A differential signal transmission cable includes a pair of differential signal lines arranged in parallel to each other, an insulation for bundle-covering the pair of differential signal lines, and a shield conductor wound around an outer periphery of the insulation. The insulation is configured such that an outer circumference thereof in a cross section perpendicular to a longitudinal direction thereof has an oval shape formed with a continuous convex arc-curve. The oval shape has a width in a first direction along the arrangement direction of the pair of differential signal lines being larger than a width in a second direction orthogonal to the first direction.
Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 µm or less in a surface layer having a depth of 50 µm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 5/02 - Single bars, rods, wires or stripsBus-bars
H01B 5/08 - Several wires or the like stranded in the form of a rope
H01B 7/00 - Insulated conductors or cables characterised by their form
A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
5.
Position sensor cord, position sensor and planar position sensor
A position sensor cord includes a hollow insulator formed of a restorable rubber or a restorable plastic, and two linear resistive members. Each of the two linear resistive members includes a linear insulator and a conductive layer provided around a circumference of the linear insulator. The conductive layer is formed of a conductive rubber or a conductive plastic. The two linear resistive members are arranged in no electrical contact with each other and along an inner surface of the hollow insulator. One of the two linear resistive members may be replaced with one linear conductive member.
A cable fixing member formed of one belt-like metal plate bent to fix three cables to a structure includes two flanges formed at both ends of the metal plate, two C-shaped holding portions formed to be bent into C-shapes in cross section on both sides respectively of a reference portion of the metal plate to hold two of the three cables in the C-shaped holding portions respectively, and two semicircular arc portions formed to be bent into semicircular arc shapes in cross section between the C-shaped holding portions and the flanges on both the sides respectively of the reference portion of the metal plate so that the two semicircular arc portions face each other to hold one of the three cables therebetween. The three cables are held so that the three cables are arranged to form a triangular shape in transverse cross sectional view.
The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the junction material a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/40 - Making wire or rods for soldering or welding
H01L 21/52 - Mounting semiconductor bodies in containers
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A piezoelectric film element comprising a substrate and a piezoelectric film formed on the substrate, wherein the piezoelectric film has a perovskite structure of an alkali niobium oxide compound represented by the general formula: (K1-xNax)yNbO3 (0
C04B 35/00 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/319 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
There is provided a cable fixing member, comprising: an intermediate member crimped and tightened to a cable; a pair of bracket members for clamping and grasping one or a plurality of cables with the intermediate member tightened thereto, through the intermediate member; and one or a plurality of grooves formed on facing surfaces of the pair of bracket members by which the cable is clamped, for clamping the cable through the intermediate member, wherein an inner surface shape of the groove is formed to mesh with an outer surface shape of the intermediate member which is crimped and tightened to the cable.
H01R 4/00 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
H01B 17/16 - Fastening of insulators to support, to conductor, or to adjoining insulator
H01R 4/10 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
10.
PIEZOELECTRIC THIN-FILM ELEMENT, PROCESS FOR PRODUCING SAME, AND PIEZOELECTRIC THIN-FILM DEVICE
Disclosed is a piezoelectric thin-film element which comprises a substrate and, disposed thereon, at least a lower electrode, a piezoelectric thin film represented by the general formula (NaxKyLiz)NbO3 (0≤x≤1, 0≤y≤1, 0≤z≤0.2, and x+y+z=1), and an upper electrode, characterized in that the piezoelectric thin film has a crystal structure constituted of a quasi-cubic, tetragonal, or orthorhombic system or has a state in which at least one of those crystal systems is coexistent, that the crystal grains have been oriented preferentially along up to two specific crystallographic axes among those axes, and that with respect to the ratio between (001) components and (111) components, as the oriented crystallographic components, the proportion by volume of the (001) components is 60-100% and the proportion by volume of the (111) components is 0-40%, when the sum of both is taken as 100%.
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
Disclosed is a piezoelectric thin-film element which comprises a substrate and, superposed thereon, at least a lower electrode, a piezoelectric thin film represented by the general formula (NaxKyLiz)NbO3 (0≤x≤1, 0≤y≤1, 0≤z≤0.2, and x+y+z=1), and an upper electrode, characterized in that the piezoelectric thin film has a crystal structure constituted of any one of quasi-cubic, tetragonal, and orthorhombic systems or has a crystal structure in which at least two of quasi-cubic, tetragonal, and orthorhombic systems are coexistent, that up to two of the crystallographic axes have been oriented preferentially in specific axial directions, and that the angle between at least one of the oriented crystallographic axes and the normal line to the substrate surface is within the range of 0-10º.
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
12.
Differential signal cable, and cable assembly and multi-pair differential signal cable using the same
A differential signal cable for transmitting high-speed digital differential signals of several Gbit/s or more is provided to minimize characteristic impedance mismatch and to repress increase in the skew, or increase in disturbance due to differential-mode to common-mode conversion. A differential signal cable comprises two insulated wires arranged parallelly in a contact, each of said two insulated wires comprising a conductor and an insulator jacketing the conductor; a fusion layer provided on the surface of each of said two insulated wires; a drain wire placed longitudinally in a recess created in the interstice between said two insulated wires; and a shield tape lapping around said two insulated wires and said drain wire together, wherein a surface of said insulator of each of said two insulated wires is partially deformed so as to have a flat portion and said two insulated wires are fused each other at said flat portions.
Disclosed is a piezoelectric thin-film element which includes a substrate (1) and, formed over the substrate (1), a piezoelectric thin film (3) having an alkali niobium oxide-based perovskite structure represented by the empirical formula (K1-xNax)yNbO3, wherein the piezoelectric thin film (3) has a carbon concentration of 2×1019 per cm3 or less or the piezoelectric thin film (3) has a hydrogen concentration of 4×1019 per cm3 or less.
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
C04B 35/00 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
Disclosed are a piezoelectric thin film element and a piezoelectric thin film device which have improved piezoelectric properties and high performance and can be produced in improved yields. The piezoelectric thin film element (1) comprises: a substrate (10); and a piezoelectric thin film (40) which is arranged on the substrate (10), has at least one crystal structure represented by general formula (NaxKyLiz)NbO3 (0≤x≤1, 0≤y≤1, 0≤z≤0.2, x+y+z=1) and selected from the group consisting of a pseudo-cubic crystal, a hexagonal crystal and an orthorhombic crystal, and contains an inert gas element at a ratio of 80 ppm or less by mass.
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H01L 41/257 - Treating devices or parts thereof to modify a piezo-electric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
15.
PIEZOELECTRIC THIN FILM ELEMENT, PIEZOELECTRIC THIN FILM DEVICE, AND PROCESS FOR PRODUCTION OF PIEZOELECTRIC THIN FILM ELEMENT
A piezoelectric thin film element having such a structure that a lower electrode, a piezoelectric thin film having an alkali niobium oxide perovskite structure represented by general formula (K1-xNax)NbO3 (0
H01L 41/08 - Piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
16.
SOFT-DILUTE-COPPER-ALLOY MATERIAL, SOFT-DILUTE-COPPER-ALLOY WIRE, SOFT-DILUTE-COPPER-ALLOY SHEET, SOFT-DILUTE-COPPER-ALLOY STRANDED WIRE, AND CABLE, COAXIAL CABLE AND COMPOSITE CABLE USING SAME
Provided are a soft-dilute-copper-alloy material, a soft-dilute-copper-alloy wire, a soft-dilute-copper-alloy sheet, a soft-dilute-copper-alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft-dilute-copper-alloy material is characterized in that the average grain size is at most 20 μm in the surface layer up to a depth of 50 μm from the surface.
B21C 1/00 - Manufacture of metal sheets, wire, rods, tubes or like semi-manufactured products by drawing
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 5/02 - Single bars, rods, wires or stripsBus-bars
H01B 5/08 - Several wires or the like stranded in the form of a rope
H01B 7/00 - Insulated conductors or cables characterised by their form
H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
National Institute of Advanced Industrial Science and Technology (Japan)
Hitachi Cable, Ltd (Japan)
Keio University (Japan)
Inventor
Ishikawa, Hiroshi
Hasama, Toshifumi
Kawashima, Hitoshi
Kintaka, Kenji
Mori, Masahiko
Uetsuka, Hisato
Tsuda, Hiroyuki
Sorimoto, Keisuke
Abstract
To provide a waveguide type wavelength domain optical switch which makes it possible to use a cheap lens, makes it possible to correct aberration of the demultiplexed wavelengths produced in a plurality of waveguide type demultiplexing circuits, a wavelength domain optical switch is provided with: an integrated element formed by laminating three or more waveguide type demultiplexing circuits; a first lens for collecting light emitted from the integrated element; a polarization separation element for separating light emitted from the first lens into X polarization and Y polarization and emitting the X polarization and the Y polarization at different angles; a second lens for collecting the X polarization and the Y polarization; a first reflective optical phase modulator for reflecting the collected X polarization and Y polarization at any angles; a ½-wavelength plate disposed between the second lens and the first reflective optical phase modulator in order to make polarization directions of the X polarization and the Y polarization identical; and a second reflective optical phase modulator for inputting light from the first reflective optical phase modulator into one of the waveguide type demultiplexing circuits.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/28 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
A halogen-free flame-retardant cable includes a multi-core twisted wire including a plurality of insulated wires twisted together, the plurality of insulated wires each including a conductor and an insulation layer on an outer periphery of the conductor, an inner layer formed on an outer surface of the multi-core twisted wire, and an outer layer formed on the inner layer. The outer layer includes a resin composition including not less than 30 parts by mass of a flame retardant with respect to 100 parts by mass of thermoplastic polyurethane (TPU). The inner layer includes a resin composition comprising an ethylene-vinyl acetate copolymer (EVA) with a vinyl acetate (VA) content of not less than 33%, and the outer layer is subjected to cross-linking treatment.
There is provided a flexible harness adapted to be detachably connected to electrode pads of an electric/electronic component. The flexible harness according to the present invention comprises: a flexible insulator film; a conductor pattern formed on the flexible insulator film; a terminal plane which is an end region of the conductor pattern; and ball-like contact bumps formed on the terminal plane. Each contact bump includes a core made of an elastically deformable resin and an electrical conductor layer surrounding the core.
There is provided a insulated electric wire with an electric conductor on which at least a lubricating layer is formed, in which a lubricant is added to the lubricating layer so that granular bodies, with sizes of 5 nm to 3 μm, which are formed by coagulation of the lubricant disperse on a surface of the lubricating layer.
A cable includes an insulated electric wire, a lateral winding layer formed by spirally winding an elemental wire having conductivity on a periphery of the insulated electric wire, a reversal lateral winding layer formed by spirally winding an elemental wire having conductivity in a direction intersecting with the winding direction of the lateral winding layer, a buffer layer formed between the lateral winding layer and the reversal lateral winding layer, and a sheath formed on a periphery of the reversal lateral winding layer. Each of a winding angle θ1 of the elemental wire forming the lateral winding layer and a winding angle θ2 of the elemental wire forming the reversal lateral winding layer is an acute angle, and an absolute value of difference between the winding angle θ1 and the winding angle θ2 is not more than 20 degrees.
An insulated electric wire is composed of a conductor, and a lubricating layer containing a lubricant. The lubricating layer is formed around the perimeter of the conductor. The lubricating layer is not less than 0.06 and not more than 0.12 in an absorbance ratio A1/A2 expressed by an absorbance A1 of carbon-hydrogen stretching vibration and an absorbance A2 of benzene ring framework vibration, obtained by Fourier Transform Infrared Spectroscopy analysis of a surface of the lubricating layer.
Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.
H01B 5/02 - Single bars, rods, wires or stripsBus-bars
H01L 31/042 - PV modules or arrays of single PV cells
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A male and female connection structure includes a female terminal, and a male terminal to electrically connect to the female terminal by being inserted into a connection position of the female terminal and to electrically disconnect from the female terminal by being withdrawn from the connection position. The female terminal includes a dimple to electrically connect to the male terminal, a male terminal pressing spring disposed opposite the dimple for pressing the male terminal to be inserted on the dimple against the dimple, and a press switching part for switching between a non-pressed state that the male terminal pressing spring does not press the male terminal located in the female terminal and a pressed state that the male terminal pressing spring presses the male terminal located in the female terminal by changing a shape of the male terminal pressing spring. The press switching part switches the non-pressed state to the pressed state, when the male terminal is inserted into the connection position, by using an insertion force applied when the male terminal is inserted into the female terminal, and it switches the pressed state to the non-pressed state, when the male terminal is withdrawn from the connection position, by using a withdrawal force applied when the male terminal is withdrawn from the female terminal.
A polybutylene naphthalate-based resin composition contains polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide; and an electric wire uses a polybutylene naphthalate-based resin composition, with an insulated coating layer formed on a conductor, by using a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide as an insulating material.
An insulation coating for electric wires has a resin coating made from polyimide resin or polyamide-imide resin as a constituent resin, the insulation coating being formed by dispersing phenyl trialkoxysilane and pure water in the resin coating. The phenyl trialkoxysilane is included 3 to 100 parts by weight for the constituent resin of 100 parts by weight in the resin coating.
A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
28.
Polyamide-imide resin insulating varnish and insulated wire using the same
A polyamide-imide resin insulating varnish includes an aromatic diamine component, an aromatic diisocyanate component, an acid component including an aromatic tricarboxylic acid anhydride, and a solvent. The aromatic diamine component includes an aromatic diamine with three or more benzene rings and an aromatic diamine with two or less benzene rings. The aromatic diamine with three or more benzene rings and the aromatic diamine with two or less benzene rings are added 99/1 to 30/70 in mole ratio.
A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.
A cable-type load sensor having an advantage in layout and being capable of sensing the load precisely is provided. The cable-type load sensor comprises a linear member composed of electrically conductive rubber and having a hollow part extending in the longitudinal direction at the central part of the cross section, and a cladding layer composed of the same kind of rubber material as the linear member and covering the circumference on the linear member.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
A roller for machining a metal foil has a plurality of recesses formed in the circumferential surface of a roller containing a metal material having a Rockwell hardness HRA of 81.2-90.0 in A scale and a deflecting strength of 3GPa-6GPa. When a metal foil is pressed using this metal foil machining roller, protrusions in substantially uniform shape having dimensions from several microns to several tens of microns can be formed efficiently on the surface of the metal foil in an industrial scale.
A metal separator for fuel cells formed with a metal plate and provided between cells accumulated, in which the metal plate is formed like trapezoidal irregularities to separate channels for a fuel gas from ones for an oxidant gas. Slope portions are formed after forming uniformly and thinly wall thickness of both upper and lower flat portions or either of the upper or the lower flat portion to 90% or less of that of the metal plate to be formed to obtain trapezoidal irregularities by forming flat portions which contact upper and lower cells and slope portions which interconnect the upper and the lower flat portions.
[PROBLEMS] To correct deformation of a wire rod, such as warping in the longitudinal direction and bending in the width direction, by using small equipment, without increasing the bearing force of the wire rod. [MEANS FOR SOLVING PROBLEMS] A wire rod correcting apparatus is provided with a wire rod drawing means for drawing a wire rod taken up as a coil; a plurality of correcting rolls, which are arranged along the drawing direction of the wire rod and are alternately arranged in the thickness direction of the wire rod; and a groove, which has a width substantially the same as the width of the wire rod arranged on the correcting rolls, bends the drawn wire rod in the thickness direction and regulates deformation in the width direction.
A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine copper alloy wire is 3% or more and 20% or less.
[PROBLEMS] To provide a photoelectric composite wiring component combining both characteristics of low power consumption of transmission by electric wiring and large transmission capacity of optical transmission by optical wiring, and exhibiting a high power efficiency for the transmission capacity. [MEANS FOR SOLVING PROBLEMS] A mechanism for switching between transmission of a transmission signal over an electrical transmission path and that over an optical transmission path depending on the modulation rate or the transmission rate of the transmission signal is provided. When the modulation rate or the transmission rate of the transmission signal is low, power supply to an optical transmitting/receiving section is stopped and the signal is transmitted over the electrical transmission path, thus achieving low power consumption. When the modulation rate or the transmission rate of the transmission signal is high, the signal is transmitted over the optical transmission path, thus achieving a large transmission capacity.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/25 - Arrangements specific to fibre transmission
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
B23K 11/00 - Resistance weldingSevering by resistance heating
In a high-frequency coaxial cable (1), an internal solid layer (3), an insulation layer (4) made of a foam resin, an external solid layer (5), and an external conductor (6) are provided on the periphery of an internal conductor (2) in this order. The external solid layer (5) has a dielectric dissipation factor of 1.0 x 10-4 or less at 2 GHz. Thereby, the voltage standing-wave ratio and the attenuation of the high-frequency coaxial cable (1) are reduced.
H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent
An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.
In a vehicle bumper structure, an optical fiber sensor (32) is provided in a vehicle width direction on the front surface of a front-bumper reinforcement (30). A front-bumper absorber (28) is provided in front of the optical fiber sensor (32), the front-bumper absorber (28) formed of a soft absorber (54) and a hard absorber (56). The hard absorber is disposed at the bumper center region where the thickness of the bumper is increased. Accordingly, the thickness of the soft absorber (54) becomes substantially uniform in the vehicle width direction, so that a substantially uniform load is inputted to the optical fiber sensor (32) regardless of the collision position of the bumper with an object. As a result, variations in the output of the load-sensing unit are reduced.
B60R 19/18 - Means within the bumper to absorb impact
B60R 21/0136 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including means for detecting collisions, impending collisions or roll-over responsive to actual contact with an obstacle
patents
