Abstract

The present invention belongs to the technical field of adhesives, relating to LED packaging silicones, and more particularly to a high-refractive-index LED packaging silicone. A high-refractive-index LED packaging silicone provided by the present invention comprises a component A and a component B, wherein a weight ratio of the component A to the component B is 10:1. The component A comprises the following raw material components in parts by weight: 80-90 parts of a methyl phenyl vinyl silicone resin, 8-18 parts of vinyl dimethyl diphenyl polysiloxane, 0.1-0.3 parts of a platinum-based catalyst, and 1-5 parts of a binder. The component B comprises the following raw material components in parts by weight: 40-60 parts of a methyl phenyl hydrogenated silicone resin, 40-60 parts of hydrogen-terminated diphenyl polysiloxane, and 0.1-0.3 parts of an inhibitor. The high-refractive-index LED packaging silicone in the present invention has the advantageous effects of high hardness, vulcanization resistance, outstanding adhesion, outstanding resistance to cold, heat and impact, etc.

IPC Classes  ?

• C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C09J 183/05 - Polysiloxanes containing silicon bound to hydrogen
• C09J 11/06 - Non-macromolecular additives organic
• C09J 11/08 - Macromolecular additives

Abstract

The present invention relates to an organic silicon composition for UV curing. The organic silicon composition consists of the following raw materials in parts by weight: 100 parts of polysiloxane having UV active functional groups at two ends, 10 to 30 parts of organic silicon resin having UV active functional groups, 5 to 10 parts of an organic silicon oligomer having UV activity, and 0.1 to 10 parts of a free radical photoinitiator. The present invention provides an organic silicon composition for UV curing; the organic silicon composition is excellent in mechanical performance, safe and environmentally-friendly, and has high transparency, high strength and low shrinkage.

IPC Classes  ?

• C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08F 283/12 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polysiloxanes
• C08F 222/14 - Esters having no free carboxylic acid groups
• C09J 151/08 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C09J 11/06 - Non-macromolecular additives organic
• C09J 11/04 - Non-macromolecular additives inorganic

Abstract

The present invention provides UV/moisture dual curable organic silicon glue. The components and contents of the glue?s raw materials are listed as follows (parts by weight): 97-98 parts of polymer and 2-3 parts of photoinitiator. The UV/moisture curable organic silicon glue belongs to a single component. With exposure to the ultraviolet light, it can carry out curing reaction and moisture curing reaction at the same time, while it can carry out moisture curing crosslinking reaction without ultraviolet light. The polymer contains a double bond and polysiloxane which can carry out photo-curing reaction, and also contains moisturecurable alkoxy and epoxy groups which can enhance the adhesiveness to the substrate.

IPC Classes  ?

• C08G 77/38 - Polysiloxanes modified by chemical after-treatment
• C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups