Ehwa Diamond Ind. Co., Ltd.

Republic of Korea

Back to Profile

1-9 of 9 for Ehwa Diamond Ind. Co., Ltd. Sort by
Query
Aggregations
IP Type
        Patent 8
        Trademark 1
Jurisdiction
        United States 5
        World 4
Date
2024 1
2022 1
Before 2020 7
IPC Class
B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades 5
B28D 1/12 - Saw blades specially adapted for working stone 2
B23D 49/06 - Hacksaw machines with straight saw blades for special use 1
B23D 51/12 - Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular partsCarrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for mounting straight saw blades or other tools for use with tools, dealt with in this subclass, which are connected to a carrier at both ends, e.g. bows adjustable in length or height 1
B23K 1/00 - Soldering, e.g. brazing, or unsoldering 1
See more
Status
Pending 1
Registered / In Force 8

1.

CUTTING TOOL FOR GANG SAW

      
Application Number 18254372
Status Pending
Filing Date 2021-12-16
First Publication Date 2024-02-01
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Park, Hee-Dong
  • Kim, Nam-Kwang
  • Kim, Doo-Hoe
  • Rhee, Dae-Yeon

Abstract

A cutting tool includes a blade formed so as to extend in the width direction or length direction of a workpiece; at least one cutting tip formed so as to protrude from the lower portion of the blade so as to cut the workpiece by reciprocating by means of a swinging motion; and a brazing part formed between the blade and the at least one cutting tip so as to silver-braze the blade and the at least one cutting tip. The brazing part includes a first silver solder layer; a metal sheet layer formed on the first silver solder layer and having a melting point that is higher than a silver brazing process temperature; and a second silver solder layer formed on the metal sheet layer.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B28D 1/12 - Saw blades specially adapted for working stone

2.

CUTTING TOOL FOR GANG SAW

      
Application Number KR2021019170
Publication Number 2022/139322
Status In Force
Filing Date 2021-12-16
Publication Date 2022-06-30
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Park, Hee-Dong
  • Kim, Nam-Kwang
  • Kim, Doo-Hoe
  • Rhee, Dae-Yeon

Abstract

A cutting tool for a gang saw is provided. The cutting tool of the present invention comprises: a blade formed so as to extend in the width direction or length direction of a workpiece; at least one cutting tip formed so as to protrude from the lower portion of the blade so as to cut the workpiece by reciprocating by means of a swinging motion; and a brazing part formed between the blade and the at least one cutting tip so as to silver-braze the blade and the at least one cutting tip. The brazing part comprises: a first silver solder layer; a metal sheet layer formed on the first silver solder layer and having a melting point that is higher than a silver brazing process temperature; and a second silver solder layer formed on the metal sheet layer, wherein, with respect to the left/right extending direction of the blade, the length of the metal sheet layer forming the brazing part is the same as the length of the cutting tip making contact with the brazing part, or is formed so as to be longer in the left/right direction.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B23K 1/00 - Soldering, e.g. brazing, or unsoldering

3.

Polishing pad

      
Application Number 29623145
Grant Number D0852601
Status In Force
Filing Date 2017-10-23
First Publication Date 2019-07-02
Grant Date 2019-07-02
Owner EHWA Diamond Ind. Co., Ltd. (Republic of Korea)
Inventor
  • Son, Jun Seok
  • Ahn, Jang Hyuk

4.

Stone cutting device

      
Application Number 14892659
Grant Number 09868226
Status In Force
Filing Date 2014-06-10
First Publication Date 2016-04-21
Grant Date 2018-01-16
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Rhee, Dae-Yeon
  • Kim, Nam-Kwang
  • Kim, Doo-Hoe
  • Park, Hee-Dong

Abstract

A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B23D 51/12 - Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular partsCarrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for mounting straight saw blades or other tools for use with tools, dealt with in this subclass, which are connected to a carrier at both ends, e.g. bows adjustable in length or height
  • B27B 3/38 - Spacing bars or spacing plates

5.

STONE CUTTING DEVICE

      
Application Number KR2014005083
Publication Number 2014/200245
Status In Force
Filing Date 2014-06-10
Publication Date 2014-12-18
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Rhee, Dae-Yeon
  • Kim, Nam-Kwang
  • Kim, Doo-Hoe
  • Park, Hee-Dong

Abstract

A stone cutting device is disclosed. A stone cutting device according to an aspect of the present invention is provided to cut a material to be cut by swinging multiple cutting tools by a predetermined angle. Each cutting tool comprises a blade extending in the longitudinal direction of the material to be cut and at least one cutting tip provided on an end of the blade to protrude in the width direction, the cutting tip reciprocating by means of swing movements, thereby cutting the material to be cut. The cutting device comprises a frame unit provided to couple the multiple cutting tools, to cause the cutting tools to reciprocate, and to separately adjust tension of respective cutting tools. The frame unit comprises an actuator for applying tension such that a load of 8-27 tons acts on the cutting tools.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades

6.

CUTTING TOOL AND CUTTING APPARATUS COMPRISING SAME

      
Application Number KR2014003970
Publication Number 2014/182024
Status In Force
Filing Date 2014-05-02
Publication Date 2014-11-13
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Park, Hee-Dong
  • Kim, Nam-Kwang

Abstract

A cutting tool and a cutting apparatus comprising the same are disclosed. A cutting tool according to an aspect of the present invention comprises: a blade extending in the longitudinal direction of a workpiece and being adapted to reciprocate so as to cut the workpiece; at least one cutting tip provided in one end of the blade, the cutting tip being formed to be projected in the width direction of the blade such that the workpiece is cut when the cutting tip comes into contact with the workpiece; and a cutting assistance unit provided in at least one side of the blade, the cutting assistance unit being formed correspondingly to the width of the cutting tip so as to prevent an undesirable movement of the blade within a cutting space formed by the cutting tip. The cutting apparatus comprising the cutting tool comprises: a frame unit provided in both sides of the cutting direction of the workpiece; and the cutting tool provided in one side of the frame unit to be reciprocatable by power transmitted from a driving unit so as to cut the workpiece.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B28D 1/12 - Saw blades specially adapted for working stone
  • B23D 49/06 - Hacksaw machines with straight saw blades for special use

7.

APPARATUS AND METHOD OF MANUFACTURING MICRO-NOTCHES AT THE EDGE LINE PORTION OF SCRIBING WHEEL USING ULTRAFAST LASER

      
Application Number KR2013002808
Publication Number 2013/151350
Status In Force
Filing Date 2013-04-04
Publication Date 2013-10-10
Owner
  • KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE (Republic of Korea)
  • EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Jeoung, Sae Chae
  • Lee, Heung Soon
  • Lee, Hyun Kyu
  • Kim, Soo Kwang

Abstract

An object of the present invention is to provide an apparatus and a method of manufacturing a scribing wheel, which is a tool used to cut a brittle material, including a plurality of micro-notches formed at a edge line portion thereof, and an apparatus and a method of manufacturing micro-notches at a edge line portion of a scribing wheel using an ultrafast laser, capable of implementing a non-contact type process by forming the micro-notches using the ultrafast laser.

IPC Classes  ?

8.

Pad conditioner having reduced friction and method of manufacturing the same

      
Application Number 13081981
Grant Number 10478941
Status In Force
Filing Date 2011-04-07
First Publication Date 2011-10-13
Grant Date 2019-11-19
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
Inventor
  • Yoon, So Young
  • Lee, Joo Han
  • Lee, Jong Jae

Abstract

This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.

IPC Classes  ?

  • B24B 53/12 - Dressing toolsHolders therefor
  • B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for
  • B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools

9.

EHWA

      
Serial Number 74581784
Status Registered
Filing Date 1994-10-04
Registration Date 1996-10-01
Owner EHWA DIAMOND IND. CO., LTD. (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

power-operated industrial diamond and cubic boron nitride tools for stone and metal-working, namely saws, cutters, grinding plates, wheels, drills, bits, reamers, bites, and dressers