The present invention relates to silane reactive hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C07C 335/12 - Derivatives of thiourea having nitrogen atoms of thiourea groups bound to acyclic carbon atoms of an unsaturated carbon skeleton the carbon skeleton containing six-membered aromatic rings
C09J 133/04 - Homopolymers or copolymers of esters
A61K 31/17 - Amides, e.g. hydroxamic acids having the group N—C(O)—N or N—C(S)—N, e.g. urea, thiourea, carmustine
A61K 31/167 - Amides, e.g. hydroxamic acids having aromatic rings, e.g. colchicine, atenolol, progabide having the nitrogen atom of a carboxamide group directly attached to the aromatic ring, e.g. lidocaine, paracetamol
A61K 31/145 - Amines, e.g. amantadine having sulfur atoms, e.g. thiurams (N—C(S)—S—C(S)—N or N—C(S)—S—S—C(S)—N)Sulfinylamines (—N=SO)Sulfonylamines (—N=SO2)
5.
ACCELERATOR/OXIDANT/PROTON SOURCE COMBINATIONS FOR TWO PART CURABLE COMPOSITIONS
Benzoylthiourea or benzoylthiourethane derivatives, together with oxidants and a source of protons, acting as cure accelerators for two part curable compositions are provided.
The present invention is directed' to compositions useful for sealing substrates and substrates coated therewith. Additionally methods of sealing and improving sealing performance using such compositions are provided.
A liquid photo-curable adhesive composition comprising: (a) 5 to 30 wt% of urethane acrylate, (b) 30 to 80 wt% of plasticizer, (c) 0.02 to 5 wt% of photo initiator, (d) 0 to 30 wt % of acrylate monomers and/or oligomer, is described.
Process for binding substrates with a liquid optically clear photo-curable adhesive A process for binding a top substrate to a base substrate is disclosed, in which (a) a liquid optically clear photo-curable adhesive is applied onto the top side of the base substrate, (b) the liquid optically clear photo-curable adhesive is partially cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm, (c) the top substrate is attached on the partially cured adhesive layer of step (b), (d) the adhesive is fully cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm.
The present invention relates to a process for producing free-flowing, agglomeration resistant amorphous poly-alpha--olefin based adhesive pellets. The process includes (a) extruding the adhesive through an orifice of a die plate immersed in a cooling fluid; (b) cutting the adhesive into a plurality of pellets in the cooling fluid; (c) solidifying the pellets at a temperature range of about 25°C to about 4Q°C for at (east 30 minutes; and (6) separating the pellets from the recrystallization fluid and drying; the pellets. The pellets harden at least three folds faster than conventionally formed pellets.
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
10.
INTEGRAL HOT MELT ADHESIVE PACKAGING FILMS AND USE THEREOF
Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.
The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
Disclosed are reactive functionalized, PIB grafted polymers having an architecture of one or more pendent polyisobutylene moieties grafted on to an organic backbone, wherein the backbone is not polyisobutylene and contains at least one telechelic, reactive functionality. Also a process for making the reactive functionalized, PIB grafted polymer s and curable compositions comprising the reactive functionalized, PIB grafted polymers.
C08F 255/10 - Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group on to polymers of olefins having four or more carbon atoms on to butene polymers
C08F 265/10 - Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group on to polymers of amides or imides
C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
Cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, an anhydride and a maleimide-, itaconimide-, or nadimide-containing compound, are provided. Cured products of the inventive cyanoacrylate compositions demonstrate improved moisture and/or heat resistance.
The present invention provides fast fixturing two pa adhesive compositions which include a first part containing a (meth) acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth) acrylic component of the first part.
Novel fluorinated compounds, their method of preparation and use are disclosed, as well as the incorporation of new and old fluorinated compounds in controlled radical polymerization processes to efficiently produce polymer compositions with unique and enhanced properties. Various cure mechanisms and types of end-uses are disclosed.
C07F 7/18 - Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
C07C 271/14 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of hydrocarbon radicals substituted by halogen atoms or by nitro or nitroso groups
C07C 69/003 - Esters of saturated alcohols having the esterified hydroxy group bound to an acyclic carbon atom
C07C 271/08 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms
16.
LENTICULAR PRINT THREE DIMENSIONAL IMAGE DISPLAY DEVICE AND METHOD OF FABRICING THE SAME
The invention provides a lenticular lens type three-dimensional image display device and a method of fabricating the device without a need for a clear plastic substrate transposed between the image and lenticular lenses. The device can be obtained by directly printing curable coatings onto the image, making them particularly well suited for volume production. The combination the image printing and application of curable coatings process can be joined together to conduct the single pass-process. The single pass-process allows for flexibility of the printing only selective areas of the substrate. Moreover, this process allows the device to be recyclable.
The invention provides a lenticular lens type three-dimensional image display device and a method of fabricating the device without a need for a clear plastic substrate transposed between the image and lenticular lenses. The device can be obtained by directly printing curable coatings onto the image, making them particularly well suited for volume production. The combination the image printing and application of curable coatings process can be joined together to conduct the single pass-process. The single pass-process allows for flexibility of the printing only selective areas of the substrate. Moreover, this process allows the device to be recyclable.
The present invention is directed to compositions useful for maintaining sealing force over time while under compression in compressive gaskets. Additionally, methods of preparing and using the sealing compositions and improving sealing performance using such compositions are provided.
The present invention relates to multi-functional polymeric resin blends which have a defined average molecular weight distribution. Additionally each polymeric component of the blend has a polydispersity of from about 1.01 to about 2.50, The average functionality of the blend is from about 1.8 to about 4.0. More particularly, the present invention relates to poly(meth)acrylates having three or more functional groups.. These highly functionalized resin blends are desirably prepared using controlled free radical polymerization techniques, such as single electron transfer living radical polymerization (SET-LRP) processes to produce a variety of blended resin systems which have tailored and enhanced properties.
The invention provides adhesives and methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that an adhesive with a polymer content greater than 70 weight percent can be formulated with a blend of (i) a metallocene catalyzed polypropylene polymer that has a density range of about 0.70 to about 0.91g/cm3 and a melt viscosity less than 50,000 cP at 190°C and (ii) a Ziegler-Natta catalyzed amorphous polybutene and/or polypropylene copolymer. Such adhesives have high creep resistance making them particularly well suited for disposable personal care garments.
The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
Photolytically induced redox curable compositions, which show a delayed onset of cure resulting in controllable "open times" for the end user consumer, are provided. These compositions are activated by exposure to electromagnetic radiation, such as UV/VIS radiation with a wavelength in the range of 254-470 nm, but show a commercially meaningful "open time" prior to cure. This property is particularly attractive when opaque substrates and/or substrates with low transmissivity are to be assembled.
The present invention relates to an adhesive composition, which comprises, based on the total weight of the adhesive composition: (1) from 38.0 to 75.0 percent by weight of a urethane oligomer carrying (meth)acryloyloxy group; (2) from 0.1 to 10.0 percent by weight of a multifunctional (meth)acrylate monomer; (3) from 15.0 to 60.0 percent by weight of a monofunctional (meth)acrylate monomer; (4) from 0.5 to 5.0 percent by weight of a photoinitiator; (5) from 0.1 to 5.0 percent by weight of a silane coupling agent; and (6) from 0 to 5.0 percent by weight of an additive, which is selected from one or more of the group consisting of a tackifier, a thickening agent, a flame retardant, a leveling agent and a thermal initiator. The cured adhesive composition has a high transparency and a high bonding strength, and the adhesive composition can be used for bonding various substrates in display devices.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
24.
USE OF REPELLENT MATERIAL TO PROTECT FABRICATION REGIONS IN SEMICONDUCTOR ASSEMBLY
A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
The present invention relates to a method for handling a wafer which comprises a plurality of grooves on its surface. The invention further relates to an assembly, comprising a wafer and a shape memory polymer film and to the use of said film as a fixing device device in dicing before grinding (DBG) processes.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Moisture curable poly(acrylate) compositions having more environmentally acceptable catalysts and/or faster skin over time. The compositions demonstrate resistance to hydrocarbon fluids, such as transmission fluids, oils and fuels and are useful as gasketing materials.
C08F 30/08 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more of a catalyst; a filler; a coloring agent; an antioxidant; and an optional reaction modifier. The cross linkable elastomeric sealant composition can be prepared by reacting a cross linkable elastomeric oligomer having a Tg with at least one of a glassy monomer and a rubbery monomer. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.
A composition for use as a thermally conductive composition in a heat-generating electronic device is provided. The composition comprises physically treated fillers modified with a surface area modifying agent and one or more resins.
patents
