Abstract

The present invention relates to a flow rate control device used in the semiconductor process field, whereby the speed of an inflowing fluid flowing into a flow unit can be increased to smoothly discharge contaminated gas inside a pipe while introducing a supply fluid, flowing into a body, via a flow path buried in the body, and thereby maintain the supply fluid at a high temperature and prevent the contaminated gas from accumulating and blocking the pipe. The flow rate control device according to a feature of the present invention comprises: a buried flow path that is buried inside a body and supplied with a supply fluid; a first chamber that communicates with the buried flow path and is provided in the body so as to be located inside the buried flow path; a second chamber that communicates with the first chamber and is provided in the body so as to be located inside the first chamber; and a flow unit that communicates with the second chamber and passes through the upper surface and the lower surface of the body so as to be located inside the second chamber, wherein the speed of inflowing fluid that flows into the flow unit is increased by the supply fluid injected into the flow unit via the second chamber.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

Proposed is an electrochemical reaction device that generates products by subjecting a mixed solution inside a reactor to an electrochemical reaction using an electrode part. More particularly, proposed is an electrochemical reaction device that can increase the yield of products produced by an electrochemical reaction inside a reactor and prevent an explosion caused by residual gas during maintenance.

IPC Classes  ?

• C25B 9/65 - Means for supplying currentElectrode connectionsElectric inter-cell connections
• C25B 1/245 - FluorineCompounds thereof
• C25B 9/63 - Holders for electrodesPositioning of the electrodes
• C25B 11/02 - ElectrodesManufacture thereof not otherwise provided for characterised by shape or form
• C25B 15/04 - Regulation of the inter-electrode distance
• C25B 15/08 - Supplying or removing reactants or electrolytesRegeneration of electrolytes

Abstract

The present invention relates to a composite pipe and to a production method therefor. The composite pipe according to the present invention comprises: a first pipe; and a second pipe which is inserted in the first pipe and is attached to the first pipe, and the second pipe comprises a plurality of ceramic tiles consisting of a ceramic material. The composite pipe production method according to the present invention comprises the steps of: subjecting the outer circumferential surface of a mandrel to a mould-release treatment; coating the outer circumferential surface of the mandrel with an adhesive; forming a second pipe by attaching a plurality of ceramic tiles to the outer circumferential surface of the mandrel so as to cover the outer circumferential surface of the mandrel; coating the outer circumferential surface of the second pipe with an adhesive; winding a plurality of turns of a continuous fibre, which has been impregnated with a resin, onto the outer circumferential surface of the second pipe which was coated with the adhesive, using a filament winding method; forming a first pipe by curing the resin stuck to the wound continuous fibre; and separating the mandrel from the second pipe. The present invention provides a composite pipe having outstanding wear resistance.

IPC Classes  ?

• F16L 9/14 - Compound tubes, i.e. made of materials not wholly covered by any one of the preceding groups
• F16L 9/10 - Rigid pipes of glass or ceramics, e.g. clay, clay tile, porcelain