Abstract

Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 31/12 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

An LED lighting system may include one or more light-emitting diodes and one or more power management modules. Components of the LED lighting system may be selected and arranged, for example, to match a load voltage to an operating voltage. Matching the load voltage to the operating voltage may enable efficient use of power by the LED lighting system. A method of selecting components of the LED lighting system is provided. For example, the components may be selected based on a target luminance and a given operating voltage. The method may be facilitated and/or implemented with a computer.

IPC Classes  ?

• G05F 1/00 - Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
• H05B 37/02 - Controlling
• H05B 39/04 - Controlling
• H05B 41/36 - Controlling
• H05B 37/00 - Circuit arrangements for electric light sources in general
• H05B 39/00 - Circuit arrangements or apparatus for operating incandescent light sources
• H05B 41/00 - Circuit arrangements or apparatus for igniting or operating discharge lamps
• H01J 7/24 - Cooling arrangementsHeating arrangementsMeans for circulating gas or vapour within the discharge space
• H01J 17/28 - Cooling arrangements
• H01J 13/32 - Cooling arrangementsHeating arrangements
• H01J 19/74 - Cooling arrangements
• H01J 61/52 - Cooling arrangementsHeating arrangementsMeans for circulating gas or vapour within the discharge space