Abstract

A detachable urethral catheterization device for guiding a movement of a urinary catheter is provided. The detachable urethral catheterization device includes a conveying body and a clamping module. The conveying body includes a driving module, a conveying channel, and a module accommodating groove in communication with the conveying channel, the module accommodating groove including a first coupling component. The clamping module coupled to the driving module, and having a second coupling component, where the second coupling component is detachably coupled to the first coupling component in the module accommodating groove, and where the driving module is configured to control the clamping module to clamp the urinary catheter and move the urinary catheter in the conveying channel and the module accommodating groove.

IPC Classes  ?

• A61M 25/01 - Introducing, guiding, advancing, emplacing or holding catheters
• A61M 25/00 - CathetersHollow probes

Abstract

Provided is a reticle pod with a detachable supporting mechanism, which is suitable for a dual pod, including an outer pod and an inner pod received therein, the inner pod including: a base, and at least a supporting mechanism, mounted on the base. The supporting mechanism includes: a supporting assembly, connected to a mounting interface of the base, the supporting assembly includes a seat, at least one limiting post, and a mounting hole, the at least one limiting post connects to the seat, the mounting hole penetrates the base and not a circular hole; and a supporting element, having a matching structure, so that the supporting element detachably received in the mounting hole.

IPC Classes  ?

• G02B 27/32 - Fiducial marks or measuring scales within the optical system

Goods & Services

Reconditioning machines that are worn or partially destroyed; Machine reconditioning; Installation, maintenance and repair of machinery; machinery installation, maintenance and repair; maintenance and repair of machines for processing; Electric appliance installation and repair; Installation, maintenance and repair of Semiconductors analysis apparatus; Installation and maintenance of device for reticle and wafer measurement; Installation, maintenance and repair of computer hardware; Installation and maintenance of reticles washing apparatus; Installation and maintenance of inflators for reticles; Installation and maintenance of reticles cleaning devices; Maintenance, repair and cleaning of apparatus and machinery for manufacturing semi-conductors; Installation and maintenance of semiconductor manufacturing machines; Installation and maintenance of electronic component manufacturing machines; Installation and maintenance of reticle storage device for semiconductor manufacturing; Installation and maintenance of Automatic repair machine for chips [integrated circuits]; Installation, maintenance and repair of machines for processing plastics; Installation and maintenance of machines for processing plastics; Providing information relating to the repair or maintenance of semiconductor manufacturing machines and systems; Provision of information relating to the repair or maintenance of semiconductor manufacturing machines and systems; Provision of information relating to the repair or maintenance of semi-conductor manufacturing machines and systems; Providing information relating to the repair or maintenance of semi-conductor manufacturing machines and systems Research and development of new products for others; Research and development of technology in the field of semiconductor industry; Research in the field of artificial intelligence technology; Research in the area of semiconductor processing technology; Technological research in the field of semiconductor industry; Research on robotic process automation technology; technological research; conducting technical project studies; Analysis and research services for the semiconductor industry; Consulting and research services on contamination monitoring, control, process response, and process improvement technologies for reticles holders in semiconductor manufacturing facilities; Technical consulting services for manufacturing equipment pertaining to semiconductor andmicroelectronics production on wafers; Provide technical research services relating to the transportation, processing, storage, and packaging of semiconductor chips, wafers, reticles, and electronic components; Provide technical consulting services relating to the transportation, processing, storage, and packaging of semiconductor chips, wafers, reticles, and electronic components; Provide technical research services for improving the transportation processes of semiconductor chips, wafers, and reticles; Offer research and development services for storage and transportation containers used in semiconductor chips, wafers, and reticles; Testing of semiconductors Filters and purifiers for machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; Washing machine for industrial parts; Air washers; reticles washing apparatus; rinsing machines; holding devices for reticles; transport vehicle for transferring Front Opening Unifed Pod (parts of machines); inflators for reticles; fixture for Pellicle removal; polishing ring for chemical mechanical processing (CMP); reticles cleaning devices; Machines for manufacturing semiconductors; electronic component manufacturing machines; transport machines; Semiconductors storage devices; Automatic repair machine for chips [integrated circuits]; Device for Lead adjustment configuring of integrated circuits; Device for Lead adjustment guide of integrated circuits; Machines for processing plastics; Reticle storage device for semiconductor manufacturing (parts of machines); Loading and unloading machines; handling apparatus for loading and unloading; electronic parts manufacturing machines; Stands for machines; Industrial robots; Cargo handling machines; handling machines, automatic [manipulators]; Exposure apparatus for use in manufacturing semiconductors Front Opening Unifed Pod Transport pod for Front Opening Unifed Pod transfer; Photomask pellicle frame storage box; Reticles; Photomask pellicle; Reticles storage box; Photomask pellicle storage box; wafer storage box; Electronic equipment cabinet; Computer Software; Computer Programs; Automatic controller for dehumidification; electric installations for the remote control of industrial operations; user-programmable humanoid robots, not configured; precision measuring apparatus; Optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; Electronic imaging platforms in the field of inspection of semiconductor materials, namely, semiconductor wafers and reticles

Goods & Services

Reconditioning machines that are worn or partially destroyed; Machine reconditioning; Installation, maintenance and repair of machinery; machinery installation, maintenance and repair; maintenance and repair of machines for processing; Electric appliance installation and repair; Installation, maintenance and repair of Semiconductors analysis apparatus; Installation and maintenance of device for reticle and wafer measurement; Installation, maintenance and repair of computer hardware; Installation and maintenance of reticles washing apparatus; Installation and maintenance of inflators for reticles; Installation and maintenance of reticles cleaning devices; Maintenance, repair and cleaning of apparatus and machinery for manufacturing semi-conductors; Installation and maintenance of semiconductor manufacturing machines; Installation and maintenance of electronic component manufacturing machines; Installation and maintenance of reticle storage device for semiconductor manufacturing; Installation and maintenance of Automatic repair machine for chips [integrated circuits]; Installation, maintenance and repair of machines for processing plastics; Installation and maintenance of machines for processing plastics; Providing information relating to the repair or maintenance of semiconductor manufacturing machines and systems; Provision of information relating to the repair or maintenance of semiconductor manufacturing machines and systems; Provision of information relating to the repair or maintenance of semi-conductor manufacturing machines and systems; Providing information relating to the repair or maintenance of semi-conductor manufacturing machines and systems Research and development of new products for others; Research and development of technology in the field of semiconductor industry; Research in the field of artificial intelligence technology; Research in the area of semiconductor processing technology; Technological research in the field of semiconductor industry; Research on robotic process automation technology; technological research; conducting technical project studies; Analysis and research services for the semiconductor industry; Consulting and research services on contamination monitoring, control, process response, and process improvement technologies for reticles holders in semiconductor manufacturing facilities; Technical consulting services for manufacturing equipment pertaining to semiconductor andmicroelectronics production on wafers; Provide technical research services relating to the transportation, processing, storage, and packaging of semiconductor chips, wafers, reticles, and electronic components; Provide technical consulting services relating to the transportation, processing, storage, and packaging of semiconductor chips, wafers, reticles, and electronic components; Provide technical research services for improving the transportation processes of semiconductor chips, wafers, and reticles; Offer research and development services for storage and transportation containers used in semiconductor chips, wafers, and reticles; Testing of semiconductors Filters and purifiers for machines, namely, filters and purifiers for removing contaminants from gases used in the semiconductor industry; Washing machine for industrial parts; Air washers; reticles washing apparatus; rinsing machines; holding devices for reticles; transport vehicle for transferring Front Opening Unifed Pod (parts of machines); inflators for reticles; fixture for Pellicle removal; polishing ring for chemical mechanical processing (CMP); reticles cleaning devices; Machines for manufacturing semiconductors; electronic component manufacturing machines; transport machines; Semiconductors storage devices; Automatic repair machine for chips [integrated circuits]; Device for Lead adjustment configuring of integrated circuits; Device for Lead adjustment guide of integrated circuits; Machines for processing plastics; Reticle storage device for semiconductor manufacturing (parts of machines); Loading and unloading machines; handling apparatus for loading and unloading; electronic parts manufacturing machines; Stands for machines; Industrial robots; Cargo handling machines; handling machines, automatic [manipulators]; Exposure apparatus for use in manufacturing semiconductors Front Opening Unifed Pod Transport pod for Front Opening Unifed Pod transfer; Photomask pellicle frame storage box; Reticles; Photomask pellicle; Reticles storage box; Photomask pellicle storage box; wafer storage box; Electronic equipment cabinet; Computer Software; Computer Programs; Automatic controller for dehumidification; electric installations for the remote control of industrial operations; user-programmable humanoid robots, not configured; precision measuring apparatus; Optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; Electronic imaging platforms in the field of inspection of semiconductor materials, namely, semiconductor wafers and reticles

Abstract

An inspection system and an inspection method for at least one supporting beam include the steps of setting a lateral surface of one supporting beam as a reference point for detecting an offset amount; applying a predetermined force respectively to the supporting beams in sequence in a moving direction; detecting the offset amount of the supporting beam as applied by the predetermined force; and, acquiring an inspection result by a calculation based on the reference point and the offset amount. The inspection system includes a pushing member, a driving module, and an offset sensor. The pushing member is used for applying a predetermined force to the supporting beam. The driving module connects to the pushing member for driving the pushing member to move toward the supporting beam. The offset sensor is used for detecting an offset amount of the supporting beam as applied by the predetermined force.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

A dry cleaning device adapted to clean a container component of a container of a semiconductor manufacturing process and adapted to clean the container component by carbon dioxide snowflakes. The dry cleaning device can first inspect the container component before and after cleaning, clean the container component by carbon dioxide snowflakes according to a predetermined cleaning working set, and forwards the container component to a next workstation once the cleaning of the container component is complete. The dry cleaning device is adapted to clean a container of a semiconductor manufacturing process in a fast and effective manner without involving any liquid solvents.

IPC Classes  ?

• B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
• B08B 9/28 - Cleaning of containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans, are brought the apparatus cleaning by splash, spray or jet application, with or without soaking
• B08B 9/46 - Inspecting cleaned containers for cleanliness

Abstract

The present disclosure provides a reticle pod comprising a base and at least one reticle support disposed on the base, the reticle support reticle support is arranged for carrying a reticle and has a resilient means. When the downward pressure applied to the reticle support is less than or equal to a critical value, a height of the reticle support is maintained at a predetermined height; when the downward pressure applied to the reticle support is greater than the critical value, the reticle support absorbs the downward pressure by deforming, and then the reticle support restores to the predetermined height only when the downward pressure is shared by another reticle support.

IPC Classes  ?

• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a dual pod including an inner pod and an outer pod. The inner pod has at least one engaging portion provided on a relative outside of the inner pod. The outer pod defines an accommodation space for receiving the inner pod. The outer pod has at least one guide mechanism provided on a relative inside of the outer pod, and the guide mechanism is guided by and limited at the engaging portion such that an offset movement of the inner pod within the outer pod is restricted.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof

Abstract

A holding device for a top-opening substrate container includes a holding assembly for pushing a substrate actuator disposed at a substrate to operate. The holding assembly includes a holding body and a pushing actuator. The pushing actuator includes a first guiding sloped surface for pressing against a second guiding sloped surface of an inner surface of a container door structure. The first guiding sloped surface causing corresponding pushing and displacement between the first guiding sloped surface and the second guiding sloped surface according to a supporting force of the container door structure. A pushing section is connected to the first guiding sloped surface, and capable of correspondingly pushing the substrate actuator to operate according to a level of the pushing and displacement of the first guiding sloped surface, such that the substrate actuator displaces substrates and stacks the substrates with another in layers.

IPC Classes  ?

• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
• B65D 81/05 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents

Abstract

A supporting structure and an inspection equipment thereof and a calibrating tool for the inspection equipment include backbone and parallel blocks in the supporting structure. The receiving trench is defined between two adjacent supporting portions on the backbone for receiving supporter. Each supporting portion has a first limiting portion and the supporter has a second limiting portion. The parallel block is disposed between the first and the second limiting portion to restrain relative movement of the supporter. The inspection equipment is used for inspecting the supporting structure and includes plural inspection regions for inspecting the deviation amount of the supporter based on how much the moving door travels towards the substrate carrier. The calibrating tool is used for calibrating the inspection equipment. Whether the inspection surface conforms with a calibration condition is inspected through the inspection regions based on how much the moving door travels toward the calibrating tool.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/66 - Testing or measuring during manufacture or treatment

Abstract

A supporting device and a protective case for a probe card are provided. The protective case includes the supporting device, a case body, an upper cover, and plural switching members. The supporting device has plural quick-release members and plural bevel grooves. The case body has plural arrangement grooves each configured to mate with the corresponding quick-release member to fasten the supporting device to the case body. The probe card is connected with a protecting cover that includes plural fastening members fastened to the probe card. When the protecting cover and the probe card connected therewith are placed on the supporting device, the bevel grooves actuate the fastening members and thereby unfasten the fastening members from the probe card. The switching members are provided on the case body and are each lockable to a corresponding engaging member on the upper cover to lock the upper cover the case body together.

IPC Classes  ?

• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• G01R 1/073 - Multiple probes

Abstract

A protection device for a substrate container includes a container door and a limiter for pushing against and securing a substrate, a support member and an elastic connecting component for engaging and securing the container body, and an antistatic member having elasticity interference to provide an electrostatic dissipation path as electrostatic protection for the substrate. The protection device for a substrate container improves a protection effect of a substrate stored in the substrate container, and prevents hazards to a substrate caused by vibration, dust, and static electricity.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A valve cover for using in a substrate carrier includes a main body and plural elastic arms. The substrate carrier has a shell and a base disposed on a bottom of the shell. A purge valve is received at the bottom and a gas opening is provided on the base. The main body of the valve cover is disposed on the base, and the elastic arms are disposed on the main body and located at the gas opening. The elastic arms are used for fixing the valve cover between the bottom of the shell and the base. A top face of the valve cover is lower than a surface height of the base and a surface height of the purge valve.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

A reticle pod with backside static dissipation has an inner pod defining an accommodation space for a reticle. Multiple flexible guiding components are correspondingly disposed on multiple outer mounting portions of the inner pod in order to guide an inner cover and an inner base of the inner pod to position without relative displacement. Multiple conductive retainers are correspondingly arranged in the accommodation space to push against a backside of the reticle and form a full-time electrical conduction with the back side of the reticle, so as to establish a static dissipation path by the conductive retainers and the inner pod. Meanwhile, with the conductive retainers pushing against the reticle as well as the flexible guiding components providing the inner cover and the inner base with automatic position guiding, the reticle is automatically pushed and positioned to a center position of the inner base.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• H05F 3/00 - Carrying-off electrostatic charges

Abstract

Provided is a substrate carrier including: a shell defining therein a wafer storage space; and at least one installation structure integrally formed with an inner wall of the shell and adapted to hold at least one gas diffuser, allowing the at least one gas diffuser to be disposed outside an operating range of a front end of a robotic arm. Not only is the installation structure of the substrate carrier structurally simplified, but the gas diffuser is also prevented from interfering with the robotic arm.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A door having a stabilization mechanism for a lock is provided. The door is suitable for a substrate carrier and includes a bottom plate, a cover and a limiting structure. The bottom plate and the cover define an accommodating space for accommodating a plurality of lock structures, each lock structure configured to move between an unlocked position and a locked position, an limiting structure is disposed between lock structure and the cover, and the limiting structure provides an elastic force corresponding to the displacement of the lock structures between the unlocked position and the locked position, such that the lock structures is maintained to move at a horizontal level under the elastic force. The structural design and configuration of the disclosure can prevent collision of substrate carrier or a problem of door drop resulted from the door falling to open/close smoothly.

IPC Classes  ?

• E05B 17/00 - Accessories in connection with locks
• E06B 3/48 - Wings connected at their edges, e.g. foldable wings

Abstract

The present invention provides a reticle pod comprising a lower cover and a support mechanism. The lower cover includes a carrying surface and a plurality of securing seats distributed on the carrying surface. The support mechanism includes a supporting portion extending upward for supporting a reticle or a reticle carrier, and a securing portion opposite the supporting portion, wherein the securing portion is detachably connected with a corresponding securing seat, so that the support mechanism can be selectively installed on the lower cover.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a measuring apparatus for measuring a wafer carrier having an opening end and at least one gas tower deposited inside, the measuring apparatus comprising a carrying interface for securing the wafer carrier. The opening end of the wafer carrier faces an inspection space of measuring apparatus. The carrying interface having a gas supplying assembly connected to a base of the wafer carrier so as to supply gas to the wafer carrier. The internal of the inspection space disposed a measuring assembly which is mainly used to measure gas flow rate from the gas tower in the accommodating space. The measuring assembly comprises a plurality of wind speed sensing elements and a plurality of displacement sensing element, which are fitted to the a second connecting element.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention discloses a reticle storage pod including an outer pod which includes an outer cover and an outer base. The outer cover and the outer base can be coupled to securely accommodate one of a first inner pod and a second inner pod that are differently structured in the outer pod. The first inner pod and the second inner pod are for individually accommodating a reticle. The outer cover is provided with at least one first hold-down mechanism and at least one second hold-down mechanism, and the first hold-down mechanism and the second hold-down mechanism respectively act on a cover of the first inner pod and a cover of the second inner pod that are differently structured.

IPC Classes  ?

• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

Abstract

The invention discloses a container for a non-rectangular reticle, adapted for accommodating an elliptical reticle, and including a cover and a base which are configured to define an elliptical space when engaged with each other. The cover and the base have reticle retainers and reticle supports, respectively, which are configured to securely hold the elliptical reticle.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a latching guide structure arranged inside a door of semiconductor carrier. The latching guide structure comprises an upper latching part, a lower latching part, at least one elastic unit and a driver. Moreover, a first guiding portion of the upper latching part is matched with a second guiding portion of the lower latching part, therefore to define the installation space for the at least one elastic unit. On the other hand, the driver simultaneously actuates an upper actuating unit of the first guiding portion and a lower actuating unit of the second guiding portion to linearly move in reverse direction therebetween. The range of the linear motion of the upper actuating unit and the lower actuating unit represents the compression or extension of the at least one elastic unit, determining to control the open/close status of the upper latching part and the lower latching part.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention discloses a reticle storage pod including an outer pod which includes an outer cover and an outer base. The outer cover and the outer base can be coupled to securely accommodate one of a first inner pod and a second inner pod that are differently structured in the outer pod. The first inner pod and the second inner pod are for individually accommodating a reticle. The outer cover is provided with at least one first hold-down mechanism and at least one second hold-down mechanism, and the first hold-down mechanism and the second hold-down mechanism respectively act on a cover of the first inner pod and a cover of the second inner pod that are differently structured.

IPC Classes  ?

• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

Abstract

A carrier board conveying box with a reinforced structure comprises a container body, two clamping parts, and at least two reinforced structures. The container body has a top plate, a bottom plate, a plurality of side plates connecting the top plate and the bottom plate and a side opening. The top plate, the bottom plate, and the side plates are clamped to form an accommodating space. Two clamping parts are respectively disposed at two opposite sides of the container body. At least two reinforced structures are respectively disposed at the two opposite sides of the container body, and each of the reinforced structures is adjacent to a position of the side opening. The carrier board conveying box with a reinforced structure solves the problem of container distortion and deformation of the container body caused by load factors because of repeatedly bearing the weight of the carrier boards during transfer.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The invention discloses a substrate container including a shell and a cover member. The shell defines an accommodation space, and has a bottom and at least one exhaust hole formed on the bottom, wherein the exhaust hole is adjacent to an opening of the shell. The cover member is mounted to the bottom of the shell, and the cover member and the bottom of the shell define a negative pressure cavity above and communicating with the at least one exhaust hole. An elongated exhaust hole is defined above the negative pressure cavity, and communicates with the negative pressure cavity and the accommodation space. A gas in the accommodation space is exhausted sequentially from the elongated exhaust hole, the negative pressure cavity and the at least one exhaust hole.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.

IPC Classes  ?

• B65D 55/02 - Locking devicesMeans for discouraging or indicating unauthorised opening or removal of closure
• B65D 43/02 - Removable lids or covers
• B65D 85/00 - Containers, packaging elements or packages, specially adapted for particular articles or materials

Abstract

The present invention discloses a gas filter device detachably mounted onto a reticle carrier. The gas filter device includes at least one porous diffusion member and a plurality of connecting members. The porous diffusion member is detachably connected to the reticle carrier by the plurality of connecting members, so that the porous diffusion member is restricted on the reticle carrier to provide filtering function.

IPC Classes  ?

• B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours

Abstract

A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 81/02 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage

Abstract

The invention discloses a substrate container which includes at least one support for substrates. The support has plural ribs distantly separated with each other. The ribs define multiple slots and a carrying plane for receiving a substrate. Each of the ribs has a front end and a rear end. Rear ends of two neighboring ones of the ribs are connected by a closing portion, so that the rear end of a slot defined by the two neighboring ones of the ribs is closed. The closing portion has a concave surface. The concave surface and the carrying plane define a clamping position for substrate confinement.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 25/24 - External fittings for spacing bases of containers from supporting surfaces, e.g. legs

Abstract

A substrate container includes a container body having a storage space and an opening in communication with the storage, a door body disposed at the opening, a limiter disposed on the door body and facing the opening, a supporter disposed on one side of the storage space, and at least two elastic buffer elements tightly disposed between the door body and the limiter and between the supporter and the container body, respectively. A door assembly of a substrate container, a support assembly of a substrate container and an elastic buffer element used in a substrate container are further provided. The elastic buffer element is applied between any two rigid elements in the substrate container to provide a buffer force and an appropriate frictional force, so as to alleviate the problems of impact and dust generated between the rigid elements.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 25/10 - Devices to locate articles in containers
• B65D 25/24 - External fittings for spacing bases of containers from supporting surfaces, e.g. legs
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus

Goods & Services

Housing for hydraulic linear actuators being parts of machines (other than for land vehicles)

Goods & Services

Housing for hydraulic linear actuators being parts of machines (other than for land vehicles)

Abstract

A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• E05B 65/52 - Other locks for chests, boxes, trunks, baskets, travelling bags, or the like
• E05C 9/04 - Arrangement of simultaneously-actuated bolts or other securing devices at well-separated positions on the same wing with two sliding bars moved in opposite directions when fastening or unfastening

Abstract

Provided is a quick-release valve including: a quick-release member having a collar detachably coupled to a bottom opening of a base; and a sleeve having a flow passage for allowing a gas to enter or exit a substrate container. The collar has a pair of ear portions extending outward therefrom along a diameter direction and a handle extending outward therefrom along a radius direction. The ear portions are at a height substantially different from the handle.

IPC Classes  ?

• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A locking device is provided adjacent to a side opening of a container and includes a handle having a driving section and being pivotally turnably mounted to a top of the container; a long bar-shaped locking member having two opposite ends pivotally connected to the top and a bottom of the container to be turnable toward or away from the side opening; and a return spring mounted on the handle. The locking member includes an upper section located adjacent to the driving section. When the handle is pivotally turned from a horizontal to a vertical position relative to the top, the driving section is turned to drive the upper section for the locking member to pivotally turn toward the side opening. A container using the above locking device is disclosed. When the container is lifted at the handle, the locking member is driven to automatically lock the side opening.

IPC Classes  ?

• E05C 3/22 - Fastening devices with bolts moving pivotally or rotatively with latching action with operating handle or equivalent member moving otherwise than rigidly with the latch the bolt being spring-controlled
• E05B 15/04 - Spring arrangements in locks
• E05C 3/02 - Fastening devices with bolts moving pivotally or rotatively without latching action
• E05C 19/00 - Other devices specially designed for securing wings

Abstract

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

The present invention discloses a reticle storage pod including an outer pod which includes an outer cover and an outer base. The outer cover and the outer base can be coupled to securely accommodate one of a first inner pod and a second inner pod that are differently structured in the outer pod. The first inner pod and the second inner pod are for individually accommodating a reticle. The outer cover is provided with at least one first hold-down mechanism and at least one second hold-down mechanism, and the first hold-down mechanism and the second hold-down mechanism respectively act on a cover of the first inner pod and a cover of the second inner pod that are differently structured.

IPC Classes  ?

• G03F 7/20 - ExposureApparatus therefor
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

Abstract

The present invention provides a reticle pod comprising a lower cover and a support mechanism. The lower cover includes a carrying surface and a plurality of securing seats distributed on the carrying surface. The support mechanism includes a supporting portion extending upward for supporting a reticle or a reticle carrier, and a securing portion opposite the supporting portion, wherein the securing portion is detachably connected with a corresponding securing seat, so that the support mechanism can be selectively installed on the lower cover.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 μm to 3400 μm to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• G08C 17/02 - Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details

Abstract

The invention discloses a reticle pod for receiving a reticle. The reticle pod includes a base and plural support device provided on the base for supporting the reticle. A first distance is defined between a peripheral area of a bottom surface of the reticle and an upward facing top surface of the base. A second distance is defined between a central area of the bottom surface of the base and the upward facing top surface of the base, wherein the central area is encircled by the peripheral area. The second distance is larger than the first distance.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/20 - ExposureApparatus therefor

Abstract

The instant disclosure discloses a workpiece container system comprising a storage assembly that comprises a seat member. The seat member has a storage portion that defines a longitudinal axis through a geometric center region thereof, provided with a workpiece receiving region that encompasses the geometric center region and configured to receive a workpiece. The seat member has a pair of flank portions arranged on opposite sides of the storage portion along the longitudinal axis, each having a thickness thinner than that of the storage portion. A diffuse inducing component is provided on the storage portion in the workpiece receiving region yet offsets the geometric center region thereof.

IPC Classes  ?

• G03F 7/20 - ExposureApparatus therefor
• B01D 69/12 - Composite membranesUltra-thin membranes
• B01D 71/02 - Inorganic material
• B01D 53/26 - Drying gases or vapours

Abstract

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• G08C 17/02 - Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details

Abstract

The instant disclosure discloses a workpiece container system comprising a storage assembly. The storage assembly comprises a seat member and a seat cover. The seat member defines a workpiece receiving region that encompasses a geometric center region thereof, configured to receive a workpiece; wherein a lower diffuse inducing component is provided on the seat member within a planar projection of the workpiece yet offsets the geometric center region. The seat cover is configured to engage the seat member at a periphery region around the workpiece receiving region thereof, so as to cooperatively form an enclosure for housing the workpiece; wherein an upper diffuse inducing component is provided on the seat cover over the planar projection of the workpiece and protectively overlaps the geometric center region of the seat member.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• B65D 81/02 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A supporting shelf module includes a plurality of plastic supporting plates parallelly arranged in a height direction, and at least one pair of metal-made connectors located at two opposite ends of the supporting plates in the height direction. The connectors in one pair are correspondingly located in two horizontal planes perpendicular to the height direction. A wafer container is also disclosed, which includes a container body having at least two sets of the supporting shelf modules mounted therein, at least two top retaining brackets and at least two bottom retaining grooves provided on an inward side of a top and a bottom panel of the container body, respectively. The supporting shelf module has upper ends engaged with the top retaining brackets and lower ends engaged with and limited to the bottom retaining grooves in an engaging direction. Thus, the tolerance problem of the conventional wafer shelf can be solved.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 21/02 - Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
• B65D 21/08 - Containers of variable capacity
• B65D 25/10 - Devices to locate articles in containers
• B65D 47/32 - Closures with discharging devices other than pumps with means for venting
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

A modularized large-sized carrier includes at least two body modules, at least one hermetic seal component and a back board. The body modules are connected to each other peripherally and arranged in a depth direction. The hermetic seal component surrounds junctions of the body modules. The back board is disposed behind the last one of the body modules. The modularized large-sized carrier overcomes existing carrier size limitations otherwise caused by injection molding machines and continuously expands in the depth direction to thereby enlarge the airtight storage space of the carrier.

IPC Classes  ?

• B65D 21/08 - Containers of variable capacity
• B65D 21/02 - Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together

Abstract

A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.

IPC Classes  ?

• B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
• B65D 25/10 - Devices to locate articles in containers

Abstract

A substrate container with enhanced flow field therein includes a box, at least one offset inflation mechanism and at least one gas diffusion mechanism. The offset inflation mechanism is disposed outside internal receiving space of the box. The offset inflation mechanism has a gaseous chamber extending in the same direction as a bottom panel. The gas diffusion mechanism includes a base, a partition wall and at least one diffusion member. The base masks an outlet of the gaseous chamber to form an auxiliary gaseous chamber. The partition wall extends perpendicularly to the bottom panel to form a vertical first gas channel in communication with the auxiliary gaseous chamber. The diffusion member and the partition wall together define a second gas channel. The partition wall has at least one gap whereby the first gas channel and the second gas channel are in communication with each other.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 21/02 - Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
• B65D 21/08 - Containers of variable capacity
• B65D 25/10 - Devices to locate articles in containers
• B65D 47/32 - Closures with discharging devices other than pumps with means for venting
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The present invention discloses a shielding jig which mainly comprises an adjustment unit, a positioning unit and a sealing unit. The adjustment unit is configured and engaged between the positioning unit and the sealing unit. Therefore, a first actuation surface of the adjustment unit matches with a second actuation surface of the sealing unit, resulting in expansion of the sealing unit. This expansion makes the shielding jig be able to shade and seal any workpiece.

IPC Classes  ?

• B05B 12/20 - Masking elements, i.e. elements defining uncoated areas on an object to be coated
• F16J 15/02 - Sealings between relatively-stationary surfaces
• F16J 15/06 - Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces

Abstract

A reticle pod cleansing apparatus includes a cavity, a gas injection unit, a dust counting unit and a control unit. The cavity has a chamber, an inlet opening in communication with the chamber, and an outlet opening in communication with the chamber. The gas injection unit is disposed at the chamber and is in communication with an inlet device through the inlet opening to inject gas into the chamber. The dust counting unit is in communication with the outlet opening to receive gas discharged from the outlet opening and calculate dust quantity of the gas discharged. The control unit is in signal communication with dust counting unit and adapted to send a signal when the calculated dust quantity is less than a predetermined threshold. During a cleansing process, the reticle pod cleansing apparatus detects precisely and instantly whether a reticle pod being cleansed has been sufficiently cleansed or not.

IPC Classes  ?

• B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
• B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
• B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/82 - Auxiliary processes, e.g. cleaning

Abstract

A reticle pod having a positioning member includes a base, a lid and a plurality of positioning members. The lid shuts relative to the base to form a substantially cuboid case. The case has a storing space for receiving a reticle. The positioning members are arranged in a shutting direction and disposed on at least two edges of the lid or at least two edges of the base, respectively. The positioning members each include a connecting portion, a correcting portion and a guiding slope portion. The connecting portion connects the edges of the lid. The correcting portion has one end connected to the connecting portion and extending in a shutting direction and an opposing end connected to the guiding slope portion. The guiding slope portion has a slope extending outward. The reticle pod having a positioning member is error-free, allowing the lid to shut precisely relative to the base.

IPC Classes  ?

• G03F 7/20 - ExposureApparatus therefor
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The invention discloses a substrate carrier latching structure, which mainly comprises a top portion, a cover and a detachable module. The top portion is disposed on the enclosure of a substrate carrier, and the cover is connected to the top portion via a detachable module. As such, the excessive stress on the substrate carrier is avoided to maintain the integrity of substrates stored in the inner portion of the substrate carrier.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

The invention discloses a container for accommodating a substrate. The container includes a base having at least one first supporting surface and a lid having at least one second supporting surface to engage with the first supporting surface of the base, so as to define an accommodating space for the substrate. The first supporting surface of the base and the second supporting surface of the lid have the same slope with a respective flatness of 0.04 mm or less, so that an effective hermetic seal between the first supporting surface and the second supporting surface is formed when the two surfaces contact each other.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants

Abstract

The invention discloses a reticle pod including a base and a lid mounted to the base. The base has a bottom surface having at least one first mark and at least one second mark. The first mark has a first reflectivity relative to a light source, and the second mark has a second reflectivity relative to the light source. The first reflectivity is different from the second reflectivity, and both are also different from that of the rest area of the bottom surface.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• G03F 1/22 - Masks or mask blanks for imaging by radiation of 100 nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masksPreparation thereof
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• G06K 7/14 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The invention discloses a reticle pod having a lid and multiple pin assemblies. The pin assembly includes a movable member movable relatively to a ceiling of the lid and an elastic member configured to arrange the movable member in between the elastic member and the ceiling of the lid. In the case where the reticle pod is provided without receiving a reticle, the ceiling of the reticle pod determines the movable member stays at a first level. In the case where the reticle pod is provided with a reticle, the elastic member collaborates with the movable member such that the movable member holds the reticle at a second level that is higher than the first level.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/22 - Masks or mask blanks for imaging by radiation of 100 nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masksPreparation thereof
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/20 - ExposureApparatus therefor

Abstract

A method for containing a reticle in a pod is provided. The method includes opening the pod such that a pressing element retained movably on the pod by a limiting cap moves to a first position, wherein a shoulder part of the pressing element between a pressure receiving part and a pressing part of the pressing element is spaced from the limiting cap. The method further includes placing the reticle in the pod such that the reticle is pressed by the pressing element.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

Abstract

A substrate container including a container body, a filter member, a back cover is provided. The container body having a top face, a bottom face opposing the top face, a back plate of a first height connecting the top face and the bottom face, a front opening located between the top face and the bottom face, and a back opening opposing the front opening. The front opening enables passage of a substrate and the back opening is located on the back plate and has a smaller second height. The filter member covers the back opening. The back cover establishes sealing engagement with the container body. A gas guiding channel extending in a direction of the first height is formed between the back cover and the container body. The back cover and the filter member define a buffering compartment, and the gas guiding channel has an outlet connecting the buffering compartment.

IPC Classes  ?

• B65D 81/18 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The instant disclosure discloses a container system, comprising an inner base, configured to receive a workpiece, the inner base including a first treatment area that corresponds to a workpiece accommodating region, a second treatment area arranged around the first treatment area of the inner base, and a workpiece supporting post arranged at a border region between the first treatment area and the second treatment area.

IPC Classes  ?

• B65D 43/02 - Removable lids or covers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance

Abstract

An apparatus for containing a substrate and a method of manufacturing the apparatus are provided. The apparatus for containing a substrate includes: a base having a periphery and an upward-facing top horizontal planar surface with a plurality of contact elements, the contact elements being used for engaging the substrate to hold the substrate upon the upward-facing top horizontal planar surface, an upward-facing frame-like support surface extending from the upward-facing top horizontal planar surface and surrounding the contact elements at a position proximate to the periphery of the base; and a cover having a downward-facing frame-like support surface being in large-area contact with the upward-facing frame-like support surface to define a cavity for containing the substrate between the base and the cover. The downward-facing and upward-facing frame-like support surfaces in contact with each other are not at the same level as the upward-facing top horizontal planar surface.

IPC Classes  ?

• G03F 7/20 - ExposureApparatus therefor

Abstract

A reticle pod includes a body, cover, sliding-rail member, sliding-fastening member and shut-corresponding element. The sliding-rail member has a dent portion and a slot portion and defines a locked direction. The dent portion extends from the slot portion in the locked direction. The sliding-fastening member is slidably disposed at the sliding-rail member. The sliding-fastening member has a fastening portion and resilient arms. The resilient arms are inserted into a slot of the slot portion. The fastening portion has a fastening groove corresponding in height to the slot portion. An oblique-guide surface is disposed above the fastening groove. When the cover switches from an open state to a closed state, the shut-corresponding element pushes the sliding-fastening member across the oblique-guide surface and thus compresses the sliding-fastening member, allowing the shut-corresponding element to enter the fastening groove. Then, the resilient arms releases resilient potential energy whereby the sliding-fastening member rebounds.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof

Abstract

The invention provides a reticle pod, in particular the reticle pod with wear parts. The reticle pod is a large-size reticle pod and includes a vertical accommodation space for accommodating reticles. The reticle pod mainly includes a cover and a box. The box is used to combine with the cover to form an internal space in order to accommodate reticles. Guiding members are disposed outside the box, and the guiding members can help guide the relative position of the box and the cover. The contact surfaces of the box contacting the upright reticles are disposed with at least two slots, and each of the slot is configured with at least one wear part. The wear part module further includes a first wear part disposed on the upper portion of the slot and a second wear part disposed on the lower portion of the slot.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

Abstract

A reticle retaining system including an inner pod and an outer pod is described. The inner pod includes an inner base configured to receive a workpiece; an inner cover configured to couple to the inner base, thereby forming an interior for housing the workpiece; and a hold down pin movably arranged through the inner cover and configured to press the workpiece. The outer pod includes an outer base configured to receive the inner base, an outer cover configured to couple to the outer base, and a pushing element arranged on the outer cover. The hold down pin, the outer cover and the pushing element have a charge dissipation property. When the pushing element pushes the hold down pin to press the workpiece, a charge dissipation path is established from the received workpiece, through the hold down pin and the pushing element, to the outer cover.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/20 - ExposureApparatus therefor

Abstract

A quick release purge valve and a substrate container using same are provided. The container includes a base which has a cover plate and a bottom plate. The quick release purge valve includes a snap plate, a gasket fitting, and a valve element. The snap plate detachably engages with the bottom plate and is at most evenly aligned with the bottom plate. The gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the two plates. The valve element is disposed in the conduit for limiting a flow direction of the gas. The gasket fitting is fixed in the base when the snap plate and the bottom plate are in an engaged state and is removable from the base when the snap plate and the bottom plate are in a disengaged state.

IPC Classes  ?

• F16K 24/04 - Devices, e.g. valves, for venting or aerating enclosures for venting only
• B01D 46/42 - Auxiliary equipment or operation thereof
• B01D 46/10 - Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.

IPC Classes  ?

• B65D 53/06 - Sealings formed by liquid or plastic material
• B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
• B01D 46/42 - Auxiliary equipment or operation thereof
• B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
• B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

IPC Classes  ?

• B65D 53/06 - Sealings formed by liquid or plastic material
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
• B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
• B01D 46/42 - Auxiliary equipment or operation thereof
• B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• G03F 7/20 - ExposureApparatus therefor

Abstract

The invention discloses a reticle storage device including a top lid, a bottom lid and a soft contact member. The top lid has a ceiling and a cover surrounding the ceiling. The bottom lid has a carrier and a peripheral structure surrounding the carrier. The soft contact member is configured to laterally extend in between the cover and the peripheral structure when the top lid and the bottom lid engage with each other, and to extend from an inside to an outside of the device in order to buffer the contact among the two lids.

IPC Classes  ?

• B65D 53/06 - Sealings formed by liquid or plastic material
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
• B01D 46/42 - Auxiliary equipment or operation thereof
• B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• G03F 7/20 - ExposureApparatus therefor

Abstract

An apparatus for containing a substrate and a method of manufacturing the apparatus are provided. The apparatus for containing a substrate includes: a base having a periphery and an upward-facing top horizontal planar surface with a plurality of contact elements, the contact elements being used for engaging the substrate to hold the substrate upon the upward-facing top horizontal planar surface, an upward-facing frame-like support surface extending from the upward-facing top horizontal planar surface and surrounding the contact elements at a position proximate to the periphery of the base; and a cover having a downward-facing frame-like support surface being in large-area contact with the upward-facing frame-like support surface to define a cavity for containing the substrate between the base and the cover. The downward-facing and upward-facing frame-like support surfaces in contact with each other are not at the same level as the upward-facing top horizontal planar surface.

IPC Classes  ?

• G03F 7/20 - ExposureApparatus therefor

Abstract

A substrate container system comprises a container body having a bottom face, a front opening that enables passage of a substrate, and a back opening opposing the front opening, the back opening having a width smaller than that of the front opening; and a back cover that covers the back opening and establishes sealing engagement with the container body, wherein the back cover comprises a first gas inlet structure that bendingly extends under the bottom face of the container body upon assembly; wherein the first gas inlet structure comprises a downward facing gas intake port opposing the bottom face of the container body.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

This invention discloses a reticle pod and gripping unit thereof. The aforementioned gripping unit comprises a gripping arm and at least two gripping modules. The gripping arm is hold and configured on the reticle pod, and each gripping module is deposed on the end of the gripping arm, passing through the reticle pod. A single gripping module comprises a case, a stopper and a spring unit. The case is configured on and in the reticle pod. The stopper is configured in the case and passes through the reticle pod. The spring unit is connected with the stopper.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A reticle pod with a spoiler structure includes a body and a cover. A reticle allocation area is centrally disposed at the body. The cover covers the body. A peripheral area of the cover and a peripheral area of the body are fitted together by a protruding portion and a dented portion. The dented portion and the protruding portion jointly form a spoiler structure surrounding the reticle allocation area. The spoiler structure includes a spoiler passage between the dented portion and the protruding portion. The body has at least one sidewall corresponding in position to the spoiler passage to form a particle-collecting space. Particles carried by external air current which enters the spoiler passage end up in the particle-collecting space and thus are denied entry into the reticle allocation area.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

An EUV reticle pod is provided. The pod includes an inner and an outer box assembly. The inner box assembly contained in the outer box assembly includes a base and a cover. The base has an upper surface and a surrounding wall. The upper surface includes a carry surface, at least one trench, and a first contacting surface. The EUV reticle is carried above the carry surface. The trench has a circular loop structure and its bottom is lower than the carry surface. The carry surface, the trench, and the first contacting surface are sequentially distributed from the center of the upper surface towards the surrounding wall. The cover has a concave for accommodating the EUV reticle and a second contacting surface for cooperating with the first contacting surface to form an air-tight seal. The trench captures and traps particles to reduce the particle contamination on the reticle.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/20 - ExposureApparatus therefor
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a semiconductor container which is made of composite material. The composite material is selected from a group consisting of a graphene material doped cycloolefin copolymer (COC), a graphene material doped cycloolefin polymer (COP) and a graphene material doped cyclic block copolymer (CBC). The content of the graphene material ranges from 0.6% to 8.0% by weight in each composite material.

IPC Classes  ?

• H01L 23/06 - ContainersSeals characterised by the material of the container or its electrical properties
• C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• C08K 3/04 - Carbon

Abstract

A reticle pressing unit and an EUV reticle pod using the same are provided. An inner assembly includes an upper cover and a lower cover. The lower cover includes a supporting element for supporting the reticle. A pressing unit for pressing the reticle is disposed on the upper cover and includes a pressing element and a limiting cap. The pressing element has oppositely arranged pressing part and pressure receiving part. The pressing part extends through the upper cover to press against the reticle. The pressing element is covered by the limiting cap and is protruded outwardly from a top surface of the limiting cap. An outer cover has a pushing surface for forming a surface-to-surface contact with the pressure receiving part and for simultaneously pressing against the pressure receiving part and the top surface to solve the problems relating to the reticle which is applied with uneven forces.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/20 - ExposureApparatus therefor
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof

Abstract

The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A reticle pressing unit and an EUV reticle pod using the same are provided. An inner assembly includes an upper cover and a lower cover. The lower cover includes a supporting element for supporting the reticle. A pressing unit for pressing the reticle is disposed on the upper cover and includes a pressing element and a limiting cap. The pressing element has oppositely arranged pressing part and pressure receiving part. The pressing part extends through the upper cover to press against the reticle. The pressing element is covered by the limiting cap and is protruded outwardly from a top surface of the limiting cap. An outer cover has a pushing surface for forming a surface-to-surface contact with the pressure receiving part and for simultaneously pressing against the pressure receiving part and the top surface to solve the problems relating to the reticle which is applied with uneven forces.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G03F 7/20 - ExposureApparatus therefor
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof

Abstract

A quick release purge valve and a substrate container using the same are provided. The substrate container has a base including a bottom plate, a cover plate, and a quick release purge valve. The quick release purge valve includes a snap plate, a gasket fitting, and a valve element. The snap plate detachably engages with the bottom plate and is at most evenly aligned with the bottom plate. The gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the two plates. The valve element is disposed in the conduit for limiting a flow direction of the gas. The gasket fitting is fixed in the base when the snap plate and the bottom plate are in an engaged state and is removable from the base when the snap plate and the bottom plate are in a disengaged state.

IPC Classes  ?

• F16K 24/04 - Devices, e.g. valves, for venting or aerating enclosures for venting only
• B01D 46/42 - Auxiliary equipment or operation thereof
• B01D 46/10 - Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
• F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

A method and a system of measuring air-tightness and a container measured thereby are provided. In the method, a first cover having a first contact surface and a first base having a second contact surface are provided. The two contact surfaces are used for engaging with each other to form an air-tight state. Further, a first contour curve relating to the first contact surface and a second contour curve relating to the second contact surface are acquired. Then, the two contour curves are brought into contact with each other, and the area of a first gap between the two curves is determined. When the area of the first gap is equal to or smaller than a threshold, the first cover and the first base are paired as a first combination of acceptable air-tightness so as to form the container.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• G01M 3/00 - Investigating fluid tightness of structures
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
• G03F 7/20 - ExposureApparatus therefor

Abstract

A reticle pod for accommodating a reticle is provided. The reticle pod comprises a base; a cover; and at least one supporting member. When the reticle is accommodated on the reticle pod, the supporting member abuts against the reticle through a protrusion part; wherein the maximum static friction is constantly greater than a horizontal force applied to the support module from the reticle.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• B65D 25/10 - Devices to locate articles in containers
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

An EUV reticle pod is provided. The pod includes an inner and an outer box assembly. The inner box assembly contained in the outer box assembly includes a base and a cover. The base has an upper surface and a surrounding wall. The upper surface includes a carry surface, at least one trench, and a first contacting surface. The EUV reticle is carried above the carry surface. The trench has a circular loop structure and its bottom is lower than the carry surface. The carry surface, the trench, and the first contacting surface are sequentially distributed from the center of the upper surface towards the surrounding wall. The cover has a concave for accommodating the EUV reticle and a second contacting surface for cooperating with the first contacting surface to form an air-tight seal. The trench captures and traps particles to reduce the particle contamination on the reticle.

IPC Classes  ?

• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• G03F 7/20 - ExposureApparatus therefor
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

A reticle pod is provided for receiving a reticle, the reticle pod comprises: a plurality of positioning modules, which are disposed on at least one vertex portions of a substrate of the reticle pod. The positioning module includes an elastic member, and an abutting member which disposed above the positioning module, wherein when the reticle is received in the reticle pod and the cover of the reticle pod is engaged to the substrate, the cover contacts and provides a downward pressure to the abutting member, and forcing the abutting member to compress the elastic member. The compressed elastic member deforms extensively along a transverse direction and contacts with the reticle.

IPC Classes  ?

• B65D 81/00 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
• G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 25/10 - Devices to locate articles in containers
• B65D 85/38 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus

Abstract

A vertical fixing transmission box used for transmitting a container is disclosed. The transmission box includes a carrier substrate and an elastic component, wherein the carrier substrate is utilized to carry the container, and the elastic component may be switched between an opening state and a fixing state. When the container is carried by the carrier substrate and the elastic component is switched to the opening state, the elastic component provides a vertical elastic force to abut against the container downwardly and fix the container. Also, the transmission box may be transported by an automatic material handling system.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The present invention relates to a latch guide assembly configured on the bottom of a wafer carrier. The latch guide assembly comprises a guide module having at least one guiding groove, a latch module having at least one side plate and at least one recess on the at least one side plate, and at least one rolling unit configured between the at least one guiding groove and the at least one recess. The latch module combines with the guide module via the at least one rolling unit and moves along with the guide module. The latch guide assembly provides a precise moving mechanism to lock/unlock the wafer carrier and reduces both the failure rate and dust production.

IPC Classes  ?

• E05C 19/10 - Hook fasteningsFastenings in which a link engages a fixed hook-like member
• F16C 29/00 - Bearings for parts moving only linearly
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers