eMagin Corporation

United States of America

Back to Profile

1-82 of 82 for eMagin Corporation Sort by
Query
Aggregations
IP Type
        Patent 79
        Trademark 3
Jurisdiction
        United States 64
        World 18
Date
2025 3
2024 12
2023 1
2022 8
2021 5
See more
IPC Class
C23C 14/04 - Coating on selected surface areas, e.g. using masks 23
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes 21
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof 19
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof 14
C23C 14/24 - Vacuum evaporation 13
See more
NICE Class
09 - Scientific and electric apparatus and instruments 3
42 - Scientific, technological and industrial services, research and design 1
Status
Pending 8
Registered / In Force 74

1.

Monolithically Integrated Top-Gate Thin-Film Transistor and Light-Emitting Diode and Method of Making

      
Application Number 19297968
Status Pending
Filing Date 2025-08-12
First Publication Date 2025-12-04
Owner eMagin Corporation (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.

Abstract

Pixels and sub-pixels suitable for high-density displays are disclosed. High-density is realized by forming a top-gate thin-film transistor (TFT) directly on top of a light-emitting diode (LED), thereby reducing the real estate required. To enable the stacked structure, a planarization layer is formed such that its top surface is coplanar with the top surface of the top electrode of the LED. The source and drain of the TFT are then formed on the planarization layer and electrode such that electrical contact is made between the LED and the TFT. In some embodiments, the fabrication includes deposition of an additional planarization layer whose top surface is coplanar with the top surface of the gate of the TFT. This enables formation of a parallel-plate capacitor on the TFT/LED stack, thereby reducing the footprint of the pixel even further.

IPC Classes  ?

  • H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components

2.

HIGH RESOLUTION DPD MASK CLEANING METHODS

      
Application Number US2025022901
Publication Number 2025/212852
Status In Force
Filing Date 2025-04-03
Publication Date 2025-10-09
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Lin, Howard
  • Zhao, Fangchao
  • Khayrullin, Ilyas I.

Abstract

222X633). The step of providing a plasma source may provide reactive ion etching, inductively coupled plasma, remote plasma, and the like. The step of providing a plasma source may include sequentially providing two or more of the gases.

IPC Classes  ?

  • H01L 21/3065 - Plasma etchingReactive-ion etching
  • C23G 5/036 - Cleaning or de-greasing metallic material by other methodsApparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds having also nitrogen
  • B08B 3/02 - Cleaning by the force of jets or sprays

3.

HIGH RESOLUTION DPD MASK CLEANING METHODS

      
Application Number 19169181
Status Pending
Filing Date 2025-04-03
First Publication Date 2025-10-09
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Lin, Howard
  • Zhao, Fangchao
  • Khayrullin, Ilyas I.

Abstract

A method of cleaning a direct patterning deposition mask is provided where the mask has at least an organic coating material comprising an organic light emitting diode (OLED) material deposited thereon. The method includes the steps of providing a plasma source for providing cleaning plasma for removing the OLED material deposited on the mask, wherein the plasma source utilizes a gas selected from at least one of argon (Ar), nitrogen (N2), oxygen (O2), Chlorine (Cl2,) carbon tetrafluoride (CFx), sodium hexafluoride (SF6), and boron trifluoride (BCl3). The step of providing a plasma source may provide reactive ion etching, inductively coupled plasma, remote plasma, and the like. The step of providing a plasma source may include sequentially providing two or more of the gases.

IPC Classes  ?

  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks

4.

OLED-based display having pixel compensation and method

      
Application Number 18439023
Grant Number 12217668
Status In Force
Filing Date 2024-02-12
First Publication Date 2024-10-17
Grant Date 2025-02-04
Owner eMagin Corporation (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.
  • Prache, Olivier
  • Kwon, Hyuk Sang

Abstract

An OLED display system is provided having visual performance pixel compensation for loss of brightness, including display pixels, where each display pixel has OLED subpixels and pixel drive circuitry; a sensing system having sensors and analog to digital conversion circuitry connected to each of the sensors, and a processor to provide an image data drive signal to each of the display pixels, receive the sensor signal from the ADC circuitry for each sensor, estimate a state of degradation of at least one of the display pixels, determine a drive-signal compensation for each display pixel having an estimated state of degradation and compensate the image data drive signal to each display pixel having an estimated state of degradation. Methods for compensating pixels for an image in a display are also provided.

IPC Classes  ?

  • G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix

5.

Mechanically Pre-biased Shadow Mask and Method of Formation

      
Application Number 18609316
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-10-17
Owner eMagin Corporation (USA)
Inventor Walker, James A.

Abstract

Shadow masks comprising a multi-layer membrane having a mechanical pre-bias that compensates the effect of gravity on the membrane are disclosed. A shadow mask in accordance with the present disclosure includes a membrane that is patterned with a desired pattern of apertures. The layers of the membrane are selected such that their residual stresses collectively give rise to a stress gradient that is directed normal to the plane of the membrane such that the stress gradient mitigates gravity-induced sag. In some embodiments, the membrane includes a layer pair having internal stresses that are of opposite signs to effect a tendency to bulge outward from the plane of the membrane prior to its release from the substrate. An exemplary membrane includes a layer pair comprising a layer of stoichiometric silicon dioxide that is under residual compressive stress and a layer of stoichiometric silicon nitride that is under residual tensile stress.

IPC Classes  ?

  • H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • B05C 17/06 - Stencils
  • B05C 21/00 - Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • C23C 16/34 - Nitrides
  • C23C 16/56 - After-treatment
  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

6.

Tandem OLED Structure with Patterned Intermediate Layers

      
Application Number 18378487
Status Pending
Filing Date 2023-10-10
First Publication Date 2024-04-18
Owner eMagin Corporation (USA)
Inventor
  • Zhao, Fangchao
  • Lin, Howard
  • Khayrullin, Ilyas I.
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

A tandem OLED display is provided, including a substrate backplane, an anode layer, at least two stacked OLED layers, each OLED layer comprising a plurality of pixels, at least one charge generation layer (CGL), wherein each CGL is disposed between two adjacent stacked OLED layers, and a cathode layer. At least one of the CGLs is patterned wherein a pattern provides gaps between each of the plurality of pixels.

IPC Classes  ?

  • H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
  • H10K 50/19 - Tandem OLEDs
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays

7.

TANDEM OLED STRUCTURE WITH PATTERNED INTERMEDIATE LAYERS

      
Application Number US2023035017
Publication Number 2024/081355
Status In Force
Filing Date 2023-10-12
Publication Date 2024-04-18
Owner EMAGIN CORPORATION (USA)
Inventor
  • Zhao, Fangchao
  • Lin, Howard
  • Khayrullin, Ilyas I.
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

A tandem OLED display is provided, including a substrate backplane, an anode layer, at least two stacked OLED layers, each OLED layer comprising a plurality of pixels, at least one charge generation layer (CGL), wherein each CGL is disposed between two adjacent stacked OLED layers, and a cathode layer. At least one of the CGLs is patterned wherein a pattern provides gaps between each of the plurality of pixels.

IPC Classes  ?

  • H10K 50/13 - OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
  • C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays
  • H10K 85/10 - Organic polymers or oligomers

8.

Tandem OLED with Intermediate Alloy Layer

      
Application Number 18376959
Status Pending
Filing Date 2023-10-05
First Publication Date 2024-04-11
Owner eMagin Corporation (USA)
Inventor
  • Zhao, Fangchao
  • Lin, Howard
  • Khayrullin, Ilyas I.
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

A tandem OLED device is provided, including an anode, a cathode, at least two electroluminescent units disposed between the anode and the cathode, and an alloy thin film disposed between the two electroluminescent units.

IPC Classes  ?

  • H10K 50/19 - Tandem OLEDs
  • H10K 50/13 - OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
  • H10K 71/60 - Forming conductive regions or layers, e.g. electrodes

9.

TANDEM OLED WITH INTERMEDIATE ALLOY LAYER

      
Application Number US2023034519
Publication Number 2024/076662
Status In Force
Filing Date 2023-10-05
Publication Date 2024-04-11
Owner EMAGIN CORPORATION (USA)
Inventor
  • Zhao, Fangchao
  • Lin, Howard
  • Khayrullin, Ilyas I.
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

A tandem OLED device is provided, including an anode, a cathode, at least two electroluminescent units disposed between the anode and the cathode, and an alloy thin film disposed between the two electroluminescent units. The alloy film may be disposed between a p-type film and an n-type film.

IPC Classes  ?

  • H05B 33/14 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material
  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials
  • H10K 59/30 - Devices specially adapted for multicolour light emission

10.

RIGID SAPPHIRE BASED DIRECT PATTERNING DEPOSITION MASK

      
Application Number US2023030908
Publication Number 2024/054353
Status In Force
Filing Date 2023-08-23
Publication Date 2024-03-14
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Lin, Howard
  • Vazan, Fridrich
  • Khayrullin, Ilyas I.
  • Zhao, Fangchao
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie

Abstract

A direct patterning deposition mask for OLED deposition is provided where the mask includes a sapphire substrate; and a Silicon Nitride (SiN) membrane. The sapphire substrate thickness may be between 0.7 and 2 mm. The sapphire substrate may have a diameter in the range of 200mm diameter to 300mm diameter. Warpage of the substrate is preferably less than <10um.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C30B 29/20 - Aluminium oxides
  • C30B 33/08 - Etching
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
  • H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

11.

SYSTEM AND METHOD FOR DIRECT PATTERNING USING A COMPENSATED SHADOW MASK

      
Application Number US2023031981
Publication Number 2024/054435
Status In Force
Filing Date 2023-09-05
Publication Date 2024-03-14
Owner EMAGIN CORPORATION (USA)
Inventor
  • Khayrullin, Ilyas I.
  • Lin, Howard
  • Zhao, Fangchao
  • Considine, Timothy
  • Sziklas, Laurie
  • Tice, Kerry
  • Ghosh, Amalkumar P.

Abstract

Systems and methods for performing direct patterning of a material on a substrate with high fidelity to a desired pattern are presented. A pattern of apertures of a shadow mask is compensated to accommodate a range of propagation angles in a vapor plume used to deposit material onto the substrate through the shadow mask. A shadow mask in accordance with the present disclosure includes an aperture pattern in which aperture position is shifted inward toward the center of the shadow mask by an amount based on the distance of the aperture from the center of the shadow mask. As a result, vaporized material passing through an aperture at a non-normal angle deposits onto the substrate at its proper desired location.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/50 - Substrate holders
  • H01J 29/07 - Shadow masks for colour-television tubes

12.

Rigid Sapphire Based Direct Patterning Deposition Mask

      
Application Number 18236243
Status Pending
Filing Date 2023-08-21
First Publication Date 2024-03-07
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Lin, Howard
  • Vazan, Fridrich
  • Khayrullin, Ilyas I.
  • Zhao, Fangchao
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie

Abstract

A direct patterning deposition mask for OLED deposition is provided where the mask includes a sapphire substrate; and a Silicon Nitride (SiN) membrane. The sapphire substrate thickness may be between 0.7 and 2 mm. The sapphire substrate may have a diameter in the range of 200 mm diameter to 300 mm diameter. Warpage of the substrate is preferably less than <10 um.

IPC Classes  ?

  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

13.

System and method for direct patterning using a compensated shadow mask

      
Application Number 18241730
Grant Number 12660491
Status In Force
Filing Date 2023-09-01
First Publication Date 2024-03-07
Grant Date 2026-06-16
Owner eMagin Corporation (USA)
Inventor
  • Khayrullin, Ilyas I.
  • Lin, Howard
  • Zhao, Fangchao
  • Considine, Timothy
  • Sziklas, Laurie
  • Tice, Kerry
  • Ghosh, Amalkumar P.

Abstract

Systems and methods for performing direct patterning of a material on a substrate with high fidelity to a desired pattern are presented. A pattern of apertures of a shadow mask is compensated to accommodate a range of propagation angles in a vapor plume used to deposit material onto the substrate through the shadow mask. A shadow mask in accordance with the present disclosure includes an aperture pattern in which aperture position is shifted inward toward the center of the shadow mask by an amount based on the distance of the aperture from the center of the shadow mask. As a result, vaporized material passing through an aperture at a non-normal angle deposits onto the substrate at its proper desired location.

IPC Classes  ?

  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • C23C 14/50 - Substrate holders
  • H10K 59/10 - OLED displays

14.

EVAPORATION SYSTEM HAVING IMPROVED COLLIMATION

      
Application Number 18229676
Status Pending
Filing Date 2023-08-03
First Publication Date 2024-02-08
Owner eMagin Corporation (USA)
Inventor
  • Vazan, Fridrich
  • Khayrullin, Ilyas I.
  • Lin, Howard
  • Zhao, Fangchao
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Frayer, Maxim
  • Ghosh, Amalkumar P.
  • Braun, Tim

Abstract

A system for deposition of evaporated material on a substrate is provided. The substrate has a central axis. The system includes an evaporation vacuum chamber, at least one nozzle assembly, and a shadow mask. The nozzle assembly has a three-point plurality of point evaporation sources disposed adjacent to the central axis of the substrate and at a distance from the substrate whereby the nozzle assembly provides for molecules of evaporated material to arrive at the substrate at an incident angle of less than or equal to 5 degrees.

IPC Classes  ?

  • B05D 1/00 - Processes for applying liquids or other fluent materials

15.

EVAPORATION SYSTEM HAVING IMPROVED COLLIMATION

      
Application Number US2023029419
Publication Number 2024/030562
Status In Force
Filing Date 2023-08-03
Publication Date 2024-02-08
Owner EMAGIN CORPORATION (USA)
Inventor
  • Vazan, Fridrich
  • Khayrullin, Ilyas I.
  • Lin, Howard
  • Zhao, Fangchao
  • Tice, Kerry
  • Considine, Timothy
  • Sziklas, Laurie
  • Frayer, Maxim
  • Ghosh, Amalkumar P.
  • Braun, Tim

Abstract

A system for deposition of evaporated material on a substrate is provided. The substrate has a central axis. The system includes an evaporation vacuum chamber, at least one nozzle assembly, and a shadow mask. The nozzle assembly has a three-point plurality of point evaporation sources disposed adjacent to the central axis of the substrate and at a distance from the substrate whereby the nozzle assembly provides for molecules of evaporated material to arrive at the substrate at an incident angle of less than or equal to 5 degrees.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
  • C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating

16.

MONOLITHICALLY INTEGRATED TOP-GATE THIN-FILM TRANSISTOR AND LIGHT-EMITTING DIODE AND METHOD OF MAKING

      
Application Number US2022035149
Publication Number 2023/278339
Status In Force
Filing Date 2022-06-27
Publication Date 2023-01-05
Owner EMAGIN CORPORATION (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.

Abstract

Pixels and sub-pixels suitable for high-density displays are disclosed. High-density is realized by forming a top-gate thin-film transistor (TFT) directly on top of a light-emitting diode (LED), thereby reducing the real estate required. To enable the stacked structure, a planarization layer is formed such that its top surface is coplanar with the top surface of the top electrode of the LED. The source and drain of the TFT are then formed on the planarization layer and electrode such that electrical contact is made between the LED and the TFT. In some embodiments, the fabrication includes deposition of an additional planarization layer whose top surface is coplanar with the top surface of the gate of the TFT. This enables formation of a parallel-plate capacitor on the TFT/LED stack, thereby reducing the footprint of the pixel even further.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

17.

Monolithically integrated top-gate thin-film transistor and light-emitting diode and method of making

      
Application Number 17850301
Grant Number 12414424
Status In Force
Filing Date 2022-06-27
First Publication Date 2022-12-29
Grant Date 2025-09-09
Owner eMagin Corporation (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.

Abstract

Pixels and sub-pixels suitable for high-density displays are disclosed. High-density is realized by forming a top-gate thin-film transistor (TFT) directly on top of a light-emitting diode (LED), thereby reducing the real estate required. To enable the stacked structure, a planarization layer is formed such that its top surface is coplanar with the top surface of the top electrode of the LED. The source and drain of the TFT are then formed on the planarization layer and electrode such that electrical contact is made between the LED and the TFT. In some embodiments, the fabrication includes deposition of an additional planarization layer whose top surface is coplanar with the top surface of the gate of the TFT. This enables formation of a parallel-plate capacitor on the TFT/LED stack, thereby reducing the footprint of the pixel even further.

IPC Classes  ?

  • H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components

18.

LARGE AREA DISPLAY AND METHOD FOR MAKING SAME

      
Application Number 17890548
Status Pending
Filing Date 2022-08-18
First Publication Date 2022-12-22
Owner eMagin Corporation (USA)
Inventor
  • Wacyk, Ihor
  • Ghosh, Amalkumar P.
  • Sculley, Jr., Andrew G.
  • Prache, Olivier

Abstract

A large area active-matrix organic light-emitting diode microdisplay and method for fabricating the same is provided which includes a panel having resolution of greater than 2,000 pixels per inch and a size of 1.4 or more inches for supporting the needs of virtual reality and augmented reality application.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 23/00 - Details of semiconductor or other solid state devices

19.

OLED-BASED DISPLAY HAVING PIXEL COMPENSATION AND METHOD

      
Application Number US2022033480
Publication Number 2022/266133
Status In Force
Filing Date 2022-06-14
Publication Date 2022-12-22
Owner EMAGIN CORPORATION (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.
  • Prache, Olivier
  • Kwon, Hyuk Sang

Abstract

An OLED display system having compensation or loss of brightness is provided, including OLED-based display pixels, a sensing system having sensors, a processor having an LIA, an LPF, and analog to digital circuitry connected to each sensor and for providing a sensor signal for each sensor. The processor is adapted to apply a drive signal having a periodic signal to at least one OLED pixel in the display, receive the sensor signal, provide a primary frequency component from the sensor signals using the LIA based on the periodic signal, provide secondary frequency components from the sensor signals using the LPF, convert the secondary frequency components to a digital signal using the ADC, provide the digital signal to the processor as a sensing signal, and determine compensation for the drive signal. A method is also provided.

IPC Classes  ?

  • G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
  • G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

20.

OLED-based display having pixel compensation and method

      
Application Number 17840375
Grant Number 11862095
Status In Force
Filing Date 2022-06-14
First Publication Date 2022-12-22
Grant Date 2024-01-02
Owner eMagin Corporation (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.
  • Prache, Olivier
  • Kwon, Hyuk Sang

Abstract

An OLED display system having compensation or loss of brightness is provided, including OLED-based display pixels, a sensing system having sensors, a processor having an LIA, an LPF, and analog to digital circuitry connected to each sensor and for providing a sensor signal for each sensor. The processor is adapted to apply a drive signal having a periodic signal to at least one OLED pixel in the display, receive the sensor signal, provide a primary frequency component from the sensor signals using the LIA based on the periodic signal, provide secondary frequency components from the sensor signals using the LPF, convert the secondary frequency components to a digital signal using the ADC, provide the digital signal to the processor as a sensing signal, and determine compensation for the drive signal. A method is also provided.

IPC Classes  ?

  • G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
  • G01J 1/16 - Photometry, e.g. photographic exposure meter by comparison with reference light or electric value using electric radiation detectors
  • G09G 3/3258 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the voltage across the light-emitting element
  • G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element

21.

OLED-based display having pixel compensation and method

      
Application Number 17830912
Grant Number 11955072
Status In Force
Filing Date 2022-06-02
First Publication Date 2022-12-15
Grant Date 2024-04-09
Owner eMagin Corporation (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.
  • Prache, Olivier
  • Kwon, Hyuk Sang

Abstract

An OLED display system is provided having visual performance pixel compensation for loss of brightness, including display pixels, where each display pixel has OLED subpixels and pixel drive circuitry; a sensing system having sensors and analog to digital conversion circuitry connected to each of the sensors, and a processor to provide an image data drive signal to each of the display pixels, receive the sensor signal from the ADC circuitry for each sensor, estimate a state of degradation of at least one of the display pixels, determine a drive-signal compensation for each display pixel having an estimated state of degradation and compensate the image data drive signal to each display pixel having an estimated state of degradation. Methods for compensating pixels for an image in a display are also provided.

IPC Classes  ?

  • G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix

22.

OLED-BASED DISPLAY HAVING PIXEL COMPENSATION AND METHOD

      
Application Number US2022032240
Publication Number 2022/260967
Status In Force
Filing Date 2022-06-03
Publication Date 2022-12-15
Owner EMAGIN CORPORATION (USA)
Inventor
  • Kim, Seonki
  • Ghosh, Amalkumar P.
  • Prache, Olivier
  • Kwon, Hyuk Sang

Abstract

An OLED display system is provided having visual performance pixel compensation for loss of brightness, including display pixels, where each display pixel has OLED subpixels and pixel drive circuitry; a sensing system having sensors and analog to digital conversion circuitry connected to each of the sensors, and a processor to provide an image data drive signal to each of the display pixels, receive the sensor signal from the ADC circuitry for each sensor, estimate a state of degradation of at least one of the display pixels, determine a drive-signal compensation for each display pixel having an estimated state of degradation and compensate the image data drive signal to each display pixel having an estimated state of degradation. Methods for compensating pixels for an image in a display are also provided.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • G01J 1/16 - Photometry, e.g. photographic exposure meter by comparison with reference light or electric value using electric radiation detectors
  • G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
  • G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements

23.

DPD

      
Serial Number 97255698
Status Registered
Filing Date 2022-02-07
Registration Date 2026-07-28
Owner EMAGIN CORPORATION (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

OLED (Organic light emitting diode) display panels

24.

DPD

      
Serial Number 97255676
Status Registered
Filing Date 2022-02-07
Registration Date 2026-05-05
Owner EMAGIN CORPORATION (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

OLED (Organic light emitting diode) display panels

25.

Display comprising OLEDs having transparent top electrodes and method of forming same

      
Application Number 17347118
Grant Number 11758751
Status In Force
Filing Date 2021-06-14
First Publication Date 2021-12-23
Grant Date 2023-09-12
Owner EMAGIN CORPORATION (USA)
Inventor
  • Zhao, Fangchao
  • Khayrullin, Ilyas I.
  • Dong, Chen
  • Ghosh, Amalkumar P.

Abstract

Aspects of the present disclosure describe systems, methods, and structures that provide organic light-emitting diodes having high luminous efficiency and low electrical dissipation. Embodiments in accordance with the present disclosure include a top electrode normally comprising a single film that includes a pair of metals and one metal compound, where the metals include a precious metal in combination with an alkaline earth metal or rare-earth metal and the metal compound is an alkali metal compound. As a result, such a top electrode has a work function that is better matched for efficient electron injection than magnesium-silver alloy-based transparent electrodes known in the prior art.

IPC Classes  ?

  • H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
  • H10K 50/805 - Electrodes
  • H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements

26.

Mechanically pre-biased shadow mask and method of formation

      
Application Number 17380715
Grant Number 11968881
Status In Force
Filing Date 2021-07-20
First Publication Date 2021-11-11
Grant Date 2024-04-23
Owner eMagin Corporation (USA)
Inventor Walker, James A.

Abstract

Shadow masks comprising a multi-layer membrane having a mechanical pre-bias that compensates the effect of gravity on the membrane are disclosed. A shadow mask in accordance with the present disclosure includes a membrane that is patterned with a desired pattern of apertures. The layers of the membrane are selected such that their residual stresses collectively give rise to a stress gradient that is directed normal to the plane of the membrane such that the stress gradient mitigates gravity-induced sag. In some embodiments, the membrane includes a layer pair having internal stresses that are of opposite signs to effect a tendency to bulge outward from the plane of the membrane prior to its release from the substrate. An exemplary membrane includes a layer pair comprising a layer of stoichiometric silicon dioxide that is under residual compressive stress and a layer of stoichiometric silicon nitride that is under residual tensile stress.

IPC Classes  ?

  • C23C 16/34 - Nitrides
  • B05C 17/06 - Stencils
  • B05C 21/00 - Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • C23C 16/56 - After-treatment
  • H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

27.

Direct-deposition system including standoffs for controlling substrate-mask separation

      
Application Number 17334248
Grant Number 11905590
Status In Force
Filing Date 2021-05-28
First Publication Date 2021-09-16
Grant Date 2024-02-20
Owner eMagin Corporation (USA)
Inventor
  • Donoghue, Evan P.
  • Vazan, Fridrich
  • Tice, Kerry
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Wang, Qi
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

The present disclosure enables high-resolution direct patterning of a material on a substrate by establishing and maintaining a separation between a shadow mask and a substrate based on the thickness of a plurality of standoffs. The standoffs function as a physical reference that, when in contact between the substrate and shadow mask determine the separation between them. Embodiments are described in which the standoffs are affixed to an element selected from the shadow mask, the substrate, the mask chuck, and the substrate chuck.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/54 - Controlling or regulating the coating process
  • H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

28.

Microdisplay with reduced pixel size and method of forming same

      
Application Number 17177007
Grant Number 11410606
Status In Force
Filing Date 2021-02-16
First Publication Date 2021-06-17
Grant Date 2022-08-09
Owner eMagin Corporation (USA)
Inventor Wacyk, Ihor

Abstract

A vertically stacked pixel circuit is provided that includes a high voltage device for driving a pixel on an upper silicon layer, and low voltage circuitry (such as matrix addressing circuitry, data storage circuitry and uniformity compensation circuitry) on a lower silicon layer. The circuitry on the upper and lower silicon layers are electrically connected via a through-silicon via. This unique arrangement allows the high voltage device for driving a pixel to be physically located on top of the larger number of low voltage devices in the lower silicon layer in order to achieve a substantial reduction in overall pixel emission area. The vertically stacked pixel circuit is particularly suited for organic light-emitting diode microdisplays.

IPC Classes  ?

  • G09G 3/3258 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the voltage across the light-emitting element
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
  • G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
  • H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology

29.

HYBRID-MATRIX DISPLAY

      
Application Number US2020049080
Publication Number 2021/046138
Status In Force
Filing Date 2020-09-02
Publication Date 2021-03-11
Owner EMAGIN CORPORATION (USA)
Inventor Wacyk, Ihor

Abstract

An integral imaging display system is provided including an orthogonal array of a plurality of displaylets, each displaylet used to form an elemental image, each displaylet comprising a passive matrix array of pixels, and each displaylet connected to a common data and address bus, the common data and address bus providing video information to each displaylet, in sequence, wherein each displaylet is driven actively.

IPC Classes  ?

  • H04N 13/302 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays
  • G02B 30/26 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer’s left and right eyes of the autostereoscopic type

30.

Linear source apparatus, system and method of use

      
Application Number 17022868
Grant Number 11313033
Status In Force
Filing Date 2020-09-16
First Publication Date 2020-12-31
Grant Date 2022-04-26
Owner eMagin Corporation (USA)
Inventor
  • Ali, Tariq
  • Khayrullin, Ilyas I.
  • Ghosh, Amalkumar P.
  • Donoghue, Evan P.
  • Wang, Qi
  • Vazan, Fridrich
  • Tice, Kerry
  • Sziklas, Laurie

Abstract

A linear evaporation apparatus, system and method including a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit including an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber and configured to transmit the linear source deposition flux therethrough, and a plurality of crucibles, each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature.

IPC Classes  ?

  • C23C 14/28 - Vacuum evaporation by wave energy or particle radiation
  • C23C 14/24 - Vacuum evaporation

31.

Apparatus and method for direct patterning of an organic material using an electrostatic mask

      
Application Number 17021306
Grant Number 11482671
Status In Force
Filing Date 2020-09-15
First Publication Date 2020-12-31
Grant Date 2022-10-25
Owner eMagin Corporation (USA)
Inventor
  • Anandan, Munisamy
  • Ghosh, Amalkumar P.

Abstract

A deposition system that mitigates feathering in a directly deposited pattern of organic material is disclosed. Deposition systems in accordance with the present disclosure include an evaporation source, an electrically conductive shadow mask, and an electrically conductive field plate. The source imparts a negative charge on vaporized organic molecules as they are emitted toward a target substrate. The source and substrate are biased to produce an electric field having field lines that extend normally between them. The shadow mask and field plate are located between the source and substrate and each functions as an electrostatic lens that directs the charged vapor molecules toward propagation directions aligned with the field lines as the charged vapor molecules approach and pass through them. As a result, the charged vapor molecules pass through the shadow mask to the substrate along directions that are substantially normal to the substrate surface, thereby mitigating feathering in the deposited material pattern.

IPC Classes  ?

  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • C23C 14/12 - Organic material
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)

32.

Microdisplay based immersive headset

      
Application Number 16746093
Grant Number 11256102
Status In Force
Filing Date 2020-01-17
First Publication Date 2020-10-15
Grant Date 2022-02-22
Owner eMagin Corporation (USA)
Inventor
  • Carollo, Jerome T.
  • Ghosh, Amal
  • Ho, John Chi-Liang
  • Rosen, Andrew Thomas Manning

Abstract

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

IPC Classes  ?

  • G02B 27/01 - Head-up displays
  • G06T 19/00 - Manipulating 3D models or images for computer graphics
  • H04N 13/286 - Image signal generators having separate monoscopic and stereoscopic modes
  • G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators

33.

Direct-deposition system including standoffs for controlling substrate-mask separation

      
Application Number 16169678
Grant Number 11035033
Status In Force
Filing Date 2018-10-24
First Publication Date 2020-04-30
Grant Date 2021-06-15
Owner eMagin Corporation (USA)
Inventor
  • Donoghue, Evan P.
  • Vazan, Fridrich
  • Tice, Kerry
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Wang, Qi
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

The present disclosure enables high-resolution direct patterning of a material on a substrate by establishing and maintaining a separation between a shadow mask and a substrate based on the thickness of a plurality of standoffs. The standoffs function as a physical reference that, when in contact between the substrate and shadow mask determine the separation between them. Embodiments are described in which the standoffs are affixed to an element selected from the shadow mask, the substrate, the mask chuck, and the substrate chuck.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • C23C 14/54 - Controlling or regulating the coating process
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

34.

Microdisplay based immersive headset

      
Application Number 16422548
Grant Number 10578879
Status In Force
Filing Date 2019-05-24
First Publication Date 2019-11-28
Grant Date 2020-03-03
Owner eMagin Corporation (USA)
Inventor
  • Carollo, Jerome T.
  • Ghosh, Amal
  • Ho, John Chi-Liang
  • Rosen, Andrew Thomas Manning

Abstract

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

IPC Classes  ?

  • G02B 27/01 - Head-up displays
  • G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
  • G06T 19/00 - Manipulating 3D models or images for computer graphics
  • H04N 13/286 - Image signal generators having separate monoscopic and stereoscopic modes

35.

3D PIXEL CIRCUIT FOR MICRODISPLAY WITH REDUCED PIXEL SIZE AND METHOD OF FORMING SAME

      
Application Number US2019018671
Publication Number 2019/164867
Status In Force
Filing Date 2019-02-20
Publication Date 2019-08-29
Owner EMAGIN CORPORATION (USA)
Inventor Wacyk, Ihor

Abstract

A vertically stacked pixel circuit is provided that includes a high voltage device for driving a pixel on an upper silicon layer, and low voltage circuitry (such as matrix addressing circuitry, data storage circuitry and uniformity compensation circuitry) on a lower silicon layer. The circuitry on the upper and lower silicon layers are electrically connected via a through-silicon via. This unique arrangement allows the high voltage device for driving a pixel to be physically located on top of the larger number of low voltage devices in the lower silicon layer in order to achieve a substantial reduction in overall pixel emission area. The vertically stacked pixel circuit is particularly suited for organic light-emitting diode microdisplays.

IPC Classes  ?

  • H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
  • H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

36.

Microdisplay with reduced pixel size and method of forming same

      
Application Number 16279809
Grant Number 10950178
Status In Force
Filing Date 2019-02-19
First Publication Date 2019-08-22
Grant Date 2021-03-16
Owner eMagin Corporation (USA)
Inventor Wacyk, Ihor

Abstract

A vertically stacked pixel circuit is provided that includes a high voltage device for driving a pixel on an upper silicon layer, and low voltage circuitry (such as matrix addressing circuitry, data storage circuitry and uniformity compensation circuitry) on a lower silicon layer. The circuitry on the upper and lower silicon layers are electrically connected via a through-silicon via. This unique arrangement allows the high voltage device for driving a pixel to be physically located on top of the larger number of low voltage devices in the lower silicon layer in order to achieve a substantial reduction in overall pixel emission area. The vertically stacked pixel circuit is particularly suited for organic light-emitting diode microdisplays.

IPC Classes  ?

  • G09G 3/3258 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the voltage across the light-emitting element
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
  • G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
  • H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology

37.

High resolution shadow mask with tapered pixel openings

      
Application Number 16178388
Grant Number 11121321
Status In Force
Filing Date 2018-11-01
First Publication Date 2019-05-02
Grant Date 2021-09-14
Owner eMagin Corporation (USA)
Inventor
  • Donoghue, Evan P.
  • Khayrullin, Ilyas I.
  • Tice, Kerry
  • Ali, Tariq
  • Wang, Qi
  • Vazan, Fridrich
  • Ghosh, Amalkumar P.

Abstract

Aspects of the present disclosure are directed to systems, method, and structures including a high-resolution shadow mask with tapered aperture/pixel openings that advantageously overcomes problems plaguing the prior art namely shadowing, sagging, and fragility.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • H01J 1/62 - Luminescent screensSelection of materials for luminescent coatings on vessels
  • B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

38.

Method of active alignment for direct patterning high resolution micro-display

      
Application Number 16178441
Grant Number 10522794
Status In Force
Filing Date 2018-11-01
First Publication Date 2019-05-02
Grant Date 2019-12-31
Owner eMagin Corporation (USA)
Inventor
  • Khayrullin, Ilyas I.
  • Donoghue, Evan P.
  • Tice, Kerry
  • Ali, Tariq
  • Wang, Qi
  • Vazan, Fridrich
  • Ghosh, Amalkumar P.

Abstract

A method of active alignment of a shadow mask to a substrate includes a first alignment by moving the shadow mask and the substrate a first distance in a vertical direction, capturing a first alignment image, determining at least one of a first correction distance and a first rotational correction angle, and aligning the shadow mask and the substrate by moving the first correction distance and rotating the first rotational correction angle. The method further includes performing a first material deposition process on the substrate and continuously capturing a first series of alignment images during the generation of the first material deposition flow. During the generation of the first material deposition flow the first series of alignment images are analyzed to determine a second correction distance and a second rotational correction angle and determining whether second distance and/or rotational correction angle is greater than or equal to a predetermined value to cause a second alignment process to occur.

IPC Classes  ?

  • H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
  • C23C 14/24 - Vacuum evaporation
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • H01L 21/66 - Testing or measuring during manufacture or treatment

39.

Linear source apparatus, system and method of use

      
Application Number 16124568
Grant Number 10815563
Status In Force
Filing Date 2018-09-07
First Publication Date 2019-04-11
Grant Date 2020-10-27
Owner eMagin Corporation (USA)
Inventor
  • Ali, Tariq
  • Khayrullin, Ilyas I.
  • Ghosh, Amalkumar P.
  • Donoghue, Evan P.
  • Wang, Qi
  • Vazan, Fridrich
  • Tice, Kerry
  • Sziklas, Laurie

Abstract

A linear evaporation apparatus, system and method including a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit including an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber and configured to transmit the linear source deposition flux therethrough, and a plurality of crucibles, each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature.

IPC Classes  ?

  • C23C 14/28 - Vacuum evaporation by wave energy or particle radiation
  • C23C 14/24 - Vacuum evaporation

40.

Apparatus and method for direct patterning of an organic material using an electrostatic mask

      
Application Number 15968128
Grant Number 10903427
Status In Force
Filing Date 2018-05-01
First Publication Date 2018-11-01
Grant Date 2021-01-26
Owner eMagin Corporation (USA)
Inventor
  • Anandan, Munisamy
  • Ghosh, Amalkumar P.

Abstract

A deposition system that mitigates feathering in a directly deposited pattern of organic material is disclosed. Deposition systems in accordance with the present disclosure include an evaporation source, an electrically conductive shadow mask, and an electrically conductive field plate. The source imparts a negative charge on vaporized organic molecules as they are emitted toward a target substrate. The source and substrate are biased to produce an electric field having field lines that extend normally between them. The shadow mask and field plate are located between the source and substrate and each functions as an electrostatic lens that directs the charged vapor molecules toward propagation directions aligned with the field lines as the charged vapor molecules approach and pass through them. As a result, the charged vapor molecules pass through the shadow mask to the substrate along directions that are substantially normal to the substrate surface, thereby mitigating feathering in the deposited material pattern.

IPC Classes  ?

  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • C23C 14/12 - Organic material
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)

41.

Shadow mask comprising a gravity-compensation layer and method of fabrication

      
Application Number 15968325
Grant Number 11152573
Status In Force
Filing Date 2018-05-01
First Publication Date 2018-11-01
Grant Date 2021-10-19
Owner eMagin Corporation (USA)
Inventor
  • Vazan, Fridrich
  • Donoghue, Evan P.
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Tice, Kerry
  • Ghosh, Amalkumar P.

Abstract

A shadow mask that includes compensation layer operative for at least partially correcting gravity-induced sag of a shadow-mask membrane is disclosed. The compensation layer is formed on a surface of the shadow-mask membrane such that the compensation layer is characterized by a residual stress that gives rise to a first bending moment in the membrane, where the first bending moment is directed in the opposite direction to a second bending moment in the membrane that is induced by the effect of gravity.

IPC Classes  ?

  • C23C 14/24 - Vacuum evaporation
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

42.

Mechanically pre-biased shadow mask and method of formation

      
Application Number 15968443
Grant Number 11101451
Status In Force
Filing Date 2018-05-01
First Publication Date 2018-11-01
Grant Date 2021-08-24
Owner eMagin Corporation (USA)
Inventor Walker, James A.

Abstract

Shadow masks comprising a multi-layer membrane having a mechanical pre-bias that compensates the effect of gravity on the membrane are disclosed. A shadow mask in accordance with the present disclosure includes a membrane that is patterned with a desired pattern of apertures. The layers of the membrane are selected such that their residual stresses collectively give rise to a stress gradient that is directed normal to the plane of the membrane such that the stress gradient mitigates gravity-induced sag. In some embodiments, the membrane includes a layer pair having internal stresses that are of opposite signs to effect a tendency to bulge outward from the plane of the membrane prior to its release from the substrate. An exemplary membrane includes a layer pair comprising a layer of stoichiometric silicon dioxide that is under residual compressive stress and a layer of stoichiometric silicon nitride that is under residual tensile stress.

IPC Classes  ?

  • C23C 16/34 - Nitrides
  • C23C 16/56 - After-treatment
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

43.

Apparatus and method of directly patterning high resolution active matrix organic light emitting diodes using high-resolution shadow mask

      
Application Number 15968606
Grant Number 10636969
Status In Force
Filing Date 2018-05-01
First Publication Date 2018-11-01
Grant Date 2020-04-28
Owner eMagin Corporation (USA)
Inventor
  • Donoghue, Evan P.
  • Tice, Kerry
  • Khayrullin, Ilyas I.
  • Vazan, Fridrich
  • Ali, Tariq
  • Sziklas, Laurie
  • Ghosh, Amalkumar P.

Abstract

An apparatus and method for performing material deposition on an active-matrix organic light emitting diode (AMOLED) display array on a substrate, includes aligning a shadow mask to a first position relative to the substrate; initially depositing a first material through the shadow mask onto the substrate at a first material deposition position relative to the first position of the aligned shadow mask and at a first deposition height; incrementing the position the shadow mask to a second position relative to the first material deposition position; and subsequently depositing one of the first material or a second material through the shadow mask onto the substrate at a second material deposition position relative to the first material deposition position, wherein the second material deposition position having an identical deposition pattern as the first material deposition position on account of the shadow mask.

IPC Classes  ?

  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)

44.

Buffer assisted charge generation layer for tandem OLEDs

      
Application Number 15908502
Grant Number 10483478
Status In Force
Filing Date 2018-02-28
First Publication Date 2018-09-06
Grant Date 2019-11-19
Owner eMagin Corporation (USA)
Inventor
  • Wang, Qi
  • Donoghue, Evan P.
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Tice, Kerry
  • Ghosh, Amalkumar P.

Abstract

A tandem Organic Light Emitting Diode (OLED) apparatus and method of fabricating the same, where the tandem OLED apparatus includes a buffer assisted charge generation layer having a junction of a p-type doped semiconductor layer and an n-type doped semiconductor layer, where a hole buffer layer and an electron buffer layer pair surrounding the junction of the p-type and n-type doped semiconductor layers. The OLED apparatus further includes a first OLED emissive layer and a second OLED emissive layer pair surrounding the buffer assisted charge generation layer, and a cathode and anode layer pair further surrounding the first and second OLED emissive layer pair.

IPC Classes  ?

  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

45.

Method of designing and fabricating a microlens array

      
Application Number 15881485
Grant Number 11149340
Status In Force
Filing Date 2018-01-26
First Publication Date 2018-07-26
Grant Date 2021-10-19
Owner eMagin Corporation (USA)
Inventor
  • Khayrullin, Ilyas I.
  • Ghosh, Amalkumar P.
  • Wacyk, Ihor
  • Donoghue, Evan
  • Ali, Tariq
  • Wang, Qi
  • Tice, Kerry

Abstract

In a method for designing and fabricating a micro-lens array, a design is finalized by varying certain features of a shadow mask, varying a distance between a source of lens-forming material and the shadow mask, and varying other parameters until the features and distances result in the formation of a micro-lens having desired shape, etc. A shadow mask in accordance with the design is then fabricated and is appropriately positioned with respect to a micro-display and a source of lens-forming material. A plume of lens-forming material is then generated under reduced pressure and which propagates toward the shadow mask, directly patterning the micro-lenses on sub-pixels of the micro-display.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

46.

Large area display and method for making same

      
Application Number 15710602
Grant Number 11437451
Status In Force
Filing Date 2017-09-20
First Publication Date 2018-03-22
Grant Date 2022-09-06
Owner eMagin Corporation (USA)
Inventor
  • Wacyk, Ihor
  • Ghosh, Amalkumar P.
  • Sculley, Jr., Andrew G.
  • Prache, Olivier

Abstract

A large area active-matrix organic light-emitting diode microdisplay and method for fabricating the same is provided which includes a panel having resolution of greater than 2,000 pixels per inch and a size of 1.4 or more inches for supporting the needs of virtual reality and augmented reality application.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 23/00 - Details of semiconductor or other solid state devices
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

47.

Reconfigurable display and method therefor

      
Application Number 15666041
Grant Number 10741129
Status In Force
Filing Date 2017-08-01
First Publication Date 2018-03-15
Grant Date 2020-08-11
Owner
  • eMagin Corporation (USA)
  • UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE ARMY (USA)
Inventor
  • Wacyk, Ihor
  • Kwon, Hyuk Sang
  • Draper, Russell
  • Fellowes, David

Abstract

An image rendering system comprising a pixel array and variable-density column and row scanner circuits is disclosed. The variable-density column and row scanner circuits enable software-based reconfiguration of the active display area within the available screen area of the display. In addition, a hardware restore-to-black function is provided that enables pixels outside of the desired image region to be driven to black without their requiring image data or excitation. As a result, the functionality of the functionality of the display can be reconfigured to match the desired image region on a frame-by-frame basis. Therefore, displays in accordance with the present invention can operate at higher frame rates and with less power consumption that prior-art displays.

IPC Classes  ?

  • G09G 5/02 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators characterised by the way in which colour is displayed
  • G09G 5/10 - Intensity circuits
  • G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
  • G09G 3/3266 - Details of drivers for scan electrodes
  • G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
  • G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element

48.

Arrangement of color sub-pixels for full color OLED and method of manufacturing same

      
Application Number 15697372
Grant Number 10297645
Status In Force
Filing Date 2017-09-06
First Publication Date 2018-02-22
Grant Date 2019-05-21
Owner eMagin Corporation (USA)
Inventor Wacyk, Ihor

Abstract

A full-color display panel is provided comprising a repeating super-pixel block including four pixel units, wherein each of the pixel units has a first sub-pixel configured to emit a first color light, a second sub-pixel configured to emit a second color light, and a third sub-pixel configured to emit a third color light. The first or second sub-pixel abuts the same-color sub-pixel of the adjacent pixel unit thereof to form at least a double-sized sub-pixel area. The third sub-pixel abuts the same-color sub-pixel of all adjacent pixel units thereof to form at least a quadruple-sized sub-pixel area. The first color light, the second color light, and the third color light are one of emitted through or from respective organic layers of the first color sub-pixel, the second color sub-pixel and the third color sub-pixel.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

49.

RECONFIGURABLE DISPLAY AND METHOD THEREFOR

      
Application Number US2017044889
Publication Number 2018/026809
Status In Force
Filing Date 2017-08-01
Publication Date 2018-02-08
Owner
  • EMAGIN CORPORATION (USA)
  • UNITED STATES OF AMERICA, AS REPRESENTED BY TH SECRETARY OF THE ARMY (USA)
Inventor
  • Wacyk, Ihor
  • Kwon, Harrison
  • Draper, Russell
  • Fellowes, David

Abstract

An image rendering system comprising a pixel array and variable-density column and row scanner circuits is disclosed. The variable-density column and row scanner circuits enable software- based reconfiguration of the active display area within the available screen area of the display. In addition, a hardware restore-to-black function is provided that enables pixels outside of the desired image region to be driven to black without their requiring image data or excitation. As a result, the functionality of the functionality of the display can be reconfigured to match the desired image region on a frame- by-frame basis. Therefore, displays in accordance with the present invention can operate at higher frame rates and with less power consumption that prior-art displays.

IPC Classes  ?

50.

Shadow-mask-deposition system and method therefor

      
Application Number 15602939
Grant Number 10386731
Status In Force
Filing Date 2017-05-23
First Publication Date 2017-11-30
Grant Date 2019-08-20
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Vazan, Fridrich
  • Anandan, Munisamy
  • Donoghue, Evan
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system capable of forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through a pattern of through-holes in a shadow mask to deposit on the substrate in the desired pattern. The shadow mask is held in a mask chuck that enables the shadow mask and substrate to be separated by a distance that can be less than ten microns. As a result, the vaporized atoms that pass through the shadow mask exhibit little or no lateral spread (i.e., feathering) after passing through its apertures and the material deposits on the substrate in a pattern that has very high fidelity with the aperture pattern of the shadow mask.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/30 - Vacuum evaporation by wave energy or particle radiation by electron bombardment
  • C23C 14/50 - Substrate holders
  • C23C 14/54 - Controlling or regulating the coating process

51.

High-precision shadow-mask-deposition system and method therefor

      
Application Number 15655544
Grant Number 11275315
Status In Force
Filing Date 2017-07-20
First Publication Date 2017-11-30
Grant Date 2022-03-15
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Vazan, Fridrich
  • Anandan, Munisamy
  • Donoghue, Evan
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through a pattern of through-holes in a shadow mask to deposit on the substrate in the desired pattern. The shadow mask is held in a mask chuck that enables the shadow mask and substrate to be separated by a distance that can be less than ten microns. Prior to reaching the shadow mask, vaporized atoms pass through a collimator that operates as a spatial filter that blocks any atoms not travelling along directions that are nearly normal to the substrate surface. Vaporized atoms that pass through the shadow mask exhibit little or no lateral spread after passing through through-holes and the material deposits on the substrate in a pattern that has very high fidelity with the through-hole pattern of the shadow mask.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/30 - Vacuum evaporation by wave energy or particle radiation by electron bombardment
  • C23C 14/50 - Substrate holders
  • C23C 14/54 - Controlling or regulating the coating process

52.

HIGH-PRECISION SHADOW-MASK-DEPOSITION SYSTEM AND METHOD THEREFOR

      
Application Number IB2017054481
Publication Number 2017/203502
Status In Force
Filing Date 2017-07-24
Publication Date 2017-11-30
Owner EMAGIN CORPORATION (USA)
Inventor
  • Anandan, Munisamy
  • Ghosh, Amalkumar
  • Vazan, Fridrich
  • Donoghue, Evan
  • Khayrullin, Ilyas
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through a pattern of through-holes in a shadow mask to deposit on the substrate in the desired pattern. The shadow mask is held in a mask chuck that enables the shadow mask and substrate to be separated by a distance that can be less than ten microns. Prior to reaching the shadow mask, vaporized atoms pass through a collimator that operates as a spatial filter that blocks any atoms not travelling along directions that are nearly normal to the substrate surface. Vaporized atoms that pass through the shadow mask exhibit little or no lateral spread after passing through through-holes and the material deposits on the substrate in a pattern that has very high fidelity with the through-hole pattern of the shadow mask.

IPC Classes  ?

  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/50 - Substrate holders
  • C23C 14/54 - Controlling or regulating the coating process
  • C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks

53.

HIGH-PRECISION SHADOW-MASK-DEPOSITION SYSTEM AND METHOD THEREFOR

      
Application Number US2017033161
Publication Number 2017/205147
Status In Force
Filing Date 2017-05-17
Publication Date 2017-11-30
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amalkumar, P.
  • Vazan, Fridrich
  • Anandan, Munisamy
  • Donoghue, Evan
  • Khayrullin, Ilyas, I.
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system capable of forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through an aperture pattern of a shadow mask to deposit on the substrate in the desired pattern. Prior to reaching the shadow mask, the vaporized atoms pass through a collimator that operates as a spatial filter that blocks any atoms not travelling along directions that are nearly normal to the substrate surface. As a result, the vaporized atoms that pass through the shadow mask exhibit little or no lateral spread (i.e., feathering) after passing through its apertures and the material deposits on the substrate in a pattern that has very high fidelity with the aperture pattern of the shadow mask. The present invention, therefore, mitigates the need for relatively large space between regions of deposited material normally required in the prior art, thereby enabling high-resolution patterning.

IPC Classes  ?

54.

High-precision shadow-mask-deposition system and method therefor

      
Application Number 15597635
Grant Number 10072328
Status In Force
Filing Date 2017-05-17
First Publication Date 2017-11-30
Grant Date 2018-09-11
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Vazan, Fridrich
  • Anandan, Munisamy
  • Donoghue, Evan
  • Khayrullin, Ilyas I.
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system capable of forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through an aperture pattern of a shadow mask to deposit on the substrate in the desired pattern. Prior to reaching the shadow mask, the vaporized atoms pass through a collimator that operates as a spatial filter that blocks any atoms not travelling along directions that are nearly normal to the substrate surface. As a result, the vaporized atoms that pass through the shadow mask exhibit little or no lateral spread (i.e., feathering) after passing through its apertures and the material deposits on the substrate in a pattern that has very high fidelity with the aperture pattern of the shadow mask. The present invention, therefore, mitigates the need for relatively large space between regions of deposited material normally required in the prior art, thereby enabling high-resolution patterning.

IPC Classes  ?

  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • C23C 14/24 - Vacuum evaporation
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

55.

SHADOW-MASK-DEPOSITION SYSTEM AND METHOD THEREFOR

      
Application Number US2017034203
Publication Number 2017/205479
Status In Force
Filing Date 2017-05-24
Publication Date 2017-11-30
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amalkumar, P.
  • Vazan, Fridrich
  • Anandan, Munisamy
  • Donoghue, Evan
  • Khayrullin, Ilyas, I.
  • Ali, Tariq
  • Tice, Kerry

Abstract

A direct-deposition system capable of forming a high-resolution pattern of material on a substrate is disclosed. Vaporized atoms from an evaporation source pass through a pattern of through-holes in a shadow mask to deposit on the substrate in the desired pattern. The shadow mask is held in a mask chuck that enables the shadow mask and substrate to be separated by a distance that can be less than ten microns. As a result, the vaporized atoms that pass through the shadow mask exhibit little or no lateral spread (i.e., feathering) after passing through its apertures and the material deposits on the substrate in a pattern that has very high fidelity with the aperture pattern of the shadow mask.

IPC Classes  ?

56.

LARGE AREA OLED MICRODISPLAY AND METHOD OF MANUFACTURING SAME

      
Application Number US2016030414
Publication Number 2016/179092
Status In Force
Filing Date 2016-05-02
Publication Date 2016-11-10
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amalkumar, P.
  • Sculley, Andrew, G., Jr.
  • Wacyk, Ihor
  • Kwon, Harrison
  • Ho, John
  • Rosen, Andrew

Abstract

An organic light-emitting diode (OLED) display device is provided having a color emission layer including a plurality of organic light-emitting elements in a first arrangement and an electronics layer. The electronics layer includes a plurality of pixel drive circuits each including an electrode contact. The electronics layer includes a plurality of independently addressable sub-regions each sub-region including an identical pattern of electrode contacts created using a single reticle exposure. Each sub-region is orientated differently within a plane such that the first arrangement of light-emitting elements is electrically connected to the patterned electronics layer.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

57.

Large area OLED microdisplay and method of manufacturing same

      
Application Number 15144142
Grant Number 09899456
Status In Force
Filing Date 2016-05-02
First Publication Date 2016-11-03
Grant Date 2018-02-20
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Sculley, Andrew G.
  • Wacyk, Ihor
  • Kwon, Harrison
  • Ho, John
  • Rosen, Andrew

Abstract

An organic light-emitting diode (OLED) display device is provided having a color emission layer including a plurality of organic light-emitting elements in a first arrangement and an electronics layer. The electronics layer includes a plurality of pixel drive circuits each including an electrode contact. The electronics layer includes a plurality of independently addressable sub-regions each sub-region including an identical pattern of electrode contacts created using a single reticle exposure. Each sub-region is orientated differently within a plane such that the first arrangement of light-emitting elements is electrically connected to the patterned electronics layer.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

58.

Method of integrating inorganic light emitting diode with oxide thin film transistor for display applications

      
Application Number 15085128
Grant Number 09793252
Status In Force
Filing Date 2016-03-30
First Publication Date 2016-10-06
Grant Date 2017-10-17
Owner eMagin Corporation (USA)
Inventor Ghosh, Amalkumar P.

Abstract

A method of fabricating an active matrix display is disclosed in which one or more oxide thin film transistors is monolithically integrated with an inorganic light emitting diode structure. The method comprises forming an array of inorganic light emitting diodes over a substrate defining a plurality of sub-pixels, depositing an insulating layer over the inorganic LED array, forming conductive vias through the insulating layer, one via for each LED in the LED array, and forming a metal oxide thin film transistor backplane, including an array of pixel driver circuits, over the dielectric layer and conductive vias, wherein one driver circuit electrically controls each sub-pixel through the dielectric layer.

IPC Classes  ?

  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
  • H01L 29/66 - Types of semiconductor device
  • H01L 29/786 - Thin-film transistors
  • H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
  • H01L 33/50 - Wavelength conversion elements
  • H01L 31/20 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor material
  • H01L 31/0376 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
  • H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
  • G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device

59.

Microdisplay based immersive headset

      
Application Number 15149735
Grant Number 09733481
Status In Force
Filing Date 2016-05-09
First Publication Date 2016-09-22
Grant Date 2017-08-15
Owner eMagin Corporation (USA)
Inventor
  • Carollo, Jerome T.
  • Ghosh, Amal
  • Ho, John Chi-Liang
  • Rosen, Andrew Thomas Manning

Abstract

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

IPC Classes  ?

  • G02B 27/01 - Head-up displays
  • G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
  • G06T 19/00 - Manipulating 3D models or images for computer graphics
  • H04N 13/02 - Picture signal generators

60.

Method for eliminating electrical cross-talk in OLED microdisplays

      
Application Number 14971228
Grant Number 10128317
Status In Force
Filing Date 2015-12-16
First Publication Date 2016-06-23
Grant Date 2018-11-13
Owner eMagin Corporation (USA)
Inventor Wacyk, Ihor

Abstract

An OLED microdisplay comprising a substrate, a pixel array and a patterned conductive layer underneath the anode pad array to form an effective ground plane in order to greatly reduce or eliminate electrical cross-talk between pixels, and a method for fabricating same.

IPC Classes  ?

  • H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

61.

High precision, high resolution collimating shadow mask and method for fabricating a micro-display

      
Application Number 14941825
Grant Number 10644239
Status In Force
Filing Date 2015-11-16
First Publication Date 2016-05-19
Grant Date 2020-05-05
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar
  • Vazan, Fridrich

Abstract

The method for producing an OLED micro-display on a silicon wafer uses a collimating shadow mask formed on a silicon substrate. The mask is fabricated by depositing a material layer on the front side and on the back side of the substrate and etching a portion of the layer on the back side of the substrate to a reduced thickness of at least 20 microns. At least one opening is created in the etched portion of the substrate. The substrate beneath the opening is removed to create the mask. The mask is situated at a location spaced from the surface of the silicon wafer and exposed to a linear evaporation source. Organic layers are then deposited on the silicon wafer in a location aligned with the mask opening.

IPC Classes  ?

  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

62.

MICRODISPLAY BASED IMMERSIVE HEADSET

      
Application Number US2015057100
Publication Number 2016/069398
Status In Force
Filing Date 2015-10-23
Publication Date 2016-05-06
Owner EMAGIN CORPORATION (USA)
Inventor
  • Carollo, Jerome, T.
  • Ghosh, Amal
  • Ho, John, Chi-Liang
  • Rosen, Andrew, Thomas Manning

Abstract

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

IPC Classes  ?

63.

Microdisplay based immersive headset

      
Application Number 14921750
Grant Number 09366871
Status In Force
Filing Date 2015-10-23
First Publication Date 2016-04-28
Grant Date 2016-06-14
Owner EMAGIN CORPORATION (USA)
Inventor
  • Ghosh, Amal
  • Ho, John Chi-Liang
  • Rosen, Andrew Thomas Manning

Abstract

An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.

IPC Classes  ?

64.

Patterning of OLED materials

      
Application Number 14849071
Grant Number 09385323
Status In Force
Filing Date 2015-09-09
First Publication Date 2015-12-31
Grant Date 2016-07-05
Owner
  • University of Rochester (USA)
  • eMagin Corporation (USA)
Inventor
  • Chan, Charles K.
  • Tang, Ching W.
  • Vazan, Fridrich
  • Ghosh, Amal

Abstract

A method of making a patterned OLED layer or layers. The method uses a shadow mask having, for example, a free-standing silicon nitride membrane to pattern color emitter material with a feature size of less than 10 microns. The methods can be used, for example, in the manufacture of OLED microdisplays.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • C23C 14/04 - Coating on selected surface areas, e.g. using masks

65.

High efficacy seal for organic light emitting diode displays

      
Application Number 14615585
Grant Number 10147906
Status In Force
Filing Date 2015-02-06
First Publication Date 2015-08-06
Grant Date 2018-12-04
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar
  • Vazan, Fridrich

Abstract

A high efficacy multi-layer seal structure formed on an organic light emitting diode device and the process for depositing the same. A thin film seal is formed over the substrate having OLED layers, and includes a first metallic layer formed over the substrate, an inorganic layer formed over the first metallic layer, and a second metallic layer formed of the inorganic layer. The metallic layers comprise one or more oxide or nitride layers, each oxide or nitride comprising a metal. The inorganic layer comprises a metal oxide, a metal nitride or a metal oxynitride. The process for forming the multi-layer seal structure includes depositing the first metallic layer over the substrate using atomic layer deposition, depositing the inorganic layer over the first metallic layer using sputtering, and then depositing the second metallic layer over the inorganic layer using atomic layer deposition.

IPC Classes  ?

  • H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
  • H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
  • H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
  • C23C 28/04 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of inorganic non-metallic material
  • C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and

66.

System and method for electrically repairing stuck-on pixel defects

      
Application Number 14604250
Grant Number 09984616
Status In Force
Filing Date 2015-01-23
First Publication Date 2015-07-30
Grant Date 2018-05-29
Owner eMagin Corporation (USA)
Inventor Wacyk, Ihor

Abstract

A system and method for repairing an OLED display having an array of OLED pixels including at least one inoperative OLED pixel, wherein each OLED pixel is controlled by a pixel driver circuit having a fusible element. The system includes a first switch for reducing an energizing signal to the OLED pixel array, the energizing signal exceeding a threshold level below which the OLED pixels should not emit light. A second switch is provided for increasing a bias signal to the OLED pixel array, the bias signal exceeding a threshold level above which the fusible element of the inoperative OLED pixels are blown, such that inoperative OLED pixels no longer emit light.

IPC Classes  ?

  • G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
  • G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
  • G11C 17/16 - Read-only memories programmable only onceSemi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links

67.

Patterning of OLED materials

      
Application Number 14453480
Grant Number 09142779
Status In Force
Filing Date 2014-08-06
First Publication Date 2015-02-12
Grant Date 2015-09-22
Owner
  • University of Rochester (USA)
  • eMagin Corporation (USA)
Inventor
  • Chan, Charles K.
  • Tang, Ching W.
  • Vazan, Fridrich
  • Ghosh, Amal

Abstract

A method of making a patterned OLED layer or layers. The method uses a shadow mask having, for example, a free-standing silicon nitride membrane to pattern color emitter material with a feature size of less than 10 microns. The methods can be used, for example, in the manufacture of OLED microdisplays.

IPC Classes  ?

  • H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
  • H01L 21/40 - Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

68.

Method of manufacturing organic light emitting diode arrays and system for eliminating defects in organic light emitting diode arrays

      
Application Number 13925146
Grant Number 08974263
Status In Force
Filing Date 2013-06-24
First Publication Date 2013-10-31
Grant Date 2015-03-10
Owner eMagin Corporation (USA)
Inventor Ghosh, Amalkumar P.

Abstract

A method for manufacturing an organic light emitting diode (OLED) array is provided that includes applying an energizing signal to at least one of the OLED pixels in the array. The energizing signal exceeds a threshold level. The method also includes reducing the energizing signal and identifying an OLED in the array that continues to remain energized. The method further includes irradiating the identified OLED to degrade the organic material in the OLED. A method of performing quality control in a manufacturing process of an OLED array is provided. The method includes determining an intensity, a time and a wavelength of radiation sufficient to render an OLED of the OLED array inoperative by degrading organic material in the OLED. A system of performing quality control in a manufacturing process of an OLED array is provided. A computer-readable medium having stored thereon computer-executable instructions is provided.

IPC Classes  ?

  • H01J 9/50 - Repairing or regenerating used or defective discharge tubes, lamps or their salvageable components
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

69.

Stacked, non-inverted dielectrically isolated, organic light emitting diode display formed on a silicon-on-insulator based substrate and method of same

      
Application Number 13411988
Grant Number 08975832
Status In Force
Filing Date 2012-03-05
First Publication Date 2013-03-21
Grant Date 2015-03-10
Owner eMagin Corporation (USA)
Inventor
  • Khayrullin, Ilyas I.
  • Ghosh, Amalkumar P.
  • Wacyk, Ihor

Abstract

A display and method of making a display, comprising first and second stacked, non-inverted, dielectrically isolated, organic light emitting diodes formed on a silicon on insulator substrate. The display includes a means for applying both a positive or negative voltage across the stack, and a common intermediate control node situated between the diodes. The control node is electrically connected through vias to receive a control voltage signal, such that altering the relationship between the control voltage signal and the voltage applied across the stack regulates the actuation of the individual diodes.

IPC Classes  ?

  • H05B 37/02 - Controlling
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

70.

Independently controlled stacked inverted organic light emitting diodes and a method of manufacturing same

      
Application Number 13648163
Grant Number 08883553
Status In Force
Filing Date 2012-10-09
First Publication Date 2013-02-07
Grant Date 2014-11-11
Owner eMagin Corporation (USA)
Inventor
  • Ali, Tariq
  • Ghosh, Amulkumar P.
  • Khayrullin, Ilyas

Abstract

An OLED apparatus is provided that includes a first electrode having a first polarity, and an electrode arrangement spaced apart from the first electrode and having a second polarity. The OLED apparatus also includes a first organic emissive layer interposed between the first electrode and the electrode arrangement, and a second electrode spaced apart from the electrode arrangement in a direction opposite the first electrode. The second electrode has the first polarity. The OLED apparatus further includes a second organic emissive layer interposed between the second electrode and the electrode arrangement, and a drive circuit for providing a first energizing signal to the first electrode and the electrode arrangement and a second energizing signal to the second electrode and the electrode arrangement. A method for manufacturing an OLED array is provided.

IPC Classes  ?

  • H01L 51/40 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes

71.

Color organic light-emitting diode display device

      
Application Number 13524344
Grant Number 08564187
Status In Force
Filing Date 2012-06-15
First Publication Date 2012-12-20
Grant Date 2013-10-22
Owner Emagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Wake, Ronald W.

Abstract

A color display device that increases the efficiency of use of white light emitted from an organic light-emitting diode (OLED) in producing an improved color display. The device includes a plurality of color OLED display pixels, which include an OLED, a color filter layer, and a color conversion matrix sandwiched between the OLED and the color filter layer. The color filter layer has a plurality of color filter elements including a red, green and blue color filter element. The array of subpixels comprised in the color conversion matrix is composed of semiconductor nanocrystals uniformly dispersed in an organic binding material, which may be employed in either down-emitting or up-emitting color OLED display devices.

IPC Classes  ?

  • H01J 1/62 - Luminescent screensSelection of materials for luminescent coatings on vessels

72.

AMOLED microdisplay device with active temperature control

      
Application Number 13434893
Grant Number 09489887
Status In Force
Filing Date 2012-03-30
First Publication Date 2012-10-04
Grant Date 2016-11-08
Owner eMagin Corporation (USA)
Inventor
  • Wacyk, Ihor
  • Prache, Olivier

Abstract

An active-matrix organic light-emitting diode microdisplay device having a temperature control system including a temperature sensor and a control means for regulating the temperature of the OLED. The temperature is regulated by a bias transistor within the circuit, operating as a function of the temperature of the panel, such that low panel temperatures cause an increase in voltage of the bias transistor which draws a higher current through the top voltage drive transistor for self-heating the area surrounding the OLED.

IPC Classes  ?

  • G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
  • G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

73.

Method of manufacturing organic light emitting diode arrays and system for eliminating defects in organic light emitting diode arrays

      
Application Number 13484677
Grant Number 08944873
Status In Force
Filing Date 2012-05-31
First Publication Date 2012-09-27
Grant Date 2015-02-03
Owner eMagin Corporation (USA)
Inventor Ghosh, Amalkumar P.

Abstract

A method for manufacturing an organic light emitting diode (OLED) array is provided that includes applying an energizing signal to at least one of the OLED pixels in the array. The energizing signal exceeds a threshold level. The method also includes reducing the energizing signal and identifying an OLED in the array that continues to remain energized. The method further includes irradiating the identified OLED to degrade the organic material in the OLED. A method of performing quality control in a manufacturing process of an OLED array is provided. The method includes determining an intensity, a time and a wavelength of radiation sufficient to render an OLED of the OLED array inoperative by degrading organic material in the OLED. A system of performing quality control in a manufacturing process of an OLED array is provided. A computer-readable medium having stored thereon computer-executable instructions is provided.

IPC Classes  ?

  • H01J 9/50 - Repairing or regenerating used or defective discharge tubes, lamps or their salvageable components
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

74.

Compact eyepiece using an imersed field lens

      
Application Number 13106819
Grant Number 08456745
Status In Force
Filing Date 2011-05-12
First Publication Date 2012-05-31
Grant Date 2013-06-04
Owner EMAGIN CORPORATION (USA)
Inventor Weissman, Paul

Abstract

A first embodiment is a lens system having a plurality of refractive and reflective spherical elements that work as a magnifier to produce a distortion free, less than 1%, image with optical correction over a wide field of view. The system has at least one concave reflecting surface, and at least three convex refracting surfaces with the sign of the radius of one of the convex refracting surfaces being opposite of the sign of the radius of remaining two convex refracting surfaces. A second embodiment is a lens having a concave reflecting element which is on a substrate that is a negative lens by transmission with an index of refraction between 1.62.0 and a dispersion 49<νd>15. This is used in combination with at least 3 positive refracting surfaces with less dispersive power than the negative element and with the sign of the radius of one of the positive elements being opposite from the sign of the radius of the remaining positive elements.

IPC Classes  ?

  • G02B 27/14 - Beam splitting or combining systems operating by reflection only
  • G02B 17/00 - Systems with reflecting surfaces, with or without refracting elements

75.

Method of tuning display chromaticity by mixing color filter materials and device having mixed color filter materials

      
Application Number 13169862
Grant Number 09443913
Status In Force
Filing Date 2011-06-27
First Publication Date 2011-12-29
Grant Date 2016-09-13
Owner eMagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Ziesmer, Scott
  • Khayrullin, Ilyas

Abstract

A color display is provided that includes a light emitting sub-pixel and a filter layer including first and second color filter materials. The first color filter material is adapted to reduce transmittance of visible light outside a first transmittance spectrum corresponding to a first color, and the second color filter material is adapted to reduce transmittance of visible light outside a second transmittance spectrum corresponding to a second color. The second color is different than the first color. A color display having a white-balanced pixel is provided. A method of white-balancing a light emitting device is provided. A method of reducing unwanted light output due to electrical leakage is provided to fall below a pre-determined threshold. An opaque layer may be interposed between the sub-pixels and/or may frame illuminated areas of sub-pixels, and may be a combination of red, green, and/or a blue filter material.

IPC Classes  ?

  • H01J 9/00 - Apparatus or processes specially adapted for the manufacture of electric discharge tubes, discharge lamps, or parts thereofRecovery of material from discharge tubes or lamps
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

76.

Method of manufacturing organic light emitting diode arrays and system for eliminating defects in organic light emitting diode arrays

      
Application Number 12897837
Grant Number 08961254
Status In Force
Filing Date 2010-10-05
First Publication Date 2011-10-13
Grant Date 2015-02-24
Owner eMagin Corporation (USA)
Inventor Ghosh, Amalkumar P.

Abstract

A method for manufacturing an organic light emitting diode (OLED) array is provided that includes applying an energizing signal to at least one of the OLED pixels in the array. The energizing signal exceeds a threshold level. The method also includes reducing the energizing signal and identifying an OLED in the array that continues to remain energized. The method further includes irradiating the identified OLED to degrade the organic material in the OLED. A method of performing quality control in a manufacturing process of an OLED array is provided. The method includes determining an intensity, a time and a wavelength of radiation sufficient to render an OLED of the OLED array inoperative by degrading organic material in the OLED. A system of performing quality control in a manufacturing process of an OLED array is provided. A computer-readable medium having stored thereon computer-executable instructions is provided.

IPC Classes  ?

  • H01J 9/50 - Repairing or regenerating used or defective discharge tubes, lamps or their salvageable components
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

77.

Method for performing quality control on an organic light emitting diode device and a method for determining current leakage in an OLED sub-pixel

      
Application Number 12859657
Grant Number 08423309
Status In Force
Filing Date 2010-08-19
First Publication Date 2011-09-22
Grant Date 2013-04-16
Owner Emagin Corporation (USA)
Inventor
  • Ghosh, Amalkumar P.
  • Khayrullin, Ilyas I.

Abstract

A method is provided for performing quality control on an organic light emitting diode (OLED) pixel comprising three sub-pixels formed in parallel. A method is provided for determining an weighted average current leakage for three sub-pixels of an OLED pixel. The method includes selecting a total luminance level, determining a first current flowing when a first sub-pixel is energized causing the OLED pixel to emit light having 1/3 total luminance. The method includes determining a second current flowing when the first sub-pixel and a second sub-pixel are energized causing the OLED pixel to emit light having a 213 total luminance. The method includes calculating weighted average current leakage by multiplying the first current times two forming a first product, subtracting the second current from the first product forming a result, multiplying the result by two forming a second product, and dividing the second product by nine. A computer-readable medium is provided.

IPC Classes  ?

  • G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)

78.

Method of driving an organic light emitting diode (OLED) pixel, a system for driving an OLED pixel and a computer-readable medium

      
Application Number 12897413
Grant Number 08749456
Status In Force
Filing Date 2010-10-04
First Publication Date 2011-04-07
Grant Date 2014-06-10
Owner EMAGIN CORPORATION (USA)
Inventor
  • Wacyk, Ihor
  • Prache, Olivier

Abstract

A new drive scheme is provided for OLED displays that uses a pulsed drive mode. The pulsed drive mode results in a reduced duty cycle for pixel operation. The peak OLED current is increased correspondingly to maintain a constant average luminance over the frame period so that there is no brightness loss. The method, system and computer-readable medium according to the present innovation uses a blanking signal to set the OLED pixel to black by discharging a capacitive element prior to re-programming the OLED pixel during a next synchronization cycle. An organic light emitting diode (OLED) pixel system is provided. A computer-readable medium having stored thereon computer-executable instructions is provided.

IPC Classes  ?

  • G09G 3/30 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels

79.

Dual-mode AMOLED pixel driver, a system using a dual-mode AMOLED pixel driver, and a method of operating a dual-mode AMOLED pixel driver

      
Application Number 12859571
Grant Number 08766883
Status In Force
Filing Date 2010-08-19
First Publication Date 2011-03-31
Grant Date 2014-07-01
Owner eMagin Corporation (USA)
Inventor
  • Wacyk, Ihor
  • Prache, Olivier

Abstract

The present innovation provides a system for driving an OLED pixel that includes an arrangement for driving the OLED pixel in a voltage mode and an arrangement for driving the OLED pixel in a current mode. The system includes an arrangement for switching between the voltage mode and the current mode. When a selected luminance for the OLED pixel is high, the voltage mode may be selected by the switching arrangement, and when the selected luminance for the OLED pixel is low, the current mode may be selected by the switching arrangement. A driver circuit for an OLED pixel is provided. A method of driving an OLED pixel is provided that includes driving the OLED pixel in a voltage mode when a selected luminance for the OLED pixel is high. A computer-readable medium is provided having stored thereon computer-executable instructions that cause a processor to perform a method when executed.

IPC Classes  ?

  • G09G 3/30 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels
  • G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

80.

AMOLDED DIRECT VOLTAGE PIXEL DRIVE FOR MINIATURIZATION

      
Application Number US2007023053
Publication Number 2008/057372
Status In Force
Filing Date 2007-11-01
Publication Date 2008-05-15
Owner EMAGIN CORPORATION (USA)
Inventor Wacyk, Ihor

Abstract

The drive circuit for an OLED is designed for use with an external reference voltage source. The OLED is connected to the reference voltage source through a PMOS drive transistor. The circuit includes a data signal transmission gate responsive to a control signal for transmitting the data signal to the OLED. It also includes a storage capacitor and a second transistor. The capacitor is connected between the gate and the source of the drive transistor. The second transistor has an output circuit connected between the reference voltage source and the capacitor. The gate of the second transistor is operably connected to receive the control signal.

IPC Classes  ?

81.

Auto-calibrating gamma correction circuit for AMOLED pixel display driver

      
Application Number 11402092
Grant Number 08232931
Status In Force
Filing Date 2006-04-10
First Publication Date 2007-10-11
Grant Date 2012-07-31
Owner eMagin Corporation (USA)
Inventor
  • Wacyk, Ihor
  • Prache, Olivier

Abstract

A drive circuit is provided for an OLED in a pixel array. The circuit includes input voltage signal receiving means. Output voltage signal generating means are operably connected to the pixel diode. Means are provided for processing the input voltage signal to replicate the inverse IV characteristic of the pixel diode, to form the output voltage signal.

IPC Classes  ?

  • G09G 3/30 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels

82.

EMAGIN

      
Serial Number 75856770
Status Registered
Filing Date 1999-11-23
Registration Date 2004-03-23
Owner EMAGIN CORPORATION ()
NICE Classes  ?
  • 09 - Scientific and electric apparatus and instruments
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

[ Electronic field emitter panels, electronic field emitter light sources, electronic field emitter computer modules, ] organic light emitting diodes, organic light emitting displays, display-optic modules, headset mounted, direct view and optically-viewed displays and components therefor, lenses, driver circuitry for organic light emitting displays on silicon displays, and magnified microdisplays, and integrated circuits, all of the above sold individually and as component parts of handheld telecommunications devices, namely, telephones, cellular phones, radio phones, radio pagers, personal digital assistants and wireless computers Design of new systems for others in the fields of telecommunications, integrated circuits, optics, display and headset mounted displays