An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.
An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
3.
ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP
The present invention addresses the problem of providing an electronic component attaching device with which it is possible to accurately and efficiently attach an electronic component to an object to be attached onto, and to readily accommodate a change in the type of the object to be attached onto. The present invention is an electronic component attaching device for attaching a plurality of electronic components disposed at prescribed locations to a plurality of objects to be attached onto at different intervals, the electronic component attaching device provided with: an extraction mechanism for extracting some of the plurality of electronic components disposed at the prescribed locations; a conveyance mechanism for conveying the electronic components extracted by the extraction mechanism, moving the electronic components so that the electronic components are disposed, before arriving at the objects to be attached onto, at the different intervals at which the electronic components are to be attached onto the objects to be attached onto, and conveying the electronic components to the objects to be attached onto; and an attach/transfer mechanism for attaching the electronic components conveyed by the conveyance mechanism onto the objects to be attached onto in prescribed positions thereof.
The present invention addresses the problem of providing an electronic component mounting device with which an electronic component mounted body, in which an electronic component and a circuit are accurately positioned, can be manufactured easily and reliably. The present invention is a mounting device for an electronic component, in which the electronic component is attached to a first band-shaped member on which a plurality of circuits are formed, said mounting device comprising: a first transport mechanism for transporting a first band-shaped member; a second transport mechanism for transporting a second band-shaped member; a transfer member for transferring a plurality of the electronic components to the second band-shaped member, with intervals therebetween in accordance with the position of the plurality of circuits; and an attachment mechanism for attaching to each other the first band-shaped member and the second band-shaped member to which the plurality of electronic components have been transferred. The transfer mechanism is capable of transferring the electronic components while changing the interval between the electronic components. Preferably, the mounting device is further equipped with a supply mechanism for supplying an adhesive material to the surface of at least one member which is to be attached to the surface of the other, that is, the first band-shaped member or the second band-shaped member, before the members are attached to each other.
The present invention addresses the problem of providing an electronic component attaching device with which it is possible to accurately and efficiently attach an electronic component to an object to which the electronic component is to be attached, and to easily respond when the type of the object to which the electronic component is to be attached is changed. The present invention is an electronic component attaching device for attaching each of a plurality of electronic components disposed at prescribed locations to a plurality of objects to which the electronic components are to be attached, said objects being arranged at prescribed intervals, wherein the electronic component attaching device is provided with: an extraction mechanism for extracting some of the plurality of electronic components disposed at prescribed locations; a conveyance mechanism for conveying the electronic components extracted by the extraction mechanism, moving each of the electronic components before arriving at the objects to which the electronic components are to be attached such that adjacent electronic components are set apart at the prescribed intervals, and conveying the electronic components to the objects to which the electronic components are to be attached; and an attach-and-transfer mechanism for attaching the electronic components conveyed by the conveyance mechanism to the prescribed positions of the objects to which the electronic components are to be attached.
Provided is a mechanical device management system with which the cause of and countermeasures for a problem can be investigated even when the timing which is critical with respect to the cause of and countermeasures for the problem does not coincide with the timing at which a signal reporting the occurrence of the problem is transmitted. This mechanical device management system 100 is equipped with: a mechanical device 200 having an operation screen display device 220 that displays an operation screen 600 operated by a user; a storage device 320 that stores mechanical operation data, which includes continuous image data acquired and generated continuously from the operation screen 600; a management device 400 arranged at a different location than the mechanical device 200 and including a display device 420 capable of displaying an image based on the continuous image data 902 stored in the storage device 320; and a control device 310 that transmits, to the display device 420, an image beginning from a given time and based on the continuous image data 902.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers.
[PROBLEMS] To provide an expander unit capable of altering the arrangement of works efficiently with high precision, and to provide equipment for manufacturing an electronic component including this expander unit. [MEANS FOR SOLVING PROBLEMS] An expander unit (10) comprises a plurality of work holders (110) for forming a holder row (11) by being arranged along the arranging direction Dr of an interposer, a means (12) for supporting each work holder (110) so as to be displaceable along the arranging direction Dr, a coupling member (13) for regulating the maximum interval at which two adjoining work holders (110) in the holder row (11) can be spaced apart, in the arranging direction Dr, and a means (14) arranged to drive at least one (110) of the work holders (110) located at the opposite ends of the holder row (11).
A production method for producing sanitary tampons implements a cord placement step of placing at least two continuous string-like cords in parallel on surfaces of at least two cotton pad pieces sequentially placed along a sewing line in a sewing direction of a sewing machine, a first cord sewing step of sewing the cord to one of two cotton pad pieces placed in an adjacent manner, a second cord sewing step of sewing the cord to the other of the two cotton pad pieces, and a cord switching step of switching the cords to be sewn to the cotton pad piece between the first cord sewing step and the second cord sewing step.
D05B 3/12 - Sewing apparatus or machines with mechanism for lateral movement of the needle or the work or both for making ornamental pattern seams, for sewing buttonholes, for reinforcing openings, or for fastening articles, e.g. buttons, by sewing for fastening articles by sewing
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs; as far as contained in class 07; in particular electronic parts mounting apparatus for mounting electronic parts to flexible printed circuit boards and other electronic circuit boards; optical film affixing apparatus for affixing optical film on the display surfaces of crystal liquid display panels, plasma display panels, electronic paper and other display electronic parts; apparatus for assembling and manufacturing electronic tags; apparatus for assembling and manufacturing ink tags, resonant tags and other security tags; apparatus for assembling and manufacturing electronic parts with such semiconductor parts as IC chips surface mounted on film-like electronic circuit boards; apparatus for assembling and manufacturing electronic parts and other semiconductor manufacturing apparatus; label affixing apparatus for affixing seat-like labels; tag sheets affixing apparatus for affixing sheet-like tag sheets provided with electronic tags, security tags and other tag parts; sanitary products manufacturing apparatus, disposable diaper manufacturing apparatus and other sanitary goods manufacturing apparatus; apparatus for assembling and manufacturing fuel cells, solar cells and other cells; automatic sealing machines; metalworking machines and tools; mining machines and apparatus; construction machines and apparatus; work transfer apparatus for continuously receiving and handing over work; chip transfer apparatus for transferring semiconductor chips; adhesive tape transfer apparatus for transferring adhesive tape to substrates; loading-unloading machines and apparatus; fishing machines and instruments; chemical processing machines and apparatus; textile machines and apparatus; machines and apparatuses for food processing or beverage processing; lumbering, woodworking, or veneer or plywood making machines and apparatus; pulp making, papermaking or paper-working machines and apparatus; printing or bookbinding machines and apparatus; leather tanning machines; tobacco processing machines; glassware manufacturing machines and apparatus; painting machines and apparatus; packaging or wrapping machines and apparatus; plastic processing machines and apparatus; semiconductor manufacturing machines and systems; machines and apparatus for manufacturing rubber goods; stone working machines and apparatus; non-electric prime movers [not for land vehicles]; pneumatic or hydraulic machines and instruments; adhesive tape dispensing machines; automatic stamping machines; repairing fixing machines and apparatus; machine elements [not for land vehicles]; machines and apparatuses for dissolving, distributing and applying hot melt adhesives and parts thereof; machines and apparatuses for dissolving, distributing and applying thermoplastic materials and parts thereof; sewing machines. Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin-operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus; as far as contained in class 09; in particular RFID tags and IC chip mounted circuit boards which are the parts of RFID tags; non-contact IC cards and IC chip mounted circuit boards which are the parts of non-contact IC cards; contact IC cards and IC chip mounted circuit boards which are the parts of contact IC cards; electronic circuit boards with such electronic devices as IC chips mounted on the surfaces of film-like substrates such as resin sheets or paper processed sheets; measuring or testing machines and instruments; tensiometers, tensiometers for elastic fibers; speed indicators; electric or magnetic meters and testers; wavemeters; electromagnetic wave measuring instruments; radio communication machines and apparatus; wireless communication equipment for RFID tags; time and date stamping machines; clocks (time-) [time recording devices], time clocks [time recording devices]; cash registers; coin counting or sorting machines; distribution machines, automatic vending machines; burglar alarm.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Textile machines and apparatus, namely, yarn take-up winders, yarn warping machines, yarn drawing machines, yarn tension stabilizers, web unwinding machines, rotary transfer machines, glue coating machines, web gathering machines, cord sewing machines, cutting machines and folding machines; pulp making, paper making and paper-working machines and apparatus, namely, pulp carding machines, paper calendering machines, paper coating machines, paper reeling machines, paper box making machines, paper bag making machines; packaging and wrapping machines and apparatus, namely, packing machines, sealing machines, wrapping machines; plastic processing machines and apparatus, namely, molding machines, film slitting machines, film coating machines, film tentering machines, film winding machines, film laminating machines; semiconductor manufacturing machines and systems, namely, flip chip bonders, chip mounters for circuit boards, ID-tag manufacturing machines, adhesive tape dispensing machines; automatic stamping machines Design for others in the field of paper converting machines, electronic micro-machines, factory automation equipment, electric systems control packages, and parts thereof; design for others of 3-D computer graphic arts; design for others of 3-D animated cartoons; packaging design for others; design for others of packaging and design and testing for new product development in the field of sanitary products; computer software design for others; computer programming for others, and maintenance of computer software; providing technical information and advice regarding the performance and operation of computers, testing and research on electricity in the field of microwaves and high and low radio frequencies; testing and research on machines, apparatus and instruments in the fields of cutters and slitters for paper, film and other non-woven materials, packaging machines, sewing machines, transfer machines, yarn tensioners, ultra-sonic machines, micro tip bonders for semiconductors, and auto-levelers; rental of computers; technical support, namely, providing back-up computer programs
