Henkel US IP LLC

United States of America

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Thermally conductive composition

      
Application Number 12722832
Grant Number 08586650
Status In Force
Filing Date 2010-03-12
First Publication Date 2010-08-19
Grant Date 2013-11-19
Owner Henkel US IP LLC (USA)
Inventor
  • Zhang, Yimin
  • Xiao, Allison Y.

Abstract

A composition for use as a thermally conductive composition in a heat-generating electronic device is provided. The composition comprises physically treated fillers modified with a surface area modifying agent and one or more resins.

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