The invention relates to a method for manufacturing a three-dimensional item comprising at least one metal pattern, comprising at least:
a step A of providing a flat substrate of thermoformable material;
a step B of forming on a surface of the flat substrate a temporary masking coating that adheres to said surface, to obtain a masked substrate having at least one unmasked area;
a step C of thermoforming the flat substrate to give the latter a generally three-dimensional shape;
a step D of metallizing the masked substrate to form a metal deposit on the latter, at least on said unmasked area;
and a step E of eliminating said temporary masking coating,
the thermoforming step C being carried out before metallization step D and before step E of eliminating said temporary masking coating, the metallization step D being carried out by non-electrolytic deposition from one or more metallization solution(s) containing at least one metal in metal cation form and at least one reducing agent adapted to transform the metal cation into metal, by spraying the metallization solution(s) in the form of one or more aerosol(s).
The invention relates to a method for manufacturing a three-dimensional item comprising at least one metal pattern, comprising at least:
a step A of providing a flat substrate of thermoformable material;
a step B of forming on a surface of the flat substrate a temporary masking coating that adheres to said surface, to obtain a masked substrate having at least one unmasked area;
a step C of thermoforming the flat substrate to give the latter a generally three-dimensional shape;
a step D of metallizing the masked substrate to form a metal deposit on the latter, at least on said unmasked area;
and a step E of eliminating said temporary masking coating,
the thermoforming step C being carried out before metallization step D and before step E of eliminating said temporary masking coating, the metallization step D being carried out by non-electrolytic deposition from one or more metallization solution(s) containing at least one metal in metal cation form and at least one reducing agent adapted to transform the metal cation into metal, by spraying the metallization solution(s) in the form of one or more aerosol(s).
Method for manufacturing three-dimensional items with metal pattern(s)
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 5/00 - Electroplating characterised by the processPretreatment or after-treatment of workpieces
C25D 5/02 - Electroplating of selected surface areas
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
2.
Component with one or more electrically conductive patterns for an electrical, radio or electronic device, and device comprising such a component
The invention relates to a component (1) for an electrical, radio or electronic device, comprising a substrate (3) provided with a dielectric surface (4) carrying at least one electro-conductive pattern (5) that has a lower surface (5A) in contact with the dielectric surface (4) and an opposite upper surface (5B), said electro-conductive pattern being made of metal, the upper surface of the electro-conductive pattern having a roughness Sa less than or equal to 500 nm, said electro-conductive pattern having a thickness (e) of between 10 nm and 500 nm and a sheet resistance that is less than or equal to 800 mΩ/□. The invention further relates to an electrical, radio or electronic device comprising such a component.
The invention relates to a component (1) for an electrical, radio or electronic device, comprising a substrate (3) provided with a dielectric surface (4) carrying at least one electro-conductive pattern (5) that has a lower surface (5A) in contact with the dielectric surface (4) and an opposite upper surface (5B), said electro-conductive pattern being made of metal, the upper surface of the electro-conductive pattern having a roughness Sa less than or equal to 500 nm, said electro-conductive pattern having a thickness (e) of between 10 nm and 500 nm and a sheet resistance that is less than or equal to 800 mΩ/□. The invention further relates to an electrical, radio or electronic device comprising such a component.
Components with electro-conductive patterns; electrical, radio or electronic devices comprising components with electro-conductive patterns.
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
G01R 27/02 - Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
3.
METHOD FOR PRODUCING SELECTIVELY METALLISED THREE-DIMENSIONAL ITEMS WITH A MASKING COATING COMPOSITION
The invention relates to a composition for making a film-forming masking coating adhering to at least part of a surface of a substrate intended to be thermoformed for manufacturing a selectively metallized three-dimensional item, said composition comprising at least one organic polymer matrix formed of one or more organic monomers and/or polymers, said polymer matrix being curable to form said masking coating that, after curing, for a thickness of between 0.1 μm and 50 μm, has a deformation ratio at break higher than 30%, at a temperature of between 20° C. and 270° C.
The invention relates to a composition for making a film-forming masking coating adhering to at least part of a surface of a substrate intended to be thermoformed for manufacturing a selectively metallized three-dimensional item, said composition comprising at least one organic polymer matrix formed of one or more organic monomers and/or polymers, said polymer matrix being curable to form said masking coating that, after curing, for a thickness of between 0.1 μm and 50 μm, has a deformation ratio at break higher than 30%, at a temperature of between 20° C. and 270° C.
The invention is particularly adapted for making a composition suitable for making a coating on the surface of a substrate intended to be thermoformed.
The invention relates to a component (1) for an electrical, radio or electronic device, the component comprising a substrate (3) provided with a dielectric surface (4) bearing an electrically conductive pattern (5) that has an inner surface in contact with the dielectric surface (4) and an opposing outer surface (5B), the electrically conductive pattern being made of metal, the upper surface of the electrically conductive pattern having a roughness Sa that is lower than or equal to 500 nm, the electrically conductive pattern having a thickness (e) of between 10 nm and 500 nm and a sheet resistance that is lower than or equal to 800 mΩ/□. The invention further relates to an electrical, radio or electronic device comprising such a component. - Components with electrically conductive patterns; electrical, radio or electronic devices with components having electrically conductive patterns.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
The invention relates to a method for manufacturing a three-dimensional item comprising at least one metal pattern, comprising at least: - a step A of providing a flat substrate made of thermoformable material; - a step B of forming, on a surface of the flat substrate, a temporary masking coating which adheres to said surface, in order to obtain a masked substrate having at least one unmasked zone; - a step C of thermoforming the flat substrate in order to give the latter a three-dimensional general shape; - a step D of metallizing the masked substrate in order to form a metal deposit on the latter at least on said unmasked zone; - and a step E of removing said temporary masking coating, the thermoforming step C being carried out before the metallization step D and before the step E of removing said temporary masking coating, the metallization step D being carried out by non-electrolytic deposition from one or more metallization solutions containing at least one metal in the form of a metal cation and at least one reducing agent capable of transforming the metal cation into metal, by spraying the metallization solution or solutions in the form of one or more aerosols. The invention also relates to a method for manufacturing three-dimensional items with metal pattern(s).
C09D 5/20 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
B29C 51/00 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
6.
METHOD FOR PRODUCING SELECTIVELY METALLISED THREE-DIMENSIONAL ITEMS WITH A MASKING COATING COMPOSITION
The invention relates to a method for producing a selectively metallised three-dimensional item, the method comprising at least: - a step of depositing a composition in the liquid or paste state on a surface of a thermoformable substrate, the composition comprising at least one organic polymer matrix formed of one or more organic monomers and/or polymers, the composition comprising neither electrically conductive particles nor magnetic particles; - a step of curing the composition thus deposited on the substrate to form a film-forming masking coating that adheres to the latter, the masking coating having a thickness of between 0.1 pm and 30 pm; - a step of thermoforming the thus-coated substrate with the film-forming masking coating; - a step of metallising the substrate to form a metal deposit thereon; and - a step of removing the masking coating using an alkaline solution subsequent to or simultaneously with the step of metallising the substrate.
C09D 5/20 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
B29C 51/00 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C25D 5/02 - Electroplating of selected surface areas
7.
Method and device for producing metal patterns on a substrate for decorative and/or functional purposes, manufacture of objects incorporating said production and set of consumables used
A method for producing metal patterns, which includes depositing a temporary protection on a substrate surface corresponding to the negative of the patterns to be produced; depositing at least one metal on the areas corresponding to the patterns to be produced; and eliminating the temporary protection at least partly during and/or after, or at least partly during and/or after the deposition step. The method can produce decorative objects or functional objects such as printed circuits, integrated circuits, RFID chips, and electronic reader-readable encoding pictograms. A set of consumables used to implement the method is also disclosed.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 5/02 - Electroplating of selected surface areas
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Chemical products for metallization. Printing inks, varnishes, lacquer paints. Treatment of materials; treatment and coating (plating) of
metals; metallization of all supports.
9.
METHOD AND DEVICE FOR PRODUCING METAL PATTERNS ON A SUBSTRATE FOR DECORATIVE AND/OR FUNCTIONAL PURPOSES, MANUFACTURE OF OBJECTS INCORPORATING SAID PRODUCTION AND SET OF CONSUMABLES USED
The aim of the invention is to provide a method for producing metal patterns capable of being fine, accurate and complex on any type of substrate, that is easy to carry out on an industrial scale, can be automated and is easy to implement. For this purpose, the method according to the invention is characterised in that it comprises the following essential steps; A. optionally preparing the surface of the substrate intended to receive the metal patterns; B. depositing a temporary protection on the surface of the substrate corresponding to the negative of the patterns to be produced by means of a screen printing mask/stencil of which the cut-outs correspond to the negative of the patterns to be produced; and/or by direct printing, preferably by ink jet; C. optionally activating the surface of the substrate, in particular the areas corresponding to the patterns to be produced; D. metallising by depositing at least one metal on the areas corresponding to the patterns to be produced; E. eliminating the temporary protection from step B; F. optionally rinsing the surface of the substrate carrying the metal patterns; G. optionally drying the surface of the substrate carrying the metal patterns; H. optionally applying a finishing treatment to the surface of the substrate carrying the metal patterns; and in that step E of eliminating the temporary protection is carried out during step D, or at least partly during step D, and/or after step D, or at least partly during and/or after metallisation step D and partly before metallisation step D. The methods for producing decorative objects or functional objects such as printed circuits, integrated circuits, RFID chips, electronic reader-readable encoding pictograms, etc. incorporating this production of metal patterns, are also part of the invention, in addition to the sets of consumables used to implement said production.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
A method of metallizing the surface of a substrate electrolessly, by spraying one or more oxidation-reduction solutions thereonto. The steps of this method include: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metallized surface. Compact devices for implementing this method and the products obtained are also disclosed.
B05D 3/08 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by flames
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
The present invention relates to a corrosion-resistant "all-metal" mirror, including: a glass substrate (A); a silver coating (B) with a thickness eAg deposited on at least one surface of the substrate by a non-electrolytic metallisation that comprises spraying, onto said substrate surface, at least one aerosol containing silver in cation form (oxidiser) and at least one reducing agent capable of converting the silver cation into metal; at least one protective layer (C) containing at least one metal other than silver and deposited on the silver coating, characterised in that said protective layer has a thickness eM such that 0,3 eAg ≤ eM ≤ 5 eAg, and is obtained by a non-electrolytic metallisation of the silver coating, said metallisation being carried out by spraying, onto the silver coating, at least one aerosol containing at least one metal, other than silver, in cation form (oxidiser), and at least one reducing agent capable of converting the metal cation into metal. The invention also relates to a method for producing such a mirror and to the use thereof in solar applications.
The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of -a- wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
13.
PROCESS FOR THE OPTOPHYSICAL SURFACE TREATMENT OF POLYMER SUBSTRATES AND DEVICE FOR IMPLEMENTING THE PROCESS
The object of the invention is to provide a surface treatment process which enables a substrate (polymer) to be given specific physical properties, especially surface nanoporosity, for example with a view to electroless metallizing it, and which completely replaces surface treatment by sulphochromic pickling. To achieve this objective, the surface treatment according to the invention comprises a hybrid UV/corona treatment of the substrate surface followed by electroless metallization. The invention also relates to a device for implementing these processes.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
B29C 59/10 - Surface shaping, e.g. embossingApparatus therefor by electric discharge treatment
B29C 59/12 - Surface shaping, e.g. embossingApparatus therefor by electric discharge treatment in an environment other than air
B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
14.
ELECTOLESS METHOD FOR IN-LINE METALLIZATION OF SUBSTRATES BY SPRAYING THEM, WITH PRIOR SURFACE TREATMENT AND DEVICE FOR IMPLEMENTING THE METHOD
One subject of the present invention is a method of metalizing the surface of a substrate electrolessly, by spraying one more oxidation-reduction solutions thereonto, which method is industriallizable, automatable, clean, multi-substrate and optimized in terms of adhesion and decorative appearance. To achieve this, the method involves the following steps: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metalized surface. Other subjects of the invention are the compact devices for implementing this method and the products obtained, namely in particular: hollow glass flasks, especially for cosmetic use; automotive parts; parts for home electronics or for aeronautics; and electronic parts such as conducting tracks, radio frequency label antennas or coatings for electromagnetic screening.
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Treatment of metals; metal plating; metallization, namely, electro and metal coating, metal treating and casting, hardening of metal and metal products
17.
ADVANCED NON-ELECTROLYTIC METHOD FOR METALLIZING A SUBSTRATE BY METALLIC SALT(S) REDUCTION AND AEROSOL(S) PROJECTION
The invention relates to a non-electrolytic method for metallizing a substrate of any nature by projecting an aerosol containing a solution of an oxidant metallic cation and of a reDucing agent capable of converting said cation into a metal. The purpose of the present invention is to provide a method and an advanced device for industrial and automatic chemical metallisation. This purpose is achieved by the method of the invention that comprises a preliminary step of -ap- wetting the substrate with a wetting fluid; and 60 sec at most after the end of the wetting, starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection. The projection means move along a trajectory TOA between an origin point (O) and an arrival point (A) at a projection displacement speed VOA, then return to origin (O) at a projection-less displacement speed VAO along a trajectory TAO. A computing and control unit (UCC) controlling the projection means and a system for displacing said projection means is used for automating the process.
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/34 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents
C23C 18/40 - Coating with copper using reducing agents
18.
ADVANCED NON-ELECTROLYTIC METHOD FOR METALLIZING A SUBSTRATE BY METALLIC SALT(S) REDUCTION AND AEROSOL(S) PROJECTION
The invention relates to a non-electrolytic method for metallizing a substrate of any nature by projecting an aerosol containing a solution of an oxidant metallic cation and of a reDucing agent capable of converting said cation into a metal. The purpose of the present invention is to provide a method and an advanced device for industrial and automatic chemical metallisation. This purpose is achieved by the method of the invention that comprises a preliminary step of -ap- wetting the substrate with a wetting fluid; and 60 sec at most after the end of the wetting, starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection. The projection means move along a trajectory TOA between an origin point (O) and an arrival point (A) at a projection displacement speed VOA, then return to origin (O) at a projection-less displacement speed VAO along a trajectory TAO. A computing and control unit (UCC) controlling the projection means and a system for displacing said projection means is used for automating the process.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/34 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents
C23C 18/40 - Coating with copper using reducing agents
19.
ELECTOLESS METHOD FOR IN-LINE METALLIZATION OF SUBSTRATES BY SPRAYING THEM, WITH PRIOR SURFACE TREATMENT AND DEVICE FOR IMPLEMENTING THE METHOD
One subject of the present invention is a method of metalizing the surface of a substrate electrolessly, by spraying one more oxidation-reduction solutions thereonto, which method is industriallizable, automatable, clean, multi-substrate and optimized in terms of adhesion and decorative appearance. To achieve this, the method involves the following steps: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metalized surface. Other subjects of the invention are the compact devices for implementing this method and the products obtained, namely in particular: hollow glass flasks, especially for cosmetic use; automotive parts; parts for home electronics or for aeronautics; and electronic parts such as conducting tracks, radio frequency label antennas or coatings for electromagnetic screening.
