A measurement system includes a first measurement apparatus and a second measurement apparatus. Each apparatus includes a sensor that outputs a measurement signal, a wireless communication circuit that receives a trigger signal, and a synchronous sampling circuit. Each synchronous sampling circuit is configured to sample a both the trigger signal received and the measurement signal in synchronization with each other and output a synchronous trigger signal and a synchronous measurement signal. The wireless communication unit of each apparatus then transmits a signal pair including the synchronous trigger signal and the synchronous measurement signal.
A human body tracking device and a human body tracking method capable of improving the accuracy in tracking of a human body are implemented. The device includes a transmitter/receiver that transmits a radio wave and receives a reflected wave of the transmitted radio wave, and a processor that estimates a location of a human body on the basis of an intermediate frequency (IF) signal output from the transmitter/receiver. The processor is configured to execute a first detection process that detects coordinates of a moving object as first coordinates, a second detection process that detects coordinates of at least the human body in a stationary state as second coordinates, and a tracking process that tracks the human body on the basis of the first coordinates and the second coordinates.
G01S 13/72 - Radar-tracking systemsAnalogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61B 5/05 - Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fieldsMeasuring using microwaves or radio waves
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
G01S 7/41 - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisationTarget signatureTarget cross-section
G01S 13/56 - Discriminating between fixed and moving objects or between objects moving at different speeds for presence detection
3.
ACOUSTIC WAVE DEVICE AND ACOUSTIC WAVE FILTER DEVICE
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an IDT electrode on one of the first and second main surfaces, and including electrode fingers, a support facing the second main surface, and including an acoustic reflection portion at a portion closer to the second main surface of the piezoelectric layer, and a load film extending over a region that overlaps, when viewed in plan in the first direction, at least electrode fingers from a fourth one of the electrode fingers from a first outer end in an arrangement direction to a fourth one of the electrode fingers from a second outer end in the arrangement direction. d/p is less than or equal to about 0.5 where d denotes a thickness of the piezoelectric layer, and p denotes a center-to-center distance between adjacent two of the electrode fingers.
A measuring instrument is provided for inserting into an oral cavity with a narrow opening and that enables intraoral measurement in such a way as to relieve stress exerted on a probe part of the measuring instrument. The measuring device is configured to ensure that the probe part is accurately pressed against the oral mucosa of a person subjected to measurement. The measuring instrument includes a grip and a probe. The probe includes a measurement section and a joint forming a connection between the measurement section and grip. The measurement section is a tip region of the probe and provided with the sensor having an exposed measurement surface. A circuit board is disposed in the joint. The circuit board is an oscillation circuit board on which members forming an oscillation circuit are mounted. The oscillation circuit outputs an oscillatory signal corresponding to an electrical signal transmitted from the sensor.
An oxide material comprising: one or more selected from the group consisting of a nanofiber, a two-dimensional substance, or an amorphous substance of a material represented by: MQaOb wherein M is one or more elements selected from the group consisting of Groups 3, 4, 5, 6, and 7, Q is one or more elements selected from the group consisting of Groups 12, 13, 14, 15, and 16, and excluding O, a is 0 to 2, and b is more than 0 and 2 or less, wherein in a Raman spectrum, an average intensity of the oxide material at 745 to 765 cm−1 is smaller than an average intensity at 735 to 745 cm−1, and wherein a pore volume of the oxide material is 0.060 cc/g or more.
A first slave device and a second slave device to which different slave identifiers are added are connected to a serial bus. The second slave device includes a second storage unit including multiple registers and a second serial interface unit that receives a command in which the slave identifier of the second slave device is set via the serial bus and that sets a result of a process corresponding to the received command in at least one register in the second storage unit.
A semiconductor device that includes: a substrate; an insulating layer on the substrate; a first electrode layer on the insulating layer; a dielectric film on the first electrode layer; a second electrode layer on the dielectric film; a moisture-resistant film covering the first electrode layer and the second electrode layer; a first outer electrode passing through the moisture-resistant film and connected to the first electrode layer; and a second outer electrode passing through the moisture-resistant film and connected to the second electrode layer. The first electrode layer and the second electrode layer each comprise Al or an Al alloy. The outer electrodes each include a seed layer formed of Cu/Ti, Cu/Cr, or Cu/nichrome and a plating layer on the seed layer. The seed layer has a horizontal crystal grain size of 500 nm or less, and the plating layer has a horizontal crystal grain size of 500 nm or less.
A filter circuit includes an inductor formed by serially connecting wiring line groups formed on a plurality of conductive layers of the board through a via and a capacitor in which a first wiring line having one end of the inductor of the wiring line groups overlaps, as viewed in a direction orthogonal to a main surface of the board, a third wiring line that is formed on one of the conductive layers that is adjacent, in the direction orthogonal to the main surface of the board, to another of the conductive layers on which the first wiring line is formed and has one end electrically connected, through a via, to a second wiring line having another end of the inductor of the wiring line groups.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The multilayer body includes dielectric layers and inner electrode layers alternately stacked with the dielectric layers. Ni in one of first and second inner electrode layers forms a solid solution with Pt, and Ni in the other of the first and second inner electrode layers forms no solid solution with Pt. The one of the first and second inner electrode layers in which Ni forms a solid solution with Pt are coupled to a cathode when the multilayer ceramic capacitor is mounted.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an upper electrode on the first main surface, a lower electrode on the second main surface, and a support facing the second main surface of the piezoelectric layer. The piezoelectric layer includes an opening extending through the piezoelectric layer in a thickness direction in a region overlapping the lower electrode and not overlapping the upper electrode. The acoustic wave device further includes an overlapping electrode on the lower electrode in a region overlapping the opening and made of the same material as the upper electrode.
An acoustic wave filter includes a longitudinally coupled resonator acoustic wave filter including n IDT electrodes, and first and second reference-potential wiring lines each connected to a reference potential. The longitudinally coupled resonator acoustic wave filter includes first and second areas. The first area includes a first-end-positioned IDT electrode to a center-positioned IDT electrode in a direction in which the IDT electrodes are arranged side by side. The second area includes the center-positioned IDT electrode to a second-end-positioned IDT electrode in the direction in which the IDT electrodes are arranged side by side. Each of the IDT electrodes includes a first comb-shaped electrode and a second comb-shaped electrode interdigitated with each other. In each of the IDT electrodes, one of the first comb-shaped electrode and the second comb-shaped electrode is connected to the signal potential, and the other is connected to the reference potential.
A laminated film that includes: a porous resin layer having a first molded body of first liquid crystal polymer fibers; a first adhesive layer on the porous resin layer; a metal layer on the first adhesive layer on a side thereof opposite to the porous resin layer as viewed from the first adhesive layer; and a second adhesive layer on the porous resin layer on a side thereof opposite to the first adhesive layer as viewed from the porous resin layer.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
13.
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic circuit device is provided that includes a chip component, a circuit board, and a coating resin. The chip component is mounted on the circuit board, and a mounting surface of the circuit board is coated with the coating resin. A surface of an element substrate, a surface of an insulator layer, and a surface of the coating resin form a continuous surface. The electronic circuit device includes an insulator exposed portion where there is no element substrate due to exposure of the insulator layer when viewed in a stacking direction of the element substrate and the insulator layer. At least a part of a coil opening by a coil conductor is in a region of the insulator exposed portion.
An acoustic wave device includes a piezoelectric layer including first and second major surfaces, an IDT electrode on one of the first and second major surfaces, and including electrode fingers arranged in an arrangement direction, and a support facing the second major surface, and including an acoustic reflection portion facing the second major surface. The electrode fingers include a first electrode finger at an outermost position in the arrangement direction and a second electrode finger adjacent thereto. A product of a width, height, and density of one of the first and second electrode fingers is greater than a product of a width, height, and density of a central electrode finger. When the thickness of the piezoelectric layer is denoted by d and a center-to-center distance between adjacent electrode fingers is denoted by p, d/p is less than or equal to about 0.5.
An acoustic wave device includes a piezoelectric layer including a first main surface and a second main surface facing the first main surface in a first direction, an IDT electrode on at least one of the first main surface and the second main surface of the piezoelectric layer and including electrode fingers arranged in an arrangement direction, a reflector adjacent to the IDT electrode in the arrangement direction of the electrode fingers, a support that faces the second main surface of the piezoelectric layer and includes an acoustic reflection portion on a side of the second main surface of the piezoelectric layer, and a load film provided in a region overlapping with the reflector in a plan view from the first direction. When a thickness of the piezoelectric layer is d and a distance between centers of the adjacent electrode fingers is p, d/p is about 0.5 or less.
In a multilayer ceramic capacitor, a first internal electrode layer includes a first end surface-side exposed portion exposed to a first end surface side, a second internal electrode layer includes a second end surface-side exposed portion exposed to a second end surface side, and oxide films in the first and second end surface-side exposed portions. The oxide films include first and second oxide films respectively in the first and second end surface-side exposed portions. The first oxide films are provided at both ends in a width direction of the first end surface-side exposed portion, and the second oxide films are provided at both ends in the width direction of the second end surface-side exposed portion.
A multilayer electronic component includes a multilayer ceramic capacitor and an interposer. End portions of an interposer substrate in a width or length direction and end portions of joint electrodes in the width or length direction are located at a same or substantially a same position in the width direction. The joint electrodes have a plane-symmetric shape centered about an interposer symmetry plane which, in a middle of the width direction or the length direction, extend in the length or width direction and in the stacking direction. The multilayer ceramic capacitor has a plane-symmetric shape centered about a capacitor symmetry plane which, in the middle of the width direction or the length direction, extends in the length or width direction and in the stacking direction. The interposer symmetry plane and the capacitor symmetry plane are on the same or substantially the same plane.
A multilayer ceramic capacitor includes a multilayer body including first and second external electrodes respectively on third and fourth surfaces thereof. A dimension of the multilayer body in a first direction is shorter than a dimension of the multilayer body in a second direction. The multilayer body includes first and second internal electrodes respectively exposed on the third and fourth surfaces, and inner dielectric layers. The inner dielectric layers include at least Ca, Sr or Zr, and Li as main components. Li segregation exists in at least one of the first and second external electrodes, and a size of Li segregation in the at least one of the first and second external electrodes is larger than a size of Li segregation in the inner dielectric layers.
C04B 35/48 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates
H01G 4/012 - Form of non-self-supporting electrodes
In a secondary battery, a first end face of an electrode wound body and a first electrode current collector plate are joined to each other by one or more first joint parts. The one or more first joint parts each have a meander shape in a plan view. The meander shape includes multiple first linear parts and multiple first turning parts. In each of the one or more first joint parts, a length in a winding direction of the electrode wound body from an a-th one to an (a+1)th one of the first turning parts counted from a winding center of the electrode wound body is longer than a length in the winding direction from a first one to a second one of the first turning parts, of corresponding one of the first joint parts, counted from the winding center.
A plated metal film is formed on a wire placement surface of a terminal electrode. The plated metal film includes a nickel layer serving as a base and a tin layer as a surface layer. The wire extends along the wire placement surface and is bonded to the wire placement surface, in a connection portion between the wire and the wire placement surface, by a bonding member that contains a metal, such as tin, derived from the plated metal film. A fillet that contains a metal, such as tin, derived from the plated metal film is formed so as to fill in the gap between the wire and the wire placement surface at the end of the wire placement surface from which the wire extends toward a winding core portion.
A filter device is provided that includes a acoustic resonator having a substrate; a piezoelectric layer coupled to the substrate by one or more intermediate layers; and a conductor pattern on a surface of the piezoelectric layer, the conductor pattern including a pair of busbars having a plurality of interleaved fingers extending therefrom to form an interdigital transducer (IDT). The filter device further includes a dielectric capacitor electrically coupled in series to the acoustic resonator. The dielectric capacitor includes a dielectric layer on a surface of a first busbar of the pair of busbars and at least one metal layer on a surface of the dielectric layer, such that the dielectric layer is between the first busbar and the at least one metal layer to form the dielectric capacitor.
An electrical device having a capacitor including: a bottom electrode; a dielectric structure extending conformally on the bottom electrode and comprising dielectric layers, wherein the dielectric structure extends only within a central region of the bottom electrode; a top electrode extending conformally on the dielectric structure; and a passivation layer extending on the bottom electrode within a peripheral region of the bottom electrode, the peripheral region surrounding the dielectric structure and extending up to lateral edges of the electrical device, and wherein: the lateral edges of each of the dielectric layers are covered at least by the passivation layer.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
An electronic stethoscope includes a casing, a sound sensor that is provided at the casing and that obtains a sound of an organism and converts the sound of the organism into an electrical signal, light-emitting elements that are provided in the casing and that have respective light-emitting surfaces that emit light beams; and a light-guiding member that guides the light beams of the light-emitting elements to outside of the casing. The light-guiding member has an inner surface that includes light-receiving portions that face the light-emitting surfaces and upon which the light beams L of the light-emitting elements are incident, and an outer surface that is exposed to the outside of the casing by extending along an outer peripheral surface of the casing, and that radiates to the outside of the casing the light beams that are incident upon the outer surface through the light-receiving portions.
A61B 90/00 - Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups , e.g. for luxation treatment or for protecting wound edges
A multiplexer includes a common connection terminal, and transmitting and receiving filters commonly connected to the common connection terminal. The transmitting and receiving filters each include a resonator. The resonators of the transmitting and receiving filters share a piezoelectric substrate. The resonator located closest to the common connection terminal in terms of a circuit configuration of the transmitting filter defines a series-arm resonator. The resonator located closest to the common connection terminal in terms of a circuit configuration of the receiving filter defines a longitudinally coupled resonator acoustic wave filter. The series-arm resonator of the transmitting filter includes an IDT electrode including a plurality of electrode fingers. The first longitudinally coupled resonator acoustic wave filter of the receiving filter includes a plurality of IDT electrodes each including a plurality of electrode fingers.
A radio-frequency circuit includes first filter having a pass band including the transmit band of communication band A and a second filter having a pass band including the receive band of communication band B. The communication bands A and B are usable for simultaneous communication. The transmit band of the communication band A includes a sub-band X that overlaps the receive band of the communication band B and a sub-band Y that does not overlap the receive band of the communication band B. The receive band of the communication band B includes the sub-band X and a sub-band Z that does not overlap the transmit band of the communication band A. The pass band of the first filter is switchable between a first pass band including the sub-band X and the sub-band Y and a second pass band, narrower than the first pass band, including the sub-band Y.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces facing in a first direction, an IDT electrode on at least one of the first or second main surface and including electrode fingers arranged in an arrangement direction, a support facing the second main surface and including an acoustic reflection portion, and a protective film on at least one of the first or second main surface. In a region that overlaps, in plan view in the first direction, a first of the electrode fingers outermost in the arrangement direction, the protective film includes a surface of a first step where a side surface of the protective film is exposed in a direction intersecting an extending direction of the first electrode finger. When d is a thickness of the piezoelectric layer and p is a center-to-center distance between adjacent electrode fingers, d/p is about 0.5 or less.
A capacitor mounting board includes a substrate, (M×N) power lands, and (M−1)×(N−1) capacitors each in a region surrounded by (2×2) adjacent power lands. Each of the capacitors includes first and second main surfaces, first and third side surfaces, and second and fourth side surfaces. Each of the capacitors is at least on the first main surface, includes electrode terminals, has a rectangular or substantially rectangular shape at the first and second main surfaces, and is arranged such that an edge of the first capacitor main surface on the first capacitor side surface side and an edge of the first capacitor main surface on the third capacitor side surface side are inclined at about 45±5 degrees with respect to a straight line extending in a first direction on the second main surface of the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
28.
MAGNETIC MATERIAL, MAGNETIC MATERIAL MANUFACTURING METHOD, AND INDUCTOR
A magnetic material has magnetic powder containing a first magnetic particle and a second magnetic particle smaller in particle diameter than the first magnetic particle, and a resin. At least part of an outer peripheral surface of the first magnetic particle has a binding layer that contains a silane coupling agent.
H01F 1/147 - Alloys characterised by their composition
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
H01F 3/08 - Cores, yokes or armatures made from powder
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
Described are concepts, circuits, systems and techniques directed toward N-phase control techniques useful in the design and control of supply generators configured for use in a wide variety of power management applications including, but not limited to mobile applications.
A tracker circuit is provided that includes a voltage generation circuit configured to generate multiple discrete voltages based on an input voltage; and a supply modulator configured to select a voltage from among the multiple discrete voltages, and to output the selected voltage in parallel to a first power amplifier and a second power amplifier. The first power amplifier is connected to an antenna and configured to amplify a millimeter-wave signal, and the second power amplifier is connected to an antenna different from the antenna and configured to amplify the millimeter-wave signal.
An electronic component that can suppress occurrence of problems such as electrochemical migration. An electronic component includes an insulator where a plurality of insulating substrates, each being provided with a side electrode and an inner electrode, are placed upon each other; and outer electrodes that are electrically connected to the side electrodes and that are provided at side surfaces of the insulator. The plurality of insulating substrates are each further provided with dummy electrodes that are disposed on a corresponding one of two sides of the side electrode with an insulating portion being interposed therebetween when viewed from a placement direction. The outer electrodes are electrically connected to the dummy electrodes at the side surfaces of the insulator.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A ceramic substrate that includes: a base body including a ceramic layer; at least one inner conductor in the base body; a terminal electrode including a first electrode in contact with an outer surface of the base body and a second electrode covering a surface of the first electrode; and an insulating layer covering at least a portion of an outer periphery of the first electrode, the ceramic substrate including a section where the first electrode, the insulating layer, and the second electrode overlap in a thickness direction, the first electrode having a non-conductive component content of from 3% by weight to 40% by weight, the second electrode having a non-conductive component content of from 0% by weight to 10% by weight, and the non-conductive component content of the first electrode being equal to or greater than the non-conductive component content of the second electrode.
A resin laminated board includes resin layers laminated on one another and conductors located outside and inside the laminated resin layers. The resin layers include a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another. The conductors include first conductor layers, second conductor layers, and interlayer connection conductors. The first conductor layers are located at a lower main surface of the first resin layer. The second conductor layers or the interlayer connection conductors that overlap a portion of the first resin layer when viewed in a thickness direction of the third resin layer are located at the third resin layer. The second resin layer is a thermoplastic resin, and a melting point of the second resin layer is lower than a melting point of the first resin layer. At least the second resin layer includes air bubbles.
A multilayer ceramic component in which an external electrode has a thickness that does not inhibit ease of mounting. This multilayer ceramic component includes external electrodes. The external electrodes each include: a base film that extends to a first main surface and a second main surface and in contact with the internal electrode layers; an inner plating film in contact with the base film; and an outer plating film in contact with the inner plating film. The base film has a thickness that is 1.4 to 3.0 times the film thickness of the inner plating film and is 1.4 to 3.0 times the film thickness of the outer plating film. The film thickness of the base film is 0.4 to 0.6 times the total film thickness of the base film, the inner plating film and the outer plating film.
A secondary battery is provided and includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes a solvent. The solvent includes an anisole compound represented by Formula (1), and a content of the anisole compound in the solvent is 30 wt % or greater.
An antenna module includes dielectric substrates, ground electrodes, radiation electrodes, and a feed line. The dielectric substrates are flat. A third dielectric substrate is connected to rear surfaces of the first and second dielectric substrates and is rigid. A first radiation electrode is disposed at the first dielectric substrate closer to a top surface with respect to a first ground electrode. A second radiation electrode is disposed at the second dielectric substrate closer to a top surface with respect to a second ground electrode. A third ground electrode is disposed at a third dielectric substrate to electrically connect the first and second ground electrodes. The feed line is disposed at the third dielectric substrate to transmit a high-frequency signal from the first dielectric substrate to the second dielectric substrate. A normal direction of the first dielectric substrate and a normal direction of the second dielectric substrate differ from each other.
A multilayer ceramic capacitor includes a first opposing portion of a first internal electrode layer including a first high coverage region towards an outside of a laminate in a lamination direction with respect to a first extraction portion with a higher coverage than a coverage of the first extraction portion, and a second opposing portion including a second high coverage region towards an outside of the laminate in the lamination direction with respect to a second extraction portion with a higher coverage than a coverage of the second extraction portion.
A filter device includes a multilayer body, an input terminal, a ground terminal, first and second terminals, and first and second filter circuits. The first filter circuit includes first and second coils connected to in series between the input terminal and the first terminal. The filter circuit includes a third coil connected between the ground terminal and a signal path coupling the input terminal and the second terminal, and a fourth coil between the second terminal and the ground terminal. Each of the first coil and the fourth coil have a winding axis in a direction that extends in a stacking direction. Each of the second coil and the third coil has a winding axis in a direction that intersects the stacking direction. In plan view in the stacking direction, at least part of the first coil and the fourth coil are in between the second and the third coil.
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
wherein (In general formula (1), R1 is a C1-C12 hydrocarbon group. In general formula (1), R2 is a C1-C12 hydrocarbon group other than a benzene ring. In general formula (1), R3 is a hydrogen atom or a C1-C12 hydrocarbon group).
C08K 5/11 - EstersEther-esters of acyclic polycarboxylic acids
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
C08J 3/20 - Compounding polymers with additives, e.g. colouring
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
wherein (In general formula (1), R1 is a C1-C12 hydrocarbon group. In general formula (1), R2 is a C1-C12 hydrocarbon group. In general formula (1), R3 is a hydrogen atom, a hydroxy group, a carboxy group, a C2-C12 ester group, a C2-C12 acyl group, a C2-C12 acyloxy group, or a C1-C12 alkoxy group. In general formula (1), X is a single bond or a C1-C12 hydrocarbon group. In general formula (1), R4 is a hydrogen atom, a C2-C12 acyl group, or a C1-C12 hydrocarbon group. In general formula (1), R5 is a hydrogen atom or a C1-C12 hydrocarbon group).
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
B32B 27/22 - Layered products essentially comprising synthetic resin characterised by the use of special additives using plasticisers
A multilayer inductor includes terminal electrodes, a coil conductor, and an extended conductor. The terminal electrodes are on respective end surfaces of a multilayer body and extend onto side surfaces adjoining the end surfaces. The coil conductor is inside the multilayer body and includes loop-segment conductors. The extended conductor is extended from an end portion of the coil conductor and connected to the terminal electrode, and includes outside and inside via-conductors that penetrate through non-conductive layers in the thickness direction thereof to extend parallel to each other. The outside and inside via-conductors are connected, in parallel, to each other and also connected to the terminal electrode at the end surface. As the multilayer body is viewed through in the lamination direction of the non-conductive layers, all parts of the outside via-conductor overlap the loop-segment conductors, and the inside via-conductor is inside an inner periphery of the loop-segment conductors.
A multilayer ceramic capacitor includes an inner layer portion including inner dielectric layers and internal electrode layers alternately laminated in a lamination direction. The internal electrode layers include a first outer internal electrode layer closest to one of two main surfaces and a second outer internal electrode layer opposed to the first outer internal electrode layer, and a line coverage at an end portion in a width direction of the first outer internal electrode layer is lower than a line coverage at an end portion in the width direction of the second outer internal electrode layer. The first outer internal electrode layer further includes a divided region at the end portion where Mg or Mn is segregated.
A radio frequency module includes a first semiconductor component connected to a first digital control terminal; a second semiconductor component connected to a second digital control terminal and including first and second low-noise amplifiers; a first filter with a pass band including a TDD band; a second filter connected to the second low-noise amplifier and has a pass band including a reception band of an FDD band; a first switch circuit including a common terminal connected to an antenna connection terminal and first and second selection terminals connected, respectively, to the first and second filters; and a second switch circuit including a common terminal connected to the first filter and the third and fourth selection terminals connected, respectively, to a power amplifier and the first low-noise amplifier. The second semiconductor component is also connected to the first digital control terminal via the first semiconductor component.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
wherein (In general formula (1), R1 is a hydrogen atom or a C1-C12 hydrocarbon group. In general formula (1), R2 is a C1-C12 hydrocarbon group. In general formula (1), R3 is a hydrogen atom or a C1-C12 hydrocarbon group. In general formula (1), R4 is a hydrogen atom or a C1-C12 hydrocarbon group).
C08K 5/12 - EstersEther-esters of cyclic polycarboxylic acids
B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
A multilayer ceramic capacitor includes a body including dielectric ceramic layers and inner electrode layers. The dielectric ceramic layers include crystal grains including a perovskite oxide including at least one A-site element and at least one B-site element. When a cross-section of the dielectric ceramic layers is observed using a scanning transmission electron microscope, the dielectric ceramic layers include grains, on which a plane of a perovskite structure is observed, as crystal grains. In the cross-section, a percentage by number of the grains in the crystal grains is about 4% or more.
A multilayer ceramic capacitor includes a ceramic base body including dielectric layers and internal electrode layers, first and second main surfaces opposed to each other in a height direction, first and second side surfaces opposed to each other in a width direction, and first and second end surfaces opposed to each other in a length direction, and a terminal electrode on the ceramic base body and connected to a portion of the internal electrode layers. The terminal electrode includes a resin electrode including a resin and a conductive filler. An average particle diameter of the filler is about 5 μm or more. An average aspect ratio of the filler is about 4 or more.
An acoustic wave device includes a piezoelectric layer with first and second major surfaces, an IDT electrode on at least one of the first and second major surfaces and including electrode fingers arranged in a predetermined direction, a support facing the second major surface and including an acoustic reflection portion on the second major surface side, and a load film in a region that, in plan view in a first direction, overlaps at least one end portion of the IDT electrode in the arrangement direction. The end portion includes a first electrode finger positioned outermost in the arrangement direction, and d/p is about 0.5 or less where d is a thickness of the piezoelectric layer and p is a center-to-center distance between adjacent ones of the electrode fingers.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an IDT electrode on at least one of the first and second main surfaces and including electrode fingers arranged in a predetermined direction, and a support facing the second main surface and including an acoustic reflection portion toward the second main surface. At least one of a first electrode finger in an outermost portion and a second electrode finger internally adjacent to the first electrode finger differs from central electrode fingers inside the second electrode finger in at least one of a dimension in a direction orthogonal to an extension direction and an inter-center distance to an internally adjacent electrode finger, d/p is about 0.5 or less, where d denotes a thickness of the piezoelectric layer and p denotes the inter-center distance between adjacent electrode fingers.
A method for manufacturing a multilayer ceramic capacitor includes a multilayer body including layered ceramic layers and internal electrode layers, and an external electrode on a side surface of the multilayer body and connected to the internal electrode layers. A recess is provided in a surface of the external electrode on one side of opposing main surfaces of the multilayer ceramic capacitor.
In a multilayer ceramic capacitor, a first outer electrode layer includes a first base electrode layer, a first electroconductive resin layer on the first base electrode layer, and a first plating layer on the first electroconductive resin layer. The first plating layer includes a plating layer body, and a connection area extending from the plating layer body through the first electroconductive resin layer, and connected to the first base electrode layer. A connection portion between the connection area and the first base electrode layer is adjacent to a first inner electrode layer.
A multilayer ceramic capacitor includes first and second internal electrode layers, and an intermediate electrode layer, a first floating island electrode in a region between an end surface and the intermediate electrode layer of the multilayer body, and a second floating island electrode in a region between a lateral surface and an internal electrode layer of the multilayer body, in a dielectric region including a dielectric layer interposed between the first internal electrode layers or the second internal electrode layers in the lamination direction.
A multilayer ceramic capacitor includes a multilayer body including first and second surfaces facing each other in a lamination direction, third and fourth surfaces facing each other in a first direction, and fifth and sixth surfaces facing each other in a second direction, a first outer electrode on the first, third, and fifth surfaces, a second outer electrode on the first, third, and sixth surfaces, a third outer electrode on the first, fourth, and sixth surfaces, and a fourth outer electrode on the first, fourth, and fifth surfaces. The multilayer body includes a first inner electrode exposed on the third surface and connected to the first and third outer electrodes. The first outer electrode includes a notch portion that opens toward the fifth surface, and about 0.85≤L/W≤about 1.0 is satisfied.
A power supply apparatus includes a power converter, a controller, an ORing device, and a first feedback module. The power converter is configured to provide an output voltage via the ORing device. The first feedback module is connected between a downstream node of the ORing device and the controller and is configured to provide a first voltage feedback to the controller. The power supply apparatus further includes a second feedback module connected between an upstream node of the ORing device and the controller and configured to provide a second voltage feedback to the controller, and a third feedback module connected between the upstream node of the ORing device and the controller and configured to provide a third voltage feedback to the controller. The controller is configured or programmed to control the power supply apparatus based on the first voltage feedback, the second voltage feedback, and the third voltage feedback.
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
A switch circuit includes a first switch that connects and disconnects a first signal path between a common terminal and a first selection terminal; a second switch that connects and disconnects a second signal path between the common terminal and a first node; a third switch that connects and disconnects a third signal path between the first node and a selection terminal; a fourth switch that connects and disconnects a fourth signal path between the common terminal and a second node; a fifth switch that connects and disconnects a fifth signal path between the second node and a third selection terminal; an inductor connected between the first and second nodes and a ground. Each of the quantity of switches on the second and third signal paths and the quantity of switches on the fourth and fifth signal paths is greater than the quantity of switches on the first signal path.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
A radio frequency circuit include: a power amplifier circuit a harmonic attenuation circuit; a matching circuit; a filter; a first switch; a second switch; and a third switch. The matching circuit is coupled between the harmonic attenuation circuit and the power amplifier. The filter has an attenuation band including at least part of harmonic bands of a transmission band of a first band. The first switch is between the harmonic attenuation circuit and the filter. The second switch is between the filter and an antenna connection terminal. The third switch is between the matching circuit and the antenna connection terminal not via the harmonic attenuation circuit.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
An electronic module includes a substrate or a lead frame including primary conductive patterns and secondary conductive patterns; a magnetic core; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, first terminals that define a first terminal group and that are on or embedded in the resin body, and second terminals that define a second terminal group and that on or are embedded in the resin body; an IC; and a capacitor. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected corresponding secondary conductive patterns; and a first primary conductive pattern is closer to a second primary conductive pattern than any of the secondary conductive patterns.
A rotor for use in an ultrasonic motor, the rotor including: a rotor main body; and a sliding material on the rotor main body and positioned for contact with a vibrating body of a stator, the sliding material including carbon graphite. Also disclosed is a stator for an ultrasonic motor, the stator including: a vibrating body; a vibration generating element on the vibrating body; and a sliding material on the vibrating body and positioned for contact with a rotor, the sliding material including carbon graphite.
H02N 2/16 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors using travelling waves
An acoustic wave device includes a support substrate, a piezoelectric layer on the support substrate, and at least one lithium niobate layer and first and second principal surfaces opposed to each other, and first and second IDT electrodes respectively on the first and second principal surfaces. Each of the first and second IDT electrodes includes electrode fingers. A duty ratio of each of the first and second IDT electrodes is equal to or greater than about 0.6. Directions of polarization of the piezoelectric layer are inverted in a thickness direction of the piezoelectric layer.
A multilayer ceramic capacitor includes a multilayer body and external electrodes on first and second end surfaces. Each external electrode has a Cu base layer, a Ni plating layer in contact with the Cu base layer that covers the Cu base layer, and a Sn plating layer that covers the Ni plating layer. When a ridge part is defined as a portion where two surfaces of the multilayer body intersect, the thickness of the Cu base layer at the ridge part of the multilayer body is less than the thickness of the Cu base layer at a main surface, at a side surface, and at an end surface. The coverage of the Cu base layer at the ridge part is not less than 85%. The difference between the coverage of the Cu base layer at the ridge part and at the main surface and the side surface is within ±5%.
An electronic component module includes an electronic component and a multilayer wiring board. The multilayer wiring board includes wiring layers and insulating layers. A disposition surface has a hole. The wiring layers include a front surface wiring layer configuring the disposition surface and a bottom surface wiring layer configuring a bottom surface of the hole. The electronic component includes an electric circuit, an outer contour portion defining an outer contour of the electronic component, and an electrode connecting the electric circuit and the wiring layers. The outer contour portion includes an outer contour portion body on the front surface wiring layer, a first facing surface facing the front surface wiring layer, a projection in the hole, and a second facing surface defining an end surface in a first direction of the projection and facing the bottom surface wiring layer.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A semiconductor device is provided that includes a substrate; N first electrodes over the substrate; a first dielectric film on the N first electrodes; M second electrodes over the N first electrodes with the first dielectric film interposed therebetween; a first protective layer covering the N first electrodes and the M second electrodes; three or more outer electrodes that extend through the first protective layer; and a second protective layer that covers each outer electrode of the three or more outer electrodes, other than two outer electrodes. At least one of the second electrodes is located over each first electrode, and the N first electrodes, the first dielectric film, and the M second electrodes form M capacitor elements that are electrically coupled in series.
H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
62.
MULTILAYER CERAMIC CAPACITOR AND MOUNT STRUCTURE FOR MULTILAYER CERAMIC CAPACITOR
A multilayer ceramic capacitor includes a multilayer body including layered dielectric layers and internal electrode layers, first, second, third, and fourth external electrodes respectively on third, fourth, fifth, and sixth surfaces. The internal electrode layers include first and second internal electrode layers respectively exposed at the third and fourth surfaces and the fifth and sixth surfaces. The multilayer body includes a capacitance generating portion in which the first and second internal electrode layers are opposed, first and second outer layer portions respectively between first and second surfaces and the capacitance generating portion. A third internal electrode layer opposed to the first internal electrode layer in at least one of the first and second outer layer portions, and a length in a first direction of the third internal electrode layer is shorter than a length in the first direction of the second internal electrode layer.
A multilayer ceramic capacitor includes a multilayer body including first, second, third, fourth, fifth, and sixth surfaces, and first, second, and third external electrodes extending in a layering direction. The multilayer body includes dielectric layers and first and second internal electrode layers respectively connected to the first external electrode and the second and third external electrodes. The first internal electrode layer includes a first main portion and a first drawn portion extending toward the first external electrode. The second internal electrode layer includes a second main portion and a second drawn portion extending toward the second external electrode, and a third drawn portion extending toward the third external electrode. A length in a second direction of the multilayer body is longer than a length in the layering direction of the multilayer body.
A multilayer ceramic capacitor includes a multilayer body including first, second, third, fourth, fifth, and sixth surfaces, and first, second, and third external electrodes extending in the layering direction. The multilayer body includes dielectric layers and first and second internal electrode layers respectively connected to the first external electrode and the second and third external electrodes. The first external electrode includes a first fold-back portion. The second external electrode includes a second fold-back portion and a third fold-back portion. The third external electrode includes a fourth fold-back portion and a fifth fold-back portion. A dimension in a second direction of the multilayer ceramic capacitor is greater than a dimension in a layering direction of the multilayer ceramic capacitor.
A coil component includes a core, made of a magnetic material, that includes a winding core portion and first and second flange portions that are at ends of the winding core portion that are opposite to each other in an axial direction, a top plate, made of a magnetic material, that extends between the first and second flange portions, and at least one wire wound around the winding core portion. The top plate is fixed to the core in a state in which the top plate faces top surfaces of the first and second flange portions and a gap having an average dimension of from 20 μm to 50 μm is between the top plate and the top surfaces, and the ratio of the cross-sectional area of the top plate to the cross-sectional area of the winding core portion is from 0.478 to 0.956 as viewed along a surface.
A power amplification device includes a substrate, a first integrated circuit, a second integrated circuit, a splitter, a carrier amplifier, a peak amplifier, a first bias circuit providing bias to the carrier amplifier, a second bias circuit providing bias to the peak amplifier, a drive-level detector circuit outputting a signal indicating a drive level of the carrier amplifier based on a high-frequency signal outputted by the carrier amplifier, a detector circuit that outputs a control signal to control the second bias circuit, based on an inputted high-frequency signal and the signal indicating the drive level of the carrier amplifier, and a coupler. The detector circuit varies a threshold for the control signal. The first integrated circuit includes the splitter, the first-stage carrier amplifier, the first-stage peak amplifier, and the detector circuit. The second integrated circuit includes the final-stage carrier amplifier and the final-stage peak amplifier.
A multilayer ceramic capacitor includes a multilayer body including first through sixth surfaces, a first outer electrode on the third, first, second, fifth and sixth surfaces, and a second outer electrode on the fourth, first, second, fifth and sixth surfaces. The first underlying electrode layer includes a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface. The second underlying electrode layer includes a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface. A dimension of the first band portion is larger than a dimension the third band portion in the first underlying electrode layer, and a dimension of the second band portion is larger than a dimension of the fourth band portion in the second underlying electrode layer.
A radio frequency circuit includes: a first filter having a passband including uplink bands of first and second bands (UL1,UL2); a second filter having a passband including a downlink band of the first band (DL1); and a downlink filter arrangement that filters a downlink band of the second band (DL2) and a downlink band of a third band (DL3). All filter paths are ultimately communicatively coupled to an antenna terminal, either directly or via a switch. The combination of the first and second bands is a band combination for simultaneous communication. The frequency ordering is DL2>DL3>UL2>UL1>DL1. The first filter has a steeper attenuation slope on a higher frequency side than on a lower frequency side of the passband.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 9/54 - Filters comprising resonators of piezoelectric or electrostrictive material
A method for forming a silicate film that includes: applying a coating agent containing alkali metal silicate to a surface of glass that contains at least one multivalent metal ion; and forming a silicate film containing a multivalent metal ion in common with that of the glass on the surface of the glass through dissolution of the at least one multivalent metal ion in the glass to the surface of the glass.
A maintenance-free meteorological measurement device that can accurately estimate the amount of falling rain, snow, or fog droplets without becoming clogged with debris or evaporation of water. A rain gauge includes a light guide plate and an infrared camera in a housing, and an AI computer that is an information processing device. The housing has a rectangular parallelepiped shape with an open top and an open bottom. The light guide plate unit is mounted on one side surface of the housing. The light guide plate unit includes an LED, a light guide plate, and a diffusion plate housed in a unit case. The infrared camera is on the other side surface of the housing that faces the one side surface across a space. The AI computer detects images of raindrops and estimates the amount of rainfall from the images of the raindrops using machine learning.
G06T 7/73 - Determining position or orientation of objects or cameras using feature-based methods
G01W 1/04 - Instruments for indicating weather conditions by measuring two or more variables, e.g. humidity, pressure, temperature, cloud cover or wind speed giving only separate indications of the variables measured
71.
POWER CONVERSION CIRCUIT AND POWER CONVERSION DEVICE
A power conversion circuit includes first, second, and third input terminals for receiving three-phase AC voltages, a pair of output terminals, multiple bidirectional switches, and a control circuit. During a predetermined period proximate to a time when the magnitude relationship between the second and third voltages is transposing, the control circuit manages the second and third low-side bidirectional switches to prevent an overlap between specific conductive states. Concurrently, the control circuit controls the second and third high-side switches to also prevent an overlap between their respective conductive states. By preventing overlap between states, a short-circuit current does not flow through an unintended current path.
H02M 7/25 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only arranged for operation in series, e.g. for multiplication of voltage
H02M 1/38 - Means for preventing simultaneous conduction of switches
A radio-frequency circuit includes first and second filters and a first switch. The first filter has a pass band including a first broadcast band for 5G broadcast. The second filter has a pass band including a second broadcast band for 5G broadcast and a first communication band for cellular mobile communication. The first switch includes first, second, and third terminals. The first switch is configured to connect the first terminal to at least one of the second terminal and the third terminal. The second broadcast band and the first communication band at least partially overlap each other and are positioned at a high frequency side or a low frequency side of the first broadcast band. The first filter is connected to the second terminal. The second filter is connected to the third terminal.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A piezoelectric device includes a piezoelectric layer including a thickness in a first direction, and upper and lower surfaces, a support on a side of the lower surface of the piezoelectric layer, an upper electrode on the upper surface of the piezoelectric layer, a lower electrode on the lower surface of the piezoelectric layer with at least a portion of the lower electrode facing the upper electrode, and a reinforcement film on at least one of the upper and lower surfaces of the piezoelectric layer. The support includes a space portion in a region overlapping with at least a portion of the upper and lower electrodes. In plan view seen in the first direction, the reinforcement film overlaps with at least a portion of a border between a region overlapping with the space portion and a region not overlapping with the space portion.
Techniques are provided for reducing cross-coupled noise. For example, a method includes coupling an input node to a ground by a primary shunt switch in a closed state, decoupling an output node from the input node by a primary through switch in an open state, switching the primary shunt switch from the closed state to an open state to decouple the input node from the ground, switching the primary through switch from the open state to a closed state to couple the output node to the input node and provide a circuit path for an RF signal from an RF source to a load, and switching an ancillary switch from an open state to a closed state to couple the ancillary switch across one of the primary switches to reduce cross-coupled noise. Additional systems, devices, circuits, and methods are also provided.
A substrate-equipped multilayer ceramic capacitor includes a multilayer ceramic capacitor and a substrate. A dimension in a second direction of a portion of a first external electrode overlapping with a first surface as viewed in a lamination direction is smaller than a dimension in the second direction of a portion of the first external electrode overlapping with a second surface as viewed in the lamination direction. The first surface and the second surface are located on opposite sides with a first substrate surface interposed therebetween.
In a multilayer ceramic capacitor, when an internal electrode layer closest to one of outer layer portions is defined as an outermost internal electrode layer, the outermost internal electrode layer includes an internal electrode existing region and an internal electrode dividing region. The internal electrode dividing region includes a segregated region of magnesium or manganese, and a ratio B/A of a distance B in a length direction of the segregated region of magnesium or manganese relative to a distance A in the length direction of the internal electrode existing region is about 50% or more and about 75% or less.
A multilayer ceramic capacitor includes a multilayer body including an inner layer portion and outer layer portions, and first and second external electrodes respectively including first and second base electrode layers and plating layers on the first and second base electrode layers. The first and second base electrode layers include metal, glass, and voids. Voids and glass in first and second outer layer portion-side base electrode layers have a lower space occupancy percentage than voids and glass in a first inner layer portion-side base electrode layer. Voids and glass in third and fourth outer layer portion-side base electrode layers have a lower space occupancy percentage than voids and glass in a second inner layer portion-side base electrode layer.
A radio frequency module includes a module laminate, first to third substrates disposed on the module laminate, and first and second power amplifier circuits. Each power amplifier circuit includes a preceding-stage amplifier, a subsequent-stage amplifier, and a passive component. The passive component is connected between the preceding-stage amplifier and the subsequent-stage amplifier. The preceding-stage amplifiers of the first and second power amplifiers are included in the first semiconductor component. The subsequent-stage amplifier of the first power amplifier circuit is included in the second semiconductor component. The subsequent-stage amplifier of the second power amplifier circuit is included in the third semiconductor component. The first semiconductor component is disposed between the passive components of the first and second power amplifier circuits in a plan view of the module laminate.
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
A high frequency module includes a first drive stage amplification unit, a second drive stage amplification unit, a final stage amplification unit, a first matching circuit, and a second matching circuit. The first drive stage amplification unit is connected to a first input unit. The second drive stage amplification unit is connected to a second input unit. The final stage amplification unit is connected to output units. The first matching circuit is connected between the first drive stage amplification unit and the final stage amplification unit, and has a first pass band including a first communication band and a first attenuation band including a second communication band. The second matching circuit is connected between the second drive stage amplification unit and the final stage amplification unit, and has a second pass band including the second communication band and a second attenuation band including the first communication band.
A barrier property that can be expected from the average film thickness of a barrier layer may fail to be achieved. An electronic element includes a component body and a protective film. The protective film includes an organic film covering the outer surface of the component body and containing an organic constituent as a main constituent, and a first barrier film covering the organic film and containing an inorganic constituent as a main constituent. The minimum value of the film thickness of the first barrier film is 15 nm or more, and the maximum value of the film thickness of the first barrier film is 65 nm or less.
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The outer electrode includes an inner base electrode, an outer base electrode, and a plating layer.
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The outer electrode includes an inner base electrode, an outer base electrode, and a plating layer.
The inner base electrode is on at least one of a first end surface and a second end surface and includes glass and conductive metal. The outer base electrode is on the inner base electrode and includes glass and conductive metal. The outer base electrode includes, as a main metal, a metal different from a main metal of the inner base electrode. The plating layer is provided on the outer base electrode. The inner base electrode has a glass content less than a glass content of the outer base electrode.
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The outer electrode includes an inner base electrode, an outer base electrode, and a plating layer. The inner base electrode is on at least one of first and second end surfaces and includes glass and conductive metal. The outer base electrode is on the inner base electrode and includes glass and conductive metal. The outer base electrode includes, as a main metal component, a component different from a main metal component of the inner base electrode. The plating layer is on the outer base electrode.
A multilayer ceramic capacitor includes a base body including dielectric ceramic layers and internal electrode layers stacked in a thickness direction, and a pair of external electrodes on first and second end surfaces and electrically connected to the internal electrode layers. The dielectric ceramic layers include, as a main component, crystal grains including a perovskite complex oxide including barium and titanium, and a rare earth element, and include, in a cross section including the thickness direction, a rare earth element high-concentration region in an area proportion of about 50% or more, the rare earth element high-concentration region including the rare earth element in a molar ratio of the rare earth element to titanium of about 0.04 or more and about 0.30 or less.
A multilayer ceramic capacitor includes interlayer regions sandwiched between two layers, among main dielectric layers and outer layers that are adjacent in a lamination direction, and auxiliary dielectric layers in the interlayer regions. The interlayer regions include a first region positioned between one of end surfaces and an internal electrode, and a second region overlapping with the internal electrode in the interlayer region. The auxiliary dielectric layer is located in each of the first region and the second region. A main component of a dielectric ceramic is the same for the auxiliary dielectric layers in the first and second regions. A main component of a dielectric ceramic in the auxiliary dielectric layer in the first region differs from that in the main dielectric layer.
A piezoelectric device includes a first piezoelectric layer including upper and lower surfaces, a first support on a lower surface side of the first piezoelectric layer, first upper and lower electrodes respectively on the upper and lower surfaces of the first piezoelectric layer at least partially facing each other, a second piezoelectric layer including upper and lower surfaces, a second support on a lower surface side of the second piezoelectric layer, and second upper and lower electrodes respectively on the upper and lower surfaces of the second piezoelectric layer at least partially facing the second upper electrode, and an intermediate layer. The upper surfaces of the first and second piezoelectric layers face each other in a first direction, and the intermediate layer is located between the upper surfaces of the first and second piezoelectric layers.
A vibration device that includes: a vibration body; a piezoelectric element at a first end of the vibration body in a first direction; and a translucent body that has an optical axis extending in the first direction and at a second end of the vibration body in the first direction. The vibration body includes a first flange portion connected to the translucent body, a second flange portion connected to the piezoelectric element, and an arm portion that connects the first flange portion to the second flange portion. In a cross-section including the optical axis, the first flange portion and the second flange portion extend from a position separate from the optical axis in a second direction intersecting the first direction in a direction towards to the optical axis. The arm portion has a curved shape in the cross-section including the optical axis.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
87.
WIRELESS POWER SUPPLY SYSTEM AND POWER RECEPTION DEVICE
A power reception device includes a power reception rectification circuit that converts a high-frequency power received by a power reception resonance circuit into a DC power on the power reception side; a battery charged by the DC power on the power reception side; a power reception rectification control circuit that controls the power reception rectification circuit; and a power reception state detection circuit in which physical energy changes according to the power reception state of the power reception rectification circuit. A power transmission device executes an intermittent power transmission operation at a predetermined period. The power reception rectification control circuit determines, based on the measurement of the physical energy of the power reception state detection circuit, whether the power reception device is in a state in which it is continuously arranged, or a state in which it is rearranged, with respect to the power transmission device.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
A transmission line section of a multilayer substrate forms a stripline including an upper ground conductor, a lower ground conductor, and a signal line conductor. The antenna section includes a signal line conductor interlayer connection conductor that electrically connects the radiation conductor to the signal line conductor, and one or more ground conductor interlayer connection conductors that electrically connect an upper-surface annular ground conductor to the lower ground conductor and the upper ground conductor of the transmission line section. Viewed in the stacking direction of a plurality of base materials, the entire surface of the radiation conductor overlaps the lower ground conductor, and an end portion of the upper ground conductor is inside an annular shape formed by the upper-surface annular ground conductor at a position that overlaps the signal line conductor but does not overlap the radiation conductor.
A high frequency module includes an amplifier circuit, a matching circuit, and a harmonic wave endpoint circuit. The amplifier circuit has an output terminal. The matching circuit is connected to the output terminal of the amplifier circuit, and includes a first inductor. The harmonic wave endpoint circuit connects the output terminal of the amplifier circuit and ground together, and includes a second inductor. The first inductor and the second inductor are arranged so that a magnetic field occurring at the first inductor and a magnetic field occurring at the second inductor are differentially coupled.
A balun includes a first wire including a first end connected to a first balanced line transmitting one of balanced signals and a second end connected to a first reference potential; a second wire including a first end connected to a second balanced line transmitting another one of the balanced signals and a second end connected to the first reference potential; a third wire that includes a first end and an open second end and is electromagnetically coupled to the first wire; a fourth wire that includes a first end connected to the first end of the third wire and a second end connected to an unbalanced line transmitting an unbalanced signal and is electromagnetically coupled to the second wire; a first capacitor connected in parallel with a part of the first wire; and a second capacitor connected in parallel with a part of the second wire.
A multiplexer includes first and second filters are connected to a common terminal. The first filter includes series arm resonators disposed on a first series arm path and a first variable capacitance circuit connected in parallel to a first series arm resonator s11 that is connected and nearest to the common terminal. The first variable capacitance circuit includes a capacitor and a switch that are connected in series to each other. The second filter includes parallel arm resonators that are connected between a second series arm path and a ground and a second variable capacitance circuit connected in series to the parallel arm resonator that is connected and nearest to the common terminal. The second variable capacitance circuit includes a capacitor and a switch that are connected in parallel to each other.
A coil component and a method for manufacturing thereof that can improve the connection reliability of the wire to the electrode. A wire contains copper, and a terminal electrode as an electrode includes a tin plated layer at least on a surface thereof. In a cutting step of cutting and removing an excess of an end of a wire in the vicinity of an end edge of a terminal electrode by applying a tension to the wire, the excess of the end of the wire is cut and removed, and is divided into first and second portions adjacent to each other in a length direction at the end of the wire. In a thermal pressure bonding step of thermally pressure bonding the end of the wire to the terminal electrode, the first and second portions and the terminal electrode are bonded to each other.
A pressure sensor device that includes: a base having electroconductivity; an intermediate layer on the base and defining an opening; and an electrode on the intermediate layer and including a diaphragm portion that faces the opening. The opening includes a through-hole that extends through the intermediate layer in the lamination direction, and a pair of recesses on an upper surface of the intermediate layer such that the through-hole is therebetween. The intermediate layer includes a base-side electroconductive layer that is a bottom surface of the pair of recesses. The pressure sensor device further includes a pair of opposing portions that oppose each other and that protrude from at least one of the base-side electroconductive layer or the diaphragm portion and protrude toward the pair of recesses. The pair of opposing portions overlap edge portions of the pair of recesses closer to the through-hole.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
A data communication device that enables a reduction in the circuit size is provided. A data communication device includes: a command interpretation device that is connected to a main device, receives, from the main device, a main signal including a command signal, an address signal that designates an address of at least one register included in a sub-device and a sub-device, and a write data signal to be stored in the register corresponding to the address, and interprets the command signal; and the sub-device and the sub-device that are connected to the command interpretation device via a first signal line through which a clock signal is transmitted and a second signal line through which a data signal is transmitted.
A solid state battery having: a laminated structure in which one or more positive electrode layers and one or more negative electrode layers are alternately laminated with a solid electrolytic layer interposed in between; a positive end face electrode on a first end face of the laminated structure; and a negative end face electrode on a second end face of the laminated structure, wherein (1) at least one of the one or more positive electrode layers has an end portion having a protruding shape protruding toward the positive end face electrode in a sectional view and electrically connected to the positive end face electrode, or (2) at least one of the one or more negative electrode layers has an end portion having a protruding shape protruding toward the negative end face electrode in the sectional view and electrically connected to the negative end face electrode.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
A composite filter device includes a piezoelectric substrate, a first filter that is a band pass filter and includes a longitudinally coupled resonator-type acoustic wave filter on the piezoelectric substrate, a second filter that includes at least one resonator and an inductor connected to a reference potential, and a reference potential wiring line on the piezoelectric substrate and connected to the reference potential, that has a substantially annular portion having an annular shape including a gap, and that surrounds, in the substantially annular portion, the longitudinally coupled resonator-type acoustic wave filter. The substantially annular portion of the reference potential wiring line includes first and second end portions facing each other across the gap, and a reference potential connection portion extending with the first end portion as a starting point and that connects the longitudinally coupled resonator-type acoustic wave filter to the reference potential.
An electrode that includes a carbon film having an sp2 bond and an sp3 bond, the carbon film having a proportion of the sp3 bond of from 0.3 to 0.45 and a full width at half maximum of a G band of from 135 cm−1 to 220 cm−1.
A radio frequency circuit includes: an antenna connection terminal; an antenna connection terminal; a first power amplifier; a second power amplifier; a first filter in a first signal path between the antenna connection terminal and the first power amplifier and having a passband including a transmission band of a first band; a second filter in a second signal path between the antenna connection terminal and the second power amplifier and having a passband including a transmission band of a second band; and a switch configured to selectively couple an output of the power amplifier and one of the first signal path and the second signal path.
An antenna includes a first radiating conductor having a first open end and a first feed point, a second radiating conductor that has a second open end and a second feed point and is disposed such that the second open end is opposite to the first open end, and a planar ground conductor that overlaps with the first radiating conductor and the second radiating conductor in plan view. The antenna includes also a shielding ground conductor disposed between the first open end and the second open end in plan view, an end portion ground conductor connected to the first radiating conductor and the second radiating conductor in plan view, and a feed line that feeds the first radiating conductor and the second radiating conductor with power with a predetermined phase difference from each other.
A negative temperature coefficient thermistor that includes: a ceramic base body composed of a ceramic composition containing Mn, Ni, and Fe; and an outer electrode on an end portion of the ceramic base body. The outer electrode includes an underlying layer covering the end portion of the ceramic base body and containing Cu and glass, and a plating layer covering the underlying layer. A Ni content, a Mn content, and a Fe content in the ceramic base body satisfy the following formulae (1) and (2): 26.4 mol %≤[Ni]≤29.5 mol % (1), and 1.65≤[Mn]/[Fe]≤1.90 (2). In the formulae, [Ni], [Mn], and [Fe] represent the Ni content, the Mn content, and the Fe content (mol %), respectively, when a total content of Mn, Ni, and Fe in the ceramic base body is taken as 100 mol %.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
patents
