Abstract

A method of imaging infrared light is provided which comprises: exciting ultrasonic waves in a metal pillar (e.g., Cu pillar); measuring the Time-of-Flight (ToF) of the ultrasonic wave in the waveguide; whereas the ToF is a function of incident Infrared light energy on the waveguide, and reporting the infrared light energy to capture an image. An apparatus of imaging infrared light is provided which comprises: a transducer; a waveguide coupled with the transducer; and a pixel electronic circuit coupled to the transducer, wherein the transducer includes one or more of: PZT, LiNb, AlN, or GaN.

IPC Classes  ?

• H01L 27/20 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including magnetostrictive components
• H01L 27/146 - Imager structures
• G01N 29/34 - Generating the ultrasonic, sonic or infrasonic waves
• H04N 5/33 - Transforming infrared radiation
• H01L 41/107 - Piezo-electric or electrostrictive elements with electrical input and electrical output
• H01L 41/187 - Ceramic compositions
• H01L 41/193 - Macromolecular compositions
• G01J 5/44 - Radiation pyrometry, e.g. infrared or optical thermometry using extension or expansion of solids or fluids using change of resonant frequency, e.g. of piezoelectric crystals
• G01N 29/06 - Visualisation of the interior, e.g. acoustic microscopy
• G01J 5/10 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
• G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry