METHOD FOR PRODUCING WATER-BASED POLYESTER RESIN, AND WATER-BASED POLYESTER RESIN, AND METHOD FOR PRODUCING WATER-BASED COATING COMPOSITION, AND WATER-BASED COATING COMPOSITION
A method for producing a water-based polyester resin includes a first step, a second step, and a third step. The first step includes performing an ester formation reaction and a depolymerization reaction using a recycled polyester, a first polycarboxylic acid component, and a polyalcohol component. The second step includes performing an ester formation reaction using a reaction product of the first step and a second polycarboxylic acid component. The third step includes performing a polycondensation reaction by reducing pressure. The first step includes using the recycled polyester to such an amount that makes proportion of a terephthalic acid residue equal to or greater than 20% by mass and equal to or less than 72% by mass. The water-based polyester resin thus produced has an acid value equal to or greater than 30 mgKOH/g and equal to or less than 120 mgKOH/g.
C08J 11/26 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with organic material by treatment with organic oxygen-containing compounds containing carboxylic acid groups, their anhydrides or esters
2.
METHOD FOR PRODUCING WATER-BASED POLYESTER RESIN, WATER-BASED POLYESTER RESIN, AND WATER-BASED COATING COMPOSITION
A method for producing a water-based polyester resin includes a first step and a second step. The first step includes causing an ester formation reaction and a depolymerization reaction using a recycled polyester, a polycarboxylic acid component including a polycarboxylic acid residue and excluding terephthalic acid, and a polyalcohol component. The second step includes causing a polycondensation reaction by reducing pressure. The first step includes using: the recycled polyester to such an amount that makes proportion of a terephthalic acid residue equal to or greater than 20% by mass and equal to or less than 72% by mass; and a metal-sulfonate-group-containing polycarboxylic acid compound to such an amount that makes proportion of the metal-sulfonate-group-containing polycarboxylic acid residue equal to or greater than 5% by mass and equal to or less than 32% by mass. The resin thus produced has an acid value equal to or less than 10 mgKOH/g.
A method for producing an aqueous polyester resin which comprises a first step, a second step, and a third step. In the first step, a recycled polyester, a first polycarboxylic acid ingredient, which includes a residue of a divalent polycarboxylic acid that is not terephthalic acid, and a polyhydric alcohol ingredient are used to conduct an ester formation reaction and a depolymerization reaction. In the second step, a reaction product obtained in the first step and a second polycarboxylic acid ingredient, which includes a residue of a polycarboxylic acid having a functionality of three or greater, are used to conduct an ester formation reaction. In the third step, a polycondensation reaction is conducted by depressurization. In the first step, the recycled polyester is used in such an amount that the proportion of terephthalic acid residues to the sum of the terephthalic acid residues contained in the recycled polyester and the polycarboxylic-acid residues contained in the first and second polycarboxylic acid ingredients is 20-72 mass%. The aqueous polyester resin to be obtained has an acid value of 30-120 mgKOH/g.
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
4.
AQUEOUS POLYESTER RESIN PRODUCTION METHOD, AQUEOUS POLYESTER RESIN, AND AQUEOUS COATING COMPOSITION
This aqueous polyester resin production method comprises a first step and a second step. The first step is for performing an ester formation reaction and a depolymerization reaction, by using a recycled polyester, a polyvalent carboxylate component other than a terephthalate and including a polyvalent carboxylate residue, and a polyvalent alcohol component. The second step is for performing a polycondensation reaction through decompression. In the first step, a recycled polyester in which the proportion of terephthalate residues is 20-72 mass%, and a metal sulfonate group-containing polyvalent carboxylate compound in which the proportion of metal sulfonate group-containing polyvalent carboxylate residues is 5-32 mass%, are used. The acid value of an obtained resin is 10 mgKOH/g or less.
C08J 11/24 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with organic material by treatment with organic oxygen-containing compounds containing hydroxyl groups
C09D 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C08G 63/688 - Polyesters containing atoms other than carbon, hydrogen, and oxygen containing sulfur
Provided is a conductive paste which has excellent initial conductivity and can maintain the excellent conductivity for a long period of time. This conductive paste contains at least one (A) among tannic acid and a tannic acid derivative, a copper powder (B), a thermosetting resin (C), and a solvent (D).
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
Provided is a conductive paste that achieves both good adhesion and conductivity. This conductive paste includes a binder (A), a metal powder (B), boric acid (C), and an organic solvent (D). The binder (A) includes a (meth) acrylic resin (a) having a hydroxyl group.
C08F 20/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
C08L 33/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
C09D 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
9.
METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT CHIP, AND COMPOSITION FOR PROTECTION
The present disclosure addresses the problem of providing a method by which a protective film (3) can be easily manufactured, a substrate (2) and a semiconductor chip (1) can be protected with the protective film (3), and the protective film (3) can easily be removed, and is for manufacturing a semiconductor element chip (1), the method comprising irradiating the protective film (3) on the substrate (2) with a laser beam, etc. A protective composition according to the present disclosure contains a water-soluble polyester resin (A) having a polyvalent carboxylic acid residue (a) and a polyvalent alcohol residue (b). The polyvalent carboxylic acid residue (a) includes a polyvalent carboxylic acid residue (a1) having a metal sulfonate group and a naphthalenedicarboxylic acid residue (a2). The ratio of the polyvalent carboxylic acid residue (a1) to the polyvalent carboxylic acid residue (a) is 25 to 70 mol%. The ratio of the naphthalene dicarboxylic acid residue (a2) to the polyvalent carboxylic acid residue (a) is 30 to 75 mol%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
The present disclosure addresses the problem of providing a protective film composition to be used for producing a protective film on a metal, the protective film adhering to metal and being easily removed from metal. A composition for protection according to one embodiment of the present disclosure contains a water-soluble polyester resin (A) and is for producing a protective film on a metal.
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
C09D 167/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
11.
Baking slurry composition, green sheet, method for manufacturing green sheet, method for manufacturing sintered product, and method for manufacturing monolithic ceramic capacitor
A baking slurry composition for producing a green sheet of the present invention contains inorganic powder, a polyvinyl alcohol resin, acrylic polymer, and water. The acrylic polymer has a glass transition temperature higher than or equal to −50° C. and lower than or equal to 30° C. and an acid value greater than or equal to 50 mg KOH/g and less than or equal to 200 mg KOH/g. The acrylic polymer has a weight percentage of more than or equal to 0.1 and less than or equal to 5.0 relative to a total solid content of the baking slurry composition.
C08L 33/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
C04B 35/626 - Preparing or treating the powders individually or as batches
GREEN SHEET PRODUCING BINDER COMPOSITION, BAKING SLURRY COMPOSITION, METHOD FOR MANUFACTURING GREEN SHEET, METHOD FOR MANUFACTURING SINTERED PRODUCT, AND METHOD FOR MANUFACTURING MONOLITHIC CERAMIC CAPACITOR
A green sheet producing binder composition of the present invention is a binder composition for producing a green sheet. The binder composition contains a polyvinyl alcohol resin. The polyvinyl alcohol resin contains at least two kinds of components having degrees of hydrophilicity different from each other.
Baking slurry composition, green sheet, method for manufacturing green sheet, method for manufacturing sintered product, and method for manufacturing monolithic ceramic capacitor
A baking slurry composition of the present invention contains an amino alcohol compound represented by formula, inorganic powder , a polyvinyl alcohol resin, and water. In the formula,
R is a hydrogen atom or an alkyl group having a carbon number larger than or equal to 1 and smaller than or equal to 20, and m and n being values satisfying conditions m≥0, n≥0, and m+n≥1.
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
SLURRY COMPOSITION FOR FIRING, GREEN SHEET, METHOD FOR PRODUCING GREEN SHEET, METHOD FOR PRODUCING SINTERED BODY, AND METHOD FOR PRODUCING LAYERED CERAMIC CAPACITOR
The present invention addresses the problem of providing a slurry composition for firing, from which it is possible to form a sheet that exhibits high flexibility while maintaining high sheet strength. This slurry composition for firing contains an amino alcohol compound (A) represented by formula (1), an inorganic powder (B), a poly(vinyl alcohol) resin (C) and water. In formula (1), R is a hydrogen atom or an alkyl group having 1-20 carbon atoms. m and n are numbers that satisfy the inequalities m ≥ 0, n ≥ 0 and m+n ≥ 1.
BINDER COMPOSITION FOR PRODUCING GREEN SHEET, SLURRY COMPOSITION FOR FIRING, METHOD FOR PRODUCING GREEN SHEET, METHOD FOR PRODUCING SINTERED BODY, AND METHOD FOR PRODUCING LAYERED CERAMIC CAPACITOR
The present invention addresses the problem of providing a binder composition for producing a green sheet, which exhibits storage stability when an aqueous slurry composition is produced, and which can impart a formed sheet with strength and flexibility while maintaining high smoothness. This binder composition for producing a green sheet is a binder composition for producing a green sheet. The binder composition contains a poly(vinyl alcohol) resin (C). The poly(vinyl alcohol) resin (C) contains at least two components having different hydrophilic properties.
SLURRY COMPOSITION FOR FIRING, GREEN SHEET, METHOD FOR PRODUCING GREEN SHEET, METHOD FOR PRODUCING SINTERED BODY, AND METHOD FOR PRODUCING LAYERED CERAMIC CAPACITOR
The purpose of the present invention is to provide: a slurry composition for firing, from which it is possible to form a sheet that exhibits high flexibility while maintaining high sheet strength, and which can improve the adhesive properties of the sheet when the sheet is layered; and a green sheet. This slurry composition for firing, which is used for producing a green sheet, contains an inorganic powder (B), a poly(vinyl alcohol) resin (C), an acrylic polymer (D) and water. The acrylic polymer (D) has a glass transition temperature of -50ºC to 30ºC and an acid value of 50-200 mg KOH/g. The amount of the acrylic polymer (D) is 0.1-5.0 mass% relative to the total amount of solid content in the slurry composition for firing.
C08L 29/04 - Polyvinyl alcoholPartially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
C08L 33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCompositions of derivatives of such polymers
The purpose of the present invention is to provide a method for producing a film by exposing a coating film of a photosensitive resin composition to light and then developing the exposed coating film, whereby the pattern of the film can have high resolution. The method for producing a film comprises forming a coating film from a photosensitive resin composition, then exposing the coating film to light by irradiating the coating film with light emitted from a light source, and then developing the exposed coating film with an alkaline solution. The photosensitive resin composition comprises (A) a resin containing a carboxyl group, (B) an unsaturated compound, (C) a photopolymerization initiator and (D) an epoxy resin. The light to be emitted to the coating film includes light having a specific wavelength.
G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/031 - Organic compounds not covered by group
INSULATION FILM FORMING RESIN COMPOSITION, INSULATION FILM FORMING RESIN COMPOSITION PRODUCTION METHOD, DRY FILM, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD
The objective of the present invention is to provide a resin composition which has stable viscosity, a coating film formed from same exhibiting high uniformity in terms of film thickness, while also being highly thixotropic, and which is capable of forming an insulation film having excellent insulation reliability. This insulation film forming resin composition contains a curable resin (A), bentonite (E), a first flux (F1), and a second flux (F2). The solubility of the flux (F1) in 1 L of water at 20°C is 1 g or greater, and the solubility of the second flux (F2) in 1 L of water at 20°C is less than 1 g. Relative to the entire amount of the resin composition, the total amount of the first flux (F1) and the second flux (F2) is between 15% by mass and 50% by mass inclusive. Relative to the total amount of the first flux (F1) and the second flux (F2), the amount of the second flux (F2) is between 15% by mass and 50% by mass inclusive.
C08G 59/16 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
The present invention provides an electrolytic copper plating bath which has excellent via hole filling properties. An electrolytic copper plating bath according to the present invention contains a reaction product of a compound that contains an amino group in each molecule and a compound that contains an epoxy group in each molecule, said reaction product being obtained in the presence of an acid. The compound that contains an amino group in each molecule contains an amine compound that is represented by a specific general formula. The compound that contains an epoxy group in each molecule contains an epoxide compound that is represented by a specific general formula.
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 7/00 - Electroplating characterised by the article coated
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The present invention provides a photosensitive resin composition from which an electrical insulation layer is able to be formed by forming a film therefrom and subsequently thermosetting the film after light exposure, and which enables the film to be sufficiently cured even in deep portions. A photosensitive resin composition according to the present invention contains (A) a carboxyl group-containing unsaturated resin which contains (A1) a resin that does not have a urethane bond, (B) a coloring agent which contains (B1) a black coloring agent, (C) a photopolymerization initiator which contains (C1) an acyl phosphine oxide photopolymerization initiator and (C2) a hydrogen abstraction type photopolymerization initiator, (D) a polymerizable compound, (E) an epoxy compound and (F) at least one of melamine and a melamine derivative.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
Provided is a photosensitive resin composition from which a cured product is obtained when subjected to curing and in which it is possible to suppress corrosion of a cured layer when the surface of the cured product is treated with an oxidizing agent, to minimize excessive surface roughness, and to prevent the surface from becoming uneven. This photosensitive resin composition comprises: a carboxyl-containing resin (A); an unsaturated compound (B) containing at least one ethylenically unsaturated bond per molecule; a photopolymerization initiator (C); an epoxy compound (D); an organic filler (E); silica (F); and a triazine resin (G). The silica (F) has an average primary particle diameter of 1-150 nm.
Provided is a resin composition for coating, whereby a coating having high antifogging properties and antifouling properties can be produced. This resin composition for coating is for producing a coating and contains: a cyclic ether group-containing polymer (A) being a polymer of a polymerizable monomer component (a) including an ethylenically unsaturated monomer (a11) having a cyclic ether group; and a component (B) comprising at least one type of compound selected from the group consisting of a polyvalent carboxylic acid (b1) and a polyvalent carboxylic acid annhydride (b2). The water contact angle, as specified under JIS R3257, is no more than 90° for a cured product produced by: heating the resin composition for coating for at least 0.1 hours at at least 100°C and at no more than the decomposition temperature for the resin composition for coating; and curing same.
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
Provided are composite particles having improved dispersion in polar solvents. The composite particles comprise inorganic particles and a coating layer covering the inorganic particles. The coating layer is a cured product of a composition containing: a cyclic ether group-containing compound (A); and a component (B) comprising at least one type of compound selected from the group consisting of a polyvalent carboxylic acid (b1) and a polyvalent carboxylic acid anhydride (b2).
B01J 2/30 - Processes or devices for granulating materials, in generalRendering particulate materials free flowing in general, e.g. making them hydrophobic using agents to prevent the granules sticking togetherRendering particulate materials free flowing in general, e.g. making them hydrophobic
C01B 33/18 - Preparation of finely divided silica neither in sol nor in gel formAfter-treatment thereof
C08F 20/32 - Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
C08G 59/32 - Epoxy compounds containing three or more epoxy groups
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; glue and adhesives for industrial
purposes; polyester resins, unprocessed; polyester resins;
plastics, raw materials; plastics, unprocessed; synthetic
resins, unprocessed; chemicals for industrial use consisting
of emulsion polymers; chemicals for the manufacture of
paints; chemicals for the manufacture of pigments;
emulsifiers for industrial purposes; dispersing agents for
industrial use; coating agents for papermaking; chemicals
for use in manufacturing inks; coating agents for films;
processing agents for metal surfaces; adhesives for
industrial purposes; size for finishing and priming; size
for use in the textile industry; synthetic resins for use in
manufacturing cosmetics; leveling agents, for adjustment of
wetting; polymerized acrylic resins; chemicals; photoresists
for printed circuit boards; thermosetting resists for
printed circuit boards; chemical photoresist coatings used
in the manufacture of printed circuit boards; solder resist
chemicals used in the manufacture of printed circuit boards;
chemicals for use in sintering ceramics; water repellent for
industrial purposes; finishing preparations and processing
agent used for textile industry; chemical additives for
papermaking; textile-impregnating chemicals; antistatic
preparations, other than for household purposes;
stain-preventing chemicals for use on fabrics; welding
chemicals; solvents for varnishes; mold-release
preparations; plasticizers; textile-waterproofing chemicals;
chemical intensifiers for paper; heat-sensitive adhesives
for processing paper; pressure-sensitive adhesives for
processing paper; chemical compositions for use in
developing photographs; photographic sensitizers for
industrial purposes; photographic sensitizers for use in the
manufacture of screen printing plates; acrylic resins; epoxy
resins; chemical coatings for use in the manufacture of
printed circuit boards.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; glue and adhesives for industrial purposes; chemicals for industrial use consisting of emulsion polymers; chemicals for the manufacture of paints; chemicals for the manufacture of pigments; emulsifiers for industrial purposes; dispersing agents for industrial use; coating agents for papermaking, namely, polymer coating agents for paper; chemicals for use in manufacturing inks; coating agents for films, namely, polyester and composite resins including polyester resin and acrylic resin for use in the manufacture of film; adhesives for industrial purposes; size for finishing and priming; size for use in the textile industry; unprocessed synthetic resins for use in manufacturing cosmetics; leveling agents for adjustment of wetting; photoresists for printed circuit boards; thermosetting resists, namely, for printed circuit boards; chemical photoresist coatings used in the manufacture of printed circuit boards; solder resist chemicals used in the manufacture of printed circuit boards; chemicals for use in sintering ceramics; water repellents for industrial purposes; finishing preparations and processing agent used for textile industry, namely, industrial chemicals; chemical additives for papermaking; textile-impregnating chemicals; antistatic preparations, other than for household purposes; stain-preventing chemicals for use on fabrics; welding chemicals; solvents for varnishes; mold-release preparations; plasticizers; textile-waterproofing chemicals; chemical intensifiers for paper, namely, industrial chemicals; heat-sensitive adhesives for processing paper, namely, industrial adhesives; pressure-sensitive adhesives for processing paper, namely, industrial adhesives; chemical compositions for use in developing photographs; photographic sensitizers for industrial purposes; photographic sensitizers for use in the manufacture of screen printing plates; chemical coatings for use in the manufacture of printed circuit boards
26.
METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Provided is a method for producing a multilayer printed wiring board, which is capable of achieving high adhesion between an interlayer insulating layer and a conductor layer even if the interlayer insulating layer is not roughened or the roughening degree of the interlayer insulating layer is low. According to this method for producing a multilayer printed wiring board (20), a cured film (11) is produced by forming a coating film (4) from a photosensitive resin composition on a printed wiring board (1) and photocuring the coating film (4), and a conductor layer (8) is produced after processing the cured film (11) with an alkaline solution. The photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B) that has at least one ethylenically unsaturated bond in each molecule, a photopolymerization initiator (C) and an epoxy compound (D). A surface of the cured film (11), said surface coming into contact with the conductor layer (8), has an arithmetic mean roughness Ra of less than 150 nm immediately before the formation of the conductor layer (8).
The present invention addresses the problem of providing a photosensitive resin composition which has high resolution and which is capable of forming a cured product having high copper-plating adhesiveness. This photosensitive resin composition is photocurable. The photosensitive resin composition contains: a carboxyl group-containing resin (A) that has an aromatic ring; an organic filler (B) that has an average primary particle size of 1 µm or less and has a carboxyl group; a coupling agent (C) that has at least one type of atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom, and that has two or more functional groups including at least one selected from the group consisting of alkoxy groups, acyloxy groups, and alkoxides; and a silica filler (D) that has an average primary particle size within the range of 1-150 nm.
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/031 - Organic compounds not covered by group
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
29.
Liquid solder resist composition and printed wiring board
A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/031 - Organic compounds not covered by group
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
30.
Liquid solder resist composition and printed wiring board
A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1),
An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight %.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an α-hydroxy alkylphenone-based photopolymerization initiator.
Provided is a primer composition with which a highly adhesive and transparent primer layer can be formed by applying the composition to a substrate. The primer composition includes a polymerized reaction product (A), a maleic acid-modified polyolefin resin (B), and water (C). The polymerized reaction product (A) is a product produced by emulsion polymerization of an ethylenically unsaturated monomer (b) in a mixture containing a saturated polyester resin (a) and the ethylenically unsaturated monomer (b). The saturated polyester resin (a) has an acid value in the range of 10 to 100 mgKOH/g. The ethylenically unsaturated monomer (b) includes a nonionic ethylenically unsaturated monomer (b1).
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
33.
LIQUID SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD
The present invention addresses the problem of providing a liquid solder resist composition which can be formed as a glossy solder resist layer which has a very smooth surface, even though the composition contains a powdered hydroquinone epoxy compound. The liquid solder resist composition contains a carboxyl group-containing resin (A), a heat-curable component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The heat-curable component (B) contains a powdered epoxy compound (B11) represented by formula (1).
The present invention addresses the problem of providing a liquid solder resist composition which delusters the surface of the formed solder resist layer, due to the activity of the resin component in the composition. The liquid solder resist composition contains a carboxyl group-containing resin (A), a heat-curable component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a pigment (E). The heat-curable component (B) contains a powdered epoxy compound (B11) represented by formula (1). The epoxy compound (B11) content is within the range of 15-40 mass% of the combined total content of the carboxyl group-containing resin (A), the heat-curable component (B), and the photopolymerizable component (C).
According to the present invention, a photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenic unsaturated bond in a molecule thereof, a photopolymerization initiator (C), an epoxy compound (D), an organic filler (E) including an organic filler (E1) having a carboxyl group and at least one melamine composition (F) selected from the group consisting of melamine and melamine derivatives. A dry film is a dried article of the photosensitive resin composition. A printed wiring board is provided with an interlayer insulation layer or a solder resist layer including a cured article of the photosensitive resin composition.
A dry film laminated body (15) relating to the present invention is provided with a base film (12), a dry film (13), and a cover film (14), which are laminated in this order. The base film (12) is a polyethylene terephthalate film, the dry film (13) contains a carboxyl group-containing resin (A) and a crystalline epoxy resin (B1). The cover film (14) is an oriented polypropylene film.
The objective of the present invention is to have a photosensitive resin composition achieve excellent developability even if a carboxyl group-containing resin having a bisphenol fluorene skeleton is contained therein and to have a cured product of the photosensitive resin composition less susceptible to the occurrence of cracks during repeated temperature changes. A photosensitive resin composition according to the present invention contains a carboxyl group-containing resin (A), an unsaturated compound, a photopolymerization initiator and an epoxy compound. The carboxyl group-containing resin (A) contains a carboxyl group-containing resin (A1) which is a reaction product of an acid anhydride and an intermediate that is a reaction product of an unsaturated group-containing carboxylic acid and an epoxy compound having a bisphenol fluorene skeleton represented by formula (1). The epoxy compound contains a crystalline epoxy resin and an amorphous epoxy resin.
The solder resist composition according to the present invention contains: a carboxyl group-containing resin (A); a photopolymerizable compound (B) containing at least one kind selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator (C); crystalline epoxy resin (D) having a melting point of 130°C or higher; and a blue dispersant (E).
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
This solder resist composition contains a carboxyl group-containing resin (A), a photopolymerizable compound (B) containing at least one kind selected from the group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator (C), a thermosetting component (D), a perylene-based black colorant (E1), and one kind of colorant (E2) other than black, the solder resist composition having such properties that the coating of the solder resist composition photocured on a copper plate and then thermoset to have any thickness within the range of 18-22 μｍ has a L ＊ value of 40 or less, an ａ＊ value in the range of 5.1-55, and a ｂ＊ value in the range of -15-15.
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/095 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
Provided is a resin containing a carboxyl group, which is suitable as a component of a photosensitive resin composition, can impart excellent developability with an alkaline aqueous solution to a photosensitive resin composition even though the resin has a fluorene skeleton, and can also impart high electric insulation properties and plating resistance to a cured product of a photosensitive resin composition. The resin containing a carboxyl group is a reaction product of an intermediate with an acid dianhydride and an acid monohydride, wherein the intermediate is a reaction product of an epoxy compound having a bisphenol fluorene skeleton represented by formula (1) with a carboxylic acid containing an unsaturated group. The degree of polydispersion of the resin containing a carboxyl group is in the range from 1.2 to 2.8.
A light-sensitive resin composition contains a carboxyl-group-containing resin (A), an unsaturated compound (B), a photopolymerization initiator (C), an epoxy compound (D), and a component (E) containing at least one compound selected from the group comprising melamine and melamine derivatives. The carboxyl-group-containing resin (A) contains a carboxyl-group-containing resin (A1) having a bisphenol fluorene skeleton.
The polyester resin for a hot melt adhesive includes polycarboxylic acid residues and polyhydric alcohol residues. The polycarboxylic acid resides contain aliphatic polycarboxylic acid residues in a proportion within the range of 50 to 80 mol %. The polyhydric alcohol residues contain propylene glycol residues in a proportion within the range 5 to 60 mol %.
The present invention provides a copolymer able to be used as an oily gelling agent capable of preparing a stable oily gel-like composition. This copolymer is characterized by containing a hydrophobic monomer represented by general formula (1) and a hydrophilic monomer represented by general formula (2) and /or general formula (3). (In formula (1), R1 is a straight chain or branched chain alkyl group having 16-22 carbon atoms. R2 is a hydrogen atom or a methyl group.) (In formula (2), R3 is a hydrogen atom, a glyceryl group, a straight chain or branched chain hydroxyalkyl group having 1-4 carbon atoms, or a poly(propylene glycol) group represented by -(C3H6O)nH (here, n is an integer between 2 and 10). R4 is a hydrogen atom or a methyl group.) (In formula (3), R5 is a hydrogen atom or a methyl group. R6 is a straight chain or branched chain alkyl group or hydroxylalkyl group having 1-4 carbon atoms, or a substituent group represented by general formula (4).)
C08F 220/12 - Esters of monohydric alcohols or phenols
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
A61Q 1/00 - Make-up preparationsBody powdersPreparations for removing make-up
C08F 220/58 - Amides containing oxygen in addition to the carbonamido oxygen
47.
LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD
The present invention addresses the problem of providing a liquid solder resist composition that makes it possible to form a solder resist layer in which the reflectance is high and degradation resulting from light is particularly limited. This liquid solder resist composition comprises: a carboxyl group-containing resin; a photopolymerizable compound containing at least one compound selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator; titanium oxide; and a compound having a cyclic ether skeleton. The titanium oxide contains both rutile titanium oxide produced by the sulfuric acid method and rutile titanium oxide produced by the chlorine method.
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/031 - Organic compounds not covered by group
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
48.
LIQUID SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD
This liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound that contains one or more compounds selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator; an epoxy compound; and titanium oxide. The carboxyl group-containing resin is obtained by polymerizing a monomer composition that contains a carboxyl group-containing monomer represented by formula (1) and a maleimide compound represented by formula (2). The carboxyl group-containing resin does not have a photopolymerizable functional group. In formula (1), X represents Ra-COO.
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
This solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator which contains a bisacylphosphine oxide photopolymerization initiator and an α-hydroxyalkylphenone photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxyalkylphenone photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propan-1-one. The mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propan-1-one is from 2:1 to 1:10.
Provided is a solder resist composition comprising (A) a carboxyl-group containing resin, (B) an epoxy compound, (C) titanium oxide, (D) a photopolymerization initiator, and (E) an antioxidant. The (B) component contains a hydroquinone-type epoxy compound represented by formula (1). The (D) component contains (D1) a bisacylphosphine oxide photopolymerization initiator and (D2) an α-hydroxyalkylphenone photopolymerization initiator.
A photosensitive resin composition according to the present invention comprises (A) a photopolymerizable compound containing at least one of a photopolymerizable monomer and a photopolymerizable oligomer, (B) titanium oxide, and (C) a photopolymerization initiator. The (C) component contains (C1) an acylphosphine oxide photopolymerization initiator and (C2) a phenylglyoxylate photopolymerization initiator.
Provided is a liquid solder resist composition comprising: a carboxyl group-containing resin; a photopolymerizable compound containing at least one compound selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator; and titanium oxide. The photopolymerization initiator comprises a bisacylphosphine oxide photopolymerization initiator, a first α-hydroxyalkylphenone photopolymerization initiator that is a liquid at 25 °C, and a second α-hydroxyalkylphenone photopolymerization initiator that is a solid at 25 °C.
A hair styling composition containing components (A) and (B), the mass ratio (B)/(A) being from 0.03 to 1. (A): Polymer obtained by copolymerizing 35-50 mass% of monomers represented by formula (1) and 50-65 mass% of monomers represented by formula (2) (R1 and R3 are H or CH3, R2 is a C1-8 alkyl group, R4 is a C1-4 alkyl group, p is 20-90). (B): Polymer selected from: copolymers of (meth)acrylic acid hydroxyalkyl esters and (meth)acrylic acid alkoxyalkyl esters; and copolymers of (meth)acrylic acid hydroxyalkyl esters, (meth)acrylic acid alkoxyalkyl esters, and (meth)acrylic acid dialkylamides.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
A polyester resin composition which is characterized by containing (A) a polyester resin, (B) a (meth)acrylic polymer, (C) a monomer having a (meth)acryloyl group, (D) an organic metal compound, (E) a solvent and (F) at least one fluorine-containing compound selected from among fluoroalkyl group-containing oligomers represented by general formula (1) and hydrolysis products thereof. The present invention is capable of providing a polyester resin composition which has excellent transparency, adhesion properties and antifouling properties. The present invention is also capable of providing a polyester resin composition which has excellent transparency, adhesion properties, antifouling properties, antibacterial properties and antiviral properties.
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 265/00 - Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group
C08F 283/00 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass
The present invention provides a hydrophilic primer composition that can impart adhesiveness to a substrate when applied thereto and has good handling properties. This primer composition contains a polyester resin provided with a multivalent carboxylic residue and a glycol residue, and a modified polyolefin resin. The multivalent carboxylic residue contains a trivalent or higher multivalent carboxylic residue and/or a multivalent carboxylic residue provided with a metal sulfonate group. The value of the mass ratio of the polyester resin to the modified polyolefin resin is in the range of 8/2-2/8.
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09D 123/00 - Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCoating compositions based on derivatives of such polymers
56.
Inkjet recording ink, ink cartridge, inkjet recording method, inkjet recording device and ink recorded matter
C09D 11/326 - Pigment inks characterised by the pigment dispersant
C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
C09D 143/02 - Homopolymers or copolymers of monomers containing phosphorus
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; emulsion polymers contained industrial
chemicals; photoresists for printed circuit boards;
photocurable resists for printed circuit boards;
thermosetting resists for printed circuit boards; chemical
photoresist coatings used in the manufacture of printed
circuit boards; solder resist chemicals used in the
manufacture of printed circuit boards; chemical additives
for use in sintering ceramics; water repellents for
industrial purposes; finishing preparations and processing
agents used for textile industry; chemical coatings for
papermaking; chemical additives for papermaking; dispersants
for industrial purposes; emulsifiers for industrial
purposes; textile- impregnating chemicals; antistatic
preparations, other than for household purposes;
textile-stain repellents; soldering chemicals; solvents for
varnishes; mould-release preparations; plasticizers;
waterproofing chemical compositions for articles of fabric;
chemical preparations for use in the manufacture of paints;
chemicals for the manufacture of pigments; chemical
intensifiers for paper; plastic adhesives, other than for
stationery or household purposes; size for use in the
textile industry; size for finishing and priming; adhesives
for industrial purposes; heat-sensitive adhesives for
processing paper; pressure-sensitive adhesives for
processing paper; chemical preparations for use in
photography; photographic sensitizers for industrial
purposes; photographic sensitizers for use in the
manufacture of screen printing plates; unprocessed plastics
for industrial use; acrylic resins; polyester resins; epoxy
resins.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; [ emulsion polymers containing industrial chemicals; photoresists for printed circuit boards; ] chemicals in the nature of photocurable resists for use in the manufacture of printed circuit boards [ ; chemicals in the nature of thermosetting resists for use in the manufacture of printed circuit boards; chemical photoresist coatings used in the manufacture of printed circuit boards; solder resist chemicals used in the manufacture of printed circuit boards; chemical additives for use in sintering ceramics; water repellants for papermaking; chemical finishing preparations and chemical processing agents to be applied to textiles, plastics and coatings for industrial purposes; chemical coatings for papermaking; chemical additives for papermaking; oil dispersants for industrial purposes; emulsifiers for industrial purposes; textile-impregnating chemicals; antistatic preparations, other than for household purposes; textile-stain repellants; soldering chemicals; chemical solvents for use in the manufacture of varnishes; mould-release preparations; plasticizers; waterproofing chemical compositions for articles of fabric; chemical preparations for use in the manufacture of paints; chemicals for the manufacture of pigments; chemicals for use in industry, namely, chemical intensifiers for paper; size for use in the textile industry; size for finishing and printing; chemical preparations for use in photography; photographic sensitizers for industrial purposes; photographic sensitizers for use in the manufacture of screen printing plates; unprocessed plastics for industrial use; unprocessed acrylic resins; unprocessed polyester resins; unprocessed epoxy resins ]
59.
POLYESTER RESIN, HOT MELT ADHESIVE, AND HOT MELT ADHESIVE SOLUTION
This polyester resin for a hot melt adhesive includes polycarboxylic acid residues and polyhydric alcohol residues. The polycarboxylic acid residues contain aliphatic polycarboxylic acid residues in a proportion within the range of 50-80 mol%. The polyhydric alcohol residues contain propylene glycol residues in a proportion within the range of 5-60 mol%.
C08G 63/668 - Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
C09J 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C09J 167/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
60.
Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin
The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
C08G 59/14 - Polycondensates modified by chemical after-treatment
G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
61.
INKJET RECORDING INK, INK CARTRIDGE, INKJET RECORDING METHOD, INKJET RECORDING DEVICE AND INK RECORDED MATTER
An inkjet recording ink, including: water; a water-soluble organic solvent; a pigment; and a phosphate group-containing copolymer, wherein the phosphate group-containing copolymer contains a structural unit represented by the following General Formula (1) and a structural unit represented by the following General Formula (2): where R1 denotes a hydrogen atom or a methyl group; M+ denotes an alkali metal ion, an organic amine ion, or a hydrogen ion; half or more of M+ in the copolymer is the alkali metal ion or the organic amine ion, the remainder of M+ is the hydrogen ion; n and m each denote an integer of 0 to 6, provided that both of n and m are not 0; and a block of (C2H4O) and a block of (C3H6O) may be exchanged with each other, where R2 denotes a hydrogen atom or a methyl group.
The present invention provides a plate-film forming member capable of improving workability and yields in the production of screen printing plates. A plate-film forming member (1) according to the present invention is provided with a photosensitive resin layer (4) for forming a plate film (9), a supporting substrate (2) for supporting the resin layer (4), and an intermediate layer (3) situated between the supporting substrate (2) and the resin layer (4), said intermediate layer exhibiting both transparency and water solubility or water dispersibility.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
The present invention provides a carboxyl-containing resin which is less susceptible to gelation and which can form a solder-resist layer having high electrical insulation properties. This carboxyl-containing resin has a structure derived from a biphenyl novolak epoxy resin by the addition of a carboxylic acid to at least some of the epoxy groups thereof, said carboxylic acid containing a polybasic acid as the essential component.
Provided is a gelling agent having excellent gelling performance that is capable of dissolving at a low temperature in an oil base such as silicone oil. Also provided is a gelled composition. The gelling agent comprises an amino acid oligomer derivative. The amino acid oligomer derivative is obtained by acylation of a terminal and/or side chain of an amino acid oligomer. The amino acid oligomer is a monomer condensate comprising an amino acid monomer.
C08G 69/36 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines, and polycarboxylic acids
C08L 77/04 - Polyamides derived from alpha-amino carboxylic acids
Provided is a resin composition for resists, which can be efficiently formed into a cured material that has excellent properties such as cracking resistance, blister resistance and bulge resistance and that can be used for filling through-holes or via-holes. In the present invention, a first resin and a second resin are contained in the resin composition for resists. The first resin is produced by adding an ethylenically unsaturated compound having a carboxyl group to a bifunctional epoxy resin and further adding a polybasic acid anhydride to the resultant product. The second resin has both an epoxy group to which a monocarboxylic acid is added and an epoxy group to which a polybasic acid is added.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
This invention is a conductive paste for electron beam curing comprising a conductive powder, a radical-polymerizable composition, a plasticizer, and a dispersant; the plasticizer is added at a rate of 5 to 20 parts by mass per 100 parts by mass of the radical-polymerizable composition and the dispersant is a cationic dispersant.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
67.
MOISTURIZING POLYMER, METHOD FOR PRODUCING MOISTURIZING POLYMER, MOISTURIZING AGENT COMPOSITION, AND METHOD FOR PRODUCING MOISTURIZING AGENT COMPOSITION
Provided are: a moisturizing polymer which can be easily produced, while having high moisturizing performance in comparison to conventional moisturizing agents and excellent feeling on the skin; and a method for producing the moisturizing polymer. This moisturizing polymer has a structure wherein an amino acid monomer containing a neutral amino acid and a hydrophilic amino acid is graft polymerized to a polyfunctional polymer. This method for producing a moisturizing polymer comprises a step wherein an amino acid monomer containing a neutral amino acid and a hydrophilic amino acid, a polyfunctional polymer and an organic acid ammonium salt are prepared and then the amino acid monomer is graft polymerized to the polyfunctional polymer in the presence of the organic acid ammonium salt at a temperature that is not less than the melting temperature of the organic acid ammonium salt.
Disclosed is a curtain airbag capable of establishing both a low air permeability and a flexibility. Specifically disclosed is a curtain airbag which has an air permeability measured under a pressure difference of 100 kPa of 5 cc/cm2/sec or lower and a bending resistance measured by the cantilever method of 100 mm or less.
B60R 21/235 - Inflatable members characterised by their material
B60R 21/232 - Curtain-type airbags deploying mainly in a vertical direction from their top edge
D06M 15/333 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated alcohols or esters thereof of vinyl acetatePolyvinylalcohol
Disclosed are: an electron-beam-curable electrically conductive paste which enables the production of a circuit board that has an electrically conductive layer having excellent hardness and bending performance even when used under high-temperature environments and also having excellent adhesion to plastic substrates; and others. Specifically disclosed is an electron-beam-curable electrically conductive paste comprising an electrically conductive powder, a radically polymerizable composition and a plasticizer, wherein the plasticizer is contained in an amount of 5 to 20 parts by mass relative to 100 parts by mass of the radically polymerizable composition.
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
70.
HYBRID-TYPE POLYESTER RESIN, RESIN COMPOSITION FOR FORMATION OF FILM, AND POLYESTER FILM AND TEXTILE
Provided is a hybrid-type polyester resin which, when used in processing a base material such as textile or PET film, can impart excellent flame retardance to the base material. The hybrid-type polyester resin can be inhibited from scattering high-temperature drips, even if the hybrid-type polyester resin burns. The hybrid-type polyester resin comprises both a polyester resin and a siloxane prepared from silica and an alkoxysilane. Therefore, the hybrid-type polyester resin retains the excellent properties inherent in polyester resin and exhibits extremely excellent flame retardance by virtue of hybridization with the siloxane. Even if the hybrid-type polyester resin burns, the hybrid-type polyester resin is less susceptible to deformation, and is therefore inhibited from scattering high-temperature drips.
D06M 11/79 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof with silicon dioxide, silicic acids or their salts
A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.
G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
G03F 7/032 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
72.
ANTIBACTERIAL COMPOSITION, ANTIBACTERIAL POLYESTER FIBER, AND PROCESS FOR PRODUCTION OF ANTIBACTERIAL POLYESTER FIBER
Disclosed is an antibacterial composition which has good dispersibility in water and can significantly reduce the occurrence of the yellow discoloration of a base material or the like which is subjected to an antibacterial treatment. The antibacterial composition comprises a polyester resin and a silver-containing antibacterial agent, wherein the polyester resin is produced by the reaction between polymerizable components comprising at least one of a terephthalic acid component and an isophthalic acid component as a carboxylic acid component and at least one polyalkylene glycol as a glycol component. In the antibacterial composition, the polyester resin has a segment derived from the polyalkylene glycol. Therefore, the antibacterial composition has excellent dispersibility in water, and an aqueous dispersion containing the antibacterial composition can be prepared readily. Further, when an antibacterial treatment of a base material or the like is carried out by using the antibacterial composition, the yellow discoloration of the base material or the like can be reduced significantly.
C08L 67/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
C08K 3/00 - Use of inorganic substances as compounding ingredients
D06M 11/83 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with metalsTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with metal-generating compounds, e.g. metal carbonylsReduction of metal compounds on textiles
Disclosed is a carboxyl group-containing resin which is obtained by reacting a monocarboxylic acid (b) with epoxy groups of a resin (a), which has two or more epoxy groups in a molecule, in an amount of 0.3-0.85 mole per equivalent of the epoxy group in the resin (a), then reacting a polybasic acid (d) with epoxy groups of the thus-obtained reaction product (c) in an amount of 0.15-0.95 mole per equivalent of the epoxy group in the reaction product (c), and then further reacting a monocarboxylic acid (f) with epoxy groups of the thus-obtained reaction product (e) in an amount of 1.0-5.0 moles per equivalent of the epoxy group in the reaction product (f). The thus-obtained carboxyl group-containing resin has an acid value of 20-200 mgKOH/g, and is soluble in organic solvents.
C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
It is intended to provide a base for a cosmetic comprising a nonionic resin, which is soluble in water, alcohol and liquefied petroleum gas (LPG), facilitates the adjustment of a property as a base for a cosmetic, and is useful particularly as a base for a hair cosmetic. The base for a cosmetic according to the invention is a nonionic resin composed of a polymer of an ethylenic unsaturated monomer component (A) including a nonionic unsaturated monomer (a). In the nonionic unsaturated monomer (a), N,N-dimethylacrylamide (a1) represented by the following chemical formula (1) is included as an essential component. This base for a cosmetic isa nonionic resin, therefore, a problem of lack of compatibility even if it is used with another resin is unlikely to occur. Further, it shows a favorable solubility in various types of solvents for the base. The solubility of the base for a cosmetic in various types of solvents, properties as the base for a cosmetic such as a glass transition point or adhesiveness are easily adjusted.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
A61Q 5/06 - Preparations for styling the hair, e.g. by temporary shaping or colouring
PROCESS FOR PRODUCING BASE MATERIAL HOLDING TOOL FOR WIRING BOARD, BASE MATERIAL HOLDING TOOL FOR WIRING BOARD, INTERMEDIATE MATERIAL FOR WIRING BOARD, AND PROCESS FOR PRODUCING WIRING BOARD
This invention provides a process for producing a base material holding tool for a wiring board, comprising an adhesive organic material layer provided on the surface of a holding tool body, that can realize improved adhesion between the organic material layer and the holding tool body, can regulate the adhesion of the organic material layer without varying the composition of the resin for organic material layer formation, and can accurately regulate the thickness even in the formation of a plurality of regions different from each other in adhesion in the organic material layer. The production process is characterized by comprising subjecting the surface of a holding tool body (2) to substrate treatment with a substrate treatment agent containing an adhesion modifier component for regulating the adhesion of an organic material layer (3), and then stacking an adhesive organic material layer (3). Accordingly, the adhesion of the organic material layer (3) can be regulated without varying the composition of a resin used for organic material layer (3) formation by the adhesive modifier component contained in the substrate treatment agent, and an organic material layer (3) having various adhesive properties can be formed by a resin having an identical composition.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in the manufacture of printed circuit boards, namely, etching resist, plating resist, and solder resist chemicals; synthetic resins for use in the manufacture of printed circuit boards; chemicals for use in the manufacture of textile and fabric, chemicals for use in the manufacture of hair products, chemicals for use in the manufacture and treatment of paper [ ; chemical galvanizing baths and preparations for use in metal treatment; and chemicals for use in painting and burning ceramics ]
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
ETCHING RESIST, PLATING RESIST, SOLDER RESIST, [ FILING ] *FILLING* RESIN USED FOR MANUFACTURING PRINTED CIRCUIT BOARD [ ; PHOTOSENSITIVE DRY FILMS FOR USE IN THE MANUFACTURE OF PRINTED CIRCUITS, namely, DRY FILM PHOTORESIST; AND PHOTOSENSITIVE CHEMICALS, namely, LIQUID PHOTOIMAGEABLE SOLDER RESIST, AND ELECTRODEPOSITED PHOTORESIST ]
