Variation in thickness of an uncured resin layer during transfer in imprinting molding is reduced. A method for manufacturing an optical member includes a resin supply step of supplying an uncured resin composition 600 to a surface of a base material 500 of the optical member, and a transfer step of transferring a micro concave-convex structure of a mold 10 to the uncured resin composition 600. The mold 10 has a laminate structure in which a mold substrate 12, an adhesive film 14, and a film mold 16 having the micro concave-convex structure are laminated in this order. The mold substrate 12 has a thickness of more than or equal to 0.5 mm and a shore A hardness of more than or equal to 90 degrees. The adhesive film 14 is a film having adherence on both surfaces. An adhesive force of a surface of the adhesive film 14, the surface facing the film mold 16, is smaller than an adhesive force of a surface facing the mold substrate 12.
A fuse element includes: a first element made of silver or copper, or an alloy comprising silver or copper as a main component thereof; a second element made of silver or copper, or an alloy comprising silver or copper as a main component thereof; and a connecting metal composed of tin or an alloy comprising tin as a main component thereof, connecting an end of the first element to an end of the second element.
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/042 - General constructions or structure of high voltage fuses, i.e. above 1,000 V
H01H 85/11 - Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
H01H 85/12 - Two or more separate fusible members in parallel
H01H 85/38 - Means for extinguishing or suppressing arc
Provided is a laminate which has heat insulation properties, while having excellent optical characteristics and excellent high-frequency radio wave transmissivity. The laminate comprises a glass base material and a transparent resin layer that is provided on the glass base material, and is characterized in that: the transparent resin layer contains a phosphor having an inorganic substance; and the phosphor has a volume average particle diameter of 10-400 nm.
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C03C 4/12 - Compositions for glass with special properties for luminescent glassCompositions for glass with special properties for fluorescent glass
C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
C03C 27/06 - Joining glass to glass by processes other than fusing
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
E04B 1/76 - Heat, sound or noise insulation, absorption, or reflectionOther building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
E04C 2/26 - Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups , , , or of materials covered by one of these groups with a material not specified in one of these groups
Provided is a photocurable composition that, when manufacturing an image display device having a light-shielding part, does not require thermal curing, exhibits excellent curability of the light-shielding part, and is less affected regarding turbidity and/or coloration in a visible-light region. This photocurable composition is characterized by comprising a photocurable compound, a photopolymerization initiator, and a phosphor having an inorganic substance, and is characterized in that the phosphor has a volume average particle diameter of 10-400 nm.
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 20/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
A mold production method includes a signal generation step of generating a gradation signal corresponding to each cutting hole configuring a drawing target on a mold base material, a control waveform generation step of generating, based on the gradation signals corresponding to the cutting holes, a control waveform indicating a movement pattern of a cutting blade (12), and a cutting step of moving the cutting blade (12) according to the control waveform to cut the mold base material. In the control waveform generation step, a control waveform is generated for each group of cutting holes not overlapping each other among cutting holes aligned in one direction, based on the gradation signals corresponding to the cutting holes constituting each group, and in the cutting step, the cutting blade (12) is moved according to each control waveform generated for the groups to cut the mold base material to a predetermined depth.
Provided is a light curing acrylic resin for imprinting in which an uncured resin composition has a low viscosity and in which a resin composition after curing is excellent in heat tolerance. The light curing acrylic resin for imprinting is a light curing acrylic resin for imprinting containing a photopolymerization component. The photopolymerization component contains a resin (A), and resin (B). The resin (A) is (octahydro-4,7-methano-1H-indenediyl)bis(methylene) diacrylate. The resin (B) is a bifunctional acrylate monomer having a viscosity of less than or equal to 10 mPa·s at 25° C. A content of the resin (A) in a whole of the photopolymerization component is more than or equal to 20 mass % and less than or equal to 40 mass %. A total content of the resin (A) and the resin (B) in the whole of the photopolymerization component is less than or equal to 70 mass %.
This conductive film achieves high capturability and stable conduction characteristics of conductive particles having a large particle diameter and suppresses resin protrusion and blocking even when slitted. The conductive film has a structure in which conductive particles having an average particle diameter of 10 µm or more are disposed in a laminate of a first insulating resin layer and a second insulating resin layer. In this conductive film, 90% or more of the conductive particles on a number basis are arranged so as to be separated from each other, and a resin flow amount difference between the first insulating resin layer and the second insulating resin layer is 0.07-0.09, and/or the viscosity ratio at 80°C of the first insulating resin layer and the second insulating resin layer is less than 2.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
8.
WIRE GRID POLARIZING ELEMENT, METHOD FOR MANUFACTURING WIRE GRID POLARIZING ELEMENT, PROJECTION DISPLAY DEVICE, AND VEHICLE
Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21. A coverage rate (Rc) of the side surface of the ridge portion 22 obtained by the functional film 30 is more than or equal to 30% and less than or equal to 70%. At least a portion of the ridge portion 22 covered by the functional film 30 is inclined at an inclination angle (α) of more than 0° and less than or equal to 15° with respect to a direction normal to the substrate 10.
Disclosed is an optical multilayer body, wherein a transparent substrate, a hard coat layer, an adhesion layer, an optical function layer, and an antifouling layer are stacked in that order, and wherein, when the optical multilayer body is subjected to a sliding test of 500 reciprocations at a load of 250 g using a sliding tool having a Shore D hardness of 40 and a diameter of 0.8 mm, an absolute value of a change amount Δb* in a b* value in an L*a*b* color system before and after sliding at a sliding portion is 1.9 or less.
This photocurable acrylic resin for imprinting comprises a photopolymerizable component, wherein the photopolymerizable component comprises a resin (A) and a resin (B), the resin (A) is a monofunctional acrylate monomer having a phenyl group and/or a benzyl group, the resin (B) is a difunctional compound, the content of the resin (A) is 20 mass% to 42 mass% with respect to the total amount of the photopolymerizable component, and the content of the resin (B) is 43 mass% to 66 mass% with respect to the total amount of the photopolymerizable component.
A protection element (1) comprises: an insulating substrate (2); a first electrode (11) and a second electrode (12); a first lower electrode (21) and a second lower electrode (22); a heat-generating body (3); a first heat-generating body electrode and a second heat-generating body electrode; an insulating member (5); a third lower electrode (13); and a fusible conductor (4). In a plan view seen from a first surface (2a) side of the insulating substrate (2), the fusible conductor (4) is connected to the first electrode (11) and the second electrode (12) in a manner of bridging between the first electrode (11) and the second electrode (12). In the plan view, a portion of the heat-generating body (3), a portion of the first electrode (11), and a portion of the fusible conductor (4) are provided overlapping each other.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
A method for manufacturing an image display device capable of suppressing lifting phenomenon including: step (A): applying a photocurable resin composition to surfaces of a light transmitting optical member or an image display member forming a photocurable resin composition layer; step (B): irradiating the photocurable resin composition layer with light to form a pre-cured resin layer; step (C): bonding the image display member and the light transmitting optical member via the pre-cured resin layer; step (D): obtaining an image display device by irradiating light to the pre-cured resin layer to final-cure the pre-cured resin layer, thereby laminating the image display member and the light transmitting optical member via the light transmitting cured resin layer.
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
The present invention provides a structure that achieves durability, conductivity, and quantum efficiency at the same time at high levels. This layered structure is characterize by comprising a substrate and a high-density particle layer positioned on the substrate, and is also characterized in that: the high-density particle layer comprises nanoparticles in each of which an inorganic film is formed on the surface; the nanoparticles have a particle diameter of 1 nm to 50 nm inclusive; the high-density particle layer has a filling rate of the nanoparticles per unit volume of 30 vol% to 80 vol% inclusive; the inorganic film has a thickness of 0.1 nm to 5 nm inclusive; the energy level at the upper end of a valence band of the inorganic film is the same as or lower than the energy level at the upper end of a valence band of the nanoparticles; and the energy level at the lower end of a conduction band of the inorganic film is the same as or higher than the energy level at the lower end of a conduction band of the nanoparticles.
H05B 33/14 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material
B32B 5/16 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer formed of particles, e.g. chips, chopped fibres, powder
H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
H10F 30/00 - Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
H10K 50/115 - OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
A reflective optical unit (1) according to the present disclosure includes a substrate (40) and a light-emitting element (10) and light-receiving element (30) located on the substrate (40). The difference between a first height (H1) of a first surface (S1) of the light-emitting element (10) relative to the substrate (40), the first surface (S1) facing away from the substrate (40), and a second height (H2) of a second surface (S2) of the light-receiving element (30) relative to the substrate (40), the second surface (S2) facing away from the substrate (40), is equal to or less than the thickness of the light-emitting element (10), and the light-emitting element (10) has a thin film shape. The reflective optical unit (1) is capable of reducing signal variations.
G01D 5/347 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using optical means, i.e. using infrared, visible or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
The present invention provides a protective element capable of ensuring insulation after fusing of a fuse element. This protective element comprises an insulating substrate 2, a heating element 6 provided on the insulating substrate 2, an insulating layer 7 covering the heating element 6, an intermediate electrode 4 provided on the surface of the insulating substrate 2 and electrically connected to the heating element 6, a fuse element 3 mounted on the intermediate electrode 4, and a cap member 5 covering a surface 2a side of the insulating substrate 2. The cap member 5 is a molded article of a resin composition containing an insulating inorganic filler, the insulating inorganic filler is a glass fiber milled fiber, and the resin composition has a glass fiber milled fiber filling amount between 35 wt% and 45 wt%, inclusive.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
An optical laminate 102 comprises in the following order: a transparent base material 11; a hard coat layer 12; an adhesion layer 13 which is composed of a sputtered film; an optical function layer 14 in which high refractive index layers that are each composed of a sputtered film and low refractive index layers that have a refractive index lower than the high refractive index layers are alternately laminated; and an antifouling layer 15. The hard coat layer 12 contains silica particles (A) that have an average particle diameter of 65 nm or more, and the optical laminate satisfies the condition 1 and the condition 2 described below. Condition 1: The ratio ((A)/(B)) of the Martens hardness (A) on the optical laminate antifouling layer side to the Martens hardness (B) on the hard coat layer side of a laminate having only the transparent base material and the hard coat layer is 3.65 or less. Condition 2: Using a friction testing machine that uses steel wool in accordance with JIS L0849, the difference in contact angle with respect to water before friction and after friction, in which the steel wool is subjected to 200 horizontal reciprocating motions, is 20° or less.
The present invention provides an optical coupling element that improves optical coupling efficiency between an optical fiber and an optical waveguide on an optical integrated circuit. An optical coupling element 100 comprises: a substrate 140; a pair of first optical waveguides 110 disposed in a first direction D1 on the substrate 140; a second optical waveguide 120 disposed in the first direction D1 between the pair of first optical waveguides 110; and a cladding 130 covering the pair of first optical waveguides 110 and the second optical waveguide 120 on the substrate 140. The second optical waveguide 120 is disposed in a manner that allows for optical coupling with the first optical waveguides 110. Each of the pair of first optical waveguides 110 has: a first core 111 disposed in a manner that allows for optical coupling with the second optical waveguide 120; and a second core 112 which is laid above and spaced apart from the first core 111 in a second direction D2 intersecting the first direction D1, and which contributes to a light confinement structure when optically coupled with the first core 111.
A protective element includes: an insulating substrate; a heating element provided on a front surface side of the insulating substrate; an insulating layer covering the heating element; an intermediate electrode provided on the insulating layer; a fuse element mounted on the intermediate electrode; a cap member covering the front surface of the insulating substrate; and a flux. The cap member includes at least one protrusion that retains the flux and is provided facing the intermediate electrode. At least one end portion of the intermediate electrode extends beyond the fuse element. The at least one protrusion is provided at a position facing the fuse element which is mounted on the intermediate electrode and at a position facing the at least one end portion of the intermediate electrode at which the fuse element is not mounted, and retains the flux on the fuse element and at the end portion.
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
Provided are a measurement method and a measurement system, whereby the concentration of each nucleotide constituting RNA can be easily measured. A nucleotide concentration measurement method according to the present invention is for measuring the concentration of each nucleotide constituting RNA, and comprises: a light irradiation step for irradiating with light a sample containing RNA or a sample containing each nucleotide derived from RNA, and obtaining actual measurement spectral data related to emitted light; and a calculation step for deriving, for the actual measurement spectral data, the concentration of each nucleotide by carrying out a calculation using reference spectral data related to the emitted light for each concentration of each nucleotide, the reference spectral data being acquired in advance.
G01N 21/33 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
C12M 1/00 - Apparatus for enzymology or microbiology
C12Q 1/68 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions involving nucleic acids
20.
JOINED BODY PRODUCTION METHOD, JOINED BODY, AND HOT-MELT ADHESIVE SHEET
A joined body production method includes subjecting a first electronic component and a second electronic component to thermocompression bonding via a hot-melt adhesive sheet. The hot-melt adhesive sheet includes a binder and solder particles. The binder includes a crystalline polyamide resin having a carboxyl group. A melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding. When melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10.
Provided is a thermosetting adhesive composition having a low dielectric constant and a low dielectric loss tangent even after thermosetting and having favorable processability before thermosetting. The present technique is a thermosetting adhesive composition for bonding substrates together, the thermosetting adhesive composition comprising, with respect to 100 parts by mass of the total amount of the thermosetting adhesive composition: 30-60 parts by mass of a styrene-based elastomer; 20-40 parts by mass of a hydrocarbon resin having a ring structure; (A) a modified polyphenylene ether resin having a radically polymerizable group at the molecular terminal thereof and (B) a polybutadiene and/or polyisoprene having a weight-average molecular weight of 10,000-50,000, as crosslinking components; a radical polymerization initiator; and an epoxy resin, wherein said thermosetting adhesive composition may further contain an epoxy resin curing agent, and the total content of the radical polymerization initiator, the epoxy resin, and the epoxy resin curing agent is at most 10 parts by mass.
A filler-containing film having a filler-holding insulating resin layer and a filler is provided with recesses and protrusions on one surface of the filler-holding insulating resin layer. At least one filler group composed of a plurality of fillers is disposed on the protrusions, and the width of the protrusions in the film transverse direction is less than the width of the filler-holding insulating resin layer, preferably no greater than 95% of said width.
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
24.
THERMALLY-CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING THERMALLY-CONDUCTIVE SHEET
A thermally-conductive sheet according to the present invention comprises a metal layer and a plurality of protrusions on at least one first surface of the metal layer, wherein the protrusions contain sinterable metal particles.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
B82Y 40/00 - Manufacture or treatment of nanostructures
This protection device (1) comprises: a heat generating substrate (10) having an insulating substrate (11), a heat generating body (12) formed on the insulating substrate (11), a first connection electrode (14) and a second connection electrode (15) formed on the surface of the insulating substrate (11) and electrically connected to the heat generating body (12), and an end surface electrode (16) formed on the end surface of the insulating substrate (11) and not electrically connected to the heat generating body; a first power supply member (21) connected to the first connection electrode (14) and a second power supply member (22) connected to the second connection electrode (15); a fusible conductor (30) connected to the end surface electrode (16); a first terminal (41) and a second terminal (42) connected to both ends of the fusible conductor (30); and a case (50) that accommodates the heat generating substrate (10), the fusible conductor (30), a portion of the first power supply member (21), at least a portion of the second power supply member (22), a portion of the first terminal (41), and a portion of the second terminal (42).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
26.
THERMALLY-CONDUCTIVE SHEET AND THERMALLY-CONDUCTIVE SHEET PRODUCTION METHOD
This thermally-conductive sheet includes a metal layer, a plurality of metal protrusions on at least a first surface of the metal layer, and a low-temperature sintering material on the metal protrusions. The area ratio of the plurality of metal protrusions to the first surface is 20%-80%.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
27.
THERMALLY-CONDUCTIVE SHEET AND THERMALLY-CONDUCTIVE SHEET PRODUCTION METHOD
This thermally-conductive sheet includes: a metal layer; and a plurality of protrusions having thermal conductivity on at least a first surface of the metal layer. When a contact area of the protrusions arranged in a central portion having an area of 1/2 of the first surface and being centered on the centroid of the planar shape of the first surface is defined as Ac, and a contact area of the protrusions arranged in a peripheral portion that is a portion other than the central portion of the first surface is defined as Ap, a value obtained by dividing Ac by Ap (Ac/Ap) is 1.2-10.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
B82Y 40/00 - Manufacture or treatment of nanostructures
Provided is an antireflective film 1 comprising an optical functional layer 11 formed of resin, wherein the optical functional layer 11 has a fine uneven structure 12 including projections 13 or recesses 14 arranged at a pitch equal or inferior to the wavelength of visible light, the indentation elastic modulus of the optical functional layer 11 is 130 MPa or more, and the water absorption rate of the optical functional layer 11 is 11 mass % or more.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
A mask and a method for manufacturing the mask with excellent processability and transferability of individualized pieces, as well as a method for manufacturing a display device and a display device. By using a mask having a predetermined shape of a light-shielding portion that blocks laser light within an opening that transmits laser light, laser light is irradiated from the base material side to the curable resin film formed on the base material to remove the curable resin film in the irradiated portion, thereby forming individualized pieces of a predetermined shape composed of a curable resin film with a reaction rate of 25% or less on the base material. This allows for excellent workability and transferability of the individualized pieces, thereby improving tact time.
H10H 29/02 - Manufacture or treatment using pick-and-place processes
H10H 29/34 - Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
Provided is an antireflective film 1 comprising an optical functional layer 11 formed of resin, wherein the optical functional layer 11 has a fine uneven structure 12 including projections 13 or recesses 14 arranged at a pitch equal or inferior to the wavelength of visible light, the indentation elastic modulus of the optical functional layer 11 is 45 MPa or more, the water absorption rate of the optical functional layer 11 is 11 mass % or more, and the water contact angle of the surface of the optical functional layer 11 is 65° or more.
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
A linear Fresnel lens 1 comprises a substrate 2 and a linear Fresnel lens structure 3 formed on a surface on at least one side of the substrate 2. The linear Fresnel lens structure 3 includes a plurality of Fresnel lens surfaces 4 extending in an X direction and arranged in a Y direction, and a surface relief structure 10 formed on a riser surface 5 connecting adjacent Fresnel lens surfaces 4, 4 in the Y direction. The surface relief structure 10 has a plurality of protrusions 12 repeatedly provided on the riser surface 5 at a predetermined pitch P in the X direction. Each protrusion 12 includes a first diffusion surface 14 that is connected to an upper edge 4a of one first Fresnel lens surface 4 of the adjacent Fresnel lens surfaces 4, 4 in the Y direction and is inclined with respect to an XY plane, and a second diffusion surface 16 connecting a lower edge 4b of the other second Fresnel lens surface 4 to the first diffusion surface 14.
Provided is a reel member which can be wound at an optimum winding core diameter even when adhesive films having different lengths are wound thereon. A reel member comprises: a circular winding core 3; a disk-like core ring 6 that is detachably fitted to the outer circumference of the winding core 3 and that has a fitting hole 6a to which the winding core 3 fits; and a pair of reel flanges 4A, 4B provided on both sides of the winding core 3. An engagement recess 8 is provided to the outer circumferential surface of the winding core 3. An engagement projection 9 that is to be engaged with the engagement recess 8 is provided on the inner circumferential surface of the fitting hole 6a. By engaging the engagement recess 8 with the engagement projection 9, the core ring 6 is engaged with the winding core and rotation of the core ring 6 becomes restricted.
This method for manufacturing a laminate comprises the steps of: sandwiching and heating, between a substrate and an opposite substrate, a heat conductive sheet having a metal layer and a plurality of metal protrusions on at least a first surface of the metal layer; and filling the space between the plurality of metal protrusions with a filler and curing the filler.
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
Provided are: an image display device with which it is possible to make visibility of a boundary between a light-shielding layer 6 and an image display area 3 more seamless when a display is turned off, and to maintain luminance of the image display area 3 when the display is turned on; and a method for manufacturing the image display device. An image display device 1 comprises a cover panel 2, an image panel 4 having an image display area 3 and a non-display area 9, a light-shielding layer 6 provided at a position corresponding to a peripheral edge of the non-display area 9 of the cover panel 2, and an adhesive layer 5 that joins the light-shielding layer 6 side of the cover panel 2 and the image panel 4. The adhesive layer 5 is provided with a transparent adhesive layer 7 provided at a position corresponding to the image display area 3, and a colored layer 8. The colored layer 8 is in contact with the light-shielding layer 6 and the transparent adhesive layer 7, is provided surrounding the transparent adhesive layer 7, and has a higher transmittance for light having a wavelength of 550 nm than the light-shielding layer 6 and a lower transmittance for light having a wavelength of 550 nm than the transparent adhesive layer 7.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
H10K 71/13 - Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
35.
IMAGE DISPLAY DEVICE AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE
Provided are: an image display device that is capable of making the visibility of a boundary between a light-blocking layer 6 and an image display region 3 more seamless when a display is turned off and maintaining the luminance of the image display region 3 when the display is turned on; and a method for manufacturing the image display device. An image display device 1 comprises: a cover panel 2; an image panel 4 that has an image display region 3 and a non-display region 9; a light-blocking layer 6 that is provided at a position on the cover panel 2 corresponding to a peripheral edge of the non-display region 9; and an adhesive layer 5 that joins the light-blocking-layer 6 side of the cover panel 2 and the image panel 4. The adhesive layer 5 is provided with: a first adhesive layer 7 that is provided at a position corresponding to the image display region 3 and exhibits transmittance with respect to light at a wavelength of 550 nm such that the color of the image panel 4 when turned off is similar to the color of the light-blocking layer 6; and a second adhesive layer 8 that is in contact with the light-blocking layer 6 and the first adhesive layer 7, is provided around the first adhesive layer 7, and is such that the transmittance thereof with respect to light at a wavelength of 550 nm is higher than that of the light-blocking layer 6 and is lower than that of the first adhesive layer 7.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
H10K 71/13 - Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
36.
DISPLACEMENT SENSOR AND METHOD FOR MANUFACTURING DISPLACEMENT SENSOR
This displacement sensor comprises a first member, a second member that is provided on the first member and has an opening, a laser element that is provided on an upper surface of the first member in the opening and emits laser light, a mirror that is provided on a side surface of the opening and reflects the laser light, and a first light detector that receives reflected light resulting from the laser light reflected by the mirror being reflected by an object, wherein the first member and the second member are separate members.
G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H01S 5/02255 - Out-coupling of light using beam deflecting elements
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
Provided is a photomixer capable of achieving at least one of reduced size and increases output of an electric signal. A photomixer 10 according to the present disclosure comprises a light receiving unit 11 that receives incident light and converts the light into an electric signal having a predetermined frequency, an amplification unit 12 that amplifies the electric signal output from the light receiving unit 11, and a coaxial connector 13 that receives and outputs the electric signal amplified by the amplification unit 12.
H10F 30/20 - Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
A protective element includes: a fuse element configured to be energized in a first direction, which is a direction from a first end portion of the fuse element to a second end portion of the fuse element; a first terminal electrically connected to the first end portion; a second terminal electrically connected to the second end portion; a case made of an insulating material, having therein a housing portion storing the fuse element, and exposing a portion of the first terminal and a portion of the second terminal to an outside of the case; and a cover made of an insulating material having a tube shape, covering a lateral face along the first direction of the case, and exposing a portion of the first terminal from a first end of the cover, and exposes a portion of the second terminal from a second end of the cover.
H01H 85/175 - Casings characterised by the casing shape or form
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/08 - Fusible members characterised by the shape or form of the fusible member
H01H 85/17 - Casings characterised by the casing material
39.
METHOD FOR MANUFACTURING INDIVIDUALIZED-PIECE-FILM AND INDIVIDUALIZED-PIECE-FILM, AND METHOD FOR MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE
A method for manufacturing an individualized-piece-film that can obtain excellent workability of individualized pieces, an individualized-piece-film, and a display device. The method irradiates a laser light from a base material side to an anisotropic conductive film formed on a base material to remove the anisotropic conductive film in the irradiated area (removal portion), thereby forming individualized pieces of a predetermined shape. The thickness of the anisotropic conductive film is 1 μm or more and 10 μm or less, the melt viscosity of the anisotropic conductive film at 30° C. is 2,000 Pa*s or more and 800,000 Pa*s or less, and 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
This displacement sensor comprises: a first member having a recess in the upper surface thereof; a second member provided in a lamination direction of the first member; a laser element that is provided in the recess and emits laser light; a mirror which is provided on a side surface of the recess, and on which the laser light is incident at an incidence angle of less than 45°, and which reflects the laser light; a lens that is provided on the second member and on which the reflected laser light is incident; and a first photodetector that receives reflected light obtained by reflection, by an object, of the laser light transmitted through the lens. Between the first member and the second member in a first region on the opposite side of the laser element with respect to the mirror when viewed from the lamination direction, a first gap that is recessed to the first region side from the side surface of the recess and is connected to the recess is provided.
G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H01S 5/02255 - Out-coupling of light using beam deflecting elements
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
41.
METHOD FOR PRODUCING METAL FOIL, AND METAL FOIL FOR THERMALLY CONDUCTIVE MATERIAL
This method for producing metal foil involves a step for forming metal foil on a resin base material having a flat surface with an arithmetic average roughness Ra of 50 nm or less, and a step for removing the resin base material to produce metal foil, wherein the arithmetic average roughness Ra of the metal foil is 50 nm or less.
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
There is provided a substrate for an inspection device. The substrate has an average thickness of 250 μm or greater and 350 μm or less, and a density of 0.25×106 g/m3 or greater and 0.40×106 g/m3 or less.
Provided is a smart card that can improve the adhesive strength of the IC chip module even under low pressure, and can prevent deformation of the card by increasing the flowability of the conductive adhesive. The smart card includes a card body 2 with an antenna coil 3 built in, and an IC chip module 4 provided with an antenna connection terminal 5 for conductive connection with the antenna coil 3, the IC chip module 4 being housed in an accommodating recess 6 in the card body 2, wherein the antenna coil 3 and the antenna connection terminal 5 are conductively connected via a conductive adhesive 9 in which conductive particles 8 are blended with binder resin 7, and the antenna connection terminal 5 has an opening 10 with a width larger than the average particle diameter of the conductive particles 8.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B42D 25/20 - Information-bearing cards or sheet-like structures characterised by identification or security featuresManufacture thereof characterised by a particular use or purpose
The present invention provides an anti-reflective black paint composition having a favorable anti-reflective property, particularly in the infrared region used in LiDAR devices and the like, and having excellent adhesion to a housing of the above-mentioned devices mainly composed of aluminum. Provided is an anti-reflective black paint composition containing: a solvent; an epoxy resin; a cationic thermal reaction initiator; a black pigment; and a silica filler, wherein the silica filler includes an air layer therein, and when made into a cured dry paint coat, a reflectance for light having a wavelength of 1,500 nm is 2.5% or less in total light reflectance measurement at an angle of incidence of 8°.
The present invention provides a conductive-particle-containing hot melt adhesive sheet, a smart card manufacturing method, and a smart card, with which it is possible to obtain, with high production efficiency, an excellent adhesive force. This conductive-particle-containing hot melt adhesive sheet (1) comprises: a binder (2) containing a crystalline polyamide resin, a crystalline polyester resin, and a crystalline polyurethane resin; and conductive particles (3), the crystalline polyurethane resin content of the binder (2) being 5 mass% to less than 75 mass%, and the melt viscosity of the binder (2) at 155-170℃ being 5,000-50,000 Pa･s.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
C09J 177/00 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chainAdhesives based on derivatives of such polymers
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
H01B 1/20 - Conductive material dispersed in non-conductive organic material
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
46.
ALIGNMENT METHOD, MANUFACTURING METHOD, LITHOGRAPHY METHOD, ALIGNMENT DEVICE, AND PROGRAM
An alignment method according to an embodiment of the present invention includes: laminating a first object on which a first array body is formed and a second object on which a second array body having a first periodic structure is formed; irradiating the laminated first object and second object with light; detecting a signal of the light transmitted through each of the first array body of the first object and the second array body of the second object; and calculating positional deviation of the laminated first object and second object on the basis of a plurality of the signals. The first array body is formed on any one surface of the first object, and the second array body is formed on one of a front surface and a back surface of the second object that does not face the first object.
The present invention provides a film-like solder connection material which is capable of suppressing scattering of a solder and has good handling properties. This solder connection material 21 contains a film-forming resin, a liquid epoxy resin, a thermal curing agent, a solder particle 20, and a flux component, and has a maximum melt viscosity at 170°C or more of 40,000 Pa∙s or less. It is preferable that the arithmetic average of the weight average molecular weight of the film-forming resin is 10,000-20,000.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
An optical coupling element (1) according to the present invention comprises: a substrate (10); a cladding (20) that is superposed on the upper surface of the substrate; and an optical waveguide (30) that is embedded in the cladding and is disposed on one surface of the substrate. The optical waveguide (30) has two long-axis optical waveguides (31, 33) that are at a distance from each other and extend in parallel to each other, and a central optical waveguide (32) that is disposed between the two long-axis optical waveguides. The long-axis optical waveguides (31, 33) are each provided with a plurality of first regions (R1) and a plurality of second regions (R2), which are alternately connected in the extending direction of the central optical waveguide. The second regions (R2) each have a smaller area of the long-axis optical waveguide disposed with respect to the substrate than the first regions (R1) when viewed from the direction in which the cladding is superposed. The central optical waveguide (32) includes a tapered portion (32a) at least at one end in the extending direction of the central optical waveguide.
This filler-containing film (10) enables accurate alignment when manufacturing a connection structure for a µLED or the like by mounting a light-emitting element such as a µLED on a substrate via a filler-containing film that contains a black pigment capable of forming a black matrix, wherein the filler-containing film, capable of forming a matte black matrix, has conductive particles (2) held in an insulating adhesive layer (1). In the filler-containing film, the average transmittance of near infrared rays having a wavelength of 800-1200 nm, inclusive, is at least 20%, and the 60° gloss value of the film surface according to ASTM D523 (60°) is less than 60.
C09J 133/04 - Homopolymers or copolymers of esters
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H10H 20/00 - Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
Disclosed is a filler-containing film with which it is possible to perform accurate alignment when manufacturing a connection structure such as a µLED display by mounting a light emitting element such as a µLED on a substrate by the intermediary of the filler-containing film which contains a black pigment that is capable of forming a black matrix, wherein conductive particles are held in an insulating adhesive layer. This filler-containing film has an average transmittance of visible light having a wavelength of 400 nm to 700 nm inclusive of 10% or less, and an average transmittance of near infrared light having a wavelength of 800 nm to 1,200 nm inclusive of 30% or more. The content of the black pigment in the insulating adhesive layer is 6 mass% to 30 mass% inclusive, and the layer thickness of the insulating adhesive layer is 1 µm to 20 µm inclusive.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H10H 20/00 - Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
This filler-containing film enables accurate alignment when manufacturing a connection structure for a µLED display or the like by mounting a light-emitting element such as a µLED on a substrate via a filler-containing film that contains a black pigment capable of forming a black matrix, wherein the filler-containing film, capable of forming a piano black matrix, has conductive particles held in an insulating adhesive layer. In the filler-containing film, the average transmittance of near infrared rays having a wavelength of 800-1200 nm, inclusive, is at least 20%, and the 60° gloss value of the film surface according to ASTM D523 (60°) is at least 60.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H10H 20/00 - Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
Provided is a hot-melt adhesive sheet containing conductive particles that can improve the adhesive strength of a card member and an IC chip, and that can improve the moisture and heat reliability and the bending resistance of a smart card. A hot-melt adhesive sheet 1 containing conductive particles comprises: a first layer 2 that contains 50 mass% or more a crystalline polyamide resin having a carboxyl group, and that has a storage modulus of 150 MPa or greater at 50°C; a crystalline polyester resin; and a second layer 3 that contains an amorphous polyester resin and that has a storage modulus of 30 MPa or greater at 50°C. The hot-melt adhesive sheet 1 containing conductive particles contains conductive particles 4.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
C09J 177/00 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chainAdhesives based on derivatives of such polymers
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
53.
OPTICAL ELEMENT, ROLL MASTER DISK, AND METHOD FOR MANUFACTURING OPTICAL ELEMENT
211 of the first tapered part 31. The second tapered part 32 has a needle-like tapered shape thinner than the first tapered part 31, and the height h of the structure 3 is 400 nm or more.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
Provided is a protective element in which a fusible conductor is not fused even after a reflow process, and the fusible conductor can be quickly fused at the time of an abnormality. A protective element 1 includes: an insulating substrate 2; a heating element 5; a first electrode 3 and a second electrode 4 stacked on the insulating substrate 2; a heating element lead-out electrode 6 provided on a current path between the first and second electrodes 3, 4 and electrically connected to the heating element 5; and a fusible conductor 7 that is mounted on the first electrode 3, the second electrode 4, and the heating element lead-out electrode 6 and that is fused by self-heating resulting from heating or overcurrent of the heating element 5 to interrupt the current path. The fusible conductor 7 is composed of a laminate 13 including at least a low-melting-point metal layer 11 having a liquidus temperature of less than 260°C and a high-melting-point metal layer 10 having a liquidus temperature exceeding 400°C. The laminate 13 has a material configuration such that, when melted as a single alloy, the liquidus temperature of the alloy composition is 300-400°C.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
55.
SOLAR BATTERY CELL, SOLAR BATTERY, AND ANTIREFLECTION FILM
A solar battery cell 30 comprises: a fine uneven structure layer 11; a first electrode layer 32; a photoelectric conversion layer 34; and a second electrode layer 36. The fine uneven structure layer 11 includes: a fine uneven structure 12 having a plurality of protrusions 13 disposed at a pitch P which is no more than the wavelength of visible light; and wavelength conversion nanoparticles 15 dispersed and contained in the fine uneven structure 12.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
This protective element comprises a fuse element (50), a first terminal (91) and a second terminal (92) that are connected to both electric-conduction-direction ends of the first fuse element (50), and an insulation case (10) that accommodates the fuse element (50) and portions of the first terminal (91) and the second terminal (92). An element accommodation space (53) is formed in the insulation case (10) such that a portion of the insulation case (10) is in proximity to or in contact with at least a portion of the fuse element (50). The rated voltage of the protective element is equal to or less than a value obtained by multiplying an inter-terminal distance (D) [mm] between the first terminal (91) and the second terminal (92) by an electric field intensity of 30 [V/mm].
This protective element (1400) comprises: a first terminal (91) and second terminal (92) that are disposed so as to be separated from each other in a first direction; a fuse element (50) that blows out when a prescribed or greater current flows therethrough; an insulating member (1460) that is disposed so as to face the fuse element (50); an insulating case (1410) in which is formed an internal pressure buffer space (1416) that communicates with the space in which the fuse element (50) is disposed; and a filter (1465) that is disposed in at least a portion of the internal pressure buffer space (1416). In the protective element (1400), formed are emission paths (1470A, 1470B) for discharging, to the outside, residual gas occurring after fuse scatter that has been produced when the fuse element (50) blows out due to overcurrent has collected on a filter (1465).
Provided is a method for manufacturing an electronic component capable of disposing a connection film by using a mounter. The method comprises: a peeling step (A1) for holding individual pieces of connection film with a suction nozzle and peeling the individual pieces from a long first film, in which the plurality of pieces of connection film are arranged, by using an edge member for folding back the first film at an acute angle from a first traveling direction to a second traveling direction; and an arrangement step (B1) for arranging the individual pieces peeled from the first film on a wiring board by using the suction nozzle. Here, the edge member is a portion of a feeder for supplying the individual pieces of the film, and is also a portion of the mounter.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
This protective element (1600) comprises: a first terminal (91) and a second terminal (92) that are positioned separated from each other in a first direction; a fuse element (50) that is positioned between the first terminal (91) and the second terminal (92), electrically connects the same, and blows when a prescribed current or greater flows therethrough; and at least two covers (1610A1, 1610A2) that sandwich the fuse element (50) and are fitted with each other.
A protective element (1100) comprises: a first terminal (91) and a second terminal (92) that are disposed in a mutually separated manner in a first direction; a fuse element (1150) that is disposed between the first terminal (91) and the second terminal (92) to electrically connect therebetween and that gets fused when a current equal to or greater than a prescribed level flows through the fuse element; insulating members (1160) that are disposed in a manner facing the fuse element (1150) from both sides in a second direction orthogonal to the first direction; and an insulating case (1110) that accommodates a portion of the first terminal (91), a portion of the second terminal (92), the fuse element (1150), and the insulating members (1160). The fuse element (1150) has a bent shape (1151) in a region sandwiched by the insulating members (1160).
A laminate which has a first bonding layer, a metal layer and a second bonding layer, in this order, wherein recesses which connect to an outer peripheral edge of the metal layer are present in a first surface of the metal layer on the first bonding layer side thereof and in a second surface thereof on the second bonding layer side thereof.
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
62.
LIGHT EMITTING DEVICE PRODUCING METHOD AND BLACK TRANSFER FILM
A producing method for a light-emitting device including a black matrix in at least a part of peripheries of light-emitting elements on a wiring substrate includes: a step of allowing a black transfer film with a black transfer layer formed on one side of a light-transmitting base material to face, from the black transfer layer side, the substrate before the light-emitting elements are disposed; a step of applying laser light to the black transfer film from the base material side, transferring pieces of the black transfer layer to positions on the substrate of the light-emitting elements; and a step of disposing and mounting the light-emitting elements on the pieces of the black transfer layer that have been transferred to the substrate, deforming the black transfer layer to form a black matrix in at least a part of the peripheries of the light-emitting elements and connecting the elements to the substrate.
In the present invention, an antireflection film is provided with a film base material and an optically functional layer. The optically functional layer comprises, sequentially from the film base material side, a first high-refractive index layer having an optical thickness of 25-43 nm, a first low-refractive index layer having an optical thickness of 54-69 nm, a second high-refractive index layer having an optical thickness of 278-308 nm, and a second low-refractive index layer having an optical thickness of 131-141 nm. The antireflection film exhibits a transmission rate of not less than 86% with respect to light having a wavelength of 940 nm, and a visibility reflectance Y of not more than 1.0%. The a*value and the b*value expressed in the CIE-LAB color system for total reflection light obtained when light having a wavelength of 380-780 nm generated by a standard light source D65 is caused to enter the antireflection film satisfy -4.0
A film laminate that can achieve sufficient sterilization effects and does not have the risk of damaging the film surface structure is provided. A film laminate 1 includes a plurality of film-shaped members 2 laminated in a separable manner, and columnar protruding members 5 protruding in the direction of lamination of the film-shaped members 2 and holding the film-shaped members 2 at a predetermined interval, wherein the protruding members 5 have engagement portions on the outer circumference of the protruding members 5 to which the film-shaped members 2 are engaged at the predetermined interval, the film-shaped members 2 have insertion holes 4 through which the protruding members 5 are inserted and removed as desired, and the film-shaped members 2 are held at the predetermined interval and laminated by the protruding members 5 being inserted through the insertion holes 4 and the film-shaped members 2 being engaged with the engagement portions.
A high refractive index curable composition contains a polyfunctional (meth)acrylate compound (A) represented by general formula (1), a monofunctional (meth)acrylate compound (B) having a naphthalene skeleton, and a polymerization initiator.
A high–refractive index curable composition according to the present invention contains a polyfunctional (meth)acrylate compound (A) that is represented by general formula (1), a monofunctional (meth)acrylate compound (B) that has a naphthalene skeleton, inorganic nanoparticles, and a polymerization initiator.
Provided is a cured film having good frost resistance and water resistance. A laminate 1 includes an adherend 2 and a cured film 3 formed on the adherend 2. The cured film 3 is a cured product of a resin composition containing a monofunctional monomer, a polyfunctional monomer, and a radical polymerization initiator. After the laminate 1 is taken out from -40°C to room temperature (25°C, 40% RH), the frost adhesion area on a surface of the cured film 3 is less than 30% when the thickness is 5 μm or more.
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water theretoThawing or antifreeze materials for application to surfaces
F21S 41/275 - Lens surfaces, e.g. coatings or surface structures
F21S 45/00 - Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
F21W 102/00 - Exterior vehicle lighting devices for illuminating purposes
The micro-lens array is a micro-lens array in which a plurality of micro-lenses are arranged in a matrix in a plan view, wherein each of the plurality of micro-lenses has four main sides in a plan view, and each of the four main sides is inclined with respect to a row virtual line parallel to a row direction or a column virtual line parallel to a column direction.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
69.
WAVEPLATE, WAVELENGTH SELECTION SWITCH, OPTICAL BRANCH INSERTION DEVICE, AND METHOD FOR MANUFACTURING WAVEPLATE
Provided is a waveplate comprising: a transparent substrate; a pattern layer that is patterned on the transparent substrate; a first cured resin layer that is formed on at least a part of the outer periphery of the pattern layer on the transparent substrate; and a second cured resin layer that is formed in a region on the transparent substrate, said region being further to the inner side than the first cured resin layer where the pattern layer is not formed. The pattern layer has a retardation film.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
70.
ADHESIVE FILM, AND CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
An adhesive film according to the present invention exhibits rapid low-temperature curability, good adhesive strength, and good connection reliability, and can be stably slit into narrow widths and also has good temporary adhesiveness. This adhesive film has a base material film on which a release treatment has been executed, and has an insulating resin layer that is provided on the base material film and that exhibits radical polymerizability and anionic polymerizability. The adhesive film has a film width of not more than 1.0 mm or not more than 0.8 mm, and has a length of at least 5 m. The insulating resin layer contains: a film-forming component containing two types of film components having different molecular weights; a radical-polymerizable component containing a first acrylic compound; an anionic polymerizable component containing an epoxy compound; a radical polymerization initiator containing an organic peroxide having a one-minute half-life temperature of not more than 125°C; and an anionic polymerization curing agent containing an organic acid hydrazide compound that is a solid at ordinary temperatures.
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
The present invention provides a protective element which can interrupt a current pathway quickly and reliably using a fusible conductor having a high-melting-point metal layer and a low-melting-point metal layer, and which can also be manufactured through a simple process. A protective element (1) comprises an insulating substrate (2), a heating element (5), first and second electrodes (3, 4), a heating element lead electrode (6), and a fusible conductor (7) that melts, and thus interrupts a current pathway, due to self-heating and/or heating by the heating element (5) caused by application of an overcurrent exceeding the rated current, wherein the fusible conductor (7) has a laminated structure of a high-melting-point metal layer (10) and a second low-melting-point metal layer (12), the fusible conductor (7) is connected on top of the first electrode (3), on top of the second electrode (4), and on top of the heating element lead electrode (6) via the second low-melting-point metal layer (12) in an orientation such that the second low-melting-point metal layer (12) faces the insulating substrate (2), with at least part of the second low-melting-point metal layer (12) being in direct or indirect contact with the insulating substrate (2) in the space between the first electrode (3) and the heating element lead electrode (6) and in the space between the second electrode (4) and the heating element lead electrode (6).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
72.
THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD
Provided is a thermosetting adhesive composition having a low dielectric constant and a low dielectric loss tangent even after thermosetting, a low temperature change rate of a dielectric loss tangent, and favorable bending resistance. The present technique is a thermosetting adhesive composition for bonding substrates, the thermosetting adhesive composition comprising, with respect to 100 parts by mass of the total amount of the thermosetting adhesive composition: 65-90 parts by mass of a styrene-based elastomer; 5-20 parts by mass of (A) a modified polyphenylene ether resin having a radically polymerizable group at the molecular terminal thereof and 4-10 parts by mass of (B) a polybutadiene and/or polyisoprene having a weight-average molecular weight of 10,000-50,000, as crosslinking components; a radical polymerization initiator; and an epoxy resin, wherein the total content of the radical polymerization initiator, the epoxy resin, and an epoxy resin curing agent is at most 10 parts by mass, a styrene-based elastomer having a styrene ratio of less than 67% is contained as the styrene-based elastomer, and the total of the content of the (A) component and the content of the (B) component is at most 25 parts by mass.
Provided is a method for manufacturing a connection structure that makes it possible to mount electronic parts at a high density by using a connection film with insufficient printing (blur) in an adhesive layer. The method for manufacturing a connection structure, in which first terminals 5 of a first electronic part 3 having the first terminals 5 and second terminals 6 of a second electronic part 4 having the second terminals 6 are connected via a cured film 11A obtained by curing an adhesive layer 11 of a connection film 2, involves: a pasting step for pasting the adhesive layer 11 of the connection film 2 to the first electronic part 3; a placement step for placing the second terminals 6 on the first terminals 5 with the adhesive layer 11 therebetween; and a connection step for pressing the second electronic part 4 and curing the adhesive layer 11. The adhesive layer 11 has a body 12 that has a prescribed thickness and tapered inclination parts that are formed on both end sides of the body 12 in the width direction. In the pasting step, the pasting is performed while aligning the body 12 with the first terminals 5 in the width direction of the adhesive layer 11.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A cell culturing method comprising culturing hematopoietic stem cells or hematopoietic progenitor cells, or both the hematopoietic stem cells and the hematopoietic progenitor cells with their undifferentiated state maintained using a device for cell culture. The device includes a base material having a culture section with a plurality of pores, wherein the culture section has a Young's modulus of at least 3 GPa measured according to JIS K 7161-1.
A light receiving device includes a first light-receiving element and a second light-receiving element, each including a semiconductor substrate including a light receiving region, and a support substrate including a supporting surface supporting the first light-receiving element and the second light-receiving element. The semiconductor substrate of the first or second light-receiving element includes a main surface including the light receiving region, a back surface on an opposite side of the main surface in a perpendicular direction, and a recess sunk from the back surface towards the main surface. The other semiconductor substrate of the first light-receiving element or second light-receiving element is disposed inside the recess. An angle θ formed between a side surface of the recess and the supporting surface is 75° or greater and 105° or less, where the side surface is continuous from an opening edge of the recess to a bottom surface of the recess.
H10F 77/14 - Shape of semiconductor bodiesShapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
H10F 30/22 - Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
Provided is an apparatus for treating an exhaust gas containing hydrogen sulfide, the apparatus comprising: a combustion furnace configured to combust the hydrogen sulfide contained in the exhaust gas to convert the hydrogen sulfide into sulfur dioxide; and a scrubber configured to convert the sulfur dioxide produced in the combustion furnace into a sulfite by contacting the sulfur dioxide with an alkaline aqueous solution. The combustion furnace comprises a first introduction pipe for introducing the exhaust gas, a second introduction pipe for introducing a combustible gas and a combustion supporting gas, and a combustion chamber connected to the first introduction pipe and the second introduction pipe, and a component constituting the combustion chamber has a surface including quartz glass on an inside of the combustion chamber.
An optical reception module (3) according to the present invention comprises a first substrate (30), a second substrate (40) that is disposed on the first substrate (30), a light-receiving element (50) that is disposed on the second substrate (40) and that converts an optical signal into an electrical signal, and an amplifier (60) that is disposed on the second substrate (40) and that amplifies the electrical signal inputted from the light-receiving element (50). The second substrate (40) is provided with a transmission line (70) that transmits the amplified signal outputted from the amplifier (60) to the first substrate (30), and the light-receiving element (50) is positioned on one side of a center line (C40) on the second substrate (40), said center line (C40) being a virtual line segment passing through the center of the second substrate (40) in plan view. The amplifier (60) is positioned on the center line (C40) or between the center line (C40) and the light-receiving element (50).
Provided is a polarizer comprising: a transparent substrate; and lattice protrusions that are arranged on one surface of the transparent substrate at a pitch shorter than a wavelength of light in an allocated band and that extend in a predetermined direction. The lattice protrusions each comprise, in order from the transparent substrate: a reflective layer; a dielectric layer; and an absorption layer; and a water repellent film on which areas treated with a plurality of different water-repellent treatment agents exist non-uniformly is formed on surfaces of the lattice protrusions and a surface of the transparent substrate on which the lattice protrusions are arranged.
Provided is a polarization element including a transparent substrate and lattice-shaped convex portions, the lattice-shaped convex portions being arranged on one surface of the transparent substrate at a pitch shorter than a wavelength of light in a use band and extending in a predetermined direction and having a reflection layer and an absorption layer, in this order from a side of the transparent substrate; a width of the absorption layer being substantially the same as a width of the reflection layer on a side facing the absorption layer; in a cross-sectional view from a direction in which the lattice-shaped convex portions extend, a central plane passing through a center in a width direction of the absorption layer being spaced apart from a central plane passing through a center in a width direction of the reflection layer by a predetermined distance.
22 as a main component, and an antifouling layer formed on the low-refractive-index layer, the method comprising: a high-refractive-index layer forming step; a low-refractive-index layer forming step for forming a low-refractive-index layer in a dry atmosphere; a plasma treatment step for performing plasma treatment on the low-refractive-index layer; and an antifouling layer forming step for forming an antifouling layer on the surface, wherein in the plasma processing step, the low-refractive-index layer is subjected to plasma treatment at an electrode power density of 4,400 W/m2to 18,000 W/m222 as measured by X-ray photoelectron spectroscopy (ESCA) from the antifouling layer side is 103.25 eV or less.
The present invention provides an infrared sensor cover 7 for covering an infrared sensor that uses infrared rays to measure the distance to an object of measurement, said cover comprising a base material 10 and a microasperity structure 11 which is provided on at least one surface of a base material 19 and which has a plurality of raised parts 12 arranged at a pitch P no greater than the wavelength λ of the infrared rays, wherein the infrared sensor cover 7 is disposed on the infrared sensor so as to allow the infrared rays to be incident on the infrared sensor cover 7 from a direction inclined relative to the surface of the infrared sensor cover 7, and the ratio (H/λ) of the height H of the raised parts 12 to the wavelength λ is 0.5 or greater.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
82.
SURFACE TREATMENT METHOD AND SURFACE-TREATED SUBSTRATE
A surface treatment method according to the present invention comprises: a step for forming a coating film of an organosilicon compound on the surface of a substrate; a step for heating the substrate; a step for bringing the coating film into contact with a medium containing water to form a water-repellent treatment layer; and a step for drying the water-repellent treatment layer.
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
C08J 3/16 - Powdering or granulating by coagulating dispersions
The latent curing agent contains porous particles holding a curing catalyst, and the porous particles contain a crosslinkable vinyl polymer and an alpha-olefin copolymer.
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
84.
METHOD FOR MANUFACTURING SMART CARD, SMART CARD, AND CONDUCTIVE PARTICLE-CONTAINING HOT-MELT ADHESIVE SHEET
A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.
B29C 65/00 - Joining of preformed partsApparatus therefor
B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
B29L 17/00 - Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01B 1/20 - Conductive material dispersed in non-conductive organic material
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H05K 3/36 - Assembling printed circuits with other printed circuits
86.
MASTER, TRANSFERRED OBJECT, AND METHOD OF PRODUCING MASTER
Provided are a master in which a more complicated microstructure is formed, a transferred object obtained by using the master, and a method of producing the master. A plurality of concave-convex groups each including a plurality of concavities or convexities are provided on a base material apart from each other. Average widths of areas occupied by the concavities or convexities at a surface of the base material are smaller than or equal to a wavelength belonging to a visible light band. Formed lengths of the concavities or convexities from the surface of the base material in each of the concave-convex groups each belong to any of at least two or more groups having different central values.
In a filler-containing film in which fillers are dispersed in a resin layer, an unnecessary flow movement of the fillers due to an unnecessary flow movement of the resin layer is suppressed at the time when the filler-containing film is bonded to an article by pressure bonding. A filler-containing film includes a filler dispersion layer in which fillers are dispersed in a resin layer. In the filler dispersion layer, the surface of the resin layer in the vicinity of the fillers includes inclinations or undulations with respect to a tangent plane to a central portion of the surface of the resin layer between adjacent fillers. The CV value of the particle diameter of these fillers is not greater than 20%.
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Provided are: a structure manufacturing method with which a fine textured structure is easily formed only on a desired portion of a substrate without a curable resin protruding from the periphery thereof; and said structure. The structure manufacturing method comprises: a modification step for forming a non-modified portion 10 and a modified portion 20 on a surface of a substrate 101; an application step for applying a curable resin to the surface; a structure formation step for forming a fine textured structure in the curable resin applied to the substrate 101; a curing step for curing the curable resin; and a removal step for removing a cured product of the curable resin applied to the non-modified portion 10.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
A screen is configured to receive and reflect projected light at a light-receiving surface in a state in which the screen is placed upright. The screen includes the light-receiving surface. The light-receiving surface includes a mirror array A in which multiple mirrors A are arranged in a first direction, and a mirror array B that is positioned in a second direction crossing the first direction and in which multiple mirrors B are arranged in the first direction. The mirrors A and the mirrors B are tilted in the same direction at the light-receiving surface.
G03B 21/60 - Projection screens characterised by the nature of the surface
G02B 27/18 - Optical systems or apparatus not provided for by any of the groups , for optical projection, e.g. combination of mirror and condenser and objective
A protective element includes a fuse element having a cut portion between a first end portion and a second end portion and electrified in a first direction from the first end portion toward the second end portion; a movable member, having a projection portion, and a recessed member having a recessed portion allowing the projection portion to be inserted therein, which are disposed facing each other such that the cut portion is sandwiched therebetween; and a pressing means applying a force so as to shorten a relative distance in a direction in which the cut portion is sandwiched between the movable member and the recessed member. The cut portion is cut due to the force of the pressing means at a temperature equal to or higher than a softening temperature of the fuse element. The cut portion of the fuse element has one of or both a penetration hole and a thin portion in at least part thereof.
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/36 - Means for applying mechanical tension to fusible member
91.
METHOD FOR MANUFACTURING METAL MEMBER, AND MOLD MEMBER
A method for manufacturing a metal member according to the present disclosure includes: a step for making a laminate, in which a mask layer is formed on a conductive substrate, the mask layer having a groove with a desired shape for exposing the conductive substrate ; a step for plating to form a metal layer, which is made of a prescribed metal, on the laminate by electroplating; and a step for isolating the metal layer, which has been formed in the groove, from the laminate after the plating.
In the present invention, a wire grid polarization element 1 comprises: a substrate 10 made of an inorganic material; a grid structure 20 in which a plurality of projecting strip sections 22 are integrally formed with a base part 21 which is made of an organic material and provided on the substrate 10; and a functional film 30 which is made of a metal material and covers a part of a projecting strip section 22. The organic material is a cured product of a photocurable acrylic resin for imprinting, which contains a photopolymerizable component. The photopolymerizable component contains a resin (A) and a resin (B). The resin (A) is a monofunctional acrylate monomer having a phenyl group and/or a benzyl group. The resin (B) is a difunctional compound. The content of the resin (A) is 20-42 mass% relative to the overall photopolymerizable component. The content of the resin (B) is 43-66 mass% relative to the overall photopolymerizable component.
Provided is a structure with which a water-repellent function can be imparted with ease, optical characteristics of a sensor device can be maintained, and also replacement can be easily performed on the sensor device. Provided is a structure 100, which is attached to the outer surface of a sensor device 400, the outer surface having a curved shape, the structure comprising a base 101 and micro dip/bump-structured layers each arranged on one of the two surfaces of the base 101. The micro dip/bump-structured layers are constituted by a first micro dip/bump-structured layer 102 positioned on the sensor device 400 side, and a second micro dip/bump-structured layer 103 positioned on the opposite side from the sensor device 400 side. The second micro dip/bump-structured layer 103 has water repellency. The structure 100 has a three-dimensional shape following the curved shape of said outer surface.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
95.
WIRE GRID POLARIZING ELEMENT, METHOD FOR MANUFACTURING WIRE GRID POLARIZING ELEMENT, PROJECTION DISPLAY DEVICE, AND VEHICLE
A wire grid polarizing element 1 comprises: a substrate 10; a grid structure 20 in which a base 21 and a plurality of projections 22 are integrally formed; a functional film 30 that covers a portion of the projections 22; and a reinforcement film 51. The reinforcement film 51 is made of an inorganic oxide, is interposed between the functional film 30 and a portion of the projections 33 covered with the functional film 30, and reinforces the projections 22. The reinforcement film 51 envelopes at least tips 22a and the upper sides of both side-surfaces 22b of the projections 22. The functional film 30 envelopes the tops of the projections 22 with the reinforcement film 51 therebetween while not covering the bottom sides of the projections 22 and the base 21, and the coverage (Rc) thereof is 30-70%.
An individualized piece-processed adhesive film, a method for manufacturing a connection structure, and a connection structure capable of improving adhesive strength with respect to a substrate on which a component is mounted. An individualized piece-processed adhesive film includes individualized pieces having, with respect to a substrate on which a component is mounted, an opening to surround the component, the individualized pieces being arranged in the longitudinal direction of a base material film. A method for manufacturing a connection structure is to connect terminals of the first electronic component to terminals of the second electronic component by using an individualized piece with an opening to surround a component with respect to the substrate on which the component is mounted. This improves the adhesive strength.
According to one aspect of the present invention, what is provided is a photocatalyst member in which a photocatalyst layer is formed on a substrate via an underlayer, the underlayer contains at least cerium oxide, and the photocatalyst layer contains at least titanium oxide. Here, the underlayer may be composed solely of the cerium oxide or composed of the cerium oxide and at least one or more other elements at 10 atomic % or less of an elemental cerium proportion. According to the present invention, it is possible to produce a highly productive photocatalyst industrially.
B01J 21/06 - Silicon, titanium, zirconium or hafniumOxides or hydroxides thereof
B01J 23/10 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of rare earths
B01J 31/38 - Catalysts comprising hydrides, coordination complexes or organic compounds containing in addition, inorganic metal compounds not provided for in groups of titanium, zirconium or hafnium
B01J 35/30 - Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
A long film capable of maintaining the performance of individualized pieces of adhesive film and a method for manufacturing a connection structure. A long film has a long base material film and individualized pieces of adhesive film arranged in the longitudinal direction of the base material film, and an identification mark is provided on at least one of the predetermined individualized pieces or the base material film on which the predetermined individualized pieces are arranged. This allows defective individualized pieces to be avoided by identifying the identification mark when the individualized pieces are used, thereby maintaining the performance of the adhesive film individualized pieces.
The curable composition contains an oligomer complex. The oligomer complex is obtained by coordinating a ligand to a metal alkoxide oligomer, and the number average molecular weight of the metal alkoxide oligomer is 500 or more.
