A field effect transistor includes a source region of a first conductive type on a device layer, a drain region of the first conductive type, a body region of a second conductive type that is opposite to the first conductive type, and a gate electrode on the device layer. The body region is directly below the gate electrode. When the insulating surface is in plan view, the gate electrode and the body region each have a shape elongated in a first direction, the source region is on one side of the gate electrode, and the drain region is on another side of the gate electrode. The field effect transistor further includes a body-contact region of the second conductive type extending from each of a plurality of body-contact connecting portions on an edge of the body region facing the source region toward the source region.
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An insulating layer made of an inorganic insulating material is provided on an upper surface which is one surface of a support substrate made of a polymer or a filler-containing polymer. A circuit formation layer including a semiconductor element is provided on the insulating layer. A lower surface on an opposite side from the upper surface and a side surface of the support substrate are covered with a coating film formed of a material having lower moisture permeability than the support substrate.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
Methods and devices for realizing RF processing paths associated to different frequency bands are presented. According to one aspect, the RF processing paths are provided by a hybrid input LNA RF frontend that includes RF processing paths that are dedicated to specific frequency bands and RF processing paths that are shared between several frequency bands. Sharing of the RF processing paths is provided by an input combiner network and/or a multi-input cascode amplifier that includes a cascode transistor that is coupled to at least two input transistors. Further presented in a toolkit that includes circuit blocks that can be used in specific combinations to customize the RF processing paths to achieve specific performance or cost optimization. A decision tree based on performance and cost priorities assigned to each of the frequency bands is used to provide the specific combinations.
A laminated coil component includes a multilayer body in which a coil, which is obtained by electrically connecting a plurality of coil conductors with a via conductor interposed therebetween, is provided in an inside of an insulator portion which is obtained by laminating a plurality of insulation layers. Each of a first coil conductor and a second coil conductor that are adjacent to each other in a lamination direction and are electrically connected in series with a first via conductor interposed therebetween includes a first main surface that faces the opposite direction to the lamination direction and on which a void exists. The second coil conductor includes a second main surface that faces the lamination direction and on which another void exists, and the other void locally exists on a position opposed to the first via conductor.
A power converter includes a first bridge arm connected between an input power supply and a reference potential, the first bridge arm including a first switch and a second switch connected at a first connection point, a second bridge arm connected in parallel with the first bridge arm between the input power supply and the reference potential, the second bridge arm including a first capacitor and a second capacitor connected at a second connection point, a coupling inductance connected between the first and second connection points, where a center tap of the coupling inductance is connected to a load, and a first resonant inductor connected in series with the coupling inductance between the first and second connection points, the first resonant inductor defining a series resonant circuit with each of the first capacitor and the second capacitor.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/00 - Conversion of DC power input into DC power output
A filter device applied to a radio-frequency circuit includes a dielectric substrate on which a ground electrode is disposed and a main line which has an input end and an output end. The filter device also includes first and second resonators and an intermediate resonator. The main line is disposed to face the ground electrode and extends in a first direction. The first resonator intersects the main line and extends in a second direction. The second resonator intersects the main line and extends in the second direction in a region further to an output end side than the first resonator. At least part of the intermediate resonator is disposed between the first resonator and the second resonator.
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
Squaric acid-based polymers and their use in electrode materials and/or electrolyte compositions, as well as their production processes are described herein. Also described are electrode materials, electrodes, electrolyte compositions, electrochemical cells, electrochemical accumulators, and optoelectronic devices comprising the polymers and their uses.
C08G 65/00 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
G02F 1/1516 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on an electrochromic effect characterised by the electrochromic material, e.g. by the electrodeposited material comprising organic material
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
H01M 10/0565 - Polymeric materials, e.g. gel-type or solid-type
A filter device is provided that includes a substrate; a piezoelectric layer; an acoustic Bragg reflector between the substrate and the piezoelectric layer; and a conductor pattern on a surface of the piezoelectric layer. The conductor pattern includes interdigital transducers (IDTs) of a plurality of resonators, and a plurality of conductors that connect the plurality of resonators in a ladder filter circuit, the plurality of conductors comprising adjacent first and second conductors. Moreover, the piezoelectric layer has an opening between the first and second conductors. A width dp of the opening of the piezoelectric layer is less than a distance dm between the first and second conductors.
An acoustic sensor includes a piezoelectric plate including a conductor plate with first and second surfaces, and a piezoelectric element on the second surface, a cover facing the first surface of the conductor plate, a support substrate facing the second surface of the conductor plate and the piezoelectric element, a first connector including a conductor between the piezoelectric element and the support substrate and electrically connecting the piezoelectric element and the support substrate, a first insulating structure including an insulator between the second surface of the conductor plate and the support substrate at an outer edge of the second surface of the conductor plate, and a second connector including a conductor on an outer edge of the first surface of the conductor plate and electrically connecting the conductor plate and the cover.
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H04R 1/46 - Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/092 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
12.
EPITAXIALLY-GROWN SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
An epitaxially-grown substrate includes: a substrate made of a III-V-group compound semiconductor containing Ga or In as a III-group element; a sacrificial layer epitaxially grown on the substrate; and a semiconductor layer epitaxially grown on the sacrificial layer. The sacrificial layer includes a layer made of a mixed-crystal semiconductor containing Al or In as a III-group element, a composition ratio of Al or In varies in a thickness direction, and a location indicating a local maximum value of the composition ratio of Al or In is positioned inside other than a lower surface and an upper surface of the sacrificial layer.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
H01L 29/36 - Semiconductor bodies characterised by the concentration or distribution of impurities
13.
ELECTROLYTE ADDITIVE, ELECTROLYTE, AND LITHIUM ION SECONDARY BATTERY INCLUDING SAME
Provided is an electrolyte additive, including a compound of formula (1), wherein R1 is selected from a substituted or unsubstituted five-membered heterocyclic group, a substituted or unsubstituted six-membered heterocyclic group, or a substituted or unsubstituted amino group; L is a sulfone group, a sulfate ester group, or a sulfonate ester group; and R2 is selected from a substituted or unsubstituted C1-18 alkyl group, a substituted or unsubstituted C1-18 alkoxy group, a substituted or unsubstituted conjugated five-membered carbocyclic group or heterocyclic group, a substituted or unsubstituted conjugated six-membered carbocyclic group or heterocyclic group, a di(C1-6 alkyl)amino group, a di(C6-12 aryl)amino group, a tri(C1-6 alkyl)silyl group, a substituted or unsubstituted C3-6 alkenyl group, a substituted or unsubstituted C3-6 alkynyl group, or a substituted or unsubstituted ester group. The electrolyte additive, electrolyte, and lithium ion secondary battery comprising same of the present disclosure achieve better protection of electrodes, improve the cycle performance of the battery, and achieve lower post-cycle impedance.
Provided is an electrolyte additive, including a compound of formula (1), wherein R1 is selected from a substituted or unsubstituted five-membered heterocyclic group, a substituted or unsubstituted six-membered heterocyclic group, or a substituted or unsubstituted amino group; L is a sulfone group, a sulfate ester group, or a sulfonate ester group; and R2 is selected from a substituted or unsubstituted C1-18 alkyl group, a substituted or unsubstituted C1-18 alkoxy group, a substituted or unsubstituted conjugated five-membered carbocyclic group or heterocyclic group, a substituted or unsubstituted conjugated six-membered carbocyclic group or heterocyclic group, a di(C1-6 alkyl)amino group, a di(C6-12 aryl)amino group, a tri(C1-6 alkyl)silyl group, a substituted or unsubstituted C3-6 alkenyl group, a substituted or unsubstituted C3-6 alkynyl group, or a substituted or unsubstituted ester group. The electrolyte additive, electrolyte, and lithium ion secondary battery comprising same of the present disclosure achieve better protection of electrodes, improve the cycle performance of the battery, and achieve lower post-cycle impedance.
R1-L-R2 (1)
H01M 10/0567 - Liquid materials characterised by the additives
C07C 305/24 - Esters of sulfuric acids having oxygen atoms of sulfate groups bound to carbon atoms of six-membered aromatic rings of non-condensed six-membered aromatic rings
C07C 307/02 - Monoamides of sulfuric acids or esters thereof, e.g. sulfamic acids
C07C 309/76 - Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton
C07C 311/16 - Sulfonamides having sulfur atoms of sulfonamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atom of at least one of the sulfonamide groups bound to hydrogen atoms or to an acyclic carbon atom
C07C 311/29 - Sulfonamides, the carbon skeleton of the acid part being further substituted by singly-bound oxygen atoms having the sulfur atom of at least one of the sulfonamide groups bound to a carbon atom of a six-membered aromatic ring
C07D 213/71 - Sulfur atoms to which a second hetero atom is attached
C07D 233/60 - Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
A power converter includes a first bridge arm and a second bridge arm connected in parallel between a voltage input terminal and a voltage output terminal, a first winding and an inductor connected in series between first and second nodes, a second winding and a third winding connected in series, a third switch connected between the second winding and a ground, and a fourth switch connected between the third winding and the ground. The first bridge arm includes first and second switches connected in series. The second bridge arm includes first and second capacitors connected in series. The first node is on a path connecting the first switch and the second switch, and the second node is on a path connecting the first capacitor and the second capacitor. The first to third windings define a transformer.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
A film including: particles of a two-dimensional material containing one or plural layers, wherein the one or plural layers comprise a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon or nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n but not more than 5, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom; and a polymer having an anionic functional group and a cationic functional group, wherein a ratio of the polymer to a sum of the particles of the two-dimensional material and the polymer in the film is 5 vol % to 70 vol %.
An acoustic resonator device is provided that includes a piezoelectric layer; and an interdigital transducer (IDT) at a surface of the piezoelectric layer, the IDT comprising interleaved fingers. At least one interleaved finger of the interleaved fingers comprises a first layer and a second layer over the first layer, wherein the first layer is between the piezoelectric layer and the second layer. Moreover, a shape of the second layer varies with respect to at least one other interleaved finger of the interleaved fingers. A thickness of the first layer is less than a thickness of the second layer.
A capacitor element that includes: a capacitor portion including an anode plate including a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a sealing layer covering the capacitor portion; conductive interconnect layers on the sealing layer; and an outer insulating layer covering the sealing layer and the conductive interconnect layers. In a plan view from a thickness direction of the anode plate, a center-to-center distance between a first anode through conductor and a first cathode through conductor is equivalent to a center-to-center distance between the first anode through conductor and a second cathode through conductor, and a center-to-center distance between a fifth cathode through conductor and the first cathode through conductor is equivalent to a center-to-center distance between the fifth cathode through conductor and the second cathode through conductor.
A three-dimensional (3D) package includes one or more frames, circuit assemblies, and an encapsulating material to encapsulate at least a part of the one or more frames and the circuit assemblies. The one or more frames each include one or more supporting portions and conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween. Circuit assemblies are each mounted in one assembly mounting space and electrically attached to corresponding one or more of the first and second conductive connecting portions.
H01L 23/04 - ContainersSeals characterised by the shape
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
A radio frequency circuit includes: a first output terminal; a second output terminal; a first low-noise amplifier; a second low-noise amplifier; a first filter connected between an output end of the first low-noise amplifier and the first output terminal, the first filter having a passband that includes at least a portion of a first band; and a second filter connected between the output end of the first low-noise amplifier and the second output terminal, the second filter having a passband that includes at least a portion of a second band. The second low-noise amplifier is connected between the second filter and the second output terminal, and the first band and the second band are a combination of bands usable in dual connectivity.
H04B 1/10 - Means associated with receiver for limiting or suppressing noise or interference
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
20.
SECONDARY BATTERY AND METHOD FOR MANUFACTURING SECONDARY BATTERY
A secondary battery of the present disclosure includes a stacked electrode assembly in which a plurality of positive electrodes and a plurality of negative electrodes are alternately stacked with a separator interposed therebetween. The positive electrodes include a positive electrode metal current collector, a positive electrode active material layer stacked on the positive electrode metal current collector, and an adhesive layer adhering to the separator. A region of the positive electrode metal current collector where the positive electrode active material layer is not stacked forms a positive electrode metal current collector exposed portion. An edge portion of the positive electrode active material layer includes a first edge portion adjacent to the positive electrode metal current collector exposed portion and a second edge portion disposed on a side opposite to the first edge portion when viewed from a stacking direction in which the positive electrode and the negative electrode are stacked. The adhesive layer includes a first adhesive layer stacked on the positive electrode metal current collector exposed portion and extending along the first edge portion, and a second adhesive layer extending along the second edge portion.
A secondary battery having higher operation reliability is provided. The secondary battery includes an electrode wound body, a first tape, a second tape, and a third tape. The electrode wound body has a first end face and a second end face that are opposed to each other in a first direction, and a side surface coupling the first end face and the second end face to each other. The first tape covers a first side surface part, of the side surface of the electrode wound body, that is positioned on a side of the first end face. The second tape covers a second side surface part, of the side surface of the electrode wound body, that is positioned on a side of the second end face. The third tape covers a third side surface part, of the side surface of the electrode wound body, that is positioned between the first side surface part and the second side surface part. The third tape has an elongation percentage higher than both an elongation percentage of the first tape and an elongation percentage of the second tape.
H01M 10/04 - Construction or manufacture in general
H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
22.
LOW LOSS REFLECTIVE PASSIVE PHASE SHIFTER USING TIME DELAY ELEMENT WITH DOUBLE RESOLUTION
A phase shifter for altering the phase of a radio frequency signal is disclosed herein. A Lange coupler is used having reflective ports that are coupled to artificial transmission lines. The artificial transmission lines provide a reflection transmission path, the length of which can be determined by digital control lines. Transistors placed along the length of the central trace provide independent paths to ground that serve to shorten the electrical length of the ATL. Accordingly, by selectively turning the transistors on/off, the electrical length of the ATL can be selected and thus the amount of phase delay introduced by the phase shifter.
A coil component is capable of reducing specific resistance of a coil and reliably mitigating stress. A coil component includes a base body and a coil disposed in the base body. The base body includes a plurality of magnetic layers laminated in a first direction. The coil includes a plurality of coil wires laminated in the first direction. The coil wires extend along a plane orthogonal to the first direction. Each of the coil wires includes a first coil conductor layer and a second coil conductor layer laminated in the first direction. Specific resistance of the first coil conductor layer is smaller than specific resistance of the second coil conductor layer. Also, in a section orthogonal to an extending direction of each of the coil wires, the second coil conductor layer is adjacent to one side of the first coil conductor layer in the first direction, and a cavity portion is disposed in at least a part between the first coil conductor layer and one of the magnetic layers adjacent to another side of the first coil conductor layer in the first direction.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A power converter includes a first bridge arm including a first switch and a second switch connected in series such that the first switch is connected to the second switch to define a first connection point, a second bridge arm including a third switch and a fourth switch connected in series such that the third switch is connected to the fourth switch to define a second connection point, a first LC resonant cavity connected between the first connection point and the second connection point, a first rectifier and a second rectifier including switches, and a coupling inductance connected to the second switch, the third switch, the first rectifier and the second rectifier respectively, such that a center tap of the coupling inductance is connected to a load.
H02M 7/219 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only in a bridge configuration
An inductor component including an element body, a coil in the element body, and first and second outer electrodes that are at the element body and are electrically coupled to the coil. The coil includes a winding portion spirally wound along an axis direction. The coil includes the winding portion, and first and second extended wirings that couple one end and the other end of the winding portion to the first and second outer electrodes, respectively, at least one of the first and second outer electrodes includes an embedded portion embedded in the element body, at least one of the first and second extended wirings includes a coupling portion coupled to the winding portion and a curved portion curved from the coupling portion toward the embedded portion. In a view from the axial direction, the curved portion has a recessed shape.
A switching power supply device includes a passive EMI filter including capacitors coupled to an output terminal of the passive EMI filter and a ground, a first soft switching converter coupled to the passive EMI filter output terminal and the ground, including a primary side switching circuit coupled to the passive EMI filter output terminal, an isolation transformer including a primary winding coupled to the primary side switching circuit and a secondary winding, and a rectification circuit coupled to the secondary winding and an output terminal of the switching power supply device, and including a rectifier, and a first common-mode noise reduction path coupled between a node coupling the capacitor and the passive EMI filter output terminal and a node coupling a homonymous end of the secondary winding and the rectifier. The first common-mode noise reduction path includes an impedance.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
A stretchable device that includes: a stretchable substrate having a main surface; an electronic component on the main surface of the stretchable substrate; a first stretchable wiring connected to the electronic component; and a second stretchable wiring connected to the first stretchable wiring. A first end portion in an extending direction of the first stretchable wiring is connected to the electronic component, and a second end portion in the extending direction of the first stretchable wiring is connected to a third end portion in the extending direction of the second stretchable wiring.
A distal-end structure of an endoscope includes an image sensor disposed in a distal-end portion of an insertion portion of the endoscope elongated in an axial direction D1. The image sensor is directed in the axial direction D1 toward a distal end of the insertion portion and is configured to capture an image. A light-emitting device is disposed in the distal-end portion and configured to emit light in the axial direction D1 toward the distal end. A connection member is disposed inside the distal-end portion and in which the image sensor and the light-emitting device are mounted. Wires are connected to the connection member. The wires supply electricity for driving the image sensor and the light-emitting device from outside the endoscope, transmit driving signals, and also transmit captured image data to a control unit.
A battery unit is provided and includes a battery and a wiring unit. The battery includes an outer package can that includes a first surface on which a first electrode terminal is exposed, a second surface on which a second electrode terminal is exposed, and a side surface coupling the first surface and the second surface to each other. The second surface is disposed on a side opposite to the first surface. The wiring unit includes a first coupling terminal to be welded to the first electrode terminal, a second coupling terminal to be welded to the second electrode terminal, and a flexible wiring substrate. The flexible wiring substrate includes a first support part, a second support part, a middle part, a first wire, and a second wire. The first support part supports the first coupling terminal. The second support part supports the second coupling terminal. The middle part couples the first support part and the second support part to each other. The first wire extends from the first coupling terminal, through the first support part, to the middle part. The second wire extends from the second coupling terminal, through the second support part, to the middle part.
A first radiation conductor layer is provided in a multilayer body. A second radiation conductor layer is provided in or on the multilayer body, is located above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in an up-down direction. A first floating conductor has a shape surrounding at least a part of a periphery of the first radiation conductor layer when viewed in the up-down direction, is located on a same layer as or above the first radiation conductor layer and on a same layer as or below the second radiation conductor layer in the up-down direction, and is not electrically connected to any conductor present in or on the multilayer body. A second floating conductor has a shape surrounding at least a part of a periphery of the second radiation conductor layer.
A plating apparatus includes a plating bath in which a plating solution including plating targets is stored and an injector that is in the plating bath and that injects the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. The injector has an inner cylindrical shape including a bottom surface extending in a horizontal direction, an inner wall extending in a height direction from the bottom surface, and an opening defined in an upper end of the inner wall. The opening is a first injection port that injects the plating solution to the plating bath. A mesh portion is provided at the first injection port. A second injection port that injects the plating solution to the injector is provided in the bottom surface.
An RFID module is provided that includes a substrate having a first main surface and a second main surface, an RFIC chip disposed on the first main surface of the substrate, and a coil element having a conductive wire having a plurality of windings. A first end of the RFIC chip is electrically connected to a first end of the coil element. A second end of the RFIC chip is electrically connected to a second end of the coil element. The coil element has at least one sparsely wound portion, and both ends of the coil element are first densely wound portions in which the conductive wire is wound at a narrower pitch than the pitch in the sparsely wound portion.
An electronic component includes a base body and a glass film covering an outer surface of the base body. The glass film has a groove extending on an outer surface of the glass film. The groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. The bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. In addition, the bottom portion of the groove has an arc shape in the specific section.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
Circuits and methods for achieving good amplifier AM-AM and AM-PM metrics while achieving good power, PAE, linearity, and EVM performance. Embodiments compensate for a non-linear distortion profile (e.g., an AM-PM and/or AM-AM profile) in an amplifier by pre-processing an input signal, such as a radio-frequency signal, to alter the non-linear distortion profile of the input signal so as to compensate for the non-linear distortion profile imposed by a coupled device, such as an amplifier. An inventive aspect includes linearizing an output from an amplifier having a first non-linear distortion profile, including passing an input signal having a second non-linear distortion profile through a reflective hybrid coupler to a non-linear termination circuit, and reflecting a modified input signal from the non-linear termination circuit back through the reflective hybrid coupler as an output signal, the output signal having a third non-linear distortion profile shaped to compensate for the first non-linear distortion profile.
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and first and second inner electrode layers. The first inner electrode layers include first counter electrode portions facing the second inner electrode layers and first extended portions extending from the first counter electrode portions to a first end surface. The second inner electrode layers include a second counter electrode portions opposing the first inner electrode layers and second extended portions extending from the second counter electrode portions to a first side surface. The first extended portions include a first connection portion connected to straddle at least two or more of the first extended portions in the lamination direction, between the first extended portions, and the second extended portions include a second connection portion connected to straddle at least two or more of the second extended portions in the lamination direction, between the second extended portions.
An acoustic wave device includes a piezoelectric layer, a first comb-shaped electrode on the piezoelectric layer, including a first busbar and first electrode fingers, and connected to an input potential, a second comb-shaped electrode on the piezoelectric layer, including a second busbar and second electrode fingers interdigitated with the first electrode fingers, and connected to an output potential, and a reference potential electrode connected to a reference potential and including third electrode fingers on the piezoelectric layer aligned with the first and second electrode fingers, and a connection electrode connecting adjacent third electrode fingers. An order in which a first electrode finger, a second electrode finger, and a third electrode finger are arranged is such that, starting from the first electrode finger, the first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger define one period.
Disclosed embodiments may include systems and methods of a permanent magnet (PM) hybrid core inductor and fabrication methods thereof. The permanent magnet hybrid core may include a first set of members comprising a soft magnetic material, the first set of members forming a first gap between two end faces of the first set of members, and a second set of members comprising a permanent magnetic material and located adjacent to the first set of members, wherein the second set of members provides at least a partially parallel path to the first set of members for flow of magnetic flux lines. Some embodiments may include an inductor comprising the permanent magnet hybrid core, or a power conversion circuit including a switched capacitor circuit and a switching regulator, the switching regulator including an inductance, the inductance comprising an electrical conductor wound around a permanent magnet hybrid core.
An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.
H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
C03C 1/00 - Ingredients generally applicable to manufacture of glasses, glazes or vitreous enamels
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
A radio frequency circuit supports a first power class and a second power class whose maximum output power is lower than that of the first power class, and includes: a first power amplifier; and a variable load matching circuit connected to an output end of the first power amplifier. Under a condition that the first power class is applied, a first power supply voltage is supplied to the first power amplifier, and a load impedance viewed from the first power amplifier is adjusted to a first impedance by the variable load matching circuit. Under a condition that the second power class is applied, a second power supply voltage is supplied to the first power amplifier, and the load impedance viewed from the first power amplifier is adjusted to a second impedance by the variable load matching circuit.
A stretchable device that includes: a stretchable substrate that has a first main surface and a second main surface and is stretchable, wherein the first main surface includes a first region and a second region, and the stretchable substrate is in a folded back configuration such that the first main surface is in an inner side of the stretchable device; and an electronic component on the first main surface of the stretchable substrate.
A coil component comprises a first wire including a winding portion wound around a winding core portion of a core, a first end portion electrically connected to a terminal electrode provided in a first flange portion, and a first extended portion connecting the winding portion and the first end portion. In a first direction, the first end portion is positioned on a first side with respect to a central axis of the winding core portion, and a first boundary portion which is a boundary portion between the first extended portion and the winding portion is positioned on a second side with respect to the central axis. A corner of the winding core portion is positioned between the first boundary portion and the first end portion in a circumferential direction. A gap is interposed between the first extended portion and the corner.
The secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes a negative electrode active material layer. The negative electrode active material layer includes an alkali metal carbonic acid compound and a magnesium compound. The alkali metal carbonic acid compound has a carbonate bond (—OC(═O)O—), and includes an alkali metal element as a constituent element. The magnesium compound includes magnesium as a constituent element.
A plating apparatus includes a plating bath storing a plating solution and plating targets, and an injector in the plating bath. The injector includes a first injection port to inject the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. A mesh portion is provided at the first injection port. The mesh portion is defined by at least two stacked meshes. The mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. The circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. The central portion is defined by a plurality of layers of the mesh. A number of layers of the mesh in the central portion is greater than that of the circumferential portion.
A plating apparatus includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an insulating material, and a second electrode. The metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe.
An electronic component is provided that includes a substrate, an insulator layer, an inductor in the insulator layer, planar conductors extending along the substrate, and connecting conductors electrically connected to the planar conductors. The inductor includes surface direction conductors and a plurality of inductor via conductors that connect the surface direction conductors. A direction of a current flowing through an inductor via conductor among the plurality of inductor via conductors configuring a portion of a helical coil having a winding axis along the surface of the substrate, the inductor via conductor being adjacent to the connecting conductors, and a direction of a current flowing through the connecting conductors are opposite to each other.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
A multilayer ceramic capacitor includes a multilayer body and external electrodes, which each include a base electrode layer, an electrically conductive resin layer, and a plated layer. The electrically conductive resin layer at a ridge portion of the multilayer body has a film thickness of about 0.8 μm or more and about 8 μm or less. The electrically conductive resin layer includes a peeling region separating from the multilayer body at least one extending portion. The peeling region extends from an end portion of the electrically conductive resin layer adjacent to a middle of the multilayer body in a length direction to before an end of the base electrode layer adjacent to the middle of the multilayer body in the length direction. The peeling region has a dimension of about 5 μm or more in the length direction.
A battery is provided and includes a battery assembly; an exterior body that has an opening at one end and houses the battery assembly; and a safety valve disposed at the opening, in which the safety valve includes an inner terminal positioned relatively inside and an outer terminal positioned relatively outside, the inner terminal includes an annular-in-plan-view thinned part located on an inner peripheral side with respect to an opening end of the opening, and is electrically connected to the battery assembly on an outer peripheral side with respect to the thinned part, and the outer terminal is fixed to the inner terminal in a state of being elastically deformed toward the inside of the exterior body on an inner peripheral side with respect to the thinned part, and is electrically connected to each other.
H01M 50/358 - External gas exhaust passages located on the battery cover or case
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
A battery is provided and including a safety valve, in which the safety valve includes a first metal member positioned on an outer side, a second metal member positioned on an inner side, and an insulating member positioned between the first metal member and the second metal member, the first metal member and the second metal member are connected to each other so as to straddle the insulating member, and the first metal member has a stepped part including a thin portion having a thickness relatively reduced as compared with other portions.
A filter device is provided that includes series resonator connected between a pair of ports; shunt resonators connected between a ground connection and a node between one or more of series resonator and one of the pair of ports; and inductors that are connected between the ground connection and the shunt resonators, respectively. The inductors have staggered inductance values that are different from each other. Each of the resonators includes a substrate, a piezoelectric layer attached either directly or via one or more intermediate layers to the substrate, and an interdigital transducer (IDT) on a surface of the piezoelectric layer and that includes interleaved IDT fingers extending from first and second busbars, respectively.
A device includes a cap wafer with a sealing region surrounding a gap-control region, and a structure wafer with a corresponding sealing region and gap-control region. The cap wafer has top and bottom surfaces, defining an xy-plane, and a vertical z-direction perpendicular to this plane. The structure wafer is similarly oriented, with its top surface parallel to the xy-plane. The cap wafer and structure wafer are bonded by a eutectic seal connecting their sealing regions, ensuring alignment of their gap-control regions along the z-axis. The device also includes a metal layer located on the bottom surface of the cap wafer in its gap-control region, and the structure wafer features a standoff protruding from its top surface within its gap-control region, extending along the z-direction to contact the metal layer.
A device is provided that includes a stator including a stator element and a row of stator comb fingers, wherein the stator comb fingers extend away from the stator element in a y-direction. A device may include a rotor including a rotor element and a row of rotor comb fingers, wherein the rotor comb fingers extend away from the rotor element in a direction which is opposite to the y-direction, and wherein the stator comb fingers are interdigitated with the rotor comb fingers, and form an interdigitated row, and each pair of adjacent stator comb finger and rotor comb finger are separated from each other by a x-gap in a x-direction, which is perpendicular to the y-direction.
In a high-frequency module, a first chip includes one of a plurality of first acoustic wave resonators of a first filter a mounting substrate. A second chip includes one of a plurality of second acoustic wave resonators of a second filter. The second chip is on a side of the first chip opposite to the mounting substrate side. The first chip has a first main surface on the second chip side and a second main surface on the mounting substrate side. The second chip includes a third main surface on the first chip side and a fourth main surface on a side opposite to the first chip side. A first circuit element related to the first filter is on the second main surface side of the first chip. A second circuit element related to the second filter is disposed on the fourth main surface side of the second chip.
An acoustic wave device includes a first acoustic wave filter, a first conductor portion between the first acoustic wave filter and a second acoustic wave filter and connected to a second functional conductor portion of the second acoustic wave filter. The first acoustic wave filter includes a signal electrode on a second main surface of a first piezoelectric substrate and connected to the first conductor portion, a ground electrode on the second main surface of the first piezoelectric substrate, and a second conductor portion connected to the ground electrode. The ground electrode overlaps a first functional conductor portion and does not overlap the signal electrode in a thickness direction of the first piezoelectric substrate. The second conductor portion is located between first and second main surfaces of the first piezoelectric substrate and spaced apart from the first main surface.
A first portion and a second portion are connected to a first surface of a connection portion having the first surface and a second surface opposite to the first surface. A first radiating element is disposed on the first portion, and a second radiating element is disposed on the second portion. The connection portion includes a first flat board portion, a bent portion extending from the first flat board portion, and bent to have the first surface facing outward, and a second flat board portion further extended from the bent portion.
A radio frequency circuit includes a filter with a pass band including at least a part of a band (A) for TDD; a filter with a pass band including at least a part of the band (A); and a switch circuit that has (i) a first mode in which the filter is connected between an antenna connection terminal and a radio frequency input terminal, (ii) a second mode in which the filter is connected between the antenna connection terminal and a radio frequency output terminal, and (iii) a third mode in which the filters are connected in series between the antenna connection terminal and the radio frequency input terminal or between the antenna connection terminal and the radio frequency output terminal.
An acoustic wave device includes a piezoelectric substrate including a piezoelectric layer with first and second main surfaces, and a support on the second main surface, a first comb-shaped electrode on the first main surface including a first busbar and first electrode fingers connected to the first busbar and being connected to an input potential, a second comb-shaped electrode on the first main surface including a second busbar and second electrode fingers connected to the second busbar and interdigitated with the first electrode fingers, and connected to an output potential, and a reference potential electrode connected to a reference potential and including third electrode fingers on the first main surface and aligned with the first and second electrode fingers, connection electrodes connected to the third electrode fingers, respectively, and a third busbar electrically connected to the third electrode fingers by the connection electrodes.
A resonance device includes a resonator including a vibration part, a frame disposed at at least a part of a circumference of the vibration part, and a supporting arm connecting the vibration part to the frame; and a first substrate including a first bottom plate configured to have a first gap from o the vibration part in a thickness direction, a first side wall, and a first limiting part having a first distance to the resonator in the thickness direction smaller than a second distance between the resonator and the first bottom plate. The first limiting part includes a first tip-end with a first metal film facing the resonator in the thickness direction. The first metal film is configured as a first getter that maintains a vacuum of a vibration space in the resonance device.
An acoustic wave device includes a piezoelectric layer, at least one pair of electrodes, and a protective film. The piezoelectric layer includes first and second major surfaces opposing each other in a first direction. The at least one pair of electrodes are on at least one of the first and second major surfaces. The protective film covers at least a portion of the pair of electrodes. The protective film includes a first-component insulative film including a first component and in contact with the pair of electrodes, and a second-component insulative film including a second component and located at the surface layer of the protective film. The first-component insulative film has a higher moisture resistance than the second-component insulative film. The second-component insulative film has a higher plasma resistance than the first-component insulative film.
An acoustic wave device includes a piezoelectric layer, first and second comb-shaped electrodes respectively including first and second electrode fingers, and a reference potential electrode including third electrode fingers. An order in which the first, second, and third electrode fingers are arranged is the first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger and defines one period. A pair of reflectors sandwich a region where the first electrode finger, the second electrode finger, and the third electrode finger are provided in an electrode finger orthogonal direction.
A battery is provided and including a safety valve, in which the safety valve includes a first metal member positioned on an outer side, a second metal member positioned on an inner side, and an insulating member positioned between the first metal member and the second metal member, the first metal member and the second metal member are connected to each other so as to straddle the insulating member, and the second metal member is provided with a groove in a sectional view, the groove has at least two corner portions inside the groove in the sectional view, and shapes of the two corner portions are different from each other.
H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
A secondary battery is provided and includes a first pole and a second pole both wound along a prescribed direction. A first current collector of the first pole has a first protrusion protruding along the prescribed direction and not overlapping a first active material layer of the first pole. A second current collector of the second pole has a second protrusion protruding along an orthogonal direction orthogonal to the prescribed direction and not overlapping a second active material layer of the second pole. The first tab is electrically connected to the first protrusion. The second tab is electrically connected to the second protrusion.
A secondary battery is provided and includes a positive electrode, a negative electrode, a separator, an adhesive layer provided on a principal face of the separator, and an electrolytic solution. The adhesive layer contains a water-soluble binder. With a region where the positive electrode, the negative electrode, and the separator are stacked and overlapped being defined as an electrode body region, the positive electrode and the negative electrode respectively have a positive electrode terminal and a negative electrode terminal that are portions protruding from the electrode body region in plan view in the first direction. The positive electrode terminal and the negative electrode terminal are located on the same side with respect to the geometric center of the electrode body region. When a region overlapping a shortest path in the electrode body region from a first boundary where the positive electrode terminal is connected to the electrode body region to a second boundary where the negative electrode terminal is connected to the electrode body region is defined as a first measurement region, and a region that is point-symmetric to the first measurement region about a geometric center of the electrode body region and has an area equal to that of the first measurement region is defined as a second measurement region, and where an area proportion occupied by the adhesive layer in the first measurement region is denoted by A and an area proportion occupied by the adhesive layer in the second measurement region is denoted by B, 1.1≤A/B≤1.5.
H01M 50/489 - Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
A secondary battery is provided and includes a first electrode wound body, a second electrode wound body, and an outer package body. The outer package body contains the first electrode wound body and the second electrode wound body. Each of the first electrode wound body and the second electrode wound body includes, at respective ends of a stacked body in a width direction, a first end face at which a first electrode is exposed and a second end face at which a second electrode is exposed. The first electrode wound body and the second electrode wound body are disposed adjacent to each other in the width direction of the stacked body, with the first end face of the first electrode wound body and the first end face of the second electrode wound body being opposed to each other.
H01M 10/04 - Construction or manufacture in general
H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
H01M 50/152 - Lids or covers characterised by their shape for cells having curved cross-section, e.g. round or elliptic
H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
A battery is provided and including an exterior body that houses a battery assembly and an electrolyte, and a safety valve attached to the exterior body, wherein the battery assembly includes a positive electrode, a negative electrode, and a separator, the exterior body includes a cylindrical portion, a support portion protruding inward from the cylindrical portion at one end portion of the cylindrical portion, and an opening surrounded by the support portion, the safety valve is positioned at the one end portion of the cylindrical portion, and the safety valve and the support portion are fixed to each other with a thermoplastic resin layer interposed therebetween.
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
A filter includes an acoustic wave resonator including a piezoelectric substrate and an IDT electrode. The piezoelectric substrate includes a piezoelectric layer, a low acoustic velocity layer, and a high acoustic velocity layer. An intersection region of the IDT electrode includes a central region and an edge region. The IDT electrode includes a mass addition film in the edge region. A duty of the IDT electrode and a cut-angle θ° of the piezoelectric layer satisfy any one or more of 0.513≤D≤0.568 and 2.5≤θ≤17.5, 0.538≤D≤0.568 and 17.5≤θ≤22.5, 0.538≤D≤0.588 and 42.5≤θ≤52.5, 0.538≤D≤0.613 and 52.5≤θ≤67.5, 0.513≤D≤0.638 and 67.5≤θ≤77.5, and 0.513≤D≤0.713 and 77.5≤θ≤92.5.
A battery is provided and including a battery element having a first outer end surface and a second outer end surface; and an exterior body having a cylindrical shape, having a first inner end surface to face the first outer end surface, and housing the battery element, in which the exterior body has a first inner diameter φ1 at a position 4 mm distant from the first inner end surface toward the second outer end surface; the exterior body has a second inner diameter φ2 at a position 7 mm distant from the second outer end surface of the battery element toward the first outer end surface; and the first inner diameter φ1 is 0.24 to 0.72% smaller than the second inner diameter φ2.
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
An acoustic resonator is provided that includes an interdigital transducer (IDT) at a surface of at least one piezoelectric layer, the IDT including interleaved IDT fingers extending from first and second busbars respectively. Moreover, a ratio of a thickness of the IDT fingers to a thickness of the at least one piezoelectric layer is optimized to minimize unwanted spurs. The mark to pitch ratio of the IDT fingers may also be optimized to minimize spurs during operation.
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An inductor including a component main body having a multilayer structure formed with stacked non-conductive material layers; and a coil inside the component main body and configured of line conductors each extending along an interface between the non-conductive material layers and via conductors penetrating through the non-conductive material layers to a thickness direction. The line conductors each have pad portions connected to the via conductors and line wire portions connected to the pad portions. The coil has a shape of extending along a helical path with the line conductors and the via conductors alternately connected, in which the via conductors include a longitudinal via conductor in a longitudinal shape extending along the line conductor. The pad portions include a longitudinal pad portion connected to the longitudinal via conductor, and a width-direction dimension of the longitudinal pad portion is larger than a width-direction dimension of the line wire portion.
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The positive electrode includes a positive electrode current collector and first and second positive electrode active material layers. Each of the first and second positive electrode active material layers includes a first thin part and a first thick part having a thickness greater than that of the first thin part and being adjacent to the first thin part in a longitudinal direction. A position of a first border between the first thin part of the first positive electrode active material layer and the first thick part of the first positive electrode active material layer and a position of a second border between the first thin part of the second positive electrode active material layer and the first thick part of the second positive electrode active material layer are different from each other.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
A power supply device includes an input terminal to which a direct-current power supply can be connected, an output terminal, a power converter circuit, a first switch placed between the input terminal and a power converter circuit, a second switch placed between the power converter circuit and the output terminal, and a controller configured to control the first switch and the second switch to switch between an on-state and an off-state. For cutting off an electrical connection between the input terminal and the output terminal, the controller is configured to switch the first switch into an off-state and thereafter switch the second switch into an off-state.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A substrate and a chip device mounted on a main surface of the substrate are provided. The chip device is provided with a first differential amplifier including a first carrier amplifier and a second carrier amplifier, and a second differential amplifier including a first peak amplifier and a second peak amplifier. In the chip device, the first carrier amplifier and the second carrier amplifier are disposed side by side in a first direction, the first carrier amplifier and the first peak amplifier are disposed side by side in a second direction different from the first direction, the first peak amplifier and the second peak amplifier are disposed side by side in the first direction, and the second carrier amplifier and the second peak amplifier are disposed side by side in the second direction.
A secondary battery includes a stacked body including a positive electrode, a negative electrode, and a separator. The positive electrode includes a positive electrode active material layer, a positive electrode current collector, and an insulating layer. The positive electrode current collector includes a positive electrode covered region and a positive electrode exposed region. The positive electrode exposed region is not covered with the positive electrode active material layer and extends in a width direction from the positive electrode active material layer. The insulating layer extends along a first edge of the positive electrode active material layer. The first edge is located at a border between the positive electrode covered region and the positive electrode exposed region. The positive electrode active material layer includes a first thin part and a first thick part that is adjacent to the first thin part in the width direction.
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
73.
SECONDARY BATTERY-USE ELECTROLYTIC SOLUTION AND SECONDARY BATTERY
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution, and the electrolytic solution contains a phenyl isothiocyanate compound represented by Formula (1).
A cognitive function assessment device includes a brain signal detection part, a response motion detection part, and a computation part. The brain signal detection part detects a brain signal of a subject occurring in response to a stimulus. The response motion detection part detects a response motion of the subject occurring in response to the stimulus and outputs a response signal. The computation part detects an event-related potential and a motor readiness potential from the brain signal, calculates a response speed from the response signal, and assesses cognitive function on the basis of the event-related potential, the motor readiness potential, and the response speed.
G16H 50/30 - ICT specially adapted for medical diagnosis, medical simulation or medical data miningICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for calculating health indicesICT specially adapted for medical diagnosis, medical simulation or medical data miningICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for individual health risk assessment
75.
SOLIDLY-MOUNTED TRANSVERSELY-EXCITED FILM BULK ACOUSTIC DEVICE
Resonator and filter devices and methods of fabrication. A resonator chip includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between the substrate and a back surface of the piezoelectric plate. A conductor pattern on a surface of the piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The acoustic Bragg reflector is configured to reflect the shear primary acoustic mode. An interposer has a second plurality of contact pads on a back surface. A seal connects a perimeter of the piezoelectric plate to a perimeter of the interposer. Each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
A capacitor element that includes: a capacitor part including: an anode plate having a core and a porous part on at least one major face of the core, a dielectric layer on a surface of the porous part, and a cathode layer on a surface of the dielectric layer; and a sealing layer that seals the capacitor part, wherein a surface of the sealing layer has a slit.
A stretchable wiring board that includes: a stretchable substrate having a first main surface and a second main surface facing each other in a thickness direction; a wiring member on at least the first main surface side of the stretchable substrate and including at least one stretchable wiring extending in a plane direction including a length direction orthogonal to the thickness direction and a width direction orthogonal to the thickness direction and the length direction; a protective member covering at least one of the first main surface and the second main surface of the stretchable substrate; and a film member on at least one of the stretchable substrate side and a side opposite to the stretchable substrate with respect to the protective member, wherein the film member is constructed such that an appearance of the film member is irreversibly changed when the film member is stretched in the length direction.
A multilayer ceramic capacitor includes dielectric layers including at least Ti, a region in a center portion in a width direction and a lamination direction of the dielectric layers with a dimension in the width direction of about 800 nm and a dimension in the lamination direction of about 1 nm is divided into 800 cells with a size of a dimension in the width direction of about 1 nm and a dimension in the lamination direction of about 1 nm. When a cell in which a mole ratio of rare earths is about 5 mol % or more with respect to 100 mol of Ti is a high concentration cell, about 75% or more and less than about 100% of the 800 cells in the region are high concentration cells.
A multilayer ceramic electronic component includes a multilayer body, first and second outer electrodes respectively extending from first and second end surfaces of the multilayer body to each of first and second main surfaces. The first outer electrode includes a first main surface inclined portion extending from the first main surface side of the multilayer body to the first end surface side. The second outer electrode includes a second main surface inclined portion extending from the first main surface side of the multilayer body to the second end surface side. The first main surface inclined portion covers a ridge portion defined by the first main surface and the first end surface of the multilayer body. The second main surface inclined portion covers a ridge portion defined by the first main surface and the second end surface of the multilayer body.
A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A capacitor element that includes: a capacitor part including: an anode plate having a core and a porous part on at least one major face of the core, a dielectric layer on a surface of the porous part, and a cathode layer on a surface of the dielectric layer; a sealing layer that seals the capacitor part; and an insulating layer inside the sealing layer at a position where the insulating layer does not contact the cathode layer, wherein the insulating layer has a Young's modulus lower than a Young's modulus of the sealing layer.
An analysis method includes: calculating dynamical behavior of a series of atoms included in a constituent component of an electrolytic solution by performing a molecular dynamics calculation regarding the electrolytic solution; calculating a first dielectric relaxation spectrum signal of the constituent component, based on the dynamical behavior of the series of atoms; calculating a second dielectric relaxation spectrum signal of the electrolytic solution, based on the first dielectric relaxation spectrum signal; and calculating a physical property value unique to the constituent component, based on the first dielectric relaxation spectrum signal and the second dielectric relaxation spectrum signal.
G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
G01N 27/06 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
83.
SECONDARY BATTERY, METHOD OF MANUFACTURING THE SAME, AND BATTERY PACK
A secondary battery having higher reliability is provided. The secondary battery includes an electrode wound body, a first electrode current collector plate, and a second electrode current collector plate. The electrode wound body includes a stacked body including a first electrode and a second electrode that are stacked with a separator interposed therebetween. The stacked body is wound around a central axis extending in a first direction. The electrode wound body includes a first end face and a second end face that are opposed to each other in the first direction. The first electrode current collector plate faces the first end face of the electrode wound body and is coupled to the first electrode. The second electrode current collector plate faces the second end face of the electrode wound body and is coupled to the second electrode. The first electrode includes a first electrode covered region in which a first electrode current collector is covered with a first electrode active material layer, and a first electrode exposed region in which the first electrode current collector is exposed without being covered with the first electrode active material layer. The first electrode exposed region includes multiple first edge parts that are adjacent to each other in a radial direction of the electrode wound body. The multiple first edge parts are bent toward the central axis and overlap each other to form the first end face. The multiple first edge parts each have an end including a first curved face.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 4/02 - Electrodes composed of, or comprising, active material
A negative electrode active material includes a first negative electrode active material particle, and the first negative electrode active material includes a silicon-based material. A Si2p spectrum obtained by measuring the first negative electrode active material particle in a state of 0.6 V (vs. Li/Li+) by X-ray photoelectron spectroscopy has a peak in a range from 99.0 eV to 105.0 eV, and a half width of the peak is 1.5 eV or more and 8.0 eV or less.
A clamping circuit is connected between a ground potential and a node through which a radio frequency signal passes. The clamping circuit includes multiple clamping elements that are cascaded. Each of the multiple clamping elements becomes conductive when a voltage greater than or equal to a forward voltage is applied thereto. At least one of the multiple clamping elements is implemented by a resistor-connected transistor that includes a bipolar transistor and a base-collector resistance element connected between the base and the collector of the bipolar transistor.
A radio-frequency circuit includes a power amplifier configured to output a first maximum transmit power, a power amplifier configured to output a second maximum transmit power that is higher than the first maximum transmit power, a filter having a pass band that includes a band A, a filter having a pass band that includes a band B different from the band A, a switch coupled between the power amplifier and the filter and between the power amplifier and the filter, and a switch coupled between the switch and the filter and between the power amplifier and the filter.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
An acoustic wave device includes a support substrate a silicon oxide layer on the support substrate, a lithium niobate layer on the silicon oxide layer, and an IDT electrode on the lithium niobate layer. When a wavelength of the IDT electrode is denoted as λ, a thickness of the silicon oxide layer is more than or equal to about 0λ. Values of TIDT, ρ, duty, LNcut, TLN, and TSiO2 are within ranges that enable BW derived from Formula 1 to be about 12% or less and ksaw2 derived from Formula 2 to be about 0.1% or less.
A device is provided that includes a stator core having a molded body of magnetic powder that includes an annular yoke extending circumferentially and a tooth protruding radially from the yoke's inner surface. The device further includes a coil that includes a winding wire wound around the tooth. A terminal plate is fixed to the axial end surface of the yoke and includes a plate portion and a terminal portion. The plate portion features a first main surface on the side of the yoke's end surface and a second main surface on the opposite side. The terminal portion extends axially from the second main surface. One end of the winding wire is fixed to the terminal portion by being bound around it. This configuration facilitates electrical connection and structural integration within the stator core.
A capsule medication device is provided that includes a housing having a capsule shape, a substrate disposed inside the housing, a power receiving coil on the substrate, and a secondary battery that can be charged with power received by the power receiving coil. A gravity center of the capsule medication device 10 not located at a center of a cut face when the capsule medication device is cut along a plane that passes through the gravity center and is orthogonal to the longitudinal direction of the capsule medication device, and is located to overlap the substrate in a view along a direction orthogonal to the substrate.
A receiving unit of a CPAP apparatus includes a base member, a receiving case, a heating unit, and an elastic member. The receiving case is disposed on an upper side of the base member and includes an opening formed in a lower wall. The heating unit is disposed between the base member and the lower wall of the receiving case. The elastic member is disposed on the base member and holds the heating unit. The heating unit includes a heating element and a thermal conductor. The thermal conductor is disposed on an upper side of the heating element, has a shape wider than a shape of the heating element when the heating element is viewed from the receiving unit in plan view, and includes a peripheral portion that does not overlap the heating element.
A stretchable wiring board that includes: a stretchable substrate having a first main surface and a second main surface facing each other in a thickness direction; and a wiring member on at least the first main surface side of the stretchable substrate and including at least one stretchable wiring extending in a plane direction including a length direction orthogonal to the thickness direction and a width direction orthogonal to the thickness direction and the length direction, wherein the at least one stretchable wiring includes a first wiring portion and a second wiring portion both extending in the length direction, at least the first wiring portion is an electric path to an outside of the stretchable wiring board, and a tensile strength in the length direction of the second wiring portion is lower than a tensile strength in the length direction of the first wiring portion.
A capacitor including: a capacitor element including a body and an external electrode on an end surface of the body; a lead-out terminal electrically connected to the external electrode; an outer case housing the capacitor element such that the lead-out terminal protrudes outward therefrom, wherein an outer surface of the outer case includes a mounting surface that faces a mounting object in a first direction when the lead-out terminal is welded to the mounting object; a filling resin filling the outer case such that the capacitor element is embedded in the filling resin; and a mounting foot on the outer surface of the outer case for welding the outer case to the mounting object at the mounting surface, the mounting foot being electrically isolated from the lead-out terminal and including a metal material of a same type as that of the lead-out terminal.
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and being wound along a longitudinal direction thereof, and has a through hole in a width direction. The positive electrode includes a positive electrode current collector, and a positive electrode active material layer provided thereon. The positive electrode active material layer includes a first thin part, a thick part, and a second thin part. The thick part has a thickness greater than a thickness of the first thin part and is adjacent to the first thin part in the longitudinal direction. The second thin part has a thickness smaller than the thickness of the thick part and is positioned on an opposite side of the thick part to the first thin part.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and being wound along a longitudinal direction thereof, and has a through hole provided through the electrode wound body in a width direction. The positive electrode includes a positive electrode current collector extending in both the longitudinal direction and the width direction, and a positive electrode active material layer provided thereon. The positive electrode active material layer includes a first thin part, a thick part, and a grooved part. The thick part has a thickness greater than a thickness of the first thin part and is adjacent to the first thin part in the longitudinal direction. The grooved part is positioned between the first thin part and the thick part.
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
A first bias circuit, a second bias circuit, a first differential amplifier, a second differential amplifier, and an inverting amplifier are included. The first bias circuit has: a first bias output terminal from which first bias current or a voltage is output to a carrier amplifier; and a first monitoring terminal from which a first monitoring signal is output. The second bias circuit has: a second bias output terminal from which second bias current or a voltage is output to a peaking amplifier; and a second monitoring terminal from which a second monitoring signal is output. The first differential amplifier outputs the first bias control signal. The second differential amplifier outputs an amplified signal. The inverting amplifier outputs the second bias control signal resulting from inverting amplification of the amplified signal.
A secondary battery includes an electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and wound along a longitudinal direction thereof, and has a through hole in a width direction. The positive electrode includes a positive electrode active material layer, and a positive electrode current collector including a positive electrode covered region and a positive electrode exposed region. The positive electrode covered region is covered with the positive electrode active material layer. The positive electrode exposed region is covered with no positive electrode active material layer and extends in the width direction from the positive electrode active material layer. The positive electrode active material layer includes a first thin part, and a first thick part having a thickness greater than that of the first thin part and being adjacent to the first thin part in the width direction.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
97.
ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
An electronic component is provided that includes a package, at least one electronic chip housed within an enclosure inside the package, and at least one first bonding pad, at least one second bonding pad, and at least one bond connected to at least one bonding pad and at least one second bonding pad for establishing an electric connection between the electronic chip and surrounding circuitry. A cleaning pad is provided in the package. The cleaning pad is spaced from first bonding pad and second bonding pad, designed to be electrically disconnected from other structures or components, and designed to enable cleaning of a bonding tool.
An acoustic resonator device is provided that includes a substrate; a piezoelectric layer at least partially supported by the substrate; an interdigital transducer (IDT) at the piezoelectric layer; an acoustic Bragg reflector between the substrate and the piezoelectric layer. The acoustic Bragg reflector includes alternating layers of a first material and a second material having a higher acoustic impedance than the first material. Thicknesses of the first material and the second material of the acoustic Bragg reflector are configured to generate a reflectance frequency band centered around a displaced frequency f0′, the displaced frequency f0′ being displaced from a resonance frequency fr of the acoustic resonator device based on a harmonic spur of the resonance frequency fr. In this aspect, the thicknesses of the first material and the second material are measured in a direction normal to the substrate.
A multilayer inductor includes a body. The body includes, within a magnetic member having a stack of magnetic layers containing iron powder, a coil including a coil conductor wound around and a through conductor that is electrically connected to the coil conductor and exposed in a bottom surface of the magnetic member. The multilayer inductor also includes an outer electrode that is on the through conductor and is electrically connected to the through conductor; and an exterior resin layer on the bottom surface of the magnetic member. The outer electrode includes protrusions that protrude perpendicular to a stacking direction of the magnetic layers in an upper end portion on a far side from the through conductor and a lower end portion on a near side from the through conductor in the stacking direction. The exterior resin layer extends across between the protrusions in the upper and lower end portions.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.