A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, dielectric coolant. The first bypass can include a first valve configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second valve configured to regulate a second bypass flow of coolant through the second bypass.
Computer hardware can be adapted for fluid cooling. Computer hardware can include a microprocessor with an integrated circuit. The integrated circuit can have a two-dimensional and/or three-dimensional circuit architecture. A heat sink module can be placed in thermal communication with the microprocessor. The heat sink module can include an inlet chamber and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to remove heat from the microprocessor while operating.
A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
4.
METHOD OF ABSORBING HEAT WITH SERIES-CONNECTED HEAT SINK MODULES
A method of cooling multiple processors of an electronic device can employ a two-phase cooling system with series-connected heat sink modules. A flow of dielectric single-phase liquid coolant can be provided to a first heat sink module on a first processor. Within the first heat sink module, a first amount of heat can be transferred from the first processor to the liquid coolant resulting in vaporization of a first portion of liquid coolant, thereby changing the flow to two-phase bubbly flow as heat is absorbed across the heat of vaporization of the coolant. The two-phase bubbly flow can then pass from the first heat sink module to a second heat sink module mounted on a second processor. Within the second module, heat transfer from the second processor to the coolant can result in vaporization of a second portion of liquid coolant, thereby increasing vapor quality of the two-phase bubbly flow.
F28F 25/10 - Component parts of trickle coolers for feeding gas or vapour
F28F 99/00 - Subject matter not provided for in other groups of this subclass
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
5.
METHOD OF CONDENSING VAPOR IN A TWO-PHASE COOLING SYSTEM
A method of condensing vapor present in two-phase bubbly flow within a cooling apparatus can include mixing a first flow of coolant containing two-phase bubbly flow with a second flow of coolant containing single-phase liquid flow. The two-phase bubbly flow can have a first flow quality greater than zero and can include vapor bubbles dispersed in liquid coolant. The single-phase liquid flow can have a flow quality of zero. Mixing the first flow of coolant and the second flow of coolant within the cooling apparatus can result in heat transfer from the first flow of coolant to the second flow of coolant and can cause vapor bubbles within first flow of coolant to condense, thereby providing a third flow of coolant with a third flow quality that is less than the first flow quality.
A method of providing stable pump operation in a two-phase cooling system is disclosed. The method can include providing a cooling system with a reservoir fluidly connected to a pump. The reservoir can include a liquid-vapor interface separating an amount of vapor coolant from an amount of substantially subcooled liquid coolant. The method can include delivering two-phase bubbly flow to an upper portion of the reservoir above the liquid-vapor interface. The two-phase bubbly flow can include vapor bubbles of coolant dispersed in liquid coolant. The vapor bubbles can condense upon passing through the liquid-vapor interface and interacting with and transferring heat to subcooled liquid coolant in the reservoir. A continuous outlet flow of single-phase liquid coolant can be delivered from the reservoir to the pump, thereby ensuring stable pump operation despite the presence of two-phase flow in portions of the cooling system.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25D 17/02 - Arrangements for circulating cooling fluidsArrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
A heat sink for cooling a heat source can include a thermally conductive base member configured to mount on, or be placed in thermal communication with, a heat source. The heat sink can include a heat sink module mounted on the thermally conductive base member. The heat sink module can include an inlet chamber formed within the heat sink module and an outlet chamber formed at least partially in the heat sink module and bounded by the surface of the thermally conductive base member. The heat sink module can include a first plurality of orifices extending from the inlet chamber to the outlet chamber. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the surface of the thermally conductive base member when pumped coolant is provided to the inlet chamber.
A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir and can include a heat exchanger and a second pump. The second pump can circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir. A manifold can distribute coolant within the two-phase cooling system. The manifold can include a bypass fluidly connecting an inlet chamber to an outlet chamber. A valve can be installed in the bypass and can control a flow of pressurized coolant to maintain a desired pressure differential between the inlet and outlet chambers. The valve can be a differential pressure bypass valve.
A heat exchanger can include a first helical gas passageway extending from a first side of the heat exchanger to a second side of the heat exchanger. The first helical gas passageway can extend along and wrap around a first liquid passageway within the heat exchanger. A second helical gas passageway can extend from the first side of the heat exchanger to the second side of the heat exchanger. The second helical gas passageway can extend along and wrap around a second liquid passageway within the heat exchanger. Along a length of the first helical gas passageway, the first helical gas passageway can merge with the second helical gas passageway and then subsequently separate from the second helical gas passageway. The heat exchanger can be a liquid-to-gas counter-flow heat exchanger suitable for a wide variety of applications, including computer cooling.
F28D 1/04 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid with tubular conduits
10.
HEAT EXCHANGER WITH INTERCONNECTED FLUID TRANSFER MEMBERS
A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.
F28F 1/36 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely the means being helically-wound fins or wire spirals
A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted on the heat providing surface and when pressurized coolant is delivered to the inlet chamber.
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
09 - Scientific and electric apparatus and instruments
Goods & Services
Cooling systems for electronic devices, namely, computer
processors, computer memory, and power supplies; components,
assemblies, and systems for cooling data centers, namely,
heat sinks.
09 - Scientific and electric apparatus and instruments
Goods & Services
Cooling systems for electronic devices, namely, computer
processors, computer memory, and power supplies; components,
assemblies, and systems for cooling data centers, namely,
heat sinks.
