The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.
Systems and methods for the recovery of noble metal from noble-metal-containing material are generally described. Certain embodiments related to systems and methods in which an electric current is transported between an electrode and the noble metal of a noble-metal-containing material to dissolve at least a portion of the noble metal from the noble-metal-containing material. The dissolved noble metal can subsequently be precipitated out of solution and recovered, according to certain embodiments. Noble metals can be recovered from any suitable noble-metal-containing material, including plated and/or filled scrap materials and/or other materials.
Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.
B23K 1/018 - UnsolderingRemoval of melted solder or other residues
B03B 5/04 - Washing granular, powdered or lumpy materialsWet separating using shaken, pulsated or stirred beds as the principal means of separation on shaking tables
B03B 5/30 - Washing granular, powdered or lumpy materialsWet separating by sink-float separation using heavy liquids or suspensions
B07C 5/342 - Sorting according to other particular properties according to optical properties, e.g. colour
Systems and methods for the recovery of silver are generally described. Certain embodiments are related to innovations newly developed within the context of the present invention that exploit the ability of elemental silver (i.e., silver metal in an uncharged, unreacted state - and in certain cases, in relatively high purities) to be recovered from liquids (e.g., suspensions and/or solutions) containing non-elemental silver (i.e., silver ions, silver salts, silver complexes, silver compounds, etc.), by exposing the non-elemental silver to certain reducing agents.
The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.
Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
B23K 1/018 - UnsolderingRemoval of melted solder or other residues
B03B 5/04 - Washing granular, powdered or lumpy materialsWet separating using shaken, pulsated or stirred beds as the principal means of separation on shaking tables
B03B 5/30 - Washing granular, powdered or lumpy materialsWet separating by sink-float separation using heavy liquids or suspensions
B07C 5/342 - Sorting according to other particular properties according to optical properties, e.g. colour
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.
Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.
Gold and silver are recovered selectively such that gold and silver are separated from non-silver and non-gold material within the scrap. Gold and silver are recovered from scrap material using mixtures of acids, in some instances. The mixture comprises nitric acid and at least one supplemental acid, such as sulfuric acid or phosphoric acid. The amount of nitric acid within the mixture are relatively small compared to the amount of sulfuric acid or phosphoric acid within the mixture. The recovery of gold and silver using the acid mixtures are enhanced by transporting an electric current between an electrode and the gold and silver of the scrap material. Acid mixtures are used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and scrap material comprising silver metal and tungsten metal.
Systems and methods for the recovery of noble metal from noble-metal-containing material are generally described. Certain embodiments related to systems and methods in which an electric current is transported between an electrode and the noble metal of a noble-metal-containing material to dissolve at least a portion of the noble metal from the noble-metal-containing material. The dissolved noble metal can subsequently be precipitated out of solution and recovered, according to certain embodiments. Noble metals can be recovered from any suitable noble-metal-containing material, including plated and/or filled scrap materials and/or other materials.
B01D 61/00 - Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltrationApparatus, accessories or auxiliary operations specially adapted therefor
16.
REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA
Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from PWBs. In some such embodiments, the liquid heat medium may be at least partially separated from the solder and, in some cases, recycled back to a vessel in which the liquid heat medium is stored. The PWBs may be pre-heated, in some embodiments, prior to being immersed in a liquid heat transfer medium in which the solder is removed. In certain embodiments, an additional liquid heat medium may be used to remove underfill from PWBs. In certain embodiments, the electronic components separated from the PWBs may be at least partially separated according to size, density, and/or optical characteristics.
Systems and methods for processing lead-containing glass are generally described. In certain embodiments, at least a portion of the lead within the bulk of the lead-containing glass is removed from the lead-containing glass and transferred to a liquid leaching medium. Removal of lead from the bulk of the lead-containing glass, as opposed to the surface and areas closely adjacent to the surface of the lead-containing glass, can allow for the production of recycled glass that includes substantially no lead within its boundaries.
