Abstract

A system, for deforming an effective structure, includes a stack, compression means, and shear means. The stack includes, successively, the effective structure and a buffer matrix. Between the effective structure and the buffer matrix is an interface having a mean plane. The compression means is designed to apply a compressive force to the stack along an axis normal to the mean plane of the interface. The shear means is designed to apply to the buffer matrix longitudinal shear forces parallel to the mean plane of the interface. The buffer matrix is designed to transmit the shear forces to the effective structure in the mean plane of the interface so as to deform the effective structure.

IPC Classes  ?

• H10N 70/20 - Multistable switching devices, e.g. memristors
• H01L 21/66 - Testing or measuring during manufacture or treatment
• H10N 70/00 - Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching

Abstract

System for deforming an effective structure (1), comprising: - a stack comprising, successively, the effective structure (1) and a buffer matrix (2); the stack having an interface between the effective structure (1) and the buffer matrix (2), said interface having a mean plane; - compression means designed to apply a compressive force (F) to the stack along the normal to the mean plane of the interface; - shearing means designed to apply to the buffer matrix (2) longitudinal shearing forces (f) parallel to the mean plane of the interface; the buffer matrix (2) being capable of transmitting the shearing forces (f) to the effective structure (1), within the mean plane of the interface, so as to deform the effective structure (1).

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/66 - Testing or measuring during manufacture or treatment

Abstract

The invention relates to a variable sample holder for correlative microscopy, wherein this includes light microscopy, electron beam microscopy, ion beam microscopy, atomic force microscopy and/or x-ray microscopy. The sample holder is formed by a sample carrier and an adapter element, which are connected to each other by at least one fastening means. Corresponding receptacles or feedthroughs for the at least one fastening means are provided in the adapter element and the sample carrier. The sample carrier according to the invention allows for simple and fast exchange of the adapter element and thus for adapting to a different or additional observation apparatus or a different microscopy method without the sample itself having to be transferred to a different sample carrier.

IPC Classes  ?

• G02B 21/34 - Microscope slides, e.g. mounting specimens on microscope slides
• H01J 37/20 - Means for supporting or positioning the object or the materialMeans for adjusting diaphragms or lenses associated with the support
• H01J 37/26 - Electron or ion microscopesElectron- or ion-diffraction tubes
• G02B 21/26 - StagesAdjusting means therefor

Abstract

A secure device for powering a plurality of inductive loads, each coupled to a dedicated converter, the device including a standby converter and, for each inductive load: a flyback diode connected to the inductive load; a circuit for detecting an anomaly of the current flowing through the inductive load; and a selection switch controlled by the detection circuit, adapted to decouple the inductive load from the specific converter and couple the inductive load to said standby converter.

IPC Classes  ?

• H05H 7/02 - Circuits or systems for supplying or feeding radio-frequency energy
• H01F 7/06 - ElectromagnetsActuators including electromagnets

Abstract

The invention relates to a device for measuring an atomic force, comprising a beam (1) whereof a first end carries a microtip (2); a microtip position sensor (6); means (4) of moving the second end of the beam in the axis z of the microtip; a low-frequency servo loop (13) using a signal (11) of the detector and acting on the means of moving to keep the microtip fixed when the force applied to the microtip varies; whereby the variation in force, ΔF, is given by the expression ΔF = k Δz, where k designates the stiffness of the beam and Δz the movement of the means of moving.

IPC Classes  ?

• G01Q 60/32 - AC mode
• G01Q 60/36 - DC mode
• G01Q 10/06 - Circuits or algorithms therefor
• B82Y 35/00 - Methods or apparatus for measurement or analysis of nanostructures

Abstract

The invention relates to boron carbide and to a method for making the same, as well as to a super-abrasive material and a machine device including said boron carbide. The boron carbide of the invention has the following formula BC5 and has a diamond-type cubic structure with a mesh parameter a = 3,635 ± 0,006 Å. The boron carbide of the invention can particularly be used in the field of machining.

IPC Classes  ?

• C01B 31/36 - Carbides of silicon or boron
• C09K 3/14 - Anti-slip materialsAbrasives

Abstract

The invention relates to an atomic force microscope comprising a microtip (1) placed on a flexible support connected to a microscope head (11) facing a surface (5) to be studied, which includes means (31, 32) for controlling the distance between said head and said surface for a given value and means (31, 35) for inhibiting vibration of the microtip.

IPC Classes  ?

• G01Q 10/00 - Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
• G01Q 10/06 - Circuits or algorithms therefor
• G01Q 30/12 - Fluid environment
• G01Q 60/18 - SNOM [Scanning Near-Field Optical Microscopy] or apparatus therefor, e.g. SNOM probes
• G01Q 60/36 - DC mode
• G01Q 70/04 - Probe holders with compensation for temperature or vibration induced errors

Goods & Services

Treatment of materials. Training. Scientific analysis.