A method for automatic power negotiation for electric vehicle-to-vehicle charge transfer, includes connecting a donor electric vehicle to a receiver electric vehicle via a charging cable of a charging cable system and receiving from a control box of the charging cable system, an initial power setting for the donor electric vehicle. The method also includes determining if the initial power setting has a non-zero value and if the initial power setting has a non-zero value, determining if the initial power setting is acceptable by the donor electric vehicle. The method further includes if the initial power setting is acceptable by the donor electric vehicle, repeatedly increasing the initial power setting to a higher power setting until a maximum power setting is determined and transferring an electric charge from the donor electric vehicle to the receiver electric vehicle along the charging cable based on the maximum power setting.
An integrated heat spreader power adapter includes an integrated heat spreader housing formed by insert molding of a housing and a heat spreader and an internal cavity formed by the integrated heat spreader housing. The integrated heat spreading housing increases a size of the internal cavity. The integrated heat spreader power adapter further includes a printed circuit board assembly provided within the increased size of the internal cavity formed by the integrated heat spreader housing. The printed circuit board is sized based on the increased size of the internal cavity and includes electronic components provided thereon to cause the integrated heat spreader power adapter to be configured to deliver an output power of at least 320 watts. The integrated heat spreader power adapter has a volume of less than 270,000 mm3.
09 - Scientific and electric apparatus and instruments
35 - Advertising and business services
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Downloadable and non-downloadable software for supply chain management, logistics, operations management, quality control, inventory management, manufacturing automation, industrial automation, predictive maintenance, and scheduling of transportation and delivery; software for machine learning, data analytics, and artificial intelligence in the fields of supply chain, manufacturing, and data center infrastructure; Computer hardware and data processing equipment for use in data centers; Computer hardware and data processing equipment for use in data centers, namely, servers, racks, liquid-cooled racks, and temperature control apparatus; Electronic and electrical components, namely, Frequency control devices, crystal resonators, oscillators, filters (namely surface acoustic wave filters), multiplexers, duplexers, antennas and antenna modules; Capacitors, inductors, resistors, circuit protection devices, supercapacitors, ultracapacitors, batteries; Semiconductors, diodes, transistors, voltage regulators, integrated circuits (namely application-specific, mixed signal, logic, and power management integrated circuits), microcontrollers; Signal tuners, amplifiers, transmitters, receivers; Sensors, namely, electric, hall, gyroscope, optical, MEMS, pressure, temperature, magnetic field, accelerometer, bio, and air quality sensors; Display devices, light emitting diodes, audio speakers, microphones, buzzers, transducers, nebulizer modules, electronic nose sensors; Electrical and electronic connectors, namely, Wire, board, and circuit connectors; terminals; pin headers; sockets; switch housings; connector housings; Specialized connectors, namely, USB, HDMI, RJ45, PCI-E, SFP, QSFP, OSFP; automotive connectors, namely, Fakra and HSD connectors; backplane connectors; Cables and cable assemblies, namely, Power cables, optical cables, USB cables, high-speed cables (e.g., OSFP, QSFP, SFP, Ethernet), EV charging cables and guns; Busbars (copper, aluminum, flexible, multilayer, automotive, integrated); Printed circuit boards, flexible circuits, flexible flat cables; Cooling systems and components, namely, Cooling fans, heat sinks, liquid cooling systems, cold plates, hoses, pumps, quick disconnect couplings, cooling distribution manifolds; Power and distribution equipment, namely, Power supplies, power controllers, power distribution units, blocks, machines, panels, busways, switchgear, outlet boxes, connection boxes; Wireless controllers for remote monitoring and control of electrical, electronic, and mechanical systems; renewable battery systems for backup power; digital and analog converters; computer hard drive enclosures; electrical enclosure cabinets and control enclosures; high-frequency switching power supplies. Business management and supply chain management services in the fields of electronics, power generation and distribution, liquid cooling solutions, computer hardware, and data processing equipment; logistics management services; procurement services, namely, purchasing of electronics, power generation and distribution products, liquid cooling solutions, computer hardware, and data processing equipment for others; sourcing and purchasing of computer systems, components, and related inventory management services; wholesale distributorship services and wholesale ordering services via direct solicitation by sales agents in the fields of electronics, power generation and distribution products, liquid cooling solutions, computer hardware, and data processing equipment; inventory control and inventory management services. Custom manufacturing services for others in the fields of electronics, power generation and distribution products, liquid cooling solutions, computer hardware, and data processing equipment; manufacturing of computer hardware and electronics for use in data centers; technical support services, namely, providing technical advice related to the manufacture of electronics, computer hardware, and data processing equipment. Engineering and engineering design services; product development and product design services; research, development, and testing services in the fields of electronics, power generation and distribution products, liquid cooling solutions, computer hardware, and data processing equipment; design and testing for new product development; Providing temporary use of non-downloadable software for supply chain management, logistics, operations, inventory control, inventory management, and tracking of documents and products over computer networks, intranets, and the internet; Software as a Service (SaaS) featuring software for supply chain management, logistics, operations management, quality control, inventory management, and scheduling of transportation and delivery; SaaS featuring mobile applications for supply chain management, logistics, operations management, quality control, inventory management, and scheduling of transportation and delivery; SaaS featuring software for machine learning, data analytics, and artificial intelligence for use in supply chain management, manufacturing automation, industrial automation, and data center infrastructure; SaaS featuring software for managing manufacturing processes and predictive maintenance; Information, consultancy, and advisory services related to all the aforementioned services.
A power system includes an energy storage system having a rechargeable energy storage element and a converter connected to the rechargeable energy storage element and configured to connect to a bus so that the energy storage system is connected in parallel with a load and a main power supply system. The energy storage system may cooperate with the main power supply system to supply power to the load with each of the energy storage system and the main power supply system configured as a voltage source with a corresponding droop function. The system may include a control circuit configured to monitor a voltage of the bus and control the converter to either charge or discharge the rechargeable energy storage element based on the voltage of the bus.
A power system comprises an energy storage system including a rechargeable energy storage element and a converter connected to the rechargeable energy storage element and configured to connect to a bus so that the energy storage system is connected in parallel with a load and a main power supply system. The energy storage system cooperates with the main power supply system to supply power to the load. The power system may include a control circuit configured to monitor a voltage of the bus and control the converter to either charge or discharge the rechargeable energy storage element based on the voltage of the bus. The control circuit may also monitor a status of a state of charge (SOC) of the rechargeable energy storage element and a system load condition.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, crystal
oscillators, electrolytic capacitors, inductors, resistors
and fuses; discrete electronic components, namely diodes and
transistors; analog electronic voltage regulators; analog
electronic signal tuners; amplifiers, transmitters of
electronic signals, receivers of electronic signals,
electricity limiters, internal cooling fans for analog and
digital electrical and electronic equipment; bracelets,
wrist straps and gloves worn principally for electrostatic
discharge mitigation; storage bags for electronics to
protect against electrostatic charges; mats used to mitigate
electrostatic discharge.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, frequency control devices in the nature of electrical signal generation, electrical signal filtering and shaping Crystal resonators, Crystal oscillators, Surface Acoustic Wave Filter, Ceramic resonators and filter, electromagnetic interference filters; Metal Oxide Silicon Field effect transistors (MOSFET); rectifiers; light emitting diodes (LED); supercapacitors for energy storage; ultracapacitors for energy storage; capacitors, electrical and electronic inductors, electric resistors; electronic and electrical circuit protection devices, namely, fuses, circuit breakers, varistors, thermistors; batteries; semiconductors; diodes; transistors; voltage regulators; radio signal tuners; amplifiers; transmitters of electronic signals; receivers of electronic signals; integrated circuits; application-specific integrated circuits; microcontrollers; logic circuits; logic integrated circuits; mixed signal integrated circuits; power management integrated circuits; electronic servo motor controllers; electronic controls for motors; electric sensors; light emitting diodes; display devices, namely electronic display interfaces, liquid crystal displays, flat panel display screens; optical sensors; opto-isolaters; optocouplers; memory boards; memory cards; memory modules; electrical and electronic connectors; wire to board connectors; optical fiber connectors; connectors for electronic circuits; board to board connectors, namely, electronic connectors to connect Printed Circuit Boards (PCBs) for electronic signal and power transmission; wire to wire connectors, namely, electronic connectors to connect cable wires for electronic signal and power transmission; wire to board connectors, namely, electronic connectors connect cable wire and PCB board for electronic signal and power transmission; terminals, namely, metal terminal as contact for connectors; battery terminals; component parts of batteries, namely, battery clips, battery contacts, battery springs; pin headers, namely, electronic header connectors; electronic sockets; semiconductor wafers; wafers for integrated circuits; electric switch housings; electronic connector housings; housings for printed circuit boards; flat flexible cable (FFC) and flexible printed circuit (FPC) connectors, namely, electronic connectors connects FFC and FPC to PCB for signal and power transmission; peripheral component interconnect express (PCI-E) connectors, namely, electrical and electronic connectors that connects various server and storage components with the motherboard, following PCI-E standard; industrial connectors, namely, electrical and electronic connectors that transmit signal and power for industrial application; terminal blocks, namely electrical terminal blocks; heavy-duty connectors, namely, electrical and electronic connectors for signal and power connection; high power connectors, namely, electrical connectors; high speed connectors, namely, electronic connector; small form factor pluggable (SFP), quad small form factor pluggable (QSFP), and octal small form factor pluggable (OSFP) connectors, namely, electronic connector; input/output (I/O) connectors, namely, electronic connector; universal serial bus (USB) connectors, namely, electronic connectors; D-subminiature (d-sub) connectors, namely, electronic connectors following D-Sub standards for signal transmission; display port (DP) connectors, electronic connectors following DP standards for signal transmission; ethernet connectors, namely, electronic connectors for ethernet signal transmission; registered jack (RJ45) connectors; electronic connector for ethernet application; dc jacks, namely, electrical connectors that supply DC(direct current) power; audio jacks connectors, namely, electronic connectors for audio signal transmission in audio devices; high definition multimedia interface connectors, namely, electronic connectors following high definition multimedia interface standards for signal; digital visual interface (DVI)connectors, namely, electronic connectors following DVI standards for signal transmission; pogo pins, namely, electronic connectors with spring loaded contact mechanism, for data and power transmission ; insulation-displacement contact (IDC) connectors, namely, electrical and electronic connectors that connect cable to using directly piercing the insulation layer of the wire through blade crimping technology; radio frequency (RF) connectors, namely, electronic circular coaxial connector for signal transmission; mini radio frequency (RF)connectors, namely, electronic circular coaxial connector for signal ; radio frequency (RF)switches, namely, electronic connector for signal transmission; Sub Miniature version A (SMA) connectors, namely, electronic connector with threaded connection for signal transmission ; Threaded Neill Concelman (TNC) connectors, namely, connector for signal transmission; rectangular connectors, namely, electrical and electronic connector with a rectangular mating interface for signal and power transmission; circular connectors, namely, electrical and electronic connector with a circular mating interface for signal and power transmission; automotive connectors, namely, electrical and electronic connectors that transmit signal and power for automotive application; fakra connectors, namely, electronic connector that transmit high frequency electronic signal for cameras, sensors and antennas, radar; mini fakra connectors, namely, electronic connector transmit high frequency electronic signal for cameras, sensors and antennas, radar applications; high speed data (HSD) connectors, namely, electronic connectors that transmit high-speed signal and power in automotive application, for cameras, USB interfaces, Ethernet, Firewire and similar high-speed communication protocols; backplane connectors, namely, electronic connectors transmit signals between the main system board (the backplane) and peripheral PCB boards or modules; electronic and electrical wires, used for transmitting electronic signals; Cables and cable assemblies, namely, interconnect solutions consisting of connectors, conductors, insulation, shielding, and protective jackets, designed for reliable transmission of data, control signals, and electrical power; cable harnesses, namely, organized bundles of conductors terminated with connectors and wrapped with insulation and protective sheathing, designed to transmit electrical power, control signals, and data. power cables; power whips, namely, cables transmit power between power source and devices; Optical cables, namely, fiber-based interconnect solutions consisting of optical fibers, connectors, protective jackets, and shielding elements, designed for high-speed data transmission over long distances; USB cables, namely, copper-based interconnect solutions consisting of conductors, USB connectors, insulation, shielding, and protective jackets, designed for data transfer and low-power delivery; High-speed direct attach cables (DAC), namely, copper-based cable assemblies consisting of twinax conductors, high-speed connectors, shielding, and protective jackets, designed for short-reach, low-latency transmission of high-speed data. electric vehicle (EV)charging cables, namely, electrical cable assemblies consisting of high-current conductors, insulation, shielding, protective jackets, and integrated connectors, designed for safe and efficient transmission of high-voltage DC or AC power in EV charging systems; electric vehicle (EV)charging inlet, namely, electrical connectors integrated into the vehicle body, consisting of high-current contacts, insulation, sealing gaskets, and safety interlock features, designed to receive AC or DC power from external charging equipment. copper busbars, namely, solid electrical conductors made of high-purity copper, designed for efficient high-current and low-resistance power distribution in electrical systems, consisting of flat or shaped bars with insulation, plating, and mounting feature; aluminum busbars, namely, solid electrical conductors made of high-strength aluminum alloys, designed for lightweight and cost-effective high-current power distribution in electrical systems, consisting of flat or shaped bars with insulation, plating, and mounting features; flexible busbars, namely, laminated or braided electrical conductors made of stacked copper foils or tinned-copper braids, designed to accommodate vibration, thermal expansion, and assembly tolerances while providing compact, low-inductance, high-current power distribution in electrical systems, consisting of insulated flat or shaped sections with optional surface plating defined bend radii, hole patterns, and integrated termination or mounting features; multilayer busbars, namely, laminated electrical conductors composed of multiple stacked copper or aluminum layers separated by insulation, designed for compact, low-inductance, and high-current power distribution in electrical systems, consisting of precisely aligned layers with dielectric barriers, surface plating, and integrated mounting or termination; lamination busbars, namely, laminated electrical conductors formed by stacking and bonding multiple copper or aluminum layers with insulating films, designed for compact, low-inductance, and high-current power distribution in electrical systems, consisting of precision-aligned conductive layers, dielectric insulation, surface plating, and integrated mounting or termination features; rod busbars, namely, solid cylindrical electrical conductors made of high-conductivity copper or aluminum alloys, designed for robust and efficient high-current power distribution in electrical systems, consisting of straight or bent rods with optional insulation, surface plating, and integrated mounting or termination features; integrated busbars, namely, custom-engineered electrical conductors combining multiple phases, insulation layers, and connection interfaces into a single compact assembly, designed for optimized space utilization, low inductance, and high-current power distribution in electrical systems, consisting of laminated conductive layers, dielectric barriers, surface plating , and integrated mounting or termination features; solid busbars, namely, rigid electrical conductors made of high-conductivity copper or aluminum alloys, designed for durable and efficient high-current power distribution in electrical systems, consisting of straight or shaped bars with optional insulation, surface plating and integrated mounting or termination features; automotive busbars, namely, custom-engineered electrical conductors made of high-conductivity copper or aluminum alloys, designed for compact, lightweight, and reliable high-current power distribution in electric and hybrid vehicle systems, consisting of laminated or solid sections with insulation, surface plating integrated mounting features, and connection interfaces for battery packs, inverters, and power electronics; open compute project (OCP) busbars, namely, standardized electrical conductors designed according to OCP specifications for high-efficiency, scalable power distribution in data center and server rack systems, consisting of rigid or laminated copper or aluminum sections with insulation, surface plating, integrated mounting features, and connection interfaces for modular power shelves and IT equipment; power elements; printed circuits boards; flexible printed circuits; flexible flat cables, namely, thin and bendable electrical conductors arranged in parallel within a flat, insulated ribbon structure, designed for compact, lightweight, and reliable signal or power transmission in electronic and electromechanical; high speed active copper cables and active electrical cables, namely, electrically enhanced transmission assemblies using copper conductors combined with integrated signal conditioning electronics, designed for reliable, low-latency, and high-bandwidth data transfer in high-performance computing and networking systems, consisting of precision-twisted copper pairs with shielding, active equalization circuitry, low-loss insulation, and standardized high-speed connectors; internal high-speed cables, namely, precision-engineered transmission assemblies using copper or hybrid conductors with controlled impedance, designed for ultra-low-loss, high-bandwidth signal delivery within electronic enclosures or system chassis, consisting of shielded twisted pairs or twinax structures with low-dielectric insulation, optional active equalization, and standardized high-speed connectors for board-to-board or module interconnects; input-output (I/O) cables, namely, electrical or hybrid transmission assemblies designed for reliable signal and power connectivity between peripheral devices and host systems, consisting of copper or optical conductors with insulation, shielding for electromagnetic interference suppression, standardized connectors, and optional active components for signal conditioning or protocol; type C cable, reversible high-speed transmission assemblies designed for universal connectivity and power delivery between electronic devices, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, integrated control circuitry for USB Power Delivery and data protocols, and standardized USB Type-C connectors supporting multiple modes; cables, namely, certified transmission assemblies designed for secure and reliable power delivery and data transfer between portable electronic devices and accessories, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, integrated authentication circuitry, and standardized Lightning or USB Type-C connectors; display port (DP) cable, namely, high-speed digital transmission assemblies designed for reliable delivery of video, audio, and auxiliary data between computing devices and displays, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, standardized DisplayPort connectors supporting multiple resolutions and refresh rates, and optional active circuitry for signal boosting over extended lengths; high definition multimedia interface cables, namely, digital transmission assemblies designed for high-quality audio and video connectivity between consumer electronics and display devices, consisting of copper conductors with precision impedance control, multi-layer shielding for EMI suppression, standardized high definition multimedia interface connectors supporting advanced protocols such as Ethernet and ARC, and optional active components for extended cable runs; copper clad steel (CCS) cables, namely, composite electrical conductors consisting of a high-strength steel core uniformly coated with copper, designed for enhanced tensile strength, corrosion resistance, and cost-effective signal or power transmission in telecommunication and electrical systems, consisting of stranded or solid CCS wires with insulation, optional shielding, and standardized termination; photovoltaic (PV) cable, namely, specialized electrical conductors designed for reliable DC power transmission in solar energy systems, consisting of stranded copper conductors with cross-linked polymer insulation, UV and weather-resistant outer jackets, optional shielding, and standardized termination features for photovoltaic modules, inverters, and junction; optical signal interconnect devices, namely, optical fiber cables, namely, multifiber push-on (MPO), lucent connector (LC), fiber channel (FC), and square connector (SC) optical fiber cables; active optical cables, namely, high-performance interconnect solutions integrating optical transceivers and fiber assemblies, designed for ultra-high-speed, low-latency data transmission over extended distances in data centers and high-performance computing systems, consisting of optical fibers, embedded electronics for signal conversion, connectors, and protective sheathing; active optical cables (AOC), namely, octal small form-factor pluggable (OSFP), quad small form factor pluggable (QSFP), and small form factor pluggable (SFP) optical cables; octal small form-factor pluggable (OSFP), quad small form factor pluggable (QSFP), and small form factor pluggable (SFP) transceivers; optical modular, namely, pre-terminated fiber optic interconnect solutions designed for high-density, high-speed data transmission in telecommunication and data center systems, consisting of multiple optical fibers organized in modular cassettes or panels with precision alignment, protective housings, standardized connectors such as MPO/MTP, and optional polarity management features for simplified installation and scalability electric buzzers; audio speakers; microphones; piezo devices, namely, piezoelectric sensors, piezoelectric switches, piezoelectric actuators, piezoelectric transducers, electrical transducers; electromagnetic transducers; ultrasonic sensors; powder level sensors; air quality sensors; micro-electromechanical systems time-of-flight (MEMS ToF) sensors; pressure sensors; magnetic field sensors; photoplethysmography sensors, using light-emitting diodes (LEDs) and photodetectors; temperature sensors; cooling fans for analog and digital electrical and electronic equipment, namely, internal cooling fans for smartphones, internal cooling fans for computers, Power supply and rack and enclosure; heat sinks for use in electronic components; liquid cooling systems, namely, integrated thermal management assemblies designed for efficient heat dissipation in high-performance electronic or computing systems, consisting of a pump, radiator, reservoir, cold plate, manifold, quick-disconnect fittings, controller, monitoring unit, and a series of tubes for coolant circulation; quick disconnect couplings, namely, precision-engineered mechanical connectors designed for rapid and secure connection or disconnection of fluid lines in cooling, hydraulic, or pneumatic systems, consisting of mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and standardized interface geometries for leak-free operation; universal quick disconnect couplings for liquid cooling systems; universal quick disconnect (UQD) connectors, namely, standardized fluid coupling assemblies designed for rapid, secure, and leak-free connection or disconnection of liquid cooling lines in high-performance computing and electronic systems, consisting of precision-machined mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for compatibility across multiple platforms; universal quick disconnect blind mate (UQDB) connectors, namely, precision-engineered fluid coupling assemblies designed for rapid, secure, and leak-free blind mating of liquid cooling lines in high-performance computing and electronic systems, consisting of self-aligning mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for tool-less installation and compatibility across multiple platforms; universal blind-mate quick (BMQC) connectors, namely, precision-engineered fluid coupling assemblies designed for rapid, secure, and leak-free blind mating of liquid cooling lines in high-performance computing and electronic systems, consisting of self-aligning mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for tool-less installation and compatibility across multiple platforms; tubes, namely, flexible material that carries liquid for liquid cooling devises; liquid leakage detection wires, namely, sensor-based cable assemblies designed for early detection of liquid presence in cooling or fluid distribution systems, consisting of conductive sensing elements embedded in insulated wires, protective outer jackets, standardized connectors for integration with monitoring controllers, and optional alarm or shutdown interfaces for system safety; liquid cooling distribution manifolds, namely, precision-engineered assemblies designed for centralized coolant routing and flow management in high-performance computing and electronic systems, consisting of machined or molded bodies with multiple inlet and outlet ports, integrated sealing elements, optional flow control valves, mounting features, and standardized quick-disconnect interfaces for modular liquid cooling loops; cold plates, namely, precision-engineered thermal interface assemblies designed for efficient heat transfer from electronic components to liquid cooling loops, consisting of a machined or extruded metal base with microchannel or pin-fin structures, integrated sealing elements, inlet and outlet ports for coolant flow, and mounting features for secure attachment to processors, power modules, or other heat-generating devices, hoses, pumps, namely, precision-engineered fluid circulation assemblies designed for continuous and reliable coolant flow in high-performance electronic and computing systems, consisting of a motor-driven impeller housed in a sealed chamber, integrated inlet and outlet ports, vibration-damping mounts, optional speed control electronics, and standardized interfaces for connection to reservoirs and cooling loops; antennas; external antennas, cabled external antennas, dipole antennas, patch antennas, dome antennas, multiple-input and multiple-output (MIMO) antennas, stub antennas, automotive antennas; internal antennas, printed circuit board (PCB) antennas, flexible printed circuit (FPC) antennas, chip antennas, helix antennas, metal antennas, near field communication (NFC) antennas, precision location antennas, GPS antennas, global navigation satellite system (GNSS) antennas; antenna array, namely, structured assemblies of multiple radiating elements arranged in a defined geometric configuration, designed for high-gain, directional, and beamforming capabilities in wireless communication and radar systems, consisting of individual antenna elements with feed networks, phase-shifting components, mounting structures, and optional integrated control electronics for adaptive performance; antenna filter unit, namely, precision RF components designed to selectively pass desired frequency bands while attenuating unwanted signals, enabling optimized performance in wireless communication systems, consisting of resonators, dielectric or cavity structures, integrated shielding, connectors, and mounting features; levelers, namely, adjustable height support and feet for electronic equipment, and cabinets and racks for holding electronic equipment
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, crystal
oscillators, electrolytic capacitors, inductors, resistors
and fuses; discrete electronic components, namely diodes and
transistors; analog electronic voltage regulators; analog
electronic signal tuners; amplifiers, transmitters of
electronic signals, receivers of electronic signals,
electricity limiters, internal cooling fans for analog and
digital electrical and electronic equipment; bracelets,
wrist straps and gloves worn principally for electrostatic
discharge mitigation; storage bags for electronics to
protect against electrostatic charges; mats used to mitigate
electrostatic discharge.
11.
NOVEL HIGH EFFICIENCY CENTER TAPPED TRANSFORMER STRUCTURE
Devices and methods for coupling an interleaved aligned first and second secondary windings coil structure with a primary winding of a center tapped transformer are provided. In particular, a method for forming a center tapped transformer includes forming a winding core, winding a primary winding around the winding core and winding a first secondary winding and a second secondary winding in an interleaved alignment around the primary winding.
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
H01F 29/02 - Variable transformers or inductances not covered by group with tappings on coil or windingVariable transformers or inductances not covered by group with provision for rearrangement or interconnection of windings
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A syringe includes a barrel and a plunge rod axially translatable within the barrel. The plunge rod includes a plunge end extending outside the barrel. A smart cap is coupled to the plunge end of the plunge rod. The smart cap includes a spring, a conductive plate coupled to the spring, a spacer, a battery holder, a battery, a measuring device, and a cap. The battery holder is disposed axially closer to the plunge end than the spacer, and the battery holder is adjacent a first surface of the battery. The measuring device is disposed axially closer to the plunge end than the battery holder, and the measuring device is adjacent a second surface of the battery. The cap is axially aligned with the plunge rod. The cap encompasses each of the spring, the conductive plate, the spacer, the battery holder, the battery, and the measuring device.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic and electrical components, namely, crystal oscillators, electrolytic capacitors, inductors, resistors and fuses; discrete electronic components, namely diodes and transistors; analog electronic voltage regulators; analog electronic signal tuners; amplifiers, transmitters of electronic signals, receivers of electronic signals, electricity limiters, internal cooling fans for analog and digital electrical and electronic equipment; bracelets, wrist straps and gloves worn principally for electrostatic discharge mitigation; storage bags for electronics to protect against electrostatic charges; mats used to mitigate electrostatic discharge.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electronic and electrical components, namely, crystal oscillators, electrolytic capacitors, inductors, resistors and fuses; discrete electronic components, namely diodes and transistors; analog electronic voltage regulators; analog electronic signal tuners; amplifiers, transmitters of electronic signals, receivers of electronic signals, electricity limiters, internal cooling fans for analog and digital electrical and electronic equipment; bracelets, wrist straps and gloves worn principally for electrostatic discharge mitigation; storage bags for electronics to protect against electrostatic charges; mats used to mitigate electrostatic discharge.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, crystal oscillators, electrolytic capacitors, electronic inductors, electric resistors and fuses; discrete electronic components, namely diodes and transistors; analog electronic voltage regulators; electronic devices, namely, analog electronic signal turners being amplifiers; amplifiers, transmitters of electronic signals, receivers of electronic signals, electricity limiters, internal cooling fans for analog and digital electrical and electronic equipment; protective electrostatic discharge grounding devices, namely, bracelets, wrist straps and gloves worn principally for electrostatic discharge mitigation; protective electrostatic discharge grounding devices, namely, storage bags for electronics to protect against electrostatic charges; protective electrostatic discharge grounding devices, namely, mats used to mitigate electrostatic discharge
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, crystal oscillators, electrolytic capacitors, electronic inductors, electric resistors and fuses; discrete electronic components, namely diodes and transistors; analog electronic voltage regulators; electronic devices, namely, analog electronic signal turners being amplifiers; amplifiers, transmitters of electronic signals, receivers of electronic signals, electricity limiters, internal cooling fans for analog and digital electrical and electronic equipment; protective electrostatic discharge grounding devices, namely, bracelets, wrist straps and gloves worn principally for electrostatic discharge mitigation; protective electrostatic discharge grounding devices, namely, storage bags for electronics to protect against electrostatic charges; protective electrostatic discharge grounding devices, namely, mats used to mitigate electrostatic discharge
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic and electrical components, namely, crystal oscillators, electrolytic capacitors, electronic inductors, electric resistors and fuses; discrete electronic components, namely diodes and transistors; analog electronic voltage regulators; electronic devices, namely, analog electronic signal turners being amplifiers; amplifiers, transmitters of electronic signals, receivers of electronic signals, electricity limiters, internal cooling fans for analog and digital electrical and electronic equipment; protective electrostatic discharge grounding devices, namely, bracelets, wrist straps and gloves worn principally for electrostatic discharge mitigation; protective electrostatic discharge grounding devices, namely, storage bags for electronics to protect against electrostatic charges; protective electrostatic discharge grounding devices, namely, mats used to mitigate electrostatic discharge
18.
DIGITAL DESIGN FOR AUTOMATION (DDFAUT) AUTOMATED ANALYSIS SYSTEM
Embodiments relate to automated review and analysis of a digital design. Performing an automated review and analysis on a three-dimensional design can comprise collecting data related to the three-dimensional design, performing a pre-processing on the three-dimensional design files and the collected data related to the three-dimensional design and performing a validation of the three-dimensional design based on a plurality of pre-defined design rules and the pre-processing of the three-dimensional design files. An analysis report can be generated based on results of performing the validation of the three-dimensional design.
Embodiments relate to automated review and analysis of a digital design. Performing an automated review and analysis on a three-dimensional design can comprise collecting data related to the three-dimensional design, performing a pre-processing on the three-dimensional design files and the collected data related to the three-dimensional design and performing a validation of the three-dimensional design based on a plurality of pre-defined design rules and the pre-processing of the three-dimensional design files. An analysis report can be generated based on results of performing the validation of the three-dimensional design.
G06F 30/13 - Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
20.
ELECTROMECHANICAL ARCHITECTURE FOR CONNECTED PREFILLED DISPOSABLE SYRINGES
A smart syringe includes a barrel and a plunger axially translatable within the barrel. The plunger includes a first body portion coupled to a second body portion. A printed circuit board is coupled and positioned between the first body portion and the second body portion. The printed circuit board can include a ground contact disposed on a first lateral side of the printed circuit, a plurality of contact pads disposed on a second lateral side of the printed circuit board, and a microcontroller coupled to a surface of the printed circuit board. A conductive ring is disposed about an outer circumference of the plunger. The conductive ring includes sliding contacts configured to engage the ground contact and the plurality of contact pads of the printed circuit board. The microcontroller is configured to detect a change in conductivity to identify a position of the plunger relative to the barrel.
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
An antimicrobial metallized thin film is provided that can be quickly and easily attached to surfaces of objects. This film includes a polymer substrate onto which a metallized layer is formed. The metallized layer comprises an exposed antimicrobial metal physical contact surface. Ions from this physical contact surface destroy the viral coating and ribonucleic acid of contacting viruses rendering the viruses inactive and noninfectious. The film can be attached via an adhesive layer disposed between and in contact with the polymer substrate and the communal surface. This arrangement allows the film to economically refurbish communal surfaces with a film overlay rather than completely replacing communal surfaces with antimicrobial materials. The film mitigates the likelihood of viruses such as coronaviruses, noroviruses, rhinoviruses, and the like from spreading due to contact with the refurbished communal surfaces.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
An IMU may comprise a frame made of cast aluminum or injection molded plastic and a flexible PCBA wrapped at least partially around the frame. The PCBA may house electronic components include one or more of: a Y-axis component, an X-axis component, a Z-axis component and an application specific integrated circuit (ASIC) which are each located on a different side of the frame. A flexible tail having a connector may be used as an interface to the IMU. The connector may be designed to mate with a zero insertion force (ZIF) socket. Such IMU may be employed for automobile applications.
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
H01R 13/193 - Means for increasing contact pressure at the end of engagement of coupling part
G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
24.
SYSTEM AND METHOD OF CORRECTING INJECTION MOLD ALIGNMENTS
A method employing a corrector busing including measuring plastic parts produced by a plastic injection mold, adjusting one or more corrector bushings based on any measured errors in the plastic parts, performing a test production run of plastic parts, measuring the parts produced by the test production run, and determining whether the plastic parts produced by the test production run are within tolerance.
Recent progress related to energy harvesting solutions and printed electronics is opening the opportunity for a smart label to combine chemical/physical color change technology with an electronic based reader architecture, which can be achieved with printed electronics technologies and can be suitable for monitoring applications that are very cost sensitive. The smart label provides an innovative product architecture to achieve a very low cost solution to monitor packaged items during storage and shipment. Exemplary applications of the smart label include, but are not limited to, cold chain monitoring, food monitoring, and in-package control of sensitive devices, such as electronic components.
G01N 31/22 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods using chemical indicators
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
G01K 11/16 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in colour, translucency or reflectance of organic materials
The present disclosure provides a connector, which relates to the technical field of electrical connection devices, so as to solve the problem of poor connection stability of connectors in existing technologies. The connector includes a mounting base and a binding post, wherein the binding post has both sides symmetrically provided with a fixed fin, the mounting base defines thereon a mounting groove for mounting the binding post, two sides of the mounting groove define a limit groove, and the fixed fin is clamped in the limit groove so as to enable the binding post to be limited to the mounting groove. The connector according to the present disclosure has good connection stability and can effectively transmit current or signal, enabling an effective cooperation between connected devices.
An automatic injection device with flow regulation. The automatic injection device has an insertion needle configured to be inserted into a patient and a drug container which contains a pharmaceutical product and includes a plunger. The automatic injection device also has a fluid path which fluidly connects the drug container to the patient via an insertion device, a potential energy source, and a regulator configured to restrict release of potential energy and restrict linear movement of the plunger and pharmaceutical product into the fluid path at a proscribed pace. The regulator includes a clock escapement mechanism and a wire and pulley system including a wire coupled to at least one pulley. The potential energy source may be a spring that surrounds the drug container and may be directly coupled to the plunger and the wire such that movement of the spring and the wire is restricted over time.
A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
F28F 13/00 - Arrangements for modifying heat transfer, e.g. increasing, decreasing
An apparatus includes a switching circuit, a resonant circuit coupled to an output of the switching circuit, a rectification circuit coupled between the resonant circuit and an output of the apparatus, and a controller coupled to the switching circuit. The controller, during a soft start-up operation of the power supply, is configured to switch a plurality of switches with a variable limited maximum duty cycle at a minimum frequency and after the variable limited maximum duty cycle reaches the limited maximum duty cycle at the minimum frequency, simultaneously switch the frequency to a maximum frequency and switch the duty cycle to a minimum duty cycle at the maximum frequency for a same on-time as the limited maximum duty cycle at the minimum frequency.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 3/00 - Conversion of DC power input into DC power output
30.
Industrial internet of things (IIOT) in-situ stress real-time monitoring system
Embodiments of the present disclosure provide sensors inside an In-Circuit Tester (ICT) that measure stress on a Printed Circuit Board (PCB) every time the ICT runs through a manufacturing process. This ICT can comprise an Internet of Things (IoT) device which can measure, monitor, record, and show stress data that is being exerted by ICTs on the mounted PCB in real-time during tests thereby providing technicians an ability to oversee failures based on historical data that the IoT device provides.
G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
A bend test device and bend test method enable a mandrel bend test to be automatically performed. The bend test device includes a controlled motor, a drive shaft coupled to the motor, a nose piece coupled to the drive shaft, and a nose clamp for securing a device under test (DUT) to the nose piece. A control system connected to the bend test device uses a programmed control algorithm to control the bend test device. The motor is connected to the drive shaft and rotates the drive shaft in response to control signaling provided by the control system. The rotating drive shaft in turn rotates the nose piece. Rotation of the nose piece bends the mounted DUT. The motor rotates the drive shaft as defined by the software parameters and the DUT is bent back and forth across a defined radius edge.
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
A planar antenna can include one or more high permeability objects that are added near the planar coil's tips. Further, the planar antenna includes a coil having two or more layers, with each layer having two or more turns. The planar antenna also has a restricted conductor arrangement, where there are a maximum number of turns arranged in any horizontal layer. A turn's conductor could be a single conductor or could be two (2) or more conductors arranged in parallel.
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
H01F 27/36 - Electric or magnetic shields or screens
At least one example embodiment is directed to a method for controlling a rectifier. The method includes applying a first control signal to a first switch of the rectifier to cause a first current to flow through a first inductor of the rectifier, applying a second control signal to a second switch of the rectifier to cause a second current to flow through a second inductor. The second control signal and the first control signal have a phase difference. The method includes detecting that the first current falls to a first minimum value at a first time, detecting that the second current falls to a second minimum value at a second time, determining a first difference between the first time and the second time, and determining whether to adjust the second control signal based on the first difference to bring the phase difference closer to a target phase difference.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
A magnetic core assembly includes a first core having at least one gap and at least one second core provided within the at least one gap of the first core. The first core and the at least one second core are made of different materials. The at least one second core occupies a space no larger than the at least one gap of the first core.
H01F 1/147 - Alloys characterised by their composition
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
36.
Input redundant power supply with zero current switching
An input redundant power supply circuit includes a power converter, a relay switch unit including a first relay circuit coupled to a first power source and a second relay circuit coupled to a second power source, a control unit configured to control the relay switch unit so that the power converter is supplied power by the first or second power source, a high capacity capacitor powered by the power converter and a step-up converter coupled between the power converter and the high capacity capacitor. The step-up converter maintains a voltage across the high capacity capacitor higher than a voltage of the first power source or a voltage of the second power source when the relay switch unit switches from one of the first power source and the second power source to the other of the first power source and the second power source.
H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
37.
Touch detection through metal with detailed lit icon
Embodiments of the present disclosure are directed to a detailed lit indicator and touch detection in the same location through a metal surface. When the light behind the metal is turned off there will be no visible appearance of an indicator. When touched the metal will have no perceptible movement and never experience any deformation or evidence of usage over the life of the product.
Embodiments of the present disclosure are directed to a detailed lit indicator and touch detection in the same location through a metal surface. When the light behind the metal is turned off there will be no visible appearance of an indicator. When touched the metal will have no perceptible movement and never experience any deformation or evidence of usage over the life of the product.
A power adapter is disclosed with retractable prongs to engage an outlet and obtain power therefrom, when extended, and be partially or entirely within the housing of the power adapter when retracted. To ensure safe operation, a channel is provided within the power adapter to accommodate the prongs when retracted and to accommodate the prongs travel as they pivot between extended and retracted. The channel is width-limited and/or has a length to make it impossible or, at least, exceptionally difficult for a human finger to come into contact with the prongs while the prongs are extended and sufficiently engaged with an outlet to obtain power therefrom.
Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.
An apparatus includes a first circuit path including a series combination of a primary winding of a transformer and a first secondary winding of the transformer and a second circuit path including a second secondary winding of the transformer. The primary winding of the transformer is magnetically coupled to the first and second secondary windings of the transformer and the primary winding of the transformer is detachably coupled to each of the first and second secondary windings of the transformer. The primary winding of the transformer is operative to generate a portion of an output current based on energy received from the primary winding of the transformer, and the second secondary winding of the transformer is operative to generate a remaining portion of the output current based on energy received from the second secondary winding of the transformer.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
42.
Devices, systems, and methods for stacked die packages
A package includes a first chip stack. The first chip stack includes a first chip including first bonding structures, a second chip including second bonding structures facing the first bonding structures and bonded to the first bonding structures, and a first electrical contact on the second chip. At least a portion of the first electrical contact does not overlap with the first chip in a plan view.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/00 - Details of semiconductor or other solid state devices
43.
Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel
Methods, devices, and systems for testing the flexibility of a sample such as an electronic device are provided herein. A testing system can have a motor operably connected to a mandrel such that the motor causes the mandrel to accurately and precisely rotate and cause the sample to conform to an outer surface of the mandrel. Moreover, a proximal end of the sample is secured to the outer surface of the mandrel, and the opposing distal end is controlled by a retractable holder such that the entire sample is subjected to a constant bend radius as the mandrel rotates. Other aspects and features such as controlling the environment around the mandrel and securing small samples to the mandrel are also described herein.
A rectifier includes a first input and a second input that receive an unrectified signal, a first circuit portion including a first transistor coupled to the second input, a second circuit portion including a second transistor coupled to the first input, a third circuit portion including a third transistor coupled to the first input, a fourth circuit portion including a fourth transistor coupled to the second input. The first, second, third, and fourth circuit portions are operable to convert the unrectified signal into a rectified signal. The rectifier includes a first adjustment circuit coupled to a gate of the third transistor, and a second adjustment circuit coupled to a gate of the fourth transistor. The first adjustment circuit and the second adjustment circuit are configured to control a dead time between an on-state of the third transistor and an on-state of the fourth transistor.
H02M 7/219 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only in a bridge configuration
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/38 - Means for preventing simultaneous conduction of switches
45.
Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.
A method comprising : measuring plastic parts produced by a plastic injection mold (10); adjusting a corrector bushing (30, 34) based on any measured errors in the plastic parts; performing a test production run of plastic parts in the injection mold; measuring the parts produced by the test production run; and determining whether the plastic parts produced by the test production run are within tolerance. Further claimed is a corrector bushing comprising: a plurality of facets (32), the facets (32) configured to mate with facets (32) of a plastic injection mold (10); and an orifice (24, 34) configured to receive a core of an injection molding machine, wherein the orifice (24, 34) is centered on a location off set from a centerline of the corrector bushing (30, 34) such that insertion of the core into the orifice (24, 34) causes the core to deflect.
A set of headphones include a zone that is sensitive to electromagnetic radiation, a first earpiece including a first directional antenna operable at a first frequency and having a first radiation pattern radiating away from the zone, and a second earpiece including a second directional antenna operable at the first frequency and having a second radiation pattern radiating away from the zone.
H01Q 25/00 - Antennas or antenna systems providing at least two radiating patterns
H01Q 1/27 - Adaptation for use in or on movable bodies
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
A multi-board mid-plane includes a disk backplane board (DBB) having a front side and a rear side. Venting holes are provided within the DBB extending between the front side of the DBB and the rear side of the DBB. The multi-board mid-plane also includes a controller backplane board (CBB) having a front side and a rear side. The front side of the CBB includes venting holes provided within the CBB extending between the front side of the CBB and the rear side of the CBB. A top fabric plane board (TFPB) and a bottom fabric plane board (BFPB) are provided for connecting the DBB with the CBB. A combination of the DBB and the CBB has a venting ratio that is equal to a lower of the venting ratio of the DBB and the venting ratio of the CBB.
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Supply chain management services; logistics management in
the field of electronics; procurement and inventory
management services for others; wholesale distributorship
services in the field of electronics. Manufacturing services for others in the field of
electronics; custom manufacture of goods for others;
technical support services, namely, providing technical
advice related to the manufacture of goods. Engineering services, consulting services in the fields of
new product development and electronics; new product design
services; research and development of new products;
technical support services, namely, providing technical
advice related to the manufacture of goods.
A device and method is disclosed for assembling a container holder in a clean environment, aseptically adding a solution to a primary container, inserting the primary container into the container holder, applying a first barrier to the container holder, sterilizing the container holder comprising the primary container and the applied first barrier to provide a sterilized container holder, assembling a fluid path module in a clean environment, the assembling comprising applying a second barrier to a first end of the sterilized fluid path module, sterilizing the fluid path module to provide a sterilized fluid path module and assembling a delivery device comprising the sterilized container holder and the sterilized fluid path module.
Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
A method of operating a vibrational energy harvesting system includes providing an energy harvester and an energy storage module. The energy storage module is coupled to the energy harvester to transfer energy to the energy storage module. The method also includes determining whether the energy transferred exceeds a predetermined threshold. The method further includes limiting the energy transferred to the energy storage module by a passive device when the energy transferred exceeds the predetermined threshold.
H02N 2/18 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
H02J 7/34 - Parallel operation in networks using both storage and other DC sources, e.g. providing buffering
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
53.
Control of thermal interface material in multi-chip package
An electronic system includes a plurality of heat sources. At least two of the plurality of heat sources vary in height and each of the plurality of heat sources includes a first side and a second side. The electronic system also includes a substrate having a first side and a second side. The second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate. The electronic system further includes a cover member provided above the plurality of heat sources and a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/367 - Cooling facilitated by shape of device
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Supply chain management services; supply chain logistics management for others in the field of electronics; procurement and inventory management services for others in the field of electronics; wholesale distributorship services in the field of electronics.
(2) Manufacturing services for others in the field of electronics; custom manufacture of electronics goods for others; technical support services, namely, providing technical advice related to the manufacture of electronics.
(3) Electrical, electronic, software, industrial, and automotive engineering design services; consulting services in the fields of new product development for others and design and development of electronics; new product design services for others; research and development of new products for others.
55.
Methods, devices, and systems for electronic device molding and encapsulation
Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
56.
System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features
An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 1/14 - Structural association of two or more printed circuits
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
40 - Treatment of materials; recycling, air and water treatment,
35 - Advertising and business services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Manufacturing services for others in the field of electronics; custom manufacture of electronics goods for others; technical support services, namely, providing technical advice related to the manufacture of electronics Supply chain management services; transportation logistics services, namely, arranging the transportation of goods for others; logistics management in the field of electronics; procurement and inventory management services for others in the field of electronics; packaging articles to the order and specification of others; wholesale distributorship services in the field of electronics Engineering design services, consulting services in the fields of new product development for others and design and development of electronics; new product design services; research and development of new products
A PCB based electrochemical sensor includes a PCB having a first electrode on a first surface of the PCB, and a second electrode on a second surface. A sensing element, such as a conductive wire, is attached to the first electrode. The PCB includes one or more through holes, and the conductive wire is positioned proximate one or more of the one or more through holes. When the PCB based electrochemical sensor is positioned in a solution to be sensed, the solution fills the through holes. The ions within the solution provide a current pathway between the conductive wire and the second electrode through the through holes. A voltage potential between the two electrodes is measured. The measured voltage potential is used to determine a value associated with the solution, such as a pH value.
A system and method for calibrating an IV pump infusion system tube comprises a fluid source, an infusion system comprising, an IV pump, a drive unit, a chamber with known constant volume, a control unit, and IV tubing with a known inner diameter tolerance, and a set of conductive plates. The system administers medicinal fluid, calculates the flow rate of the medicinal fluid in the chamber by measuring the time the capacitance level of the medicinal fluid changes from a capacitance level corresponding to a first (initial) position to a capacitance level corresponding to a second (filled) position, compares the calculated flow rate with a set flow rate of the IV pump input in the control unit prior to infusion, and adjusts the IV pump and flow rate based on the compared deviations for more accurate delivery to a patient. This configuration may therefore provide a more precise delivery rate.
Providing security functions in an IoT device can comprise executing, by a TPM of the IoT device, a set of cryptographic functions. The set of cryptographic functions can comprise providing a secure unidirectional uplink from the IoT device to one or more communications networks. The set of cryptographic functions can also be executed by a second TPM to provide a secure unidirectional downlink from the one or more communications networks to the IoT device. The processor of the IoT device need not perform cryptographic functions and the processor of the IoT device and a memory of the IoT device can be outside of a secure boundary maintained by the first TPM and the second TPM. Cryptographic information to provide the secure unidirectional uplink and the secure unidirectional downlink can be exchanged between the first TPM and the second TPM.
A system and method for calibrating an IV pump infusion system tube comprises a fluid source, an infusion system comprising, an IV pump, a drive unit, a chamber with known constant volume, a control unit, and IV tubing with a known inner diameter tolerance, and a sensor and floating detection object. The system administers medicinal fluid, calculates the flow rate of the medicinal fluid in the chamber by measuring the time the floating detection object and medicinal fluid rises in the chamber, compares the calculated flow rate with a set flow rate of the IV pump input in the control unit prior to infusion, and adjusts the IV pump and flow rate based on the compared deviations for more accurate delivery to a patient. This configuration may provide a more precise delivery rate of medicinal fluid, preventing harm to the patient and waste of medicine.
An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.
A seam jump connector provides connectivity over an irregular area, such as seam, in a textile. The textile is part of a textile base structure that includes one or more electrically conductive interconnects formed either directly on the textile or on intermediate substrates that are attached to the textile. The intermediate substrates can be TPU sheets having conductive interconnects printed on a surface. The conductive interconnects of the textile base structure are discontinuous at an irregular area on the textile, and the seam jump connector includes a flexible and/or stretchable substrate with conductive interconnects. The seam jump connector is aligned with and stacked onto the conductive interconnects so as to provide electrical connectivity across the irregular area. The seam jump connectors can be configured to be permanently or removably attached to the textile base structure.
H01R 12/81 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to another cable except for flat or ribbon cable
Embodiments of the invention provide structures for sensing, activation, and signal networking in a composite textile (100). According to one embodiment, a composite textile (100) comprises an activation layer (105, 110) of a reactive yarn knit into a fabric. The reactive yarn has at least one physical property that changes in response to a stimulus. A signaling layer (115) of a first conductive yarn (305) is knit into the fabric with the activation layer (105, 110). The first conductive yarn (305) provides the stimulus to the reactive yarn. A sensing layer (120) comprising second conductive yarn (405) is knit into the fabric with the activation layer (105, 110) and signaling layer (115). The second conductive yarn (405) provides a feedback signal corresponding to the stimulus provided by the first conductive yarn (305) of the signaling layer (115).
D02G 3/44 - Yarns or threads characterised by the purpose for which they are designed
D04B 1/12 - Patterned fabrics or articles characterised by thread material
D04B 1/22 - Weft knitting processes for the production of fabrics or articles not dependent on the use of particular machinesFabrics or articles defined by such processes specially adapted for knitting goods of particular configuration
D04B 1/24 - Weft knitting processes for the production of fabrics or articles not dependent on the use of particular machinesFabrics or articles defined by such processes specially adapted for knitting goods of particular configuration wearing apparel
66.
ADDITIVE MANUFACTURING OF HIGHLY FLEXIBLE ELECTROPHORETIC FILM AND TEXTILE COMPOSITES
Embodiments of the disclosure provide a flexible and stretchable textile composite including an electrophoretic film. According to one embodiment, a textile composite material can comprise a textile base layer, a first flexible, optically transparent film layer deposited onto and affixed to the textile base layer, and an electrophoretic film layer disposed onto the first flexible, optically transparent film layer on a side of the first flexible, optically transparent film layer opposite the textile base layer. The electrophoretic film layer can comprise a plurality of relief cuts therein. The plurality of relief cuts can allow the electrophoretic film layer to flex or stretch in at least one direction.
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
Embodiments of the disclosure provide a flexible and stretchable textile composite including an electrophoretic film. According to one embodiment, a textile composite material can comprise a textile base layer, a first flexible, optically transparent film layer deposited onto and affixed to the textile base layer, and an electrophoretic film layer disposed onto the first flexible, optically transparent film layer on a side of the first flexible, optically transparent film layer opposite the textile base layer. The electrophoretic film layer can comprise a plurality of relief cuts therein. The plurality of relief cuts can allow the electrophoretic film layer to flex or stretch in at least one direction.
B32B 38/00 - Ancillary operations in connection with laminating processes
B33Y 70/00 - Materials specially adapted for additive manufacturing
B33Y 80/00 - Products made by additive manufacturing
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
Embodiments of the disclosure provide structures for sensing, activation, and signal networking in a composite textile. According to one embodiment, a composite textile can comprise an activation layer of a reactive yarn knit into a fabric. The reactive yarn can have at least one physical property that changes in response to a stimulus. A signaling layer of a first conductive yarn can be knit into the fabric with the activation layer. The first conductive yarn provides the stimulus to the reactive yarn. A sensing layer comprising second conductive yarn can be knit into the fabric with the activation layer and signaling layer. The second conductive yarn can provide a feedback signal corresponding to the stimulus provided by the first conductive yarn of the signaling layer.
D04B 1/12 - Patterned fabrics or articles characterised by thread material
D04B 1/24 - Weft knitting processes for the production of fabrics or articles not dependent on the use of particular machinesFabrics or articles defined by such processes specially adapted for knitting goods of particular configuration wearing apparel
70.
Use of adhesive films for 3D pick and place assembly of electronic components
An electronic device assembly includes one or more discrete electronic components mounted onto a substrate having a 3D, 2.5D, or N×2D geometric classification. The substrate surface includes a specific mounting location to which an electronic component is to be electrically connected, where each specific mounting location includes one or more electrical connection points, such as contact pads. An anisotropic conductive film (ACF) is applied to the substrate surface covering the one or more electrical connection points of the specific mounting location, and the electronic component is placed on the ACF and properly aligned with the specific mounting location on the substrate surface. Pressure and heat are applied to compress the ACF to form an electrical interconnection between corresponding pairs of the electrical connection points on the electronic device and the specific mounting location on the substrate surface.
An improved SiP structure includes one or more interposers positioned to form a center cavity into which one or more electronic components can be mounted. The improved SiP structure provides a reduced footprint using the one or more interposers and formed center cavity without the need of laser drilling, exposed molding, and/or double side molding.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
A semiconductor package system includes a semiconductor package including at least one semiconductor device having a first side and a second side and a substrate having a first side and a second side. The second side of the at least one semiconductor device is positioned on the first side of the substrate. At least one stiffener element is provided on the semiconductor package. The at least one stiffener element includes at least two metal elements having different coefficients of thermal expansion joined together.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
73.
Stress relief encapsulation for flexible hybrid electronics
Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 1/14 - Structural association of two or more printed circuits
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.
B29C 51/10 - Forming by pressure difference, e.g. vacuum
B29C 51/12 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor of articles having inserts or reinforcements
B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
B29K 105/00 - Condition, form or state of moulded material
76.
Multilayer transformer structure comprising multiple rectification elements
A power conversion circuit has a multilayer transformer and a plurality of rectifying transistors coupled to the secondary windings of the multilayer transformer. The multilayer transformer is formed as multiple layers within a PCB stack, where primary winding conductors and secondary winding conductors are vertically aligned and stacked. The secondary winding conductors are constructed to have one or more secondary winding arms that provide area to which the plurality of rectifying transistors are physically connected. The primary winding conductors are constructed to have a primary winding arm. A footprint of each primary winding conductor is configured to substantially overlap an entire footprint of each of the secondary winding conductors. As such, an entirety of the secondary current flowing through the secondary winding conductors is vertically aligned with the primary winding conductors, and therefore with the primary current flowing through the secondary winding conductors.
A method that combines injection molding and extrusion is disclosed. First, a molten material is injected into a mold via an injection gate, the mold comprising a first portion and a second portion. Next, additional molten material is injected via the injection gate and pushed through an extrusion die located in the first portion of the mold and the second portion is separated from the first portion. In embodiments, the second portion is separated from the first portion before the additional material is injected. In other embodiments, the second portion is separated from the first portion simultaneously with the additional material being injected. The method may be used to produce longer and thinner parts with detailed features, such as catheters.
A power converter with AFC (Automatic AC Feed Control) implements zero voltage switching when switching from a first input power supply to a second input power supply. The power converter with AFC includes a relay switchover circuit and control circuitry for selectively providing power to a connected power converter. The control circuitry uses sensed amplitude and phase values for the two input power supplies for determining when the first input power supply is lost and selectively connecting the second input power supply according to precise timing control to minimize component stress.
H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
79.
Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.
Embodiments of the disclosure provide systems and methods for producing and using a plaited fabric comprising a low-melt yarn for adhering the fabric without a glue adhesive. According to one embodiment, a knitted fabric can comprise a first polymeric yarn of a first material, the first polymeric yarn forming a base of the knitted fabric, and a second polymeric yarn of a second material. The second material can be different from the first material and can have a lower melting temperature than the first material. The first polymeric yarn can be knitted with the second polymeric yarn to form the fabric. Upon an application of heat to the knitted fabric, the second polymeric yarn can form an adhesive and cohesive mechanical attachment to itself and form a tight-knit structural bond within the fabric without the use of a glue adhesive.
Embodiments of the disclosure provide systems and methods for producing and using a knitted fabric including one or more integrated sensors. According to one embodiment, a soft touch sensor can comprise a first knitted conductive layer of metallic-coated, plaited yarn and a second knitted conductive layer of metallic-coated, plaited yarn disposed parallel to the first knitted conductive layer. A knitted dielectric layer disposed between the first knitted conductive layer and the second knitted conductive layer. The knitted dielectric layer can be plaited into the first knitted conductive layer and the second knitted conductive layer and can form a spacer between the first knitted conductive layer and the second knitted conductive layer.
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
D04B 1/16 - Other fabrics or articles characterised primarily by the use of particular thread materials synthetic threads
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/06 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer needled to another layer, e.g. of fibres, of paper
B32B 5/08 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments the fibres or filaments of a layer being specially arranged or being of different substances
D04B 21/00 - Warp knitting processes for the production of fabrics or articles not dependent on the use of particular machinesFabrics or articles defined by such processes
Embodiments of the disclosure provide systems and methods for producing and using a knitted fabric including one or more integrated sensors. According to one embodiment, a soft touch sensor can comprise a first knitted conductive layer of metallic-coated, plaited yarn and a second knitted conductive layer of metallic-coated, plaited yarn disposed parallel to the first knitted conductive layer. A knitted dielectric layer disposed between the first knitted conductive layer and the second knitted conductive layer. The knitted dielectric layer can be plaited into the first knitted conductive layer and the second knitted conductive layer and can form a spacer between the first knitted conductive layer and the second knitted conductive layer.
Systems, devices and methods for monitoring a physical property over time are disclosed. A monitoring device in accordance with the present disclosure may comprise an electronic chip assembly, at least one light source, at least one monitoring label comprising a chemical configured to absorb light depending upon at least one physical property, and at least one photodiode configured to collect light emitted by the at least one monitoring label and provide at least one measurement corresponding to the at least one physical property. The at least one measurement may correspond to a past or present status of the at least one physical property. The monitoring device may be communicatively coupled to a user device configured to run an application that collects and store the at least one measurement provided by the at least one photodiode.
G01K 11/12 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in colour, translucency or reflectance
G01N 33/569 - ImmunoassayBiospecific binding assayMaterials therefor for microorganisms, e.g. protozoa, bacteria, viruses
Embodiments of the disclosure provide systems and methods for producing and using a plaited fabric comprising a low-melt yarn for adhering the fabric without a glue adhesive. According to one embodiment, a knitted fabric can comprise a first polymeric yarn of a first material, the first polymeric yarn forming a base of the knitted fabric, and a second polymeric yarn of a second material. The second material can be different from the first material and can have a lower melting temperature than the first material. The first polymeric yarn can be knitted with the second polymeric yarn to form the fabric. Upon an application of heat to the knitted fabric, the second polymeric yarn can form an adhesive and cohesive mechanical attachment to itself and form a tight-knit structural bond within the fabric without the use of a glue adhesive.
D04B 21/16 - Fabrics characterised by the incorporation by knitting, in one or more thread, fleece, or fabric layers, of reinforcing, binding, or decorative threadsFabrics incorporating small auxiliary elements, e.g. for decorative purposes incorporating synthetic threads
D01F 8/04 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers
D01F 8/06 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers with at least one polyolefin as constituent
D01F 8/08 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers with at least one polyacrylonitrile as constituent
D01F 8/12 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers with at least one polyamide as constituent
D01F 8/14 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers with at least one polyester as constituent
D02G 3/04 - Blended or other yarns or threads containing components made from different materials
An electronic pressure sensor array has a plurality of conductive electrodes and interconnects selectively formed on a pressure sensor substrate to form a plurality of individual pressure sensor assemblies. The individual pressure sensor assemblies can be aligned in various configurations to form the electronic pressure sensor array. Each pressure sensor assembly is made of a plurality of layers including a pressure sensor substrate, insulating layers on either side of the pressure sensor substrate, and conductive ink layers on an outer surface of each insulating layer. A cavity is formed in each insulating layer, the cavity in one insulating layer being vertically aligned with the cavity in the other insulating layer, and conductive ink fills each cavity to form electrodes.
G01L 5/16 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
H01M 4/02 - Electrodes composed of, or comprising, active material
86.
Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components
A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
F28F 13/00 - Arrangements for modifying heat transfer, e.g. increasing, decreasing
A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B33Y 80/00 - Products made by additive manufacturing
B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B23K 1/08 - Soldering by means of dipping in molten solder
B29C 64/106 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
Embodiments provide systems and methods for providing a dynamically variable focal plane in a waveguide-based display. Generally speaking, embodiments described herein provide an optical system that allows variable control of the focal length of the image emerging from the display engine into the waveguide. This can be a dynamic system that is controlled based upon the content being projected on the display. For a stereoscopic system, individual control of each eye can be provided. More specifically, embodiments comprise an electrically tunable lens element interposed between the output of the projection engine and the optical waveguide and a control unit to dynamically the tunable lens element to vary the focal length of the images provided to the waveguide display.
A plurality of devices of an enterprise are identified. For example, lights and door sensors are identified. The plurality of devices of the enterprise uses a plurality of gateways in a hierarchy of gateways to control the plurality of devices of the enterprise. A first rule for at least two of the plurality devices of the enterprise is received. For example, the first rule may be to turn on a light when door is opened. In response to receiving the first rule, a first lowest level gateway of the plurality of gateways in the hierarchy of gateways is determined for applying the first rule for the at least two of the plurality of devices of the enterprise. The first rule for the at least two of the plurality devices of the enterprise is sent to the first lowest level gateway.
A listening device that identifies, based on receiving the digitized voice stream, a first keyword of a plurality of keywords in the digitized voice stream. For example, the keyword may be a name associated with a service provider (e.g., “Google”). In response to identifying the first keyword of the plurality of keywords in the digitized voice stream the listening device identifies a first communication address of a first communication server of a first service provider associated with the first keyword of the plurality of keywords in the digitized voice stream. The listening server then routes the digitized voice stream and/or information associated with the digitized voice stream to the first communication server of the first service provider using the first communication address.
A circuit and method provide improved trimming of a DCR sensing circuit where a sensing element is sensitive to self-heating or having a large tolerance. The circuit includes a resistive divider circuit coupled to a sensing element. The resistive divider circuit includes a trim resistor and two test points. Prior to trimming the trim resistor, an actual resistance of the sensing element is determined. A target voltage across the trim resistor to be trimmed is calculated according to the determined sensing element resistance and a known small trim current that is to be injected into the circuit during the trimming process. This injected trim current has a low current value so there is no self-heating of the sensing element. Then, the trim resistor is trimmed while injecting this small trim current into the resistive divider circuit and the voltage across the trim resistor is monitored.
H01C 17/22 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
H01C 17/24 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
Attaching electronic components to a substrate can be challenging in certain applications. By utilizing printed conductive ink to fill vias, one or more conductive layers may be provided, which allow for fine pin pitches or other crowded substrates to utilize multiple layers for traces connecting the contact pad to the pins of an electronic component. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, and with conductive ink filling the vias, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.
The methods, systems, and devices of the present disclosure are directed to a capacitively coupled label antenna as a component in an antenna system comprising the label antenna, a feed block, an antenna coupler, and a gap between the antenna coupler and the feed block. The label antenna is electrically connected to the antenna coupler, and the antenna coupler is capacitively coupled to the feed block through the gap. By the addition of the gap between the feed block and antenna coupler, the label antenna may be placed on the surface of a container without requiring a wired connection to pass through the container. The feed block may be a small electronic component on a circuit board while the label antenna may be significantly larger thereby providing increased frequency bandwidth and an improved antenna radiation pattern.
An automatic injection device has an insertion needle configured to be inserted into a patient and a drug container which contains a pharmaceutical product and includes a plunger. The automatic injection device also has a fluid path which fluidly connects the drug container to the insertion needle, and a drive system configured to cause linear movement of the plunger to force the pharmaceutical product into the fluid path. The passive drive system has a movable element. The movable element has a shape memory alloy and is configured to change shape to move the plunger.
A61M 5/20 - Automatic syringes, e.g. with automatically actuated piston rod, with automatic needle injection, filling automatically
A61M 5/145 - Pressure infusion, e.g. using pumps using pressurised reservoirs, e.g. by means of pistons
A61M 5/44 - Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular wayAccessories therefor, e.g. filling or cleaning devices, arm rests having means for cooling or heating the devices or media
Methods, devices, and systems for assembling a pallet are provided. In particular, a pallet is provided that is made from multiple pieces that are bent from an initial planar shape to a final shape. In some embodiments, a transverse piece locks at least one longitudinal piece in the final shape without the use of fasteners or adhesives. The resulting pallet can be loaded with materials and then maneuvered and transported using a forklift. In addition, the pieces can be made from cardboard which significantly reduces the weight of the pallet.
A solenoid-operated valve assembly that reduces the jet flow of fluid or gas in an axially exiting valve. The valve assembly comprises a spool valve, a valve member housing, and a flow path. The spool valve comprises a fluid communication channel, a tail, and an inlet seat. The valve member housing comprises at least one inlet, at least one nozzle flow director, and at least one outlet. The flow path begins at the at least one inlet and exits at the at least one outlet. The at least one nozzle flow director is within the flow path. The spool valve moves axially within the valve member housing between a closed position and an open position. The inlet seat closes the at least one flow path at the inlet when the spool valve is in the closed position. A method of operation of the solenoid-operated valve assembly is also provided.
F16K 11/07 - Multiple-way valves, e.g. mixing valvesPipe fittings incorporating such valvesArrangement of valves and flow lines specially adapted for mixing fluid with all movable sealing faces moving as one unit comprising only sliding valves with linearly sliding closure members with cylindrical slides
F16K 31/06 - Operating meansReleasing devices electricOperating meansReleasing devices magnetic using a magnet
98.
Low cost battery-less light switch architecture and pairing method
According to one embodiment, a lighting system can comprise a light source and a light switch. The light switch can comprise a binary switch, a wireless transmitter, a processor, and a memory coupled with and readable by the processor and storing therein a code identifying the light switch. A light driver can be coupled with the light source. The light driver can comprise a pairing switch, a wireless receiver, a processor, and a memory coupled with and readable by the processor and storing therein a set of instructions which, when executed by the processor, causes the processor to pair with the light switch by receiving, from the pairing button, a first input indicating a start of a pairing mode, initiating the pairing mode based on the first input, and determining whether a message is received from the light switch within a first predetermined period of time.
A thermoplastic composite component assembly and method of manufacturing the thermoplastic composite component assembly is disclosed. The thermoplastic composite component assembly is manufactured by first performing a molding step to form individual assembly features as discrete assembly feature components, and separately forming a thermoplastic composite component using a first compression molding step. Then, a reprocessing step is performed where the discrete assembly feature components are integrated with the thermoplastic composite component using a second compression molding step. The reprocessing step essentially “welds” the discrete assembly feature components to the thermoplastic composite component at each of a plurality of desired assembly feature sites.
B29C 65/70 - Joining of preformed partsApparatus therefor by moulding
B29C 65/00 - Joining of preformed partsApparatus therefor
B29C 43/14 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles in several steps
B29C 43/20 - Making multilayered or multicoloured articles
100.
System and method for using gaze control to control electronic switches and machinery
A system that detects a gaze interaction from a user or animal based on information received from a camera. For example, the user looks directly at the camera or is looking at an angle toward the camera. In response to detecting the gaze interaction, the system identifies an associated action for controlling one or more of an electrical element and a mechanical element. For example, the action may be to control lighting system. The action is then initiated to control the one or more of the electrical element and the mechanical element.
