Abstract

The invention relates to a method for producing a sliding contact comprising a contact carrier and at least two contacts made of a noble metal or an alloy comprising at least one noble metal, the method having the following steps: A) a metal ribbon and at least one noble metal ribbon are provided; B) a contact carrier or a contact carrier ribbon with a plurality of connected and identical contact carrier parts is formed, particularly punched out, from the metal ribbon, wherein the contact carrier parts or the contact carrier comprise or comprises a respective receiving surface for conductive mounting of a plurality of contacts; C) a plurality of preferably identically long strips are produced, particularly punched or cut, from the noble metal ribbon or the noble metal ribbons; D) on the receiving surfaces of the contact carrier parts or the receiving surface of the contact carrier, a plurality of strips of the noble metal, or the noble metal ribbon before the strips were produced or the noble metal ribbons before the strips were produced, are placed parallel to one another or parallel to adjacent strips with the flat side on the receiving surface and conductively mounted, particularly welded or soldered, in this position, with the result that the strips form the contacts of the sliding contact. The invention also relates to a sliding contact comprising a flat metallic contact carrier and a plurality of contacts that are mounted on a receiving surface of the contact carrier, wherein the contacts are flat, preferably identically long strips of noble metal or a noble metal alloy, which are mounted parallel to one another on the receiving surface, and further relates to a potentiometric sensor, a potentiometer, a sliding control, a position sensor, a rotary switch, an electric motor, a generator, a wind turbine, a slip ring system, an actuator drive or a current collector with such a sliding contact.

IPC Classes  ?

• H01R 39/24 - Laminated contactsWire contacts, e.g. metallic brush, carbon fibres
• H01H 11/04 - Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
• H01R 43/12 - Manufacture of brushes
• H01R 4/02 - Soldered or welded connections
• H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials

Abstract

The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, comprising a copper core (2) with a surface and coating layer (3), which coating layer (3) is superimposed over the surface of the core (2), wherein the coating layer (3) comprises aluminium, wherein in any cross-sectional view of the wire the area share of the coating layer (3) is in the range of from 20 to 50 %, based on the total area of the cross-section of the wire, and wherein the aspect ratio between the longest path and the shortest path through the wire in any cross-sectional view is in the range of from larger than 0.8 to 1.0, and wherein the wire has a diameter in the range of from 100 μm to 600 μm. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge bonding.

IPC Classes  ?

• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like

Abstract

The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, comprising a copper core (2) with a surface and coating layer (3) superimposed over the surface of the copper core (2), wherein the coating layer (3) comprises aluminium, wherein the ratio of the thickness of the coating layer (3) to the diameter of the copper core (2) is in the range of from 0.05 to 0.2 μm, wherein the ratio of the standard deviation of the diameter of the copper core (2) to the diameter of the copper core (2) is in the range of from 0.005 to 0.05 μm and wherein the ratio of the standard deviation of the thickness of the coating layer (3) to the thickness of the coating layer (3) is in the range of from 0.05 to 0.4 μm, wherein the wire has a diameter in the range of from 100 μιη to 600 μm. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge bonding.

IPC Classes  ?

• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

The invention relates to a ribbon, preferably a bonding ribbon for bonding in microelectronics, comprising a first layer (2) comprising copper with a surface and at least a coating layer (3) superimposed over the surface of the first layer (2), wherein the coating layer (3) comprises aluminium, and an intermediate layer (7), wherein in a cross-sectional view of the ribbon the area share of the first layer (2) is in the range of from 50 to 96 %, based on the total area of the cross-section of the ribbon, wherein the aspect ratio between the width and the height of the ribbon in a cross-sectional view is in the range of from 0.03 to less than 0.8, wherein the ribbon has a cross-sectional area in the range of from 25Ό00 μιη2 to 800Ό00 μιη2, wherein the intermediate layer (7) is arranged between the first layer (2) and the coating layer (7), wherein the intermediate layer (7) comprises at least one intermetallic phase comprising material of the first layer (2) and material of the coating layer (3). The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge-bonding.

IPC Classes  ?

• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

The invention relates to a tape-type carrier substrate for mounting a plurality of semiconductor chips comprising an electrically conductive layer structured by cutouts in the layers, wherein the cutouts form a plurality of uniform units in the carrier substrate and each unit comprises a receiving area for mounting at least one semiconductor chip, a residual region and two electrodes for making contact with the semiconductor chip, which are prestructured by the cutouts, wherein the receiving areas are arranged between the electrodes of the same unit and the carrier substrate is formed by a parqueting of the units, in which the receiving areas, the residual regions and the electrodes are connected to one another by webs that are so narrow that, by means of the webs being stamped out using compact stamping tools, the receiving areas can be electrically insulated from the electrodes and the electrodes and receiving areas of the units can be separated from the residual regions, and at least two webs that connect the electrodes to the residual regions are arranged in the region of corners of the unit. The invention also relates to an electronic component comprising two electrodes and a receiving area, produced from such a carrier substrate, in which at least one semiconductor chip is fixed on the receiving area, said at least one semiconductor chip being electrically contact-connected to the electrodes by means of bonding wires. Furthermore, the invention also relates to a method for producing a tape-type carrier substrate and for producing an electronic component.

IPC Classes  ?

• H01L 23/495 - Lead-frames

Abstract

Known textile flat structures contain precious metal wire or they are composed completely thereof. In order to achieve high flexural and tensile strength with, at the same time, high flexibility of the flat structure, it is proposed according to the invention that the precious metal wire is configured as a precious metal cord (1) which comprises a plurality of braids (3) or a plurality of individual precious metal wires (2) or a combination of braids and individual precious metal wires which are in each case laid around one another and/or twisted around one another.

IPC Classes  ?

• D02G 3/12 - Threads containing metallic filaments or strips
• D03D 15/00 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used

Abstract

The present invention relates to a sputtering target made of a material that contains at least two phases or components. One phase is formed by a metal oxide forming the matrix, in which the elemental metal or metal alloy is embedded. The sputtering target is characterised through its low resistance and high density. It is well-suited for producing layers of low reflectivity and high absorptivity.

IPC Classes  ?

• C23C 14/08 - Oxides
• C23C 14/34 - Sputtering
• C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material

Abstract

The invention relates to a laminated substrate for mounting and making contact with two or more electronic elements (75), comprising a structured first electrically conductive layer (70), which is laminated with a structured insulating layer (71, 87), characterized in that a laminated substrate (1, 11, 21, 31, 81, 111, 131) comprises at least two units (2, 62, 82, 112, 132), wherein each unit (2, 62, 82, 112, 132) comprises at least one electrode (4, 5, 64, 65, 84, 114, 115, 134, 135) for providing electrical energy and a receiving surface (3, 63, 83, 113, 133) for mounting electronic elements (75), at least one adjacent electrode (4, 5, 64, 65, 84, 114, 115, 134, 135) being arranged beside each receiving surface (3, 63, 83, 113, 133), which jointly form a unit (2, 62, 82, 112, 132), and each receiving surface (3, 63, 83, 113, 133) is electrically insulated from the at least one adjacent electrode (4, 5, 64, 65, 84, 114, 115, 134, 135), and wherein the receiving surfaces (3, 63, 83, 113, 133) and/or the electrodes (4, 5, 64, 65, 84, 114, 115, 134, 135) of at least two adjacent units (2, 62, 82, 112, 132) are electrically connected to each other via a connection (19, 89, 124, 125, 144, 145) or two connections (9, 69, 119, 139) in such a way that the electronic elements (75) can be connected in parallel and/or in series electronically by the connection (19, 89, 124, 125, 144, 145) or connections (9, 69, 119, 139) when they are mounted on the receiving surfaces (3, 63, 83, 113, 133) and contact is made with an electrode (4, 5, 64, 65, 84, 114, 115, 134, 135) or with two electrodes (4, 5, 64, 65, 84, 114, 115, 134, 135) of the same unit (2, 62, 82, 112, 132). The invention also relates to an electronic circuit comprising such a substrate having electronic elements, to a laminate for producing such a substrate, and to a method for producing such a substrate from such a laminate, in which the pre-structured laminate is shaped in the region of the connections, wherein the electrode and the receiving surface or the electrodes and the receiving surface or the electrodes of the same pre-structured unit are separated in such a way, and electrodes of adjacent pre-structuring units or receiving surfaces and/or electrodes of adjacent pre-structuring units remain electrically connected in such a way that a substrate is built up with units on which electronic elements are connected in parallel and/or in series when contact is made between the electronic elements on the receiving surfaces and an electrode or two electrodes of the same unit.

IPC Classes  ?

• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H05K 1/02 - Printed circuits Details
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

The invention relates to a wire for producing a sliding contact, wherein at least an inner core of the wire comprises a copper/silver alloy. The invention also relates to a sliding contact with at least one such wire, wherein a mating contact is provided, with at least one of the wires resting on the conductive surface of said mating contact, wherein the spring force of the wire on the conductive surface of the mating contact brings about electrical contact between the wire and the mating contact, and the mating contact is moveable towards the wire, with the result that the surface of the wire slides over the mating contact during a movement of the mating contact. Finally, the invention also relates to a potentiometric sensor, a potentiometer, a sliding controller, a position sensor, a rotary switch, an electric motor, a generator, a wind turbine, a slip ring system, a servo drive or a current collector with such a sliding contact.

IPC Classes  ?

• H01R 13/33 - Contact members made of resilient wire
• H01R 39/20 - Contacts for co-operation with commutator or slip-ring, e.g. contact brush characterised by the material thereof
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

The invention relates to a laminate (1) for producing at least one switch, comprising a dielectric layer (4) and at least a first and a second electrically conductive, in particular metallic, layer (2, 5), which layers are electrically isolated from one another. At least one recess (7) is arranged in the dielectric layer (4), wherein at least the first electrically conductive layer (2) extends into the region of the recess (7) and forms a spring element (3) there, in particular a leaf spring, such that the first electrically conductive layer (2) can be electrically contacted with the second electrically conductive layer (5) by the action of force on the spring element (3). The invention also relates to a switch comprising such a laminate, to a laminate sheet comprising a plurality of laminate elements made of such a laminate, and to a method for producing such a laminate.

IPC Classes  ?

• H01H 13/88 - Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
• H01H 11/00 - Apparatus or processes specially adapted for the manufacture of electric switches
• B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers

Abstract

The invention relates to a substrate for receiving at least one electronic element, more particularly at least one semiconductor element, comprising an electrically conductive first layer for making contact with the element, a thermally conductive second layer for dissipating heat from the element, and an electrically insulating third layer arranged between the first layer and the second layer, such that the third layer electrically insulates the first layer from the second layer, wherein the third layer is a thin-film layer or a glass ceramic or a polymer matrix filled with ceramic powder. The invention also relates to an electronic component, more particularly semiconductor component, comprising at least one semiconductor element and such a substrate, wherein the semiconductor element is electrically conductively connected to the first layer areally on a first side, preferably by means of a solder, a conductive adhesive sieve or a silver sintering connection, and to a method for producing such a substrate, wherein a third, electrically insulating layer is applied to a first electrically conductive layer by sputtering, vapour deposition, physical vapour deposition (PVD), chemical vapour deposition (CVD), lamination, adhesive bonding, soldering or a printing method, more particularly a screen printing method, and wherein a second, thermally conductive layer is applied to the third layer by PVD, sputtering, lamination, adhesive bonding, soldering, low-temperature silver sintering or a printing method, more particularly a screen printing method, in such a way that the second layer has no electrical contact with the first layer.

IPC Classes  ?

• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/64 - Heat extraction or cooling elements
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/492 - Bases or plates

Abstract

The invention relates to a sliding contact (4, 14) comprising at least one main body (2, 12), wherein a sliding contact member (1, 11) is disposed on one end of the main body (2, 12), the sliding contact member (1, 11) being a wire, a wire piece or a metal ball. According to the invention, the at least one main body (2, 12) is substantially made of stainless steel, and a welded auxiliary layer (3, 13), which connects the basic member (2, 12) to the sliding contact member (1, 11) at least in some regions, is disposed at least in some regions between the main body (2, 12) and the sliding contact member (1, 11), wherein the welded auxiliary layer (3, 13) is a coating of the basic member (2, 12).

IPC Classes  ?

• H01R 39/20 - Contacts for co-operation with commutator or slip-ring, e.g. contact brush characterised by the material thereof

Abstract

The invention relates to a method for producing a laminate (16, 26, 56) from at least two films, wherein at least one first film (1, 31, 61) is structured and is subsequently laminated with at least one second film (2, 3, 62). In one single production step, at least one second film is stamped using at least one tool (6, 12, 66) and is laminated with the structured first film at the same time, wherein the films are conveyed, at least intermittently, to the at least one tool. The invention further relates to a laminate produced with such a method, and to a device for producing a laminate using a method as described, wherein the device is suitable for conveying a first film and at least one second film. In some regions, the films are oriented parallel to one another, and the device comprises at least one tool with which at least one second film can be stamp-laminated onto the first film.

IPC Classes  ?

• B32B 38/18 - Handling of layers or the laminate
• B32B 37/20 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
• B32B 38/04 - Punching, slitting or perforating

Abstract

The invention relates to a method for producing a laminate for contacting at least one electronic component, in which an insulating layer is arranged between a first metal layer and a second metal layer, the metal layers contact each other in at least one contact region, at least one opening is created in the insulating layer, and the metal layers are laminated with the insulating layer, wherein at least one cut-out is created in the first metal layer in the region of the opening, the first metal layer and the second metal layer are conductively connected to each other in the region of the opening, and the connection of the two metal layers is inspected. The invention further relates to a laminate for contacting an electronic component, produced by such a method, comprising a first metal layer and a second metal layer which is arranged substantially parallel to the first metal layer and which is separated in regions from the first metal layer by an insulating layer, wherein at least one opening is arranged in the insulating layer, and the first metal layer and the second metal layer are connected to each other in the opening such that the second metal layer is covered, in particular completely covered, such that the metal layers are thermally and/or electrically conductively connected to each other. The invention finally relates to the use of such a laminate as a circuit board or flexible carrier substrate for electrical circuits comprising chips, sensors, LEDs, power components, cell phone components, and open-loop or closed-loop control units.

IPC Classes  ?

• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

The invention relates to methods for producing a laminate that is for contacting at least one electronic component. In said method, an insulating layer is arranged between a first metal layer and a second metal layer, the metal layers are contacted with each other, at least one cavity is produced in the insulating layer, the metal layers are laminated with the insulating layer, a recess is produced in the first metal layer for receiving the electronic component, and the electronic component is inserted therein. The invention also relates to a laminate produced by such a method, and to the use thereof as a circuit board, sensor, LED lamp, mobile phone component, control system, controller or mobile phone flash LED.

IPC Classes  ?

• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/498 - Leads on insulating substrates

Abstract

The invention relates to a method for producing a laminate (1, 11) for making contact with at least one electronic component (6, 16), in which an insulating layer (4, 14) is arranged between a first metal layer (2, 12) and a second metal layer (3, 18), electrical contact is made between the metal layers in at least one contact region, a recess is produced in the insulating layer in the contact region or recesses are produced in the contact regions, at least one embossed portion and/or at least one bulge is/are produced in the contact region at least in the first metal layer, wherein the distance between the two metal layers is reduced in the regions of the at least one embossed portion and/or bulge, the metal layers are laminated to the insulating layer, wherein the dimensions of at least one embossed portion and/or of at least one bulge suffice to accommodate at least one electronic component, at least one electronic component is inserted into at least one embossed portion and/or at least one bulge and is conductively connected there, with the result that the full extent of the electronic component is accommodated and the component is at least partially accommodated in the embossed portion or the bulge on the basis of the height (H) of the electronic component. The invention also relates to a laminate for making contact with an electronic component, in particular a laminate produced using such a method.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01L 33/60 - Reflective elements
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 23/498 - Leads on insulating substrates

Abstract

According to the invention, one or more cylindrical sleeves for protecting pipes that are made of platinum or Pt alloys and are connected to a flange at least at one end is/are used to substantially reduce the loss of material caused by evaporation when the pipes are used in an oxidizing atmosphere at temperatures exceeding 1200°C, where A) one end of the sleeve is fastened to the flange and the other end forms an open annular hollow space along with the pipe, and B) the cylindrical outer surface of the pipe is surrounded by at least one sleeve at a distance ranging from 0.1 to 100 mm.

IPC Classes  ?

• C03B 5/167 - Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
• C03B 5/43 - Use of materials for furnace walls, e.g. fire-bricks
• C03B 7/07 - Electric means

Abstract

The invention relates to methods for reducing the evaporation rate out of platinum and Pt alloys used at temperatures exceeding 1200°C in an oxidizing atmosphere, comprising the following steps: A) providing a part made of platinum or a platinum alloy; B) wrapping a flexible bandage, which has an open porosity and is provided with an oxide ceramic material and/or a glass former, around the outer surface of the part; C) using the part at operating temperatures exceeding 1200°C, or methods for recovering precious metal oxides evaporating or subliming out of the surface of platinum or Pt alloys by A) providing a part made of platinum or a platinum alloy, B) wrapping a flexible bandage having an open porosity around the outer surface of the part, and C) using the part at operating temperatures exceeding 1200°C, and the correspondingly wrapped parts.

IPC Classes  ?

• C03B 5/167 - Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
• C03B 5/43 - Use of materials for furnace walls, e.g. fire-bricks
• C03B 7/02 - Forehearths, i.e. feeder channels

Abstract

Parts made of platinum or a Pt alloy, the outer surface of which comes in contact with an oxidizing atmosphere during operation and is covered with an open-cell ceramic or quartz layer, the pores containing a material that melts at the operating temperature as an infiltration material, are protected against loss caused by evaporation when used in an oxidizing atmosphere at temperatures exceeding 1200°C. A method for reducing the evaporation rate out of platinum and Pt alloys in an oxidizing atmosphere comprises the steps of A. applying an open-cell quartz or ceramic layer, B. infiltrating said quartz or ceramic layer with a material melting at a lower temperature than the ceramic material such that pore spaces of the open-cell ceramic layer are partially or entirely filled by the infiltration material, C. use at temperatures exceeding 1200°C.

IPC Classes  ?

• C03B 5/167 - Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
• C03B 5/43 - Use of materials for furnace walls, e.g. fire-bricks
• C03B 7/02 - Forehearths, i.e. feeder channels

Abstract

The invention relates to a spring contact for a sliding contact having a terminal region (24) and at least one contact region comprising an elongated spring element and a precious metal, wherein the spring contact comprises a conductive spring support (1, 11, 21, 31) and at least one contact piece (2, 12, 22, 32), wherein the spring support has a substantially symmetrical rigidity in some regions in a plane perpendicular to the elongated extent of the spring support and is made from a conductive material, substantially free of precious metal and wherein the at least one contact piece is conductively connected to the spring support, and comprises at least one surface to form the sliding contact and the material of the surface of the contact piece comprises a precious metal or a precious metal alloy. The invention also relates to a slip ring transmitter comprising such a spring contact, wherein the surface of the contact piece(s) is/are conductively connected to the slip rings, and also relates to a motor and a dynamo having such a slip ring transmitter.

IPC Classes  ?

• H01R 39/24 - Laminated contactsWire contacts, e.g. metallic brush, carbon fibres
• H01R 39/20 - Contacts for co-operation with commutator or slip-ring, e.g. contact brush characterised by the material thereof
• H02K 5/14 - Means for supporting or protecting brushes or brush holders

Abstract

The present invention was based on the object of providing a ribbon wire with which it is possible to effectively prevent damage to the bonding surfaces during the bonding process and short circuits when the corresponding assemblies are used. According to the invention, this object is achieved by a bonding wire having a wire core made of a first material and a wire sheath which envelops the wire core and is made of a second material, wherein the first material has a first metal and the second material has a second metal and the first metal and the second metal are different, and wherein the bonding wire has a cross-sectional ratio of not more than 0.8.

IPC Classes  ?

• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like

Abstract

The invention relates to a modular metal strip for generating conductor structures, which comprises undercuts in the contact regions and is free of unevenness caused by tensions during the generation of said undercuts. Accordingly, the invention provides a modular metal strip, wherein the individual module (11) comprises a carrier region (60) for attaching an electronic component (30) which has at least two sides (62) that are parallel to each other and delimited by corners (64), contact regions (70) which completely surround the at least two sides (62) of the carrier region (60) that are parallel to each other and the corners (64) of the at least two sides (62) of the carrier region (60) that are parallel to each other, the contact regions (70) that surround the corners (64) of the at least two sides (62) of the carrier region (60) that are parallel to each other being rounded, and further comprises punch-outs (80) that separate the carrier region (60) from the contact regions (70), at least the contact regions (70) comprising undercuts (50) that are connected to the punch-outs (80), characterized in that in the rounded regions the contact regions (70) comprise slits (90) that are in contact with the punch-outs (80).

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

The invention relates to a combined structure that is suitable for back-contacting solar cells, a method for back-contacting solar cells, and a solar cell module containing back contact solar cells. The aim to provide a combined structure which allows back contact solar cells to be easily, safely, stably, and cost-effectively back-contacted is solved by a combined structure which comprises a carrier foil and a metal foil in contact therewith and which is characterized in that the combined structure includes cavities extending through the carrier foil and the metal foil, the circumference of the cavity in the carrier foil being greater that the circumference of the cavity in the metal foil.

IPC Classes  ?

• H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells

Abstract

The present invention relates to a sintering method which allows joining components in a stable manner, wherein the process temperature is below 200 °C and stable contact points occur which have a low porosity and a high electrical and thermal conductivity. The invention relates to a method for joining components, in which (a) a sandwich arrangement is provided, which comprises at least (a1) a component (1), (a2) a component (2) and (a3) a metal paste situated between component (1) and component (2), and in which (b) the sandwich arrangement is sintered. The invention is characterized in that the metal paste comprises (A) 75-90 % by weight of at least one metal, which is present in the form of particles having a coating, containing at least one organic compound; (B) 0-12 % by weight of at least one metal precursor; (C) 6-20 % by weight of at least one solvent; and (D) 0.1-15 % by weight of at least one auxiliary sintering agent which is selected from the group consisting of (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials

Abstract

The present invention relates to a sintering method which allows joining components in a stable manner, wherein the process temperature is below 200 °C and stable contact points occur which have a low porosity and a high electrical and thermal conductivity. The invention relates to a method for joining components, in which (a) a sandwich arrangement is provided, which comprises at least (a1) a component (1), (a2) a component (2) and (a3) a metal paste situated between component (1) and component (2), and in which (b) the sandwich arrangement is sintered. The invention is characterized in that the metal paste comprises (A) 75-90 % by weight of at least one metal, which is present in the form of particles having a coating, containing at least one organic compound; (B) 0-12 % by weight of at least one metal precursor; (C) 6-20 % by weight of at least one solvent; and (D) 0.1-15 % by weight of at least one auxiliary sintering agent which is selected from the group consisting of (i) salts of organic acids, the organic acids having 1-4 carbon atoms, (ii) esters of organic acids, the organic acids having 1-4 carbon atoms, and (iii) carbonyl complexes.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C

Abstract

The invention relates to a TFT structure, wherein an oxide semiconductor is used in conjunction with an electrode material on the basis of Cu alloy.

IPC Classes  ?

• H01L 29/786 - Thin-film transistors

Abstract

The invention relates to a simple method for cohesively joining an electronic component to a substrate, wherein a) an electronic component with a first surface to be joined and a substrate with a second surface to be joined is provided, b) a soldering paste is applied to at least one of the surfaces to be joined, c) the electronic component and the substrate are arranged in such a way that the first surface of the electronic component to be joined is in contact to the second surface to be joined via the soldering paste and d) the arrangement from c) is soldered in order to create a cohesive joint between the electronic component and the substrate, wherein the soldering paste (i) comprises 10-30 wt % of copper particles, (ii) 60-80 wt % of particles of at least one material chosen from the group comprising tin and tin-copper-alloys and (iii) 3-30 wt% of flux material, wherein the median particle diameter of the copper particles and the particles from a material chosen from the group comprising tin and tin-cooper-alloys is not more than 15 μm and wherein the application thickness of the soldering paste is at least 20 μm.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

The invention relates to an optoelectronic component, comprising a connection carrier (1) having an electrically insulating film (3) on an upper side (1c) of the connection carrier (1), an optoelectronic semiconductor chip (8) on the upper side (1c) of the connection carrier (1), a recess (5) in the electrically insulating film (3) that frames the optoelectronic semiconductor chip (8), and a cast body (10) surrounding the optoelectronic semiconductor chip (8), wherein a bottom surface (32) of the recess (5) is formed at least regionally by the electrically insulating film (3), the cast body (10) extends at least regionally up to an outer edge (51) of the recess (5) facing the optoelectronic semiconductor chip (8), and the recess (5) is at least regionally free of the cast body (10).

IPC Classes  ?

• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H01L 33/52 - Encapsulations
• H01L 33/54 - Encapsulations having a particular shape