Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Custom manufacture of semiconductor wafers; Integrated circuit packaging processing; Substrate processing and manufacturing; Custom manufacture of semiconductor substrates; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Custom manufacture of semiconductor wafers; Integrated circuit packaging processing; Substrate processing and manufacturing; Custom manufacture of semiconductor substrates; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Custom manufacture of semiconductor wafers; Integrated circuit packaging processing; Substrate processing and manufacturing; Custom manufacture of semiconductor substrates; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Integrated packages of semiconductor integrated circuits, packages, components and modules; integrated modules of semiconductor integrated circuits, packages, components and modules. Custom manufacture of integrated semiconductor packages and modules. Custom design services regarding integrated semiconductor packages and modules; analysis services regarding integrated semiconductor packages and modules; testing for new product development services regarding integrated semiconductor packages; technological consultation services regarding integrated semiconductor packages and modules.

Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Wafer foundry; Integrated circuit packaging processing; Substrate processing and manufacturing; Substrate foundry; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Wafer foundry; Integrated circuit packaging processing; Substrate processing and manufacturing; Substrate foundry; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]. Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Wafer foundry; Integrated circuit packaging processing; Substrate processing and manufacturing; Substrate foundry; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer. Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology.

Goods & Services

Treatment of materials; processing and treatment of materials in the field of semiconductors, and integrated circuits; wafer etch processing; semiconductor package processing; integrated circuit etch processing; wafer manufacturing; manufacturing of substrates for semiconductors and integrated circuits according to client's instructions and specifications; manufacturing of semiconductors, integrated circuits, integrated circuit boards and wafers according to client's instructions and specifications. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; developing and researching in the technology field related to semiconductors; designing integrated circuits; testing and probing products related to semiconductors.