An exposure device 1 according to the present invention exposes a photosensitive layer by switching a plurality of mask parts on which mask patterns corresponding to each of a plurality of regions to be exposed are formed, the exposure device including: an exposure stage 30 that supports any of the plurality of regions to be exposed; a photomask plate 20 that is disposed at a position facing the exposure stage 30 and in which a plurality of mask parts 21A, 21B are collectively formed; an exposure light irradiation mechanism 40 that irradiates the entire photomask plate 20 with exposure light; and a mask part switching mechanism 60 that switches the mask parts, wherein at least two of the plurality of mask parts are formed side by side along a predetermined direction on the photomask plate 20, and when a region to be exposed is exposed, a mask part other than the mask part used for exposure is located at a position outside the region to be exposed supported by the exposure stage. Even in the case of a division exposure system, the installation area can be reduced and productivity can be improved.
[Problem] To suitably perform various types of machining on a machined member in a pressing device. [Solution] A pressing device for performing pressing of a plate-shaped member 50 which is a machined member, wherein the pressing device comprises an upper machining tool 22 which is a one-sided mold pressed against the plate-shaped member 50 from one side, and a lower machining tool 24 which is a facing member facing the upper machining tool 22, the upper machining tool 22 has shearing sections 102a, b including cutting blade sections for shearing the plate-shaped member 50 and drawing sections 104a, b for drawing the plate-shaped member 50, and during pressing in which at least one of the upper machining tool 22 and the lower machining tool 24 is pressed toward the plate-shaped member 50, drawing of the plate-shaped member 50 is performed at positions corresponding to the drawing sections 104a, b while simultaneously shearing part of the plate-shaped member 50 by means of the cutting blade sections in the shearing sections 102a, b.
The affixing device 100 according to the present invention comprises a transfer roller 140 for transferring an affixing film piece 13 to a circumferential surface and affixing the affixing film piece 13 to a member 20 being affixed, a moving means 15 for moving the transfer roller 140, and an affixing film piece adjustment means 160 for adjusting the position and orientation of the affixing film piece 13 on the circumferential surface of the transfer roller 140 at a position set apart from both a transfer region A1 and an affixing region A2. The affixing film piece adjustment means 160 has a rotational angle adjustment means 162 for adjusting the affixing start position of the affixing film piece 13 on the circumferential surface of the transfer roller 140, a width direction adjustment means 164 for adjusting the width-direction position of the affixing film piece 13 corresponding to the width-direction position of the member 20 being affixed, and a tilt adjustment means 166 for adjusting the angle of the transfer roller 140 relative to the affixing angle of the member 20 being affixed. According to the affixing device 100 of the present invention, affixing can be performed with high precision.
A sticking device includes: a transfer roller that transfers a sticking film piece to a circumferential surface, and sticks the sticking film piece to a member to be stuck; a moving unit that moves the transfer roller; and a sticking film adjusting unit that adjusts a position and a posture of the sticking film piece on the circumferential surface of the transfer roller at a position away from both a transfer region A1 and a sticking region A2. The sticking film piece adjusting unit includes: a rotation angle adjusting unit that adjusts a sticking start position of the sticking film piece; a width direction adjusting unit that adjusts a position of the sticking film piece; and an inclination adjusting unit that adjusts an angle of the transfer roller.
This exposure apparatus 1 comprises a plurality of light sources 10a, 10b disposed in a positional relationship such that parts of the irradiable ranges overlap each other, and a partition member 20 disposed on the inner side of an overlap area in which the irradiable ranges of two adjacent light sources 10a, 10b overlap each other, this side being the side on which the light sources 10a, 10b are disposed as seen from an exposure surface 68. A first side wall 21 of the partition member 20 blocks radiated light RLa from one light source 10a from proceeding to the side of a second side wall 22, and the second side wall 22 blocks radiated light RLb from the other light source 10b from proceeding to the side of the first side wall 21. According to this exposure apparatus 1, in a large part of the area of an exposure surface of a workpiece other than a minimized and limited area, exposure is possible with a beam of light from only one light source, and it is possible to radiate exposure light over a range larger than the irradiable range covered by a single light source.
A press device includes: a press head having: a press plate, a chamber base body and an elastic packing; and a provisional pressing unit having: a provisional pressing plate which transmits a provisional pressing force, and a provisional pressing force applying mechanism which gives a provisional pressing force to the provisional pressing plate. A main pressing force is generated to a work placed on a press surface by introducing a pressurized fluid into a chamber from a pressurized fluid source in a state where the elastic packing is deformed by compression by a provisional pressing force. The press device further includes a suppression unit which restricts the displacement of the provisional pressing plate in a counter provisional pressing direction by suppressing the movement of the provisional pressing plate in the counter provisional pressing direction.
B30B 1/32 - Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
B30B 5/02 - Presses characterised by the use of pressing means other than those mentioned in groups and wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
B30B 15/00 - Details of, or accessories for, pressesAuxiliary measures in connection with pressing
A molding apparatus 1 according to the present invention comprises a punch 16 having a cutting edge part 20 with a punching shape, and a die 12 configured by die blocks 12A to 12D disposed with respect to the cutting edge part 20. Any of the die blocks 12A to 12D is capable of slide movement toward the punch 16. The die blocks 12A to 12D are fixed to a die holder 13, with a clearance 21 between the cutting edge part 20 of the punch 16 and a cutting edge part 15 of the die 12 being defined by a shim 40. The molding apparatus 1 according to the present invention makes it possible to reduce the cost of the molding apparatus significantly, easily and accurately keep a desired clearance, and provide a forward inclination angle and/or a shear angle on the cutting edge part of the die. Furthermore, the molding apparatus 1 according to the present invention is advantageous in terms of ease of maintenance.
This exposure device divides a plurality of exposure target areas arranged along the direction of feeding the substrate 10 into a first exposure target area 22A and a second exposure target area 22B with a division line of a given shape, and exposes the target areas with light using a first photomask 20A and a second photomask 20B corresponding to the respective target areas. The exposure device is provided with an exposure stage 25, a substrate feeding mechanism 27, an alignment mechanism 28, and an exposure light radiation mechanism 30, and is configured such that, in a first operation mode, exposure is performed by using the first photomask 20A while the exposure target area 22A is being fed in a forward direction, and in a second operation mode, exposure is performed by using the second photomasks 20B, while the exposure target area 22B is being fed in the opposite direction. It is possible to reduce cost for photomasks, highly accurately transfer mask patterns to a large-sized substrate, and increase productivity even in a division exposure method.
A press device 1 comprises: a press head 100 including a pressing plate 110, a chamber base 120, and an elastic packing 130; and a preliminary pressing unit 200 including a preliminary pressing plate 210 that transmits preliminary pressing force, and a preliminary pressing force application mechanism 220 that applies the preliminary pressing force to the preliminary pressing plate 210. Further provided is a pressing means 300 which presses the movement of the preliminary pressing plate 210 in a direction D2 opposite the preliminary press direction, and regulates displacement of the preliminary pressing plate 210 in the direction D2 opposite the preliminary press direction. The pressing means 300 is configured such that a primary pressing force on a workpiece on the press surface is generated by introducing a pressure fluid into a chamber 10 from a pressure fluid source 400 in a state in which the elastic packing 130 is compressed and deformed by the preliminary pressing force. The press device 1 and the press method enable generation of a sufficient pressing force on the press surface even if pressing with a wide surface area.
B30B 1/32 - Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
B30B 5/02 - Presses characterised by the use of pressing means other than those mentioned in groups and wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
An exposure device 1 divides a region to be exposed 14 into a first region to be exposed 14A and a second region to be exposed 14B, and transfers mask patterns 17A, 17B to a substrate 10 by a first photomask 11A corresponding to the first region to be exposed 14A and a second photomask 11B corresponding to the second region to be exposed 14B. The exposure device 1 comprises: an alignment mechanism 28 which has a first stage 25 and a second stage 26 that are connected in series, and performs relative alignment between the substrate 10 and the photomasks 11A, 11B; and exposure light irradiation mechanisms 30A, 30B which switchingly irradiate the first photomask 11A and the second photomask 11B with light emitted from a light source 45 as exposure light 50. The exposure device 1 makes it possible to reduce cost for photomasks, and highly accurately transfer mask patterns to a large-sized substrate.
This peeling device 1 has: a metal mask fixing frame 11 that holds and fixes a metal mask 10 which has an opening 13 defining the range of a section to be peeled 46 of an uppermost layer substrate 48; a pressing roller 32 that presses an adhesive layer 20b of adhesive tape 20 from an upper surface 10a of the metal mask 10 against the uppermost layer substrate 48 within the opening 13; and a peeling head 6. Furthermore, the peeling device 1 is characterized by having a peeling head driving mechanism 19 that can switch the movement direction of the peeling head 6 and that moves the pressing roller 32 in a state where the adhesive layer 20b is pressed against the uppermost layer substrate 48. This peeling device 1 makes it possible to peel the section to be peeled 46 of the uppermost layer substrate 48 from a lower layer substrate 47 and to cut and divide the section to be peeled 46 from the uppermost layer substrate 48, regardless of the size, shape, and arrangement of the section to be peeled 46.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B65H 41/00 - Machines for separating superposed webs
12.
FILM MEMBER ATTACHING DEVICE AND FILM MEMBER ATTACHING METHOD
A film member attaching device 1 comprising a table 100 on which a member to attach is placed, a film member supply mechanism 200, and a control device 300 that has a film member feed control function and an attachment control function, wherein the film member supply mechanism 200 has a release film advancing mechanism 220 that advances a release film 40 returned by a peeling unit 210, and the release film advancing mechanism 220 has an attaching-peeling synchronization mechanism 221 that peels off the release film 40 by actively synchronizing to the action of attaching a film member (polarization film) 30 when performing an action to attach the film member 30. Damage to the release film can be prevented by reducing the tension applied to the release film when attaching the film member to the member to attach while returning and peeling, with the peeling unit, the release film from the film member to which the release film is separably attached.
B65H 41/00 - Machines for separating superposed webs
B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling
13.
FILM MEMBER ADHESION DEVICE, FILM MEMBER ADHESION METHOD, AND STATIC ELECTRICITY REMOVAL MEMBER
The present invention is a film member adhesion device for adhering a film member to a member subject to adhesion, and relates to the film member adhesion device 1 comprising: a separating device 170 for separating a release film 40 from the film member 30; an adhesion device 180 for adhering the film member 30, after separation from the release film 40, to a member 10 subject to adhesion; and a static electricity elimination member 190 which is disposed between the separating device 170 and the adhesion device 180, has a contact surface having conductivity and non-adhesiveness, is composed of metal, and is electrically grounded. This film member adhesion device 1 eliminates, by means of the static electricity removal member 190, static electricity which can build up on the adhering surface of the film member. With this film member adhesion device, there is no risk of deterioration to the quality of products obtained by adhering the film member to the member subject to adhesion even in the event that static electricity builds up on the adhering surface of the film member when the release film is separated from the film member.
B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling
B65H 20/18 - Advancing webs by web-gripping means, e.g. grippers, clips to effect step-by-step advancement of web
B65H 23/16 - Registering, tensioning, smoothing, or guiding webs longitudinally by weighted or spring-pressed movable bars or rollers
B65H 41/00 - Machines for separating superposed webs
14.
FILM ADHESION DEVICE, FILM ADHESION METHOD, AND GUIDE MEMBER
This film adhesion device (1) comprises a table (20) on which a film-receiving member (10) is placed and a film supply mechanism unit (100) which supplies the leading end (30a) of a film (30) to the adhesion start end (10a) of the film-receiving member. The film supply mechanism unit has: a peeling roll (110) which peels a release film (40); a release film advancing mechanism unit (120) which causes the release film, folded back by the peeling roll (110), to advance; a guide member (130) which has a sharp-edged leading end and has a guide surface (131) that guides the advance of the film with the release film peeled off, the guide surface (131) having a non-adhesive surface treatment applied thereto; and a pressing roll (140) which presses the leading end of the film against the adhesion start end. Thus, the advancing operation of the film and the peeling operation of the release film are reliably performed, and the leading end in the advancing direction of the film is allowed to reach the adhesion start end of the film-receiving member with high accuracy.
B65H 41/00 - Machines for separating superposed webs
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
This film detachment device comprises a pre-detachment mechanism (700) that performs pre-detachment in order to make detachment of a film (Wc) from a base member (Wm) easier. The pre-detachment mechanism (700) performs: a first step in which, while a pre-detachment roll (710) is caused to be in contact with one side end section on the surface of the film (Wc), at least either the film (Wc) or the pre-detachment roll (710) is caused to travel such that the pre-detachment roll (710) rotates, and the film (Wc) is wound to a final winding position while being detached from the base member (Wm); and a second step after the first step, in which at least either the film (Wc) or the pre-detachment roll (710) is caused to travel in the opposite direction, in a state in which the pre-detachment roll (710) is in contact with the surface of the film (Wc), and the film that was wound on to the pre-detachment roll (710) is re-attached to the base member (Wm). As a result of this film detachment device, film can be reliably detached from base paper by using less force than used by conventional film detachment devices.
This punching device (100) that punches holes, using the roll-to-roll method, in a sheet workpiece (W) being transported comprises: a sheet workpiece transport mechanism (110) that transports the sheet workpiece (W); a first punching mechanism (130) that has a first punching die (131) in which a plurality of punches (138) are arranged in a prescribed pattern and that punches a plurality of holes, collectively, in the sheet workpiece (W) after moving the first punching die (131) to any position within a first punching region; and a second punching mechanism (160) that has a second punching die (161) in which a single punch (168) is disposed and that punches one hole at a time into the sheet workpiece (W) after moving the second punching die (161) to any position within a second punching region. By virtue of this punching device (100), productivity can be improved and the punching device can punch holes in any location on the sheet workpiece.
This exposure device comprises: a substrate retaining stage (110) which retains a substrate (W) and which is capable of shuttling and elevating; an exposure stage (320) which retains a mask plate (310) such that a mask pattern (M2) faces a photosensitive face (M1) of the substrate (W); a mask dust removal unit (120) which advances together with the substrate retaining stage (110) and which makes contact with the surface of the pattern face (M2) of the mask (310) by a force in a direction that presses against the pattern face (M2) (first direction force) and removes dust while rotating; and a substrate dust removal unit (210) which, by the advancing of the substrate retaining stage (110), makes contact with the photosensitive face (M1) of the substrate (W) by a force in a direction that presses against the photosensitive face (M1) of the substrate (W) (second direction force) and removes dust while rotating. With this exposure device, it is possible to simplify the overall mechanism of removing dust from the photosensitive face of a substrate and the surface of a mask, and to rapidly expose a large volume of substrates.
This method for producing a perforated metal foil is characterized by including: a conductive substrate preparation step (S10) for preparing a conductive substrate having a structure of an insulating layer being formed at a second region corresponding to the position of a perforation; a metal foil formation step (S20) for forming a metal foil by means of electrodeposition at a first region, to which the insulating layer has not been formed, of the conductive substrate; an insulating layer elimination step (S30) for eliminating the insulating layer; and a metal foil peeling step (S40) for peeling the metal foil from the conductive substrate; the insulating layer being eliminated while imparting minute vibrations to the insulating layer in the insulating layer elimination step (S30). By means of the method for producing a perforated metal foil, it is possible to stably produce a high-quality perforated metal foil as the perforation shape and perforation dimensions no longer degrade in the production process.
This method for producing a perforated metal foil includes: a conductive substrate preparation step (S20) for preparing a conductive substrate having a structure such that an insulating layer has been formed at a second region corresponding to the position of a perforation; a metal foil formation step (S30) for forming a metal foil by means of electrodeposition at a first region that is of the conductive substrate and to which the insulating layer has not been formed; an insulating layer elimination step (S40) for eliminating the insulating layer; and a metal foil peeling step (S50) for peeling the metal foil from the conductive substrate. By means of the method for producing a perforated metal foil, degradation of perforation shape and perforation dimensions during the production process are eliminated and so it is possible to stably produce a high-quality perforated metal foil.
This punching method comprises: a first step of forming a die hole (210) in a die plate (200) supported so as to be fixed to an upper end surface of a die plate supporting base (300), with a punch (100) capable of forming a hole equivalent to a hole (510) to be formed in a member (500) to be processed; and a second step of placing the member to be processed on the die plate in which the die hole has been formed by the first step, and forming a hole in the member to be processed by lowering the punch from above the member to be processed, such that the punch passes through the member to be processed and the die hole. In this punching method, it is possible to form a high precision hole in the member to be processed, and to simplify the process for forming a hole in the member to be processed while eliminating the need for elaborate equipment.
Disclosed is a plastic film peeling apparatus which peels a plastic film (coverlay film) (Wc) from a mount film (Wm) during a process in which the films are travelling with the mount film (Wm) on the bottom. The apparatus is provided with a movable peeling unit (200) that is capable of moving in a reciprocating manner towards the front of a track and the rear of the track, a cutting mechanism (600) that forms plastic film pieces by cutting the plastic film (Wc) while leaving the mount film (Wm) intact, and a suction-holding device (700) that serves as a holding device for holding a plastic film piece. When the movable peeling unit (200) is moved towards the rear of the track, force is applied to mount film Wm in opposition to the movement of the movable peeling unit (200) toward the rear of the track, and the movement of the movable peeling unit (200) toward the rear of the track while the plastic film piece is held by the holding device pulls the mount film away from the plastic film piece. This apparatus makes it possible to separate a plastic film and a mount film using a small amount of force.
A plastic film peeling apparatus, which peels a plastic film (coverlay film) (Wc) from a mount film (Wm) during a process in which the films are travelling with the mount film (Wm) on the bottom, is provided with a movable peeling unit (200) that is capable of moving in a reciprocating manner towards the front of a track and the rear of the track, a pre-peeling mechanism (400) that pre-peels the plastic film (Wc) from the mount film (Wm), a cutting mechanism (600) that forms plastic film pieces by cutting the pre-peeled plastic film (Wc) while leaving the mount film (Wm) intact, and a suction-holding device (700) for holding a plastic film piece by means of suction. While a plastic film piece is held by the suction-holding device (700), the movable peeling unit is moved towards the rear of the track while applying a prescribed tensile force to the mount film so as to thereby pull the mount film away from the plastic film. This apparatus makes it possible to separate a plastic film and a mount film using a small amount of force.
A plastic film peeling apparatus comprising a base board bed (2); a mobile peeling unit (5) capable of reciprocating motion along a guide plane of the base board bed (2), provided at its distal end with a peeling blade (9); a driving unit for allowing reciprocating drive of the mobile peeling unit (5); a suction retention unit (35) for suction retention of a coverlay film (11) stuck onto a mount film (10) and precut to a given size; a first clamp unit (45) disposed on the side of the base board bed (2); and a second clamp unit (50) disposed on the side of the mobile peeling unit (5). In this apparatus, the peeling blade (9) detaches the coverlay film (11) from the mount film (10) at an acute peeling angle, so that not only can the coverlay film (11) be smoothly detached across the whole width with uniform force by small peeling strength but also there can be realized an automation of manufacturing process.
A production device of a flexible wiring board in which a reinforcing board or a coverlay film of predetermined shape and size can be cut out from a thin plastic film. The production device of a flexible wiring board comprises a fixed die plate (22), a movable punch plate (21) being moved toward a plastic film from above the fixed die plate (22), a guiding device for guiding the movable punch plate (21) toward the die plate (22), and a pushing device for pushing the movable punch plate (21) into the fixed die plate (22). In this production device, the movable punch plate (21) is provided with a take-out opening through which a cut article can pass and a cutter blade is formed on the inner circumferential edge at the inlet of the take-out opening.
A method of perforating a coverlay film, characterized by including the first perforating step of making multiple first product holes (H1) and two reference holes (H4) in coverlay film (W) by means of first perforating metal die (510) and the second perforating step of making multiple second through-holes (H3) in the coverlay film (W) by means of second perforating metal die (540), wherein in the second perforating step, the two reference holes (H4) are photographed to thereby measure the positions of the reference holes (H4) in the coverlay film (W), subsequently the position and/or posture of the coverlay film (W) against the second perforating metal die (540) is regulated on the basis of measuring results, and thereafter second product holes (H3) are formed in the coverlay film (W). Accordingly, this coverlay film perforating method realizes forming of the product holes (H3) made in the second perforating step to the product holes (H1) made in the first perforating step with precision corresponding to miniaturization and as a result, forming of a product hole pattern finer than in the prior art.
A method for producing a long sheet with sprocket holes in which a plurality of sprocket holes are formed in a plurality of rows using a device for punching sprocket holes sequentially one by one. The method comprises a third step for setting imaginary lines (140, 140') for every row by connecting with a line the position (A0) of a punched sprocket hole and the position (A1) of an initially set sprocket hole, and setting the punching positions of the a plurality of sprocket holes for every row along the imaginary lines such that they are arranged at a constant interval from at least the minimum allowable interval (P0-δP0) to up to the maximum allowable interval (P0+δP0) in the set interval P0 of sprocket holes. A long sheet with sprocket holes in which the sprocket holes are formed with high precision as compared with prior art can thereby be produced.
A cover-lay film laminating device (1000) has a base film feeding device (1400), a cover-lay film feeding table (1300) movable in the x- and y-axis directions and rotatable about an axis in the z-axis direction, and a temporary pressure bonding table (1200). Base film sucking holes for sucking a base film (Wb) are formed in the lower surface of the temporary pressure bonding table (1200). The cover-lay film feeding table (1300) has a function for adjusting the position and/or attitude of a cover-lay film (Wc) relative to the base film (Wb) sucked to the base film sucking holes. The temporary pressure bonding table (1200) is vertically movable in a temporary pressure bonding area (P2). The cover-lay film laminating device (1000) can increase efficiency of laminating the cover-lay film (Wc) on the base film (Wb), can be easily maintained, and is inexpensive.
B65H 37/04 - Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching, or stapling
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
A hole forming device (100) has a first clamper (320) capable of moving work (W) in the x-axis direction, a second clamper (340) capable of moving work (W) in the x-axis direction, a support table (400) for supporting the first clamper (320) and the second clamper (340) and rotatable, a fine movement device (500) for finely moving the support table (400), a hole forming mechanism (600) for forming a through-hole (22) in the work (W), and imaging devices (710, 720) for imaging the work. The first clamper (320) and the second clamper (340) are constructed so that they can hold the work (W) independently from each other. The hole forming device (100) can perform hole forming work across the entire surface of the work (W), can form the through-hole (22) while highly accurately adjusting the position and attitude of the work (W), and is compact.
A method for manufacturing a flexible board is characterized by comprising, in this order, the long sheet preparation step S110 of preparing a long sheet (W) on which circuit patterns (110) are formed and a drilling step S120 of forming sprocket holes (120) in the long sheet (W) by using a drilling device with reference to the predetermined portions (electrodes (114)) of the circuit patterns (110). By the manufacturing method, the sprocket holes and the circuit patterns can be formed with a sufficient relative positional accuracy even if the long sheet is stretched or deformed in the process of forming the circuit patterns.
A device (1000) for sticking a reinforcement board comprising a base film holding table (1400), a reinforcement board punching device (1500) having a reinforcement board punching die (1510), an arm (1600) for sucking a reinforcement board (Ws) and sticking it to a predetermined position of a base film (Wb), and an imaging device (1700), characterized in that a function, for sticking the reinforcement board (Ws) based on the imaging results from the imaging device (1700) under a state where the base film holding table (1400) and the reinforcement board sticking arm (1600) are regulated to an appropriate positional relation, is provided. The device for sticking a reinforcement board can enhance the efficiency of sticking the reinforcement board to the base film, can stick a reinforcement board of small size precisely, and needs not to provide reinforcement boards of various profiles prior to a step for sticking the reinforcement board.
A reinforcement plate bonding device (1000) has a base film holding table (1400), a reinforcement plate punch device (1500) having a reinforcement plate punch die (1510), a reinforcement plate bonding arm (1600) for sucking a reinforcement plate (Ws) and bonding the reinforcement plate (Ws) to a predetermined position on a base film (Wb), and an imaging device (1700). The reinforcement plate bonding device (1000) has a function to perform bonding of the reinforcement plate (Ws) based on the result of imaging by the imaging device (1700), with the base film holding table (1400) and the reinforcement plate bonding arm (1600) adjusted to an appropriate positional relationship. The reinforcement plate bonding device (1000) can enhance efficiency of bonding of the reinforcement plate to the base film, can bond the reinforcement plate at excellent accuracy even if the size of the reinforcement plate is small, and eliminates the need to prepare reinforcement plates with various sizes before the start of a reinforcement bonding process.
A perforator (100) comprises a supply mechanism (110), a take-up mechanism (120), a perforating mechanism (130) movable along the y-axis direction, and a pair of clamping mechanisms (140) movable along the x-axis direction and releasably holding a sheet-type workpiece (W) at both edges along the x-axis direction of a part to be perforated. With the perforator (100), the weight of the perforating mechanism (130) can be lightened and the action of positioning the perforating mechanism (130) with respect to the sheet-type workpiece (W) can be sped up. Hence, with the perforator (100), perforation can be performed with a high productivity.
A drilling device (100) comprising a die mold (120), a punch mold (130) having a punch, and a punch lifting mechanism (60) lifting the punch. The punch (140) comprises a punch body (142) and a punch head part (144), and the punch lifting mechanism (60) comprises punch head part holding parts (82, 84) capable of holding the punch head part. The drilling device further comprises a holding state control mechanism for holding the punch head part on the punch head part holding parts and releasing the held state of the punch head part by the punch head part holding parts. In the drilling device (100), since only the punch can be replaced, when the punch of the punch mold is worn, all spare parts for a drilling mold must not be prepared, that was required in a conventional drilling device. As a result, the drilling device can easily reduce drilling cost.
A hole punching device for punching holes at high productivity in the entire surface of a strip-like workpiece (W). The hole punching device (100) has a base (110), two workpiece feeding devices (210, 220) respectively having upper rollers (212, 222) and lower rollers (214, 224) and horizontally moving and positioning the workpiece (W) in the workpiece feeding direction (hereinafter referred to as one direction), and a hole punching mechanism (400). The hole punching mechanism (400) has a punching die (500) having a forming die (510) and a punching die (520) and placed between the two workpiece feeding devices (210, 220). The hole punching mechanism (400) is horizontally movable relative to the base (110) in the other direction normal to the one direction and is finely movable relative to the base (110) in the one direction.
This invention provides a process for producing a metal plate for a metal mask, comprising a first step of providing a metal plate, a second step of forming a plurality of holes in the metal plate by drilling holes one by one in the metal plate while varying the relative position between a drilling mechanism and the metal plate in such a state that, in a drilling apparatus provided with a drilling mechanism comprising a ding mold and a punching mold, the metal plate is disposed between the ding mold and the punching mold, and a third step of polishing for deburring on the ding mold-side face in the metal plate. According to the above constitution, holes having a straight wall face can be formed even in relatively thick metal plates for use in metal plates for metal masks. Further, the need to prepare a photomask can be eliminated in the production of a new metal plate for a metal mask by providing a ding mold and a punching mold corresponding to a predetermined hole diameter, and, thus, the throughput time of the metal plate for a metal mask can be reduced.
The boring method of a printed wiring board comprising a first step for forming a through hole (22) in a board (20) for BOC by lowering a punch (622) while holding the board (20) for BOC between a stripper plate (630) and a die plate (642), a second step for feeding compressed air to the through hole (22) from the punching die (620) side through a punch hole (632) after the punch (622) is elevated while holding the board (20) for BOC between the stripper plate (630) and the die plate (642), and a third step for lowering the punch (622) again while holding the board (20) for BOC between the stripper plate (630) and the die plate (642). In this boring method, boring chips generated on the inner surface of the through hole (22) can be removed completely, adhesion of boring chips to the upper surface of the board (20) for BOC can be suppressed, and the mechanism and method for forming the through hole (22) can be simplified easily.
patents
