as the first inclined portion 31Ba extends from the first facing portion 31A side toward a first end surface LS1 side, and a second lead-out portion 32B of a second internal electrode layer 32 has a second inclined portion 32Ba that is led out from a second facing portion 32A and is inclined inward in the lamination direction as the second inclined portion 32Ba extends from the second facing portion 32A side toward a second end surface LS2 side. A first principal surface TS1 of a laminate 10 has a first raised portion 15 disposed in the vicinity of the first end surface LS1 and a second raised portion 16 disposed in the vicinity of the second end surface LS2. At least a top portion 15a of the first raised portion 15 is covered with a first external electrode 40A, and at least a top portion 16a of the second raised portion 16 is covered with a second external electrode 40B.
This wireless sensor system comprises a reception antenna and a transmission antenna disposed inside a housing that covers a motor. When the larger one between the coil diameter of the transmission antenna and the coil diameter of the reception antenna is defined as an antenna diameter, the distance from the transmission antenna and the reception antenna to a metal positioned closest to the transmission antenna and the reception antenna is defined as a metal distance, the ratio of the metal distance to the antenna diameter is defined as an M/D ratio, and the signal-to-noise ratio of the output of the reception antenna is defined as an S/N ratio, the S/N ratio has a characteristic of being maximum when the M/D ratio is a prescribed value. The M/D ratio is set to a value that makes the S/N ratio greater than a predetermined reference value.
H02K 11/20 - Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
Provided are a high-frequency module and a communication device capable of reducing transmission loss degradation while enabling communication for a co-banded communication band. A high-frequency module (1) comprises a first filter (21), a second filter (22), and a switch (5). The first filter (21) has a first passband. The first passband includes a reception band of a first communication band. The second filter (22) has a second passband. The second passband includes a transmission band of the first communication band and a reception band of a second communication band. The switch (5) connects the first filter (21) and/or the second filter (22) to an antenna terminal (71). The reception band of the second communication band includes a first band and a second band. The first band is a band overlapping the reception band of the first communication band. The second band is a band overlapping the transmission band of the first communication band. The second filter (22) is a variable filter.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H03H 9/54 - Filters comprising resonators of piezoelectric or electrostrictive material
H03H 9/70 - Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
8.
POWER CONVERSION DEVICE AND PROGRAM FOR POWER CONVERSION DEVICE
A power conversion device (10) comprises: a diode (55), an anode terminal of which is connected to a high-potential output terminal (50A) of a rectifier circuit (50); and a fifth capacitor (C5), one end of which is connected to a cathode terminal of the diode (55) and the other end of which is connected to a low-potential output terminal (50B) of the rectifier circuit (50). When starting power conversion in a power conversion circuit (30), a control unit (100) of the power conversion device (10) starts on/off switching of a plurality of bidirectional switches, said switching being in accordance with a switching sequence, when the phase of an AC voltage which is inputted to the power conversion circuit (30) is within any of the following ranges: 0±5°, (30)±5°, –(30)±5°, (60)±5°, –(60)±5°, (90)±5°, –(90)±5°, (120)±5°, –(120)±5°, (150)±5°, –(150)±5°, and (180)±5°.
H02M 7/12 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
A heat diffusion device (1) has a housing (100), and a working medium and a wick (200) disposed in an internal space of the housing (100). The housing (100) has a top face (10) and a bottom face (20) having a first bottom face (21) and a second bottom face (22) opposite the top face (10) in the thickness direction. A step (23) is provided between the first bottom face (21) and the second bottom face (22). The minimum distance between the top face (10) and the first bottom face (21) is smaller than the minimum distance between the top face (10) and the second bottom face (22). The step (23) has a first step face (23a) parallel to a first direction orthogonal to the thickness direction, a second step face (23b) parallel to the first direction, and a first connection step face (23c) that is not parallel to the first direction and connects together an end part of the first step face (23a) and an end part of the second step face (23b) in the first direction. The wick (200) has a first part (200A) that continuously covers the first bottom face (21), the first step face (23a), and the second bottom face (22) of the housing (100) along a second direction orthogonal to the thickness direction and to the first direction, and a second part (200B) that continuously covers the first bottom face (21), the second step face (23b), and the second bottom face (22) of the housing (100) along the second direction. Between a portion of the first part (200A) of the wick (200) that covers the first bottom face (21) of the housing (100) and a portion of the second part (200B) of the wick (200) that covers the second bottom face (22), a non-continuous part where the wick (200) is not continuous in the first direction is provided along the first connection step face (23c).
F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
10.
FILTER DEVICE AND HIGH-FREQUENCY FRONT END CIRCUIT PROVIDED WITH SAME
This filter device (100) comprises: a laminate (110); an input terminal (TI), an output terminal (TO), and a ground terminal (GND) on a lower surface (112) of the laminate (110); a ground electrode (PG10) connected to the ground terminal (GND); a ground electrode (PG20) connected to the ground electrode (PG10) and located between an upper surface (111) of the laminate and the ground electrode (PG10); resonance circuits (RC1-RC4); and a crossover electrode (P5) connecting the resonance circuits (RC1, RC2). The resonance circuits (RC1, RC2) are connected to the input terminal (TI) and the output terminal (TO), respectively. Each of the resonance circuits (RC1, RC2) includes a one-side-open via (V1, V2) with a capacitor (C1, C2). Each of the resonance circuits (RC3, RC4) includes a capacitor (C3, C4) and a both-sides-open inductor with a capacitor (C34). In a plan view from the lamination direction, the crossover electrode (P5) does not overlap the resonance circuits (RC3, RC4).
This secondary battery has: a solid electrolyte layer having a first main surface and a second main surface on the opposite side from the first main surface; a positive electrode current collector provided on the first main surface; a positive electrode active material layer provided on the positive electrode current collector; a negative electrode current collector provided on the second main surface; and a negative electrode active material layer provided on the negative electrode current collector, wherein the negative electrode active material layer, the negative electrode current collector, the solid electrolyte layer, the positive electrode current collector, and the positive electrode active material layer are laminated in this order in a direction perpendicular to the first main surface.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
An antenna element (101) comprises a plurality of insulator layers and a plurality of conductor layers. The plurality of conductor layers constitute at least a first radiation conductor, a second radiation conductor, and a ground conductor layer. The area of the ground conductor layer is greater than the area of the second radiation conductor, and the area of the second radiation conductor is greater than the area of the first radiation conductor. The first radiation conductor overlaps the second radiation conductor as seen in the direction orthogonal to a principal surface of the second radiation conductor. The second radiation conductor overlaps the ground conductor layer as seen in the direction orthogonal to a principal surface of the ground conductor layer. The ground conductor layer, the second radiation conductor, and the first radiation conductor are layered in the given order from an inner layer to an outer layer of a stack. At least a portion of the first radiation conductor and at least a portion of the second radiation conductor are not parallel to the ground conductor layer.
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 5/40 - Imbricated or interleaved structuresCombined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
H01Q 5/307 - Individual or coupled radiating elements, each element being fed in an unspecified way
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
13.
ANTENNA ELEMENT, ANTENNA MODULE, AND ELECTRONIC APPARATUS
An antenna element (101A) is provided with an insulator layer, and a conductor member positioned along the insulator layer or positioned inside the insulator layer. The insulator layer is provided with base layers (21, 22), an inclined part formation layer (1), and coating layers (31, 32) that cover the inclined part formation layer (1) between the base layers (21, 22) and the coating layers (31, 32). A part of the coating layers (31, 32) is laminated on a part of the base layers (21, 22), the inclined part formation layer (1) is laminated between the other parts of the base layers (21, 22) and the other parts of the coating layers (31, 32), a part of the conductor member is a radiation conductor (RC) formed on the coating layers covering the inclined part formation layer, and a part of the conductor member is a power supply transmission line (FL) formed on the coating layers (31, 32).
An electronic component (100) comprises a base material (10), a resistive layer (20), a base material electrode portion (30), a protective film (70), a chip component (80), and solder (91). The resistive layer (20) is formed on the base material (10). The resistive layer (20) has a first portion (21) and a second portion (22) positioned on the first direction (D1) side with respect to the first portion (21). The base material electrode portion (30) is formed on the first portion (21) of the resistive layer (20). The base material electrode portion (30) has an edge portion (311) on the first direction (D1) side. The protective film (70) has a first covering portion (71) that covers the second portion (22) of the resistive layer (20) and a second covering portion (72) that covers the edge portion (311) of the base material electrode portion (30). The chip component (80) has a chip electrode portion (81). The solder (91) fixes the chip component (80) to the base material electrode portion (30) and electrically connects the chip electrode portion (81) and the base material electrode portion (30).
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
C03C 10/14 - Silica crystalline phase, e.g. stuffed quartz, cristobalite
C03C 10/02 - Non-silica and non-silicate crystalline phase, e.g. spinel, barium titanate
C03C 10/04 - Silicate or polysilicate crystalline phase, e.g. mullite, diopside, sphene, plagioclase
C03C 10/06 - Divalent metal oxide aluminosilicate crystalline phase, e.g. anorthite, slagcerams
C04B 35/16 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay
A transmission line according to the present invention comprises a laminate (10) obtained by lamination of insulator layers (L1, L2, L3) and a conductor layer patterned along the insulator layers (L1, L2, L3). The conductor layer includes a ground conductor pattern (GL) and signal line conductor patterns (SL1, SL2), and the laminate (10) has a curved-shaped portion (CP) at a position along the extension direction of the signal line conductor patterns (SL1, SL2). Thus, a spatial area (SA) is provided by the curved-shaped portion (CP) of the laminate (10).
The present invention reduces Vπ⋅L. An optical modulator (1) comprises an optical waveguide (2), a first cladding layer (3), a first electrode (4), a second electrode (5), and a second cladding layer (7). The first cladding layer (3) covers the optical waveguide (2). The first electrode (4) is spaced apart in the width direction from a first end (21) of the optical waveguide (2) in the width direction. The second electrode (5) is spaced apart in the width direction from a second end (22) of the optical waveguide (2) in the width direction, and a voltage is applied between the first electrode (4) and the second electrode (5). The second cladding layer (7) covers the first cladding layer (3). The refractive index of the first cladding layer (3) is lower than the refractive index of the optical waveguide (2). The relative permittivity of the second cladding layer (7) is higher than the relative permittivity of the first cladding layer (3). The second cladding layer (7) has a slit (72) overlapping the optical waveguide (2). The relative permittivity inside the slit (72) is lower than the relative permittivity of the second cladding layer (7).
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
18.
METHOD FOR MANUFACTURING OPTICAL MODULATOR, AND OPTICAL MODULATOR
The present invention makes it easier to ensure that the relation between a second cladding layer and an optical waveguide material layer is as designed. This method for manufacturing an optical modulator (1) comprises a first substrate forming step and a bonding step. In the first substrate forming step, a first substrate (100) is formed. The first substrate (100) includes: a second cladding layer (7) having a planar main surface (701); and a support substrate (10). The first substrate (100) has a planar main surface (111). In the bonding step, a second substrate (200) is prepared, the second substrate (200) having a first main surface (211) and a planar second main surface (212), and in which an optical waveguide material that serves as the basis of an optical waveguide material layer (20) including an optical waveguide (2) is exposed on the second main surface (212), the main surface (111) of the first substrate (100) and the second main surface (212) of the second substrate (200) are arranged to face one another, and then the first substrate (100) and the second substrate (200) are bonded together.
G02F 1/035 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect in an optical waveguide structure
According to one aspect of the present disclosure, a radio frequency (RF) transmit system includes: an RF power amplifier (PA); a power management circuit (PMC) configured to receive a control signal and to generate a supply modulation signal having a level responsive to the control signal and selected from a plurality of discrete supply voltage levels; and a bias modulation circuit configured to generate at least one bias modulation signal having a level responsive at least in part to the level of the supply modulation signal, wherein both the supply modulation signal and the bias modulation signal are applied to the RF PA.
An artificial quartz member (100) is used in an optical element (101) irradiated with laser light, wherein the Na content is 15 ppb by weight or less, the Al content is 1500 ppb by weight or less, and the molar ratio Na/Al of Na to Al is 0.2 or less.
C30B 7/10 - Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
The present invention achieves an antenna module and a sub-module capable of suppressing deterioration in the quality of an RF signal in a configuration in which a plurality of sub-modules are disposed on a main substrate. This antenna module (100) comprises: a plurality of sub-modules (200) in which a plurality of antenna elements are two-dimensionally arranged side by side in a first direction Dx and a second direction Dy intersecting the first direction Dx; a main substrate (140) in which the plurality of sub-modules (200) are two-dimensionally arranged side by side in the first direction Dx and the second direction Dy, respectively; and a first terminal (141A) and a second terminal (141B) that electrically connect the sub-modules (200) and the main substrate (140). The first terminal (141A) is provided in one of four regions obtained by dividing the sub-module (200) into two in each of the first direction Dx and the second direction Dy. The second terminal (141B) is provided, among the four regions, in a region different from the region in which the first terminal (141A) is provided.
H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
The present invention improves charge/discharge characteristics. This secondary battery is provided with a positive electrode, a negative electrode, and an electrolyte solution. The positive electrode comprises: a positive electrode current collector containing aluminum; and a positive electrode active material layer provided to the positive electrode current collector. The positive electrode active material layer contains a lithium-containing compound. The electrolyte solution contains an electrolyte, a solvent, and an additive. The electrolyte includes a bis(fluorosulfonyl)imide salt. The surface of the positive electrode current collector contains sulfur. The additive includes at least one of lithium fluorophosphate, a sulfinyl compound, and a dinitrile compound. A photoelectron spectrum of the surface of the positive electrode current collector obtained by XPS has a first signal that has a peak in the range of 164.1 eV to 164.5 eV inclusive, and a second signal that has a peak in the range of 168.9 eV to 169.3 eV inclusive. The ratio of the sum of the signal intensity of the first signal and the signal intensity of the second signal to the sum of the signal intensities of the S2p spectrum is 0.97 or less.
H01M 10/0567 - Liquid materials characterised by the additives
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
The present invention improves charge/discharge characteristics. This secondary battery comprises a positive electrode, a negative electrode, and an electrolyte solution. The positive electrode comprises: a positive electrode current collector containing aluminum; and a positive electrode active material layer provided on the positive electrode current collector. The positive electrode active material layer contains a lithium-containing compound, lithium carbonate, and lithium hydroxide. The electrolyte solution includes an electrolyte and a solvent. The electrolyte contains a bis(fluorosulfonyl)imide salt. The solvent contains at least one compound selected from a first group consisting of ethylene carbonate, propylene carbonate, fluoroethylene carbonate, dimethyl carbonate, and γ-butyrolactone. The intrinsic molar ratio of the solvent to lithium ions, calculated from the vibrational spectrum of the electrolyte solution, is greater than 0 and not greater than 1.76.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 10/0568 - Liquid materials characterised by the solutes
H01M 10/0569 - Liquid materials characterised by the solvents
This front-end module comprises a first substrate that has a first amplifier which amplifies a transmission signal of a first radio frequency band, a switch component that includes a switch circuit and that is mounted to the first substrate, and a filter circuit. The switch circuit includes: a first switch element having a first end that is connected to a first power source supply terminal, and a second end that is connected to the ground via the filter circuit and that is connected to the first amplifier; and a second switch element having a first end that is connected to a second power source supply terminal, and a second end that is connected to the second end of the first switch element.
This sensor module comprises: a sensor that outputs a first signal; a filter that is connected at a subsequent stage of the sensor, and that attenuates a frequency component of the first signal of a cutoff frequency or greater, said cutoff frequency being higher than a fundamental frequency of the first signal; and a condition evaluation circuit that is connected at a subsequent stage of the filter and into which a second signal, which is the first signal after the frequency component has been attenuated by the filter, is input. The condition evaluation circuit evaluates whether the second signal satisfies a prescribed condition, and outputs a digital signal based on the evaluation result. The digital signal includes a pulse which cyclically repeats a high and a low in a period in which the second signal satisfies the prescribed condition, and the digital signal is fixed at the low in a period in which the second signal does not satisfy the prescribed condition. The repetition frequency of the pulse is the cutoff frequency or greater.
Provided are a camera module capable of suppressing vibration of wiring for applying a drive signal to a vibration source of a vibration mechanism, a vehicle-mounted system, and a mobile object. A camera module 300 according to the present invention comprises: a first housing 23 in which an accommodation space for accommodating a lens barrel 22 is formed; a vibration mechanism comprising a vibration source which is provided in the first housing 23 and performs ultrasonic vibration, and a vibrator 62 which is connected to the vibration source and a first lens 31 and transmits the ultrasonic vibration of the vibration source to the first lens 31; and a second housing 24 which is joined to the image side of the first housing 23 and accommodates a drive circuit board for applying a drive signal to the vibration source. The drive circuit board and the vibration source are electrically connected by wiring 306. A portion of the wiring 306 is fixed inside the first housing 23.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 15/00 - Special procedures for taking photographsApparatus therefor
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
An electronic component module (101) comprise:s a substrate (1) that has a first surface (1a); a first electronic component (3a) that is mounted on the first surface (1a); a first sealing resin layer (6a) that seals the first surface (1a) and the first electronic component (3a); and a first plate (5) that covers the surface of the first sealing resin layer (6a) on the side away from the first surface (1a). The linear expansion coefficient of the substrate (1) is greater than the linear expansion coefficient of the first plate (5), and when the combination of the first sealing resin layer (6a) and the first electronic component (3a) is a first composite layer (41), the linear expansion coefficient of the first composite layer (41) is greater than the linear expansion coefficient of the substrate (1).
244 crystal. When subjected to measurement at 6 GHz by a perturbation method, the low-temperature fired ceramic substrate 1 demonstrates a relative dielectric constant of 3.8 or less and a Q value of 1500 or more.
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C04B 35/16 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay
Provided are a camera module, a vehicle-mounted system, and a mobile object capable of reducing the number of components and improving assembly accuracy. In a camera module (300) according to the present invention, a first housing (23) comprises: an external vibration body (23A) that is coupled to an internal vibration body (62) and receives the vibration of the internal vibration body (62); and a tubular damping weight (95) that forms a part of a housing space for accommodating a lens barrel (22) and prevents the vibration of the external vibration body (23A) from being transmitted to a second housing (24) side. In this configuration, the weight (95), the second housing (24), and the lens barrel (22) are integrally formed.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 15/00 - Special procedures for taking photographsApparatus therefor
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
30.
MULTILAYER SHEET, MULTILAYER SUBSTRATE, ELECTRONIC APPARATUS, SOUNDBOARD, AND MUSICAL INSTRUMENT
In this multilayer sheet including a liquid crystal polymer sheet, mechanical strength is improved and desired physical characteristics are achieved. A multilayer sheet (11) includes a first liquid crystal polymer sheet (12a), a second liquid crystal polymer sheet (13a), and a third liquid crystal polymer sheet (12b). The second liquid crystal polymer sheet (13a) includes a liquid crystal polymer as a material and is aligned in a first direction (D11) orthogonal to the thickness direction of the multilayer sheet (11). Each of the first liquid crystal polymer sheet (12a) and the third liquid crystal polymer sheet (12b) includes a liquid crystal polymer as a material, and has a degree of alignment lower than that of the second liquid crystal polymer sheet (13a). In the thickness direction of the multilayer sheet (11), the second liquid crystal polymer sheet (13a) is sandwiched between and in contact with the first liquid crystal polymer sheet (12a) and the third liquid crystal polymer sheet (12b).
B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is a multilayer ceramic capacitor that can improve deflection resistance. A multilayer ceramic capacitor 1 comprises: a laminate 10 which has a plurality of laminated dielectric layers 20 and a plurality of internal electrode layers 30 disposed above the dielectric layers 20, the laminate including a first main surface TS1 and a second main surface TS2 facing each other in the height direction T, a first lateral surface WS1 and a second lateral surface WS2 facing each other in the width direction W orthogonal to the height direction T, and a first end surface LS1 and a second end surface LS2 facing each other in the length direction L orthogonal to the height direction T and the width direction W; and a pair of external electrodes 40 disposed spaced apart at the ends of the laminate 10 in the length direction L. Each of the external electrodes 40 includes: a base electrode layer 50 containing a metal component; a conductive resin layer 60 disposed above the base electrode layer 50 and containing filler powder and a resin component; and a plating layer 70 disposed above the conductive resin layer 60. An interstice CP is provided inside the conductive resin layer 60 or in contact with the conductive resin layer 60.
Provided is an optical lens offering less defocus. This optical lens (first optical lens 1A, second optical lens 1B) is used in a laser processing apparatus 10, and has a thermal conductivity of 4 [W/(m·k)] or higher and a Mohs hardness of 5-7.5.
G02B 1/02 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of crystals, e.g. rock-salt, semiconductors
B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
H01S 3/00 - Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
The present invention facilitates improvement of electrical characteristics of an inductor. One aspect according to the present invention is an inductor comprising: an element body including a core and a coil embedded in the core; and an external terminal provided on the surface of the element body. The coil includes a winding part in which a conducting wire is alpha-wound, and a lead-out part led out from the winding part and connected to the external terminal. The core includes a columnar part inside the winding part. The center of the columnar part is at a position offset from the center of the element body as viewed along a winding axis of the winding part.
A high-frequency module (1) comprises: a power amplification circuit (10); a filter (31) that includes the transmission band of a band A in a passband; a filter (35) that includes a band B in a passband; a filter (34) that includes the reception band of a band C in a passband; and semiconductor components (41 and 43). The semiconductor component (41) includes: a switch (301) that is connected to the filter (31) and to the power amplification circuit (10); a switch (303) that is connected to the filter (35) and to the power amplification circuit (10); and a switch (304) that is connected to the filter (35). The semiconductor component (43) includes: switches (207 and 205) arranged in series on a path connecting a low-noise amplifier (22) and the switch (304); and a switch (203) arranged in series on a path connecting the low-noise amplifier (22) and the filter (34). The total number of the switches (207 and 205) that are stacked is larger than the total number of the switches (203) that are stacked.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
This connector is provided with a female connector including a resin body and a signal terminal supported on the resin body. The resin body includes a frame part having a rectangular shape extending in the long-side direction and the short-side direction, and an island part extending in the long-side direction in the frame part and connected to the frame part. A reinforcing metal fitting is incorporated into an end portion of the island part in the long-side direction. The reinforcing metal fitting includes an upper surface part covering an upper surface of the island part, side surface parts on both sides covering side surfaces of the island part on both sides in the short-side direction, and an end surface part covering an end surface of the island part in the long-side direction. Each of the side surface parts on both sides includes a folded part folded back from a lower end portion of the side surface part to an inner side of the side surface part in the short-side direction.
A high-frequency module (1) comprises a module board (90), a power amplification circuit (10), a low-noise amplification circuit (20), a filter (31) having a passband including the transmission band of a band A, a filter (32) having a passband including a band B (TDD band), and semiconductor components (41 and 42), wherein: the semiconductor component (41) includes a switch (501) connected between the power amplification circuit (10) and the filter (31); and the semiconductor component (42) includes a switch (502) connected between the filter (31) and an antenna connection terminal (101), a switch (503) connected between the filter (32) and an antenna connection terminal (102), a switch (504) connected between the filter (32) and the power amplification circuit (10), and a switch (505) connected between the filter (32) and the low-noise amplification circuit (20).
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
H03H 9/54 - Filters comprising resonators of piezoelectric or electrostrictive material
A high-frequency module (1) is provided with: a filter (31) having a passband including the transmission band of a band A; a filter (32) having a passband including a band B (TDD band); a filter (33) having a passband including the reception band of a band (C); and semiconductor components (41, 42). The semiconductor component (41) includes: a switch (501) connected between the filter (31) and a power amplifier circuit (10); and a switch (502) connected between the filter (32) and the power amplifier circuit (10). The semiconductor component (42) includes: a switch (503) connected between the filter (31) and an antenna connection terminal (101); a switch (504) connected between the filter (32) and an antenna connection terminal (102); a switch (505) connected between the filter (33) and the antenna connection terminal (102); and a switch (506) connected between the filter (32) and a low-noise amplifier circuit (20).
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
This wireless controller comprises: an operation assembly that outputs operation information; and a holder that holds the operation assembly in a movable manner. The operation assembly includes: a first operation unit operated by a user; a first sensor that detects that the first operation unit is operated using electromagnetic waves as a power source; an IC chip having a memory that stores a detection result of the first sensor and first identification information for identifying the first operation unit; and an antenna that outputs the detection result of the first sensor and the first identification information stored in the IC chip via wireless communication.
G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
A63F 13/22 - Setup operations, e.g. calibration, key configuration or button assignment
A63F 13/24 - Constructional details thereof, e.g. game controllers with detachable joystick handles
A63F 13/92 - Video game devices specially adapted to be hand-held while playing
A63F 13/235 - Input arrangements for video game devices for interfacing with the game device, e.g. specific interfaces between game controller and console using a wireless connection, e.g. infrared or piconet
This connector set comprises a first connector mounted on a first substrate, and a second connector fitted to the first connector. A first ground terminal of the first connector is provided with: a cylindrical outer wall that rises and extends from the first substrate; at least one cylindrical inner wall that faces the outer wall and rises and extends from the first substrate; a first mounting part that is disposed at an end section of the outer wall facing the first substrate and is physically and electrically connected to a ground electrode of the first substrate; and a second mounting part that is disposed at an end section of the at least one inner wall facing the first substrate and is physically and electrically connected to the ground electrode of the first substrate. In the fitted state, the inner wall is in contact with a second ground terminal of the second connector. The length of a current path from a contact point between the inner wall and the second ground terminal to the second mounting part is less than the length of a current path from said contact point to the first mounting part.
This connector set comprises a first connector and a second connector. The first connector comprises: a first signal terminal; a support member that supports the first signal terminal; a first ground terminal that is electrically conductive, surrounds the first signal terminal and the support member, and is electrically connected to a ground potential; and a floating terminal that is electrically conductive, covers a part of the support member, is disposed away from the first ground terminal, and is electrically insulated from the first ground terminal. The second connector comprises: a second signal terminal that is electrically connected to the first signal terminal; and a second ground terminal that is electrically conductive, surrounds the second signal terminal, is electrically connected to the ground potential, is in contact with the first ground terminal in a fitted state, and is disposed spaced apart from the floating terminal. The floating terminal and the second ground terminal are disposed facing and close to each other in the fitted state.
This electronic device comprises: a housing; a contact portion that is positioned at a bottom portion of the housing and comes into contact with an object to be contacted; a sensor portion that is provided in the contact portion and includes a first piezoelectric body and a second piezoelectric body; and a determination portion. In a bottom view, the first piezoelectric body and the second piezoelectric body are disposed so as not to overlap each other. The sensor portion outputs a first output signal that changes according to deformation of the first piezoelectric body, and a second output signal that changes according to deformation of the second piezoelectric body. The determination portion determines, on the basis of the first output signal and the second output signal, whether or not the contact portion is in contact with the object to be contacted at an appropriate angle.
ONONGDDSSDSS, thus enhancing device reliability. Hybrid MOSFETs are particularly useful in cascode applications such as for envelope tracking and average power tracking.
The present invention enables, in an inductor having a coil embedded in an element body, use of a larger size coil by suppressing deformation and positional variation of the coil during pressure molding of the element body. A method for manufacturing an inductor having an element body containing magnetic particles and a resin, and a coil embedded inside the element body, the method includes: a preliminary molded body production step of producing a first preliminary molded body having a plate-like portion and a columnar portion protruding from the plate-like portion, and a bottomed cylindrical second preliminary molded body having a recess, each containing magnetic particles and a resin; a coil assembly step of winding a conductive wire around the columnar portion of the first preliminary molded body to form the coil, and arranging both end portions of the conductive wire on a side surface of the plate-like portion; and a pressure-molding step of pressure-molding the entirety of the first preliminary molded body and the second preliminary molded body in a molding die, in a state where the columnar portion of the first preliminary molded body is inserted together with the coil into the recess of the second preliminary molded body.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A power storage system according to an embodiment of the present disclosure comprises: a plurality of battery packs each having a storage battery; a charging circuit capable of selectively performing a charging operation with respect to one of the plurality of battery packs; and a charging control circuit capable of acquiring data on a charging current in each of the plurality of battery packs, sequentially selecting the battery pack having the largest charging current as a charging target from among the plurality of battery packs, and controlling the operation of the charging circuit so as to perform the charging operation on the selected battery pack.
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
H02J 7/10 - Regulation of the charging current or voltage using discharge tubes or semiconductor devices using semiconductor devices only
45.
POWER CONVERSION DEVICE AND PROGRAM FOR POWER CONVERSION DEVICE
A control unit (100) can switch a plurality of bidirectional switches of a power conversion circuit (30) on and off. When stopping the conversion of three-phase alternating-current power by the power conversion circuit (30), the control unit (100) controls any of the plurality of bidirectional switches of the power conversion circuit (30) to an ON state so as to form a closed circuit that goes from a first end of a primary-side winding (41A) of a transformer (41) to a second end of the primary-side winding (41A) via any of the plurality of bidirectional switches. Then the control unit (100) controls all of the plurality of bidirectional switches of the power conversion circuit (30) to an OFF state.
H02M 7/12 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
H02M 5/293 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A high-frequency module (1) comprises: a power amplification circuit (10); a filter (31) having a passband that includes a transmission band of a band A; a filter (35) having a passband that includes a band B; a filter (34) having a passband that includes a reception band of a band C; inductors (51 and 52); and semiconductor components (41 and 43). The semiconductor component (41) includes a switch (301) that is connected to the filter (31) and the power amplification circuit (10), a switch (303) that is connected to the filter (35) and the power amplification circuit (10), and a switch (304) that is connected to the filter (35) and one end of the inductor (52). The semiconductor component (43) includes a low noise amplifier (22) and a switch (206) that is connected between the one end of the inductor (52) and the ground. One end of the inductor (51) is connected to the filter (34), and the other ends of the inductors (51 and 52) are connected to an input end of the low noise amplifier (22).
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A wiring board (11) has a first surface and a second surface. A plate-shaped conductor (14) is provided at a predetermined distance from the first surface of the wiring board (11) and has a rectangular shape. A power feed line (13) is capacitively coupled to a first edge of the periphery of the plate-shaped conductor (14) and supplies power to the plate-shaped conductor (14) by capacitive coupling (C0). A connecting conductor (15) mechanically and electrically connects the plate-shaped conductor (14) to the wiring board (11) at a second edge of the periphery of the plate-shaped conductor (14). A plurality of pin conductors (16) can mechanically connect the wiring board (11) to a wiring board (21) that is provided at a prescribed distance from the second surface of the wiring board (11). The plurality of pin conductors (16) are arranged at predetermined intervals from each other along the position where the connecting conductor (15) and the wiring substrate (11) are connected to each other. The plurality of pin conductors (16) electrically connect the connecting conductor (15) to a ground conductor (22) provided on the wiring board (21).
This connector includes: an insulating body portion provided with a bottom portion comprising a front surface and a rear surface, a side wall portion provided on the front surface of the bottom portion so as to surround the bottom portion and forming a recessed portion on an inner side thereof, and a support portion provided on the front surface of the bottom portion while being spaced apart from the side wall portion; an external terminal provided on the side wall portion of the body portion; and an internal terminal provided on the support portion of the body portion. The support portion comprises a cavity with an open bottom surface. The present invention is also a connector set including the connector.
A wafer level package (1) comprises: a lower substrate (22); an upper substrate (23) facing the lower substrate (22); a plurality of elements (20) arranged in an array, the plurality of elements (20) being formed on at least one of the lower substrate (22) and the upper substrate (23), or being mounted between the lower substrate (22) and the upper substrate (23); a first eutectic material f formed on the surface of the lower substrate (22) facing the upper substrate (23); a second eutectic material f' formed on the surface of the upper substrate (23) facing the lower substrate (22); a plurality of frame bodies (24) surrounding the plurality of elements (20) respectively; and connection parts (26) that connect parts of the frame bodies (24) respectively surrounding adjacent elements (20) from among the plurality of elements (20). The frame bodies (24) and the connection parts (26) are formed by eutectically bonding the first eutectic material f and the second eutectic material f'. The eutectic material ratio between the first eutectic material f and the second eutectic material f' is different between at least the frame bodies (24) and a part of the connection parts (26).
A biological information detection device (10) for detecting biological information comprises: a plurality of piezoelectric sensors (30) that measure a load from a living body and detect a plurality of pieces of vibration information generated by the living body; a seat cushion (20) that comes into contact with the living body and pressure receiving portions (30a) of the plurality of piezoelectric sensors (30); a seat frame (21) that slidably supports the seat cushion (20); and a signal processing unit (40) that separates a predetermined vibration signal from the plurality of pieces of vibration information. The plurality of pieces of vibration information include a biological signal and a body movement signal of the living body. The seat cushion (20) is elastic and/or viscous. The plurality of piezoelectric sensors (30) include: a direct measurement sensor (30A) that is installed directly below a load input region to which the load is inputted, and that has a main detection direction coinciding with the direction of the load; and an indirect measurement sensor (30B) that detects, among the body movement signals, a second body movement signal having a phase delayed relative to a first body movement signal detected by the direct measurement sensor (30A), by the load from the living body being transmitted via the seat cushion (20).
Provided is a stretchable device comprising: a base material; a stretchable wiring provided on the base material; and a component surrounded by the base material inside the base material and having properties different from the base material.
An inductive component includes a first edgewise coil formed of a first wire having a first thickness and a first number of turns, a second edgewise coil formed of a second wire having a second thickness and a second number of turns, and a core material disposed about the first edgewise coil and the second edgewise coil. The first thickness may be different from the second thickness, or the first number of turns may be different from the second number of turns. The inductive component may include a third edgewise coil.
A multilayer ceramic capacitor 100 comprises: a multilayer structure110 that includes a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 layered in the lamination direction T, and has a first main surface 111 and a second main surface 112 facing each other in the lamination direction T, a first lateral surface 113 and a second lateral surface 114 facing each other in the width direction W orthogonal to the lamination direction T, and a first end surface 115 and a second end surface 116 facing each other in the length direction L orthogonal to the lamination direction T and the width direction W; a first external electrode 120 that is provided on the first end surface 115 of the multilayer structure110; and a second external electrode 130 that is provided on the second end surface 116 of the multilayer structure110. The multilayer structure110 is demarcated into: an internal layer part IP in which internal electrode layers 150 that are exposed on different end surfaces of the multilayer structure110 are opposite to each other in the lamination direction T with the dielectric layers 140 therebetween; a pair of end margin portions EM which are respectively positioned on the first end surface 115 side and the second end surface 116 side of the internal layer part IP in the length direction L, and in which internal electrode layers 150 that are exposed on the same end surface of the multilayer structure110 are opposite to each other in the lamination direction T without having therebetween the internal electrode layers 150 that are exposed on the different end surface of the multilayer structure110; a pair of side margin portions SM which are respectively positioned on the first lateral surface 113 side and the second lateral surface 114 side of a portion including the internal layer part IP and the end margin portions EM in the width direction W, and are provided in a manner covering the end portions of the internal electrode layers 15
A method for manufacturing a multilayer ceramic capacitor 100 includes: a step for forming, on each of main surfaces of ceramic green sheets 211 obtained by using a first ceramic paste, internal electrode patterns 212 obtained by using a conductive paste and a ceramic paste layer 213 obtained by using a second ceramic paste; a step for producing an unfired layered body by layering the ceramic green sheets 211, each of which has formed thereon the internal electrode patterns 212 and the ceramic paste layer 213; a step for firing said unfired layered body; and a step for forming an external electrode on the outer surface of the fired layered body. The first ceramic paste and the second ceramic paste do not contain boron (B), lithium (Li), or zinc (Zn) which are volatile substances. The respective contents of silicon (Si) and magnesium (Mg) based on titanium (Ti) in the second ceramic paste are greater than the respective contents of Si and Mg based on Ti in the first ceramic paste.
This method for manufacturing a multilayer ceramic capacitor 100 comprises: a step for forming an internal electrode pattern 212 using a conductive paste and a ceramic paste layer 213 using a second ceramic paste on a main surface of a ceramic green sheet 211 using a first ceramic paste; a step for laminating the ceramic green sheet 211 on which the internal electrode pattern 212 and the ceramic paste layer 213 are formed to produce an unfired laminate; a step for firing the unfired laminate; and a step for forming an external electrode on an outer surface of the laminate after firing. Neither the first ceramic paste nor the second ceramic paste contains the volatile components boron (B), lithium (Li) and zinc (Zn). The silicon (Si) content and the manganese (Mn) content, using titanium (Ti) as a basis, in the second ceramic paste are higher than the Si content and the Mn content, using Ti as a basis, in the first ceramic paste.
Provided is a high-frequency module capable of reducing deterioration in inductor characteristics and improving heat dissipation of an inductor. A high-frequency module (1) is provided with a mounting substrate (2), an inductor (3), a conductor (4), and a wiring conductor (5). The inductor (3) is built into the mounting substrate (2). The conductor (4) overlaps the inductor (3) in a plan view in the thickness direction (D1) of the mounting substrate (2). The conductor (4) has an open circuit. The wiring conductor (5) is connected to the conductor (4).
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
57.
VARIABLE CAPACITANCE ELEMENT AND DESIGN METHOD THEREOF
Provided are a variable capacitance element in which the capacitance variation rate can be easily increased and the withstand voltage can be easily increased, and a method for designing such a variable capacitance element. The variable capacitance element (1) includes a conductive film (10), a dielectric layer (20), and a semiconductor layer (30), wherein the semiconductor layer (30) is formed of an oxide semiconductor.
Provided is a multilayer ceramic capacitor having high moisture-resistant reliability while achieving miniaturization and increased capacity. A multilayer ceramic capacitor (1) comprises: a multilayer body (10) that includes an inner layer part (100) in which internal electrode layers (30) and internal dielectric layers (20i) are layered, and that has two main surfaces (TS1, TS2) facing each other in the lamination direction (T), two lateral surfaces (WS1, WS2) facing each other in the width direction intersecting the lamination direction (T), and two end surfaces facing each other in the length direction intersecting the lamination direction (T) and the width direction (W); and external electrodes (40) that are respectively disposed on the two end surfaces and are connected to internal electrode layers. In side margin parts (WG) positioned on both sides of the inner layer part (100) in the width direction (W), the content of elemental rare earth in an outer region (WGo) is lower than the content of elemental rare earth in an inner region (WGi).
A multilayer ceramic capacitor 100 comprises: a laminate 110 which includes a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 laminated in a lamination direction T, and has a first main surface 111 and a second main surface 112 facing each other in the lamination direction T, a first side surface 113 and a second side surface 114 facing each other in a width direction W orthogonal to the lamination direction T, and a first end face 115 and a second end face 116 facing each other in a length direction L orthogonal to the lamination direction T and the width direction W; a first external electrode 120 provided on the first end face 115 of the laminate 110; and a second external electrode 130 provided on the second end face 116 of the laminate 110. The laminate 110 comprises: an inner layer portion IP in which the internal electrode layers 150, which are exposed on the different end surfaces of the laminate 110, face each other in the lamination direction T via the dielectric layers 140; a pair of end margin portions EM which are respectively located on the first end surface 115 side and the second end surface 116 side of the inner layer portion IP in the length direction L, and in which internal electrode layers 150 exposed at the same end face of the laminate 110 face each other in the lamination direction T without intervening the internal electrode layers 150 exposed at a different end face of the laminate 110; a pair of side margin portions SM which are respectively located on the first side surface 113 side and the second side surface 114 side of a portion including the inner layer portion IP and the end margin portions EM in the width direction W, and which are provided so as to cover the end portions of the internal electrode layer 150 in the width direction W; and a pair of outer layer portions XP which are respectively located on the first main surface 111 side and the second main surface 112 side of a portion including the
Provided is a two-terminal multilayer ceramic capacitor in which crack formation can be suppressed. An internal electrode has a first internal electrode that is connected to a first external electrode 3A and is not connected to a second external electrode 3B, and a second internal electrode that is connected to the second external electrode 3B and is not connected to the first external electrode 3A. The first external electrode 3A has: a first base electrode layer 31A of the first external electrode disposed on a first surface F1; a second base electrode layer 32A of the first external electrode disposed on the first surface F1; a first resin electrode layer 34A disposed over the first base electrode layer 31A of the first external electrode, the first surface F1, and the second base electrode layer 32A of the first external electrode; and a first plating layer 36A disposed on the first resin electrode layer 34A. The first surface F1 has a first region 21, which is the region between the region where the first base electrode layer 31A of the first external electrode is disposed and the region where the second base electrode layer 32A of the first external electrode is disposed, and which is the region where the first resin electrode layer 34A is disposed. The first region 21 overlaps, in a lamination direction T, the central part in a second direction W of a multilayer body 2.
Provided is a multilayer ceramic electronic component capable of ensuring mechanical strength of the multilayer ceramic electronic component while ensuring adhesion to mold resin. A multilayer ceramic electronic component 10 according to the present invention comprises: a multilayer body 12 that includes a plurality of laminated ceramic layers 14 and a plurality of internal electrode layers 16 laminated on the ceramic layers 14, and has a first main surface 12a and a second main surface 12b opposing each other in a lamination direction, a first surface 12c and a second surface 12d opposing each other in a first direction orthogonal to the lamination direction, and a third surface 12e and a fourth surface 12f opposing each other in a second direction orthogonal to the lamination direction and the first direction; and at least four external electrodes 30 that are disposed so as to cover the multilayer body 12 and are connected to the internal electrode layers 16. The first surface 12c to the fourth surface 12f have uncovered regions 40 that are not covered with the external electrodes 30, and the surface roughness of the uncovered regions 40 is higher than the surface roughness of the first main surface 12a.
This pressure sensor comprises, in the following order along a first direction, an electrode layer, a membrane layer, and a cover layer that are insulated from one another and that are each conductive. The pressure sensor comprises a conductive first pad provided on the surface of the membrane layer facing the cover layer, a conductive second pad provided on the surface of the electrode layer facing the membrane layer, and a resin package that covers at least the first pad and the second pad. The cover layer includes a main section that does not overlap the first pad or the second pad when viewed along the first direction, and at least one wall section extending from the main section to a position between the first pad and the second pad. In the first direction, at least a part of the wall section is located at a position higher than the first pad and the second pad, with the electrode layer as a reference.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
The present invention provides a multilayer ceramic capacitor in which ESR is reduced and adhesion strength between an external electrode and a laminate and denseness of the external electrode itself are improved. A multilayer ceramic capacitor 10 according to the present invention is provided with: a laminate 12 which comprises a plurality of ceramic layers 14 and a plurality of internal electrode layers 16 laminated in a lamination direction; and an external electrode 30 which is formed on an end surface of the laminate 12. The plurality of internal electrode layers 16 are mainly composed of copper (Cu). The external electrode 30 has a base electrode layer 32 that contains an insulating oxide and a conductive metal which has copper (Cu) as a main component. When a cross section of the base electrode layer 32 along the thickness direction is viewed, there is a domain of the insulating oxide that is not in contact with any of a surface in the cross section and the laminate 12 and is surrounded by copper (Cu), the size of the domain of the insulating oxide is 1.5 µm or less, and the content ratio of the insulating oxide in the base electrode layer 32 is 3% to 20% inclusive.
Provided is an external electrode paste for forming an external electrode of a multi-layer ceramic capacitor which reduces ESR and can improve the fixing strength between the external electrode and a laminate and the compactness of the external electrode itself. The external electrode paste according to the present invention is used for forming an external electrode of a multi-layer ceramic capacitor and contains copper (Cu) powder, glass powder, a resin, and a solvent. The volume ratio of the glass powder to the total volume of the copper (Cu) powder and the glass powder is 3 to 20 vol%. The particle diameter of the copper (Cu) powder is 500 nm or less. The particle diameter of the glass powder is 300 nm or less. The particle diameter of the copper (Cu) powder is greater than or equal to the particle diameter of the glass powder.
This high-frequency device (1) comprises a chip component (10) mounted on a first surface (31) of a substrate (30). The chip component (10) has: a first facing surface (11) that faces the first surface (31); and a conductor part (15). The conductor part (15) includes a functional electrode (16) and/or an interconnection electrode (17). The substrate (30) has: a signal electrode (33); a reference potential electrode (35); and an inductor (40) including a plurality of conductor patterns (p). The signal electrode (33) is in electrical continuity with the conductor part (15) of the chip component (10). The inductor (40) includes a first conductor pattern (p1) nearest the first surface (31) and a second conductor pattern (p2) nearest a second surface (32). The second conductor pattern (p2) is connected to the signal electrode (33) without going through any other conductor pattern except itself, and the first conductor pattern (p1) is connected to the reference potential electrode (35) without going through any other conductor pattern except itself.
The present invention provides a multilayer ceramic capacitor (1) which exhibits excellent solder wetting during mounting and which causes few soldering failures. This multilayer ceramic capacitor (1) comprises: a multilayer body (2) including a dielectric layer (20), a first internal electrode layer (31), and a second internal electrode layer (32); a first external electrode (41); and a second external electrode (42). The first external electrode (41) and the second external electrode (42) each have a Ni plating layer (63), and an Sn plating layer (66) positioned on the Ni plating layer (63). The number of Sn deposition particles 300 exposed from the surface of the Sn plating layer (66) is 1-10 inclusive, in a range of 30 μm within the surface.
Provided is a stretchable substrate having improved mounting strength while solder wettability is further improved. Stretchable substrates 1A-1E according to the present disclosure each have a solder layer SD disposed on a base material 10. Each of the stretchable substrates comprises: a conductive layer 20 that is positioned on one main surface side of the base material 10; and a first layer 30 that contains a first metal and is in contact with the conductive layer 20. In a cross-sectional view of the conductive layer SD, the first layer 30, and the solder layer SD, a second layer 40 that contains the first metal and a solder is disposed at least partially between the first layer 30 and the conductive layer 20 in the thickness direction. The content density of the first metal in the second layer 40 is lower than the content density of the first metal in the first layer 30. The first layer 30 has protrusions PT in which the surface protrudes in the thickness direction due to the second layer 40.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
This relay device is capable of communicating with a penlight within a first communication range that is set in advance. The relay device is capable of communicating with a server in a second communication range that is broader than the first communication range. The relay device acquires user account information from the penlight (S111), for the user to use a social media site. The relay device generates administrator posting content, which is post content of an administrator, determined in advance, on the basis of regulation information associated with the relay device in advance (S122). The relay device transmits administrator account information for the administrator to use the social media site, the administrator posting content, and the user account information, to the server, and thereby posts the administrator posting content to the user associated with the user account information in the social media site, with the administrator account associated with the administrator account information (S123, S131).
Provided is a multilayer ceramic capacitor enabling prevention of electric field concentration at the ends of internal electrode layers. A multilayer ceramic capacitor 1 comprises: a laminate 2 including an effective part 6 in which a dielectric layer 4 and an internal electrode layer 5 are laminated, an ineffective part 7 surrounding the effective part 6, two main surfaces facing each other in the lamination direction, two side surfaces facing each other in the width direction, and two end surfaces facing each other in the length direction; and two external electrodes 3 connected to the internal electrode layer 5 and respectively provided on the two end surfaces. The ineffective part 7 includes a stepped absorption layer 8 in a region from each of both ends in the width direction of the internal electrode layer 5 to the side surface. The internal electrode layer 5 includes two width-direction end regions W1 provided in a range of 40 μm respectively from both ends in the width direction of the internal electrode layer 5 toward the center side in the width direction; two width-direction intermediate regions W2 provided in a range of 40 μm respectively from the two width-direction end regions toward the center side in the width direction; and a width-direction center region W3 provided between the two width-direction intermediate regions. When the coverage of the width-direction intermediate region is w2 and the coverage of the width-direction center region is w3, w3 < w2 is satisfied.
A module 1 comprises, in the thickness direction: a sealing body 100 in which a circuit board 110 and electronic components 120 are sealed by a sealing resin 140, and a conductor 130 is exposed at a portion of the surface; and a rewiring layer 200 which is provided on the surface of the sealing body 100, and which has an insulating layer 210 and a rewiring conductor 220 that is connected to the conductor 130. The rewiring conductor 220 includes: a connection conductor 230 that is provided in the interior of the insulating layer 210 and is connected to the conductor 130; and an input/output electrode 240 that is provided in a first region E1 of the surface of the insulating layer 210 on the reverse side thereof from the sealing body 100 and is connected to the connection conductor 230. The connection conductor 230 includes a surface extension part 230a that extends along the surfaces of the conductor 130 and sealing resin 140. A portion 230Fa of the surface of the surface extension part 230a on the reverse side thereof from the sealing body 100 is stacked on the conductor 130, and is located further to the sealing body 100-side than a portion 230Ga stacked on the sealing resin 140 such that a recess 230S is provided in the surface of the surface extension part 230a on the reverse side thereof from the sealing body 100.
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
Provided is a multilayer substrate capable of improving adhesion to a mounting substrate. A multilayer substrate (100) comprises a laminated substrate (1), a signal line (2), and a plurality of external connection electrodes (4). The laminated substrate (1) has a first main surface (14). The signal line (2) is disposed inside the laminated substrate (1). The plurality of external connection electrodes (4) are disposed on the first main surface (14) of the laminated substrate (1). The plurality of external connection electrodes (4) are respectively provided in a plurality of first areas (AR1) that are separated from each other. The laminated substrate (1) is provided with hollow portions (6) respectively in a plurality of second areas (AR2) that are separated from each other. The plurality of first areas (AR1) and the plurality of second areas (AR2) are disposed alternately in the extending direction of the signal line (2).
Provided is a multilayer ceramic capacitor capable of balancing capacitance density with dielectric breakdown voltage. A multilayer ceramic capacitor (1) comprises: a laminate (2) having configured therein an effective layer part (26) in which a plurality of internal electrode layers (30) face each other in the lamination direction (T) with a dielectric layer (20) therebetween; a first external electrode (41); and a second external electrode (42). Segregation layers (200), in which a material having a relative permittivity lower than that of a dielectric material included in the dielectric layer (20) is segregated, are disposed in internal electrode layer end portions (270) included in the effective layer part (26).
A ceramic electronic component (101) comprises a laminate (1) that is formed by laminating a plurality of ceramic layers and has a bottom surface (3) and a plurality of lateral surfaces. A GND terminal (16) and an IO terminal (17) are disposed on the bottom surface. Eighty percent or more of the total area of the plurality of lateral surfaces is covered by a shield film (8) electrically connected to the GND terminal (16). The bottom surface (3) includes a flat plane. The GND terminal (16) is disposed to reach the outer periphery of the flat plane. The IO terminal (17) is disposed separately from the outer periphery of the flat plane.
A three-dimensional integrated circuit includes a first CMOS wafer, a second CMOS wafer disposed on and electrically connected to the first CMOS wafer, one or more thick metal layers including an inductive device disposed on the second CMOS wafer opposite the first CMOS wafer, and a grounded shield positioned to isolate the inductive device from the first CMOS wafer and the second CMOS wafer.
Provided is a multilayer ceramic capacitor in which entry of moisture through a partly thinned external electrode is prevented, thereby improving moisture resistance reliability. This multilayer ceramic capacitor comprises: a multilayer body which comprises a plurality of stacked dielectric layers and a plurality of internal electrode layers stacked on the dielectric layers, the multilayer body having a first surface and a second surface that face each other along the stacking direction, a third surface and a fourth surface that face each other along a length direction orthogonal to the stacking direction, and a fifth surface and a sixth surface that face each other along a width direction orthogonal to the stacking direction and the length direction; first internal electrode layers disposed on a plurality of dielectric layers and led out to the third surface; second internal electrode layers disposed on the plurality of dielectric layers and led out to the fourth surface; a first external electrode disposed on the third surface and connected to the first internal electrode layers; and a second external electrode disposed on the fourth surface and connected to the second internal electrode layers. The first external electrode comprises an Si layer, a first base electrode layer, and a first plating layer, and the first external electrode has a hole portion. The hole portion comprises: the Si layer formed so as to cover the third surface located on the bottom side of the hole portion; and the first plating layer formed so as to cover the Si layer.
A substrate (30) is provided with: a base member (31) having a first main surface (31A) for mounting a crystal vibration element (10); a bonding region (50A) formed in a frame shape along the outer peripheral part on the first main surface (31A), the bonding region (50A) being bonded to a bonding part (50) that seals the crystal vibration element (10); a metal film formed on the first main surface (31A); and an insulating film (32) formed in a region including the bonding region (50A), on the first main surface (31A). The metal film includes electrode pads (33a, 33b) that hold the crystal vibration element (10), and lead-out electrodes (34a, 34b) that lead out from the electrode pads (33a, 33b) to external electrodes (35a, 35b) so as to intersect the bonding region (50A). Furthermore, the bonding part (50) is composed of an organic-based adhesive. The insulating film (32) comprises an insulating member having a gas permeability lower than that of the organic-based adhesive of the bonding part (50), and is formed in the bonding region (50A) so as to avoid the surfaces of the lead-out electrodes (34a, 34b).
An amplifying circuit (10) comprises: electric power amplifiers (11 and 12); a combining circuit (14) that is connected to an output end of the electric power amplifier (11) and an output end of the electric power amplifier (12); and a first series circuit that is composed of a first switch and a capacitor (171) that are connected in series to each other. The first series circuit is connected between the ground and a connection node (n1) on a path that connects the output end of the electric power amplifier (12) and the combining circuit (14).
A module 1 comprises the following in the thickness direction: an encapsulated body 100 in which a circuit board 110 and an electronic component 120 are encapsulated by an encapsulating resin 140, with a conductor 130 exposed on a part of the surface; and a redistribution layer 200 provided on the surface of the encapsulated body 100 and having an insulating layer 210 and a redistribution conductor 220 connected to the conductor 130. The redistribution conductor 220 includes a connecting conductor 230 provided inside the insulating layer 210 and connected to the conductor 130, and an input/output electrode 240 provided in a first region E1 on the surface of the insulating layer 210 on the side opposite to the encapsulated body 100 and connected to the connecting conductor 230. The connecting conductor 230 includes an inclined extension part 230c extending in a direction inclined with respect to the thickness direction. When viewed in a cross section along the thickness direction, the cross-sectional shape of the inclined extension part 230c is a stepped shape with a plurality of steps.
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
Provided is an elastic wave device that suppresses an unnecessary wave. The elastic wave device uses a bulk wave in a thickness longitudinal vibration mode, and comprises: a piezoelectric layer containing lithium niobate; an upper electrode provided on the upper side of the piezoelectric layer; a lower electrode provided on the lower side of the piezoelectric layer; and a frequency adjustment film provided on the upper electrode or under the lower electrode. Of the upper electrode and the lower electrode, one electrode provided with the frequency adjustment film has a thickness smaller than the thickness of the other electrode.
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
80.
METHOD AND DEVICE FOR SEALING AND MOLDING COMPRESSION RESIN
This method for sealing and molding a compression resin is intended to seal a component disposed on a first surface of a substrate having the first surface and a second surface on opposite sides from each other while forming a sealing resin layer so that the first surface of the substrate is partially or entirely covered, said method for method for sealing and molding a compression resin comprising: a step (S1) for generating a first internal pressure in a resin material inside a cavity corresponding to the shape of the sealing resin layer; a step (S2), subsequent to step (S1) for generating the first internal pressure, for adjusting the thickness of a product substrate, obtained as a body including the resin material and the substrate, to a desired thickness by controlling the distance between an upper mold and a lower mold using a thickness control member while opening the outlet from the cavity to allow some of the resin material to seep out; and a step (S4), subsequent to the step for adjusting the thickness of the product substrate to the desired thickness, for generating a second internal pressure in the resin material inside the cavity .
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
This antenna device (1) comprises a radiator (10) that includes at least one antenna element (12-1, 12-2), a housing (20) that includes a plate-shaped region composed of a dielectric, and a plurality of strip conductors (21) that are positioned in the plate-shaped region of the housing (20). The antenna elements (12-1, 12-2) have power supply points (F1, F2) at positions shifted in a first direction from the centers of the antenna elements (12-1, 12-2) . Each of the plurality of strip conductors (21) is disposed such that the longitudinal direction of the strip conductor (21) intersects the first direction.
Provided is a multilayer board capable of reducing an impedance mismatch in a multilayer board in which parts of a plurality of signal lines overlap in a plan view. A multilayer board (100) includes, in a plan view from a thickness direction of a laminated board (1), a first region (AR2) in which a first signal line (21) and a second signal line (22) overlap, and a second region (AR1, AR3) in which the first signal line (21) and the second signal line (22) do not overlap. The present invention includes a first insulating layer (12) in which a thickness change portion (through hole 121) is formed in the first region (AR2) or the second region (AR1, AR3). In the first region (AR2), a ground electrode (37) is positioned between the first signal line (21) and the second signal line (22). At least one of the first signal line (21) and the second signal line (22) bends toward the thickness change portion (through hole 121) of the first insulating layer (12) in the thickness direction of the laminated board (1), whereby a position in the thickness direction of the laminated board (1) differs between the first region (AR2) and the second region (AR1, AR3).
Provided is a multilayer ceramic capacitor capable of maintaining high temperature load reliability for a long period of time. A multilayer ceramic capacitor (1) comprises: an inner layer part (100) in which an internal electrode layer (30) and an internal dielectric layer (20i) are laminated; main surface-side dielectric regions (20t); and side surface-side dielectric regions (20w). The ratio Dyi/D50i of the Dy content Dyi to the median grain diameter D50i of dielectric grains in the internal dielectric layer (20i) is greater than the ratio Dyw/D50w of the Dy content Dyw to the median grain diameter D50w of dielectric grains in the side surface-side dielectric regions (20w). The ratio Bai/(Tii + Zri) of the Ba content Bai to the sum of the Ti content Tii and the Zr content Zri in the internal dielectric layer (20i) is greater than the ratio Baw/(Tiw + Zrw) of the Ba content Baw to the sum of the Ti content Tiw and the Zr content Zrw in the side surface-side dielectric regions 20w.
Provided is a multilayer ceramic capacitor having excellent reliability. In the present invention, a dielectric layer 14 contains grains G. A laminate 2 has a first gap region GA1 extending from the end on a second end surface CB side of a first internal electrode 15A to a second external electrode 3B. The region that is the closest to the middle part of the laminate 2 in a lamination direction T among the regions interposed between internal electrodes 15 adjacent to each other and that is within 5 μm or less from the middle of the laminate 2 in a length direction L toward both sides in the length direction L is defined as a middle region A3. A standard deviation σG1 of the equivalent circle diameters of the grains G in the first gap region GA1 is greater than a standard deviation σC of the equivalent circle diameters of the grains G in the middle region A3.
An antenna module (100) is provided with a first substrate (130A) and a second substrate (130B) having a side surface (137) connected to the first substrate (130A). The second substrate (130B) is provided with a radiation element (121B), a ground electrode (GND2), a connection communication electrode (155) and a connection ground electrode (150) disposed on the side surface (137), and power supply wiring (171). The power supply wiring (171) is disposed in the same layer as the radiation element (121B) in the second substrate (130B). The connection ground electrode (150) is disposed so as to surround the connection communication electrode (155) on the side surface (137).
H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
H01Q 1/40 - Radiating elements coated with, or embedded in, protective material
The present disclosure relates to a multilayer ceramic capacitor (100). The multilayer ceramic capacitor (100) according to the present disclosure comprises an internal ceramic layer (130) and an external ceramic layer (160) that contain perovskite-type compounds that are the same as or different from each other. When the concentrations of vanadium with respect to 100 parts by mole of the total amount of titanium, zirconium, and hafnium in the perovskite-type compounds contained in the internal ceramic layer (130) and the external ceramic layer (160) are respectively denoted by CVI and CVO, the relationships CVI>CVO and CVO≤0.10 parts by mole are satisfied. The thickness of the external ceramic layer (160) in the stacking direction is 15–170 μm.
SSSS is a frequency at which the difference between the gain and the loss between the resonance circuit (10), the resonance circuit (20), and the sensor resonance circuit (30) is smaller than the difference between the gain and the loss between the resonance circuit (10) and the resonance circuit (20).
G01R 23/02 - Arrangements for measuring frequency, e.g. pulse repetition rateArrangements for measuring period of current or voltage
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H03H 7/48 - Networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source
The present invention provides a fragrance preparation assistance system (100) that assists a user in fragrance preparation, the fragrance preparation assistance system comprising: a fragrance generation device (30) that stores a plurality of fragrance components (Ca) and generates a fragrance by blending the plurality of fragrance components; and a fragrance preparation device (10) that prepares a fragrance to be generated by the fragrance generation device. The fragrance preparation device receives an input of a natural language obtained by user's verbal expression of a desired fragrance (S201), uses a large-scale language model (13) to generate recipe information for preparing the fragrance based on the natural language (S2052), and causes the fragrance generation device to generate the fragrance on the basis of the recipe information (S2053).
This communication module includes: a substrate; an IC chip including a high-frequency circuit disposed on the substrate; an electrode provided to a surface of the IC chip facing the substrate; a substrate electrode provided at a location on the substrate that overlaps the electrode; a conductive member provided to the substrate electrode and formed of a conductive paste; and a protrusion provided at the substrate conductive-member periphery. An electrode of the IC chip is connected to the substrate electrode via the conductive member.
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
90.
FABRIC, FABRIC PRODUCT, KNITTED FABRIC STRUCTURE, SOCK, ARM COVER, LEGGINGS, AND SHIRT
Provided are a fabric and a fabric product having antibacterial properties, biodegradability, and practical durability while effectively generating lactic acid on the surface thereof. A fabric according to the present disclosure: contains a polylactic acid fiber 1 that has a single fiber fineness of 0.5 dtex or greater, contains 10-80 eq/ton of a functional group derived from a hydrolysis inhibitor that reacts with a carboxyl terminal group of a polylactic acid, and has an optical purity of 98% or greater and a weight-average molecular weight of 70,000 or greater; generates a surface potential of 0.1 V or greater when subjected to an external force; has a lactic acid content of 0.005 µg or greater but less than 1.0 µg per 1 cm2; and is biodegradable.
D04B 1/16 - Other fabrics or articles characterised primarily by the use of particular thread materials synthetic threads
D01F 6/62 - Monocomponent man-made filaments or the like of synthetic polymersManufacture thereof from homopolycondensation products from polyesters
D03D 15/20 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
The present invention provides a multilayer ceramic capacitor having excellent reliability. A multilayer ceramic capacitor 1 is such that a multilayer body 2 has: a first gap region GA1 that is a region from a second end surface CB-side end of a first internal electrode 15A to the second end surface CB; and a second gap region GA2 that is a region from a first end surface CA-side end of a second internal electrode 15B to the first end surface CA. The first gap region GA1 includes a resin R. The second gap region GA2 includes the resin R.
This high-frequency circuit (1) comprises: a high-frequency input terminal (110) and an antenna connection terminal (100); power amplifiers (11 and 12); an orthogonal hybrid circuit (13) including an input terminal (131) connected to the high-frequency input terminal (110), an output terminal (132) connected to an input end of the power amplifier (11), and an output terminal (133) connected to an input end of the power amplifier (12); a synthesis circuit (14) including an input terminal (141) connected to an output end of the power amplifier (11), an input terminal (142) connected to an output end of the power amplifier (12), and an output terminal (143) connected to the antenna connection terminal (100); and a PA control circuit (60) having a first mode for operating the power amplifiers (11 and 12) and a second mode for selectively switching and operating the power amplifiers (11 and 12).
A module 1 comprises: a substrate 15 in which a component mounting land 20 and a resist layer 30 are provided on a surface 16 of the substrate 15; and an electronic component 100 mounted on the component mounting land 20. The module 1 is characterized by, in an electronic component lower space 50 which is a space between a bottom surface 106 of the electronic component 100 and the surface 16 of the substrate 15, having a resist thinnest portion 40 in which the resist layer 30 is not present on the surface 16 of the substrate 15 or a thickness of the resist layer 30 is smaller than a thickness of the resist layer 30 outside the component mounting land 20.
According to the present invention, a transmission/reception unit receives, by means of a plurality of reception antennas, reflected waves of radio waves transmitted from at least one transmission antenna into an observation range, and generates an intermediate frequency signal based on the transmission signal and the reception signal. A processing unit counts the positions of living bodies and the number of the living bodies within the observation range on the basis of the intermediate frequency signal. On the basis of the intermediate frequency signal, the processing unit calculates a complex signal reflecting the presence or absence of an object and the speed of the object for each position within the observation range. Furthermore, on the basis of the complex signal, a living body determination index is calculated for each position within the observation range the living body determination index varying in magnitude depending on whether the detected object is a living body and on the number of the living bodies. The living body determination index is used to identify the positions of the living bodies within the observation range and to count the number of the living bodies.
G01S 13/536 - Discriminating between fixed and moving objects or between objects moving at different speeds using transmission of continuous unmodulated waves, amplitude-, frequency-, or phase-modulated waves
G01S 13/34 - Systems for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated using transmission of continuous, frequency-modulated waves while heterodyning the received signal, or a signal derived therefrom, with a locally-generated signal related to the contemporaneously transmitted signal
Provided is a filter device wherein electric power resistance can be improved. A filter device according to the present invention comprises a plurality of elastic wave resonators (serial arm resonators S2a, S2b) that share a piezoelectric substrate 2 having a support member 3 and a piezoelectric film that is provided on said support member 3 and includes a piezoelectric layer 6, and each have a functional electrode (IDT electrode 7) that is provided on the piezoelectric film. In each of the plurality of elastic wave resonators, a cavity section 2a is provided in the support member 3 in a location that overlaps with the functional electrode in plan view. The support member 3 and the piezoelectric film are positioned such that a section of the support member 3 and a section of the piezoelectric film face each other with the cavity sections 2a interposed therebetween. The plurality of elastic wave resonators include at least one set of parallel-connected resonators, which are at least two elastic wave resonators that are connected in parallel to each other. The cavity sections 2a of the at least one set of parallel-connected resonators are separated from each other in at least one section by a partition wall 2b, which is a section of the support member 3.
A boron nitride particle 1 comprises: a particle-shaped inner layer part 11 having a hollow part 10; and an outer layer part 12 covering the outside of the inner layer part 11. The inner layer part 11 contains boron nitride and has holes 11a communicating from the hollow part 10 to the outside. The outer layer part 12 covers the holes 11a.
An LC filter (1) comprises: a ground electrode (3) and an electrode (2) facing each other with a gap therebetween; a resonator (7) positioned between the ground electrode (3) and the electrode (2); a via conductor (4) connected to the ground electrode (3) and the electrode (2); and a power supply conductor (8) connected to the electrode (2). The resonator (7) includes: an electrode (5) that is disposed apart from the electrode (2) and constitutes a capacitor component together with the electrode (2); and a via conductor (6) that is connected to the electrode (5) and the ground electrode (3) and has an inductor component. The LC filter (1) is supplied with power via the power supply conductor (8).
According to the present invention, a position detection unit transmits radio waves into an observation range, receives reflected waves from an object, and identifies the position of the object in the observation range on the basis of the transmission signal and the reception signal. A calculation unit calculates, for each of positions within the observation range and at fixed time intervals, determination basic information at the present time point that is obtained from the transmission signal and the reception signal, and determination secondary information that is determined from the determination basic information. A living body determination unit determines, on the basis of the determination secondary information calculated by the calculation unit, whether or not the object present at the position where the presence of the object has been determined by the position detection unit is a living body. A change caused by displacement of the surface of the living body due to the respiration or heartbeat of the living body is reflected in a temporal change of the determination basic information. The calculation unit calculates the determination secondary information at the current time point on the basis of the determination basic information at the current time point and the determination secondary information calculated at an immediately preceding time.
G01S 13/536 - Discriminating between fixed and moving objects or between objects moving at different speeds using transmission of continuous unmodulated waves, amplitude-, frequency-, or phase-modulated waves
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
A61B 5/113 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb occurring during breathing
In the present invention, a first switching element, a second switching element, a first rectifying element, and a second rectifying element are each composed of an even number of surface-mounted power semiconductor elements. In a planar direction orthogonal to the lamination direction in a multilayer circuit board, the first switching element and the second switching element are mounted at positions symmetrical to the first rectifying element and the second rectifying element with respect to the configuration position of a dual resonance transformer. The first switching element, the second switching element, the first rectifying element, and the second rectifying element are arranged respectively at upper, lower, left, and right positions on a plane with respect to the configuration position of the dual resonance transformer. The first switching element, the second switching element, the first rectifying element, and the second rectifying element, which are each composed of the even number of power semiconductor elements, are: mounted on the top surface and the bottom surface of the multilayer circuit board; overlapped when viewed in the lamination direction; connected in parallel through via conductors for power semiconductor connection; and thermally coupled in the lamination direction. The ON periods of the first rectifying element and the second rectifying element are set to the ON periods of the first switching element and the second switching element, respectively. The first switching element, the second switching element, the first rectifying element, and the second rectifying element change the occurrence of power loss over time vertically and horizontally with respect to the configuration position of the dual resonance transformer in the planar direction, thereby evenly dispersing the heat generation and uniformizing and integrating the heat distribution.
H02M 3/28 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
patents
